Semiconductor equipment

Abstract

Sufficient insulating space can be ensured. [Solution] The semiconductor device comprises a base plate, a semiconductor module provided on the upper surface of the base plate and including control terminals, a control board provided above the semiconductor module and to which the control terminals are connected, a terminal guide having through holes through which the control terminals pass, an upper guide surface provided opposite the lower surface of the control board and at least a portion of which contacts the lower surface of the control board, a lower guide surface at least a portion of which is positioned at or below the position of the upper surface of the semiconductor module, and a body portion connecting the upper guide surface and the lower guide surface. Thus, a sufficient insulating space distance can be secured.

Description

Technical Field

[0001] The present disclosure relates to a semiconductor device having terminals connected to a control board.

Background Art

[0002] In the prior art, a semiconductor device is disclosed in which a terminal accommodating portion is formed at a position where control terminals for control signals are arranged (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the conventional terminal accommodating portion, there is a problem that since the distance from the semiconductor module to the control board cannot be determined, it may not be possible to secure a sufficient insulation space distance.

[0005] The present disclosure has been made to solve the above problems, and an object thereof is to provide a semiconductor device capable of securing a sufficient insulation space distance.

Means for Solving the Problems

[0006] The semiconductor device according to this disclosure comprises a base plate, a semiconductor module provided on the upper surface of the base plate and including control terminals, a control board provided above the semiconductor module and to which the control terminals are connected, a terminal guide having through holes through which the control terminals pass, an upper guide surface provided opposite the lower surface of the control board and at least a portion of which contacts the lower surface of the control board, a lower guide surface at least a portion of which is located at or below the position of the upper surface of the semiconductor module, and a body portion connecting the upper guide surface and the lower guide surface. [Effects of the Invention]

[0007] According to the semiconductor device described herein, a sufficient insulating space distance can be ensured. [Brief explanation of the drawing]

[0008] [Figure 1] This is a perspective view of a semiconductor device according to Embodiment 1 of the present disclosure. [Figure 2] This is a perspective view of a semiconductor device according to Embodiment 1 of the present disclosure. [Figure 3] This is a perspective view of a semiconductor device according to Embodiment 1 of the present disclosure. [Figure 4] This is a side view of a semiconductor device according to Embodiment 1 of the present disclosure. [Figure 5] This is a perspective view of a terminal guide according to Embodiment 1 of the present disclosure. [Figure 6] This is a side view of a terminal guide according to Embodiment 1 of the present disclosure. [Figure 7] This is a top view of a terminal guide according to Embodiment 1 of the present disclosure. [Figure 8] This is a cross-sectional view of a terminal guide according to Embodiment 1 of the present disclosure. [Figure 9] This is a top view of a terminal guide according to Embodiment 2 of the present disclosure. [Figure 10] This is a side view of a semiconductor device according to Embodiment 3 of the present disclosure. [Figure 11] This is a perspective view of a semiconductor device according to Embodiment 4 of the present disclosure. [Figure 12] This is a perspective view of a semiconductor device according to Embodiment 5 of the present disclosure. [Figure 13] This is a side view of a semiconductor device according to Embodiment 5 of the present disclosure. [Figure 14] This is a perspective view of a semiconductor device according to Embodiment 6 of the present disclosure. [Figure 15] This is a side view of a semiconductor device according to Embodiment 6 of the present disclosure. [Modes for carrying out the invention]

[0009] The embodiments of this disclosure will be described below with reference to the accompanying drawings. Note that the drawings are schematic, and the relationships between sizes and positions shown in different drawings are not necessarily limited to those described and may be modified as appropriate. Furthermore, in the following description, similar components will be denoted by the same reference numerals, and their names and functions will be the same or similar. Therefore, detailed descriptions of them may be omitted.

[0010] Embodiment 1. The semiconductor device 101 in Embodiment 1 will be described with reference to Figures 1 to 8. Figure 1 is a perspective view of the semiconductor device 101 according to Embodiment 1. As shown in Figure 1, the semiconductor device 101 according to this embodiment includes a water cooling jacket 1, a base plate 2, screws 3, and a control board 4.

[0011] The base plate 2 is provided on the upper surface of the water-cooling jacket 1. The control board 4 is provided on the upper side of the base plate 2. Using the base plate 2 as a reference, the side on which the control board 4 is provided is the upper side, and the side on which the water-cooling jacket 1 is provided is the lower side. The upper surface is also called the top surface, and the lower surface is called the bottom surface. Note that the upper side, lower side, top surface, and bottom surface are defined regardless of the direction of gravity when the semiconductor device 101 is placed. The direction that penetrates the top surface and the bottom surface is called the height direction. Surfaces other than the top surface and the bottom surface are called sides. The same applies to the following explanation.

[0012] The base plate 2 is fastened to the water-cooling jacket 1 with screws 3. The control board 4 includes through-holes 5. Control terminals described later are inserted into the through-holes 5. For example, a plurality of through-holes 5 are provided. Control terminals are inserted into each of the plurality of through-holes 5.

[0013] FIG. 2 is a perspective view of the semiconductor device 101 according to Embodiment 1. In FIG. 2, the description of the control board 4 and the terminal guide described later is omitted. As shown in FIG. 2, the semiconductor device 101 includes a semiconductor module 6, a main terminal portion 9 for DC input, and a DC bus bar 10.

[0014] The semiconductor module 6 is provided on the upper surface of the base plate 2. The semiconductor module 6 includes control terminals 11, a main terminal portion 7 for AC output, and an AC bus bar 8. The control terminals 11 pass through the through-holes 5 of the control board 4. The control terminals 11 are electrically connected to the control board 4. The control terminals 11 are joined to the control board 4 with solder or the like. The semiconductor module 6 is, for example, encapsulated with resin, and the control terminals 11 are partially exposed from the resin. The semiconductor module 6 is, for example, a power module. For example, a plurality of semiconductor modules 6 are provided. Note that only one semiconductor module 6 may be provided.

[0015] The control terminals 11 include a protruding portion 12, a rising portion 13, and a bent portion 14. The protruding portion 12 protrudes in a direction parallel to the upper surface of the base plate 2. Also, the protruding portion 12 protrudes in a direction parallel to the lower surface of the control board 4.

[0016] The rising portion 13 rises above the base plate 2. The rising portion 13 is provided, for example, in a direction perpendicular to the upper surface of the base plate 2. The rising portion 13 is provided, for example, in a direction perpendicular to the lower surface of the control board 4. The rising portion 13 passes through the through-holes 5 of the control board 4. The rising portion 13 is electrically connected to the control board 4.

[0017] The bent portion 14 connects the protruding portion 12 and the rising portion 13. The control terminal 11 is bent at the bent portion 14. The protruding portion 12, the rising portion 13, and the bent portion 14 are, for example, integrally formed.

[0018] The main terminal section 7 of the AC output is partially exposed from the resin encapsulating the semiconductor module 6. The main terminal section 7 of the AC output is electrically connected to the AC busbar 8. The main terminal section 9 of the DC input is partially exposed from the resin encapsulating the semiconductor module 6. The main terminal section 9 of the DC input is electrically connected to the DC busbar 10.

[0019] Figure 3 is a perspective view of the semiconductor device 101 according to Embodiment 1. In Figure 3, the control board 4 is not shown. As shown in Figure 3, the semiconductor device 101 according to this embodiment includes a terminal guide 15.

[0020] The terminal guide 15 covers the control terminal 11. The control terminal 11 may be partially exposed from the terminal guide 15. The terminal guide 15 includes a through hole 16 through which the control terminal 11 passes. The terminal guide 15 is provided to cover a plurality of control terminals 11 protruding from one side of the semiconductor module 6. The semiconductor module 6 is provided to cover each of the plurality of control terminals 11. Multiple terminal guides 15 are provided to cover each of the control terminals 11 protruding from different sides of the semiconductor module 6. That is, a terminal guide 15 is provided for each side of the semiconductor module 6. A terminal guide 15 is provided for each of the multiple semiconductor modules 6. Note that the terminal guide 15 does not need to cover all of the control terminals 11; it may cover only a part of them.

[0021] Figure 4 is a side view of a semiconductor device 101 according to Embodiment 1. As shown in Figure 4, the terminal guide 15 is provided between the base plate 2 and the control board 4. The terminal guide 15 determines the distance from the protruding portion 12 of the control terminal 11 to the lower surface of the control board 4. The terminal guide 15 includes a guide upper surface 17, a guide lower surface 18, and a body portion 21.

[0022] The upper guide surface 17 is provided facing the lower surface of the control board 4. At least a portion of the upper guide surface 17 is in contact with the lower surface of the control board 4. The lower guide surface 18 is provided facing the upper surface of the base plate 2. At least a portion of the lower guide surface 18 is positioned at or below the position of the upper surface of the semiconductor module 6. The body portion 21 connects the upper guide surface 17 and the lower guide surface 18.

[0023] As shown in Figure 4, the lower guide surface 18 of the semiconductor device 101 according to this embodiment is provided so that at least a portion of it contacts the protruding portion 12 of the control terminal 11. The length from the portion of the lower guide surface 18 that contacts the protruding portion 12 of the control terminal 11 to the portion of the upper guide surface 17 that contacts the lower surface of the control board 4 is the distance from the protruding portion 12 to the lower surface of the control board 4. In other words, the terminal guide 15 can determine the distance from the protruding portion 12 to the lower surface of the control board 4. By determining the distance from the protruding portion 12 to the lower surface of the control board 4, that is, by ensuring the distance from the protruding portion 12 to the lower surface of the control board 4, a sufficient insulating space distance can be ensured.

[0024] The length d indicated by the arrow in Figure 4 is the length from the part of the guide's lower surface 18 that contacts the protrusion 12 to the part of the guide's upper surface 17 that contacts the control board 4. This length is the same as the height of the control board 4 when the protrusion 12 is used as the reference point, which is the distance from the protrusion 12 to the lower surface of the control board 4. In other words, the terminal guide 15 has a portion that is the same length as the distance from the protrusion 12 to the lower surface of the control board 4.

[0025] Furthermore, the terminal guide 15 determines the height of the control board 4 based on the protrusion 12 by having its lower surface 18 in contact with the protrusion 12. By having the lower surface 18 of the guide in contact with the protrusion 12, the required insulating space distance from the protrusion 12 to the lower surface of the control board 4 can be secured more accurately.

[0026] Figure 5 is a perspective view of the terminal guide 15 according to Embodiment 1. As shown in Figure 5, the terminal guide 15 includes, for example, a plurality of through holes 16. As shown in Figure 3, a plurality of control terminals 11 pass through the plurality of through holes 16, respectively. The terminal guide 15 may have only one through hole 16. Alternatively, a plurality of control terminals 11 may pass through a single through hole 16. As shown in Figure 5, the terminal guide 15 includes a fixing portion 19.

[0027] The terminal guide 15 is fixed to the control board 4 by sandwiching the control board 4 between the upper surface 17 of the guide and the fixing portion 19. However, the method of fixing the terminal guide 15 is not limited to the method described above.

[0028] Figure 6 is a side view of the terminal guide 15 according to Embodiment 1. As shown in Figure 6, the terminal guide 15 extends outwards at a position facing the fixing portion 19. The terminal guide 15 has a T-shaped side. Note that the terminal guide 15 does not necessarily have to extend outwards at a position facing the fixing portion 19. Also, the terminal guide 15 may have a rectangular side shape or the like.

[0029] Figure 7 is a top view of the terminal guide 15 according to Embodiment 1. As shown in Figure 7, the terminal guide 15 is provided with, for example, an upper recess 20 around the through hole 16. The provision of the upper recess 20 in the terminal guide 15 makes it easy to insert the terminal into the terminal guide 15.

[0030] Figure 8 is a cross-sectional view of the terminal guide 15 according to Embodiment 1. As shown in Figure 8, the through-hole 16 of the terminal guide 15 is, for example, conical. The through-hole 16 has a shape in which, for example, the diameter on the lower side, the base plate 2 side, is larger than the diameter on the upper side, the control board 4 side. The through-hole 16 has a shape in which, for example, the diameter gradually increases from the upper side, the control board 4 side, to the lower side, the base plate 2 side. The shape in which the through-hole 16 has a smaller diameter at the top and a larger diameter at the bottom makes it easy to insert multiple control terminals 11 into the terminal guide 15.

[0031] The semiconductor device 101 according to this embodiment includes a base plate, a semiconductor module provided on the upper surface of the base plate and including control terminals, a control board provided above the semiconductor module and to which the control terminals are connected, a terminal guide having through holes through which the control terminals pass, an upper guide surface provided opposite the lower surface of the control board and at least a portion of which contacts the lower surface of the control board, a lower guide surface at least a portion of which is located at or below the position of the upper surface of the semiconductor module, and a body portion connecting the upper guide surface and the lower guide surface.Therefore, a sufficient insulating space distance can be secured.

[0032] Embodiment 2. The terminal guide 22 according to Embodiment 2 will be described with reference to Figure 9. The same configuration as in Embodiment 1 will not be described. Also, in Figure 9, the same reference numerals as in Figures 1 to 8 indicate the same or corresponding parts. The terminal guide 22 according to this embodiment differs from the terminal guide 15 according to Embodiment 1 in that it is divided into multiple parts. The following description will focus on the differences from Embodiment 1.

[0033] Figure 9 is a top view of a terminal guide 22 according to Embodiment 2. The terminal guide 22 includes a first guide part 23 and a second guide part 24. The terminal guide 22 is provided divided into the first guide part 23 and the second guide part 24. The terminal guide 22 is provided divided in a direction parallel to the control terminal 11. The terminal guide 22 is provided divided in a plane including the through hole 16. The terminal guide 22 is provided divided in a direction parallel to the height direction.

[0034] The first guide part 23 and the second guide part 24 are fixed together by sandwiching the control terminal 11 between them. The control terminal 11 is provided sandwiched between the first guide part 23 and the second guide part 24 so as to pass through the through hole 16.

[0035] The first guide component 23 includes a guide inner surface 26. The second guide component 24 includes a guide inner surface 27. The terminal guide 22 includes an engaging projection 25 and an engaging recess (not shown) that engages with the engaging projection 25.

[0036] The first guide component 23 includes an engaging projection 25. The engaging projection 25 is provided on the inner surface 26 of the guide. The first guide component 23 may include, for example, multiple engaging projections 25. The first guide component 23 may include, for example, two engaging projections 25. The first guide component 23 may include three or more engaging projections 25. The first guide component 23 may also include only one engaging projection 25. The first guide component 23 may not include an engaging projection 25 at all. The engaging projection 25 may also be provided on the inner surface 27 of the guide.

[0037] The second guide part 24 includes an engaging recess. The engaging recess is provided on the inner surface 27 of the guide. The second guide part 24 may include, for example, multiple engaging recesses. The second guide part 24 may include, for example, two engaging recesses. The second guide part 24 may include three or more engaging recesses. Alternatively, the second guide part 24 may include only one engaging recess. Alternatively, the second guide part 24 may not include any engaging recesses at all. Alternatively, the engaging recess may be provided on the inner surface 26 of the guide. For example, the first guide part 23 and the second guide part 24 may each include one engaging projection 25 and one engaging recess, respectively.

[0038] The first guide component 23 includes a guide upper surface 28 and a guide lower surface (not shown). The second guide component 24 includes a guide upper surface 29 and a guide lower surface (not shown). The guide upper surface is provided facing the lower surface of the control board 4. Similar to the terminal guide 15 according to Embodiment 1, at least a portion of the guide upper surface of the terminal guide 22 is provided in contact with the lower surface of the control board 4. That is, either the guide upper surface 28 included in the first guide component 23 and the guide upper surface 29 included in the second guide component 24 may be provided in contact with the lower surface of the control board 4, or either one of them may be provided in contact with the lower surface of the control board 4. Alternatively, a portion of the guide upper surface 28 or the guide upper surface 29 may be provided in contact with the lower surface of the control board 4.

[0039] The lower surface of the terminal guide 22 is provided facing the upper surface of the base plate 2. Similar to the terminal guide 15 according to Embodiment 1, at least a portion of the lower surface of the terminal guide 22 is positioned below the position of the upper surface of the semiconductor module 6. That is, either the lower surface of the guide included in the first guide component 23 or the lower surface of the guide included in the second guide component 24 may be provided in contact with the lower surface of the control board 4, or either one of them may be provided in contact with the lower surface of the control board 4. Furthermore, a portion of the lower surface of the guide included in the first guide component 23 or the lower surface of the guide included in the second guide component 24 may be provided below the position of the upper surface of the semiconductor module 6. The first guide component 23 includes an upper recess 30. The second guide component 24 includes an upper recess 31. The lower surface of the guide is provided, for example, in contact with the protrusion 12 of the control terminal 11, at least a portion of it.

[0040] The terminal guide 22 is divided in a direction parallel to the control terminal 11 on the plane including the through hole 16. Therefore, the terminal guide 22 can be attached to the control terminal 11 so as to sandwich it, and the misalignment between the control terminal 11 and the control board 4 can be reduced even when the position tolerance of the control terminal 11 is large.

[0041] Embodiment 3. The semiconductor device 103 according to Embodiment 3 will be described with reference to Figure 10. The same configuration as in Embodiment 1 will not be described. Also, in Figure 10, the same reference numerals as in Figures 1 to 9 indicate the same or corresponding parts. The semiconductor device 103 according to this embodiment differs from the semiconductor device 101 according to Embodiment 1 in that the lower surface 33 of the terminal guide 32 is in contact with the base plate 2. The following description will focus on the differences from Embodiment 1.

[0042] Figure 10 is a side view of a semiconductor device 103 according to Embodiment 3. The semiconductor device 103 includes a terminal guide 32. The terminal guide 32 includes a guide upper surface 17 and a guide lower surface 33. The guide upper surface 17 is provided facing the lower surface of the control board 4. At least a portion of the guide upper surface 17 is provided in contact with the lower surface of the control board 4.

[0043] The guide lower surface 33 is provided opposite the upper surface of the base plate 2. At least a portion of the guide lower surface 33 is positioned at or below the position of the upper surface of the semiconductor module 6. As shown in Figure 10, the guide lower surface 33 includes a first lower surface 34 and a second lower surface 35, which are positioned at different heights from each other. That is, the terminal guide 32 includes shapes such as steps or notches.

[0044] The first lower surface 34 is provided in contact with the protrusion 12 of the control terminal 11. The second lower surface 35 is provided in contact with the upper surface of the base plate 2. By providing the second lower surface 35, which is included in the guide lower surface 33, in contact with the base plate 2, the insulating space distance that must be secured between the protrusion 12 and the control board 4 can be indirectly secured.

[0045] Furthermore, by having the first lower surface 34 included in the guide lower surface 33 in contact with the protrusion 12, and the second lower surface 35 included in the guide lower surface 33 in contact with the upper surface of the base plate 2, it is possible to reduce the load on the protrusion 12 due to gravity acting on the terminal guide 32 and the control board 4 while ensuring the necessary insulating space distance between the protrusion 12 and the control board 4.

[0046] Furthermore, the first lower surface 34 does not necessarily have to be in contact with the protrusion 12. Even if the first lower surface 34 is not in contact with the protrusion 12, the second lower surface 35 is provided in contact with the upper surface of the base plate 2, thereby indirectly securing the insulating space distance that should be maintained between the protrusion 12 and the control board 4. In addition, because the first lower surface 34 does not come into contact with the protrusion 12, the protrusion 12 does not have to bear the load due to gravity acting on the terminal guide 32 and the control board 4, thus preventing the control terminal 11 from being deformed by the load.

[0047] The first lower surface 34 may be provided in contact with the upper surface of the semiconductor module 6. By having the first lower surface 34 in contact with the upper surface of the semiconductor module 6, the height of the control board 4 can be adjusted with reference to the upper surface of the semiconductor module 6. Even when the first lower surface 34 is provided in contact with the upper surface of the semiconductor module 6, the distance from the protrusion 12 to the lower surface of the control board 4 can be indirectly secured, thereby ensuring the necessary insulating space distance.

[0048] Embodiment 4. The semiconductor device 104 according to Embodiment 4 will be described with reference to Figure 11. The same configuration as in Embodiment 1 will not be described. Also, in Figure 11, the same reference numerals as in Figures 1 to 10 indicate the same or corresponding parts. The semiconductor device 104 according to this embodiment differs from the semiconductor device 101 according to Embodiment 1 in that terminal guides covering the control terminals 11 of adjacent semiconductor modules 6 are connected. The following description will focus on the differences from Embodiment 1.

[0049] Figure 11 is a perspective view of a semiconductor device 104 according to Embodiment 4. In Figure 11, the control board 4 is not shown. The semiconductor device 104 includes a plurality of semiconductor modules 6, a terminal guide 46, and a terminal guide 47. The terminal guides 46 and 47 cover control terminals 11 protruding from different semiconductor modules 6. Through holes 16 provided in the terminal guides 46 and 47 are through which the control terminals 11 protruding from the plurality of semiconductor modules 6 are passed. For example, one control terminal 11 is passed through each through hole 16. The terminal guides 46 and 47 are an integrated unit formed by connecting terminal guides that cover the control terminals 11 of adjacent semiconductor modules 6 from the terminal guide 15 according to Embodiment 1. Note that the terminal guides 46 and 47 do not need to cover all of the control terminals 11; they may cover only a part of them.

[0050] The semiconductor module 6 includes a first side facing the AC busbar 8 and a second side facing the DC busbar 10. The terminal guide 46 is provided to cover the control terminals 11 protruding from the first side of each of the multiple semiconductor modules 6. The terminal guide 47 covers the control terminals 11 protruding from the second side of each of the multiple semiconductor modules 6. That is, the terminal guides 46 and 47 are provided to cover the control terminals 11 protruding from the sides of each of the multiple semiconductor modules 6 that are located in the same direction.

[0051] The terminal guides 46 and 47 are provided so as to cover the control terminals 11 that protrude from the same side of each of the multiple semiconductor modules 6. By aligning the positions of the terminal guides 46 and 47, the height position of the control board 4 can be easily determined, making it easy to attach the control board 4 to the semiconductor modules 6.

[0052] Furthermore, the terminal guide 46 or terminal guide 47 may be provided in combination with the terminal guide 15 according to Embodiment 1.

[0053] Embodiment 5. The semiconductor device 105 according to Embodiment 5 will be described with reference to Figures 12 and 13. The same configuration as in Embodiment 4 will not be described. Also, in Figures 12 and 13, the same reference numerals as in Figures 1 to 11 indicate the same or corresponding parts. The semiconductor device 105 according to this embodiment differs from the semiconductor device 104 according to Embodiment 4 in that an intermediate section 39 is provided in the terminal guide 36. The following description will focus on the differences from Embodiment 1.

[0054] Figure 12 is a perspective view of the semiconductor device 105 according to Embodiment 5. In Figure 12, the control board 4 is omitted from the description. The semiconductor device 105 includes a terminal guide 36. The terminal guide 36 includes a first terminal guide portion 37, a second terminal guide portion 38, and an intermediate portion 39.

[0055] The first terminal guide portion 37 corresponds to the terminal guide 46 according to Embodiment 4. That is, the first terminal guide portion 37 covers the control terminal 11 protruding from one side of the semiconductor module 6. The second terminal guide portion 38 corresponds to the terminal guide 47 according to Embodiment 4. That is, the second terminal guide portion 38 covers the control terminal 11 protruding from the other side, which is located opposite to the first side.

[0056] The connecting section 39 connects the first terminal guide section 37 and the second terminal guide section 38. The first terminal guide section 37, the second terminal guide section 38, and the connecting section 39 are formed as a single unit, for example. Alternatively, the first terminal guide section 37, the second terminal guide section 38, and the connecting section 39 may be formed as separate parts and connected by screws or the like.

[0057] The first terminal guide section 37 and the second terminal guide section 38 are connected by the connecting section 39, which makes it easy to insert the control terminal 11 into the first terminal guide section 37 and the second terminal guide section 38. In other words, it makes it easy to insert the control terminal 11 into the terminal guide 36.

[0058] Figure 13 is a side view of a semiconductor device 105 according to Embodiment 5. As shown in Figure 13, the connecting portion 39 is provided, for example, above the semiconductor module 6. The connecting portion 39 is provided, for example, at a position facing the upper surface of the semiconductor module 6. However, the connecting portion 39 does not need to be provided at a position facing the upper surface of the semiconductor module 6; it may be provided above the semiconductor module 6 but not facing the upper surface of the semiconductor module 6. That is, in Figure 13, the connecting portion 39 may be provided above the semiconductor module 6 and either in front of or behind the semiconductor module 6. Furthermore, the connecting portion 39 does not need to be provided above the semiconductor module 6; it may be provided below the upper surface of the semiconductor module 6. That is, in Figure 13, the connecting portion 39 may be provided in front of or behind the semiconductor module 6 and overlapping with the semiconductor module 6.

[0059] The terminal guide 36 includes a guide lower surface 40. The guide lower surface 40 includes a first lower surface 34, a second lower surface 35, and a third lower surface 41. The connecting portion 39 includes the third lower surface 41, which is part of the guide lower surface 40. The third lower surface 41 may be provided in contact with the upper surface of the semiconductor module 6. By the third lower surface 41 contacting the upper surface of the semiconductor module 6, the height of the control board 4 can be adjusted with reference to the upper surface of the semiconductor module 6.

[0060] Even when the third lower surface 41 is provided in contact with the upper surface of the semiconductor module 6, the distance from the protrusion 12 to the lower surface of the control board 4 can be indirectly secured, thus ensuring the necessary insulating space distance. Therefore, even when the first lower surface 34 and the second lower surface 35 are not in contact with either the protrusion 12 of the control terminal 11 or the base plate 2, the necessary insulating space distance can be ensured. Furthermore, if the first lower surface 34 does not contact the protrusion 12, the protrusion 12 does not have to bear the load due to gravity acting on the terminal guide 36 and the control board 4, thus preventing the control terminal 11 from deforming due to the load.

[0061] Embodiment 6. The semiconductor device 106 according to Embodiment 6 will be described with reference to Figures 14 and 15. The same configuration as in Embodiment 1 will not be described. Also, in Figures 14 and 15, the same reference numerals as in Figures 1 to 13 indicate the same or corresponding parts. The semiconductor device 106 according to this embodiment differs from the semiconductor device 104 according to Embodiment 4 in that a control terminal 42 is provided on the upper surface of the semiconductor module 6, and a terminal guide 43 covers the control terminal 42. The following description will focus on the differences from Embodiment 1.

[0062] Figure 14 is a perspective view of a semiconductor device 106 according to Embodiment 6. In Figure 14, the control board 4, terminal guide 43, and terminal guide 44 are omitted from the description. The semiconductor device 106 includes control terminals 42 provided on the upper surface of the semiconductor module 6. The control terminals 42 are electrically connected to the control board 4.

[0063] Figure 15 is a side view of a semiconductor device 106 according to Embodiment 6. The semiconductor device 106 includes a terminal guide 43 and a terminal guide 44. Terminal guide 43 corresponds to terminal guide 15 according to Embodiment 1. Terminal guide 44 covers the control terminal 42. Note that terminal guide 44 does not have to cover the entire control terminal 42, but may cover only a part of the control terminal 42.

[0064] The terminal guide 44 includes a guide lower surface 45. The guide lower surface 45 is provided in contact with the upper surface of the semiconductor module 6. By the guide lower surface 45 contacting the upper surface of the semiconductor module 6, the height of the control board 4 can be adjusted relative to the upper surface of the semiconductor module 6. Even when the guide lower surface 45 is provided in contact with the upper surface of the semiconductor module 6, the distance from the protrusion 12 to the lower surface of the control board 4 can be indirectly secured, thereby ensuring the necessary insulating space distance.

[0065] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0066] Furthermore, while the embodiments described herein may include descriptions of the material, dimensions, shape, relative arrangement, or conditions for implementation of each component, these are merely illustrative examples and are not limited to those described in each embodiment. Therefore, countless variations not illustrated are conceivable within the scope of each embodiment. For example, this includes modifying, adding, or omitting any component, or even extracting at least one component from at least one embodiment and combining it with a component from another embodiment.

[0067] The various aspects of this disclosure are summarized below as an appendix.

[0068] (Note 1) Base plate and A semiconductor module, including control terminals, is provided on the upper surface of the base plate, A control board is provided on the upper side of the semiconductor module and to which the control terminals are connected, A terminal guide having a through hole through which the control terminal passes, an upper guide surface provided opposite the lower surface of the control board and at least a portion of which contacts the lower surface of the control board, a lower guide surface at least a portion of which is positioned at or below the position of the upper surface of the semiconductor module, and a body portion connecting the upper guide surface and the lower guide surface, A semiconductor device equipped with the following features. (Note 2) The control terminal has a protruding portion that extends in a direction parallel to the upper surface of the base plate, a rising portion that rises up on the upper side of the base plate, and a bent portion that connects the protruding portion and the rising portion. The lower surface of the guide is in contact with the protruding portion. The semiconductor device described in Appendix 1. (Note 3) The lower surface of the guide has a first lower surface and a second lower surface. The first lower surface is in contact with the protruding portion, The second lower surface is in contact with the base plate. Semiconductor device as described in Appendix 2. (Note 4) The lower surface of the guide is in contact with the upper surface of the base plate. The semiconductor device described in Appendix 1. (Note 5) The lower surface of the guide is in contact with the upper surface of the semiconductor module. The semiconductor device described in Appendix 1. (Note 6) The semiconductor module has a plurality of terminals, The terminal guide has a plurality of through holes, Each of the control terminals passes through the multiple through holes. A semiconductor device as described in any one of the items 1 to 5 of the appendix. (Note 7) The terminal guide is provided divided in a direction parallel to the control terminal on the plane including the through hole, A semiconductor device as described in any one of the appendices 1 to 6. (Note 8) The semiconductor modules comprise a plurality of the aforementioned semiconductor modules, The terminal guide covers the control terminals that protrude from the sides of each of the multiple semiconductor modules that are provided in the same direction. A semiconductor device as described in any one of the items 1 to 7 of the appendix. (Note 9) The terminal guide comprises a first terminal guide portion that covers a control terminal protruding from one side of the semiconductor module, a second terminal guide portion that covers a control terminal protruding from the other side located opposite to the first side, and an intermediate portion that connects the first terminal guide portion and the second terminal guide portion. A semiconductor device as described in any one of the appendices 1 to 8. (Note 10) The aforementioned connecting portion has a third lower surface, The third lower surface contacts the upper surface of the semiconductor module. Semiconductor device as described in Appendix 9. (Note 11) The terminal guide covers the control terminals provided on the upper surface of the semiconductor module. The semiconductor device described in Appendix 1. (Note 12) The through-hole has a shape in which the diameter on the base plate side is larger than the diameter on the control board side. A semiconductor device as described in any one of the appendices 1 to 11. [Explanation of symbols]

[0069] 1 Water cooling jacket, 2 Base plate, 3 Screw, 4 Control board, 5 Through hole, 6 Semiconductor module, 7 AC output main terminal, 8 AC busbar, 9 DC input main terminal, 10 DC busbar, 11, 42 Control terminals, 12 Protruding part, 13 Rising part, 14 Bent part, 15, 22, 32, 36, 43, 44, 46, 47 Terminal guide, 16 Through hole, 17, 28, 29 Guide top surface, 18, 33, 40, 45 Guide bottom surface, 23 Guide first part, 24 Guide second part, 34 First bottom surface, 35 Second bottom surface, 37 First terminal guide part, 38 Second terminal guide part, 39 Intermediate part, 41 Third bottom surface, 101, 103, 104, 105, 106 Semiconductor device

Claims

1. Base plate and A semiconductor module, including control terminals, is provided on the upper surface of the base plate, A control board is provided on the upper side of the semiconductor module and to which the control terminals are connected, A terminal guide having a through hole through which the control terminal passes, an upper guide surface provided opposite the lower surface of the control board and at least a portion of which contacts the lower surface of the control board, a lower guide surface at least a portion of which is positioned at or below the position of the upper surface of the semiconductor module, and a body portion connecting the upper guide surface and the lower guide surface, A semiconductor device equipped with the following features.

2. The control terminal has a protruding portion that extends in a direction parallel to the upper surface of the base plate, a rising portion that rises up on the upper side of the base plate, and a bent portion that connects the protruding portion and the rising portion. The lower surface of the guide is in contact with the protruding portion. The semiconductor device according to claim 1.

3. The lower surface of the guide has a first lower surface and a second lower surface. The first lower surface is in contact with the protruding portion, The second lower surface is in contact with the base plate. The semiconductor device according to claim 2.

4. The lower surface of the guide is in contact with the upper surface of the base plate. The semiconductor device according to claim 1.

5. The lower surface of the guide is in contact with the upper surface of the semiconductor module. The semiconductor device according to claim 1.

6. The semiconductor module has a plurality of terminals, The terminal guide has a plurality of through holes, Each of the aforementioned terminals passes through a plurality of aforementioned through holes. The semiconductor device according to claim 1.

7. The terminal guide is provided divided in a direction parallel to the control terminal on the plane including the through hole, The semiconductor device according to claim 1.

8. The semiconductor modules comprise a plurality of the aforementioned semiconductor modules, The terminal guide covers the control terminals that protrude from the sides of each of the multiple semiconductor modules that are provided in the same direction. The semiconductor device according to claim 1.

9. The terminal guide comprises a first terminal guide portion that covers a control terminal protruding from one side of the semiconductor module, a second terminal guide portion that covers a control terminal protruding from the other side located opposite to the first side, and an intermediate portion that connects the first terminal guide portion and the second terminal guide portion. The semiconductor device according to claim 1.

10. The aforementioned connecting portion has a third lower surface, The third lower surface contacts the upper surface of the semiconductor module. The semiconductor device according to claim 9.

11. The terminal guide covers the control terminals provided on the upper surface of the semiconductor module. The semiconductor device according to claim 1.

12. The through-hole has a shape in which the diameter on the base plate side is larger than the diameter on the control board side. The semiconductor device according to any one of claims 1 to 11.

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