resin composition

JP2026094041APending Publication Date: 2026-06-09AJINOMOTO CO INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
AJINOMOTO CO INC
Filing Date
2025-11-12
Publication Date
2026-06-09

AI Technical Summary

Benefits of technology

【0008】 本発明によれば、誘電特性、伸び率、及びHAST試験前後の密着性に優れる硬化物を形成できる樹脂組成物;当該樹脂組成物を含む樹脂シート;当該樹脂組成物の硬化物;当該樹脂組成物の硬化物を含む回路基板;並びに、前記回路基板を含む半導体装置;を提供できる。

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Abstract

To provide resin compositions and the like that can form cured products with excellent dielectric properties, elongation, and adhesion before and after HAST testing. [Solution] A resin composition comprising (A) a polyimide resin containing either a dimer amine skeleton or a trimer triamine skeleton, and a fluorene skeleton, and (B) a thermosetting resin.
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Claims

1. (A) A polyimide resin containing either a dimer amine skeleton or a trimer triamine skeleton, and a fluorene skeleton, and (B) A resin composition comprising a thermosetting resin.

2. The resin composition according to claim 1, wherein the terminal end of component (A) has a maleimide group.

3. The resin composition according to claim 1, wherein component (A) further comprises an acid anhydride skeleton.

4. The resin composition according to claim 3, wherein the acid anhydride skeleton includes a skeleton derived from a bisphenol A type acid dianhydride.

5. The resin composition according to claim 1, wherein component (B) has a functional group which is an epoxy group, a maleimide group, or a styryl group.

6. The resin composition according to claim 1, wherein the content of component (A) is 0.01% by mass or more and 10% by mass or less, when the nonvolatile components in the resin composition are considered to be 100% by mass.

7. The resin composition according to claim 1, wherein the content of component (B) is 5% by mass or more and 40% by mass or less, when the nonvolatile components in the resin composition are taken as 100% by mass.

8. Furthermore, the resin composition according to claim 1, further comprising (C) an inorganic filler.

9. The resin composition according to claim 8, wherein the content of component (C) is 50% by mass or more and 90% by mass or less, when the nonvolatile components in the resin composition are taken as 100% by mass.

10. The resin composition according to claim 1, wherein the mass ratio of component (B) to component (A) (component (B) / component (A)) is 5 or more.

11. A resin sheet comprising a support and a resin composition layer provided on the support, the layer comprising the resin composition according to any one of claims 1 to 10.

12. A circuit board comprising an insulating layer formed from a cured product of a resin composition according to any one of claims 1 to 10.

13. A semiconductor device comprising the circuit board described in claim 12.