Sockets for electrical components

Abstract

To reduce damage to contact pins and probe pins, thereby increasing the durability of electrical component sockets. [Solution] A probe pin is provided in a holding hole of a probe holder that is vertically movable on a base member, a contact pin is housed laterally movable in a housing hole of an upper plate fixed to the upper side of the probe holder on the base member, the lower end of the contact pin is able to contact the upper end of the probe pin, and a contact holder for holding the contact pin is interposed between the upper plate and the probe holder, and the contact holder is movable laterally relative to the base member.

Description

Technical Field

[0001] The present invention relates to a socket for electrical components.

Background Art

[0002] Conventionally, when performing an electrical inspection of an electrical component such as a BGA (Ball Grid Array) package, for example, a socket for electrical components as shown in Patent Document 1 is used. In the base member of the socket for electrical components according to the prior art, a slider is provided so as to be movable in the lateral direction, and an accommodation hole is formed through the slider. A clamping type contact pin is accommodated in the accommodation hole of the slider, and the contact pin clamps the electrode of the electrical component in cooperation with a part of the inner wall surface of the accommodation hole of the slider. The middle part of the contact pin is fixed in a state of being embedded in the base member.

[0003] In the socket for electrical components according to the prior art, when the slider moves to one side in the lateral direction, the distance between the contact pin and a part of the inner wall surface of the accommodation hole of the slider expands. With the electrode of the electrical component accommodated in the accommodation hole of the slider, when the slider moves to the other side in the lateral direction, the upper end portion of the contact pin clamps the electrode of the electrical component in cooperation with a part of the inner wall surface of the accommodation hole of the slider.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Incidentally, because the middle portion of the contact pin is fixed embedded in the base member, when the upper end of the contact pin grips the electrode of an electrical component, the contact pin tends to deform, generating a large stress in the middle portion of the contact pin. Therefore, there is a concern that repeated large stresses in the middle portion of the contact pin may reduce the durability of the contact pin, or in other words, the durability of the electrical component socket.

[0006] Therefore, the object of the present invention is to provide an electrical component socket that can reduce damage to contact pins and other components, thereby improving the durability of the electrical component socket. [Means for solving the problem]

[0007] One embodiment of the electrical component socket of the present invention is: A probe holder is provided on the base member so as to be able to move up and down, and has a holding hole formed through it, A probe pin is provided within the holding hole, the lower end of which is capable of contacting the electrode of the first electrical component, The base member is fixed to the upper side of the probe holder, has a set area for setting a second electrical component, and has a housing hole formed through it, A contact pin is housed within the housing hole so as to be movable laterally, with its lower end in contact with the upper end of the probe pin, and which cooperates with a part of the inner wall surface of the housing hole to clamp the electrode of the second electrical component. The system includes a contact holder interposed between the upper plate and the probe holder, which is movable laterally relative to the base member and holds the contact pin. [Effects of the Invention]

[0008] According to the present invention, damage to contact pins and probe pins can be suppressed, thereby increasing the durability of electrical component sockets. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic plan view of an electrical component socket according to this embodiment. [Figure 2] Figure 2 is a schematic cross-sectional view of the electrical component socket according to this embodiment, along the lateral direction. [Figure 3] Figure 3 is an enlarged view of part III in Figure 2. [Figure 4] Figure 4 is a cross-sectional view illustrating the operation of an electrical component socket according to this embodiment. [Figure 5] Figure 5 is an enlarged view of section V in Figure 4. [Figure 6] Figure 6 is a cross-sectional view illustrating the operation of an electrical component socket according to this embodiment. [Figure 7] Figure 7 is an enlarged view of section VII in Figure 6. [Figure 8] Figure 8 is a cross-sectional view illustrating the operation of an electrical component socket according to this embodiment. [Figure 9] Figure 9 is an enlarged view of section IX in Figure 8. [Figure 10] Figure 10 is a cross-sectional view illustrating the operation of an electrical component socket according to this embodiment. [Figure 11] Figure 11 is an enlarged view of part XI in Figure 10. [Modes for carrying out the invention]

[0010] The following description of this embodiment will be made with reference to the drawings. In the specification and claims of this application, the lateral direction refers to a predetermined horizontal direction perpendicular to the thickness direction (vertical direction) of the base member. In the specification of this application, the X direction refers to one of the horizontal directions, which is the width direction of the electrical component socket. The Y direction refers to a horizontal direction perpendicular to the X direction. In the drawings, "CD" refers to the lateral direction, "CDa" refers to one side of the lateral direction, "CDb" refers to the other side of the lateral direction, "UD" refers to the upward direction, and "DD" refers to the downward direction.

[0011] Referring to FIGS. 1 to 10, the specific configuration of the socket 10 for electrical components according to the present embodiment will be described. FIG. 1 is a schematic plan view of the socket 10 for electrical components according to the present embodiment. FIG. 2 is a schematic cross-sectional view along the lateral direction of the socket 10 for electrical components according to the present embodiment. FIG. 3 is an enlarged view of part III in FIG. 2. FIG. 4 is a cross-sectional view for explaining the operation of the socket 10 for electrical components according to the present embodiment. FIG. 5 is an enlarged view of part V in FIG. 4. FIG. 6 is a cross-sectional view for explaining the operation of the socket 10 for electrical components according to the present embodiment. FIG. 7 is an enlarged view of part VII in FIG. 6. FIG. 8 is a cross-sectional view for explaining the operation of the socket 10 for electrical components according to the present embodiment. FIG. 9 is an enlarged view of part IX in FIG. 8. FIG. 10 is a cross-sectional view for explaining the operation of the socket 10 for electrical components according to the present embodiment. FIG. 11 is an enlarged view of part XI in FIG. 10.

[0012] As shown in FIGS. 1 and 2, the socket 10 for electrical components according to the present embodiment is disposed at a predetermined position of a wiring board W as a first electrical component connected to an inspection device (not shown). The socket 10 for electrical components is used for electrical inspections such as burn-in inspection of an IC (Integrated Circuit) package P as a second electrical component. The socket 10 for electrical components is formed in a rectangular shape in plan view. In the present embodiment, the IC package P is, for example, a BGA (Ball Grid Array) package. For the sake of convenience of explanation, only a part of all the electrodes Wa of the wiring board W is shown, and only a part of all the electrodes (terminals) Pa of the IC package P is shown. In the present embodiment, the diagonal direction of the socket 10 for components (the direction inclined 45 degrees with respect to the X direction and the Y direction) is defined as the lateral direction, but the X direction or the Y direction may be defined as the lateral direction.

[0013] As shown in FIG. 2, the socket 10 for electrical components includes a base member 12 having a rectangular shape in plan view, and the base member 12 is made of an insulating material. The base member 12 has a recess 12d that opens upward.

[0014] As shown in FIGS. 2 and 3, a probe holder 14 is provided in a recess 12d of a base member 12 so as to be movable up and down via a plurality of guide bolts 16 (only one guide bolt 16 is shown), and the probe holder 14 is made of an insulating material. The plurality of guide bolts 16 are fixed to the base member 12 and support the probe holder 14 so as to be movable up and down. The heads of the plurality of guide bolts 16 define the upper limit height position of the probe holder 14.

[0015] As shown in FIGS. 2 and 3, a plurality of holding holes 14h are formed to penetrate through the probe holder 14, and the plurality of holding holes 14h are arranged in a matrix. The number of the holding holes 14h of the probe holder 14 is the same as the number of electrodes Wa (electrodes Pa of the IC package P) of the wiring board W. For the sake of convenience of explanation, only a part of all the holding holes 14h is shown. Further, a plurality of coil springs 18 (only one coil spring 18 is shown) are provided on the bottom side of the recess 12d of the base member 12 as a first biasing member for biasing the probe holder 14 upward.

[0016] A probe pin 20 is provided in each holding hole 14h of the probe holder 14 so as to be telescopically movable in the vertical direction, and each probe pin 20 is made of a conductive material such as metal. The plurality of probe pins 20 are arranged in a matrix. The number of the probe pins 20 is the same as the number of electrodes Wa (electrodes Pa of the IC package P) of the wiring board W. For the sake of convenience of explanation, only a part of all the probe pins 20 is shown.

[0017] As shown in Figure 3, each probe pin 20 has a pipe-shaped probe pin body 22 and an upper contact member 24 that is movable vertically on the upper end side of the probe pin body 22. Each probe pin 20 has a lower contact member 26 that is movable vertically on the lower end side of the probe pin body 22 and can contact each electrode Wa of the wiring board W, and a coil spring (not shown) provided inside the probe pin body 22. The upper contact member 24 corresponds to the upper end of the probe pin 20 and is biased upward by the coil spring. The lower contact member 26 corresponds to the lower end of the probe pin 20 and is biased downward by the coil spring. The lower contact member 26 may also be the lower end of the coil spring.

[0018] Multiple support holes 12h for supporting the probe pin 20 (probe pin body 22) are formed extending from the recess 12d of the base member 12 to the lower surface of the base member 12, and the multiple support holes 12h are arranged in a matrix. Each support hole 12h of the base member 12 is located in a position corresponding to (aligned with) each holding hole 14h of the probe holder 14. The number of support holes 12h of the base member 12 is the same as the number of electrodes Wa (electrodes Pa of the IC package P) of the wiring board W, but for the sake of explanation, only a portion of all the support holes 12h are shown in the illustration.

[0019] An upper plate 28, which is rectangular in plan view, is fixed to the upper surface of the base member 12 via a plurality of fixing screws (not shown), and the upper plate 28 is positioned above the probe holder 14. The upper plate 28 covers the opening of the recess 12d of the base member 12 and is made of insulating material. The upper plate 28 has a set area SA for setting the IC package P. Multiple accommodation holes 28h are formed through the upper plate 28, and the multiple accommodation holes 28h are arranged in a matrix. The upper end side of each accommodation hole 28h of the upper plate 28 opens into the set area SA. Each accommodation hole 28h of the upper plate 28 is located in a position corresponding to (aligned with) each holding hole 14h of the probe holder 14. The number of accommodation holes 28h of the upper plate 28 is the same as the number of electrodes Wa of the wiring board W (electrodes Pa of the IC package P), but for the sake of explanation, only a portion of all accommodation holes 28h are shown.

[0020] As shown in Figure 3, clamp-type contact pins 30 are housed in each housing hole 28h of the upper plate 28 so as to be movable in the lateral direction. Each contact pin 30 cooperates with a part of the inner wall surface of each housing hole 28h of the upper plate 28 to clamp each ball-shaped electrode Pa of the IC package P. Each contact pin 30 is made of a conductive material such as metal. Multiple contact pins 30 are arranged in a matrix. Each contact pin 30 has a projection 32 on its intermediate side that protrudes to one side in the lateral direction, which is one of the directions perpendicular to the axis of each contact pin 30. The number of contact pins 30 is the same as the number of electrodes Wa of the wiring board W (electrodes Pa of the IC package P), but for the sake of explanation, only a portion of all contact pins 30 are shown in the figure.

[0021] As shown in Figure 2, a contact holder 34 is interposed between the upper plate 28 and the probe holder 14 of the base member 12 to hold a plurality of contact pins 30. The contact holder 34 is located in a recess 12d of the base member 12. The contact holder 34 is not vertically movable relative to the base member 12, but is movable laterally via a plurality of guide bolts 36 (only one guide bolt 36 is shown). The contact holder 34 holds the plurality of contact pins 30 so that they move laterally integrally with the contact holder 34 while in an upright position. The contact holder 34 has a plurality of through holes 34h (only one through hole 34h is shown) formed through it for inserting the guide bolts 36, and each through hole 34h is a laterally extending elliptical or elongated hole. The plurality of guide bolts 36 are fixed to the base member 12 and support the contact holder 34 so that it can move laterally. The multiple guide bolts 36, like the multiple guide bolts 16, have the function of supporting the probe holder 14 so that it can be raised and lowered.

[0022] As shown in Figures 2 and 3, the contact holder 34 has a lower holder 38 that is movably mounted laterally on the base member 12, and the lower holder 38 is made of an insulating material. The lower holder 38 has lower retaining holes 38h formed through it for holding the contact pins 30, and multiple lower retaining holes 38h are arranged in a matrix. Each lower retaining hole 38h of the lower holder 38 is located in a position corresponding to (aligned with) each retaining hole 14h of the probe holder 14. The number of lower retaining holes 38h of the lower holder 38 is the same as the number of electrodes Wa of the wiring board W (electrodes Pa of the IC package P), but for the sake of explanation, only a portion of all the lower retaining holes 38h are shown.

[0023] The contact holder 34 has an upper holder 40 fixed to the upper side of the lower holder 38 via a plurality of fixing screws (not shown), and the upper holder 40 is made of an insulating material. The upper holder 40 cooperates with the lower holder 38 to clamp the projections 32 of the plurality of contact pins 30 from above and below. The upper holder 40 and the lower holder 38 move integrally laterally while clamping the projections 32 of the plurality of contact pins 30. The upper holder 40 has upper holding holes 40h formed through it that hold the contact pins 30 so as to be movable laterally, and a plurality of upper holding holes 40h are arranged in a matrix. Each upper holding hole 40h of the upper holder 40 is located in a position corresponding to (aligned with) each lower holding hole 38h of the lower holder 38. Each upper holding hole 40h of the upper holder 40 is located in a position corresponding to (aligned with) each housing hole 28h of the upper plate 28.

[0024] As shown in Figure 2, a plurality of coil springs 42 are provided in one lateral position within the recess 12d of the base member 12 as second biasing members that bias the contact holder 34 to the other lateral position. Each coil spring 42 engages with one lateral position of the contact holder 34.

[0025] The electrical component socket 10 has the following configuration for the operation of the probe holder 14 and the contact holder 34.

[0026] As shown in Figures 4 and 5, the probe holder 14 descends against the biasing force of the multiple coil springs 18, causing the upper end of each probe pin 20 to separate from the lower end of each contact pin 30. As shown in Figures 6 and 7, following the downward movement of the probe holder 14, the contact holder 34 moves laterally to one side against the biasing force of the multiple coil springs 42, increasing the distance between each contact pin 30 and a portion of the inner wall surface of each housing hole 28h.

[0027] As shown in Figures 8 and 9, the contact holder 34 moves laterally to the other side due to the biasing force of multiple coil springs 42, causing the upper end of each contact pin 30 to grip each electrode Pa of the IC package P in cooperation with a portion of the inner wall surface of each housing hole 28h. As shown in Figures 10 and 11, following the lateral movement of the contact holder 34 to the other side, the probe holder 14 rises due to the biasing force of multiple coil springs 18, causing the upper end of each probe pin 20 to contact the lower end of each contact pin 30.

[0028] As shown in Figures 1 and 2, a rectangular cover member 44 is provided above the upper plate 28 of the base member 12, and is movable up and down via a plurality of guide bolts 46. The plurality of guide bolts 46 are fixed to the base member 12 and support the cover member 44 so that it can move up and down. The heads of the plurality of guide bolts 46 define the upper height position of the cover member 44. The cover member 44 also has a rectangular opening 44a that opens the set area SA, and the opening 44a guides the IC package P into the set area. Between the base member 12 and the cover member 44, a plurality of coil springs 48 are provided as a third biasing member that pushes the cover member 44 upward.

[0029] As shown in Figure 2, multiple mounting holes 50 (only one mounting hole 50 is shown) are formed extending from the upper surface of the upper plate 28 to the lower surface of the contact holder 34. A coil spring 52, which acts as an elastic body, is inserted through each mounting hole 50, and each coil spring 52 transmits the downward force of the cover member 44 to the probe holder 14.

[0030] The contact holder 34 has multiple rectangular insertion holes 34v (only one insertion hole 34v is shown) that penetrate through it. The inner wall surface on one side in the lateral direction of each insertion hole 34v is a cam surface 34c. In other words, the contact holder 34 has multiple cam surfaces 34c (only one cam surface 34c is shown). Each cam surface 34c of the contact holder 34 is inclined in the vertical direction such that its upper end is located on one side in the lateral direction more than its lower end. The cover member 44 also has multiple rectangular prism-shaped contact portions 54 (only one contact portion 54 is shown), and each contact portion 54 contacts each cam surface 34c of the contact holder 34 from above as the cover member 44 descends.

[0031] The upper plate 28 has multiple rectangular guide holes 28g (only one guide hole 28g is shown) that run through it to guide the contact portion 54 of the cover member 44 so that it can move up and down. Each guide hole 28g of the upper plate 28 is positioned to correspond to (align with) each insertion hole 34v of the contact holder 34.

[0032] The electrical component socket 10 has the following configuration regarding the operation of the cover member 44.

[0033] As shown in Figures 4 and 5, the cover member 44 descends against the biasing force of the multiple coil springs 48, and the downward force of the cover member 44 is transmitted to the probe holder 14 by the multiple coil springs 52 (only one coil spring 52 is shown). Then the probe holder 14 descends against the biasing force of the multiple coil springs 18. In other words, the cover member 44 descends against the biasing force of the multiple coil springs 48, and the probe holder 14 descends against the biasing force of the multiple coil springs 18.

[0034] As shown in Figures 6 and 7, following the downward movement of the probe holder 14, each contact portion 54 of the cover member 44 contacts each cam surface 34c from above, causing the contact holder 34 to move laterally to one side against the biasing force of the multiple coil springs 42. In other words, as the cover member 44 descends further against the biasing force of the multiple coil springs 48, following the downward movement of the probe holder 14, the contact holder 34 moves laterally to one side against the biasing force of the multiple coil springs 42.

[0035] As shown in Figures 8 and 9, the cover member 44 rises due to the biasing force of the multiple coil springs 48, causing the contact holder 34 to move laterally to the other side against the biasing force of the multiple coil springs 42. As shown in Figures 10 and 11, the cover member 44 rises further due to the biasing force of the multiple coil springs 48, and following the lateral movement of the contact holder 34 to the other side, the probe holder 14 rises due to the biasing force of the multiple coil springs 18.

[0036] Next, the operation of the electrical component socket 10 according to this embodiment will be described.

[0037] First, as shown in Figures 2 and 3, the electrical component socket 10 is positioned at a predetermined location on the wiring board W. Then, the lower contact members 26 of each probe pin 20 come into contact with each electrode Wa of the wiring board W and retract upward relative to the lower surface of the probe holder 14.

[0038] Next, as shown in Figures 4 and 5, by pressing the cover member 44 from above with a pressing device (not shown), the cover member 44 descends against the biasing force of the multiple coil springs 48. As a result, the probe holder 14 descends against the biasing force of the multiple coil springs 18, separating the upper contact members 24 of each probe pin 20 from the lower ends of each contact pin 30.

[0039] As shown in Figures 6 and 7, by further pressing the cover member 44 from above with the pressing device, the cover member 44 descends further against the biasing force of the multiple coil springs 48. As a result, the contact holder 34 moves laterally to one side against the biasing force of the multiple coil springs 42, widening the gap between each contact pin 30 and a portion of the inner wall surface of each housing hole 28h of the upper plate 28. This allows the IC package P to be set in the set area SA of the upper plate 28 with each electrode Pa of the IC package P housed in each housing hole 28h of the upper plate 28.

[0040] Subsequently, as shown in Figures 8 and 9, by releasing the pressing force from the pressing device, the cover member 44 rises due to the biasing force of the multiple coil springs 48. Then, the contact holder 34 moves laterally to the other side due to the biasing force of the multiple coil springs 42, and the upper ends of each contact pin 30 grip each electrode Pa of the IC package P in cooperation with a part of the inner wall surface of each housing hole 28h.

[0041] Finally, as shown in Figures 10 and 11, the cover member 44 rises to its upper height position due to the biasing force of the multiple coil springs 48. Then, the probe holder 14 rises to its upper height position due to the biasing force of the multiple coil springs 18, allowing the upper contact members 24 of each probe pin 20 to contact the lower ends of each contact pin 30. This makes it possible to electrically connect each electrode Wa of the wiring board W to each electrode Pa of the IC package P, and to perform electrical testing of the IC package P using the testing device.

[0042] According to the configuration of the electrical component socket 10 in this embodiment, as described above, probe pins 20 are provided in each holding hole 14h of the probe holder 14 which is provided on the base member 12 so as to be vertically movable. Contact pins 30 are housed in each housing hole 28h of the upper plate 28 which is fixed to the upper side of the probe holder 14 on the base member 12 so as to be movable in the lateral direction. A contact holder 34 which holds a plurality of contact pins 30 is interposed between the upper plate 28 and the probe holder 14, and the contact holder 34 is movable in the lateral direction relative to the base member 12.

[0043] Therefore, as described above, the upper contact member 24 of each probe pin 20 can be separated from the lower end of each contact pin 30, thereby increasing the distance between each contact pin 30 and a portion of the inner wall surface of each housing hole 28h of the upper plate 28. With the upper end of each contact pin 30 gripping each electrode Pa of the IC package P in cooperation with a portion of the inner wall surface of each housing hole 28h, the upper contact member 24 of each probe pin 20 can be brought into contact with the lower end of each contact pin 30. In other words, the electrodes Wa of the wiring board W and the electrodes Pa of the IC package P can be electrically connected without generating large stresses on the contact pins 30 and probe pins 20.

[0044] Therefore, according to the electrical component socket 10 of this embodiment, damage to the contact pins 30 and probe pins 20 can be suppressed, thereby increasing the durability of the electrical component socket 10.

[0045] Furthermore, according to the configuration of the electrical component socket 10 according to this embodiment, as described above, when the cover member 44 descends against the biasing force of the multiple coil springs 48, the probe holder 14 descends against the biasing force of the multiple coil springs 18. Following the downward movement of the probe holder 14, the contact holder 34 moves to one side in the lateral direction against the biasing force of the multiple coil springs 42. When the cover member 44 rises due to the biasing force of the multiple coil springs 48, the contact holder 34 moves to one side in the lateral direction against the biasing force of the multiple coil springs 42. Following the movement of the contact holder 34 to the other side in the lateral direction, the probe holder 14 rises due to the biasing force of the multiple coil springs 18. Therefore, by raising and lowering the cover member 44, the probe holder 14 can be raised and lowered, and the contact holder 34 can be moved laterally.

[0046] Therefore, according to the electrical component socket 10 of this embodiment, electrical testing of the IC package P can be performed using a conventional pressing device.

[0047] Furthermore, according to the configuration of the electrical component socket 10 according to this embodiment, as described above, the contact holder 34 has a cam surface 34c that is inclined with respect to the vertical direction such that the upper end is located on one side in the lateral direction more than the lower end. The cover member 44 has a contact portion 54 that abuts against the cam surface 34c of the contact holder 34. Therefore, the contact holder 34 can be stably moved laterally simply by raising and lowering the cover member 44.

[0048] Therefore, according to the electrical component socket 10 of this embodiment, the operational reliability of the electrical component socket 10 can be further improved.

[0049] Furthermore, according to the configuration of the electrical component socket 10 in this embodiment, as described above, a mounting hole 50 is formed extending from the upper surface of the upper plate 28 to the lower surface of the contact holder 34. A coil spring 52 is inserted through the mounting hole 50 to transmit the downward force of the cover member 44 to the probe holder 14. Therefore, the probe holder 14 can be lowered stably simply by lowering the cover member 44.

[0050] Therefore, according to the electrical component socket 10 of this embodiment, the operational reliability of the electrical component socket 10 can be further improved.

[0051] Furthermore, according to the configuration of the electrical component socket 10 in this embodiment, as described above, The upper holder 40 and the lower holder 38 move integrally in the lateral direction while gripping the protrusions 32 of the multiple contact pins 30. Therefore, the contact holder 34 can be moved while stably holding the multiple contact pins 30.

[0052] Therefore, according to the electrical component socket 10 of this embodiment, the operational reliability of the electrical component socket 10 can be further improved.

[0053] Furthermore, according to the configuration of the electrical component socket 10 in this embodiment, a plurality of support holes 12h for supporting the probe pins 20 are formed by penetrating from the recess 12d of the base member 12 to the lower surface of the base member 12. Therefore, a plurality of probe pins 20 can be stably supported by the base member 12.

[0054] Therefore, according to the electrical component socket 10 of this embodiment, the operational reliability of the electrical component socket 10 can be further improved.

[0055] Although this embodiment has been described in detail above, the present invention is not limited to the specific embodiments described above. Various modifications and changes are possible to the specific examples described above within the scope of the gist of the present invention as described in the claims. [Industrial applicability]

[0056] This invention is useful as an electrical component socket that can reduce damage to contact pins and other components, thereby improving the durability of the electrical component socket. [Explanation of symbols]

[0057] 10 Sockets for electrical components 12 Base member 12d recess 12h support hole 14 Probe holder 14h holding hole 16 Guide bolts 18. Coil spring (first biasing member) 20 probe pins 22 Probe pin body 24 Upper contact member 26 Lower contact member 28 Top plate 28h containment hole 28g guide hole 30 Contact pins 32 Protrusion 34 Contact holder 34c cam surface 34h Through hole 34V insertion hole 36 Guide bolts 38 Lower holder 38h Lower retaining hole 40 Upper holder 40h Upper retaining hole 42 Coil spring (second biasing member) 44 Cover component 44a Open area 46 Guide bolts 48. Coil spring (third biasing member) 50 mounting holes 52. Coil spring (elastic body) 54 Contact part W Wiring board (first electrical component) Wa electrode PIC package (second electrical component) Pa electrode SA Set Area

Claims

1. A probe holder is provided on the base member so as to be able to move up and down, and has a holding hole formed through it, A probe pin is provided within the holding hole, the lower end of which is capable of contacting the electrode of the first electrical component, The base member is fixed to the upper side of the probe holder, has a set area for setting a second electrical component, and has a housing hole formed through it, A contact pin is housed within the housing hole so as to be movable laterally, with its lower end in contact with the upper end of the probe pin, and which cooperates with a part of the inner wall surface of the housing hole to clamp the electrode of the second electrical component. The system includes a contact holder interposed between the upper plate and the probe holder, which is movable laterally relative to the base member and holds the contact pin, Socket for electrical components.

2. The contact holder holds the contact pin so that the contact pin moves laterally integrally with the contact holder while the contact pin is upright. The socket for electrical components according to claim 1.

3. As the probe holder descends against the biasing force of the first biasing member, the upper end of the probe pin separates from the lower end of the contact pin, and following the downward movement of the probe holder, the contact holder moves laterally to one side against the biasing force of the second biasing member, thereby increasing the distance between the contact pin and the part of the inner wall surface of the housing hole, As the contact holder moves laterally to the other side due to the biasing force of the second biasing member, the upper end of the contact pin and the part of the inner wall surface of the housing hole cooperate to grip the electrode of the second electrical component, and following the lateral movement of the contact holder to the other side, the probe holder rises due to the biasing force of the first biasing member, causing the upper end of the probe pin to contact the lower end of the contact pin. The socket for electrical components according to claim 1.

4. The base member further comprises a cover member that is vertically movable above the upper plate and has an opening that opens the set area. The socket for electrical components according to claim 3.

5. As the cover member descends against the biasing force of the third biasing member, the probe holder descends against the biasing force of the first biasing member, and subsequently, the contact holder moves laterally to one side against the biasing force of the second biasing member, As the cover member rises due to the biasing force of the third biasing member, the contact holder moves laterally to the other side due to the biasing force of the second biasing member, and subsequently, the probe holder rises due to the biasing force of the first biasing member. The socket for electrical components according to claim 4.

6. The contact holder has a cam surface that is inclined in the vertical direction such that the upper end is located on one side in the lateral direction more than the lower end. The cover member has a contact portion that contacts the cam surface from above. The socket for electrical components according to claim 5.

7. The device further includes an elastic body inserted through a mounting hole formed extending from the upper surface of the upper plate to the lower surface of the contact holder, which transmits the downward force of the cover member to the probe holder. The socket for electrical components according to claim 5.

8. The contact pin has a projection on its intermediate side that protrudes in a direction perpendicular to the axis of the contact pin, The aforementioned contact holder is A lower holder is provided on the base member so as to be movable in the lateral direction, and a lower holding hole for holding the contact pin is formed through it, The upper holder is fixed to the upper side of the lower holder and has an upper holding hole formed through it at a position corresponding to the lower holding hole, which holds the contact pin so that it can move laterally, The upper holder and the lower holder move integrally in the lateral direction while gripping the projection. The socket for electrical components according to claim 1.

9. The base member has a recess that opens upward, and a support hole for supporting the probe pin is formed through the bottom surface of the recess and extending to the lower surface of the base member. The socket for electrical components according to claim 1.

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