Electronic component housing mechanism

Abstract

The electronic component W does not protrude outwards from the storage box 55 inserted into the storage unit 1A. [Solution] The electronic component storage mechanism 1 comprises a storage unit 1A and a storage box 55 inserted inside the storage unit 1A. The storage unit 1A has a fixed top plate 2 having an discharge passage 53 connected to an electronic component inspection device 10, and a movable top plate 61 that seals the upper opening 55b of the storage box 55 is attached to the lower surface of the fixed top plate 2 so as to be movable in the vertical direction.

Description

Technical Field

[0001] The present disclosure relates to a storage mechanism for electronic components that stores a large number of electronic components according to inspection results.

Background Art

[0002] For example, produced electronic components such as capacitors are all subjected to a predetermined test, and only non-defective products are shipped.

[0003] First, the electronic component is inserted into a pocket of an index table, and an electrical test is performed on the electronic component in the inspection apparatus for electronic components while the electronic component is inserted into the pocket of the index table. Then, the electronic component is stored in the storage mechanism for electronic components according to the inspection result. The storage mechanism for electronic components has a storage unit and a storage box that is inserted into and removed from a partition area of the storage unit, and the electronic component is put into the storage box. When the electronic component is put into the storage box, it may jump out of the storage box.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present disclosure has been made in consideration of such points, and an object thereof is to provide a storage mechanism for electronic components in which the electronic components inserted into the storage box from the inspection apparatus for electronic components do not jump out of the storage box.

Means for Solving the Problems

[0006] A first embodiment of the present disclosure is an electronic component storage mechanism connected to an electronic component inspection device for inspecting electronic components, in which the inspected electronic components are stored according to the inspection results, comprising: a storage unit connected to the electronic component inspection device via a discharge path, having a fixed top plate including a discharge passage, a side plate with one side open, and a bottom plate, and including a plurality of partitioned areas formed by partition walls inside; and a storage box provided so as to be removable within the partitioned areas of the storage unit, having an upper opening, into which the electronic components are stored from the electronic component inspection device via the discharge path and the discharge passage through the upper opening, wherein a movable top plate is provided on the fixed top plate so as to be movable vertically relative to the fixed top plate to close the upper opening of the storage box.

[0007] A second embodiment of the present disclosure is an electronic component storage mechanism in which, in the first embodiment, a spring is provided between the fixed top plate and the movable top plate to press the movable top plate downward.

[0008] A third embodiment of the present disclosure is an electronic component storage mechanism in which, in the first or second embodiment, a through-hole is formed in the movable top plate, and an introduction guide is provided in the fixed top plate that passes through the through-hole of the movable top plate and guides the electronic component into the storage box.

[0009] A fourth embodiment of the present disclosure is an electronic component storage mechanism in which, in the third embodiment, the introduction guide has an elongated opening in a plan view, and a cushioning material is provided within the storage box housed in the partitioned area, at a position corresponding to the introduction opening, which contacts the electronic component and alters the movement of the electronic component.

[0010] A fifth embodiment of the present disclosure is an electronic component housing mechanism in which, in the fourth embodiment, the cushioning material has an inclined surface that is inclined with respect to the horizontal direction. [Effects of the Invention]

[0011] As described above, according to this disclosure, when electronic components are placed into a storage box after inspection in an electronic component inspection device, the electronic components will not fly out of the storage box. [Brief explanation of the drawing]

[0012] [Figure 1] Figure 1 is a front view showing an embodiment of the electronic component housing mechanism according to this disclosure. [Figure 2] Figure 2 is a perspective view showing an embodiment of the electronic component housing mechanism according to this disclosure. [Figure 3] Figure 3 is a perspective view from below showing the movable top plate of the electronic component storage mechanism. [Figure 4] Figure 4 is a diagram illustrating the operation of the electronic component storage mechanism, and is a side cross-sectional view showing the arrangement of the fixed top plate, the movable top plate, and the introduction guide. [Figure 5] Figure 5 is a side view of the electronic component housing mechanism, illustrating its operation. [Figure 6] Figure 6 is a side view of the electronic component housing mechanism, illustrating its operation. [Figure 7] Figure 7 is an enlarged view of part A in Figure 1, illustrating the operation of the electronic component housing mechanism. [Figure 8] Figure 8 shows the installation structure of the movable tabletop. [Figure 9] Figure 9 is a perspective view showing the cushioning material placed inside the storage box. [Figure 10] Figure 10 is a plan view showing the arrangement of the storage box, the installation guide, and the cushioning material. [Figure 11] Figure 11 is a perspective view showing the cushioning elements of the cushioning material. [Figure 12] Figure 12 is a perspective view showing the entire electronic component inspection apparatus. [Figure 13] Figure 13 is a front view showing the entire electronic component inspection apparatus. [Modes for carrying out the invention]

[0013] Hereinafter, embodiments of a storage mechanism for electronic components will be described with reference to the drawings. Here, FIGS. 1 to 13 are diagrams showing embodiments of the storage mechanism for electronic components.

[0014] First, with reference to FIGS. 12 and 13, an inspection device for electronic components and a storage mechanism for electronic components connected to this inspection device for electronic components will be described.

[0015] As shown in FIGS. 12 and 13, an inspection device 10 for electronic components stores an electronic component W (see FIG. 9) such as a capacitor in a pocket 12 formed in an index table 11, and conveys the electronic component W by intermittently rotating the index table 11, and performs an electrical test on the electronic component W. Then, the electronic component W is classified according to the test results.

[0016] Such an inspection device 10 for electronic components includes a structure 10A having an inclined surface 10a, an index table 11 having a disk-shaped structure provided on the inclined surface 10a of the structure 10A and having pockets 12 that each store an electronic component W and are arranged in multiple rows, for example, 8 rows, in a circumferential shape, an electronic component test device 30A provided on the index table 11 and performing an electrical test on the electronic component W stored in the pocket 12 of the index table 11, and an electronic component discharge unit 50 that discharges the electronic component W on which the electrical test has been performed by the electronic component test device 30A.

[0017] The storage mechanism 1 for electronic components according to the present disclosure is connected to such an inspection device 10 for electronic components. In the present embodiment, the storage mechanism 1 for electronic components is connected to the electronic component discharge unit 50 via a discharge path 51. Further, the electronic component test device 30A includes a total of 12 electronic component test device elements 42 provided along the circumferential direction on the index table 11, and an electronic component test device cover 41 that covers the electronic component test device elements 42.

[0018] In this embodiment, the inclined surface 10a of the structure 10A functions as a base that rotatably supports the index table 11. A heater (not shown) is provided within this inclined surface 10a for heating the electronic components W housed in the pockets 12 of the index table 11.

[0019] Of these, the inclined surface 10a of the structure 10A is inclined at approximately 60 degrees with respect to the horizontal plane, and the index table 11 rotates intermittently clockwise on this inclined surface 10a. Alternatively, instead of placing the index table 11 on the inclined surface 10a, it may be placed on the vertical surface (not shown) of the structure 10A, which is positioned perpendicular to the horizontal plane.

[0020] In this specification, "up" or "down" refers to the direction above or below when the electronic component inspection device 10 is arranged as shown in Figures 12 and 13.

[0021] Each electronic component testing device element 42 of the electronic component testing device 30A has multiple probes (not shown), and these multiple probes apply an electrical load to the electronic component W and perform an electrical test. The electrical tests or electrical loads performed by the probes include the following:

[0022] For example, the electrical loads that a probe can handle include the following: If electronic component W is a capacitor, a DC voltage load of 2.5 times the rated voltage is possible; for example, if the rated voltage is 10V, a DC voltage load of 25V is possible. Also, if electronic component W is a capacitor, an AC voltage load of 2.5 times the rated voltage is possible; for example, if the rated voltage is 10V, a maximum AC voltage load of 25V, 50Hz is possible. Furthermore, if the electronic component is an inductor, a current load of 1.5 times the rated current is possible; for example, if the rated DC current is 1,000mA, a load of 1,500mA is possible.

[0023] In addition to the function of applying an electrical load, each probe of the electronic component testing apparatus element 42 also has the function of performing an electrical test on the electronic component W. If the electronic component W is a capacitor, the probe can also detect capacitance (C), loss factor (Df), and quality factor (Q: reciprocal of Df). Alternatively, the probe can detect leakage current (insulation resistance is calculated from leakage current and applied voltage), capacitance under DC voltage bias (capacitance under AC with DC voltage applied), withstand voltage (BDV dielectric breakdown voltage), and contact between the probe and the electronic component W due to inrush current. Alternatively, if the electronic component W is an inductor, the probe can also detect inductance (L), DC resistance (Rdc), and withstand current.

[0024] In this embodiment, the probe of the electronic component testing device element 42 normally performs an electrical test on the electronic component W. Based on the results of this electrical test, the electronic component W is sorted by the electronic component discharge unit 50 and sent to the electronic component storage mechanism 1.

[0025] Furthermore, as shown in Figures 12 and 13, the electronic component discharge unit 50 includes an electronic component discharge unit body 50a provided on the inclined surface 10a of the structure 10A, and a tubular discharge path 51 attached to the electronic component discharge unit body 50a for discharging electronic components W stored in the pockets 12 of the index table 11 to the outside. The electronic component storage mechanism 1 according to this disclosure is connected to the tubular discharge path 51.

[0026] In this embodiment, an electrical load is applied to the electronic component W by the probe of the electronic component testing device 30A, and an electrical test is performed. Based on the results of this electrical test by the probe, the electronic component W is sorted by the electronic component discharge unit 50 and sent from the discharge path 51 to the electronic component storage mechanism 1.

[0027] Specifically, the results of the electrical test performed by the probe of the electronic component testing device 30A are sent to the control unit 40. Based on these electrical test results, the control unit 40 performs air injection at the electronic component discharge unit 50 using an air injection mechanism (not shown) provided on the inclined surface 10a of the structure 10A, and sends the electronic components W in the pockets 12 of the index table 11 to the electronic component storage mechanism 1 via the discharge path 51. In this embodiment, the electronic component storage mechanism 1 has a plurality of storage boxes 55, 56 for each sorting category of electronic components W sorted based on the results of the electrical test performed by the probe of the electronic component testing device 30A. Of these, storage box 55 stores electronic components W that have been determined to be good products, and storage box 56 stores electronic components W that have been determined to be defective products.

[0028] The electronic components W located in the pockets 12 of the index table 11 are sorted in the electronic component discharge unit 50 and sent via the discharge path 51 to predetermined storage boxes 55 and 56 of the electronic component storage mechanism 1.

[0029] As shown in Figures 12 and 13, a load track 20 is provided on the inclined surface (base) 10a of the structure 10A, corresponding to the lower part of the index table 11. Furthermore, an electronic component supply unit 15 is connected to this load track 20 to supply electronic components W to the load track 20. The load track 20 has a load track body (not shown) and a plurality of walls (not shown) provided within the load track body, and a storage section (not shown) for storing electronic components W is formed between the walls. The electronic components W that are stored in the corresponding pockets 12 of the index table 11 are stored in this storage section.

[0030] Furthermore, a supply feeder 18 is connected to the electronic component supply unit 15 to replenish the electronic component W to the electronic component supply unit 15.

[0031] The index table 11 rotates intermittently around its pivot axis 11a. The pivot axis 11a of the index table 11 is driven by a drive mechanism (not shown).

[0032] Furthermore, the aforementioned components, such as the drive mechanism of the index table 11, the supply feeder 18, the electronic component supply unit 15, the electronic component test device element 42 of the electronic component test device 30A, the probe, and the air injection mechanism of the electronic component discharge unit 50, are all driven and controlled by the control unit 40.

[0033] As described above, in this embodiment, an electrical test is performed on the electronic component W using the probe of the electronic component testing device element 42 of the electronic component testing device 30A.

[0034] In this embodiment, a heater (not shown) is installed inside the inclined surface 10a of the structure 10A. A probe heater is also provided in the electronic component testing device element 42. Heaters (not shown) are also installed on the inner surface of the load track body of the load track 20 and on the inner surface of the electronic component discharge section body 50a of the electronic component discharge section 50.

[0035] Next, with reference to Figures 1A to 8, we will describe the load track 20 provided on the index table 11, the electronic component supply unit 15 that supplies electronic components W to the load track 20, and the supply feeder 18 that replenishes the electronic component supply unit 15 with electronic components W.

[0036] As shown in Figures 12 and 13, the load track 20 has a storage section for storing electronic components W on the index table 11, and this storage section has 8 rows corresponding to the 8 rows of pockets 12 on the index table 11.

[0037] In other words, the load track 20 has a load track body and a plurality of walls provided within the load track body, and eight arc-shaped storage sections are formed between the walls of the load track 20. Electronic components W, which are stored in the pockets 12 of the corresponding column of the index table 11, are stored in each storage section.

[0038] In this case, since the index table 11 has eight rows of pockets 12 arranged circumferentially, the walls of the load track 20 and the storage sections formed between the walls are also configured in an arc shape, corresponding to the eight rows of pockets 12.

[0039] The electronic component supply unit 15 also has a partition plate (not shown) which is shaped like a flat fan, and an opening is formed at the base of the partition plate. The electronic component supply unit 15 rotates so that the electronic components W accumulated in the partition plate are supplied from the opening into the desired storage section (see Figure 12).

[0040] Furthermore, as shown in Figure 12, a supply feeder 18 is connected to the electronic component supply unit 15 to replenish the electronic component W within the electronic component supply unit 15, and a supply amount detection sensor (not shown) is provided at the outlet of this supply feeder 18 to detect the amount of electronic component supplied. Since the electronic component W replenished into the electronic component supply unit 15 from the supply feeder 18 is fed from the electronic component supply unit 15 into the desired storage section, the supply amount detection sensor functions to detect the amount of electronic component W supplied from the electronic component supply unit 15 to the storage section.

[0041] Next, the electronic component storage mechanism 1 according to this disclosure will be described with reference to Figures 1 to 11. As shown in Figures 1 to 11, the electronic component storage mechanism 1 is connected to an electronic component inspection device 10, and the electronic component storage mechanism 1 is connected to the electronic component discharge section 50 of the electronic component inspection device 10 via a discharge path 51.

[0042] Such an electronic component storage mechanism 1 includes a storage unit 1A connected to the electronic component discharge section 50 of the electronic component inspection device 10 via a tubular discharge path 51, and storage boxes 55 and 56 that are freely removable from the partitioned area 8 of the storage unit 1A.

[0043] In this embodiment, the storage unit 1A is connected to the structure 10A of the electronic component inspection device 10. The storage unit 1A has a fixed top plate 2 having an discharge passage 53 connected to the electronic component discharge section 50 of the electronic component inspection device 10 via a tubular discharge path 51, a side plate 4 with one side (the front side in Figures 1 and 2) open, and a bottom plate 3 including a stand 3a. The inside of the storage unit 1A is divided into two levels vertically by a horizontally extending shelf 7 located in the center in the height direction, and the space divided into two levels vertically within the storage unit 1A is further divided into multiple partitioned areas 8 by partition walls 6 that extend vertically.

[0044] The aforementioned storage boxes 55 and 56 are provided within each compartment area 8 of the storage unit 1A, allowing for easy insertion and removal.

[0045] Of the storage boxes 55 and 56, storage box 55 is for storing electronic components W that have been determined to be good products, and storage box 56 is for storing electronic components that have been determined to be defective products. Storage box 55 also has an upper opening 55b and a handle 55a.

[0046] The storage box 56 also has an opening at the top and a handle 56a.

[0047] In this embodiment, the partition wall 6 provided in the upper section and the partition wall 6 provided in the lower section of the storage unit 1A do not extend in a straight line in the vertical direction, but are arranged offset from each other in the horizontal direction. That is, as shown in Figure 1, the partition wall 6 provided in the upper section of the storage unit 1A is positioned corresponding to the central part between a pair of adjacent partition walls 6, 6 provided in the lower section. Within the partition wall 6 provided in the upper section, a passage (not shown) for electronic components W is formed which is sent into a partitioned area 8 located directly below the partition wall 6.

[0048] In Figure 1, an discharge passage 53a (see Figure 5) for electronic components W is formed in the discharge passage section 53 provided in the fixed top plate 2. The electronic components sent from the discharge path 51 into the discharge passage 53a of the discharge passage section 53 are sent into the upper compartment area 8 of the storage unit 1A, and also to the lower compartment area 8 of the storage unit 1A via a connecting passage in the compartment wall 6 provided in the upper part of the storage unit 1A.

[0049] Furthermore, as shown in Figures 1 and 3, a movable top plate 61 is provided on the fixed top plate 2 of the storage unit 1A so as to be movable in the vertical direction, which closes the upper opening 55b of the storage box 55 that stores good electronic components W. In this embodiment, a movable top plate 61 is provided to close the upper opening 55b of the storage box 55 that stores good electronic components W, but it is not limited to this, and in addition to the movable top plate 61 for closing the upper opening 55b of the storage box 55 that stores good electronic components W, a movable top plate for closing the upper opening of the storage box 56 that stores defective electronic components W may also be provided.

[0050] Next, we will describe the movable tabletop 61 provided on the fixed tabletop 2. The fixed tabletop 2 is made of SUS (stainless steel), and the movable tabletop 61 is attached to the underside of the fixed tabletop 2. The movable tabletop 61 has a movable tabletop body 61a made of synthetic resin and a reinforcing member 61b attached to the movable tabletop body 61a (see Figure 8).

[0051] A spring 66 is interposed between the fixed top plate 2 and the movable top plate body 61a, which constantly biases the movable top plate 61 downwards.

[0052] Furthermore, a retaining part 64 is attached to the underside of the fixed top plate 2, and a stopper 63 is attached to this retaining part 64 via a set screw 65. As a result, the downward movement of the reinforcing member 61b of the movable top plate 61 is restricted by the stopper 63.

[0053] As shown in Figure 3, the movable top plate 61 has a long, narrow through-hole 61A in its movable top plate body 61a when viewed from above. The fixed top plate 2 is fitted with an introduction guide 70 that passes through the through-hole 61A of the movable top plate body 61a and has an introduction opening 70a. This introduction guide 70 guides the electronic components W that are sent from the electronic component inspection device 10 through the discharge path 51 to the discharge passage section 53 of the fixed top plate 2 into the storage box 55 located within the partitioned area 8 via the introduction opening 70a. This introduction guide 70 is provided in conjunction with the movable top plate 61 that closes the storage box 55 that stores good electronic components W, but the movable top plate 61 and the introduction guide 70 may also be provided in conjunction with the storage box 55 that stores defective electronic components W.

[0054] The introduction guide 70 is formed in an elongated shape in plan view, corresponding to the elongated through-hole 61A of the movable top plate body 61a. Therefore, the outer shape of the introduction guide 70 is elongated in plan view. Furthermore, the outer shape of the introduction guide 70 is roughly corresponding to the shape of the through-hole 61A of the movable top plate body 61a, so the gap between the inner surface of the through-hole 61A and the outer surface of the introduction guide 70 is extremely small. As a result, the electronic components W inside the storage box 55 will not fly out through the gap between the inner surface of the through-hole 61A of the movable top plate body 61a and the outer surface of the introduction guide 70.

[0055] Furthermore, the introduction guide 70 has an elongated shape in plan view, and the peripheral shape of the introduction opening 70a of the introduction guide 70 is also elongated in plan view, corresponding to the external shape of the introduction guide 70.

[0056] Furthermore, in storage boxes 55 and 56, storage box 55, which stores good quality electronic components W, is provided with a cushioning material 80 at a position corresponding to the introduction opening 70a of the introduction guide 70, which the electronic components W placed into the storage box 55 will come into contact with. This cushioning material 80 is made of, for example, rubber, and comes into contact with the electronic components W placed into the storage box 55 from the introduction opening 70a of the introduction guide 70, preventing the electronic components W from being damaged by directly colliding with the inner surface of the storage box 55. The cushioning material 80 also has the function of preventing the electronic components W from bouncing violently when they collide with the inner surface of the storage box 55.

[0057] The cushioning material 80 consists of multiple, for example, six, cushioning material elements 80a, each of which is triangular prism-shaped (see Figure 11). The cushioning material 80, consisting of multiple cushioning material elements 80a, is held in place by a pair of cushioning material holders 81. Each cushioning material holder 81 is hooked onto the periphery 55b1 of the upper opening 55b of the storage box 55, and in this way the cushioning material 80 is housed inside the storage box 55.

[0058] As shown in Figure 10, the electronic components W that are introduced into the storage box 55 from the introduction opening 70a of the introduction guide 70 fall within a certain fall range 70A. In this embodiment, the cushioning material 80 is arranged inside the storage box 55 so as to cover the entire area of ​​this fall range 70A.

[0059] As shown in Figures 10 and 11, the cushioning material elements 80a held by the cushioning material holding portion 81 are, as described above, all triangular prism-shaped and have a pair of inclined surfaces 80b, 80b that are tilted at 60 degrees with respect to the horizontal plane.

[0060] Therefore, when the electronic component W, which is inserted into the storage box 55 from the inlet 70a of the introduction guide 70, comes into contact with the pair of inclined surfaces 80b, 80b of the cushioning material element 80a of the cushioning material 80, its speed decreases and its direction of travel changes.

[0061] In this way, the cushioning material 80 changes the movement (speed and direction of travel) of the electronic component W, preventing the electronic component W from directly colliding with the inner surface of the storage box 55 with a large impact, thereby preventing damage to the electronic component W and also preventing excessive bouncing.

[0062] Next, the operation of this embodiment, which has the above configuration, will be described.

[0063] First, before starting operation of the electronic component inspection device 10, the storage boxes 55 and 56 are pulled out from the storage unit 1A in the electronic component storage mechanism 1. When starting operation of the electronic component inspection device 10, the storage boxes 55 and 56 are first inserted into the corresponding compartment areas 8 of the storage unit 1A.

[0064] The storage box 56 for defective electronic components is inserted directly into the corresponding compartment 8.

[0065] On the other hand, a storage box 55 for good quality electronic components is similarly inserted into the corresponding compartment area 8.

[0066] In this case, as shown in Figure 5, the upper tip 57 of the storage box 55 first comes into contact with the tapered portion 67 of the movable top plate 61, lifting the movable top plate 61 upward. At this time, the movable top plate 61 moves upward against the pressing force of the spring 66, and then the insertion operation of the storage box 55 is completed when the storage box 55 is fully inserted into the compartment area 8 (see Figure 6).

[0067] At this time, the movable top plate 61 moves upward toward the fixed top plate 2, with the inner surface of the through-hole 61A of the movable top plate 61 sliding along the outer surface of the introduction guide 70 attached to the fixed top plate 2. Then, when the storage box 55 is fully inserted into the compartment area 8, the movable top plate 61 comes into contact with the periphery 55b1 of the upper opening 55b of the storage box 55, sealing the upper opening 55b from above. Simultaneously, the movable top plate 61 presses against the periphery 55b1 of the upper opening 55b of the storage box 55 from above with the force of the spring 66, sealing the upper opening 55b. In this way, the movable top plate 61 can completely seal the upper opening 55b of the storage box 55.

[0068] Furthermore, the storage box 56 for defective electronic components does not need to be completely sealed like the storage box 55 for good electronic components, and it is not necessary to provide a movable top plate 61 in the partitioned area 8.

[0069] However, if the movable top plate 61 is installed in the compartment area 8 that stores the storage box 56 for defective electronic components, the upper opening of the storage box 56 will be sealed by the movable top plate 61, just as when storing the storage box 55 for good electronic components.

[0070] Next, the operation of the electronic component inspection device 10 is started.

[0071] First, electronic components W, such as capacitors, in the electronic component supply unit 15 are supplied to a desired storage section of the road track 20, and the electronic components W in each storage section are stored within that storage section.

[0072] During this time, the index table 11 rotates clockwise one pitch at a time across the pockets 12, and the electronic components W stored in the storage section are placed into each pocket 12 of the index table 11. In this case, since suction holes (not shown) are provided on the inclined surface (base) 10a located on the back side of the index table 11, the electronic components W in the storage section are attracted by the suction holes on the inclined surface 10a and placed into each pocket 12 of the index table 11.

[0073] When electronic components W are supplied from the electronic component supply unit 15 into each storage section of the road track 20, the electronic components W are fed into the storage section from above, and once fed into the storage section, the electronic components W fall due to gravity and are stored in the lower part of each storage section.

[0074] As electronic components W are fed from the electronic component supply unit 15 into each storage section of the load track 20, the index table 11 rotates intermittently clockwise, as shown in Figures 12 and 13. As a result, the electronic components W in each storage section are stored in clumps centered at a position 15 degrees downstream from the lower end 11A of the index table 11 due to frictional force with the index table 11. The number of electronic components W stored in clumps in each storage section of the load track 20 is maximized at a position 15 degrees downstream from the lower end 11A, and the number of electronic components W gradually decreases to a position 45 degrees downstream, and similarly gradually decreases upstream from the index table 11 to the lower end 11A.

[0075] Thus, the number of electronic components W in each storage section of the road track 20 forms a mountain shape centered at a position 15 degrees downstream from the lower end 11A, with the number of electronic components W gradually decreasing down to a position 45 degrees downstream, and similarly gradually decreasing up to the lower end 11A upstream.

[0076] According to this embodiment, the number of electronic components W in each storage section of the road track 20 forms a mountain shape centered at a position 15 degrees downstream from the lower end 11A of the index table 11, and the electronic components W are distributed from a position 45 degrees downstream from the lower end 11A to the lower end 11A. Therefore, in the range from a position 45 degrees downstream from the lower end 11A to the lower end 11A, the electronic components W are stored in the pockets 12 of the index table 11.

[0077] In this embodiment, the load track 20 is provided with an electronic component detection unit (not shown) corresponding to each storage section, within an angular range α2 of 10 to 20 degrees downstream from the lower end 11A of the index table 11, preferably at a position of 15 degrees downstream from the lower end 11A. Therefore, this electronic component detection unit can detect whether or not an electronic component W is stored in the pocket 12 at the set position of the electronic component detection unit.

[0078] By detecting the presence or absence of electronic components W in the pocket 12 using the electronic component detection unit, the appropriate amount of electronic components W can be supplied into the load track 20, as described later, ensuring that electronic components W are reliably supplied into the pocket 12.

[0079] In this way, the electronic components W in each storage section of the road track 20 are sequentially stored in the pockets 12 of the index table 11.

[0080] During this time, the electronic components W are properly stored in the pockets 12 of the index table 11, and the electronic component testing can be properly performed on the electronic components W by the electronic component testing device element 42 of the electronic component testing device 30A in the subsequent process.

[0081] Next, the electronic component W inserted from the load track 20 into the pocket 12 of the index table 11 is transported to the electronic component testing device 30A by the intermittent rotation of the index table 11.

[0082] In this embodiment, the index table 11 rotates in 100 equal increments. That is, the index table 11 rotates 3.6 degrees at a time and stops (1 step), and this operation is repeated sequentially.

[0083] After the index table 11 has operated for 50 steps, the electronic components W on the index table 11 reach the area of ​​the electronic component testing device 30A (an area of ​​approximately 180 degrees), and the index table 11 stops its intermittent rotation. At this time, the probe of the electronic component testing device 30A performs an electrical test on all electronic components W within the area of ​​the electronic component testing device 30A (an area of ​​approximately 180 degrees) at once.

[0084] Alternatively, an electrical load may be first applied to the electronic component W using the probe of the electronic component testing device 30A to cause a less reliable electronic component W to fail, and then an electrical test may be performed on the electronic component W using the probe.

[0085] Next, the electronic component W in the pocket 12 of the index table 11 is transported to the electronic component discharge section 50 as the index table 11 rotates intermittently. The electronic component W, which has been electrically tested by the probe 30, is discharged outwards from this electronic component discharge section 50.

[0086] Specifically, the electronic components W are sorted by the electronic component discharge unit 50 based on the results of electrical testing by a probe, and then sent from the discharge path 51 to predetermined storage boxes 55 and 56 of the electronic component storage mechanism 1.

[0087] In this case, first, the results of the electrical test performed by the electronic component testing device 30A are sent to the control unit 40. Based on these electrical test results, the control unit 40 uses an air injection mechanism (not shown) in the electronic component discharge unit 50 to inject air, sending the electronic components W in the pockets 12 of the index table 11 to predetermined storage boxes 55, 56 of the electronic component storage mechanism 1 via the discharge path 51. In this embodiment, the electronic component storage mechanism 1 has a plurality of storage boxes 55, 56 for each sorting category of the electronic components W determined based on the results of the electrical test performed by the electronic component testing device 30A. Of these, storage box 55 stores good electronic components W, and storage box 56 stores defective electronic components W.

[0088] In this manner, the electronic components W located in the pockets 12 of the index table 11 are sorted in the electronic component discharge section 50 and sent via the discharge path 51 to predetermined storage boxes 55 and 56 of the electronic component recovery mechanism.

[0089] During this time, for example, electronic components W sent from the discharge path 51 to the storage box 56 for defective electronic components pass through the discharge passage 53a of the discharge passage section 53 and are placed into the storage box 56 located within the corresponding compartment area 8.

[0090] Since the electronic component W placed inside the storage box 56 has been determined to be defective, it will not be a problem even if the electronic component W falls out of the storage box 56.

[0091] On the other hand, electronic components W sent from the discharge route to the storage box 55 for good electronic components pass through the discharge passage 53a of the discharge passage section 53 and are sent to the introduction guide 70 through the opening 2a of the fixed top plate 2.

[0092] Next, the electronic component W is inserted into the storage box 55 through the upper opening 55b via the introduction port 70a of the introduction guide 70. After that, the electronic component W inserted into the storage box 55 comes into contact with the pair of inclined surfaces 80b, 80b of the cushioning element 80a of the cushioning material 80 placed inside the storage box 55, which reduces its speed and changes its direction of travel. After that, the electronic component W falls into the storage box 55. At this time, the electronic component W inserted into the storage box 55 has its speed reduced and its direction of travel changed by the cushioning element 80a of the cushioning material 80. As a result, the electronic component W does not directly collide with the inner surface of the storage box 55 with a large impact, and damage to the electronic component W and jumping are prevented.

[0093] During this time, the movable top plate 61, by the force of the spring 66, presses against the upper opening 55b of the storage box 55 from above, sealing it. As a result, the electronic components placed inside the storage box 55 cannot fly out from between the periphery 55b1 of the upper opening 55b and the movable top plate 61 (see Figure 7).

[0094] Furthermore, because the gap between the inner surface of the through-hole 61A of the movable top plate body 61a and the outer surface of the introduction guide 70 is extremely small, the electronic components W inside the storage box 55 will not fly out through the gap between the inner surface of the through-hole 61A of the movable top plate body 61a and the outer surface of the introduction guide 70.

[0095] After the operation of the electronic component inspection device 10 is completed, the operator grasps the handle 55a and pulls the storage box 55 out of the compartment area 8. At this time, the movable top plate 61 moves downward due to the force of the spring 66, and then the movable top plate 61 is stopped by the stopper 63 which restricts its downward movement, and the movable top plate 61 returns to its original position. In this case, good quality electronic components W are stored inside the storage box 55.

[0096] Similarly, the worker grasps the handle 56a and pulls the storage box 56 outward from the partitioned area 8. In this case, the storage box 56 contains the defective electronic component W.

[0097] As described above, according to this embodiment, in the electronic component recovery mechanism 1, the movable top plate 61 presses against the upper opening 55b of the storage box 55 from above with the force of the spring 66, thereby sealing it. As a result, the electronic components placed inside the storage box 55 will not fly out from between the periphery 55b1 of the upper opening 55b and the movable top plate 61.

[0098] In this case, the upper opening 55b of the storage box 55 can be sealed by an extremely simple structure in which the movable top plate 61 presses against the periphery 55b1 of the upper opening 55b of the storage box 55 from above using the force of a spring. Therefore, compared to a structure in which the storage box 55 is raised using a complex lifting mechanism and the upper opening 55b is brought into contact with the fixed top plate 2 without the movable top plate 61, the upper opening 55b of the storage box 55 can be sealed easily and simply using a simple structure.

[0099] In this case, the synthetic resin movable top plate body 61a of the movable top plate 61 presses against the periphery 55b1 of the upper opening 55b of the storage box 55. Therefore, the movable top plate body 61a, which is relatively flexible compared to metal, can press against the periphery 55b1 of the upper opening 55b of the storage box 55, and the periphery 55b1 of the upper opening 55b of the storage box 55 will not be scratched.

[0100] Furthermore, the electronic components W placed inside the storage box 55 come into contact with the pair of inclined surfaces 80b, 80b of the cushioning material element 80a of the cushioning material 80. As a result, the electronic components W do not directly collide with the inner surface of the storage box 55 with a large impact, and damage to the electronic components W and their flying outwards are reliably prevented.

[0101] In this case, since the cushioning material 80 is provided to cover the area 70A in which the electronic components W are dropped from the introduction guide 70, the cushioning material 80 can reduce the speed and change the direction of travel of almost all of the electronic components W that are placed into the storage box 55.

[0102] Furthermore, since the electronic components W placed inside the storage box 55 come into contact with the inclined surfaces 80b, 80b of the cushioning element 80a, the distance of free fall of the electronic components W placed inside the storage box 55 can be reduced, thereby reliably decreasing the speed of the electronic components W. [Explanation of Symbols]

[0103] 1. Mechanism for housing electronic components 1A Storage Unit 2 Fixed top plate 3 Bottom plate 4 side panels 6 partition walls 7 shelves 8 partitioned areas 10. Inspection equipment for electronic components 10A Structure 10a Inclined surface (base) 11 Index Table 11a Rotary shaft 12 pockets 15. Electronic Components Supply Department 18 Supply feeder 20 Road Track 30A Electronic Component Testing Equipment 40 Control Unit 50 Electronic component discharge section 51 Emission Routes 53 Discharge passage section 53a Discharge passage 55 Storage Boxes 55a Handle 55b Upper opening 55b1 Periphery 56 Storage Boxes 56a Handle 57 Upper tip 61 Movable tabletop 61A Through-hole 61a Movable top panel body 61b Reinforcement 63 Stopper 64 Holding part 65 Set screw 66 Springs 67 Tapered section 70 Introduction Guide 70a Inlet 70A fall range 80 Cushioning material 80a buffer element 81 Cushioning material holding part W Electronic Components

Claims

1. In an electronic component storage mechanism connected to an electronic component inspection device for inspecting electronic components, the electronic components are stored according to the inspection results after inspection, A storage unit connected to the aforementioned electronic component inspection device via an discharge path, having a fixed top plate including a discharge passage, a side plate with one side open, and a bottom plate, and including a plurality of partitioned areas formed by partition walls inside, The storage unit comprises a storage box that is removably installed within the partitioned area of ​​the storage unit and has an upper opening, and into which the electronic components are stored from the inspection device for the electronic components via the discharge path and the discharge passage and into the upper opening, An electronic component storage mechanism comprising a fixed top plate, on which a movable top plate that closes the upper opening of the storage box is provided so as to be movable vertically relative to the fixed top plate.

2. The electronic component storage mechanism according to claim 1, wherein a spring is provided between the fixed top plate and the movable top plate to press the movable top plate downward.

3. The electronic component storage mechanism according to claim 1 or 2, wherein a through-hole is formed in the movable top plate, and an introduction guide is provided in the fixed top plate that passes through the through-hole in the movable top plate and guides the electronic component into the storage box.

4. The electronic component storage mechanism according to claim 3, wherein the introduction guide has an elongated opening in a plan view, and a cushioning material is provided within the storage box housed in the partitioned area at a position corresponding to the introduction opening, which contacts the electronic component and alters the movement of the electronic component.

5. The electronic component housing mechanism according to claim 4, wherein the cushioning material has an inclined surface that is inclined with respect to the horizontal direction.

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