Semiconductor equipment

Abstract

The present invention provides a semiconductor device that suppresses the intrusion of foreign matter into semiconductor elements due to long-term use or aging. [Solution] The photovoltaic module 1 as a semiconductor device is generally configured to include a first substrate 2, a semiconductor element provided on the first substrate 2 that converts input first energy into second energy and outputs it, a moisture-absorbing region 5 that surrounds the semiconductor element and is placed on the first substrate 2, in which volume changes are suppressed before and after moisture absorption, a second substrate 7 that is bonded to the first substrate 2 with the semiconductor element and the moisture-absorbing region 5 in between, and an adhesive region 4 provided between the semiconductor element and the moisture-absorbing region 5, and on at least one of the outside of the moisture-absorbing region 5, which integrates the first substrate 2 and the second substrate 7.

Description

Technical Field

[0001] The present invention relates to a semiconductor device.

Background Art

[0002] As a conventional technique, an electronic device is known that includes a first substrate, a functional element provided on the surface of the first substrate, a second substrate facing the surface of the first substrate, and a moisture absorption layer and a first adhesive layer that bond the first substrate and the second substrate and are provided between the first substrate and the second substrate (see, for example, Patent Document 1).

[0003] In this electronic device, the first substrate and the second substrate are sufficiently adhered through the moisture absorption layer, and it has excellent sealing performance. The moisture absorption layer is configured to include a desiccant and a UV (Ultraviolet) curable resin.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a conventional electronic device, due to long-term use, the desiccant contains a large amount of moisture, its volume changes, and a space is generated. Due to the generated space, moisture and air may invade from the outside, or the elements may be damaged by the pulverized pieces of the desiccant due to aging deterioration.

[0006] Therefore, an object of the present invention is to provide a semiconductor device that suppresses the intrusion of foreign matter into the semiconductor element due to long-term use or aging deterioration.

Means for Solving the Problems

[0007] One aspect of the present invention provides a semiconductor device comprising: a first substrate; a semiconductor element provided on the first substrate that converts input first energy into second energy and outputs it; a moisture-absorbing region disposed on the first substrate surrounding the semiconductor element, wherein volume changes are suppressed before and after moisture absorption; a second substrate bonded to the first substrate with the semiconductor element and the moisture-absorbing region in between; and an adhesive region provided between the semiconductor element and the moisture-absorbing region, and on at least one of the outside of the moisture-absorbing region, which integrates the first substrate and the second substrate. [Effects of the Invention]

[0008] According to the present invention, it is possible to suppress the intrusion of foreign matter into the semiconductor element due to long-term use or deterioration over time. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a top view showing an example of a photovoltaic module according to an embodiment. [Figure 2] Figure 2(a) is an example of a cross-sectional view of a portion of the cross-section of the photovoltaic module of the embodiment, cut along line AA in Figure 1, viewed from the direction of the arrow, and Figure 2(b) is an example of a cross-sectional view showing a portion of the cross-section of the photovoltaic module, cut along line BB in Figure 1. [Figure 3] Figure 3 shows an example of volume change and the occurrence of pulverized fragments in the photovoltaic module according to the embodiment. [Figure 4] Figures 4(a) to 4(c) show an example of a method for manufacturing a photovoltaic module according to an embodiment. [Figure 5] Figures 5(a) and 5(b) show an example of a method for manufacturing a photovoltaic module according to an embodiment. [Modes for carrying out the invention]

[0010] (Summary of the embodiment) The semiconductor device according to this embodiment is generally configured to include: a first substrate; a semiconductor element provided on the first substrate that converts input first energy into second energy and outputs it; a moisture-absorbing region surrounding the semiconductor element and placed on the first substrate, in which volume changes are suppressed before and after moisture absorption; a second substrate that is bonded to the first substrate with the semiconductor element and the moisture-absorbing region in between; and an adhesive region provided between the semiconductor element and the moisture-absorbing region, and on at least one of the outside of the moisture-absorbing region, which integrates the first substrate and the second substrate.

[0011] In this semiconductor device, volume changes due to moisture absorption are suppressed in the moisture-absorbing region. Compared to cases where volume changes due to moisture absorption are large, this suppresses the generation of voids and other defects caused by volume changes, thereby preventing the intrusion of foreign matter into the semiconductor element due to long-term use or aging.

[0012] [Embodiment] (Overview of Photovoltaic Module 1) Figure 1 is a top view showing an example of a photovoltaic module according to an embodiment. Figure 2(a) is an example of a cross-sectional view of a part of the cross section of the photovoltaic module according to the embodiment, cut along line AA in Figure 1, viewed from the direction of the arrow. Figure 2(b) is an example of a cross-sectional view showing a part of the cross section of the photovoltaic module, cut along line BB in Figure 1. Figure 2(c) is an example of a cross-sectional view showing a part of the cross section of a modified photovoltaic module. Although Figure 1 is not a cross-sectional view, it is shaded to make the configuration of the photovoltaic module 1 easier to understand. Note that in the figures relating to the embodiments described below, the ratios and shapes between figures may differ from the actual ratios and shapes. First, the outline of the photovoltaic module 1 as a semiconductor device will be explained.

[0013] As shown in FIGS. 1 and 2(a), the photovoltaic module 1 includes a first substrate 2, a semiconductor element provided on the first substrate 2 that converts the input first energy into a second energy and outputs it, and a moisture absorption region 5 disposed on the first substrate 2 surrounding the semiconductor element and having a volume change suppressed before and after moisture absorption, a second substrate 7 bonded to the first substrate 2 with the semiconductor element and the moisture absorption region 5 interposed therebetween, and an adhesive region 4 provided at least one of between the semiconductor element and the moisture absorption region 5 and outside the moisture absorption region 5 to integrate the first substrate 2 and the second substrate 7, and is schematically configured.

[0014] As shown in FIG. 2(a), the moisture absorption region 5 has a moisture absorbent 50 that absorbs moisture and a filler 51 filled in the moisture absorption region 5 to relieve the volume change of the moisture absorbent 50 due to moisture absorption.

[0015] As shown in FIG. 1, the adhesive region 4 has a first adhesive region 41 provided between the semiconductor element and the moisture absorption region 5 and a second adhesive region 42 provided outside the moisture absorption region 5.

[0016] As shown in FIG. 2(b), the photovoltaic module 1 includes a wiring 6 that is electrically connected to the semiconductor element and disposed between the adhesive region 4 and the moisture absorption region 5 and the first substrate 2.

[0017] The semiconductor element is a photovoltaic element 3 that converts light energy as the first energy into electrical energy as the second energy.

[0018] Note that the photovoltaic module 1 may be configured to have a plurality of semiconductor elements.

[0019] (Configuration of the first substrate 2) The first substrate 2 is, for example, a sheet-like film substrate, but is not limited thereto and may be a hard and difficult-to-bend substrate. Since the semiconductor element of the present embodiment is the photovoltaic element 3, in order to input the light 8 to the photovoltaic element 3 from the back surface 21 side, it is formed of a transparent resin such as acrylic, PET (polyethylene terephthalate), polycarbonate, polyethersulfone, fluorine film, or triacetate.

[0020] (Configuration of the photovoltaic element 3) The photovoltaic element 3 is, for example, an organic solar cell, a silicon solar cell, a compound solar cell, an organic-inorganic hybrid solar cell, or the like. The photovoltaic element 3 of the present embodiment is, as an example, a perovskite solar cell having excellent flexibility.

[0021] Note that the semiconductor element is not limited to the photovoltaic element 3, and may be an organic EL (electro-luminescence) element that converts electrical energy as the first energy into light energy as the second energy.

[0022] (Configuration of the adhesion region 4) As described above, the adhesion region 4 has the first adhesion region 41 and the second adhesion region 42. The first substrate 2 and the second substrate 7 are adhered in the first adhesion region 41 and the second adhesion region 42 to seal the photovoltaic element 3.

[0023] The adhesion region 4 is formed, for example, by applying an adhesive by an inkjet method, a screen printing method, a dispenser method, or the like.

[0024] Further, the adhesion region 4 may be formed, for example, by adhesion using an adhesive, an adhesive sheet, and a thermosetting resin, or may be formed by adhesion by a hot melt sheet, thermocompression bonding, ultrasonic welding, or the like. The adhesion region 4 of the present embodiment is, as an example, formed by applying an adhesive to form the first adhesion region 41 and the second adhesion region 42, but is not limited thereto.

[0025] (Configuration of the moisture absorption region 5) The moisture-absorbing area 5 is composed of a desiccant 50 and a filler 51. Examples of the desiccant 50 include silica gel, zeolite, calcium chloride, silica-alumina gel, barium oxide, strontium oxide, aluminosilicate, and activated carbon.

[0026] The filler 51 is fluid and insulating, and contains nanofillers, in order to suppress the volume change of the desiccant 50 after it has absorbed moisture. Examples of these nanofillers include silica (SiO2), cellulose nanofibers, and zeolites. The nanofillers have pores, for example, the size of a water molecule, and adsorb and retain moisture within these pores.

[0027] The desiccant 50 and filler 51 are formed in the moisture-absorbing region 5, for example, by a dispenser. Therefore, it is preferable that the desiccant 50 and filler 51 are made of materials that mix easily with the solvent.

[0028] In the moisture-absorbing region 5, a desiccant 50 is first applied, and then a filler 51 is applied on top of the applied desiccant 50. The filler 51 is provided so as to cover the desiccant 50, as shown in Figure 2(a). As a modification, in the moisture-absorbing region 5, as shown in Figure 2(c), the filler 51 may be provided on top of the desiccant 50 provided on the surface 20 of the first substrate 2.

[0029] (Wiring configuration 6) The wiring 6 is used, for example, to extract the power generated by the photovoltaic element 3 to the outside. The wiring 6 is formed as a thin film using a conductive metallic material such as copper or silver.

[0030] The wiring 6 is provided on the surface 20 of the first substrate 2, as shown in Figure 2(b), with one end electrically connected to the photovoltaic element 3 and the other end exposed to the outside. This exposed portion serves as a pad for connection to the outside. The adhesive region 4 and the moisture absorption region 5 are formed on the wiring 6. The wiring 6 may be, for example, a straight line from one end to the other, or it may have a shape that changes direction at least once. By having a shape that changes direction several times, for example, moisture entering through the wiring 6 can be suppressed.

[0031] (Composition of the second substrate 7) The second substrate 7 is, for example, a sheet-shaped film substrate. When the second substrate 7 is used to generate electricity in the photovoltaic element 3 by inputting light from the surface 70, it is formed from a transparent resin such as PET resin or polycarbonate resin, similar to the first substrate 2. Alternatively, if it is not necessary to input light from the surface 70, the second substrate 7 can be made from an opaque resin. The back surface 71 of the second substrate 7 is then bonded to the surface 20 of the first substrate 2.

[0032] (Regarding the function of moisture absorption region 5) Figure 3 shows an example of volume change and the occurrence of pulverized fragments in the photovoltaic module according to the embodiment.

[0033] As shown in Figure 3, for example, the desiccant 50 may absorb a large amount of moisture and change in volume due to long-term use, and may also produce pulverized fragments 500 due to deterioration over time.

[0034] If the desiccant 50 contains, for example, calcium, moisture will cause the calcium to change into calcium hydroxide, resulting in a decrease in volume. Moisture may penetrate into the interior through the space between the first substrate 2 and the second substrate 7, which is caused by this decrease in volume.

[0035] As described above, when the volume of the desiccant 50 decreases, the volume of the filler 51 increases to compensate for this decrease. This is because the nanofiller increases its volume by retaining moisture in its pores. In other words, the filler 51 suppresses the absorption of all moisture by the desiccant 50 and increases the volume of the nanofiller, thereby suppressing the volume change of the desiccant 50. Therefore, by adjusting the nanofiller content appropriately, the filler 51 can suppress the volume change of the desiccant 50. Furthermore, the filler 51 may also be made to have the property of following volume changes, taking into account cases where the volume of the desiccant 50 increases, and a gel-like nanofiller that suppresses the scattering of crushed desiccant 50 may also be used.

[0036] Furthermore, since the crushed pieces 500 of the desiccant 50 that deteriorate over time are held in place by the filler 51, it is possible to suppress the crushed pieces 500 from reaching the photovoltaic element 3 and causing damage, compared to the case without the filler.

[0037] (Manufacturing method for photovoltaic module 1) Figures 4(a) to 5(b) show an example of a method for manufacturing a photovoltaic module according to an embodiment.

[0038] As shown in Figure 4(a), the photovoltaic element 3 is attached to the surface 20 of the first substrate 2. The wiring 6 is also formed at this stage.

[0039] Next, as shown in Figure 4(b), a desiccant 50 is applied to the surface 20 of the first substrate 2 so as to surround the photovoltaic element 3. The desiccant 50 is applied, for example, by an inkjet method.

[0040] Next, as shown in Figure 4(c), a filler 51 is applied on top of the desiccant 50. The filler 51 is applied, for example, by a dispenser.

[0041] Next, as shown in Figure 5(a), a first adhesive region 41 and a second adhesive region 42 are formed. The adhesive for forming the first adhesive region 41 and the second adhesive region 42 is applied, for example, by a dispenser method.

[0042] Next, as shown in Figure 5(b), the second substrate 7 is attached to the first substrate 2 to obtain the photovoltaic module 1.

[0043] The adhesive region 4 may also be formed by ultrasonic welding or the like, as shown in Figure 5(b), by placing the second substrate 7 on the first substrate 2 and forming the first adhesive region 41 and the second adhesive region 42.

[0044] (Effects of the embodiment) The photovoltaic module 1 according to this embodiment can suppress the intrusion of foreign matter into the photovoltaic element 3 due to long-term use or aging. Specifically, the photovoltaic module 1 can block moisture that has entered from the adhesive region 42 before it can enter the region where the semiconductor element is placed, and the volume change of the desiccant 50 due to long-term use can be mitigated by the filler material 51. Therefore, compared to a configuration that is not adopted, the formation of spaces caused by volume change is suppressed, and the intrusion of moisture into the photovoltaic element 3 can be suppressed. In addition, even if crushed pieces 500 of the desiccant 50 are generated due to aging, the photovoltaic module 1 can be held in place by the filler material 51, so compared to a configuration that is not adopted, the intrusion of foreign matter into the photovoltaic element 3 can be suppressed.

[0045] The photovoltaic module 1 can suppress the intrusion of moisture into the photovoltaic element 3 by the moisture-absorbing region 5 where volume changes are mitigated. Therefore, compared to a configuration without this setting, it can suppress the performance degradation of perovskite solar cells and other devices using organic materials that are prone to malfunction due to moisture intrusion. Furthermore, the photovoltaic module 1 suppresses the intrusion of foreign matter into the photovoltaic element 3 due to long-term use and aging, thus maintaining performance over a long period.

[0046] Since the photovoltaic module 1 is equipped with a first adhesive region 41 around the photovoltaic element 3 and a second adhesive region 42 outside the moisture-absorbing region 5, the intrusion of foreign substances such as moisture can be suppressed more effectively compared to a configuration that is not adopted.

[0047] Although embodiments and modifications of the present invention have been described above, these embodiments and modifications are merely examples and do not limit the invention as defined in the claims. These novel embodiments and modifications can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. Furthermore, not all combinations of features described in these embodiments and modifications are essential means for solving the problem of the invention. Moreover, these embodiments and modifications are included in the scope and spirit of the invention, as well as in the invention described in the claims and its equivalents. [Explanation of symbols]

[0048] 1...Photovoltaic module, 2...First substrate, 3...Photovoltaic element, 4...Adhesive area, 5...Moisture-absorbing area, 6...Wiring, 7...Second substrate, 8...Light, 20...Front surface, 21...Back surface, 41...First adhesive area, 42...Second adhesive area, 50...Moisture absorbent, 51...Filler, 70...Front surface, 71...Back surface, 500...Powdered fragments

Claims

1. The first substrate and A semiconductor element provided on the first substrate, which converts the input first energy into a second energy and outputs it, A moisture-absorbing region is placed on the first substrate surrounding the semiconductor element, and its volume change is suppressed before and after moisture absorption. A second substrate is bonded to the first substrate with the semiconductor element and the moisture-absorbing region in between, An adhesive region is provided between the semiconductor element and the moisture-absorbing region, and at least one of the areas outside the moisture-absorbing region, which integrates the first substrate and the second substrate. A semiconductor device equipped with the following features.

2. The moisture-absorbing region comprises a desiccant that absorbs moisture, and a filler that fills the moisture-absorbing region to mitigate the volume change of the desiccant caused by the absorption of moisture. The semiconductor device according to claim 1.

3. The adhesive region comprises a first adhesive region provided between the semiconductor element and the moisture-absorbing region, and a second adhesive region provided outside the moisture-absorbing region. The semiconductor device according to claim 2.

4. The wiring is electrically connected to the semiconductor element and is arranged between the adhesive region and the moisture-absorbing region and the first substrate. The semiconductor device according to claim 3.

5. The semiconductor element is a photovoltaic element that converts light energy, which is the first energy, into electrical energy, which is the second energy. The semiconductor device according to any one of claims 1 to 4.

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