Photosensitive resin composition, photosensitive resin laminate, method for forming resist patterns, and method for manufacturing wiring boards

Abstract

The present invention provides a photosensitive resin composition and a photosensitive resin laminate that achieve both high sensitivity and high resolution. [Solution] The solution comprises the following components: (A) a compound having an ethylenically unsaturated bond; (B) an alkali-soluble resin; and (C) a polymerization initiator, wherein component (A) is of formula I: JPEG2026097526000040.jpg49129 (In the formula, R 1 ~R 3 A photosensitive resin composition is provided, comprising component (A1), which is a compound represented by (a, b, and X as defined in the specification).

Claims

1. The following ingredients: (A) Compounds having ethylenically unsaturated bonds; (B) Alkali-soluble resins; and (C) Polymerization initiator; Includes, The aforementioned component (A) is given by formula I: 【Chemistry 1】 (In the formula, R １ R is an α-valent organic group that does not have an aromatic ring, ２ is a b+1 valent organic group, R ３ (where is a hydrogen atom or a methyl group, a is 3 or more, b is 1 or more, and X is an oxygen atom or NH) A photosensitive resin composition comprising component (A1), which is a compound represented by .

2. The photosensitive resin composition according to claim 1, wherein X is an oxygen atom.

3. The aforementioned R １ The photosensitive resin composition according to claim 1 or 2, wherein is a chain-like organic group.

4. The aforementioned R １ The photosensitive resin composition according to claim 1 or 2, wherein the number of carbon atoms in the material is 7 or more.

5. The aforementioned R １ The photosensitive resin composition according to claim 4, wherein the value of the number of carbon atoms ÷ a is 7 or less.

6. The aforementioned R １ Equation II: 【Chemistry 2】 (In the formula, the dashed line indicates the bond with the nitrogen atom contained in the urethane bond.) Or formula III: 【Transformation 3】 (In the formula, the dashed line indicates the bond with the nitrogen atom contained in the urethane bond.) A photosensitive resin composition according to claim 1 or 2, comprising the structure represented by .

7. The aforementioned R １ The photosensitive resin composition according to claim 6, wherein the structure is represented by formula II.

8. The aforementioned component (A1) is given by equations (4) to (7): 【Chemistry 4】 【Transformation 5】 【Transformation 6】 【Transformation 7】 A photosensitive resin composition according to claim 1 or 2, comprising one or more compounds selected from those represented by .

9. The photosensitive resin composition according to claim 1 or 2, wherein the mass ratio of component (B) to component (A) is 4 or less.

10. The photosensitive resin composition according to claim 1 or 2, wherein the total content of component (A) and component (B) is 75% by mass or more, based on the total solid content mass of the photosensitive resin composition.

11. The photosensitive resin composition according to claim 1 or 2, wherein the component (B) comprises styrene or benzyl (meth)acrylate.

12. The photosensitive resin composition according to claim 1 or 2, further comprising a polymerization inhibitor (D).

13. The photosensitive resin composition according to claim 1 or 2, wherein the mass ratio of component (A) to component (C) is 3 or more.

14. The photosensitive resin composition according to claim 1 or 2, wherein the (C) component comprises a hexaarylbiimidazole compound.

15. The photosensitive resin composition according to claim 1 or 2, further comprising component (A2), which is a compound having an ethylenically unsaturated bond other than component (A1).

16. The photosensitive resin composition according to claim 15, wherein the (A2) component comprises a compound having two or more ethylenically unsaturated bonds.

17. A photosensitive resin laminate comprising a support and a photosensitive resin layer containing the photosensitive resin composition described in claim 1 or 2.

18. The photosensitive resin laminate according to claim 17, wherein the photosensitive resin layer is for resist.

19. Furthermore, the photosensitive resin laminate according to claim 17 is further provided with a protective film.

20. A method for forming a resist pattern using a photosensitive resin laminate as described in claim 17, comprising the following steps: Lamination process for stacking a photosensitive resin layer onto a substrate; An exposure step of exposing the photosensitive resin layer; A developing step for developing and removing the unexposed portion of the photosensitive resin layer; A method for forming a resist pattern, including the method described above.

21. A method for manufacturing a wiring board using a photosensitive resin laminate as described in claim 17, comprising the following steps: Lamination process for stacking a photosensitive resin layer onto a substrate; An exposure step of exposing the photosensitive resin layer; A developing step to develop and remove the unexposed portion of the photosensitive resin layer to form a resist pattern; A conductor pattern forming step involves etching or plating the substrate on which the resist pattern is formed to form a conductor pattern; and A peeling step for peeling the resist pattern from the substrate; A method for manufacturing a wiring board, including the method described above.

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