Processing method

Abstract

This invention provides a processing method that makes it possible to estimate when an abnormality occurred in the processed object. [Solution] A processing method for processing a substrate 10, one example of which includes a first processing step S10 in which the substrate 10 is processed with a tape application device 100a, a transport step S20 in which the substrate 10 is transported outside the tape application device 100a by a transport vehicle 5 after the first processing step S10, and an abnormality detection step S30 in which an abnormality in the substrate 10 is detected in the transport vehicle 5.

Description

Technical Field

[0005]

[0001] The present invention relates to a method for processing an object to be conveyed.

Background Art

[0002] When a plurality of devices are formed on the surface of a thin plate-like wafer and the wafer is divided for each device, device chips to be mounted on an electronic device can be formed. For dividing the wafer, first, a wafer is attached to an annular frame via an adhesive tape by a tape attaching device to form a work unit. Then, after the work unit is conveyed to a cutting device, the wafer of the work unit held by the holding table of the cutting device is divided by cutting with a cutting blade or the like.

[0003] However, in cutting the wafer, the wafer may not be appropriately processed due to a defect of the cutting device or the like. And if manufacturing is carried out in a state where the wafer or the device chip is damaged or contamination (chips) is attached, the obtained device chip may be a defective product. Therefore, in order to confirm that the processing of the wafer is appropriately performed, the wafer processed by the cutting device is imaged and inspected by a camera unit (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In inspections that involve imaging wafers after processing with a cutting device such as the one described in Patent Document 1, when scratches or contamination are found on the wafer, the cause is not necessarily due to a processing defect in the cutting device. It may also be due to scratches or contamination that were already present on the wafer before processing. Therefore, it is desirable to estimate when the abnormality in the processed material, such as scratches or contamination, occurred.

[0006] The present invention provides a processing method that can estimate when an abnormality occurred in the processed object. [Means for solving the problem]

[0007] One aspect of the present invention is, A processing method for processing an object to be processed, A first processing step involves processing the workpiece in the first processing apparatus, After the first processing step, a transport step is performed in which the workpiece is transported outside the first processing apparatus by a transport unit, The transport unit includes an abnormality detection step for detecting an abnormality in the object to be processed. [Effects of the Invention]

[0008] According to the present invention, it is possible to estimate at what point in time an abnormality occurred in the processed object. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a plan view showing an example of the transport system 1. [Figure 2] Figure 2 is a perspective view showing an example of a work unit 13 including a substrate 10, a ring frame 11, and adhesive tape 12. [Figure 3] Figure 3 is a perspective view showing an example of a transport vehicle 5. [Figure 4] Figure 4 is a perspective view showing an example of container 508. [Figure 5]Figure 5 is a perspective view showing the vicinity of the transport vehicle 5, and illustrates the state in which the container 508 is placed on the placement area A. [Figure 6] Figure 6 is a side view showing the configuration of the lifting unit 510 and the state in which the container 508 is placed on the mounting area A. [Figure 7] Figure 7 is an image showing an example of reference information. [Figure 8] Figure 8 is an image showing an example of detection information. [Figure 9] Figure 9 is a perspective view showing the appearance of the processing device 100 and an example of the transport path 2. [Figure 10] Figure 10 is a perspective view showing an example of a tape application device 100a. [Figure 11] Figure 11 is a perspective view showing an example of a cutting device 100b. [Figure 12] Figure 12 is a flowchart showing an example of the processing method. [Modes for carrying out the invention]

[0010] The following describes a processing method of one embodiment of the present invention with reference to the drawings.

[0011] The processing method in this embodiment involves processing an object to be processed in a first processing device, transporting it to a second processing device, and then processing it in the second processing device. If an abnormality occurs in the object to be processed during this process, the timing of the abnormality is estimated. The transport of the object to be processed is achieved, for example, by a transport system 1. Before describing the processing method, the configurations of the transport system 1, the first processing device, and the second processing device will be described. In the following description, the X-axis direction is a single direction in the horizontal plane. The Y-axis direction is a direction perpendicular to the X-axis direction in the horizontal plane. The Z-axis direction is a direction perpendicular to both the X-axis and Y-axis directions.

[0012] [Conveyor System] FIG. 1 is a plan view showing a transfer system 1. The transfer system 1 is a system for transferring a substrate 10 (see FIG. 2), which is an object to be processed, above a plurality of processing apparatuses 100. In this transfer system 1, a transfer path 2 is provided above the plurality of processing apparatuses 100, and the object to be processed can be transferred between the plurality of processing apparatuses 100 through the transfer path 2. In an embodiment, as an example, the substrate 10 is transferred from a tape sticking apparatus 100a (see FIG. 10), which is a first processing apparatus, to a cutting apparatus 100b (see FIG. 11), which is a second processing apparatus. In the example shown in FIG. 1, a part of the transfer system 1 is shown, and only one processing apparatus (for example, the tape sticking apparatus 100a, the cutting apparatus 100b) is shown. Also, in the following description, when not specifying a specific processing apparatus such as the tape sticking apparatus 100a or the cutting apparatus 100b, it is simply referred to as the processing apparatus 100.

[0013] During transfer, the substrate 10 is transferred as a work unit 13 that is unitized by attaching an adhesive tape 12 to the substrate 10 and a ring frame 11 having an opening large enough to accommodate the substrate 10.

[0014] FIG. 2 is a perspective view schematically showing a work unit 13 including the substrate 10, the ring frame 11, and the adhesive tape 12. The substrate 10 is, for example, a substantially disc-shaped wafer or an optical device wafer made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors.

[0015] On the surface 10a of the substrate 10, a plurality of streets 14 intersecting each other are used as division planned lines, and a plurality of regions partitioned by the division planned lines are formed in a lattice pattern. Devices 15 such as ICs (Integrated Circuits), LSIs (Large Scale Integrated circuits), and MEMS (Micro Electro Mechanical Systems) are formed in each of the partitioned regions. When the substrate 10 is divided along the division planned lines by a second processing apparatus (for example, a cutting apparatus) described later, individual device chips are formed.

[0016] The substrate 10 is integrated with a ring frame 11 and an adhesive tape 12 adhered so as to close the opening of the ring frame 11 to form a work unit 13. The ring frame 11 is, for example, formed of metal or resin and is an annular plate member having an opening larger than the outer diameter of the substrate 10. The adhesive tape 12 has expandability and is in a sheet shape having an outer diameter larger than the opening of the ring frame 11. The adhesive tape 12 is adhered to the back side of the ring frame 11 so as to cover the opening of the ring frame 11. The substrate 10 is positioned at a predetermined position of the opening of the ring frame 11, and the back surface 10b side of the substrate 10 is adhered to the adhesive tape 12, whereby the substrate 10 is fixed to the ring frame 11 and the adhesive tape 12.

[0017] In the transfer system 1, the workpiece to be transferred is not limited to the substrate 10 on which the device 15 is formed as described above, and may be a substrate on which no device or the like is formed. Further, in the embodiment, since it is an example of transferring the substrate 10 from the tape sticking device 100a to the cutting device 100b, the work unit 13 unitized by the tape sticking device 100a is the transfer target. However, for example, a substrate to which the adhesive tape 12 is not adhered or a substrate not supported by the ring frame 11 may be the transfer target. For example, when the substrate 10 is transferred from the loader / unloader 3 that houses the substrate 10 before processing to the tape sticking device 100a, the substrate 10 is transferred in a state where it is not unitized with the adhesive tape 12 or the ring frame 11.

[0018] The transport path 2 is installed above each processing unit 100 to connect multiple processing units 100. Substrates 10 are transported to each processing unit 100 through this transport path 2. The transport path 2 is provided with an opening 4 that runs vertically through it. A transport vehicle 5 (see Figure 3) equipped with a container 508 (see Figure 4) capable of housing a work unit 13 (described later) is moved above the opening 4, and the substrates 10 are loaded and unloaded by raising and lowering the container 508 through the opening 4. Since the transport path 2 is installed above the processing units 100, it does not interfere with piping 6, etc., connected to the sides of each processing unit 100.

[0019] Below the transport path 2, in addition to the processing unit 100, there is a loader / unloader (storage unit) 3 that accommodates substrates 10 before processing and substrates 10 after processing. The substrates 10 before processing that are stored in the loader / unloader 3 are loaded into the transport vehicle 5 at any time and transported to the designated processing unit 100.

[0020] The transport vehicle 5 transports the unprocessed substrate 10 received from the loader / unloader 3 to a predetermined processing device 100 by traveling along the transport path 2. In this embodiment, the transport vehicle 5 transports the unprocessed substrate 10 received from the loader / unloader 3 to the tape application device 100a, and then transports the substrate 10, which has undergone adhesive tape application processing such as the application of adhesive tape 12 in the tape application device 100a, to the cutting device 100b. Note that the transport vehicle 5 that transports the substrate 10 from the loader / unloader 3 to the tape application device 100a and the transport vehicle 5 that transports the substrate 10 from the tape application device 100a to the cutting device 100b may be different transport vehicles. In other words, there may be multiple transport vehicles 5 used in the transport system 1. After all processing is completed, the transport vehicle 5 may receive the processed substrate 10 from the processing device 100 and transport the processed substrate 10 back to the loader / unloader 3.

[0021] In this way, the transport system 1 uses a transport vehicle 5 to transport the substrate 10 to each processing unit 100. The control of this operation is performed by the control unit 7. The control unit 7 is a known computer that includes an arithmetic unit that performs various calculations, a storage unit that has a storage medium, and an input / output interface (none of which are shown) that controls the input and output of data to and from the inside and outside of the control unit 7. As shown in Figure 1, for example, the control unit 7 is able to communicate with each processing unit 100 such as the tape application device 100a and the cutting device 100b, the loader / unloader 3, and the transport vehicle 5, and the control unit 7 sends control signals to each component at appropriate timings.

[0022] Here, the configuration of the transport vehicle 5 described above will be explained in detail. Figure 3 is a perspective view showing an example of the transport vehicle 5. As shown in Figure 3, the transport vehicle 5 is equipped with a plate-shaped frame 501 on which various components are mounted. In the front-rear direction of the frame 501, front wheels 502 and rear wheels 503 are provided at both ends. The front wheels 502 and rear wheels 503 function as wheels for driving the transport vehicle 5 when it travels on the transport path 2.

[0023] A drive unit 504 is mounted at the front end of the frame 501 to drive a pair of front wheels 502. The drive unit 504 includes a pair of motors 506 connected to the front wheels 502 via an axle 505, etc. The motors 506 have a rotating shaft 506a and generate power to rotate the front wheels 502. The drive unit 504 can move the transport vehicle 5 forward or backward by controlling the direction of rotation of the pair of front wheels 502 with the pair of motors 506.

[0024] Furthermore, a battery (secondary battery) 507 is connected to the drive unit 504 via power supply wiring (not shown) to supply power to the motor 506 and other components. The battery 507 is, for example, mounted on the front end of the frame 501 and supplies power to the motor 506 to rotate the front wheel 502.

[0025] Below the frame 501, there is a storage area 509 in which a container 508 for housing the work unit 13 is stored. The storage area 509 is surrounded by a pair of front wheels 502 and a pair of rear wheels 503, and is located above the lower ends of the front wheels 502 and rear wheels 503. By being located above the lower ends of the front wheels 502 and rear wheels 503, it is possible to prevent the container 508 from coming into contact with the transport path 2 while the transport vehicle 5 is in motion.

[0026] Figure 4 is a perspective view showing an example of a container 508. The container 508 is an example of a support for supporting the substrate 10 in the embodiment, and includes a housing section 508a capable of housing a unitized substrate 10 inside. The housing section 508a is connected to the space outside the container 508 through a slit-shaped opening. The substrate 10 is loaded into the housing section 508a through the opening and is also loaded out of the housing section 508a through the opening. The top surface of the container 508 is transparent so that the substrate 10 can be imaged through the container 508 by a camera 520, which will be described later.

[0027] Returning to Figure 3, a lifting unit 510 for suspending and raising / lowering the container 508 is provided in the upper surface area of ​​the frame 501 located above the storage area 509. The lifting unit 510 lowers the container 508 stored in the storage area 509 and places it on a predetermined mounting area in the processing device 100. The lifting unit 510 also raises the container 508 that is placed on the predetermined mounting area and stores the container 508 back into the storage area 509.

[0028] Figure 5 is a perspective view showing the vicinity of the transport vehicle 5, with the container 508 placed in the placement area A. The lifting unit 510 comprises a suspension member 511, one end (lower end) of which is connected to the container 508, and a drive mechanism 512 for winding up and unwinding the suspension member 511. The placement area A is an area provided in each processing device 100 for placing the container 508.

[0029] As shown in Figure 5, the lifting unit 510 is equipped with four suspension members 511. For example, belts of a predetermined width are used as suspension members 511. The four suspension members 511 are connected between the lower surface of the frame 501 and the upper surface of the container 508.

[0030] When the container 508 is stored in the storage area 509, the suspension member 511 is extended by the drive mechanism 512, causing the container 508 to descend and be placed in the mounting area A. When the container 508 is placed in the mounting area A, the suspension member 511 is retracted by the drive mechanism 512, causing the container 508 to rise and be stored in the storage area 509.

[0031] Here, the configuration of the lifting unit 510 will be described in more detail. Figure 6 is a side view showing the lifting unit 510 and the container 508 stored in the storage area 509 placed on the mounting area A. As described above, the lifting unit 510 is equipped with a drive mechanism 512 that winds up and unwinds the suspension member 511. The drive mechanism 512 includes a motor 513 having a rotating shaft 513a. The motor 513 generates power used for winding up and unwinding the suspension member 511 by rotating the rotating shaft 513a. On both sides of the motor 513 are a first rotating shaft 514a and a second rotating shaft 514b, which are arranged parallel to each other.

[0032] A pulley 515 is provided on the first rotating shaft 514a, and an endless connecting member 516, such as a belt or chain, is placed between the rotating shaft 513a of the motor 513 and the pulley 515. The rotating shaft 513a of the motor 513, the pulley 515, and the connecting member 516 constitute a power transmission mechanism, connecting the motor 513 to the first rotating shaft 514a.

[0033] A cylindrical reel 517a is fixed to the first rotating shaft 514a, around which the suspension member 511 is wound. A cylindrical roller 518a that supports the suspension member 511 is positioned outside and below the reel 517a so as to be rotatable.

[0034] Similarly, a cylindrical reel 517b around which the suspension member 511 is wound is fixed to the second rotating shaft 514b. Furthermore, a cylindrical roller 518b that supports the suspension member 511 is positioned outside and below the reel 517b so as to be rotatable.

[0035] The base end of a suspension member 511 is fixed to each of the reels 517a and 517b. The suspension member 511 fixed to reel 517a hangs downward while in contact with the outer part of roller 518a. Similarly, the suspension member 511 fixed to reel 517b hangs downward while in contact with the outer part of roller 518b.

[0036] For example, when the rotating shaft 513a of the motor 513 is rotated in the direction indicated by arrow D1, the reel 517a fixed to the first rotating shaft 514a rotates in the direction that feeds out the suspension member 511 (in the direction indicated by arrow D2). As a result, the suspension member 511 is fed out from the reel 517a via the roller 518a.

[0037] Furthermore, the torque of the first rotating shaft 514a is transmitted to the second rotating shaft 514b by the connecting member 519, causing the reel 517b fixed to the second rotating shaft 514b to rotate in the direction that feeds out the suspension member 511 (indicated by arrow D3). As a result, the suspension member 511 is fed out from the reel 517b via the roller 518b.

[0038] On the other hand, when the rotation shaft 513a of the motor 513 is rotated in the direction indicated by arrow D4, the reel 517a fixed to the first rotation shaft 514a rotates in the direction that winds up the suspension member 511 (in the direction indicated by arrow D5). As a result, the suspension member 511 is wound onto the reel 517a via the roller 518a.

[0039] Furthermore, the torque of the first rotating shaft 514a is transmitted to the second rotating shaft 514b by the connecting member 519, causing the reel 517b fixed to the second rotating shaft 514b to rotate in the direction that winds up the suspension member 511 (indicated by arrow D6). As a result, the suspension member 511 is wound onto the reel 517b via the roller 518b.

[0040] When each suspension member 511 is fed out from the drive mechanism 512, the container 508 connected to the tip of the suspension member 511 descends. This allows the container 508 to be placed in the mounting area A, as shown in Figures 5 and 6. When each suspension member 511 is wound up by the drive mechanism 512, the container 508 connected to the tip of the suspension member 511 rises. This allows the container 508 to be stored in the storage area 509 of the transport vehicle 5 (see Figure 3).

[0041] Furthermore, the transport vehicle 5 in this embodiment is equipped with a camera 520 for capturing images of the substrate 10 and acquiring "detection information" of the substrate 10 when transporting the substrate 10 from a predetermined processing device to the transport vehicle 5, and / or when transporting the substrate 10 from the transport vehicle 5 to the predetermined processing device. In this embodiment, the image captured by this camera 520 becomes a comparison image with a reference image which is a pre-registered image. If there is an abnormality in the substrate 10, the camera 520 can detect that abnormality.

[0042] The camera 520 is positioned above the lifting unit 510 so as the container 508 moves up and down, it can image the substrate 10. The camera 520 has an image sensor that images the entire surface of the substrate 10 before or after a predetermined process along the path in which the container 508 is loaded and unloaded, in other words, along the path in which the container 508 moves up and down. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. The camera 520 images the substrate 10 along the path in which the container 508 is loaded and unloaded, and outputs the obtained image to the control unit 530. The image output to the control unit 530 is recorded in the storage unit.

[0043] As shown in Figures 5 and 6, the control unit 530 is provided on the upper surface of a plate-shaped support base 521 fixed to the frame 501. The control unit 530 controls the operation of the drive unit 504, lifting unit 510, camera 520, etc. of the transport vehicle 5. The control unit 530 is a known computer that includes an arithmetic unit that performs various calculations, a storage unit having a storage medium, and an input / output interface (none of which are shown) that controls the input and output of data to and from the inside and outside of the control unit 530.

[0044] The memory unit stores "reference information" that serves as a reference when comparing it with detection information captured by the camera 520. Figure 7 shows an example of this reference information. In this embodiment, since the substrate 10 may be imaged during the transport process of the substrate 10 from the tape application device 100a to the cutting device 100b, the reference information may include, for example, images of the substrate 10 before or after the adhesive tape 12 is applied by the tape application device 100a. Figure 7 shows, as an example, an image obtained by imaging the entire surface of the substrate 10 after the adhesive tape 12 has been applied. In other words, the reference information includes an image of the substrate 10 in a normal state (in other words, a state without abnormalities) before processing at the processing device at the transport destination. In this embodiment, the image in the reference information is a reference image for the image obtained by the camera 520 of the transport vehicle 5, so an image of the substrate 10 in a state where there are no scratches or foreign matter such as contamination on the surface 10a of the substrate 10 and no abnormalities have occurred in the substrate 10 is pre-registered.

[0045] Furthermore, the memory unit records "detection information" captured by the camera 520. Figure 8 shows an example of this detection information, which is an image obtained by capturing the entire surface of the substrate 10 with the camera 520 during the transport process of the substrate 10 from the tape application device 100a to the cutting device 100b. As mentioned above, the image in this detection information is a comparison image that is compared to the image in the reference information, and the example shown here includes two abnormal areas P such as contamination or dirt.

[0046] The calculation unit performs various calculations based on a predetermined program stored in the memory unit. The control unit 530 outputs various control signals to the above-mentioned components via the input / output interface according to the calculation results, thereby controlling the transport vehicle 5. The specific processing of the control unit 530 will be explained in the processing method described later.

[0047] Furthermore, as shown in Figure 5, a receiver 531 that receives signals from the outside and sends them to the control unit 530, and a transmitter 532 that transmits signals received from the control unit 530 to the outside are fixed to the support base 521.

[0048] Next, the configuration of the processing unit 100 will be described. Figure 9 is a perspective view showing the external appearance of the processing unit 100 and a part of the transport path 2. The processing unit 100 is housed inside the external appearance shown in Figure 9, and in this embodiment, a tape application device 100a and a cutting device 100b are housed inside. As shown in Figure 9, the processing unit 100 is equipped with a base 400 that supports each component.

[0049] A recess 401 is formed at the end of the base 400, and a lifting platform 403, which is raised and lowered by the lifting unit 510 described above, is placed in this recess 401. The area in which this lifting platform 403 is placed is the mounting area A on which the container 508 of the transport vehicle 5 described above is placed. In the example shown in Figure 9, the lifting platform 403 rises in the direction of the thick arrow.

[0050] The upper side of the base 400 is covered by a cover 404, and the processing unit is housed inside the cover 404. In addition, an opening 4 is provided in the area directly above the recess 401, which penetrates vertically through the ceiling 405 of the cover 404, and the container 508 moves from the outside to the inside of the cover 404, or from the inside to the outside of the cover 404, through this opening. The side wall of the base 400 is provided with a pipe connection section 406 to which the various pipes 6 shown in Figure 1 are connected.

[0051] Furthermore, a transport path 2 is provided above the ceiling 405 of the cover 404, on which the transport vehicle 5 travels. In this way, the processing device 100 is covered by the cover 404, and the transport path 2 is located above the processing device 100, enabling the loading and unloading of substrates 10 between the processing device 100 and the transport vehicle 5, thereby realizing the transport of substrates 10 between processing devices 100.

[0052] Next, the specific configuration of the processing apparatus 100 will be described. In this embodiment, as described above, the processing apparatus 100 includes a tape application device 100a and a cutting device 100b. The substrate 10 is then transported from the tape application device 100a to the cutting device 100b using the transport system 1. That is, the tape application device 100a and the cutting device 100b are connected to the transport system 1, and the substrate 10 is transported between the tape application device 100a and the cutting device 100b via a transport path 2 provided above each processing apparatus.

[0053] [Tape application device] Figure 10 is a perspective view showing the tape application device 100a. In this embodiment, the tape application device 100a forms a work unit 13 by applying adhesive tape 12 to the substrate 10 described above using Figure 2, and a ring frame 11 having an opening large enough to accommodate the substrate 10.

[0054] The tape application device 100a comprises, as its main components, a base 400a, a mounting space 30, a transport unit 40, a holding unit 50, a tape application unit 60, and a control unit 90. The base 400a corresponds to the base 400 shown in Figure 9.

[0055] The mounting space 30 is provided on the base 400a on one end in the X-axis direction and includes three first mounting spaces 30a, a second mounting space 30b, and a third mounting space 30c, which are arranged in the Y-axis direction. For example, a cassette C1 for containing the substrate 10 before the adhesive tape 12 is applied by the tape application device 100a is placed in the first mounting space 30a. For example, a mounting table A1 is placed in the second mounting space 30b on which a work unit 13 including the substrate 10 and ring frame 11 after the adhesive tape 12 has been applied by the tape application device 100a is placed. The second mounting space 30b corresponds to the mounting area A on which the container 508 is placed from the transport vehicle 5, and the mounting table A1 is placed in this mounting area A. In the third mounting space 30c, for example, a cassette C2 is placed to house the ring frame 11 before the adhesive tape 12 is applied by the tape application device 100a.

[0056] As shown in Figure 10, the transport unit 40 is provided adjacent to the mounting space 30. The transport unit 40 includes a first transport unit 40a that transports the substrate 10 from the cassette C1 to the holding unit 50, and a second transport unit 40b that transports the ring frame 11 from the cassette C2 to the holding unit 50, and also transports the work unit 13 from the holding unit 50 to the mounting table A1.

[0057] The first transport unit 40a comprises a base 41a and a pivotable arm 42a supported on the base 41a. The base 41a is configured to be movable, for example, in the Y-axis direction. In this embodiment, for example, a known ball screw type moving mechanism (not shown) enables the Y-axis movement of the first transport unit 40a. The first transport unit 40a supports the substrate 10 housed in the cassette C1 with the arm 42a and transports the substrate 10 from the cassette C1 into the holding unit 50.

[0058] Similarly, the second transport unit 40b comprises a base 41b and a pivotable arm 42b supported on the base 41b. The base 41b is configured to be movable in the Y-axis direction by, for example, a known ball screw type moving mechanism. The second transport unit 40b supports the ring frame 11 housed in the cassette C2 with the arm 42b and transports the ring frame 11 from the cassette C2 into the holding unit 50. The second transport unit 40b also supports the integrated work unit 13 with the arm 42b and transports the work unit 13 from the holding unit 50 into the mounting table A1.

[0059] The holding unit 50 holds the substrate 10 transported from cassette C1 by the first transport unit 40a, the ring frame 11 transported from cassette C2 by the second transport unit 40b, and the work unit 13 assembled by the tape application unit 60, which will be described later. Specifically, the holding unit 50 has an annular frame holding portion 51 for holding the ring frame 11 and a substrate holding portion 52 for holding the substrate 10. An opening is formed in the center of the upper surface of the frame holding portion 51, and the substrate holding portion 52 is positioned in this opening.

[0060] The holding unit 50 is supported by the moving unit 70 and is movable along the X-axis direction by the moving unit 70. When the holding unit 50 moves to one end in the X-axis direction, the substrate 10, ring frame 11, and work unit 13 are transported between the transport unit 40 and the holding unit 50. When the holding unit 50 moves to the other end in the X-axis direction, the adhesive tape 12 is attached by the tape attachment unit 60, which will be described later. The adhesive tape 12 is attached to the back surface 10b of the substrate 10 and the back surface of the ring frame 11 by the tape attachment unit 60, which will be described later, to form the work unit 13. Therefore, the holding unit 50 holds the surface 10a of the substrate 10 on which the device 15 etc. is formed, and the surface of the ring frame 11. Therefore, for example, when transporting the substrate 10 and the ring frame 11 to the holding unit 50, the transport unit 40 may adjust the orientation of the substrate 10 and the ring frame 11, such as reversing them, so that the surface 10a of the substrate 10 and the surface of the ring frame 11 are held by the holding unit 50.

[0061] The moving unit 70 includes a pair of guide rails 71 aligned with the X-axis direction, a ball screw 72 parallel to the guide rails 71 and connected to a nut portion provided on the lower surface of the holding unit 50, and a pulse motor 73 connected to one end of the ball screw 72. When the ball screw 72 is rotated by the pulse motor 73, the holding unit 50 moves along the X-axis direction.

[0062] The holding unit 50 is configured so that the position of the ring frame 11 can be adjusted so that the adhesive tape 12 can be properly attached to the ring frame 11. Specifically, the frame holding portion 51 includes a first fixing portion 53 that restricts the movement of the ring frame 11 in the X-axis direction. The first fixing portion 53 is formed, for example, in a long shape along the Y-axis direction. The frame holding portion 51 also includes a first movable portion 54 that faces the first fixing portion 53 and moves back and forth in the X-axis direction to sandwich the ring frame 11 between itself and the first fixing portion 53. The first movable portion 54 is provided in a position facing the first fixing portion 53 with the substrate holding portion 52 in between, and is composed, for example, of two pins protruding from the upper surface of the frame holding portion 51.

[0063] Similarly, the frame holding portion 51 includes a second fixing portion 55 that restricts the movement of the ring frame 11 in the Y-axis direction. The second fixing portion 55 is formed, for example, in a long shape along the X-axis direction. The frame holding portion 51 also includes a second movable portion 56 that faces the second fixing portion 55 and moves back and forth in the Y-axis direction to sandwich the ring frame 11 between itself and the second fixing portion 55. The second movable portion 56 is provided in a position facing the second fixing portion 55 with the substrate holding portion 52 in between, and is composed, for example, of two pins protruding from the upper surface of the frame holding portion 51.

[0064] In the frame holding section 51 configured in this way, the position of the ring frame 11 is adjusted to an appropriate position by sandwiching the ring frame 11 between the first fixing section 53 and the first movable section 54, and by sandwiching the ring frame 11 between the second fixing section 55 and the second movable section 56.

[0065] The tape application unit 60 applies adhesive tape 12 to the ring frame 11 and the substrate 10. The tape application unit 60 includes a tape dispensing roller 62 that stores multiple adhesive tapes 12 that are supported by a release tape 61, and a take-up roller 63 that winds up and collects the release tape 61 from which the adhesive tapes 12 have been peeled off. The adhesive tape 12 is supported by the release tape 61 in a state that has been cut to a predetermined shape that closes the opening of the ring frame 11, for example.

[0066] Furthermore, the tape application unit 60 includes a first guide roller 64 for guiding the release tape 61 pulled out from the tape dispensing roller 62, a peeling section 65 for bending the release tape 61 guided by the first guide roller 64 to peel it off from the adhesive tape 12, and a second guide roller 66 for guiding the release tape 61 peeled off from the adhesive tape 12 by the peeling section 65 towards the winding roller 63.

[0067] Furthermore, the tape application unit 60 is movable up and down above the holding unit 50 and is equipped with an application roller 67 that presses the adhesive tape 12, from which the release tape 61 has been peeled off, from above to adhere it to the ring frame 11. The application roller 67 presses the adhesive tape 12 by raising and lowering the tape application unit 60.

[0068] The tape application unit 60 rotates the tape dispensing roller 62, the first guide roller 64, the second guide roller 66, and the winding roller 63 in conjunction, and while transferring the release tape 61 from the tape dispensing roller 62 to the winding roller 63, the adhesive tape 12 is applied to the ring frame 11 and the substrate 10.

[0069] More specifically, with the end of the ring frame 11 positioned below the adhesive roller 67 of the tape application unit 60, the tape application unit 60 is lowered to a predetermined height. Next, the winding roller 63, etc., is rotated to peel the release tape 61 from the adhesive tape 12 at the peeling unit 65. After that, with the exposed adhesive surface of the adhesive tape 12 facing the back surface of the ring frame 11, the adhesive tape 12 is applied to the ring frame 11. Then, while pressing the portion of the adhesive tape 12 applied to the ring frame 11 from above with the adhesive roller 67, the holding unit 50 is moved from one end to the other by the moving unit 70. As a result, the adhesive surface of the adhesive tape 12 sequentially contacts the back surface of the ring frame 11 from one end to the other, and the adhesive tape 12 is applied to the ring frame 11. At this time, when the back surface 10b of the substrate 10 is positioned below the adhesive roller 67, the adhesive tape 12 is also attached to the back surface 10b of the substrate 10. Then, when the adhesive roller 67 reaches the other end of the ring frame 11, the attachment of the adhesive tape 12 to the ring frame 11 and the substrate 10 is completed.

[0070] Then, after the substrate 10, ring frame 11, and adhesive tape 12 are integrated to form the work unit 13, the moving unit 70 moves the holding unit 50 towards the transport unit 40. Then, the second transport unit 40b transports the work unit 13 from the holding unit 50 to the mounting table A1. After that, the work unit 13 placed on the mounting table A1 is placed in the container 508 of the transport vehicle 5 and transported to the cutting device 100b.

[0071] The control unit 90 controls each of the above-mentioned components in the tape application device 100a to perform processes such as applying adhesive tape 12 to the substrate 10. The control unit 90 is a known computer that includes an arithmetic unit that performs various calculations, a storage unit that has a storage medium, and an input / output interface (none of which are shown) that controls the input and output of data to and from the inside and outside of the control unit 90.

[0072] The calculation unit performs various calculations based on a predetermined program stored in the memory unit. The control unit 90 outputs various control signals to the above-mentioned components via the input / output interface according to the calculation results, thereby controlling the tape application device 100a. The specific processing of the control unit 90 will be explained in the processing method described later.

[0073] [Cutting equipment] Figure 11 is a perspective view showing the cutting device 100b. In this embodiment, the cutting device 100b holds the work unit 13, which has been transported from the tape application device 100a by the transport vehicle 5, on the holding table 210, and uses a cutting blade (not shown) to divide the substrate 10 along the planned division lines to form individual device chips.

[0074] As shown in Figure 11, the cutting apparatus 100b includes a holding table 210 that holds the workpiece unit 13 by suction on a holding surface 211, a cutting unit 220 that cuts the substrate 10 held by the holding table 210 with a cutting blade, an alignment camera 240 that images the substrate 10 held on the holding table 210, and a control unit 300.

[0075] Furthermore, the cutting apparatus 100b includes a moving unit (not shown) for moving the cutting unit 220 relative to the substrate 10 held by the holding table 210. The moving unit includes a Y-axis moving unit for moving the holding table 210 in the Y-axis direction, an X-axis moving unit for moving the cutting unit 220 in the X-axis direction, a Z-axis moving unit for moving the cutting unit 220 in the Z-axis direction, and a rotational moving unit for rotating the holding table 210 around an axis parallel to the Z-axis direction.

[0076] The X-axis movement unit, Y-axis movement unit, and Z-axis movement unit may be composed of, for example, known ball screw type movement units. The rotational movement unit may be configured to be rotated by, for example, a motor that rotates the holding table 210 around its axis.

[0077] The holding table 210 has a holding surface 211 for holding the substrate 10, which is made of porous ceramic or the like. The holding table 210 is provided to be movable in the Y-axis direction by a Y-axis moving unit, spanning from the machining area below the cutting unit 220 to the loading / unloading area where the substrate 10 is loaded and unloaded, separated from below the cutting unit 220, and is also provided to be rotatable around an axis parallel to the Z-axis direction by a rotational moving unit.

[0078] The holding table 210 has a holding surface 211 connected to a suction source (not shown), and the holding surface 211 is sucked by the suction source, thereby sucking up the substrate 10 placed on the holding surface 211.

[0079] The cutting unit 220 is a processing unit that performs cutting on a substrate 10 held by a holding table 210. It comprises a cutting blade for cutting the substrate 10, a spindle housing (not shown), a spindle (not shown) rotatably mounted on the spindle housing around its axis, and a spindle motor (not shown) for rotating the spindle around its axis. The cutting blade is an extremely thin cutting wheel with a substantially ring shape, and cuts the substrate 10 along the planned division line of the substrate 10 held by the holding table 210. The cutting unit 220 can position the cutting blade at any position on the holding surface 211 of the holding table 210, for example, by using an X-axis movement unit and a Z-axis movement unit.

[0080] The alignment camera 240 is fixed to a fixed frame 202 provided on the base 400b and is positioned between the loading / unloading area and the processing area. The base 400b corresponds to the base 400 shown in Figure 9. The alignment camera 240 is equipped with an image sensor that images a portion of the area to be divided of the substrate 10 before cutting, that is, a part of the surface 10a of the substrate 10, which is held on the holding table 210. The image sensor is, for example, a CCD image sensor or a CMOS image sensor. The alignment camera 240 images the substrate 10 held on the holding table 210 to obtain an image for performing alignment, such as aligning the position of the substrate 10 with the cutting blade, and outputs the obtained image to the control unit 300.

[0081] Furthermore, the cutting device 100b includes a mounting table A2 on which the substrate 10 is placed before and after cutting, a transport unit 250 that transports the substrate 10 between the mounting table A2 and the holding table 210, and a cleaning unit 260 that cleans the substrate 10 after cutting. In Figure 11, the space where the mounting table A2 is located corresponds to the mounting area A in the cutting device 100b.

[0082] The transport unit 250 transports the substrate 10 sequentially from the mounting table A2 to the holding table 210 and then to the washing unit 260. The transport unit 250 includes a pair of guide rails 251 on which the substrate 10 before cutting and the substrate 10 after cutting are placed on the mounting table A2 are placed, an loading / unloading unit 252 that removes the substrate 10 before cutting from the mounting table A2 and places it on the guide rails 251, and also places the substrate 10 after cutting on the guide rails 251 back onto the mounting table A2, a third transport unit 253 that transports the substrate 10 before cutting on the guide rails 251 to the holding table 210 in the loading / unloading area, and also transports the substrate 10 after washing from the washing unit 260 onto the guide rails 251, and a fourth transport unit 254 that transports the substrate 10 after cutting from the holding table 210 in the loading / unloading area to the washing unit 260.

[0083] The control unit 300 controls each component of the cutting device 100b to cause the cutting device 100b to perform various operations on the substrate 10. Specifically, the control unit 300 controls the holding table 210, the cutting unit 220, the transport unit 250, the cleaning unit 260, etc. The control unit 300 may have the same configuration as the control unit 90 in the tape application device 100a described above, and may include, for example, a calculation unit and a storage unit (neither of which are shown).

[0084] The calculation unit performs various calculations based on a predetermined program stored in the memory unit. The control unit 300 outputs various control signals to the above-mentioned components via the input / output interface according to the calculation results, thereby controlling the cutting device 100b. The specific processing of the control unit 300 will be explained in the processing method described later.

[0085] Furthermore, the cutting device 100b is connected to a display unit (not shown) that can receive input such as machining conditions from the operator via a touch panel and display the status of the machining operation and images, and to a notification unit 270. The display unit and the notification unit 270 are each connected to the control unit 300. The notification unit 270 notifies the operator by emitting at least one of sound and light. In this embodiment, the functions of the notification unit 270 are realized by screen display on the display unit, warning lights that emit light and sound, or transmission of information to a portable terminal held by the operator.

[0086] [Processing method] Next, a method for processing the transported object in the embodiment will be described. Figure 12 is a flowchart showing an example of the processing method. The processing method includes a first processing step S10, a transport step S20, an abnormality detection step S30, a second processing step S40, a cleaning step S50, a transmission step S60, a notification step S70, an abnormality resolution determination step S80, and an abnormality resolution step S90. Each of these steps is performed, for example, by the control unit 90 of the tape application device 100a, the control unit 530 of the transport vehicle 5, and the control unit 300 of the cutting device 100b.

[0087] For example, the first processing step S10 is executed by the control unit 90, the transport step S20, the abnormality detection step S30, and the transmission step S60 are executed by the control unit 530, and the second processing step S40, the cleaning step S50, the notification step S70, the abnormality resolution determination step S80, and the abnormality resolution step S90 are executed by the control unit 300.

[0088] In the first processing step S10, the control unit 90 performs the process of attaching the adhesive tape 12 to the substrate 10 and the ring frame 11, which are the targets for the adhesive tape 12, using the tape attachment device 100a. Specifically, the first transport unit 40a transports the substrate 10 from the cassette C1 and loads it into the holding unit 50. The second transport unit 40b loads the ring frame 11 from the cassette C2 into the holding unit 50. Then, the tape attachment unit 60 attaches the adhesive tape 12 to the ring frame 11 and the substrate 10 to form a work unit 13. The formed work unit 13 is transported by the transport vehicle 5 in the transport step S20 and is placed on the mounting table A1.

[0089] In the transport step S20, the control unit 530 transports the tape application device 100a outside the transport vehicle 5. "Transporting outside the tape application device 100a" means transporting to at least a device other than the tape application device 100a, such as a device that performs the next conceivable processing step. In this embodiment, since a cutting process is assumed as the next step, the work unit 13 including the substrate 10 is transported to the cutting device 100b. In this embodiment, the work unit 13 is transported to the cutting device 100b by the transport system 1, which uses the transport vehicle 5 described above as a transport unit. That is, the work unit 13 is placed in a container 508 placed in a predetermined placement area, and the lifting unit 510 raises the container 508 placed in the placement area and stores it in the storage area 509, thereby loading the container 508 into the transport vehicle 5. With the container 508 stored in the storage area 509, the transport vehicle 5 travels along the transport path 2. When the transport vehicle 5 reaches above the cutting device 100b, the lifting unit 510 lowers the container 508 and places it on the mounting area A of the cutting device 100b. This allows the container 508 to be unloaded from the transport vehicle 5 and completes its transport to the cutting device 100b. Through this transport process, the substrate 10 is transported from the tape application device 100a to the cutting device 100b.

[0090] In this embodiment, during the transport process in the transport step S20, the control unit 530 executes an abnormality detection step S30. In the abnormality detection step S30, the control unit 530 uses the camera 520 to image the surface 10a of the substrate 10 contained in the work unit 13 housed in the container 508 during the transport process of the substrate 10 from the tape application device 100a to the cutting device 100b, and acquires detection information of the substrate 10. Specifically, for example, the control unit 530 uses the camera 520 to image the surface 10a of the substrate 10 when it is loaded from the tape application device 100a to the transport vehicle 5, and / or when it is unloaded from the transport vehicle 5, and acquires detection information of the substrate 10. The image of the detection information detected in this abnormality detection step S30 is recorded in the storage unit. Note that the captured images detected in this abnormality detection step S30 are not limited to those showing abnormalities in the substrate 10, but also include those showing no abnormalities in the substrate 10. In this embodiment, as shown in Figure 8, abnormal areas P such as contamination and dirt are included.

[0091] Then, in the abnormality detection step S30, the control unit 530 determines whether an abnormality has occurred in the substrate 10 based on the detection in the abnormality detection step S30. Specifically, the control unit 530 refers to the memory unit to identify the reference information image and the detected image detected in the abnormality detection step S30, and performs an abnormality determination by comparing the two images. The means for this abnormality determination is, for example, template matching (pattern matching). As template matching, for example, known methods such as SAD (Sum of Absolute Difference), SSD (Sum of Squared Difference), NCC (Normalized Cross-Correlation), and ZNCC (Zero-mean Normalized Cross-Correlation) can be used. These are algorithms that determine the abnormality by looking at the difference in pixel values ​​in various ways. In this way, the control unit 530 compares the pre-registered reference information image with the detected information image detected in the abnormality detection step S30 using template matching, and determines that the images are similar if the similarity between them is greater than or equal to a predetermined value, and determines that they are dissimilar if the similarity between them is less than a predetermined value. The similarity of the images in the embodiment is defined, for example, by contamination or dirt adhering to the substrate 10.

[0092] Based on this abnormality detection, if the images are similar, the control unit 530 determines that there is no abnormality in the substrate 10. Conversely, if the images are not similar, it determines that there is an abnormality in the substrate 10. In this embodiment, the reference information in Figure 7 shows no contamination or dirt, while the detection information in Figure 8 includes two abnormal locations P such as contamination or dirt. Therefore, the images are not similar, and it is determined that an abnormality has occurred in the substrate 10 housed in the container.

[0093] If it is determined in the abnormality detection step S30 that an abnormality has occurred in the substrate 10 (Yes in the abnormality detection step S30), the control unit 530 proceeds to the transmission step S60. Conversely, if it is determined in the abnormality detection step S30 that no abnormality has occurred in the substrate 10 (No in the abnormality detection step S30), the control unit 530 proceeds to the second processing step S40. The second processing step S40 will be explained first.

[0094] In the second processing step S40, the control unit 300 performs cutting on the substrate 10 with the cutting device 100b. That is, since no abnormality has occurred in the substrate 10, cutting is performed on the substrate 10. Specifically, the substrate 10 is placed on the holding surface of the holding table 210 and the substrate 10 is held in place by suction. Then, the substrate 10 is imaged with the alignment camera 240 and alignment is performed based on the image captured. Then, the cutting unit 220 is controlled to move the cutting blade and the holding table relative to each other and perform cutting along the planned division line.

[0095] In the cleaning step S50, the control unit 300 cleans the substrate 10 that has been cut in the second processing step S40. This is to clean off any cutting debris that has adhered to the substrate 10. Specifically, the control unit 300 uses the transport unit 250 to transport the substrate 10 from the holding table 210 to the cleaning unit 260, and the cleaning unit 260 cleans the substrate 10 after cutting.

[0096] On the other hand, as described above, if it is determined in the abnormality detection step S30 that an abnormality has occurred in the substrate 10 (Yes in the abnormality detection step S30), the control unit 530 proceeds to the transmission step S60.

[0097] In the transmission step S60, the control unit 530 transmits the detection information obtained in the abnormality detection step S30 to the cutting device 100b. In this embodiment, since an abnormality has been detected in the substrate 10 by the abnormality detection step S30, information to that effect is transmitted. For example, the control unit 530 directly transmits information to the cutting device 100b that an abnormality has been detected in the substrate 10 via communication or the like. Alternatively, information that an abnormality has been detected may be transmitted to the cutting device 100b via a server or the like.

[0098] In notification step S70, the control unit 300 notifies the operator that an abnormality has occurred in the substrate 10 to be cut. For example, based on the information received from the transport vehicle 5 in the transmission step S60 that an abnormality has been detected, the control unit 300 activates notification units 270, such as display units and warning lights, provided on the cutting device 100b to notify the operator that an abnormality has occurred in the substrate 10. This allows the operator to understand that an abnormality has occurred in the substrate 10 and to avoid performing cutting on the substrate 10 while the abnormality is present.

[0099] Furthermore, since the transmission step S60 and the notification step S70 share the common function of notifying the operator or others that an abnormality has occurred in the circuit board 10, if, for example, the operator can understand that an abnormality has occurred in the circuit board 10 through the transmission step S60, the notification step S70 may be omitted.

[0100] In the abnormality resolution determination step S80, the control unit 300 determines whether the abnormality of the substrate 10 can be resolved by executing the abnormality resolution step S90 described later. After the abnormality resolution process in the abnormality resolution step S90 is performed, the system returns to the abnormality detection step S30, takes an image of the substrate 10 that has undergone the abnormality resolution process, and compares the images. In the initial routine, the abnormality resolution step S90 has not yet been executed, so in that case, the system may be configured to make a positive determination in the abnormality resolution determination step S80 (Yes in the abnormality resolution determination step S80).

[0101] On the other hand, if, after returning to the abnormality detection step S30 and imaging the substrate 10 after the abnormality elimination process, it is determined that an abnormality still exists (Yes in the abnormality detection step S30), and it is determined that the abnormality cannot be eliminated even if the abnormality elimination step S90 is executed (No in the abnormality elimination determination step S80), the control unit 300 terminates the processing method shown in Figure 12. In other words, if the dirt or other substances attached to the substrate 10 cannot be removed even after executing the abnormality elimination step S90, the process is terminated without performing cutting. To put it another way, if the similarity between the image of the reference information and the image of the detected information does not reach a predetermined value even after executing the abnormality elimination step S90, the process is terminated.

[0102] Furthermore, the cases in which the abnormality resolution determination step S80 is determined negatively may be defined, for example, by the number of times. For example, if there is a possibility that the abnormality of the substrate 10 can be resolved by the abnormality resolution step S90 up to two times, including the first time, the abnormality resolution determination step S80 may be determined positively (Yes in the abnormality resolution determination step S80), and then determined negatively (No in the abnormality resolution determination step S80) from the third time onward.

[0103] In the abnormality resolution step S90, the control unit 300 performs processing to resolve the abnormality in the substrate 10 that was determined to be abnormal in the abnormality detection step S30. As processing to resolve the abnormality, for example, a cleaning process is performed to clean off any contamination or dirt adhering to the substrate 10. Specifically, the control unit 300 transports the substrate 10 to the cleaning unit 260 using the transport unit 250 and cleans the substrate 10. Note that the cleaning in the abnormality resolution step S90 may be changed to cleaning conditions that have a stronger cleaning force compared to, for example, the cleaning conditions in the cleaning step S50 after cutting the substrate 10. For example, in the cleaning unit 260 that supplies pure water for cleaning, the cleaning conditions in the abnormality resolution step S90 may be changed to cleaning conditions where the cleaning time is longer than the cleaning conditions in the cleaning step S50 after cutting (for example, twice the cleaning time). Alternatively, the supply pressure of the pure water may be changed to a higher pressure than the cleaning conditions in the cleaning step S50 after cutting.

[0104] Furthermore, in addition to the cleaning process, the abnormality resolution step S90 may also include a suction process to remove contaminants and dirt adhering to the substrate 10, or a blower process to blow away contaminants and dirt adhering to the substrate 10.

[0105] As described above, in this embodiment, during the transport process from the tape application device 100a to the cutting device 100b, the camera 520 installed on the transport vehicle 5 detects abnormalities in the substrate 10. Therefore, it is possible to estimate that an abnormality occurred on the substrate 10, such as scratches or contamination, during processing by the tape application device 100a before the transport vehicle 5 transports the substrate 10, or during transport. In other words, in the conventional method, when an abnormality is determined after the second processing step S40, it was not possible to determine whether the detected abnormality occurred before or during the second processing step S40. However, by executing the abnormality detection step S30 on the transport vehicle 5 during transport, it becomes possible to detect abnormalities that occurred before the second processing step S40 before the second processing step S40. This makes it possible to prevent the substrate 10 with an abnormality from being processed in the second processing step S40. Furthermore, if an abnormality is detected after the second processing step S40, it can be determined that the abnormality occurred in the second processing step, making it possible to appropriately grasp the timing of the abnormality's occurrence.

[0106] Although each embodiment has been described above with reference to the drawings, it goes without saying that the present invention is not limited to these embodiments. It is clear to those skilled in the art that various modifications and alterations can be conceived within the scope of the claims, and these are also understood to naturally fall within the technical scope of the present invention. Furthermore, the components of the above embodiments may be combined arbitrarily without departing from the spirit of the invention.

[0107] The reference information images mentioned above are not limited to pre-registered information; for example, detection information may be used as reference information. For example, a detection image obtained by the camera 520 on the transport vehicle 5, which is determined to be free of abnormalities, may be adopted as the reference image. In other words, the registered reference information may be updated with the detection image which is determined to be free of abnormalities, thereby making the detection image the reference information. Furthermore, for example, in a processing step where it is generally unlikely that an abnormality will occur in the substrate 10, the substrate 10 after the previous processing step may be imaged without pre-registering reference information, and the image captured may be registered as the reference information.

[0108] Furthermore, in the above-described embodiment, the surface 10a of the substrate 10 was imaged and detection information of the substrate 10 was acquired when loading it into or unloading it from the transport vehicle 5. However, the system is not limited to loading or unloading; it may also be configured to image the substrate 10 and acquire detection information of the substrate 10 while the container 508 is being transported in the storage area 509. In that case, the substrate 10 is imaged by a camera (not shown) capable of close-up photography in the narrow area where the container 508 is stored in the storage area 509. In addition, the substrate 10 may also be imaged when placing it in or removing it from the container 508. In that case, for example, a line camera equipped with a line sensor having one or more rows of image sensors arranged in a row may be provided above the opening of the container 508, and the system may be configured to acquire detection information of the substrate 10 when loading or unloading it.

[0109] Furthermore, the first and second processing units are configured to detect abnormalities occurring between the processing of the first and second processing units, and the applicable devices are not limited to the tape application device 100a or the cutting device 100b. For example, it may be applied to various processing units such as a laser processing device that performs laser processing on the substrate 10, a grinding device that performs grinding on the substrate 10, a polishing device that performs polishing on the substrate 10, and other inspection devices.

[0110] Furthermore, although the above-described embodiment was configured to transport one substrate 10 by the transport vehicle 5, the transport of substrates 10 is not limited to one substrate, but may be transported in cassette units capable of holding multiple substrates. In that case, the transport unit may be, for example, a known OHT (Overhead Hoist Transport) or AGV (Automated Guided Vehicle) installed above the tape application device 100a or the cutting device 100b, and the cassette is transported by this to various devices such as the cutting device 100b that perform the next process.

[0111] Furthermore, in a configuration in which the substrates 10 are transported in cassette units, for example, the space where the mounting table A1 of the tape application device and the mounting table A2 of the cutting device 100b are provided may also be used as a space for placing the cassettes. In addition, as in the embodiment described above, the transport system 1 may have both a mounting table A1 (A2) and a space for placing the cassettes to transport a single substrate 10. For example, if there is a delay before the transported substrate 10 is subjected to a predetermined process, the substrate 10 may be temporarily placed in a cassette to prevent contamination from adhering to the substrate 10. In that case, for example, the cassette may be placed on the bottom and the mounting table A1 (A2) on the top, stacked vertically, the substrate 10 may be temporarily placed in the cassette, and then the substrate 10 may be placed in the container 508 using the mounting table A1 (A2).

[0112] Furthermore, the means for detecting the information of the substrate 10 described above may be a particle counter for detecting particles on the substrate 10, or a thickness detection sensor for measuring the thickness of the substrate 10, in addition to the camera 520. In this case, the reference information used as a reference will be a reference threshold (number) or a reference thickness.

[0113] Furthermore, if the means for detecting the information of the substrate 10 is a camera 520, imaging may be performed while illuminating the substrate 10 with oblique light focused at the UV wavelength of an LED light source. Focusing the light means generating a strong light in one direction, like a Polarion light, to make it easier to find small objects. This is because using UV wavelengths leads to the emission of fluorescent materials, and using an LED light source results in a narrow spectral output (short wavelength) of UV wavelengths, which makes the light more easily scattered. Short wavelengths are suitable for illuminating and reflecting light from tiny objects such as dust and foreign matter.

[0114] Furthermore, in the above-described embodiment, the processing method explained with reference to Figure 12 was configured such that the control unit 530 in the transport vehicle 5, the control unit 90 in the tape application device 100a, and the control unit 300 in the cutting device 100b cooperated to execute each step. However, the process may be executed by at least one control unit, or it may be controlled by another control unit or server that comprehensively controls the transport vehicle 5, the tape application device 100a, and the cutting device 100b.

[0115] Furthermore, in the above-described embodiment, an image of the substrate 10 in a normal state was explained as an example of reference information. However, the reference information may also include images of the substrate 10 in an abnormal state. In that case, the abnormality determination in the abnormality detection step S30 may be configured to determine that the substrate is normal if the reference information and the detection information are not similar, and to determine that an abnormality has occurred if they are similar.

[0116] Furthermore, in the above-described embodiment, an example was explained in which the initial routine is judged positively in the abnormality resolution determination step S80 of the processing method in Figure 12. However, if the similarity between the image of the reference information and the image of the detected information, which were judged to be abnormal in the abnormality detection step S30, is significantly lower than a predetermined value, such as being less than a second predetermined value, it may be determined that the abnormality cannot be resolved even if the abnormality resolution step S90 is executed, and the initial routine may be judged negatively.

[0117] Furthermore, the processing method described in the above-described embodiment can be realized by executing a pre-prepared control program on a computer. This control program is recorded on a computer-readable storage medium and executed when read from the storage medium. This control program may also be provided in the form of a non-transient storage medium such as flash memory, or it may be provided via a network such as the Internet. The computer that executes this control program may be included in the processing unit, or it may be included in an electronic device such as a smartphone, tablet terminal, or personal computer that can communicate with the processing unit, or it may be included in a server device that can communicate with these processing units and electronic devices.

[0118] This specification contains at least the following information. Note that the components etc. in parentheses indicate those corresponding to the embodiments described above, but are not limited thereto.

[0119] (1) A processing method for processing an object to be processed (substrate 10), A first processing step (first processing step S10) in which the object to be processed is processed by a first processing device (tape application device 100a), After the first processing step, a transport step (transport step S20) is performed in which the workpiece is transported outside the first processing apparatus by a transport unit (transport vehicle 5), The transport unit includes an abnormality detection step (abnormality detection step S30) for detecting an abnormality in the object to be processed. Processing method.

[0120] According to (1), since the transport unit performs abnormality detection, it is possible to estimate that abnormalities such as scratches or contamination have occurred on the workpiece during the process up to the first processing device before the transport unit transports the workpiece, or during transport. This makes it possible to identify abnormalities that occurred before the second processing step before the second processing step, and to prevent the workpiece with abnormalities from being processed in the second processing step. Furthermore, if an abnormality is detected after the second processing step, it can be determined that the abnormality occurred in the second processing step, making it possible to appropriately grasp the timing of the abnormality's occurrence.

[0121] (2) The processing method described in (1), The aforementioned abnormality detection step is: An abnormality determination is made by comparing the registered standard information of the object to be processed with the detection information obtained by the abnormality detection step. Processing method.

[0122] According to (2), by using the registered information of the object to be processed as reference information for a normal state, for example, and comparing it with that reference information to determine whether the object to be processed is abnormal, an accurate abnormality can be determined.

[0123] (3) The processing method described in (1) or (2), The aforementioned abnormality detection step is: When loading the object to be processed into the transport unit and / or when unloading the object to be processed from the transport unit, the abnormality is detected. Processing method.

[0124] According to (3), by detecting an anomaly at at least one of the timings of loading into the transport unit or unloading from the transport unit, for example, if it occurs during loading, it can be estimated that an anomaly occurred in the process up to before loading. If it occurs during unloading, it can be estimated that an anomaly occurred in the process from loading from the first processing unit until unloading. If an anomaly is detected at both loading and unloading, for example, if it is determined that there is no anomaly at loading, it can be estimated that an anomaly occurred in the process between loading and unloading.

[0125] (4) The processing method described in (1) or (2), The system further includes a second processing step (second processing step S40) in which the workpiece is processed by a second processing device (cutting device 100b), The second processing step, if no abnormality is detected in the abnormality detection step, performs processing on the workpiece using the second processing device. Processing method.

[0126] According to (4), if there is no abnormality in the material to be processed, processing by the second processing device can be carried out appropriately.

[0127] (5) The processing method described in (4), The system further includes a transmission step (transmission step S60) for transmitting the detection information obtained by the abnormality detection step to the second processing device, The transmission step transmits the detection information when the anomaly is detected in the anomaly detection step. Processing method.

[0128] According to (5), if there is an abnormality in the object to be processed, detection information is transmitted before processing in the second processing unit is executed, thereby preventing or suppressing the execution of processing in the second processing unit while the abnormality is present.

[0129] (6) The processing method described in (1) or (2), The aforementioned transport step is, The objects to be processed are transported by transporting cassettes containing one or more of the objects to be processed. Processing method.

[0130] According to (6), in a transport unit that transports multiple items to be processed in cassette units, it becomes possible to detect abnormalities in the items to be processed during transport.

[0131] (7) The processing method described in (1) or (2), The aforementioned transport unit is The transport vehicle (transport vehicle 5) has a support part (container 508) for supporting the object to be processed, The aforementioned transport step is, In the transport path (transport path 2) provided above the first processing apparatus, the transport vehicle transports the object to be processed. Processing method.

[0132] According to (7), by enabling the transport vehicle to transport the workpieces through a transport path provided above the first processing device, an abnormality in the workpieces can be detected during transport in a transport unit that transports workpieces between processing devices using a transport vehicle.

[0133] (8) The processing method described in (2), The system further includes a notification step (notification step S70) for notifying the occurrence of an abnormality in the processed object, The notification step notifies the occurrence of an abnormality in the workpiece if it is determined that there is an abnormality in the workpiece based on the abnormality determination in the abnormality detection step. Processing method.

[0134] According to (8), if there is an abnormality in the material to be processed, notification of the abnormality can be provided, thereby preventing operators from continuing to process the material with the second processing device while it is in an abnormal state.

[0135] (9) The processing method described in (2), The system further includes an abnormality resolution step (abnormality resolution step S90) for resolving the abnormality of the workpiece, The abnormality resolution step resolves the abnormality in the workpiece when it is determined that there is an abnormality in the workpiece based on the abnormality determination in the abnormality detection step. Processing method.

[0136] According to (9), if there is an abnormality in the object to be processed, the abnormality can be resolved, and then the processing by the second processing device can be carried out after the abnormality has been resolved.

[0137] (10) The processing method described in (9), A second processing step (second processing step S40) in which the workpiece is processed in the second processing apparatus, The process further includes a cleaning step (cleaning step S50) in which the workpiece is cleaned by a cleaning unit (cleaning unit 260) after the second processing step, The abnormality resolution step involves, if the abnormality determination in the abnormality detection step determines that there is an abnormality in the object to be processed, washing the object to be processed with the washing unit. Processing method.

[0138] According to (10), by using the cleaning unit for the cleaning step in the abnormality resolution step, a separate mechanism for resolving abnormalities becomes unnecessary, meaning that the abnormality resolution step can be performed using the existing configuration without creating a new configuration.

[0139] (11) The processing method described in (10), The cleaning conditions in the abnormality resolution step have a stronger cleaning power than the cleaning conditions in the cleaning step. Processing method.

[0140] According to (11), by changing the cleaning conditions between the abnormality resolution step and the normal cleaning step, cleaning can be performed in a manner that suits the purpose. [Explanation of Symbols]

[0141] 2. Conveyor path 5. Transport vehicle (transport unit) 10. Substrate (object to be processed) 100a Tape application device (first processing device) 100b Cutting device (second processing unit) 260 Washing Units 508 Container (support part) S10 First processing step S20 Conveying Step S30 Anomaly detection step S40 Second processing step S50 Cleaning Step S60 Transmission Step S70 Hochi Step S90 Anomaly Resolution Steps

Claims

1. A processing method for processing an object to be processed, A first processing step involves processing the object to be processed with a first processing apparatus, After the first processing step, a transport step is performed in which the workpiece is transported outside the first processing apparatus by a transport unit, The transport unit includes an abnormality detection step for detecting an abnormality in the object to be processed, Processing method.

2. The processing method according to claim 1, The aforementioned abnormality detection step is: An abnormality determination is made by comparing the registered standard information of the object to be processed with the detection information obtained by the abnormality detection step. Processing method.

3. A processing method according to claim 1 or 2, The aforementioned abnormality detection step is: When the object to be processed is loaded into the transport unit and / or when the object to be processed is unloaded from the transport unit, the abnormality is detected. Processing method.

4. A processing method according to claim 1 or 2, The process further comprises a second processing step of processing the workpiece in a second processing apparatus, The second processing step, if no abnormality is detected in the abnormality detection step, performs processing on the workpiece using the second processing device. Processing method.

5. The processing method according to claim 4, The system further includes a transmission step of transmitting the detection information obtained by the anomaly detection step to the second processing unit. The transmission step transmits the detection information when the anomaly is detected in the anomaly detection step. Processing method.

6. A processing method according to claim 1 or 2, The aforementioned transport step is, The objects to be processed are transported by transporting cassettes containing one or more of the objects to be processed. Processing method.

7. A processing method according to claim 1 or 2, The aforementioned transport unit is A transport vehicle having a support part for supporting the object to be processed, The aforementioned transport step is, In a transport path provided above the first processing apparatus, the transport vehicle transports the object to be processed. Processing method.

8. The processing method according to claim 2, The system further includes a notification step for notifying the occurrence of an abnormality in the processed object, The notification step is to notify the occurrence of an abnormality in the workpiece if it is determined that there is an abnormality in the workpiece based on the abnormality determination in the abnormality detection step. Processing method.

9. The processing method according to claim 2, The process further includes an abnormality resolution step for resolving the abnormality of the workpiece, The abnormality resolution step resolves the abnormality in the workpiece when it is determined that there is an abnormality in the workpiece based on the abnormality determination in the abnormality detection step. Processing method.

10. The processing method according to claim 9, A second processing step involves processing the workpiece in a second processing apparatus, The process further comprises a washing step in which the workpiece is washed in a washing unit after the second processing step, The abnormality resolution step involves, if the abnormality determination in the abnormality detection step determines that there is an abnormality in the object to be processed, washing the object to be processed with the washing unit. Processing method.

11. The processing method according to claim 10, The cleaning conditions in the abnormality resolution step have a stronger cleaning power than the cleaning conditions in the cleaning step. Processing method.

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