A method of processing glass by alkaline etching.

Abstract

We provide a fast, low-cost, and virtually waterless alkaline etching process for processing or structuring glass. [Solution] A method for processing glass, comprising providing a glass element, removing glass material from the glass element, performing the removal by etching, and using an alkaline etching medium in an organic solvent during etching.

Claims

1. A method for processing glass, A glass element (1) is provided, a glass material is removed from the glass element (1), the removal is performed by etching, and an alkaline etching medium (4) in an organic solvent is used during the etching. method.

2. The glass material is selectively or locally removed from the glass element (1), or uniformly and isotropically removed from the entire surface of the glass element (1). The method according to claim 1.

3. The water content of the alkaline etching medium (4) is less than 5% by weight (wt%), preferably less than 1% by weight (wt%). The method according to claim 1 or 2.

4. The organic solvent includes an alcohol, preferably a polyhydric alcohol, particularly a diol (dialcohol), and more preferably ethylene glycol. The method according to any one of claims 1 to 3.

5. The aforementioned organic solvent is a mixture of organic compounds, preferably a mixture of polyhydric alcohols. The method according to any one of claims 1 to 4.

6. The alkaline etching medium (4) is potassium hydroxide (KOH) or sodium hydroxide (NaOH). The method according to any one of claims 1 to 5.

7. The KOH in the organic solvent has a concentration of more than 4 mol / l, preferably more than 5 mol / l, and particularly preferably more than 6 mol / l, provided that the concentration is less than 30 mol / l. The method according to claim 6.

8. The etching is performed at a temperature above 130°C, preferably above 150°C, and particularly preferably above 170°C. The method according to any one of claims 1 to 7.

9. The glass element (1) has at least one of the following features, namely - The glass element (1) is characterized by being a thin, disc-shaped or plate-shaped glass having a thickness of less than 1500 μm. - The glass element (1) is characterized by being glass having a maximum thickness of 100 mm. Having, The method according to any one of claims 1 to 8.

10. The glass element (1) is exposed to the alkaline etching medium (4) which removes the material of the glass element (1) at a removal rate or etching rate of at least 10 μm per hour, preferably 20 μm per hour or more. The method according to any one of claims 1 to 9.

11. The glass element (1) is borosilicate glass or soda-lime silicate glass. The method according to any one of claims 1 to 10.

12. The glass element (1) contains titanium, The method according to any one of claims 1 to 11.

13. The glass element (1) is one of the following glass compositions in weight percentage, namely Yes ２ 63~83, Al ２ O ３ 0~7、 B ２ O ３ 5~18、 Li ２ O+1 ２ O+K ２ O4~14、 MgO+CaO+SrO+BaO+ZnO 0-10, TiO ２ +ZrO ２ 0~3、 P ２ O ５ 0~2、 or Yes ２ 50-75, Al ２ O ３ 7~25、 B ２ O ３ 0~20、 Li ２ O+1 ２ O+K ２ O0~0.1、 MgO+CaO+SrO+BaO+ZnO 5-25, TiO ２ +ZrO ２ 0~10、 P ２ O ５ 0~5、 or Yes ２ 75-85, B ２ O ３ 8~18、 Al ２ O ３ 0.5~4.5、 Na ２ O 1.5~5.5、 K ２ O 0~2、 or Yes ２ 55~75, Na ２ O0~15、 K ２ O 2~14、 Al ２ O ３ 0~15、 MgO 0-4, CaO 3-12, BaO 0-15, ZnO 0-5, TO ２ 0~2、 Having one of the following, The method according to any one of claims 1 to 12.

14. The glass element (1) is pre-damaged by introducing a scratch (33) using the laser beam (27) of an ultrashort pulse laser (30) and expanding the scratch (33) with the alkaline etching medium (4). The method according to any one of claims 1 to 13.

15. A filamentous scratch (32) is introduced into the glass element (1) using the laser beam (27), and the filamentous scratch (32) is expanded by the alkaline etching medium (4) to form a channel (5). The method according to claim 14.

16. The diameters of the channels (5) arranged adjacent to each other along a predetermined path are increased by the alkaline etching medium (4) until the glass between the channels (5) is removed and the channels (5) are connected, thereby separating the glass elements along the path. The method according to claim 15.

17. Since the predetermined path of the channel (5) forms a closed circular or rectangular path, separation along the path by the alkaline etching medium (4) results in an opening in the glass element (1). The method according to claim 16.

18. The glass composition, the composition of the alkaline etching medium (4), the removal rate or etching rate, and the etching temperature are adjusted so that a predetermined angle of taper is formed on one edge (10) of the channel (5) with respect to each side (2, 3). The method according to any one of claims 15 to 17.

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