Workpiece holding device, processing device, and method for manufacturing articles

Abstract

To reduce misalignment of workpieces when receiving them. [Solution] A workpiece holding device comprising a workpiece holding section for holding a workpiece and a support member that moves up and down relative to the workpiece holding section, wherein the support member includes a retractable pad having an open end that contacts the workpiece and a pad support section that supports the pad, and the pad support section includes a first flow path and a second flow path connecting the internal space and the external space of the pad, and a check valve disposed in the first flow path so as to allow air to flow from the internal space to the external space through the first flow path and to prevent air from flowing from the external space to the internal space through the first flow path, wherein the kinetic energy of the support member when the support member rises from a state in which the pad is retracted is greater than the elastic energy of the pad in a state in which it is retracted.

Description

Technical Field

[0001] The present invention relates to a work holding device, a processing device, and a method for manufacturing an article.

Background Art

[0002] A processing device may be configured to receive a work conveyed by a conveying device by a plurality of lift pins. For example, the processing device may be configured to receive a work supported by a hand of the conveying device by a plurality of lift pins. However, the work may be displaced at the moment when the plurality of lift pins contact the work. If the speed of raising the plurality of lift pins is reduced so as not to cause such displacement, it may lead to a decrease in productivity. Although Patent Document 1 describes a configuration in which a wafer is held by suction, incorporating such a configuration into a processing device requires a mechanism for controlling suction, and the overall configuration of the processing device may become complicated.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to provide an advantageous technique for reducing displacement of a work when receiving the work.

Means for Solving the Problems

[0005] To achieve the above objective, a workpiece holding device as one aspect of the present invention comprises a workpiece holding section for holding a workpiece and a support member that moves up and down relative to the workpiece holding section, wherein the support member includes a retractable pad having an open end that contacts the workpiece and a pad support section that supports the pad, and the pad support section includes a first flow path and a second flow path connecting the internal space and the external space of the pad, and a check valve disposed in the first flow path so as to allow air to flow from the internal space to the external space through the first flow path and to prevent air from flowing from the external space to the internal space through the first flow path, characterized in that the kinetic energy of the support member when the support member rises from a state in which the pad is retracted is greater than the elastic energy of the pad in a state in which it is retracted. [Effects of the Invention]

[0006] According to the present invention, it is possible to provide a workpiece holding device that is advantageous in reducing misalignment of the workpiece when receiving it. [Brief explanation of the drawing]

[0007] [Figure 1] A schematic cross-sectional view showing an example of the configuration of a workpiece holding device according to one embodiment. [Figure 2] A schematic plan view showing an example of the configuration of a workpiece holding device according to one embodiment. [Figure 3] A schematic cross-sectional view showing an example of the configuration of the support member of a workpiece holding device. [Figure 4] A plan view showing an example of the configuration of a transport hand in a transport mechanism. [Figure 5] A diagram illustrating the process by which a workpiece holding device receives a workpiece from a transport mechanism and holds it in place by the workpiece holding section. [Figure 6] A diagram illustrating the process by which a workpiece holding device receives a workpiece from a transport mechanism and holds it in place by the workpiece holding section. [Figure 7]A diagram illustrating the process by which a workpiece holding device receives a workpiece from a transport mechanism and holds it in place by the workpiece holding section. [Figure 8] A diagram illustrating the process by which a workpiece holding device receives a workpiece from a transport mechanism and holds it in place by the workpiece holding section. [Figure 9] A diagram illustrating the process by which a workpiece holding device receives a workpiece from a transport mechanism and holds it in place by the workpiece holding section. [Figure 10] A diagram illustrating the process by which a workpiece holding device receives a workpiece from a transport mechanism and holds it in place by the workpiece holding section. [Figure 11] A diagram illustrating the process by which a workpiece holding device receives a workpiece from a transport mechanism and holds it in place by the workpiece holding section. [Figure 12] This figure shows an example of the configuration of an exposure apparatus as an example of a processing apparatus incorporating a workpiece holding device. [Modes for carrying out the invention]

[0008] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In each drawing, the same reference numeral is used for identical components, and redundant descriptions are omitted.

[0009] <First Embodiment> The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0010] In the attached drawings and the following description, directions in three-dimensional space are described according to the XYZ coordinate system. In the XYZ coordinate system, the X, Y, and Z axes are mutually orthogonal. The direction parallel to the X axis can be expressed as the X direction, the direction parallel to the Y axis as the Y direction, and the direction parallel to the Z axis as the Z direction. The Z axis is typically parallel to the vertical.

[0011] Figure 1 is a schematic cross-sectional view showing the configuration of a workpiece holding device 100 according to one embodiment. Figure 2 is a schematic plan view showing the configuration of the workpiece holding device 100. Figure 4 is a plan view showing the configuration of the transport hand of the transport mechanism 7. The workpiece holding device 100 can be incorporated into a device that processes a workpiece W. The workpiece holding device 100 can be configured as a device that holds a workpiece W such as a substrate. The workpiece holding device 100 may include a workpiece holding part (chuck) 6 that holds the workpiece W, and one or more support members SM that move up and down relative to the workpiece holding part 6. Typically, the workpiece holding device 100 may include multiple support members SM, but it may also include a single support member SM. In the latter case, one or more other members such as support pins may be used together with the support member SM. Each support member SM may be provided at the tip of a lifting pin 5. The workpiece holding device 100 may further include a lifting mechanism 8 that moves the multiple lifting pins 5 up and down. The workpiece holding device 100 may be controlled by a control unit CNT. The control unit CNT may be incorporated into a control unit provided in a processing apparatus equipped with a workpiece holding device 100. The control unit CNT may consist of, for example, a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), a general-purpose or dedicated computer with a program installed, or a combination of all or part of these.

[0012] The workpiece W is conveyed by the conveying mechanism 7 to the space above the workpiece holding device 100 and can be received from the conveying mechanism 7 by a plurality of lifting pins 5 (a plurality of support members SM provided at the tips of each of them). After the conveying mechanism 7 retreats, the lifting mechanism 8 lowers the plurality of lifting pins 5, whereby the workpiece W is transferred from the plurality of lifting pins 5 (the plurality of support members SM provided at the tips of each of them) to the workpiece holding portion 6, and the workpiece W can be held by the workpiece holding portion 6. Typically, the workpiece W can be subjected to a predetermined process while being held by the workpiece holding portion 6. The predetermined process can be, for example, any one of a process of transferring a pattern to the workpiece W, a process of applying a liquid to the workpiece W, a process of forming a film on the workpiece W, an annealing process for the workpiece W, a process of inspecting the workpiece W, etc., but other processes may also be possible. When the workpiece W is conveyed from the workpiece holding portion 6 to another device or position, the workpiece W is supported by the plurality of lifting pins 5 (the plurality of support members SM provided at the tips of each of them) by the lifting mechanism 8 raising the plurality of lifting pins 5 and can be passed to the conveying mechanism 7.

[0013] FIG. 3 is a cross-sectional view schematically showing the configuration of the support member SM. The support member SM may include a collapsible pad 1 having an open end OP that abuts against the workpiece W, and a pad support portion 11 that supports the pad 1. The pad 1 may have, for example, a bellows shape, but other expansion and contraction mechanisms may also be possible. The pad support portion 11 may include a first flow path FP1 and a second flow path FP2 that connect the internal space PIS and the external space OS of the pad 1. Further, the pad support portion 11 may include a check valve 2 disposed in the first flow path FP1. The check valve 2 is disposed in the first flow path FP1 so as to allow air to flow from the internal space PIS to the external space OS through the first flow path FP1 and prevent air from flowing from the external space OS to the internal space PIS through the first flow path FP1. The pad support portion 11 may further include an orifice 3 disposed in the second flow path FP2. The orifice 3 acts to limit the flow rate of the air flowing through the second flow path FP2. In other words, the orifice 3 can limit the conductance of the second flow path FP2. The function of the orifice 3 may be provided by adjusting the cross-sectional area and length of the second flow path FP2.

[0014] The support member SM may further include a connection part CP that connects the first flow path FP1 and the second flow path FP2, and a third flow path FP3 that connects the connection part CP and the internal space PIS of the pad 1. The connection part CP may be understood, for example, as a part that connects the orifice 3 and the check valve 2. As illustrated in FIG. 3, the central axis AX1 of the first flow path FP1 and the central axis AX2 of the second flow path FP2 may coincide with each other. Also, as illustrated in FIG. 3, the central axis of the third flow path FP3 may be perpendicular to the straight line including the central axis AX1 of the first flow path FP1 and the central axis AX2 of the second flow path FP2.

[0015] Hereinafter, the operation of the work holding device 100 will be exemplarily described through the description of the operation in which the work holding device 100 receives the work W from the transfer mechanism 7 and holds it by the work holding part 6 while referring to FIGS. 5, 6, 7, 8, 9, 10, and 11. Note that FIGS. 5(a), 6(a), 7(a), 8(a), 9(a), 10(a), and 11(a) schematically show the state of the work holding device 100. Also, FIGS. 5(b), 6(b), 7(b), 8(b), 9(b), 10(b), and 11(b) schematically show the state of the support member SM. Further, in FIGS. 5(b), 6(b), 7(b), 8(b), 9(b), 10(b), and 11(b), the height H of the lower surface of the work W when the work W is transferred to the work holding device 100 by the transfer mechanism 7 is shown for reference.

[0016] First, as schematically shown in FIG. 5, with the plurality of support members SM not protruding from the upper surface of the work holding part 6, the work W is transferred by the transfer mechanism 7 to the space above the work holding device 100.

[0017] Next, as schematically shown in Figures 6, 7, 8, and 9, the lifting mechanism 8 raises the lifting pin 5, thereby raising the multiple support members SM. As a result, first, as schematically shown in Figure 6, the pads 1 of the multiple support members SM come into contact with the lower surface of the workpiece W. Next, as schematically shown in Figure 7, the pin 5 continues to rise while the open end OP of the pad 1 is closed by the workpiece W, but the workpiece W tries to stay in place due to inertia, causing the pad 1 to contract and the volume of the internal space PIS to decrease. At this time, the air inside PIS is discharged through FP1 and FP2. As schematically shown in Figure 8, once the pad 1 has fully contracted, the workpiece W rises. As schematically shown in Figure 9, the workpiece W moves upward while the open end OP of the pad 1 is closed by the workpiece W. The lifting mechanism 8 can stop the raising of the multiple support members SM after the pad 1 has come into contact with the workpiece W. However, even if the rise of the multiple support members SM is stopped, the workpiece W may rise slightly further due to inertia. When the open end OP of the pad 1 is closed by the workpiece W, and the rise of the lifting pin 5 by the lifting mechanism 8 is stopped, and the workpiece W moves upward due to inertia, the pad 1 may stretch and the volume of the internal space PIS of the pad 1 may increase. As a result, the internal space PIS of the pad 1 becomes negative pressure and an attractive force may act on the workpiece W. In this state, since the internal space PIS is under negative pressure, the check valve 2 is closed, and the inflow of air from the external space OS to the internal space PIS is blocked.

[0018] Furthermore, the flow resistance of the second flow path FP2 (orifice 3) may be adjusted or configured so that the internal space PIS of pad 1 becomes negative pressure as the internal space PIS of pad 1 increases while the workpiece W moves upward. In other words, the flow resistance of the second flow path FP2 (orifice 3) may be adjusted so that the decrease in pressure in the internal space PIS due to the increase in the internal space PIS is greater than the increase in air flowing into the internal space PIS through the second flow path FP2. To facilitate such adjustment, a variable orifice may be used as orifice 3 to release the internal vacuum.

[0019] To summarize, the lifting mechanism 8 raises the support member SM, causing the pad 1 to come into contact with the workpiece W. The open end OP of the pad 1 is closed by the workpiece W as the workpiece W moves upward. As the workpiece W moves upward while the open end OP of the pad 1 is closed by the workpiece W, the volume of the internal space PIS of the pad 1 increases. This creates negative pressure in the internal space PIS, and an attractive force acts on the workpiece W. Therefore, the separation of the workpiece W from the pad 1 is suppressed.

[0020] Next, as schematically shown in Figure 10, the transport mechanism 7 is retracted. Then, the lifting mechanism 8 lowers the multiple lifting pins 5, causing the multiple support members SM to descend. The workpiece W is then passed from the multiple support members SM to the workpiece holding section 6, and the pad 1 separates from the workpiece W. At this time, the negative pressure in the PIS inside the SM returns to atmospheric pressure due to the inflow of air from FP2, so the SM does not pull the workpiece W into the hole in the workpiece holding section 6, and the workpiece W is held by the workpiece holding section 6. In other words, the lifting mechanism 8 raises the multiple support members SM, causing the pad 1 to come into contact with the workpiece W, and the workpiece W is supported by the pad 1. After that, the lifting mechanism 8 lowers the support members SM, and the workpiece W is held by the workpiece holding section 6. Typically, the workpiece W can be subjected to predetermined processing while being held by the workpiece holding section 6.

[0021] Once processing of the workpiece W is complete, the lifting mechanism 8 raises the multiple lifting pins 5. As a result, the workpiece W is supported by the multiple lifting pins 5 (and the multiple support members SM provided at the tip of each pin), and the workpiece W can then be passed to the conveying mechanism 7.

[0022] Alternatively, instead of the lifting mechanism 8 raising and lowering multiple lifting pins 5 (and multiple support members SM), a lifting mechanism (not shown) may raise and lower the workpiece holding section 6. Furthermore, if the transport mechanism 7 or the workpiece holding section 6 is driven up and down instead of the lifting pins 5 being driven up and down, the lifting pins 5 do not need to be driven.

[0023] Next, preferred conditions for the pad 1 in this embodiment will be described. The support member SM has the configuration shown in Figure 3 as described above. The negative pressure P (Pa) generated by the volume change of the pad 1 is given by the contraction / expansion amount s (mm) of the pad 1 and the effective cross-sectional area A (mm) of the pad 1. 2 ), Fixed part volume V (mm 3 ), when the atmospheric pressure is p (Pa), it can be calculated from the following equation (1).

[0024]

number

[0025] Furthermore, while the contracted state of pad 1 is as shown in Figure 8(b), the amount of contraction of pad 1 needs to be adjusted to the design value. That is, the upward speed v (mm / s) of the lifting pin 5. 2 It is necessary to set the elastic energy of pad 1 during contraction, which is calculated from the contraction amount x (mm) of pad 1 and the spring constant k (N / mm) of pad 1, to be small compared to the kinetic energy calculated from the mass m (kg) of the workpiece. This relationship can be expressed as shown in equation (2) below.

[0026]

number

[0027] Equation (2) is a conditional equation that shows that the kinetic energy in the lifting pin 5 when it rises from a state where the pad 1 is contracted is greater than the elastic energy of the pad 1 when it is contracted. Furthermore, by rearranging equation (2) for the spring constant k of the pad 1, it can be expressed as shown in equation (3) below.

[0028]

number

[0029] At this time, the air in the enclosed space generated when the workpiece W and pad 1 come into contact is discharged from the check valve 2 and the orifice 3.

[0030] After the workpiece W and pad 1 are attracted to each other, the lifting pin 5 reaches its upper end and stops, as shown in Figure 10(b). However, as the workpiece W rises due to inertia, pad 1 extends. As the volume of the closed space created when the workpiece W and pad 1 come into contact increases, air flows into the interior from the check valve 2 and orifice 3. At this time, the rate of change of pad 1's volume v(mm) is greater than the flow rate of air entering from the check valve 2 and orifice 3. 3 Because the time ( / s) is faster, negative pressure is generated in the closed space and the check valve 2 closes. The negative pressure generated in the closed space attracts the workpiece W, preventing the workpiece W from shifting position. After attracting the workpiece W, the workpiece W separates from the transport mechanism 7.

[0031] When the transport mechanism 7 is retracted, air flows into the closed space from the orifice 3 during the waiting time for retraction, and the negative pressure in the closed space returns to atmospheric pressure. Also, because the closed space returns to atmospheric pressure, the check valve 2 opens.

[0032] When the lifting pin 5 descends and the workpiece W is mounted on the workpiece holding section 6, that is, when the workpiece W and pad 1 separate, the pressure in the enclosed space returns to atmospheric pressure, but a volume change occurs and a negative pressure is generated as the deformation of pad 1 due to the mass of workpiece W is released. Therefore, in order to prevent a pulling force from being applied when mounting workpiece W on the workpiece holding section 6, the volume change rate of pad 1 when workpiece W detaches from pad 1 must be v(mm 3 Q(mm) is the inflow flow rate from orifice 3. 3 It is preferable that it be less than / s. This relationship can be expressed as shown in equation (4) below.

[0033]

number

[0034] Here, the volume change rate v of pad 1 can be determined from the effective cross-sectional area A of pad 1, the deformation amount of pad 1 due to the mass of workpiece W x2 (mm), and the time t (s) until workpiece W separates from pad 1. It can be expressed as shown in equation (5) below.

[0035]

number

[0036] Furthermore, substituting equation (5) into equation (4) yields equation (6) below.

[0037]

number

[0038] Here, the mass of the workpiece W is m (kg), and the acceleration due to gravity is g (mm / s²). 2 ), and with the spring constant k (N / mm) of pad 1, the following equation (7) holds true from Hooke's Law.

[0039]

number

[0040] Substituting equation (7) into equation (6) and rearranging it for the spring constant k of pad 1, we obtain the following equations (8) and (9).

[0041]

number

[0042]

number

[0043] By satisfying equation (9), no pulling force is applied to the workpiece W when it separates from the pad 1. In this way, the material hardness, volume, and orifice diameter of the pad 1 can be determined according to conditions such as the mass of the workpiece W and the lifting speed and number of the lifting pins 5, and the pad 1 can be designed to achieve an optimal volume change.

[0044] Furthermore, the volume of the enclosed space and the opening of orifice 3 are adjusted to control the adsorption time. Regarding orifice 3, a fixed orifice is preferable due to the design space, but the adsorption time may also be adjusted by using a variable orifice.

[0045] Based on the above, it is preferable that the pad 1 is made of a material with a spring constant k that satisfies equation (2). By satisfying equation (2), the pad 1 can hold the workpiece W without separating from it when the lifting pin 5 rises, thereby reducing displacement of the workpiece W. Furthermore, it is preferable that the pad 1 is made of a material with a spring constant k that satisfies equation (9). By satisfying equation (9), the force that pulls the workpiece W into the workpiece holding part 6 when the workpiece W is mounted on the workpiece holding part 6, that is, when the workpiece W separates from the pad 1, can be reduced. This reduces, for example, exposure defects caused by wrinkles in the workpiece W. This embodiment can provide an advantageous technology for holding the workpiece W by satisfying at least one of equations (2) and (9).

[0046] Figure 12 illustrates the configuration of an exposure apparatus EXP as an example of a processing apparatus incorporating a workpiece holding device 100. The exposure apparatus EXP may include a projection optical system PO that projects the pattern of a master plate R onto a workpiece W so that the workpiece W held by the workpiece holding device 100 is exposed. The exposure apparatus EXP may also include a master plate holding mechanism RS that holds the master plate R, and an illumination optical system IL that illuminates the master plate R. The exposure apparatus EXP may also include a drive mechanism WDM that drives the workpiece holding device 100.

[0047] The processing apparatus may be configured to perform other processes. For example, the processing apparatus may be a coating apparatus for applying a liquid to a workpiece, a developing apparatus for developing a workpiece onto which a pattern has been transferred by an exposure apparatus, a film forming apparatus for forming a film on a workpiece, an annealing apparatus for performing an annealing process on a workpiece, or an inspection apparatus for inspecting a workpiece. The film forming apparatus may be, for example, an imprint apparatus, a CVD apparatus, a sputtering apparatus, a planarizing apparatus, or a vapor deposition apparatus (for example, a vapor deposition apparatus for manufacturing OLEDs).

[0048] A method for manufacturing an article using the above-described processing apparatus may include a first processing step of processing a workpiece with the processing apparatus, and a second processing step of further processing the workpiece after the first processing step to obtain an article. For example, if the processing apparatus is configured as an exposure apparatus, the method for manufacturing an article may include an exposure step of exposing a workpiece with the exposure apparatus, a developing step of developing the workpiece exposed in the exposure step, and a processing step of processing the workpiece after the developing step to obtain an article.

[0049] The disclosures herein include at least the following workpiece holding devices, processing devices, and methods for manufacturing articles.

[0050] (Item 1) A workpiece holding device comprising a workpiece holding section for holding a workpiece, and a support member that moves up and down relative to the workpiece holding section, The support member includes a retractable pad having an open end that contacts the workpiece, and a pad support portion that supports the pad. The aforementioned pad support portion is A first channel and a second channel connecting the internal space and external space of the pad, A check valve is positioned in the first channel to allow air to flow from the internal space to the external space through the first channel and to prevent air from flowing from the external space to the internal space through the first channel, including, A workpiece holding device characterized in that the kinetic energy in the support member when the support member rises from a state in which the pad is contracted is greater than the elastic energy in the state in which the pad is contracted.

[0051] (Item 2) The workpiece holding device according to item 1, characterized in that the pad support portion further includes an orifice arranged in the second flow path.

[0052] (Item 3) The workpiece holding device according to item 2, characterized in that the volume change rate at which the deformation of the pad is released due to the mass of the workpiece is smaller than the flow rate of air entering from the orifice.

[0053] (Item 4) The workpiece holding device according to any one of items 1 to 3, characterized in that the pad has a bellows shape.

[0054] (Item 5) The system further includes a lifting mechanism for raising and lowering the support member, As the lifting mechanism raises the support member, the pad comes into contact with the workpiece, and the workpiece moves upward while the open end of the pad is closed by the workpiece. As the workpiece moves upward while the open end of the pad is closed by the workpiece, the volume of the internal space increases, causing a negative pressure in the internal space and resulting in an attractive force acting on the workpiece. A workpiece holding device according to any one of items 1 to 4, characterized by the above.

[0055] (Item 6) The suction force acting on the workpiece prevents the workpiece from separating from the pad. A workpiece holding device as described in item 5, characterized by the features described herein.

[0056] (Item 7) The lifting mechanism stops the support member from rising after the pad comes into contact with the workpiece. A workpiece holding device according to item 5 or 6, characterized by the features described herein.

[0057] (Item 8) The lifting mechanism raises the support member, causing the pad to come into contact with the workpiece, thereby supporting the workpiece with the pad. Subsequently, the lifting mechanism lowers the support member, causing the workpiece to be held by the workpiece holding portion. A workpiece holding device according to any one of items 5 to 7, characterized by the above.

[0058] (Item 9) The support member further includes a connecting portion that connects the first flow path and the second flow path, and a third flow path that connects the connecting portion and the internal space of the pad. A workpiece holding device according to any one of items 1 to 8, characterized by the above.

[0059] (Item 10) The central axis of the first channel and the central axis of the second channel coincide. A workpiece holding device as described in item 9, characterized by the features described herein.

[0060] (Item 11) The central axis of the third channel is perpendicular to the line containing the central axis of the first channel and the central axis of the second channel. A workpiece holding device according to item 10, characterized by the features described herein.

[0061] (Item 12) A processing apparatus for processing workpieces, A processing apparatus characterized by comprising a workpiece holding device according to any one of items 1 to 11, which is arranged to hold the aforementioned workpiece.

[0062] (Item 13) The system further comprises a projection optical system that projects the pattern of a master plate onto the workpiece so that the workpiece held by the workpiece holding device is exposed. The apparatus according to item 12, characterized in that

[0063] (Item 14) A first processing step in which the workpiece is processed by the processing apparatus described in item 12, A second processing step involves further processing the workpiece that has undergone the first processing step to obtain an article, A method for manufacturing an article, characterized by including the following:

[0064] (Item 15) An exposure step in which the workpiece is exposed using the processing apparatus described in item 13, A developing step for developing the workpiece exposed in the exposure step, A processing step to obtain an article by processing the workpiece that has undergone the development step, A method for manufacturing an article, characterized by including the following: [Explanation of symbols]

[0065] 1 pad 2. Check valve 6. Workpiece holding section 11 Pad support section 100 Workpiece Holding Device FP1 First channel FP2 Second channel OP open end OS external space PIS interior space SM support member Double job

Claims

1. A workpiece holding device comprising a workpiece holding section for holding a workpiece, and a support member that moves up and down relative to the workpiece holding section, The support member includes a retractable pad having an open end that contacts the workpiece, and a pad support portion that supports the pad. The aforementioned pad support portion is A first channel and a second channel connecting the internal space and external space of the pad, A check valve is positioned in the first channel such as to allow air to flow from the internal space to the external space through the first channel and to prevent air from flowing from the external space to the internal space through the first channel, including, A workpiece holding device characterized in that the kinetic energy in the support member when the support member rises from a state in which the pad is contracted is greater than the elastic energy in the state in which the pad is contracted.

2. The workpiece holding device according to claim 1, characterized in that the pad support portion further includes an orifice arranged in the second flow path.

3. The workpiece holding device according to claim 2, characterized in that the volume change rate at which the deformation of the pad is released due to the mass of the workpiece is smaller than the air inflow rate from the orifice.

4. The workpiece holding device according to claim 1, characterized in that the pad has a bellows shape.

5. The system further includes a lifting mechanism for raising and lowering the support member, As the lifting mechanism raises the support member, the pad comes into contact with the workpiece, and the workpiece moves upward while the open end of the pad is closed by the workpiece. As the workpiece moves upward while the open end of the pad is closed by the workpiece, the volume of the internal space increases, causing a negative pressure in the internal space and resulting in an attractive force acting on the workpiece. The workpiece holding device according to feature 1.

6. The suction force acting on the workpiece prevents the workpiece from separating from the pad. The workpiece holding device according to feature 5.

7. The lifting mechanism stops the support member from rising after the pad comes into contact with the workpiece. The workpiece holding device according to feature 5.

8. The lifting mechanism raises the support member, causing the pad to come into contact with the workpiece, thereby supporting the workpiece with the pad. Subsequently, the lifting mechanism lowers the support member, causing the workpiece to be held by the workpiece holding portion. The workpiece holding device according to feature 5.

9. The support member further includes a connecting portion that connects the first flow path and the second flow path, and a third flow path that connects the connecting portion and the internal space of the pad. The workpiece holding device according to feature 1.

10. The central axis of the first channel and the central axis of the second channel coincide. The workpiece holding device according to feature 9.

11. The central axis of the third channel is perpendicular to the line containing the central axis of the first channel and the central axis of the second channel. The workpiece holding device according to feature 10.

12. A processing apparatus for processing workpieces, A processing apparatus characterized by comprising a workpiece holding device according to any one of claims 1 to 11, which is arranged to hold the workpiece.

13. The system further comprises a projection optical system that projects the pattern of a master plate onto the workpiece so that the workpiece held by the workpiece holding device is exposed. The apparatus according to feature 12.

14. A first processing step of processing a workpiece using the processing apparatus described in claim 12, A second processing step involves further processing the workpiece that has undergone the first processing step to obtain an article, A method for manufacturing an article, characterized by including the following:

15. An exposure step of exposing a workpiece using the processing apparatus described in claim 13, A developing step for developing the workpiece exposed in the exposure step, A processing step to obtain an article by processing the workpiece that has undergone the development step, A method for manufacturing an article, characterized by including the following:

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