Ferrules and optical modules for multi-core optical connectors
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- HAKUSAN INC
- Filing Date
- 2026-03-17
- Publication Date
- 2026-06-02
AI Technical Summary
Ferrules in multi-core optical connectors face challenges with dimensional instability and misalignment due to temperature changes during solder reflow and operational heating, leading to increased connection loss and misalignment of optical fibers.
A ferrule made of a resin composition containing polyphenylene sulfide with controlled dimensional change rate of 0.1% or less at 260°C, incorporating a thermal expansion absorbing portion in the boot insertion hole to manage internal thermal expansion, and heat-treated at a specific temperature range to minimize distortion.
The ferrule maintains dimensional accuracy and mechanical strength, reducing connection loss and misalignment even under thermal fluctuations, enabling high-density optical communication near electronic components.
Smart Images

Figure 2026090674000001_ABST