electronic machines

Abstract

To provide electronic equipment with a large display area. The size of the display area can be adjusted according to the application. We provide electronic devices that can be selected. [Solution] The electronic device has two parts that sandwich the bending part of the display panel, and each part is attached to the housing. It has a fixed configuration and can be in two forms: with the display panel open and folded into three sections. The electronic device has a mechanism in which two housings slide parallel to each other, and the display panel is In its folded form, the display surface of the display panel has a convex curved portion and a concave portion. The curved part and the curved part deform so that they move parallel to each other and in opposite directions. The two parts supported by the panel housing slide while maintaining their display surfaces parallel. Do it.

Description

Technical Field

[0001] One aspect of the present invention relates to an electronic device including a display device.

[0002] Note that one aspect of the present invention is not limited to the above technical field. Examples of the technical field of one aspect of the present invention disclosed in this specification and the like include semiconductor devices, display devices, light-emitting devices, power storage devices, storage devices, electronic devices, lighting devices, input devices, input / output devices, their driving methods, or their manufacturing methods.

Background Art

[0003] In recent years, diversification of electronic devices including display devices has been promoted. Examples thereof include electronic devices such as mobile phones, smartphones, tablet terminals, and wearable terminals.

[0004] Typical display devices include light-emitting devices including light-emitting elements such as organic EL (Electro Luminescence ) elements and light-emitting diodes (LEDs: Light Emitting Diodes), liquid crystal display devices, and electronic paper that performs display by an electrophoresis method or the like.

[0005] Patent Document 1 discloses a flexible light-emitting device to which an organic EL element is applied.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007]

[0007] In recent years, there has been a demand for electronic devices with large display areas. This offers advantages such as improved overview and an increased amount of information that can be displayed. On the other hand, mobile In electronic devices of this type, increasing the display area reduces portability. Therefore, it was difficult to achieve both improved display readability and improved portability.

[0008] One aspect of the present invention aims to provide an electronic device having a large display area. Alternatively, one of the challenges is to improve the portability of electronic devices. Alternatively, the display area is large. One of the objectives is to provide electronic devices whose size can be changed. Alternatively, the display can be changed according to the application. One of the objectives is to provide an electronic device that allows users to select the size of the area. One of our objectives is to provide novel electronic devices. [Means for solving the problem]

[0009] One aspect of the present invention is an electronic device having a flexible display panel. The display panel is It has a first part, a second part, and a third part. The third part is flexible. , and is located between the first part and the second part. The display panel is located in the first part The first display surface, the second display surface located in the second part, and the third display surface located in the third part Each has. The display panel is transformable between the first and second forms. One form has a third part that is flat, and a first display surface, a second display surface, and a third surface The first form has the indicator surfaces positioned parallel to each other. The second form has the third part being the third indicator surface. A first curved section in which part of the third display surface is bent in a convex shape, and a second curved section in which the other part of the third display surface is bent in a concave shape. having a curved portion and, and a part of the first display surface and a part of the second display surface are flat respectively In the form where they overlap in a row. When the display panel is in the second form, the third part is deformed so that the width between the first curved part and the second curved part changes, and the relative positions of the first part and the second part change while maintaining the parallel state of the first display surface and the second display surface.

[0010] When the display panel is deformed between the first form and the second form, it is preferable that the third part is deformed so that the relative positions of the first part and the second part in the direction perpendicular to the first display surface change while maintaining the parallel state of the first display surface and the second display surface.

[0011] When the display panel is in the second form, the portion where the third display surface in the third part is curved concave is on the first part side, and the portion where the third display surface in the third part is curved convex is on the second part side, respectively. Preferably. At this time, it is more preferable that the area of the second display surface is larger than the area of the first display surface.

[0012] It is preferable that the area of the display region in the first form is 1.1 times or more and 3 times or less the area of the display region in the second form.

[0013] The electronic device preferably has a first housing that supports the first part, a second housing that supports the second part, and a mechanism that slidably connects the first housing and the second housing.

[0014] The electronic device preferably has a hinge having parallel first and second axes. At this time, the first housing and the hinge are rotatably connected about the first axis, and the second housing and the hinge The rangefinder is rotatably connected around the second axis. Also, the first housing or the second housing is Preferably, it has a slide rail that extends in a direction intersecting the first axis, and The hinge is preferably mounted so as to be slidable along the slide rail.

[0015] The electronic device is preferably deformable as follows: The display panel is in the first embodiment At that time, the hinge is located at one end of the slide rail. The display panel changes from the first form to the second form. When the state changes, the hinge rotates so that the first housing and the first display surface of the second housing are perpendicular to each other. The relative position of the direction changes. And when the display panel is in the second form, the hinge slides. By sliding along the rail, the first housing or the second housing moves along the slide rail. It slides.

[0016] The second housing preferably has a notch on a part opposite to the side supporting the second part. Furthermore, when the display panel is in the second form, the notch separates the first housing and the second housing. It is more preferable that the third part is housed in the space formed between it and the body.

[0017] The second housing has a convex portion with a convex curved surface in a part that overlaps with the third portion. Preferred. Furthermore, when the display panel is in the second form, the third part is on the protrusion of the second housing. It is preferable if it curves along the curve.

[0018] When the display panel of the electronic device is in the first form, the relative positions of the first housing and the second housing are defined as It is preferable that the electronic device has a first locking mechanism. Furthermore, the display panel has a second locking mechanism. The form is such that the first display surface is at least one of the second part, the third part, and the second housing. With the first housing covered, the second lock locks the relative position of the first housing and the second housing. It is preferable to have a mechanism.

[0019] The electronic device preferably has a first vibrating element and a second vibrating element. The first vibrating element and the second vibrating element vibrate the first housing and the second housing, respectively. It is more preferable if it has a function. In this case, the first vibrating element and the second vibrating element are Different frequencies are even more preferable. [Effects of the Invention]

[0020] According to one aspect of the present invention, an electronic device having a large display area can be provided. Alternatively, The portability of sub-devices can be improved. Alternatively, the size of the display area can be changed. We can provide the equipment, or an electronic device that allows you to select the size of the display area according to the application. We can provide equipment, or we can provide new electronic devices. [Brief explanation of the drawing]

[0021] [Figure 1] An example of the configuration of an electronic device according to an embodiment. [Figure 2] An example of the configuration of an electronic device according to an embodiment. [Figure 3] An example of the configuration of an electronic device according to an embodiment. [Figure 4] An example of the configuration of an electronic device according to an embodiment. [Figure 5] An example of the configuration of an electronic device according to an embodiment. [Figure 6] An example of the configuration of an electronic device according to an embodiment. [Figure 7] An example of the configuration of an electronic device according to an embodiment. [Figure 8] An example of the configuration of an electronic device according to an embodiment. [Figure 9] An example of the configuration of an electronic device according to an embodiment. [Figure 10] An example of the configuration of an electronic device according to an embodiment. [Figure 11] A block diagram of an electronic device according to an embodiment. [Figure 12] An example of the configuration of an electronic device according to an embodiment. [Figure 13] A block diagram of an electronic device according to an embodiment. [Figure 14] An example of the configuration of an electronic device according to an embodiment. [Figure 15] An example of the configuration of an electronic device according to an embodiment. [Figure 16] An example of the configuration of an electronic device according to an embodiment. [Figure 17] An example of the configuration of an input device according to an embodiment. [Figure 18] An example of the configuration of an input device according to an embodiment. [Figure 19] An example of the configuration of a display device according to an embodiment. [Figure 20] A diagram illustrating an example of a driving method for an input device according to an embodiment. [Figure 21] An example of the configuration of an input / output device according to an embodiment. [Figure 22] An example of the configuration of an input / output device according to an embodiment. [Figure 23] An example of the configuration of an input / output device according to an embodiment. [Figure 24] An example of the configuration of an input / output device according to an embodiment. [Figure 25] An example of the configuration of an input / output device according to an embodiment. [Modes for carrying out the invention]

[0022] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. Those skilled in the art will readily understand what is possible. Therefore, the present invention is as shown in the following embodiments. It should not be interpreted as being limited to the contents described herein.

[0023] In the configuration of the invention described below, the same part or part having a similar function is The same reference numerals are used consistently across different drawings, and explanations of their repetition are omitted. When referring to this function, the hatching pattern is the same, and sometimes no specific sign is assigned. .

[0024] In each figure described herein, the size, layer thickness, or area of ​​each component is as follows: It may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale. stomach.

[0025] In this specification, ordinal numbers such as "the first," "the second," etc., are used to avoid confusion of constituent elements. This is added for the purpose of providing a numerical limit, and is not intended to limit the number of items.

[0026] (Embodiment 1) This embodiment describes an example of the configuration of an electronic device according to one aspect of the present invention.

[0027] An electronic device according to one aspect of the present invention comprises a display panel that is partially flexible and bendable. It has two forms: one with the display panel open and one folded into three sections. It can be taken.

[0028] In electronic devices, the two parts that sandwich the curved portion of the display panel are each fixed to the casing. It has a configuration. Also, in a form in which the display panel is folded into three, the display panel is a display It has a portion where the surface is curved in a convex shape and a portion where the display surface is curved in a concave shape. Furthermore, two housings By having a mechanism that allows the body to slide parallel to the surface, the display panel has the two curved parts mentioned above. They can be deformed so that they move parallel and in opposite directions. This allows the display to The two parts supported by the Nell casing slide while maintaining their display surfaces parallel to each other. It is possible.

[0029] An electronic device according to one aspect of the present invention has a seamless, wide display area when the display panel is open. It can display information in a wide area, offering excellent overview. Furthermore, the display panel can be folded into three sections. This allows for miniaturization of electronic devices, resulting in superior portability. Furthermore, the display panel can be folded. When this happens, the two casings can be transformed to slide, thus reducing the height of the electronic device. The range of motion in the direction (perpendicular to the display surface) can be kept to a minimum. Therefore, one side It doesn't require lifting the casing; two casings can be opened with a simple motion such as sliding one casing. Because it is possible to transition between different forms, it is possible to create electronic devices with improved convenience. Furthermore, because electronic devices can be transformed with such simple movements, they can be operated with one hand. This is also possible.

[0030] More specifically, the configuration can be as follows:

[0031] [Example Configuration] Figures 1(A1), (B1), and (C1) show schematic perspective views of the electronic device 10, respectively. The sub-device 10 has a flexible display panel 11. Figure 1(A1) shows the display panel 1 Figure 1(C1) shows the folded state of 1, Figure 1(B1) shows the display panel 11 in the open state, These show the states between these two states, respectively.

[0032] Furthermore, Figure 1(A2) is a schematic cross-sectional view corresponding to the cutting line A1-A2 in Figure 1(A1). Figure 1(B2) is a schematic cross-sectional view corresponding to the cutting line A3-A4 in Figure 1(B1). (C2) is a schematic cross-sectional view corresponding to the cutting line A5-A6 in Figure 1(C1).

[0033] The electronic device 10 has a display panel 11, a hinge 12, a housing 21, and a housing 22. Nel 11 has a flexible and bendable portion (also called the third portion). The part of the octopus is supported by the housing 21 and fixed to the housing 21 (the (Also called part 1) and part that is supported by the housing 22 and fixed to the housing 22 (part 2) It has (also called a minute). The display panel 11 has two supported by the housing 21 or housing 22 The part does not need to be flexible.

[0034] The housing 21 and housing 22 are connected by a hinge 12. The hinge 12 and housing 21 are connected by a hinge 12. The sliding rail 13 of the housing 21 moves in a direction parallel to the display surface of the display panel 11. It is slidably connected to it.

[0035] In each of the figures in Figure 1, the housing 21 contains a printed circuit board 42, a battery 43, etc. This shows an example. Various ICs are mounted on the printed circuit board 42. Also, the display panel FPC (Flexible Printed Circuit) connected to end 11 Part of 41 is routed into the interior of the housing 21 and connected to terminals on the printed circuit board 42. In the configuration shown in Figure 1, the casing 21 can also be referred to as the main body.

[0036] Furthermore, the housing 22 has a notch on the side opposite to the side supporting the display panel 11. When replaced, the housing 22 is thicker on the side opposite to the side supporting the display panel 11 compared to the other parts. It has a thin recess.

[0037] Figures 1(A1) and (A2) show two housings overlapping, with housing 22 positioned on top of housing 21. This indicates the state in which the device is closed (also known as the closed state of the electronic device 10). The display panel 11 is The flexible part bends so that the display surface becomes convex, and the display surface becomes concave. The two curved parts are folded. Also, the display panel The flexible portion of part 11 is the gap formed between the notch of housing 22 and housing 21. It is positioned to be stored inside.

[0038] The ends of the casing 22 are processed so that their surfaces are curved. And the display panel 1 Part 1 is curved so that its display surface is convex, following the curved surface of the casing 22.

[0039] Furthermore, the housing 21 has a portion that is partially thicker near its end and protrudes toward the display surface. Furthermore, that part is processed into a concave shape so that the convex curved part of the display panel 11 fits into it. It has a protruding portion. That is, the protruding portion of the housing 21 is the folded display panel 11. Sometimes, it has the function of protecting the surface of the curved part. Also, when the display panel 11 is extended... The user holds onto the protruding part of the housing 21, and the housing 22 slides, causing the center of gravity to shift. The electronic device 10 can be made easier to hold even if its position changes. The extended portion is a mechanism that stores inside the housing 21 when the display panel 11 is in a flat state. It may have a flat surface. In that case, when the display panel 11 is in a flat state, the display surface side Because it has no protruding parts, it allows for a clean and streamlined design.

[0040] In the state shown in Figures 1(A1) and (A2), the electronic device 10 is the housing 22 of the display panel 11. It can be displayed by the part supported by it.

[0041] From the state shown in Figures 1(A1) and (A2), the housing 21 and housing 22 are slid relative to each other. By doing so, the electronic device 10 can be transformed into the state shown in Figures 1(B1) and (B2). At this time, the hinge 12 slides along the slide rail 13 of the housing 21. This allows the housing 21 and housing 22 to slide relative to each other. (Figure 1(A1), (A 2) The state in which the hinge 12 is located at one end of the slide rail 13 is shown in Figure 1(B1), (B 2) shows the state in which the hinge 12 is located at the other end of the slide rail 13. .

[0042] Furthermore, from the state shown in Figures 1(B1) and (B2), the hinge 12 rotates, The electronic device 10 can be transformed into the states shown in Figures 1(C1) and (C2).

[0043] In the states shown in Figures 1(C1) and (C2), the flexible portion of the display panel 11 becomes flat. The portion of the display panel 11 supported by the housing 21, the portion supported by the housing 22, and the flexible Each display surface of the part possessing properties is located on a single plane. Therefore, In this state, the electronic device 10 can display information across the entire display area of ​​the display panel 11. Cut.

[0044] The electronic device 10 illustrated in Figure 1 is such that the housing 22 slides in the direction of the shorter side of the housing 21. The display area can be expanded. Compared to the folded state of the display panel 11, when opened... The display area can be expanded to about twice its original size. The display area when the Ru11 is folded is such that the aspect ratio is 4:3 or 16:9. In the case of a rectangular shape, widening the display panel 11 will reduce the aspect ratio of the display area. It expands to a vertically elongated shape, such as an application-related window. Displaying multiple images side-by-side horizontally, or displaying multiple images created horizontally arranged vertically. It can be displayed. Therefore, multiple applications can be used without switching screens. Because multiple tasks can be performed simultaneously, convenience is greatly improved. Also, for example, e-books When displaying applications such as books, the aspect ratio is the same as when an actual book is opened. Because it can be brought closer, visibility can be improved.

[0045] Electronic device 10 with this configuration offers excellent portability when the display panel 11 is folded. When the display panel 11 is open, the seamless, wide display area provides a clear overview of the display. It is superior. Therefore, the electronic device 10 is an electronic device that achieves both high display readability and high portability. It is a device.

[0046] [Regarding the relationship between the display panel and the casing] Figures 2(A) and (B) show cross-sections of the display panel 11 in its folded and unfolded states, respectively. A schematic diagram of the surface is shown. The positional relationship between the housing 21 and housing 22 and the display panel 11 is explained. For clarity, housings 21 and 22 are shown with dashed lines.

[0047] The display panel 11 has three parts (part 11a, part 11b, and part 11c). Part 11a is a part fixed to the housing 21, and part 11b is a part fixed to the housing 22. and part 11c is located between part 11a and part 11b and is flexible, These are parts that are not fixed to any of the housings. Each of the three parts contains multiple pixels. It has the ability to display images and the like on the display surface. In Figure 2, to distinguish these, It has a different hatching pattern.

[0048] Here, the portion 11a fixed to the housing 21 in a direction parallel to the sliding direction of the housing. Let the width of the part be width W1. Also, the width of the part 11b fixed to the housing 22 in the same direction is width Let W2 be the width between part 11a and part 11b in the same direction, i.e., part 1 Let the width of 1c be width W3. Here, the width W3 of part 11c is from the end of part 11a to part 1 From the length to the opposite end of 1b (i.e., the width of the display area of ​​the display panel 11), the width W The length is calculated by subtracting 1 and the width W2.

[0049] Furthermore, the height of the gap formed between housing 21 and housing 22 by the notch in housing 22 is Let the height be D. Also, let the radius of curvature of the convex portion of the housing 22 having a convex curved surface be the radius of curvature R.

[0050] The portion 11c of the display panel 11 has a curved shape that follows the convex curved surface of the housing 22. Therefore, the radius of curvature of the protrusion is the smallest radius of curvature that can be bent without damaging the display panel 11. The radius of curvature R should be a value greater than the diameter. For example, the radius of curvature R should preferably be between 0.5 mm and 50 mm. The length is 1 mm to 30 mm, more preferably 1 mm to 20 mm, and even more preferably It can be between 1 mm and 10 mm. The smaller the radius of curvature R, the smaller the electronic device 10 The thickness can be reduced.

[0051] Furthermore, the height D of the gap formed between the housing 21 and the housing 22 is the height of part 1 of the display panel 11. This is the part of 1c that defines the radius of curvature of the section that bends so that the display surface faces inward. Specifically, the radius of curvature on the display surface side of part 11c is half the length of the height D, from the display panel 1 The length is obtained by subtracting the thickness of 1. Therefore, the height D will not damage the display panel 11. It is preferable that the value bendable without bending. For example, the gap height D should be 1 mm or more and 100 mm or more. m or less, preferably 2 mm to 60 mm, more preferably 2 mm to 40 mm, More preferably, the length can be between 2 mm and 20 mm.

[0052] The width W3 of part 11c is preferably greater than the width W1 of part 11a. This includes, at least when the display panel 11 is folded, a portion 11 when viewed from the display surface side. It is preferable to set the width W3 of portion 11c such that a is located inside portion 11c. .

[0053] Furthermore, it is preferable that the width W2 be close to the sum of the widths W1 and W3. Since the width of the body 21 and the housing 22 can be made to be approximately the same, the display panel 11 can be folded. The electronic device 10 in this state can be miniaturized. Alternatively, the width W2 can be made to width W1 and width W3. It may be a value greater than the sum. This allows the electronic device to be in the folded state of the display panel 11. The size of the display area of ​​the device 10 can be increased. Specifically, the width W2 is the sum of the widths W1 and W3. 75% to 200%, preferably 80% to 180%, more preferably 85% It is preferable to set the length to 150% or less of the above.

[0054] Here, by making the width W2 larger than the width W1, the display panel 11 is folded. It is preferable because the size of the display area can be increased. Also, the display panel 11 can be folded. In this state, when viewed from the display surface side, part 11a is positioned inside part 11b, It is preferable to set the width of each. This allows the display panel 11 to be folded. In this state, part 11b covers part 11a, so that part 11a is not visible to the user. This is preferable because it allows for this and also protects part 11a. The width W2 is width W It is greater than 1 times 1 and less than or equal to 10 times, preferably between 1.2 times and 7 times, more preferably It is preferable that the ratio be between 1.5 and 5 times, and more preferably between 2 and 3.5 times.

[0055] Furthermore, the display panel 11 and the housing 21 are not fixed together at the portion 11a that forms part of the display area. Alternatively, it can be configured to be fixed to the enclosure 21 via an FPC or the like. However, in that case, When the display panel 11 is extended, a portion of the display area lifts away from the housing 21, and F Because excessive force may be applied to PCs, etc., potentially causing damage, as described above, The portion 11a forming part of the indicated area and the housing 21 are fixed at the surface where they come into contact. It is preferable.

[0056] [About the sliding mechanism] The following describes an example of a mechanism for changing the relative positions of housing 21 and housing 22. ru.

[0057] Figure 3(A) shows the electronic device 10 when cut along the cutting line B1-B2 in Figure 1(A1). The diagram shows a perspective view of parts of the housing 21, housing 22, and hinge 12. The hinge 12 has two shaft portions (shaft portion 12a and shaft portion 12b).

[0058] Here, as shown in Figure 1(B1), the housing 21 has a movable range for a pair of hinges 12 and There are two recesses in that part. Figure 3(A) shows one of the two recesses. A cross-section is shown. Furthermore, on the side of the recess, there is a strip-shaped recess that forms the slide rail 13. It is provided. The shaft portion 12a fits into the recess of the slide rail 13, and the slide rail It can slide along 13. On the other hand, the housing 22 and the hinge 12 have the shaft portion 12b in the middle. It is rotatably mounted on the heart.

[0059] Next, we will explain the sliding motion using Figures 3(B)-(F). Figure 3(B) is This diagram shows the display panels 11 overlapping, and Figure 3(F) shows the display panels 11 open. The diagrams show the states, and Figures 3(C)-(E) show the states between these in stages. Yes. Electronic device 10 can move between the state shown in Figure 3(B) and the state shown in Figure 3(F). It can be reversibly deformed. Here, Figures 3(B)-(F) show the table for each state. To show the shape of the display panel 11, a dashed line shows a projection of the side of the display panel 11.

[0060] In the state shown in Figure 3(B), the hinge 12 is located at one end of the slide rail 13. From this state, by pulling the housing 22 in the direction of the arrow, the hinge 12 slides out. Slide along the line 13, passing through the state shown in Figure 3(C) to the state shown in Figure 3(D). This is the state in which the hinge 12 is located at the other end of the slide rail 13.

[0061] When sliding the housing 22, the part 11a (notation) of the display panel 11 that is fixed to the housing 21 (The part is not shown in the figure) and the part 11b (the part is not shown in the figure) that is fixed to the housing 22 are Each display surface slides while maintaining a parallel position. Also, the flexibility of the display panel 11 The portion 11c (not shown in the figure) having the position of the part that bends so that the display surface becomes concave The position moves in a direction away from part 11a. That is, within the flexible part 11c The display panel 11 deforms so that the bending part changes. At this time, the display surface of part 11c If the part that bends to become convex does not displace, then the display surface will bend to become concave. The displacement of this part is approximately half the amount of sliding of the housing 22.

[0062] If you pull the housing 22 further in the direction of the arrow from the state shown in Figure 3(D), you will get Figure 3(E). As shown, the hinge 12 rotates around the shaft portion 12a and the shaft portion 12b. At this time, As the rangefinder 12 rotates at the same angle around its two axes, the housings 21 and 22 move. Each of the display panels 11, which is fixed in place, maintains a state in which its display surface is parallel. It moves relatively. Then, after going through the state shown in Figure 3(E), it moves as shown in Figure 3(F). Furthermore, the housings 21 and 22 are constructed so that the flexible portion 11c of the display panel 11 becomes flat. To travel by [this method].

[0063] The state shown in Figure 3(F) is when the display panel 11 is unfolded and flattened. At this time, the display surfaces of parts 11a, 11b, and 11c of the display panel 11 It is preferable that they are located on a single plane.

[0064] When transforming the electronic device 10 from the state shown in Figure 3(F) to the state shown in Figure 3(B): Alternatively, the reverse method described above can be used. For example, from the state shown in Figure 3(F), the housing 22 can be moved diagonally. By applying an upward force, the hinge 12 is rotated, passing through the state shown in Figure 3(E) to Figure 3(D) The state shown in ) is then adjusted, and then the housing 22 is slid in a pushing motion, as shown in Figure 3. The state shown in Figure 3(B) can be reached by going through the state shown in (C).

[0065] In the state shown in Figure 3(D), a part of the flexible portion 11c of the display panel 11 is , it becomes bent along the surface of the protrusion of the housing 22. Furthermore, from Figure 3(D) the housing 22 When you slide it in a pushing motion, the part that comes into contact with the protrusion maintains its shape. The display panel 11 deforms so that the part that bends so that the display surface becomes concave is displaced.

[0066] Here, we have the cross-section of the end portion of the housing 21 that is located on the housing 22 side when the display panel 11 is opened. This shows an example where the shape is an arc shape. As a result, as shown in Figure 3(E), the housing 2 The hinge 12 can be rotated so that 1 and the housing 22 do not physically interfere with (contact with) each other. Yes, it is possible. Note that the cross-sectional shapes of casing 21 and casing 22 are examples only and are not limited to these.

[0067] Figures 4(A) to 4(C) show examples where the end shape of the housing 22 is arc-shaped. Figures 4(D) and 4(E) show an example where the bottom surface of the end of the housing 21 is also arc-shaped. ru.

[0068] Figures 5(A) to (E) show examples where the slide rail 13 is provided on the housing 22. It is showing.

[0069] The side of the housing 22 is provided with a recess that forms the slide rail 13. The shaft portion 12b fits into the recess of the slide rail 13 and slides along the slide rail 13. It can be moved. On the other hand, the housing 21 and the hinge 12 can rotate around the shaft portion 12a. It is installed.

[0070] In the state shown in Figure 5(A), the hinge 12 is located at one end of the slide rail 13. When the housing 22 is pulled from this position, the housing 22 slides relative to the hinge 12, as shown in the figure. After going through state 5(B), it reaches state 5(C) in Figure 5. Furthermore, by pulling the housing 22, the hinge The 12 rotates, passing through the state shown in Figure 5(D) and then reaching the state shown in Figure 5(E). Note that Figure 5(E) To transform the electronic device 10 from the state shown in Figure 5(A) to the state shown in Figure 5(A), use the reverse method described above. That's all you need to do.

[0071] The above describes an electronic device in which the display panel 11 can be folded into three sections. However, by folding it even more, it is possible to create electronic devices that are more portable. Cut.

[0072] Figures 6(A) and (B) show examples of electronic devices that can be folded into five sections. The sub-device has a housing 23 between housings 21 and 22. Furthermore, housings 21 and 23 are connected. It has a hinge 14 that connects the two casings and a hinge 15 that connects the casing 23 and the casing 22. A slide rail 13a is provided on the casing 22, and a slide rail 13b is provided on the housing 22. The shaft portion 14a of the hinge 14 fits into the recess of the slide rail 13a of the housing 21. It can slide. The shaft portion 15b of the hinge 15 is connected to the slide rail 13b of the housing 22. It fits into the recess and can slide. Hinge 14 and hinge 15 each have a shaft portion 14b It is mounted on the housing 23 so as to be rotatable around the shaft portion 15a.

[0073] As shown in Figures 6(A) and (B), housings 23 and 22 are slid in the direction of the arrows. This allows the display panel 11 to be folded into five sections and to be in an open state. Electronic devices can be deformed between states.

[0074] Here, we have shown a configuration in which the display panel 11 can be folded into five sections. The number of folds for the display panel 11 can be increased by increasing the number of enclosures, without any limitations. This is the aspect ratio (ratio of the long side to the short side in a rectangle) when the display panel 11 is opened. If the ratio is large (for example, 16:9 or larger, preferably 2:1 or larger), it can be folded into five or more sections. By creating a configuration that allows for this, portability is improved, especially when the display panel 11 is folded. Therefore, it is preferable. At this time, the thickness of the display panel 1 is greater than the thickness of the electronic equipment when the casings are stacked. It is preferable that the length when 1 is opened is sufficiently large (for example, twice or more, preferably three or more). It seems so.

[0075] In this section, the mechanism by which housing 21 and housing 22 slide is described as the slide rail 1. An example with 3 and hinge 12 has been described, but it is not limited to this and other configurations are possible. It is also possible to provide housing 22 so that it slides in an L-shape relative to housing 21. It is also possible to use a sliding rail and implement a configuration without hinges.

[0076] The above is an explanation of the sliding mechanism.

[0077] [About the locking mechanism] The electronic device 10 has a display panel 11 in a folded state (for example, Figure 1 (A1)) and a display In each state where panel 11 is extended (for example, Figure 1(C1)), housing 2 It is preferable that the unit has a locking mechanism that can fix the relative position of unit 1 and the housing 22. For example, the above sliding mechanism has two or more stable positions with respect to the relative positions of housing 21 and housing 22. It is preferable that it has a mechanism that can be locked in a fixed position and released relatively easily. stomach.

[0078] Figures 7(A1) and (A2) show a mechanism for locking the position of the shaft portion 12a of the hinge 12. A magnified view of a part of the housing 21 is shown. The sliding mechanism is a leaf spring attached to the housing 21. It has a leaf spring 51 and a screw 52. The leaf spring 51 has a protrusion, and this protrusion is on the slide rail 13 It is provided so as to protrude from the passage of the shaft portion 12a.

[0079] As shown in Figure 7(A1), when the convex portion of the leaf spring 51 and the shaft portion 12a come into contact, the leaf spring 51 It curves. And when the shaft portion 12a reaches the end of the slide rail 13, the protrusion of the leaf spring 51 This presses down on a portion of the surface of the shaft portion 12a. As a result, as shown in Figure 7(A2), the shaft portion 12 a is fixed with the end of the slide rail 13 in a stable position. Also, the shaft portion 12a is When a force is applied away from the end of the ride rail 13, the leaf spring 51 lifts up, and the shaft 12a can slide in a direction away from its stable position.

[0080] Also, as shown in Figures 7(B1) and (B2), a part of the housing 21 can be deformed into a spring shape. The structure has a spring portion 53 that has been processed in such a way, and does not use a leaf spring 51 and a screw 52. It is also possible to do so.

[0081] Figures 8(A1) and (A2) show a hinge 12 on the other end of the slide rail 13 of the housing 21. This example shows a mechanism that locks both the position and angle.

[0082] A notch 54 is provided in the shaft portion 12a. From the state shown in Figure 8(A1), the shaft portion 12 As a rotates, the protrusion of the leaf spring 51 fits into the notch 54, as shown in Figure 8(A2). This allows the end of the slide rail 13 to be in a stable position, and the position and rotation of the shaft portion 12a to be controlled. The angle of rotation is fixed. Conversely, when the shaft 12a rotates from the state shown in Figure 8(A2), the plate Because the spring 51 is lifted, the shaft portion 12a slides away from the stable position. can.

[0083] Furthermore, Figure 8(B) shows the case where a spring portion 53 is provided instead of the leaf spring 51 and screw 52. An example is shown.

[0084] Here, we have shown an example in which a locking mechanism is provided on the housing 21, but as shown in Figure 5(A), etc. If a slide rail 13 is provided on the housing 22, a similar configuration should be provided on the housing 22. It is possible.

[0085] Furthermore, the housing on the side where the slide rail 13 is not provided has a lock for the rotation of the hinge 12. It is preferable to have a locking mechanism. Figure 8(C) shows the rotation angle of the shaft portion 12b. An example is shown of a case where a locking mechanism capable of locking only the part in a stable position is provided on the housing 22. The shaft portion 12b has two notches 54 spaced at a 90-degree angle. Therefore, the hinge 12 can be locked in two stable positions. There are two notches 54. It is not limited to this, and may be one or three or more. Furthermore, as shown in Figure 5(A), etc., the enclosure If a slide rail 13 is provided on 22, a similar configuration should be provided on the housing 21. It is possible.

[0086] The above describes a locking mechanism for fixing the position, angle, or both of the hinge shafts of the hinge 12. Although this is just one example, any mechanism that can lock the relative positions of housing 21 and housing 22 can be used for various applications. A structure can be used. For example, the part of the hinge 12 other than the shaft part and the housing 21 or housing 22 A locking mechanism may be provided between them, or a locking mechanism may be provided between housing 21 and housing 22. They may also be provided. For example, a hook-shaped member may be provided on one of the housings 21 and 22. The relative position of housing 21 and housing 22 with the display panel 11 folded (for example, Figure 1(A1)) The configuration may also include a locking mechanism for the position. Additionally, the housing 21 or housing 22 may have a mechanism for unlocking. A button or switch may be provided for this purpose.

[0087] The above is an explanation of the locking mechanism.

[0088] [Differentiation] The following describes an example configuration of electronic device 10, which differs in some aspects from the above.

[0089] Figure 9(A) shows a schematic cross-sectional view of the electronic device 10 in the folded state of the display panel 11. As shown in Figure 9(A), the flexible portion 11c of the display panel 11 has two curved The portion located between the portions extends diagonally rather than parallel to portion 11a and portion 11b. More specifically, the part of the display surface of section 11c that is curved so that it is convex, and the display The parts that are curved to form a concave shape are each curved at an angle of less than 180 degrees. This configuration allows the housing 21 and housing 22 to slide together to close them. Sometimes, the direction of the force pulling on part 11c of the display panel 11 can be made to be diagonally upward. This makes it possible to deform part 11c more easily compared to the case shown in Figure 2(A). It is possible.

[0090] Figure 9(B) shows that the display surface of part 11c of the display panel 11 is curved so that it is convex. The part that is curved and the part that is curved so that the display surface is concave both exceed 180 degrees. This shows an example where it is bent at an angle. With this configuration, Figure 2(A) Compared to the case shown, the radii of curvature of the two curved parts in section 11c are increased. This allows the stress on the curved portion of part 11c of the display panel 11 to be To reduce this, highly reliable electronic devices can be made. Also, in the case shown in Figure 2(A) If section 11c is bent with the same radius of curvature as the whole, the thickness of the housing 22 can be reduced. ru.

[0091] Figure 9(C1) shows an example where both the housing 21 and the housing 22 are curved. It is there. Figure 9(C2) also shows a schematic cross-sectional view of the display panel 11 in an extended state.

[0092] The display panel 11 is curved to conform to the surface shape of the respective housings 21 and 22. It is curved in a concave shape in this way, so the central part and the edges of the display area are different. This allows for a reduction in the distance from the user's viewpoint to the display surface (also called the viewing distance). This allows for a greater sense of immersion and enables a display that provides users with a more realistic experience. .

[0093] Thus, because the casing is curved, for example, the electronic device 10 can be placed in a pants pocket. When stored in such a way, it conforms to the surface of the user's body, making it difficult for the user to move. This can prevent that from happening.

[0094] Note that in Figures 9(C1) and (C2), the display surface is concave, and the housings 21 and 22 Although it showed a curved shape, the housings 21 and 22 were bent so that the display surface became convex. The shape may also be acceptable. For example, if it is a wearable information terminal such as a wristwatch, the housing 21 Furthermore, since the housing 22 can be attached so as to conform to the curved surface of the body, such as the arm, the user can wear it comfortably. You can get a good fit.

[0095] Figures 10(A) to (C) show an electronic device 1 in which the housing 22 slides along the long side of the housing 21. An example of 0 is shown. In this case, the display panel 11 is in the open state as shown in Figure 10(C). Then, you can display a larger aspect ratio. For example, related to the application This includes displaying multiple vertically oriented images in a vertically oriented window, or displaying them horizontally. Multiple images created can be displayed side-by-side horizontally. Therefore, switching screens... It allows you to work with multiple applications simultaneously without any hassle, making it more convenient. Performance is improved. Also, for example, by using the display panel 11 with its long side oriented horizontally, When viewing widescreen images such as movies or panoramic photos, display them without scaling down. This is possible. Also, by using the display panel 11 with its longer side oriented vertically, horizontal writing is possible. When displaying text or other content, it is possible to display more lines than before without shrinking them. ru.

[0096] The above is an explanation of the variations.

[0097] [Example of electronic device configuration] The following describes examples of hardware configurations provided in each enclosure of the electronic device 10. .

[0098] Figure 11 is a block diagram showing an example configuration of the electronic device 10.

[0099] In the drawings attached to this specification, the components are classified by function and shown as independent of each other. Although a block diagram is shown as a lock, the actual components are completely separated by function. This can be difficult, and a single component may be involved in multiple functions.

[0100] Furthermore, the configuration of the electronic device 10 illustrated in Figure 11 is just one example, and it is not necessary to include all components. There is no need for it. The electronic device 10 is sufficient if it has the necessary components among the components shown in Figure 11. Furthermore, it may have components other than those shown in Figure 11.

[0101] The electronic device 10 has a housing 21, a housing 22, and a touch panel 63. 63 is positioned transversely between the casing 21 and the casing 22.

[0102] The enclosure 21 includes a processing unit (CPU) 61, a storage device 64, a display controller 71, Touch sensor controller 72, battery controller 73, power receiving unit 74, battery Module 75, sound controller 76, communication module 81, attitude detection unit 83, shape It has a shape detection unit 84, an external interface 85, a vibration module 87, a sensor 88, etc. The housing 22 includes an audio input unit 77, an audio output unit 78, an antenna 82, and a camera module 86. It has the following characteristics.

[0103] Storage device 64, display controller 71, touch sensor controller 72, battery Terry controller 73, sound controller 76, communication module 81, attitude detection unit 83, Shape detection unit 84, External interface 85, Camera module 86, Vibration module The wire 87, sensor 88, etc., are each connected to the calculation unit 61 via the bus line 62. ru.

[0104] The touch panel 63 corresponds to the display panel 11. That is, the touch panel 63 is , a part fixed to housing 21, a part fixed to housing 22, and a flexible part, It also has parts that are not fixed to the casing.

[0105] The arithmetic unit 61 is, for example, a central processing unit (CPU). It can function as a unit. The arithmetic unit 61 can, for example, store memory 64, disk Spray controller 71, touch sensor controller 72, battery controller 7 3. Sound controller 76, communication module 81, attitude detection unit 83, shape detection unit 84 External interface 85, camera module 86, vibration module 87, sensor 88 It has the function of controlling components such as those listed above.

[0106] Signals are transmitted between the arithmetic unit 61 and each component via the bus line 62. The arithmetic unit 61 receives signals from each component connected via the bus line 62. It has functions to process and generate signals to output to each component, etc. Each component connected to IN62 can be controlled comprehensively.

[0107] Furthermore, oxidation may occur in the channel formation region of the arithmetic unit 61 or other components such as ICs. It is also possible to use transistors that utilize solid semiconductors and achieve extremely low off-current. Because the transistor has an extremely low off-current, it can be used as a memory element. To be used as a switch to hold the charge (data) that has flowed into a functional capacitive element. This ensures that the data retention period can be extended over a long period. This characteristic is utilized by the calculation unit 61. By using it for the zista and cache memory, the arithmetic unit 61 is operated only when necessary, and other In some cases, the information from the previous processing is saved to the memory element, which is how normally off-the-shelf computers are managed. This enables computing, which can help reduce the power consumption of the electronic device 10.

[0108] The arithmetic unit 61 interprets and executes instructions from various programs by the processor. It performs various data processing and program control. The programs that can be executed by the processor are It may be stored in the memory area of ​​the processor, or it may be stored in the storage device 64. It's okay to be there.

[0109] In addition to the CPU, the arithmetic unit 61 also includes a DSP (Digital Signal Processor). Other than cessors, GPUs (Graphics Processing Units), etc. These microprocessors can be used individually or in combination. Microprocessor is FPGA (Field Programmable Gate Ar ray) and FPAA (Field Programmable Analog Arra) y) is a PLD (Programmable Logic Device) This configuration could also be considered a viable option.

[0110] The arithmetic unit 61 may have main memory. The main memory is RAM (Random volatile memory such as m Access Memory, and ROM (Read-Only Memory). The configuration can include non-volatile memory such as (y Memory).

[0111] Examples of RAM provided in main memory include DRAM (Dynamic Random-Accessed RAM). (DOM Access Memory) is used, and a virtual workspace is used for the arithmetic unit 61. Memory space is allocated and used. The operating system stored in storage device 64 The system, application programs, program modules, program data, etc. These data and programs loaded into RAM are then loaded into RAM for execution. The program module is directly accessed and operated by the calculation unit 61. From the data input from the output unit 83, the shape detection unit 84, the sensor 88, etc., the position of the electronic device 10 Characteristic data for calculating placement and orientation, as well as the relative positional relationship of each enclosure, etc., is available in the Look It is read from storage device 64 as an up table and stored in main memory. stomach.

[0112] On the other hand, ROM does not require rewriting of the BIOS (Basic Input / Output). It can store the system (put System) and firmware, etc. As ROM, Mask ROM and OTPROM (One Time Programmable ROM) d Only Memory), EPROM (Erasable Programmable EPROM can be used (e.g., Read Only Memory). This is a UV-EPROM (Ultra-V) that allows for the erasure of stored data by ultraviolet irradiation. iolet Erasable Programmable Read Only Me mory), EEPROM (Electrically Erasable Program Examples include ammable read-only memory (AMMable Memory) and flash memory. It can be done.

[0113] For example, the storage device 64 could be flash memory, MRAM (Magnetores istive Random Access Memory), PRAM (Phase change RAM), ReRAM (Resistance RAM), FeRAM ( Memory devices using non-volatile memory elements such as Ferroelectric RAM. , or DRAM (Dynamic RAM) or SRAM (Static RAM), etc. A storage device or the like using a volatile memory element may also be used. For example, a hard disk Hard Disk Drive (HDD) and Solid State Drive (S You can also use a storage media drive such as an SSD. stomach.

[0114] Furthermore, an HDD or SS can be attached and detached via a connector through the external interface 85. Storage devices such as D, and recording media such as flash memory, Blu-ray discs, and DVDs. The media drive can also be used as the storage device 64. A storage device that is not built into the device 10 but is located outside the electronic device 10 is used as the storage device 64. It is also possible that the communication module is connected via the external interface 85. Therefore, a configuration in which data is exchanged wirelessly is also possible.

[0115] The touch panel 63 includes a display controller 71 and a touch sensor controller 7 It is connected to 2. Display controller 71 and touch sensor controller 72 Each of these is connected to the arithmetic unit 61 via the bus line 62.

[0116] The display controller 71 receives input from the arithmetic unit 61 via the bus line 62. In response to drawing instructions, the touch panel 63 is controlled to display a predetermined image on the display surface of the touch panel 63. Display it.

[0117] The touch sensor controller 72 responds to requests from the arithmetic unit 61 via the bus line 62. This controls the touch sensor of the touch panel 63. It also controls the signal received by the touch sensor. The signal received by the touch sensor is output to the arithmetic unit 61 via the bus line 62. The touch sensor controller 72 may also have a function to calculate information about the touch position. Alternatively, it may be calculated by the calculation unit 61.

[0118] The touch panel 63 operates based on signals supplied from the display controller 71. Images can be displayed. Also, the touch panel 63 is connected to the touch sensor controller 72. Based on the supplied signals, the system detects when a detected object, such as a finger or stylus, approaches or comes into contact with it. It can detect this action and output its position information to the touch sensor controller 72. ru.

[0119] Furthermore, the touch panel 63 and the touch sensor controller 72 detect the object to be detected from their detection surfaces. It is preferable to have a function to acquire the height distance up to the object being detected. It is preferable that the system has a function to acquire the magnitude of the pressure applied to the surface. It is preferable that the system has a function to obtain the size of the surface in contact with the protruding surface.

[0120] The touch panel 63 has a module equipped with a touch sensor superimposed on the display surface side of the display panel. The configuration can be such that a module equipped with a touch sensor is provided. It is preferable that at least a portion of it is flexible and can be bent along the display panel. The module equipped with the touch sensor and the display panel can be bonded together with adhesive or similar. A polarizing plate or buffer material (separator) may also be placed between these. The thickness of the module is preferably less than or equal to the thickness of the display panel.

[0121] Even if the touch panel 63 is a touch panel in which the display panel and touch sensor are integrated Good. For example, an on-cell type touch panel or an in-cell type touch panel. It is preferable that on-cell or in-cell touch panels be thin and lightweight. Furthermore, on-cell or in-cell touch panels can reduce the number of components. Therefore, costs can be reduced.

[0122] The touch sensor of the touch panel 63 detects when an object to be detected, such as a finger, approaches or touches it. Various sensors can be applied to detect touch. For example, capacitive type, resistive type, Sensors employing methods such as surface acoustic wave, infrared, and optical methods can be used. In addition, there are optical sensors using photoelectric conversion elements, pressure sensors using pressure-sensitive elements, etc. You may also use [this method]. You may also have two or more different types of sensors, or the same type of sensor. It may have two or more sensors.

[0123] For example, a capacitive touch sensor has a pair of conductive layers. Between the pair of conductive layers Capacitance coupling occurs. Detection can be performed by touching or approaching a detection target to a pair of conductive layers, which causes a change in the capacitance between the pair of conductive layers.

[0124] As the capacitance method, there are a surface capacitance method, a projection capacitance method, etc. As the projection capacitance method, mainly due to the difference in the driving method, there are a self-capacitance method, a mutual-capacitance method, etc. Using the mutual-capacitance method is preferable because simultaneous multi-point detection is easy.

[0125] Alternatively, instead of the touch panel 63, a display panel that does not have the function as a touch sensor may be applied. Even in that case, the一览性 of the display can be improved by expanding the display panel.

[0126] As the touch panel 63, display panel, touch sensor, etc. having flexibility, for example, a flexible substrate can be used to support a display element, a circuit for driving the same, or a circuit for constituting the touch sensor.

[0127] Typically, an organic resin can be used as the material of the flexible substrate. In addition, glass, metal, alloy, semiconductor, etc. that are thin enough to have flexibility can be used. Alternatively, a composite material or a laminated material containing two or more of organic resin, glass, metal, alloy, semiconductor, etc. can be used.

[0128] Examples of the display element included in the touch panel 63 include OLED (Organic Light t Emitting Diode), LED (Light Emitting Dio de), QLED (Quantum-dot Light Emitting Diod e) Self-luminous light-emitting elements such as can be used. Alternatively, transmissive, reflective, or Semitransparent liquid crystal elements may also be used. In addition, for example, MEMS (Microelectronic Systems) may be used. ctro Mechanical Systems) elements, electron emission elements, and other display elements A display device using a child can be used. As a display element using MEMS, shutter Examples include MEMS display elements using the ter method and MEMS display elements using the optical interference method. Carbon nanotubes may be used as the output element. Alternatively, electronic paper may be used. Good. As for electronic paper, there are microcapsule methods, electrophoresis methods, and electrowet methods. Elements employing methods such as the ting method or the electronic powder fluid (registered trademark) method can be used.

[0129] The battery controller 73 manages the charge state of the battery module 75. This is possible. Furthermore, the battery controller 73 receives power from the battery module 75. It supplies power to each component. The power receiving unit 74 receives power supplied from the outside and the battery It has the function of charging the Lee module 75. The battery controller 73 controls the battery - The operation of the power receiving unit 74 can be controlled according to the charging state of module 75.

[0130] The battery module 75 has, for example, one or more primary and secondary batteries. For example, lithium-ion batteries can be used in the Lee Module 75. Examples include ponds and lithium-ion polymer rechargeable batteries. Also, battery modules. In addition to these batteries, the 75 is equipped with a protection circuit to prevent overcharging and over-discharging of the battery. It's okay if it's done that way.

[0131] When used indoors, an AC power source may be used as the external power source. When using the electronic device 10 disconnected from an external power source, the charge / discharge capacity is large and it can be used for a long time. A battery module 75 that enables the use of electronic devices 10 is desirable. When charging the Lee Module 75, use a charger capable of supplying power to the electronic device 10. It is acceptable to do so. In this case, charge using a wired method such as a USB connector or AC adapter. Alternatively, wireless power transfer methods such as electric field coupling, electromagnetic induction, and electromagnetic resonance (electromagnetic resonant coupling) are also available. The system may also be configured to perform charging using a specific method.

[0132] The battery controller 73 includes, for example, a battery management unit (BMU). It is permissible. The BMU collects battery cell voltage and cell temperature data, and detects overcharging and over-discharging. Monitoring, cell balancer control, battery degradation status management, battery level (State of Charge) It performs calculations of rge (SOC) and controls fault detection.

[0133] The battery controller 73 receives the battery module 75 from the bus line 62 and its It controls the transmission of power to each component via other power supply lines. The Terry controller 73 is used, for example, in multi-channel power converters and inverters, and protection circuits. It can be configured to include roads, etc.

[0134] The battery module 75 is preferably arranged in a configuration that overlaps it with the touch panel 63. It seems so. At this time, the housing (in this case, housing 21) into which the battery module 75 is incorporated. If the battery module is flexible and can be bent for use, At least a part of the rule 75 is also preferably flexible. Battery module Examples of the secondary battery applicable to the rule 75 include, for example, a lithium-ion secondary battery and a lithium-ion polymer secondary battery. Further, in order to make these batteries flexible, the outer container of the battery may use a laminated bag.

[0135] The film used for the laminated bag is a single-layer film selected from a metal film (such as aluminum, stainless steel, nickel steel, etc.), a plastic film made of an organic material, a hybrid material film containing an organic material (such as an organic resin and fiber) and an inorganic material (such as ceramic), and a carbon-containing inorganic film (such as a carbon film and a graphite film), or a laminated film composed of a plurality of these. The metal film is easy to emboss, and when embossing is performed to form concave or convex portions, the surface area of the film exposed to the outside air increases , so it has an excellent heat dissipation effect.

[0136] Particularly, as the laminated bag, using a laminated bag having a metal film with concave and convex portions formed by embossing can relieve the strain generated by the stress applied to the laminated bag. As a result, when the secondary battery is bent, problems such as the laminated bag being torn can be effectively reduced, which is preferable.

[0137] Further, the battery controller 73 preferably has a low power consumption function. For example, as the low power consumption function, it detects that there is no input to the electronic device 10 for a certain period of time, and lowers the clock frequency of the arithmetic unit 61 or stops the input of the clock, and the arithmetic unit 61 itself To stop the body's movements, to stop the operation of auxiliary memory, to supply each component Examples include reducing power consumption by decreasing the amount of power supplied. This can be performed by the battery controller 73 alone, or in conjunction with the arithmetic unit 61. It is possible.

[0138] The audio input section 77 includes, for example, a microphone or an audio input connector. It also has an audio output Section 78 includes, for example, a speaker and an audio output connector. Audio input section 77 and audio output section Each of the 78s is connected to the sound controller 76, and via the bus line 62 to the processing unit 6 Connect to 1. Audio data input to the audio input unit 77 is sent to the sound controller 76. The signal is converted to a digital signal and processed by the sound controller 76 and the arithmetic unit 61. Meanwhile, the sound controller 76 responds to commands from the arithmetic unit 61, allowing the user to... It generates an analog audio signal and outputs it to the audio output unit 78. The audio output unit 78 has the sound Connect an audio output device such as earphones, headphones, or a headset to the audio output connector. It is possible, and the sound generated by the sound controller 76 is output to the device.

[0139] The communication module 81 can communicate via the antenna 82. For example, the arithmetic unit Control for connecting electronic device 10 to a computer network in response to instructions from 61 It controls the signal and transmits that signal to the computer network. This allows Wor The Internet, intranet, and internet are the foundation of the Wide Web (WWW). Stranet, PAN (Personal Area Network), LAN (Lo cal Area Network), CAN(Campus Area Network) k), MAN (Metropolitan Area Network), WAN (Wi Global Area Network), GAN (Global Area Network) The electronic device 10 can be connected to a computer network such as ) and communicate with it. Furthermore, if multiple communication methods are used, the antenna 82 will be configured according to the respective communication method. You may have multiple of them.

[0140] The communication module 81 is equipped with, for example, a high-frequency circuit (RF circuit) to transmit and receive RF signals. It should be done. High-frequency circuits use electromagnetic and electrical signals within the frequency band defined by the laws of each country. To convert between and and use the electromagnetic signal to communicate wirelessly with other communication devices. It is a circuit. A practical frequency range of several tens of kHz to several tens of GHz is generally used. The high-frequency circuit connected to antenna 82 has high-frequency circuits that support multiple frequency bands. It has a path section, and the high-frequency circuit section includes an amplifier, mixer, filter, DSP, and RF transistor. It can be configured to include an interceptor, etc. When performing wireless communication, a communication protocol or Communication technologies include LTE (Long Term Evolution) and GSM (Globe Evolution). bal System for Mobile Processing: Registered Trademark ), EDGE(Enhanced Data Rates for GSM Evolu tion), CDMA2000 (Code Division Multiple Ac cess 2000), W-CDMA (Wideband Code Division Communication standards such as Multiple Access (registered trademark), or Wi-Fi (W iReless Fidelity (registered trademark), Bluetooth (registered trademark), Z IEEE-standardized specifications such as igBee® can be used. .

[0141] Furthermore, even if the communication module 81 has the function of connecting the electronic device 10 to a telephone line, Good. When making a call via a telephone line, the communication module 81 receives information from the arithmetic unit 61. In response to a command, the system controls the connection signal for connecting the electronic device 10 to the telephone line, and the signal Make a call to the telephone line.

[0142] The communication module 81 receives broadcast radio waves from the antenna 82 and then transmits the information to the touch panel 63 It may have a tuner that generates a video signal to be output. For example, the tuner may have a It includes a tuning circuit, an AD conversion circuit (analog-to-digital conversion circuit), a decoder circuit, and the like. The configuration can be as follows. The demodulation circuit has the function of demodulating the signal input from antenna 82. The AD conversion circuit also has the function of converting the demodulated analog signal into a digital signal. It has. The decoder circuit decodes the video data contained in the digital signal and displays It has the function of generating a signal to be sent to the play controller 71.

[0143] The decoder may also be configured to have a splitter circuit and multiple processors. It has the function of spatially and temporally dividing the input video data and outputting it to each processor. Multiple processors decode the input video data and control the display. It generates a signal to send to the -ra 71. In this way, as a decoder, it uses multiple processors. By applying a configuration that processes data in parallel, extremely information-rich video data can be processed in parallel. It can be used to display video with a resolution exceeding Full HD. In this case, the decoder circuit that decodes the compressed data has extremely high processing power. It is preferable to have a processor. Furthermore, for example, it is preferable to have 4 or more decoder circuits. A configuration including multiple processors capable of parallel processing of 8 or more, more preferably 16 or more. It is preferable to do so. The decoder also processes the video signal included in the input signal and It may also have a circuit to separate signals other than the specified one (such as text information, program information, authentication information, etc.).

[0144] The broadcast signals that can be received by antenna 82 include those transmitted from terrestrial or satellite sources. Radio waves are one example. In addition, analog broadcast radio waves can be received by antenna 82. This includes transmission, digital broadcasting, and broadcasts with both video and audio, or audio only. (Example) For example, the UHF band (approximately 300MHz to 3GHz) or the VHF band (30MHz to 300MHz) It can receive broadcast radio waves transmitted in a specific frequency band among those. By using multiple data received across multiple frequency bands, the transfer rate can be increased. This allows for obtaining more information. This enables resolutions exceeding Full HD. Images with a certain resolution can be displayed on the touch panel 63. For example, 4K-2K, It is possible to display video with a resolution of 8K-4K, 16K-8K, or higher. Cut.

[0145] Furthermore, the tuner transmits data via computer network data transmission technology. This configuration generates a signal to be transmitted to the display controller 71 using the broadcast data. This is also acceptable. In this case, if the received signal is a digital signal, the tuner will demodulate the signal. It does not need to have a path or AD conversion circuit.

[0146] The attitude detection unit 83 has the function of detecting the tilt and attitude of the electronic device 10. For example, attitude The detection unit 83 includes an acceleration sensor, an angular velocity sensor, a vibration sensor, a pressure sensor, and a gyroscope. Sensors and the like can be used. Multiple sensors may also be used in combination. .

[0147] The shape detection unit 84 detects the relative positional relationship between the housing 21 and the housing 22 and calculates that information. The unit 61 has a function to output via the bus line 62.

[0148] For example, the shape detection unit 84 may have a sensor similar to the attitude detection unit 83 placed on the housing 22. This configuration can be achieved. The tilt and orientation information of the housing 22 acquired by the shape detection unit 84 is When input is received by the calculation unit 61 via the bus line 62, the calculation unit 61 is determined by the attitude detection unit 83. Based on the detected tilt and orientation information of housing 21 and housing 22, housing 21 and The relative positional relationship of the enclosure 22 can be calculated.

[0149] Alternatively, the shape detection unit 84 may detect the rotation angle of the hinge 12 as exemplified in the above configuration example. This configuration allows for the detection of the relative positions of the two housings connected by the hinge 12. i. At this time, the rotation angle of the hinge with respect to each axis of rotation is determined mechanically, optically, magnetically, or electrically It can be configured to detect targets.

[0150] Alternatively, a flexible member can be provided to connect two adjacent housings, and a sensor can be used to detect this curved shape. Sa can be used. In this case, the flexible member can be a touch panel 63 or a tap Protective members or the like may be used to protect the panel 63. As a sensor for detecting the curved shape For example, using multiple acceleration sensors arranged on the flexible member, the position of each sensor The shape may be calculated by the calculation unit 61 based on the change in acceleration at the location. This configuration uses a sensor that includes a piezoelectric element placed on a flexible member to detect bending. Alternatively, bending it can alter its physical properties (resistivity, thermal conductivity, transmittance, etc.). By incorporating a changing sensor into a flexible material, the shape can be determined from the changes in its physical properties. You may calculate the status.

[0151] Furthermore, the shape detection unit 84 can detect two states: when the two housings are closed and when they are open. It may have a function to detect the state. For example, an example of an optical detection method is adjacent A light-receiving element is placed in one of the two housings, and when these are closed, external light is blocked. The system may be configured to detect by utilizing this. Alternatively, the front of one of two adjacent enclosures By placing a light-receiving element on one surface and a light source on the other surface, these can be closed or When either of the open positions is light from the light source incident on the light-receiving element, or is incident on the light-receiving element. A configuration that utilizes the disappearance of light for detection is also possible. In this case, infrared light is used as the light source. Using this method is preferable because it is not visible to the user.

[0152] Note that the configuration of the shape detection unit 84 is not limited to this, and the relative positional relationship of two adjacent housings may also be considered. Any means capable of detecting the relationship, including mechanical, electromagnetic, thermal, acoustic, and chemical means. Various sensors that utilize this technology can be used.

[0153] The external interface 85 is, for example, one provided on the housing 21 or housing 22. The above buttons, switches (also called enclosure switches), and other input components are connected. Possible external ports include the external interface 85 via the bus line 62. It is then connected to the arithmetic unit 61. The enclosure switch is associated with turning the power on / off. It has switches, volume control buttons, a camera button, and more.

[0154] Furthermore, the external ports on the external interface 85 include, for example, a computer or a PC. It can be configured to connect to external devices such as a linter via a cable. It has USB (Universal Serial Bus) terminals, etc. Also, external Ports include a terminal for LAN (Local Area Network) connection, and digital It may also have terminals for receiving broadcasts, terminals for connecting an AC adapter, etc. Furthermore, it may only be wired. Alternatively, a configuration that includes transceivers for optical communication using infrared, visible light, ultraviolet light, etc. good.

[0155] The camera module 86 is connected to the arithmetic unit 61 via the bus line 62. For example, the housing When a switch on the body is pressed, or when a touch operation is performed on the touch panel 63, It can capture still images or videos. The camera module 86 also emits light for shooting. It may have a power source. For example, lamps such as xenon lamps, and light sources such as LEDs and organic ELs. Optical elements, etc., can be used. Alternatively, the touch panel 63 can emit light as a light source for photography. You may also use light, and in that case, you can use not only white light but also light of various colors as the light source for photography. It may also be used in this way.

[0156] The vibration module 87 includes a vibration element that vibrates the electronic device 10, and a control element that controls the vibration element. It has a motion controller and a vibration element, a vibration motor (eccentric motor), and a resonant action. Tuners, magnetostrictive elements, piezoelectric elements, etc., which can convert electrical signals and magnetic signals into vibrations. A component can be used.

[0157] The vibration module 87, in response to instructions from the calculation unit 61, determines the vibration frequency and vibration of the vibration element. By controlling the width, duration of vibration, etc., the electronic device 10 can be vibrated in various vibration patterns. This can be done. For example, vibrations linked to the operation of a housing switch, etc., electronic device 1 Vibration synchronized with the startup of 0, and synchronized with videos and audio played by video playback applications. Vibration, vibration linked to incoming email, vibration linked to input operation on the touch panel 63 Vibration patterns based on various actions performed in various applications, such as motion control. The vibration can be generated by the vibration module 87.

[0158] Furthermore, it is preferable that the vibration module 87 has a configuration having multiple vibration elements. By combining vibrations from the above-mentioned vibration elements, various vibration patterns can be generated. This makes it possible to provide users with various kinds of information. For example, each vibration element By controlling the frequency, amplitude, vibration pattern, timing, etc., the vibrating element can be controlled in a single field It can express a wider variety of vibrations compared to a single unit. When arranging multiple vibration elements, Multiple identical elements may be arranged at intervals, or multiple types of vibrating elements with different natural frequencies may be used. That's fine.

[0159] Furthermore, vibrations (elastic waves) from two or more vibration elements placed at a distance from each other are transmitted to the electronic device 10. By causing interference on the surface, the strength of the vibration varies depending on the position on the surface of the housing. It is preferable that the vibration module 87 has a function to drive the device 10 to vibrate. At this time, at least a portion of the surface of the electronic device 10 is capable of transmitting elastic waves. It is preferable to use an elastic material. This provides a novel tactile feedback unlike anything before. It can be provided to users. The intensity of the vibration can be varied depending on the location, for example, When the device touches the user, it allows the user to feel the uneven surface and the difference in frictional resistance. This makes it possible to, for example, have the image displayed on the touch panel 63 and By linking them together, it is possible to express the texture of the displayed object. Also, for example, electronic device 1 By representing letters and Braille shapes in relief on the surface of the 0, users can access textual information by touching it. It also becomes possible to obtain such things.

[0160] For example, Figure 12(A) shows two vibrating elements inside the housing 21 of the electronic device 10 (vibrating elements) 91a, 91b) are provided, and a sheet-like elastic body 9 is provided on the surface of the housing 21 opposite to the display surface. An example having 2 is shown. In this case, the elastic body 92 has the function of a touch sensor. This is preferable. Also, Figure 12(B) shows two vibration elements (vibration element 9) inside the housing 21. 1a, vibration element 91b), and two vibration elements (vibration elements 91c, 91d) inside the housing 22 This shows an example having ). If the entire display panel 11 is flexible, the display panel It is also possible to make L11 function as the elastic body described above.

[0161] Furthermore, the electronic device 10 is vibrated by the vibration module 87, and By bringing various objects that transmit vibrations, such as cables and walls, into contact with the object, sound is emitted from that object. It may also function as a vibration generator. For example, in music playback applications. In conjunction with the above, the electronic device 10 vibrates with vibrations corresponding to the music being played. The object that touches the electronic device 10 can be used as a speaker. For example, Figure 12(C) Due to the vibration of the electronic device 10 placed on the table 95, sound 96 is emitted from the table 95. This shows an example of when such a statement is being made.

[0162] Sensor 88 comprises a sensor and a sensor controller. The sensor controller is a The sensor unit is supplied with power from the battery module 75, etc. Also, the sensor control The sensor unit receives input from the sensor unit, converts it into a control signal, and transmits it via bus line 62. Output to calculation unit 61. The sensor controller performs error management for the sensor unit. Alternatively, the sensor unit may be calibrated. Note that the sensor controller is The system may also be configured to include multiple controllers for controlling the sensor unit.

[0163] Sensor 88 can measure, for example, force, displacement, position, velocity, acceleration, angular velocity, rotational speed, distance, light, and liquid. Magnetism, temperature, chemicals, sound, time, hardness, electric field, electric current, voltage, power, radiation, flow rate, A configuration that includes various sensors capable of measuring humidity, gradient, vibration, odor, or infrared radiation. That is also acceptable.

[0164] Here, it is preferable that both housing 21 and housing 22 have battery modules. This reduces the frequency of charging the electronic device 10. Also, the housing 2 By separating the battery modules into 1 and the housing 22, the thickness of the housing 21 can be reduced. It is possible to reduce the thickness, making the two chassis the same, resulting in a cleaner design. It can be done as follows.

[0165] In Figure 13, the battery module 75a is provided in the housing 21, and the battery is located in the housing 22. - This shows an example where module 75b is provided. Battery located in a different enclosure. Modules 75a and 75b of the battery module connect to the battery controller 73. The power received by the power receiving unit 74 can be supplied via this configuration. Alternatively, as shown in the figure... Power is supplied directly from the power receiving unit 74 to the battery module 75b via the power supply line. This is also fine. In addition, the power receiving unit 74 and the battery controller 73 are located in both the housing 21 and the housing 22. It may be provided in [location].

[0166] One method for transmitting power and signals between two enclosures is to use an FPC (Flexible Printed Circuit) that traverses the enclosure. This could be one example. Alternatively, the two enclosures can maintain an electrical connection regardless of their relative positions. It may have a dangling terminal, or wiring for transmitting signals or power may pass through the inside of the hinge. The configuration may extend within two adjacent enclosures. Alternatively, the display of the touch panel 63 An FPC (flexible printed circuit) may be attached to the opposite side of the enclosure, traversing the two sides. Or, two The system may also be configured to transmit power and signals wirelessly between enclosures.

[0167] Note that in Figures 11 and 13, the audio input unit 77, the audio output unit 78, the antenna 82, and the cable are shown. An example was shown in which the Mera module 86 is installed in the housing 22, but these are installed in the housing 21. It may be provided on both housing 21 and housing 22. Each component provided in 1 may also be provided in the housing 22, or housing 2 It may be provided on both 1 and the housing 22.

[0168] The above is an explanation of an example of an electronic device configuration.

[0169] [Application Examples] One aspect of the present invention can also be used as a wearable electronic device. Cut.

[0170] Figure 14 shows an example of a wristwatch-type wearable device equipped with an electronic device 10. The wearable device shown in 4 includes an electronic device 10, bands 45 and 46, etc. Band 45 has a fastener, and band 46 has multiple holes that engage with the fastener. The wearable device can be attached to the arm or other body parts using two bands. The form of the lent is not limited to this, and various other forms can be used.

[0171] Furthermore, since the display panel 11 has the functionality of a touch panel, the display area can be touched. This allows you to operate the electronic device 10.

[0172] Furthermore, Figure 14 shows an example in which the housing 21 of the electronic device 10 has housing buttons 47 on its side. It shows that the input actions using the casing button 47 are: touch, press, rotate, pull. Apply operations such as twisting, or shifting in the vertical, forward, or depth directions. It is possible.

[0173] Furthermore, in Figure 14, batteries 48 are installed inside bands 45 and 46, respectively. This shows an example of how it is connected. Battery 48 is connected to band 45 or band 46. It can be transformed. The battery 48 can supply power to the electronic device 10. The battery controller, which manages the charging and discharging of the battery 48, is incorporated into the electronic device 10. The electronic device 10 has a main battery in the housing 21 or housing 22, and the battery By using the -48 as a secondary battery, the period of use on a single charge can be significantly extended. It can be extended. Alternatively, without providing a battery in either housing 21 or housing 22. Battery 48 may be used as the main battery. In doing so, the housing 21 Furthermore, the housing 22 can be made thinner and lighter.

[0174] Figures 15(A) to (C) show examples of how wearable devices look when worn. The Arable device is in a state where the housing 22 is stacked on top of the housing 21, as shown in Figure 15(A). Then, by sliding the housing 22 as shown in Figure 15(B), as shown in Figure 15(C) As shown, the display panel 11 can be reversibly transformed into an expanded state. For example, Normally, the display panel 11 is used in a folded state, and when a larger display area is needed, the housing... The display panel 11 can be used with the 22 slid open.

[0175] As shown in Figure 15(A), when housing 21 and housing 22 are overlapping, housing 21 and The housing 22 has a locking mechanism to prevent it from sliding unintentionally. This is preferable. At this time, the lock state can be released by, for example, pressing the housing button 47. It is preferable to have a configuration that allows this. Furthermore, it is preferable to use the restoring force of a spring or the like to release the locked state. When divided, it automatically transforms from the state shown in Figure 15(A) to the state shown in Figure 15(C). It may have a mechanism. Conversely, it may change from the state in Figure 15(C) to the state in Figure 15(A). It may have a mechanism that deforms dynamically. Alternatively, a magnet may be used instead of a locking mechanism, and the magnetic force may be used. The relative positions of housing 21 and housing 22 may be fixed using this method. By using magnetic force, The housing 21 and housing 22 can be easily attached and detached.

[0176] In Figures 15(A) to (C), the direction of curvature of bands 45 and 46 is roughly perpendicular to the direction of curvature. Although a configuration in which the housing 22 can be slid in a straight direction was shown, as shown in Figures 16(A) and (B) The housing 22 can be slid in a direction roughly parallel to the bending direction of bands 45 and 46. This configuration is also acceptable.

[0177] Furthermore, as shown in Figures 16(C) and (D), the housings 21 and 22 have a convex display surface. It may be a curved shape to achieve this. Also, when the housing 22 is slid at this time Preferably, the sliding direction is along the direction of band 45 or band 46. When the display panel 11 is opened, the display surface becomes a curved surface that conforms to the arm. The 21 and the housing 22 are arranged to wrap around the arm along the bands 45 and 46. Therefore, the gap between the casing 22 and the arm becomes smaller, preventing the casing 22 from being hit and damaged. This is possible. Also, even when the display panel 11 is open, a more comfortable fit can be used. It can be given to someone.

[0178] The above is an explanation of the application examples.

[0179] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0180] (Embodiment 2) The following describes input devices (touch sensors) and input / output devices applicable to the display panels of electronic devices. This section describes an example configuration of a device (touch panel), etc.

[0181] Herein, in this specification, a display panel has the function of displaying (outputting) images, etc., on its display surface. It possesses such a feature. Therefore, the display panel is one form of an output device.

[0182] Furthermore, in this specification, the display panel substrate may be, for example, FPC or TCP (Tape A device with a connector attached, such as a Carrier Package, or a circuit board. ICs (integrated circuits) are mounted using COG (Chip On Glass) or similar methods. This is sometimes called a display panel module, display module, or simply a display panel. be.

[0183] Furthermore, in this specification, etc., a touch sensor is defined as a sensor that is touched by an object to be detected, such as a finger or stylus. It has the function of sensing pressure or approach. It also has the ability to detect its location. It may also have the function of outputting a signal. Therefore, a touch sensor is one form of an input device. .

[0184] Furthermore, in this specification, etc., a substrate having a touch sensor is referred to as a touch sensor panel, or a single It is sometimes referred to as a touch sensor. Also, in this specification, the base of the touch sensor panel A board with connectors such as FPC or TCP attached, or a circuit board ICs mounted using COG (Center of Graving) or similar methods are referred to as touch sensor panel modules and touch sensors. It may be called a sensor module, touch sensor, or simply a touch sensor.

[0185] Furthermore, in this specification, etc., a touch panel has the function of displaying (outputting) images, etc. on its display surface. When a detected object such as a finger or stylus touches, presses, or approaches the display surface, etc. It has the function of a touch sensor that detects touches. Therefore, the touch panel is an input / output device. This is one aspect of it.

[0186] A touch panel is, for example, a display panel (or display device) with a touch sensor. It can also be called a display panel (or display device) with support functions.

[0187] A touch panel can also be configured to include a display panel and a touch sensor panel. Alternatively, the display panel can be configured to have a touch sensor function built into it. ru.

[0188] Furthermore, in this specification, etc., the touch panel substrate may include, for example, FPC or TCP. A connector is attached, or an IC is mounted on a circuit board using the COG method or similar. It may be called a touch panel module, display module, or simply a touch panel. be.

[0189] [Example of touch sensor configuration] The following describes an example configuration of an input device (touch sensor) with reference to the diagrams.

[0190] Figure 17(A) shows a schematic top view of the input device 150. The input device 150 is located on the circuit board 160. Multiple conductive layers 151, multiple conductive layers 152, multiple wirings 155, and multiple wirings 156 are placed on top of each other. It has. Also, the substrate 160 has multiple conductive layers 151 and multiple conductive layers 152 and electrical An FPC157 is provided to connect to the target. Also, in Figure 17(A), the FPC157 This shows an example where IC158 is provided.

[0191] Figure 17(B) shows a magnified view of the area enclosed by the dashed line in Figure 17(A). Conductive layer 15 1 has a shape in which multiple rhombus-shaped electrode patterns are connected horizontally. The diamond-shaped electrode patterns are electrically connected to each other. Similarly, the conductive layer 152 is also electrically connected. Multiple rhombus-shaped electrode patterns are arranged in a vertical line, and the rhombus-shaped electrode patterns are arranged in a row. Each turn is electrically connected. Also, conductive layer 151 and conductive layer 152 are Some of these overlap and intersect with each other. At this intersection, conductive layer 151 and conductive layer 15 An insulator is sandwiched between the two components to prevent an electrical short circuit.

[0192] Furthermore, as shown in Figure 17(C), a plurality of conductive layers 152 having a rhombus shape are connected to conductive layer 1 The configuration may also be connected by 53. The island-shaped conductive layers 152 are arranged in a vertical direction. Furthermore, the conductive layer 153 electrically connects two adjacent conductive layers 152. By using such a configuration, the conductive layer 151 and the conductive layer 152 are processed from the same conductive film. They can be formed simultaneously. Therefore, variations in these film thicknesses can be suppressed. This suppresses variations in the resistance and light transmittance of each electrode depending on the location. Here, the conductive layer 152 is configured to have a conductive layer 153, but the conductive layer 151 is such The configuration is also acceptable.

[0193] Furthermore, as shown in Figure 17(D), conductive layer 151 and conductive layer 15 shown in Figure 17(B) Alternatively, the inside of the two rhombus-shaped electrode patterns can be hollowed out, leaving only the outline. At this time, the widths of conductive layer 151 and conductive layer 152 are narrowed to such an extent that they are not visible to the user. In that case, even if a light-shielding material such as metal or alloy is used for conductive layer 151 and conductive layer 152 Good. Also, the conductive layer 151 or conductive layer 152 shown in Figure 17(D) is the conductive layer 153. A configuration having the following characteristics is also possible.

[0194] One conductive layer 151 is electrically connected to one wiring 155. 152 is electrically connected to one wire 156. Here, conductive layer 151 and conductive layer 1 One of the 52 corresponds to row wiring, and the other corresponds to column wiring.

[0195] IC158 has the function of driving the touch sensor. Signal output from IC158 The wires 155 or 156 connect to either the conductive layer 151 or the conductive layer 152. It is supplied. Also, the current (or potential) that flows through either the conductive layer 151 or the conductive layer 152 is supplied. This is input to IC158 via wiring 155 or wiring 156.

[0196] In this case, when the input device 150 is superimposed on the display surface of the display panel to form a touch panel. It is preferable to use a light-transmitting conductive material for the conductive layer 151 and conductive layer 152. Furthermore, transparent conductive materials are used for conductive layers 151 and 152, allowing light to be seen from the display panel. When light is extracted via conductive layer 151 or conductive layer 152, conductive layer 151 and conductive A conductive film containing the same conductive material is placed as a dummy pattern between layer 152 and the other layer. This is preferable. In this way, a portion of the gap between the conductive layer 151 and the conductive layer 152 is made into a dummy pattern. By filling it with a ray, variations in light transmittance can be reduced. As a result, input device 1 It can reduce the brightness unevenness of light transmitted through 50.

[0197] Examples of light-transmitting conductive materials include indium oxide, indium tin oxide, and indium Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide with added gallium are used. This can be done. Furthermore, a film containing graphene can also be used. Examples of films containing graphene include... For example, it can be formed by reducing a film containing graphene oxide that has been formed in a film-like structure. Methods for achieving this include applying heat.

[0198] Alternatively, a metal or alloy that is thin enough to be translucent can be used. For example, gold. Silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt Metals such as copper, palladium, or titanium, or alloys containing such metals, can be used. Alternatively, a nitride of the metal or alloy (for example, titanium nitride) may be used. Alternatively, a laminated film may be used in which two or more conductive films containing the materials described above are stacked.

[0199] Furthermore, conductive layers 151 and 152 are processed to be so thin that they are not visible to the user. A conductive film may be used. For example, such a conductive film may be processed into a grid (mesh) shape. This allows for high conductivity and high visibility of the display device. 30 nm to 100 μm, preferably 50 nm to 50 μm, more preferably 5 It is preferable that the material has a portion with a width of 0 nm to 20 μm. In particular, a portion with a width of 10 μm or less. A conductive film with a pattern width is preferable because it is extremely difficult for the user to see.

[0200] As an example, Figures 18(A) to (D) show an expanded portion of the conductive layer 151 or conductive layer 152. A rough schematic diagram is shown. Figure 18(A) shows an example using a grid-like conductive film 146. This is shown. At this time, the conductive film 146 is positioned so as not to overlap with the display elements of the display device. This arrangement is preferable because it does not block light from the display device. The orientation of the grid is the same as the orientation of the display element array, and the period of the grid is an integer of the period of the display element array. It is preferable to double the amount.

[0201] Furthermore, Figure 18(B) shows a lattice-shaped conductive film processed to form triangular openings. 147 examples are shown. With this configuration, compared to the case shown in Figure 18(A) This makes it possible to lower the overall resistance.

[0202] Furthermore, as shown in Figure 18(C), the conductive film 14 has a pattern shape that does not have periodicity. It may also be set to 8. With this configuration, when superimposed on the display unit of the display device, moiré patterns are reduced. This can prevent the occurrence of [the problem].

[0203] Furthermore, conductive nanowires may be used for conductive layers 151 and 152. Figure 18 (D) shows an example using nanowire 149. Adjacent nanowire 14 By distributing the 9s at an appropriate density so that they touch each other, a two-dimensional network is formed. It can be formed and function as an extremely transparent conductive film. For example, the average diameter The value is 1 nm or more and 100 nm or less, preferably 5 nm or more and 50 nm or less, more preferably 5 Nanowires between nm and 25 nm can be used. As for nanowire 149, Metal nanowires such as Ag nanowires, Cu nanowires, Al nanowires, or Car Materials such as von nanotubes can be used. For example, in the case of Ag nanowires, the light transmittance is A sheet resistance of 40Ω / □ or more and 100Ω / □ or less can be achieved with a viscosity of 89% or more.

[0204] The above is an explanation of an example of a touch sensor configuration.

[0205] [Example of touch panel configuration] Figure 19(A) is a schematic perspective view of the touch panel 100. Figure 19(B) is a schematic perspective view of Figure 1 This is a schematic perspective view showing a breakdown of 9(A). For clarity, only representative components are shown. This is shown. Also, in Figure 19(B), only the outline of the substrate 160 is indicated by a dashed line.

[0206] The touch panel 100 has two substrates, 101 and 160, which are arranged facing each other.

[0207] The circuit board 101 is provided with a display unit 102, a circuit 103, wiring 104, etc. The FPC167 is mounted on board 101.

[0208] Circuit 103 can be a circuit that functions, for example, as a scan line drive circuit.

[0209] The wiring 104 has the function of supplying signals and power to the display unit 102 and the circuit 103. Signals and power are input to wiring 104 via FPC167 from an external source or IC168. ru.

[0210] An input device 150 is provided on the circuit board 160.

[0211] The configuration of the input device 150 can be adapted from the example configuration of the touch sensor described above. Figure 19(A)(B) ) In this case, the input device 150 has multiple conductive layers 151, multiple conductive layers 152, and multiple wirings 155 This shows the case where there are multiple wires 156.

[0212] For example, a capacitive touch sensor can be used as the input device 150. Methods include surface capacitance and projected capacitance. The methods include self-capacity systems and mutual-capacity systems. When using a mutual-capacity system, simultaneous multi-capacity This is preferable because it enables point detection. Below, a projected capacitive touch sensor is applied. Let's explain the case.

[0213] Furthermore, this is not limited to the above, but also includes when a detected object such as a finger or stylus approaches or comes into contact with it. Alternatively, various sensors capable of sensing and outputting pressure, etc., can be connected to the input device 150. It can also be applied.

[0214] The touch panel 100 shown in Figures 19(A) and 19(B) has an input device 150 provided on the circuit board 160. Furthermore, the wiring 155 and wiring 156 of the input device 150 are connected via the connection part 169. The FPC 167 connected to the substrate 101 is electrically connected. The connection part 169 is, for example, A configuration can be provided that includes a connector exhibiting anisotropic conductivity.

[0215] By using this configuration, the FPC connected to the touch panel 100 is located on one board side ( Here, it can only be placed on the circuit board 101 side. Also, 2 or more touch panels 100 The above FPC can be installed in this configuration, but as shown in Figures 19(A) and 19(B), touch Panel 100 is provided with one FPC 167, and the FPC 167 is connected to the substrate 101 side and the substrate By configuring the device to supply signals to both sides of the 160, the number of components can be further reduced, simplifying the configuration. This is preferable because it allows for this.

[0216] Furthermore, in Figures 19(A) and (B), IC168 is used in the COF (Chip On Film) method. The diagram shows an example of implementation on the FPC167. IC168 is, for example, a signal line. An IC that functions as a drive circuit can be applied. Also, IC168 is an input device 15 It may have a function to drive 0. In particular, IC168 has a function as a signal line driving circuit. Having both the function of driving the input device 150 and the function of driving the input device 150 is preferable because it reduces the number of parts. It seems so.

[0217] [Examples of touch sensor driving methods] The following describes an example of a driving method for an input device (touch sensor) applicable to one aspect of the present invention. I will explain.

[0218] Figure 20(A) is a block diagram showing the configuration of a mutually capacitive touch sensor. The sensor has a pulse voltage output circuit 601 and a current detection circuit 602. Six wires X (wires X1-X6) are connected to path 601. Current sensing circuit 602 Six wires Y (wires Y1-Y6) are connected to it. Note that the number of wires is not limited to this. One wire X and one wire Y form a capacitance 603.

[0219] For example, the conductive layer 151 corresponds to either wiring X or wiring Y, and the conductive layer 152 corresponds to the other. It corresponds to.

[0220] The pulse voltage output circuit 601, for example, inputs pulse voltages sequentially to wiring X1-X6. This is the circuit. The current sensing circuit 602 detects the current flowing through each of the wires Y1-Y6, for example. This is a circuit for measurement.

[0221] Each of the wirings X1-X6 connects to each of the wirings Y1-Y6, and to the capacitor 603. They are connected. Therefore, when a pulse voltage is applied to one of the wires X1-X6, the wires Current flows through each of Y1-Y6. Part of the electric field generated between a pair of wires is felt by a finger or a pen. This refers to the object being detected coming into contact with, approaching, or pressing against the detection surface (hereinafter referred to as touch). The strength of the electric field between the wires changes due to shielding (also called operation). The magnitude of the current flowing through wiring Y1-Y6 changes.

[0222] When there is no touch operation, the magnitude of the current flowing through wiring Y1-Y6 is equal to the magnitude of the capacitance 603. The value will be accordingly. On the other hand, if a portion of the electric field is shielded by the touch operation, the wiring Y1- The magnitude of the current flowing through Y6 decreases. This difference in current allows for the detection of touch motion. It is possible.

[0223] The current sensing circuit 602 obtains the (time-dependent) integral value of the current flowing through a single wire. Alternatively, the peak of the current The value can also be obtained as a current value. In that case, for example, the current can be converted to a voltage. It is also possible to obtain the peak value of the voltage.

[0224] Figure 20(B) shows the input and output waves of the mutual capacitance type touch sensor shown in Figure 20(A). An example of a timing chart for the shape is shown. In Figure 20(B), the detection of each matrix in one sensing period. It shall perform the task. Also, in Figure 20(B), the case when there is no touch action (non-touch), Two cases are shown side by side, both involving touch operation (when touched). Here, wiring Y1 -For Y6, the voltage waveform corresponds to the direction and magnitude of the current flowing through each wire. It is showing.

[0225] As shown in Figure 20(B), pulse voltages are sequentially applied to the wiring X1-X6. Accordingly, current flows through wiring Y1-Y6. When not in contact, the voltage of wiring X1-X6 is... As the current changes, the same current flows through the wiring Y1-Y6, so each of the wiring Y1-Y6 The output waveform will be similar. On the other hand, when touched, of the wiring Y1-Y6, touch Because the current flowing through wiring Y located at the point where the operation occurred decreases, as shown in Figure 20(B) As shown, the output waveform changes.

[0226] In Figure 20(B), touch motion occurs at or near the point where wiring X3 and wiring Y3 intersect. This shows an example of what might happen if a work were to be done.

[0227] Thus, in the mutual capacitance method, the electric field generated between the pair of wires is shielded by the object being detected. By utilizing the change in the current flowing through the wiring, it is possible to obtain the location information of the object being detected. In addition, if the sensitivity is high, the object to be detected should be far enough away from the detection surface (e.g., the surface of a touch panel). Even if it is not touching, its coordinates can still be detected. Furthermore, it can utilize changes in the contact area of ​​the detected object. It may also have a function to detect changes in the pressure applied when pressing the detection surface. This reduces the thickness of the touch panel and increases the parasitic capacitance of the wiring, which is used to control the pressure. It may also have a function to detect changes in pressure.

[0228] Furthermore, in the case of a touch panel, there is a display period for the display unit and a sensing period for the touch sensor. By using a drive method with a staggered timing, the detection sensitivity of the touch sensor can be increased. For example, if you separate the display period and the sensing period within the duration of one display frame... Good. Furthermore, it is preferable to include two or more sensing periods within a single frame. By increasing the sensing frequency, detection sensitivity can be further improved.

[0229] Furthermore, the pulse voltage output circuit 601 and the current detection circuit 602 are, for example, on a single IC chip. Preferably, it is formed inside. The IC chip is mounted, for example, on a touch panel. It is preferable that it be mounted on a circuit board inside the housing of an electronic device. When using a touch panel, parasitic capacitance increases in the bent portion, and the impact of noise becomes greater. Because there is a risk of malfunction, ICs that employ a drive method less susceptible to noise are used. It is preferable to use a chip. For example, a driving method that increases the signal-to-noise ratio (S / N ratio) It is preferable to use an IC chip to which the law applies.

[0230] The above is an explanation of an example of a method for driving a touch sensor.

[0231] [Example of cross-sectional configuration] Below, we will explain an example of the cross-sectional configuration of a touch panel with reference to the drawings.

[0232] [Cross-sectional configuration example 1] Figure 21 is a schematic cross-sectional view of a touch panel. The touch panel shown in Figure 21 is a display panel. This is a so-called external touch panel, where a circuit board with a touch sensor is attached to a surface. In Figure 21, the region including the FPC 373, the region including the drive circuit 382, ​​and the display unit 381 are shown. The images show cross-sections of the region containing the FPC350 and the region containing the FPC350.

[0233] The touch panel has a substrate 291, a substrate 191, and a substrate 330. The substrate 191 is bonded to the substrate 330 by an adhesive layer 220, and the substrate 191 and the substrate 330 are bonded together. They are bonded together by a bonding layer 230. Here, substrate 291, substrate 191, and these The configuration including the sandwiched laminated structure corresponds to the display panel. Also provided on the substrate 330 Configurations including a layered structure support touch sensors.

[0234] <Display Panel> Between board 291 and board 191 are transistor 201, transistor 202, and A zista 203, display element 204, capacitive element 205, etc., are provided.

[0235] The substrate 291 is bonded to the insulating layer 294 by an adhesive layer 292. 1 is bonded to the insulating layer 194 by an adhesive layer 192.

[0236] Materials such as flexible resin can be used for substrates 291 and 191. It is preferable to use a flexible film or the like for substrates 291 and 191. By using flexible materials for these substrates, a bendable display panel can be created. This can be achieved. Substrate 291 and substrate 191 protect transistors and light-emitting elements. It has a function that allows it to be used as a protective film, and can also be called a protective film.

[0237] Furthermore, the insulating layer 294 and insulating layer 194 are made of a material that does not easily allow impurities such as water and hydrogen to diffuse. It is preferable to use this configuration. With this configuration, moisture permeability is maintained between substrate 291 and substrate 191. Even if a material with properties is used, external interference can occur to the display element 204 and each transistor. This effectively suppresses the diffusion of pure substances, resulting in a highly reliable touch panel. can.

[0238] On top of insulating layer 294 are insulating layer 211, insulating layer 212, insulating layer 213, insulating layer 214, insulating Edge layer 215, spacer 216, etc. are provided. A portion of the insulating layer 211 is each transistor It functions as the gate insulating layer of the zistor, and another part of it functions as the dielectric of the capacitive element 205. The insulating layers 212, 213, and 214 are used for each transistor and capacitive element. It is provided covering 205, etc. The insulating layer 214 functions as a planarizing layer. Here, as insulating layers covering transistors, etc., insulating layer 212, insulating layer 213, and insulating layer The example shows a case with three layers of layer 214, but it is not limited to this and may have four or more layers. It may be a single layer or two layers. Also, the insulating layer 214 that functions as a planarizing layer is not required. If one exists, it doesn't need to be provided.

[0239] A display element 204 is provided on the insulating layer 214. Here, the display element 204 is This shows an example of applying a top-emission type organic EL element. The display element 204 emits light toward the second electrode 223. The light-emitting region of the display element 204 and Next, transistors 202, 203, 205, and wiring are arranged in layers. This allows the aperture ratio of the display unit 381 to be increased.

[0240] The display element 204 has an EL layer 222 between the first electrode 221 and the second electrode 223. Furthermore, an optical adjustment layer 224 is provided between the first electrode 221 and the EL layer 222. The insulating layer 215 is provided to cover the first electrode 221 and the end of the optical adjustment layer 224. It is.

[0241] Figure 21 shows a cross-section of one pixel as an example of the display unit 381. Here, the pixel is A transistor 202 for current control, a transistor 203 for switching control, and a capacitor This shows the case where element 205 is present. The source or drain of transistor 202 On the other hand, one electrode of the capacitance element 205 is insulated by insulating layer 212, insulating layer 213 and insulating layer 21 It is electrically connected to the first electrode 221 through an opening provided in 4.

[0242] Furthermore, in Figure 21, a transistor 201 is provided as an example of the drive circuit 382. It shows success.

[0243] Transistors 201, 202, and 203 are gates A conductive layer 241 that functions as a source, a semiconductor layer 242 that functions as a source and a drain. It has a pair of conductive layers 243.

[0244] In Figure 21, transistors 201 and 202 form a semicircular structure in which a channel is formed. A configuration was applied in which the conductive layer 242 is sandwiched between two gates (conductive layer 241 and conductive layer 244). An example is shown. Such transistors have a field-effect mobility compared to other transistors. This makes it possible to increase the on-current. As a result, high-speed operation is possible. It is possible to create a feasible circuit. Furthermore, it is possible to reduce the circuit's footprint. Yes. By applying transistors with high on-current, the display panel can be made larger, or higher Even if the number of wires increases when the wiring is refined, reducing the signal delay in each wire is possible. This is possible, and it will be possible to reduce variations in display brightness.

[0245] The transistors provided in the drive circuit 382 and the display unit 381 have the same structure. It may be a single transistor, or a combination of transistors with different structures may be used. .

[0246] At least one of the insulating layers 212 and 213 covering each transistor is water-resistant. It is preferable to use a material that does not easily allow impurities such as hydrogen to diffuse. That is, insulating layer 21 2 or the insulating layer 213 can function as a barrier film. This effectively suppresses the diffusion of impurities from the outside into the transistor. This makes it possible to create a highly reliable touch panel.

[0247] The spacer 216 is provided on the insulating layer 215 and adjusts the distance between the substrate 291 and the substrate 191. It has a function to adjust. In Figure 21, there is a gap between the spacer 216 and the light-shielding layer 232. Although it is shown as a combination, these may be in contact. Also, here the spacer 216 is on substrate 2 The configuration shown is provided on the 91 side, but the substrate 191 side (for example, the substrate 191 side of the light-shielding layer 232) is also shown. ) may be provided in ). Alternatively, a granular spacer may be used instead of spacer 216. As spacers, materials such as silica can be used, but organic resins and rubber can also be used. It is preferable to use an elastic material. In this case, the granular spacer is compressed in the vertical direction. It may take on a different shape.

[0248] A colored layer 231, a light-shielding layer 232, etc., are provided on the substrate 291 side of the insulating layer 194. The light-shielding layer 232 has an opening, and the opening is positioned so as to overlap with the display area of ​​the display element 204. It also functions as an insulating overcoat, covering the colored layer 231 and the light-shielding layer 232. Layers may be added.

[0249] A connection portion 206 is provided in the region near the edge of the substrate 291. The connection portion 206 is The FPC373 is electrically connected via the subsequent layer 209. In the configuration shown in Figure 21, A portion of the wiring 207 that is electrically connected to the dynamic circuit 382, ​​and the same conductive film as the first electrode 221. This example shows how a conductive layer formed by processing is laminated to constitute the connection portion 206. In this way, by stacking two or more conductive layers to form the connection part 206, the electrical resistance is reduced. Not only can the load be reduced, but the mechanical strength of the connection part 206 can also be increased.

[0250] Furthermore, Figure 21 shows an example of processing the same conductive film as the gate electrode of a transistor to form a shape. The wiring is made, and the same conductive film as the source and drain electrodes of the transistor is processed. This shows the cross-sectional structure of the intersection 387 where the formed wiring intersects.

[0251] <Input device> Electrodes 333 and 332 are provided on the side of substrate 330 facing substrate 291. This shows an example where there is a bridge electrode 334 connected to electrode 333. Figure 2 As shown in the intersection 387 in 1, electrodes 332 and 333 are formed on the same plane. Furthermore, an insulating layer 161 is provided covering electrodes 332 and 333, and the substrate of the insulating layer 161 A bridge electrode 334 is provided on the side facing 291. The bridge electrode 334 is on the insulating layer 1 Two electrodes 333 are provided so as to sandwich electrode 332 through an opening provided in 61. They are electrically connected.

[0252] A connection portion 106 is provided in the region near the edge of the substrate 330. The connection portion 106 is The FPC350 is electrically connected via the connecting layer 109. In the configuration shown in Figure 21, A portion of the wiring 342 and a conductive layer obtained by processing the same conductive film as the bridge electrode 334 This shows an example where the components are stacked to form a connecting section 106.

[0253] Here, the substrate 330 is also a substrate that is directly touched by a detected object such as a finger or stylus. It can be used. In that case, a protective layer (ceramic coating, etc.) is provided on the substrate 330. This is preferable. The protective layer may be, for example, silicon oxide, aluminum oxide, or yttrium oxide. Inorganic insulating materials such as yttria-stabilized zirconia (YSZ) can be used. Alternatively, tempered glass may be used for the substrate 330. Tempered glass undergoes physical or chemical treatment. A material that has been treated and has had compressive stress applied to its surface can be used. Therefore, methods such as ion exchange and air cooling strengthening can be used. To provide a surface on one side, and then use the opposite side as a touch surface, for example, on the outermost surface of an electronic device. This allows for a reduction in the overall thickness of the device.

[0254] The substrate 330 has a flexible portion that bends at least together with the display panel. It is preferable that the same material as substrate 291 and substrate 191 be used. Cut.

[0255] [Regarding each component] The following sections will explain each of the components listed above.

[0256] The substrate of the touch panel can be made of a material having a flat surface. The substrate that extracts the light from the source is made of a material that transmits the light. For example, glass or quartz. Materials such as ceramics, sapphires, and organic resins can be used.

[0257] By using a thin substrate, it is possible to make the touch panel lighter and thinner. Furthermore, by using a substrate of sufficient thickness to be flexible, a flexible touch panel can be created. This can be achieved.

[0258] Examples of glass include alkali-free glass, barium borosilicate glass, and alumino. Glass or similar materials can be used.

[0259] Materials that are flexible and transparent to visible light include, for example, materials that are flexible to a certain degree. Glass of varying thicknesses, polyethylene terephthalate (PET), polyethylene naphthalate Polyester resins such as (PEN), polyacrylonitrile resin, polyimide resin, polymer Chill methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PE) S) Resins, polyamide resins, cycloolefin resins, polystyrene resins, polyamide resins Examples include plastic resins, polyvinyl chloride resins, and polytetrafluoroethylene (PTFE) resins. It is preferable to use a material with a low coefficient of thermal expansion, for example, a material with a coefficient of thermal expansion of 30 Polyamide-imide resins, polyimide resins, PET, etc., with a K of ×10⁻⁶ or less are preferably used. It is possible to have a substrate made of glass fiber impregnated with organic resin, or an inorganic filler made of organic resin. It is also possible to use substrates in which the thermal expansion coefficient has been reduced by mixing with resin. Because the circuit board is lightweight, the touch panel using it can also be made lightweight.

[0260] Furthermore, the substrate on the side from which light is not extracted does not need to be translucent, as mentioned above. In addition to the base plate, metal substrates can also be used. Metal substrates have high thermal conductivity, and the entire substrate Because it can easily conduct heat to the body, it can suppress localized temperature increases on the touch panel. , preferable. In order to obtain flexibility and bendability, the thickness of the metal substrate should be 10 μm or more and 200 μm or more. A thickness of m or less is preferred, and a thickness of 20 μm or more and 50 μm or less is more preferred.

[0261] There are no particular limitations on the materials that make up the metal substrate, but for example, aluminum, copper, and nickel are used. Preferably, metals such as buckle, or alloys such as aluminum alloy or stainless steel are used. It is possible.

[0262] In addition, insulating treatment is performed by oxidizing the surface of the metal substrate or forming an insulating film on the surface. A substrate that has been treated may be used. For example, a coating method such as spin coating or dip coating, or an electric coating method may be used. An insulating film may be formed using methods such as deposition, vapor deposition, or sputtering, or in an oxygen atmosphere. In addition to leaving it exposed to air or heating it, an oxide film can be formed on the surface of the substrate by methods such as anodizing. That's fine.

[0263] As a flexible substrate, a layer using the above material protects the surface of the touch panel from scratches and other damage. A hard coat layer (e.g., a silicon nitride layer) or a layer of material that can distribute pressure (e.g.) For example, it may be constructed by laminating with an aramid resin layer, etc. Also, due to moisture, etc. To suppress the decrease in the lifespan of light-emitting elements, silicon nitride film, silicon oxide nitride film, etc. Permeable membranes containing silicon and other elements, or membranes containing nitrogen and aluminum such as aluminum nitride membranes. It may have a low insulating film.

[0264] The substrate can also be constructed by stacking multiple layers. In particular, it can be configured to include a glass layer. This improves the barrier properties against water and oxygen, resulting in a more reliable touch panel. For example, a substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closest to the light-emitting element. It can be used. By providing such an organic resin layer, cracking of the glass layer and cracks can be prevented. This can suppress cracking and improve mechanical strength. By applying this composite material to the substrate, an extremely reliable flexible touch panel can be created. It can be made into a lu.

[0265] A transistor consists of a conductive layer that functions as the gate electrode, a semiconductor layer, and a source electrode. A functional conductive layer, a conductive layer that functions as a drain electrode, and a gate insulating layer that functions as a gate insulating layer. It has an insulating layer. Figure 21 shows the case where a bottom gate structure transistor is applied. They are doing it.

[0266] The structure of the transistors in the touch panel according to one aspect of the present invention is not particularly limited. For example, it can be a staggered transistor or an inverse staggered transistor. Good. Furthermore, it can be either a top-gate or bottom-gate transistor structure. The semiconductor material used in transistors is not particularly limited; for example, oxide semiconductors, silicon Examples include cellulose and germanium.

[0267] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors are also available. Crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a crystalline region in part) Any semiconductor (having a region) may be used. If a semiconductor with crystalline properties is used, This is preferable because it suppresses the degradation of the DISTA characteristics.

[0268] Furthermore, semiconductor materials used in transistors include, for example, elements of Group 14 (silicon, Germanium, compound semiconductors, or oxide semiconductors can be used as semiconductor layers. In general, semiconductors containing silicon, semiconductors containing gallium arsenide, or oxides containing indium. It can be applied to materials such as semiconductors.

[0269] In particular, it is preferable to use oxide semiconductors with a larger band gap than silicon. Using semiconductor materials with a wider band gap and lower carrier density than silicon This is preferable because it reduces the current when the transistor is off.

[0270] For example, the above oxide semiconductor may contain at least indium (In) or zinc (Zn). Preferably contains ). More preferably In-M-Zn oxide (where M is Al, Ti, Contains oxides represented by metals such as Ga, Ge, Y, Zr, Sn, La, Ce, or Hf. nothing.

[0271] In particular, the semiconductor layer has multiple crystalline portions, and the c-axis of the crystalline portion is the surface on which the semiconductor layer is formed. Alternatively, grains are observed that are oriented approximately perpendicular to the upper surface of the semiconductor layer, and grain boundaries are observed between adjacent crystalline regions. It is preferable to use an oxide semiconductor film that is not treated.

[0272] Such oxide semiconductors do not have grain boundaries, so when the display panel is curved... This suppresses the formation of cracks in the oxide semiconductor film due to stress. Therefore, Such oxide semiconductors are suitable for applications that are flexible and can be bent, such as touch panels. It can be used.

[0273] Furthermore, by using an oxide semiconductor with such crystalline properties as the semiconductor layer, the electrical properties This suppresses fluctuations and enables the creation of highly reliable transistors.

[0274] Furthermore, transistors using oxide semiconductors with a larger band gap than silicon, Due to its low off-current, the charge accumulated in the capacitive element connected in series with the transistor is reduced over time. It is possible to retain the data over a period of time. Applying such transistors to pixels. This makes it possible to stop the drive circuit while maintaining the gradation of each pixel. As a result, This makes it possible to realize a display device with reduced power consumption.

[0275] Alternatively, silicon is preferred as the semiconductor in which the transistor channel is formed. It is fine. Amorphous silicon may be used as silicon, but crystalline silicon is particularly desirable. It is preferable to use silicon. For example, microcrystalline silicon, polycrystalline silicon, single-crystal silicon It is preferable to use materials such as n. In particular, polycrystalline silicon is suitable for lower temperatures compared to single-crystal silicon. It can be formed using [a specific method] and possesses higher field-effect mobility and higher reliability compared to amorphous silicon. By applying such polycrystalline semiconductors to pixels, the aperture ratio of the pixels can be improved. It can. Also, even if the display device is extremely high resolution, the scan line drive circuit and the signal line drive circuit This makes it possible to form pixels on the same substrate, reducing the number of components that make up electronic devices. It is possible.

[0276] Alternatively, transistors with different semiconductors applied may be mixed together. For example, polycrystalline. A mix of transistors using silicon and transistors using oxide semiconductors. This configuration can be implemented in such a way. In this case, for example, the transistor in the drive circuit and the electric Transistors that require large currents, such as current control transistors, use polycrystalline silicon. It is preferable to apply a capacitor. Also, a switching transistor within the pixel, etc. In transistors, etc., a capacitor or similar component is connected in series with the transistor, and the charge stored in it is held in place. It is preferable to use an oxide semiconductor.

[0277] In addition to the gate, source, and drain of transistors, various components that make up a touch panel are also included. Materials that can be used for conductive layers such as wires and electrodes include aluminum, titanium, Chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and Examples include metals such as tungsten, or alloys in which tungsten is the main component. These materials can be used in single-layer or multi-layer structures. For example, silico A single-layer structure of an aluminum film containing , a double-layer structure in which an aluminum film is laminated on a titanium film, A two-layer structure consisting of a tungsten film laminated with an aluminum film, copper-magnesium-aluminium A two-layer structure in which a copper film is laminated on an alloy film, a two-layer structure in which a copper film is laminated on a titanium film, tungsten A two-layer structure in which a copper film is laminated on a titanium film, a titanium film or titanium nitride film, and on top of that, A luminium film or copper film is laminated, and then a titanium film or titanium nitride film is formed on top of it. A three-layer structure consisting of a molybdenum film or molybdenum nitride film, with an aluminum film layered on top of it. Alternatively, a copper film is laminated, and then a molybdenum film or molybdenum nitride film is formed on top of it, creating a three-layer structure. It has a structure, etc. Furthermore, oxides such as indium oxide, tin oxide, or zinc oxide may be used. Furthermore, using copper containing manganese is preferred because it improves the controllability of the shape through etching. It's nice.

[0278] Furthermore, it can be used for conductive layers such as various wirings and electrodes that make up a touch panel. Examples of translucent materials include indium oxide, indium tin oxide, and indium zinc oxide. Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide with added gallium, or graphene are used. It can be. Or, gold, silver, platinum, magnesium, nickel, tungsten, Metal materials such as chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, and Alloy materials containing metallic materials can be used. Alternatively, nitrides of the metallic material (for example, Titanium nitride may also be used. Note that metal materials, alloy materials (or nitrides thereof) When using it, it is sufficient to make it thin enough to be translucent. Also, when the laminated film of the above material is used It can be used as an electrochemical layer. For example, an alloy of silver and magnesium and indium tin oxide. Using a multilayer film of a material is preferable because it can improve conductivity.

[0279] Examples of insulating materials that can be used for each insulating layer, overcoat, spacer, etc. include For example, resins such as acrylic and epoxy, and resins having siloxane bonds such as silicone resins. Others include silicon oxide, silicon oxide nitride, silicon nitride, silicon nitride, and aluminum oxide. Inorganic insulating materials such as um can also be used.

[0280] Furthermore, it is preferable that the light-emitting element is provided between a pair of insulating films with low water permeability. This prevents impurities such as water from entering the light-emitting elements, thus suppressing a decrease in the reliability of the device. It can be controlled.

[0281] Examples of insulating films with low water permeability include silicon nitride films and silicon nitride oxide films, which contain nitrogen and silicon. Examples include films containing nitrogen and aluminum, such as aluminum nitride films. Silicon oxide films, silicon oxide nitride films, aluminum oxide films, etc., may also be used.

[0282] For example, the amount of water vapor transmitted through a low-permeability insulating film is 1 × 10⁻⁶ -5 [g / (m 2 ·day) ] Preferably 1 × 10 -6 [g / (m 2 ·day)] Below, more preferably 1×1 0 -7 [g / (m 2 (day) More preferably 1 x 10 -8 [g / (m 2 ·d (ay) and below.

[0283] Each adhesive layer can be a photocuring adhesive such as an ultraviolet-curing type, a reaction-curing adhesive, or a thermosetting adhesive. Various types of curing adhesives, such as adhesives and anaerobic adhesives, can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, Mido resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, Examples include EVA (ethylene vinyl acetate) resin. In particular, moisture-permeable epoxy resins. Materials with low properties are preferred. Two-component resins may also be used. Adhesive sheets, etc. You may also use [this].

[0284] Furthermore, the above resin may contain a desiccant. For example, an alkaline earth metal oxide (acid Using substances that adsorb moisture by chemical adsorption, such as calcium carbonate or barium oxide. It is possible to remove moisture through physical adsorption, such as with zeolite or silica gel. Adsorbent substances may be used. If a desiccant is included, impurities such as moisture may be absorbed into the functional element. This is preferable because it can deter intrusion and improve the reliability of the display panel.

[0285] Furthermore, by mixing fillers or light-scattering materials with a high refractive index into the above resin, a light-emitting element can be created. The light extraction efficiency from these can be improved. For example, titanium dioxide, barium oxide, Zeolite, zirconium, etc., can be used.

[0286] As the light-emitting element, a self-emitting element can be used, and it will light up when current or voltage is applied. This category includes elements whose degree of control is managed. For example, light-emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc., can be used.

[0287] Light-emitting devices include top-emission type, bottom-emission type, and dual-emission type. Either of the above is acceptable. The electrode that extracts light uses a conductive film that transmits visible light. Furthermore, it is preferable to use a conductive film that reflects visible light on the electrode that does not extract light. stomach.

[0288] The EL layer has at least an emissive layer. The EL layer has layers other than the emissive layer, such as hole injection layers. High-performance materials, materials with high hole transport, hole-blocking materials, materials with high electron transport, electron injection This includes substances with high electron transport and hole transport properties, or bipolar substances (substances with high electron transport and hole transport properties), etc. It may have further layers.

[0289] The EL layer can use either low-molecular-weight compounds or high-molecular-weight compounds, and inorganic compounds It may contain materials. Each layer constituting the EL layer is made by a vapor deposition method (including vacuum deposition). It can be formed by methods such as transfer, printing, inkjet, and coating.

[0290] When a voltage higher than the threshold voltage of the light-emitting element is applied between the cathode and anode, the EL layer on the anode side... Holes are injected from the cathode side, and electrons are injected from the cathode side. The injected electrons and holes are in the EL layer. They recombine, and the light-emitting material contained in the EL layer emits light.

[0291] When using a white light-emitting element as the light-emitting element, two or more types of light-emitting elements are used in the EL layer. It is preferable to have a composition that includes substances. For example, the emission of light from two or more light-emitting substances is related to the complementary color White light emission can be obtained by selecting a light-emitting material that acts in conjunction with the light-emitting material. For example, These are light-emitting substances that exhibit light emission in the following colors: R (red), G (green), B (blue), Y (yellow), O (orange), etc. Or, among luminescent materials that exhibit emission containing two or more spectral components of R, G, and B, It is preferable that it contains 2 or more. Also, the spectrum of emission from the light-emitting element is in the visible light region. A light-emitting element having two or more peaks within a wavelength range (e.g., 350nm to 750nm) is suitable. It is preferable to use it. Also, the emission spectrum of a material having a peak in the yellow wavelength region is Preferably, the material has spectral components in the green and red wavelength regions.

[0292] The EL layer includes an emissive layer containing an emissive material that emits one color, and an emissive material that emits another color. It is preferable to have a structure in which multiple light-emitting layers are stacked. For example, multiple light-emitting layers in the EL layer The layers may be stacked in contact with each other, or they may be separated by regions that do not contain any light-emitting material. They may be laminated. For example, between the fluorescent emitting layer and the phosphorescent emitting layer, the fluorescent emitting layer or It contains the same material as the phosphorescent layer (e.g., host material, assist material), and either emission The configuration may also include a region that does not contain any optical material. This makes it easier to fabricate the light-emitting element. This also results in a reduction in the drive voltage.

[0293] Furthermore, the light-emitting element may be a single element having one EL layer, or it may have multiple EL layers These may be tandem elements stacked with charge generation layers in between.

[0294] Examples of conductive films that transmit visible light include indium oxide, indium tin oxide, and indium Zinc oxide, zinc oxide, and zinc oxide with added gallium can be used. Gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, Metallic materials such as balt, copper, palladium, or titanium, alloys containing these metallic materials, These metallic nitrides (for example, titanium nitride) are also formed to a thin, translucent state. It can be used by doing so. Furthermore, the laminated film of the above material can be used as a conductive layer. It is possible. For example, by using a multilayer film of a silver-magnesium alloy and indium tin oxide, This is preferable because it can improve conductivity. Alternatively, graphene or the like may be used.

[0295] Conductive films that reflect visible light include, for example, aluminum, gold, platinum, silver, nickel, and tungsten. Metal materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, Alloys containing these metal materials can be used. In addition, the above metal materials and alloys can be treated with ran It may also contain additives such as tungsten, neodymium, or germanium. Additionally, titanium and nickel may be added. Alternatively, an alloy containing neodymium and aluminum (aluminum alloy) may be used. An alloy containing silver may be used, which includes copper, palladium, or magnesium. Alloys are preferred because they have high heat resistance. Furthermore, an aluminum film or an aluminum alloy film By laminating a metal film or metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film is suppressed. This is possible. Examples of materials for such metal films and metal oxide films include titanium and titanium oxide. These are some examples. In addition, a conductive film that transmits visible light and a film made of a metal material are laminated together. This may also apply to multilayer films of silver and indium tin oxide, and alloys of silver and magnesium and indium Multilayer films of um-tin oxide can be used.

[0296] The conductive layers can be formed using methods such as vapor deposition or sputtering. In addition, Using ejection methods such as inkjet printing, printing methods such as screen printing, or plating methods It can be formed.

[0297] Furthermore, the above-mentioned light-emitting layer, as well as materials with high hole injection potential, materials with high hole transport potential, and electricity Layers containing materials with high electron transport properties, materials with high electron injection properties, bipolar materials, etc. These include inorganic compounds such as quantum dots, and polymer compounds (oligomers, dendrimers, poly It may have (such as a mer). For example, by using quantum dots as the light-emitting layer, the light-emitting material and It can also be made to function in that way.

[0298] Furthermore, quantum dot materials include colloidal quantum dot materials, alloy-type quantum dot materials, Core-shell type quantum dot materials, core-type quantum dot materials, etc., can be used. Materials containing elemental groups 12 and 16, 13 and 15, or 14 and 16 May be used. Alternatively, cadmium, selenium, zinc, sulfur, phosphorus, indium, tellurium, Quantum dot materials containing elements such as lead, gallium, arsenic, and aluminum may also be used.

[0299] Materials that can be used for the colored layer include metal materials, resin materials, pigments, or dyes. Examples include resin materials.

[0300] Materials that can be used for the light-shielding layer include carbon black, metal oxides, and multiple golds. Examples include composite oxides containing solid solutions of group oxides. Furthermore, the light-shielding layer may contain the material for the colored layer. Laminated films can also be used. For example, a material used for a colored layer that transmits light of a certain color. A laminated structure is used consisting of a film containing and a film containing a material used for a colored layer that transmits light of other colors. This is possible. By using the same materials for the colored layer and the light-shielding layer, the equipment can be standardized, and the process can be streamlined. It is preferable because it can be simplified.

[0301] The connecting layer between the FPC and the terminals contains an anisotropic conductive film (ACF: Anisotropic). PVC Conductive Film) and anisotropic conductive paste (ACP: Anisotropic Conductive Film) You can use otropic conductive paste, etc.

[0302] The above is a description of each component.

[0303] [Example of manufacturing method] The following describes an example of a method for manufacturing a display device using a flexible substrate.

[0304] Here, display elements, circuits, wiring, electrodes, and insulating layers, as well as light-shielding layers such as colored layers and light-shielding layers. Layers containing components such as display elements will be collectively referred to as element layers. For example, an element layer may contain display elements. This includes, in addition to the display elements, the wiring that electrically connects to the display elements, and the transistors used in pixels and circuits. It may also be equipped with elements such as a t-axis.

[0305] Furthermore, at the stage when the display element is completed (the manufacturing process is finished), the element layer is supported A material that is flexible and holds its shape will be called a substrate. For example, a substrate may have a thickness This also includes extremely thin films, etc., ranging in thickness from 10 nm to 300 μm.

[0306] Typical methods for forming an element layer on a substrate that is flexible and has an insulating surface include There are two methods, as listed below. One is to directly form the element layer on a flexible substrate. This is one method. Another method involves forming the element layer on a support substrate different from the flexible substrate. This method involves separating the element layer from the support substrate and then transferring the element layer to the substrate. Although I won't go into detail, in addition to the two methods mentioned above, an element layer is formed on a non-flexible substrate. Another method involves making the substrate flexible by thinning it through polishing or other means.

[0307] If the materials constituting the substrate have heat resistance to the heat generated during the device layer formation process, Forming the element layer directly on the substrate is preferable because it simplifies the process. When the element layer is formed with the plate fixed to the support substrate, transport within and between devices is It is preferable because it makes things easier.

[0308] Furthermore, when using a method in which the element layer is formed on a support substrate and then transferred to the substrate, first the support A release layer and an insulating layer are laminated on the substrate, and an element layer is formed on the insulating layer. Subsequently, the support base The element layer is delaminated between the plate and the element layer, and the element layer is transferred to the substrate. At this time, the interface between the support substrate and the delamination layer. Therefore, a material should be selected that causes delamination at the interface between the release layer and the insulating layer, or within the release layer itself. In this method, the element layer is formed by using highly heat-resistant materials for the support substrate and release layer. This allows for an increase in the upper limit of the temperature applied during the process, resulting in the formation of an element layer with more reliable components. This is preferable because it allows for this.

[0309] For example, as a release layer, a layer containing a high melting point metal material such as tungsten, and the metal material Layers containing oxides are stacked and used. In addition, silicon oxide and silicon nitride are used as insulating layers on the release layer. It is preferable to use layers made up of multiple layers of silicon dioxide, silicon oxide nitride, silicon nitride oxide, etc. In this specification, oxidnitrides are defined as having a composition that contains more oxygen than nitrogen. This refers to materials with a high concentration of nitrogen, and nitride oxides, in their composition, have a higher nitrogen content than oxygen. It refers to the material.

[0310] Methods for separating the element layer from the support substrate include applying mechanical force and removing the delamination layer. Examples include chipping or penetrating the peeling interface with a liquid. Alternatively, the difference in thermal expansion between the two layers forming the delamination interface can be used for heating or cooling. The peeling may be performed by this method.

[0311] When initiating delamination, first a starting point for delamination is formed, and the delamination proceeds from that starting point. Preferably, the starting point of the peeling is to locally heat a portion of the insulating layer or peeling layer with laser light or the like. And, by physically cutting or penetrating a part of the insulating layer or release layer with a sharp object, It can be formed.

[0312] Furthermore, if delamination is possible at the interface between the support substrate and the insulating layer, a delamination layer may not be necessary.

[0313] For example, glass is used as the support substrate and an organic resin such as polyimide is used as the insulating layer. This allows for delamination at the interface between the glass and the organic resin. Also, any remaining polyimide, etc. Organic resins can also be used as substrates.

[0314] Alternatively, a heating layer is provided between the support substrate and an insulating layer made of organic resin, and the heating layer is heated. By doing so, delamination may occur at the interface between the heating layer and the insulating layer. The heating layer is a current Materials that generate heat when a fluid is passed through them, materials that generate heat when light is absorbed, and materials to which a magnetic field is applied. Various materials can be used, such as materials that generate heat. For example, the heating layer can be Semiconductors, metals, and insulators can be selected and used.

[0315] The above is an explanation of an example of the manufacturing method.

[0316] [Cross-sectional configuration example 2] Figure 22 shows a schematic cross-sectional view of a touch panel with some configuration differences from Figure 21. Please note that explanations of parts that overlap with the above will be omitted, and the differences will be explained.

[0317] Transistors 201 and 202 are conductive, functioning as its second gate. Layer 244 is provided between insulating layer 213 and insulating layer 214. This is the configuration. This allows us to increase the electric field strength applied to the semiconductor layer 242 compared to the configuration shown in Figure 21. Therefore, it is preferable because the voltage applied to the second gate can be reduced.

[0318] Furthermore, Figure 22 shows an example of a display element 204 formed using a color-shading method. Specifically, an EL layer 222 that emits a different color is formed for each pixel of a different color. Furthermore, outside the light-emitting region of the display element 204, the edge of the EL layer 222 is located at the second electrode 223. It is covered. The EL layer 222 is covered by, for example, a vapor deposition method using a metal mask, a printing method, or ink. It can be formed using methods such as the jet process.

[0319] Note that here the entire EL layer 222 is shown colored, but the EL layer 222 is composed of It is also possible to configure the system so that one or more of the multiple films are painted in a different color, while the others are not. It is possible. For example, it is possible to paint only the luminescent layer in a different color, while keeping the rest the same. Of the three types of light-emitting layers, red (R), green (G), and blue (B), the red light-emitting layer and the green layer The luminescent layer can be formed by painting different colors, or the blue luminescent layer can be formed without painting the other colors. can.

[0320] Furthermore, Figure 22 does not show the optical adjustment layer 224 or the coloring layer 231 shown in Figure 21. An example is shown.

[0321] The transistor configuration and the configuration of the display element 204 shown here are shown in Figure 21 and The following examples of cross-sectional configurations can be used to replace the transistors, display elements, etc. can.

[0322] [Cross-sectional configuration example 3] The touch panel shown in Figure 23 has a touch sensor configured between substrate 191 and substrate 291. Electrodes and the like are formed. The touch panel shown in Figure 23 is an in-cell type touch panel and It can also be said that, with this configuration, the input device and the display panel are on board 191 Because it can share resources, it is possible to create a thin touch panel.

[0323] The touch panel shown in Figure 23 has a light-shielding layer 235 on the substrate 291 side of the insulating layer 194. An edge layer 234, an insulating layer 161, etc., are provided in order. Also, the insulating layer 161 and the bridge electrode are provided. An insulating layer 233 is provided covering 334, etc. On the substrate 291 side of the insulating layer 233, A light layer 232 and a colored layer 231 are provided.

[0324] The insulating layers 233 and 234 function as planarizing films. 3 and the insulating layer 234 may be omitted if they are not needed.

[0325] The light-shielding layer 235 is positioned on the visible side of the electrodes and other components that make up the touch sensor. This prevents external light from reflecting off the electrodes, etc., and the reflected light from being visible to the user. This allows for improved visibility of the touch panel.

[0326] [Cross-sectional configuration example 4] Figure 24 shows transistors 201 and 20 in the example cross-sectional configuration shown in Figure 21. When top-gate type transistors are applied to transistors 2 and 203, An example is shown.

[0327] Each transistor has a semiconductor layer 261, and an insulating layer 211 is placed on the semiconductor layer 261. A conductive layer 241 that functions as a gate is provided. Furthermore, the semiconductor layer 261 is designed to reduce resistance. It may have a region 262.

[0328] The conductive layer 243, which functions as the source or drain of the transistor, is located on the insulating layer 213. Provided, and through openings provided in the insulating layer 213, insulating layer 212, and insulating layer 211, It is electrically connected to region 262.

[0329] Furthermore, Figure 24 shows that the capacitive element 205 is formed by processing the same semiconductor film as the semiconductor layer 261. A laminated structure of a layer, an insulating layer 211, and a layer formed by processing the same conductive film as the conductive layer 241. An example is shown which has the following characteristics. Here, a part of the semiconductor film of the capacitive element 205 is a transistor It is preferable that a region 263 with higher conductivity is formed than the region where the channel is formed. It's nice.

[0330] Regions 262 and 263 are less dense than, for example, the region where the transistor channel is formed. This refers to regions containing a large amount of pure substances, regions with high carrier concentrations, or regions with low crystallinity. It is possible.

[0331] The impurities that enhance conductivity depend on the type of semiconductor applied to the semiconductor layer 261. Although they differ, typical examples include noble gases such as helium, neon, and argon, as well as phosphorus and boron. Element, hydrogen, lithium, sodium, magnesium, aluminum, nitrogen, fluorine, potassium Examples include aluminum, calcium, etc. Other examples include titanium, iron, nickel, copper, zinc, silver, and zinc. Dium and tin also function as impurities that affect the conductivity of semiconductors. For example, in semiconductors... When silicon is used, phosphorus and other elements can impart n-type conductivity, while boron... These are elements that can impart p-type conductivity.

[0332] [Cross-sectional configuration example 5] Figure 25 shows a cross-section when the FPC is placed on only one side of the substrate, as shown in Figure 19. An example configuration is shown.

[0333] The connection part 385 has wiring 342 provided on the circuit board 191 side and wiring provided on the circuit board 291 side The wiring 207 is electrically connected via the connector 386.

[0334] For example, conductive particles can be used as the connector 386. In this case, a material is used in which the surface of particles such as organic resin or silica is coated with a metal material. Yes, it is possible. Using nickel or gold as the metallic material is preferable because it reduces contact resistance. Particles coated in layers of two or more metal materials, such as nickel further coated with gold. It is preferable to use such a material. Furthermore, it is preferable to use an elastically deformable or plastically deformable material as the connecting body 386. It is preferable that they are present. At this time, the conductive particles have a shape that is flattened in the vertical direction as shown in Figure 25. This can happen. This way, the connection between the connector 386 and the conductive layer that is electrically connected to it This increases the contact area, reduces contact resistance, and suppresses the occurrence of problems such as poor contact. .

[0335] It is preferable that the connecting body 386 be positioned so as to be covered by the adhesive layer 220. For example, cured The connector 386 should be dispersed in the previous adhesive layer 220. By positioning the connection part 385, the adhesive layer 220 is placed on the display element 204 as shown in Figure 25. This includes not only configurations where elements are arranged (also called solid-state encapsulation structures), but also, for example, light-emitting elements with hollow encapsulation structures and If the configuration involves placing the adhesive layer 220 around the periphery, such as in a liquid crystal display device, the same method can be applied. can.

[0336] The above is an explanation of the cross-sectional configuration examples.

[0337] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination. [Explanation of Symbols]

[0338] 10 Electronic equipment 11 Display Panel 11a part 11b part 11c part 12 hinges 12a Shaft 12b Shaft 13 Slide rails 13a Slide rail 13b Slide rail 14 Hinge 14a Shaft 14b Shaft 15 Hinge 15a Shaft 15b Shaft 21 cabinets 22 enclosures 23 cabinets 41 FPC 42 Printed circuit boards 43 batteries 45 bands 46 bands 47 Cabinet buttons 48 batteries 51 Leaf spring 52 screws 53 Spring section 54 Notch 61 Arithmetic section 62 Bus Line 63 Touch Panel 64 Storage device 71 Display Controller 72 Touch Sensor Controller 73 Battery Controller 74 Power receiving section 75 Battery Modules 75a battery module 75b Battery Module 76 Sound Controller 77 Voice Input Section 78 Audio output section 81 Communication Module 82 Antenna 83 Posture detection area 84 Shape detection unit 85 External Interfaces 86 Camera Module 87 Vibration Module 88 sensors 91a Vibration element 91b Vibration element 91c Vibration element 91d Vibration element 92 Elastic body 95 Table 96 Audio 100 Touch Panels 101 circuit board 102 Display section 103 Circuits 104 Wiring 106 Connection part 109 Connecting Layer 146 Conductive film 147 Conductive film 148 Conductive film 149 nanowires 150 Input Devices 151 Conductive layer 152 Conductive layer 153 Conductive layer 155 Wiring 156 Wiring 157 FPC 158 IC 160 circuit boards 161 Insulating layer 167 FPC 168 IC 169 Connection part 191 circuit board 192 Adhesive layer 194 Insulating layer 201 Transistors 202 transistors 203 Transistors 204 display elements 205 Capacitive element 206 Connection part 207 Wiring 209 Connecting Layer 211 Insulating layer 212 Insulating layer 213 Insulating layer 214 Insulating layer 215 Insulating layer 216 Spacer 220 Adhesive layer 221 Electrode 222 EL layer 223 Electrode 224 Optical adjustment layer 230 Adhesive layer 231 Colored layer 232 Light blocking layer 233 Insulating layer 234 Insulating layer 235 Light blocking layer 241 Conductive layer 242 Semiconductor layer 243 Conductive layer 244 Conductive layer 261 Semiconductor layer 262 areas 263 areas 291 circuit boards 292 Adhesive layer 294 Insulating layer 330 circuit boards 332 Electrode 333 Electrode 334 Bridge Electrode 342 Wiring 350 FPC 373 FPC 381 Display section 382 Drive Circuit 385 Connection part 386 connectors 387 Intersection 601 Pulse voltage output circuit 602 Current sensing circuit 603 capacity

Claims

[Claim 1] An electronic device having a flexible display panel, The display panel has a first part, a second part, and a third part. The third portion is flexible and is located between the first and second portions. The display panel has a first display surface located in the first portion, a second display surface located in the second portion, and a third display surface located in the third portion, The display panel is transformable between the first and second forms. The first embodiment is a configuration in which the third portion is flat and the first display surface, the second display surface, and the third display surface are arranged parallel to each other. The second embodiment is such that the third portion has a first curved portion in which a part of the third display surface is bent in a convex shape, and a second curved portion in which another part of the third display surface is bent in a concave shape, and the part of the first display surface and the part of the second display surface overlap in parallel. An electronic device in which, when the display panel is in the second form, the third part deforms such that the width between the first curved part and the second curved part changes, thereby changing the relative position of the first part and the second part.

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