Ultraviolet irradiation device

Abstract

The objective is to provide an ultraviolet irradiation device that can suppress particles from entering the interior of the chamber through the opening when the chamber opening is exposed. [Solution] The ultraviolet irradiation apparatus according to the embodiment comprises: a chamber having a space inside for storing a workpiece and having an opening at one end; a light source capable of irradiating ultraviolet light into the chamber through a window provided in the chamber; a conveying unit having a cylindrical shape with one end facing the opening of the chamber; and a shutter having a plate shape and a hole penetrating in the thickness direction, which is movable between the end of the chamber and the end of the conveying unit with a gap in between. When the hole of the shutter faces the opening of the chamber, the portion of the shutter around the hole is located between the end of the chamber and the end of the conveying unit.

Description

Technical Field

[0001] Embodiments of the present invention relate to an ultraviolet irradiation device.

Background Art

[0002] There is an ultraviolet irradiation device that irradiates an object to be processed with ultraviolet rays to process the object. For example, there has been proposed an ultraviolet irradiation device that irradiates ultraviolet rays onto an ultraviolet-curable resin, an ultraviolet-curable adhesive, an adhesive sheet containing an ultraviolet-curable resin, etc., to cure the ultraviolet-curable resin or the ultraviolet-curable adhesive, or to adjust the adhesive strength of the adhesive sheet.

[0003] Here, when an ultraviolet-curable resin is irradiated with ultraviolet rays, the photoinitiator contained in the ultraviolet-curable resin becomes excited, and radicals are generated. The bonding rate between the generated radicals and oxygen is faster than the bonding rate between the generated radicals and the monomer, which is the main component of the ultraviolet-curable resin. Therefore, when an ultraviolet-curable resin is irradiated with ultraviolet rays in a gas containing oxygen such as air, the reaction on the surface of the ultraviolet-curable resin is inhibited by oxygen. Such a phenomenon is called oxygen inhibition.

[0004] Therefore, the ultraviolet irradiation device is provided with a chamber in which the object to be processed is stored, and when irradiating the object to be processed with ultraviolet rays, the air inside the chamber is removed by a purge gas. In addition, the chamber is provided with an opening for loading and unloading the object to be processed. And the ultraviolet irradiation device is further provided with a shutter for opening and closing the opening.

[0005] When irradiating the object to be processed placed inside the chamber with ultraviolet rays, the shutter is moved to close the opening of the chamber, and a purge gas is supplied into the chamber. If the opening of the chamber is closed by the shutter, it is possible to suppress the intrusion of air and particles in the atmosphere into the chamber through the opening of the chamber.

[0006] However, when loading materials into the chamber before processing or removing processed materials from the chamber, it is necessary to move the shutter to expose the chamber's opening. As a result, air and particles in the atmosphere may enter the chamber through the exposed opening.

[0007] In this case, as mentioned above, air that has entered the chamber can be removed by supplying purge gas to the chamber. However, particles that have entered the chamber cannot be removed by supplying purge gas to the chamber. If particles that have entered the chamber adhere to the processed material, the quality of the processed material may deteriorate.

[0008] Therefore, there was a need to develop an ultraviolet irradiation device that could suppress particles from entering the chamber through the chamber opening when the chamber opening was exposed. [Prior art documents] [Patent Documents]

[0009] [Patent Document 1] Patent No. 5324130 [Overview of the project] [Problems that the invention aims to solve]

[0010] The problem that the present invention aims to solve is to provide an ultraviolet irradiation device that can suppress particles from entering the interior of a chamber through the opening when the opening of the chamber is exposed. [Means for solving the problem]

[0011] The ultraviolet irradiation apparatus according to the embodiment comprises: a chamber having a space inside for storing a workpiece and having an opening at one end; a light source capable of irradiating ultraviolet light into the chamber through a window provided in the chamber; a conveying unit having a cylindrical shape with one end facing the opening of the chamber; and a shutter having a plate shape and a hole penetrating in the thickness direction, which is movable between the end of the chamber and the end of the conveying unit with a gap in between. When the hole of the shutter faces the opening of the chamber, the portion of the shutter around the hole is located between the end of the chamber and the end of the conveying unit. [Effects of the Invention]

[0012] According to embodiments of the present invention, it is possible to provide an ultraviolet irradiation device that can suppress particles from entering the interior of the chamber through the opening of the chamber when the opening of the chamber is exposed. [Brief explanation of the drawing]

[0013] [Figure 1] This is a schematic plan view illustrating the processed object. [Figure 2] This is a schematic cross-sectional view illustrating an ultraviolet irradiation device according to this embodiment. [Figure 3] This is a schematic cross-sectional view illustrating an opening / closing section related to a comparative example. [Figure 4] This is a schematic diagram of the shutter as viewed from the direction from the conveying section toward the opening of the chamber. [Figure 5] This is a schematic cross-sectional view illustrating the operation and effect of the opening and closing mechanism. [Figure 6] This is a schematic cross-sectional view illustrating the operation and effect of the opening and closing mechanism. [Modes for carrying out the invention]

[0014] The embodiments will be illustrated below with reference to the drawings. In each drawing, similar components are denoted by the same reference numerals, and detailed descriptions will be omitted as appropriate.

[0015] The ultraviolet irradiation device according to this embodiment can be used, for example, to irradiate ultraviolet rays to cure an ultraviolet curable resin or an ultraviolet curable adhesive, or to adjust the adhesive strength of an adhesive sheet containing an ultraviolet curable resin. Here, as an example, an ultraviolet irradiation device that irradiates ultraviolet rays to a semiconductor wafer provided with an adhesive sheet to reduce the adhesive strength of the adhesive sheet will be described.

[0016] First, the object 100 to be irradiated with ultraviolet rays will be exemplified. FIG. 1 is a schematic plan view for exemplifying the object 100. As shown in FIG. 1, the object 100 includes a frame 101, a semiconductor wafer 102, and an adhesive sheet 103.

[0017] The frame 101 has, for example, a plate shape and is formed of a material that can transmit ultraviolet rays 200. The frame 101 is formed of, for example, quartz glass.

[0018] The semiconductor wafer 102 can be provided in the central region of the frame 101. The semiconductor wafer 102 has a plurality of chip-shaped semiconductor elements that have been singulated by dicing.

[0019] The adhesive sheet 103 is provided between the frame 101 and the semiconductor wafer 102. The adhesive sheet 103 is adhered to the surface of the semiconductor wafer 102 on the side of the frame 101. The adhesive sheet 103 contains an ultraviolet curable resin.

[0020] FIG. 2 is a schematic cross-sectional view for exemplifying the ultraviolet irradiation device 1 according to this embodiment. As shown in FIG. 2, the ultraviolet irradiation device 1 includes, for example, a housing 2, a processing unit 3, a reflection unit 4, a light source unit 5, a light shielding unit 6, an exhaust unit 7, and a controller 8.

[0021] The housing 2, for example, has a box shape and has a space inside that houses the processing unit 3, the reflector 4, the light source unit 5, the light shielding unit 6, the exhaust unit 7, and the controller 8. The inside of the housing 2 can be divided into three layers, for example. For example, as shown in Figure 2, the exhaust unit 7 and the controller 8 can be provided in the lowest layer 2a of the housing 2. The light source unit 5 and the light shielding unit 6 can be provided in the layer 2b above layer 2a. The processing unit 3 and the reflector 4 can be provided in the uppermost layer 2c of the housing 2.

[0022] The exterior of the housing 2 can be, for example, a rectangular parallelepiped. The housing 2 has a frame structure using, for example, shaped steel or square pipes. A cover can be provided on the outer surface of the housing 2. The housing 2 can be made of, for example, metal. Legs 2d, such as adjustable feet, can be provided on the bottom surface of the housing 2.

[0023] The processing unit 3 includes, for example, a chamber 31, a window 32, a mounting section 33, a gas supply section 34, a transport section 35, and an opening / closing section 36. The chamber 31 is provided, for example, at the end of the reflecting section 4 opposite to the light source section 5. The chamber 31 is, for example, box-shaped. The chamber 31 has a space inside in which the workpiece 100 is stored. An opening 31a can be provided at the end of the chamber 31 for loading the workpiece 100 into the chamber 31 before processing and for unloading the processed workpiece 100 from the chamber 31. The opening 31a can be provided at a position opposite to the transport section 35. In addition, an opening 31b is provided at the end of the chamber 31 on the reflecting section 4 side, into which ultraviolet light 200 irradiated from the light source section 5 enters. The chamber 31 is made of, for example, metal.

[0024] If a chamber 31 is provided, it is possible to suppress the irradiation of ultraviolet rays 200 directed towards the workpiece 100 into the inside of the housing 2, maintain the atmosphere of the purge gas described later, and suppress particles inside the housing 2 from adhering to the workpiece 100 during processing.

[0025] The window 32 is plate-shaped and closes the opening 31b of the chamber 31. The window 32 can be located outside the chamber 31, inside the opening 31b, or inside the chamber 31. The window 32 is made of a material that can transmit ultraviolet light 200 irradiated from the light source 5. For example, the window 32 can be made of quartz glass.

[0026] The mounting section 33 is located inside the chamber 31. The mounting section 33 is located around the opening 31b of the chamber 31. The workpiece 100 is placed on the mounting section 33. The periphery of the workpiece 100 (frame 101) is supported by the mounting section 33. When the workpiece 100 supported by the mounting section 33 is viewed from the direction toward the mounting section 33, the mounting section 33 is located in a position that does not overlap with the semiconductor wafer 102 at least. Therefore, ultraviolet light 200 transmitted through the window 32 can be irradiated through the frame 101 onto the adhesive sheet 103 that is bonded to the frame 101 side of the semiconductor wafer 102.

[0027] Here, since the adhesive sheet 103 contains an ultraviolet-curing resin, if the adhesive sheet 103 is irradiated with ultraviolet light in an oxygen-containing gas such as air, so-called oxygen inhibition may occur. If oxygen inhibition occurs, the processing time may be prolonged or unevenness may occur in the adhesive strength of the adhesive sheet 103. Therefore, a gas supply unit 34 is provided in the processing unit 3.

[0028] The gas supply unit 34 supplies purge gas into the chamber 31. The purge gas can be an oxygen-free gas. The purge gas can be an inert gas such as nitrogen gas or a noble gas.

[0029] The gas supply unit 34 includes, for example, a gas source 34a, an on / off valve 34b, and a control valve 34c. The gas source 34a can be a high-pressure cylinder containing purge gas or factory piping.

[0030] The on / off valve 34b switches the supply of purge gas to and from the on / off valve. For example, when processing the material 100, the on / off valve 34b supplies purge gas into the chamber 31. For example, when processing the material 100 is finished, the on / off valve 34b stops supplying purge gas into the chamber 31.

[0031] The control valve 34c controls at least one of the flow rate and pressure of the purge gas supplied into the chamber 31. The control valve 34c may also have the function of an on-off valve 34b. If the control valve 34c has the function of an on-off valve 34b, the on-off valve 34b can be omitted.

[0032] Here, as shown in Figure 2, the loading of the unprocessed material 100 into the chamber 31 and the unprocessed material 100 out of the chamber 31 can be performed by the conveying device 300. The conveying device 300 can be, for example, an articulated robot. The conveying device 300 illustrated in Figure 2 is a horizontal articulated robot.

[0033] In this case, when the processed material 100 held by the conveying device 300 is conveyed inside the housing 2, particles inside the housing 2 may adhere to the processed material 100. If particles adhere to the processed material 100, the quality of the processed material 100 may deteriorate.

[0034] Therefore, a transport section 35 is provided inside the housing 2. The transport section 35 extends between the opening 31a of the chamber 31 and the housing 301 in which the transport device 300 is installed. The transport section 35 is cylindrical, with one end facing the opening 31a of the chamber 31. The transport section 35 is made of, for example, metal.

[0035] As shown in Figure 2, the internal space of the transport section 35 is connected to the internal space of the housing 301 in which the transport device 300 is installed. The internal space of the housing 301 is a space in which the cleanliness (number of particles) is controlled. If a transport unit 35 is provided, it is possible to suppress the adhesion of particles from inside the housing 2 to the processed material 100 being transported between the housing 301, which has a controlled level of cleanliness, and the chamber 31.

[0036] As mentioned above, purge gas is supplied to the inside of the chamber 31. If the purge gas supplied to the inside of the chamber 31 flows into the transport unit 35 or the housing 301 through the opening 31a of the chamber 31, there is a risk that particles may enter the transport unit 35 or the housing 301.

[0037] Therefore, an opening / closing section 36 is provided between the end of the conveying section 35 on the chamber 31 side and the end of the chamber 31 where the opening 31a is provided. Further details regarding the opening / closing section 36 will be described later.

[0038] As will be described later, the light source unit 5 is equipped with a discharge lamp 51. The discharge lamp 51 irradiates ultraviolet light 200 radially in all directions, but the longer the distance to the irradiation position, the lower the intensity of the ultraviolet light 200 at the irradiation position. Therefore, as shown in Figure 2, the intensity of ultraviolet light 200 that directly incident on the adhesive sheet 103 bonded to the central region of the semiconductor wafer 102 is higher than the intensity of ultraviolet light 200 that directly incident on the adhesive sheet 103 bonded to the peripheral region of the semiconductor wafer 102. In addition, the discharge lamp 51 has a shape that extends in one direction. Therefore, a linear region is created in the central region of the adhesive sheet 103 bonded to the semiconductor wafer 102 where the intensity of the directly incident ultraviolet light 200 is highest.

[0039] In other words, if ultraviolet light 200 is directly incident on the adhesive sheet 103 bonded to the semiconductor wafer 102, the intensity of the ultraviolet light 200 incident on the adhesive sheet 103 will vary greatly. When the intensity of the incident ultraviolet light 200 varies greatly, there is a risk that the adhesive strength of the adhesive sheet 103 will vary greatly or become uneven. As a result, the individual chip-shaped semiconductor elements may become more likely to detach from the adhesive sheet 103 or become more difficult to separate from the adhesive sheet 103.

[0040] Furthermore, when the discharge lamp 51 of the light source unit 5 is lit, heat is generated along with ultraviolet light 200. The generated heat is irradiated from the discharge lamp 51 as infrared rays (heat rays) 201. In the case of infrared rays 201, the discharge lamp 51 is also irradiated radially in all directions. Also, the shorter the distance to the irradiation position, the higher the intensity of the infrared rays 201 at the irradiation position. As a result, the temperature of the adhesive sheet 103 bonded to the semiconductor wafer 102 may become locally high in the central region of the adhesive sheet 103. If the temperature of the adhesive sheet 103 becomes locally high, the adhesive sheet 103 may undergo localized thermal deformation. If the adhesive sheet 103 undergoes localized thermal deformation, it may become difficult to separate the semiconductor elements that were bonded to the thermally deformed portion.

[0041] Therefore, the ultraviolet irradiation device 1 is provided with a reflector 4. The reflector 4 is cylindrical and is provided between the chamber 31 (workpiece 100) and the light source unit 5 (discharge lamp 51). Both ends of the reflector 4 are open. One opening of the reflector 4 faces the window 32 of the processing unit 3. The other opening of the reflector 4 faces the discharge lamp 51 of the light source unit 5 through a hole 2c1 provided in the bottom plate of the layer 2c of the housing 2.

[0042] As shown in Figure 2, a portion of the ultraviolet light 200 irradiated from the discharge lamp 51 and directed toward the workpiece 100 enters the inner wall of the reflecting section 4 through the hole 2c1, is reflected by the inner wall of the reflecting section 4, and enters the workpiece 100. The reflected ultraviolet light 200 can be incident on almost the entire surface of the adhesive sheet 103 bonded to the semiconductor wafer 102. As a result, the variation in the intensity of ultraviolet light 200 in the adhesive sheet 103, as described above, can be mitigated.

[0043] The inner wall of the reflective section 4 can be formed from a material with high reflectivity to ultraviolet 200. For example, the reflective section 4 can be formed from an aluminum alloy, a film or layer containing an aluminum alloy can be provided on the inner wall of the reflective section 4, or a white film or layer can be provided on the inner wall of the reflective section 4.

[0044] Furthermore, irregularities can be provided on the inner wall of the reflective portion 4. For example, the inner wall of the reflective portion 4 can be embossed. If irregularities are provided on the inner wall of the reflective portion 4, ultraviolet rays 200 incident on the inner wall of the reflective portion 4 can be diffusely reflected. Therefore, it becomes easier to cause the reflected ultraviolet rays 200 to be incident on the entire surface of the adhesive sheet 103 bonded to the semiconductor wafer 102 in a substantially uniform manner. If the reflected ultraviolet rays 200 are incident on the adhesive sheet 103 in a substantially uniform manner, the variation in the intensity of ultraviolet rays 200 on the adhesive sheet 103, as described above, can be further reduced.

[0045] Furthermore, if a reflective section 4 is provided, a portion of the infrared radiation 201 irradiated from the discharge lamp 51 can be reflected by the reflective section 4 and incident on the entire surface of the adhesive sheet 103. As a result, it is possible to suppress the localized increase in the temperature of the adhesive sheet 103 and the resulting localized thermal deformation of the adhesive sheet 103.

[0046] Furthermore, the temperature rise of the discharge lamp 51 can be suppressed by the exhaust unit 7, which will be described later, thus reducing the overall intensity of the infrared rays 201 incident on the adhesive sheet 103. In this case, if the intensity of the infrared rays 201 incident on the adhesive sheet 103 does not become locally high, thermal deformation of the adhesive sheet 103 can be suppressed.

[0047] Furthermore, if the inner wall of the reflective portion 4 has irregularities, the infrared rays 201 incident on the inner wall of the reflective portion 4 can be diffusely reflected. This makes it easy to cause the reflected infrared rays 201 to be incident on the entire surface of the adhesive sheet 103 almost uniformly. If the reflected infrared rays 201 are incident on the adhesive sheet 103 almost uniformly, localized thermal deformation of the adhesive sheet 103 can be effectively suppressed.

[0048] The light source unit 5 faces the semiconductor wafer 102 of the workpiece 100 placed on the mounting unit 33, via the reflecting unit 4 and the window 32 of the processing unit 3. The light source unit 5 irradiates the inside of the chamber 31 with ultraviolet light through the window 32 provided in the chamber 31. The light source unit 5 irradiates the adhesive sheet 103 of the workpiece 100 with ultraviolet light through the window 32. The light source unit 5 includes, for example, a discharge lamp 51 and a reflector 52.

[0049] The discharge lamp 51 emits ultraviolet light 200. The discharge lamp 51 is located inside the reflector 52. The discharge lamp 51 is not particularly limited as long as it emits ultraviolet light of a wavelength that can reduce the adhesive strength of the adhesive sheet 103. The discharge lamp 51 can be, for example, a low-pressure mercury lamp. The discharge lamp 51 has a shape that extends in one direction. The emission length of the discharge lamp 51 can be longer than the planar dimension of the semiconductor wafer 102. For example, if the diameter of the semiconductor wafer 102 is 300 mm, the emission length of the discharge lamp 51 can be about 400 mm.

[0050] The reflector 52 surrounds the discharge lamp 51, with an opening on the side facing the workpiece 100. The inner surface of the reflector 52 is inclined away from the discharge lamp 51 as it approaches the opening. The inner surface of the reflector 52 can also be curved, for example. For example, the inner surface of the reflector 52 can be parabolic. The inner surface of the reflector 52 can be formed from a material with high reflectivity to ultraviolet light 200. For example, the reflector 52 can be formed from an aluminum alloy, or a film or layer containing an aluminum alloy can be provided on the inner surface of the reflector 52, or a white film or layer can be provided on the inner surface of the reflector 52.

[0051] If a reflector 52 is provided, as shown in Figure 2, ultraviolet rays 200 irradiated from the discharge lamp 51 that did not go toward the reflector 4 and the workpiece 100 can be reflected toward the reflector 4 and the workpiece 100. Therefore, the utilization efficiency of ultraviolet rays 200 irradiated from the discharge lamp 51 can be improved.

[0052] In the above example, a discharge lamp 51 that emits ultraviolet light 200 was provided, but it is also possible to provide a light-emitting element such as a light-emitting diode that emits ultraviolet light 200. For example, multiple light-emitting elements may be arranged in a line in one direction or in a matrix. In other words, the light source unit 5 only needs to be capable of emitting ultraviolet light.

[0053] Here, when loading the material 100 to be processed into the chamber 31 or unloading the processed material 100 from the chamber 31, the opening 31a of the chamber 31 is exposed. As a result, ultraviolet light 200 may leak to the outside of the housing 2 through the chamber 31 and the transport unit 35. In this case, turning off the discharge lamp 51 will prevent ultraviolet light 200 from leaking to the outside of the housing 2. However, if this is done, the discharge lamp 51 will need to be turned on again when processing the next material 100. Turning on the discharge lamp 51 again requires a predetermined amount of time for the discharge to stabilize, thus increasing the processing time.

[0054] Therefore, the ultraviolet irradiation device 1 is provided with a light-shielding section 6. The light-shielding section 6 switches between transmitting and blocking ultraviolet light 200 irradiated from the light source section 5 (discharge lamp 51) to the reflecting section 4 (processing object 100).

[0055] As shown in Figure 2, for example, a pair of light-shielding sections 6 can be provided. When viewed from a direction along the central axis (tube axis) of the discharge lamp 51, the pair of light-shielding sections 6 face each other with the light source section 5 in between. The pair of light-shielding sections 6 are provided at positions symmetrical to each other with respect to the central axis of the discharge lamp 51.

[0056] The light-shielding section 6 includes, for example, a light-shielding plate 61, an arm 62, a rotating shaft 63, and a drive unit 64. When viewed from a direction along the central axis of the discharge lamp 51, the light shield 61 has a shape that is curved outward from the discharge lamp 51, for example. The outline of the outer surface of the light shield 61 when viewed from a direction along the central axis of the discharge lamp 51 can be, for example, part of a circle. The light shield 61 can be made from a material that can block ultraviolet rays 200 irradiated from the light source 5. The light shield 61 can be made from a metal such as stainless steel or an aluminum alloy, for example.

[0057] When viewed from a direction along the central axis of the discharge lamp 51, the arm 62 has a shape that is curved outward from the discharge lamp 51, for example. The light shield plate 61 is provided on the outer surface of the arm 62. The arm 62 can be made from a metal such as an aluminum alloy, for example.

[0058] When viewed from a direction along the central axis of the discharge lamp 51, the rotation axis 63 is located near the end of the arm 62 opposite to the discharge lamp 51 side. The rotation axis 63 is columnar in shape and extends in a direction along the central axis of the discharge lamp 51.

[0059] The drive unit 64 is connected to the rotating shaft 63. The drive unit 64 switches between transmitting and blocking ultraviolet 200 irradiated from the light source unit 5 (discharge lamp 51) by oscillating the light shielding plate 61 via the rotating shaft 63 and the arm 62. The drive unit 64 can be equipped with, for example, a control motor such as a servo motor, an air cylinder or hydraulic cylinder, or a motor and crank mechanism. When the light shielding plate 61 oscillates, the tip of the light shielding plate 61 oscillates in an arc shape around the rotating shaft 63.

[0060] Note that the light-shielding section 6 is not limited to the example shown. The light-shielding section 6 can be any component that can switch between transmitting and blocking ultraviolet light 200 from the discharge lamp 51 to the workpiece 100.

[0061] If a light-shielding section 6 is provided, the discharge lamp 51 can be kept lit when the processed material 100 is removed from the chamber 31 or when the material 100 before processing is brought into the chamber 31. Therefore, the processing time when processing multiple materials 100 sequentially can be shortened. In addition, even if the discharge lamp 51 is kept lit, it is possible to suppress the leakage of ultraviolet rays 200 to the outside of the housing 2 through the chamber 31 and the transport section 35.

[0062] Furthermore, the light-emitting element takes less time to achieve stable illumination compared to the discharge lamp 51. Therefore, when using a light-emitting element instead of the discharge lamp 51, the light-shielding section 6 can be omitted and the light-emitting element can be switched ON / OFF.

[0063] The exhaust section 7 suppresses the temperature rise of the discharge lamp 51 by exhausting the gas in the space surrounded by the pair of light-shielding sections 6 (light-shielding plates 61). If the temperature rise of the discharge lamp 51 can be suppressed, the intensity of the infrared radiation 201 emitted from the discharge lamp 51 can be reduced. Therefore, thermal deformation caused by the temperature rise of the adhesive sheet 103 can be suppressed.

[0064] The exhaust section 7 includes, for example, a duct 71 and an exhaust pump 72. One end of the duct 71 is connected to a space enclosed by a pair of light-shielding sections 6 (light-shielding plates 61). An exhaust pump 72 is connected to the other end of the duct 71. The duct 71 can be, for example, a flexible duct.

[0065] The exhaust pump 72 exhausts the gas in the space enclosed by the pair of light-shielding parts 6 (light-shielding plates 61) via the duct 71. In this process, the exhaust pump 72 can also exhaust the gas in the internal space of the reflecting part 4. The exhaust pump 72 can be, for example, a blower.

[0066] The controller 8 includes, for example, an arithmetic unit such as a CPU (Central Processing Unit) and a storage unit such as memory. The controller 8 is, for example, a computer. The controller 8 controls the operation of each element provided in the ultraviolet irradiation device 1 based on a control program stored in the storage unit. The controller 8 may also include, for example, a lighting circuit and power supply for the discharge lamp 51.

[0067] Next, the opening / closing section 36 will be explained further. Figure 3 is a schematic cross-sectional view illustrating an opening / closing section 136 according to a comparative example. As shown in Figure 3, the opening / closing section 136 has a shutter 136a and a movable section 136b. Shutter 136a is a plate-like body. Viewed from the direction from the transport unit 35 toward the opening 31a of the chamber 31, the moving unit 136b moves the shutter 136a between a position where the opening 31a of the chamber 31 is hidden by the shutter 136a and a position where the opening 31a of the chamber 31 is exposed from the shutter 136a.

[0068] For example, when irradiating the object 100 with ultraviolet light 200, the moving unit 136b moves the shutter 136a to a position where the opening 31a of the chamber 31 is hidden by the shutter 136a. This prevents ultraviolet light 200 irradiated into the chamber 31 from irradiating the inside of the housing 2, maintains the atmosphere of the purge gas, and prevents particles inside the housing 2 from adhering to the object 100 being processed.

[0069] However, as shown in Figure 3, when loading the material to be processed 100 into the chamber 31 before processing, or when unloading the processed material 100 from the chamber 31, the moving unit 136b moves the shutter 136a to a position where the opening 31a of the chamber 31 is exposed from the shutter 136a. Figure 3 shows the case where the opening 31a of the chamber 31 is exposed from the shutter 136a. As shown in Figure 3, there is space between the chamber 31 and the transport unit 35 for moving the shutter 136a, so between the unloading of the processed material 100 and the loading of the next material to be processed 100, there is a risk that particles 202 inside the housing 2 may enter the chamber 31 through the space between the chamber 31 and the transport unit 35 and the opening 31a of the chamber 31.

[0070] In this case, air inside the housing 2 also enters the chamber 31, but the air that enters the chamber 31 can be removed by supplying purge gas to the chamber 31 via the gas supply unit 34. In contrast, particles 202 that enter the chamber 31 cannot be removed by supplying purge gas to the chamber 31. If particles 202 that enter the chamber 31 adhere to the processed material 100, the quality of the processed material 100 may deteriorate.

[0071] Therefore, in the opening / closing section 36 according to this embodiment, when the opening 31a of the chamber 31 is exposed, it is made difficult for particles 202 to enter the interior of the chamber 31 through the opening 31a of the chamber 31.

[0072] As shown in Figure 2, the opening / closing section 36 includes, for example, a shutter 36a and a movable section 36b. Figure 4 is a schematic diagram of the shutter 36a as viewed from the direction toward the opening 31a of the chamber 31 from the transport section 35. As shown in Figures 2 and 4, the shutter 36a is plate-shaped and has a hole 36a1 that penetrates in the thickness direction. In this case, since the workpiece 100 is plate-shaped, the planar dimension of the workpiece 100 is larger than the thickness dimension of the workpiece 100. Therefore, as shown in Figure 4, the hole 36a1 has a shape that extends in one direction.

[0073] The shutter 36a is provided so as to be movable between the end of the chamber 31 and the end of the conveying section 35, with a gap in between. Viewed from the direction from the transport unit 35 toward the opening 31a of the chamber 31, the moving unit 36b moves the shutter 36a between a position where the opening 31a of the chamber 31 is hidden by the shutter 36a and a position where the opening 31a of the chamber 31 overlaps with the hole 36a1 of the shutter 36a. The moving unit 36b can be equipped with, for example, a control motor such as a servo motor, an air cylinder or hydraulic cylinder, a motor and crank mechanism, etc. Furthermore, the opening / closing section 36 may also be further equipped with linear bearings or the like to guide the movement of the shutter 36a.

[0074] Figures 5 and 6 are schematic cross-sectional views illustrating the operation and effects of the opening / closing section 36. When irradiating the workpiece 100 with ultraviolet light 200, as shown in Figure 5, the moving unit 36b moves the shutter 36a so that the portion of the shutter 36a without a hole 36a1 faces the opening 31a of the chamber 31. In other words, the moving unit 36b moves the shutter 36a to a position where, when viewed from the direction from the transport unit 35 toward the opening 31a of the chamber 31, the opening 31a of the chamber 31 is hidden by the shutter 36a.

[0075] In this way, ultraviolet rays 200 irradiated into the chamber 31 through the window 32 can be prevented from leaking out of the opening 31a of the chamber 31. In addition, the purge gas supplied into the chamber 31 can be prevented from leaking out of the opening 31a of the chamber 31. Furthermore, if the leakage of purge gas from the opening 31a of the chamber 31 can be prevented, the pressure inside the chamber 31 will become higher than the pressure in the internal space of the housing 2. Therefore, it is possible to prevent particles from entering the chamber 31 through the gap between the end of the chamber 31 where the opening 31a is provided and the shutter 36a.

[0076] When loading the material to be processed 100 into the chamber 31 before processing, or when unloading the processed material 100 from the chamber 31, as shown in Figure 6, the moving unit 36b moves the shutter 36a so that the hole 36a1 of the shutter 36a faces the opening 31a of the chamber 31. In other words, the moving unit 36b moves the shutter 36a to a position where, when viewed from the direction from the transport unit 35 toward the opening 31a of the chamber 31, the hole 36a1 of the shutter 36a overlaps with the opening 31a of the chamber 31.

[0077] In this manner, the material to be processed 100 can be loaded or unloaded through the hole 36a1 of the shutter 36a and the opening 31a of the chamber 31.

[0078] In this case, as shown in Figure 6, when the hole 36a1 of the shutter 36a faces the opening 31a of the chamber 31, the portion of the shutter 36a around the hole 36a1 is located between the end of the chamber 31 where the opening 31a is provided and the end of the conveying unit 35 on the chamber 31 side. That is, the portion of the shutter 36a without the hole 36a1 is always located between the end of the chamber 31 where the opening 31a is provided and the end of the conveying unit 35 on the chamber 31 side.

[0079] Therefore, with the shutter 36a according to this embodiment, it is possible to suppress the entry of particles 202 inside the housing 2 into the interior of the chamber 31 or the interior of the transport unit 35 through the space between the chamber 31 and the transport unit 35.

[0080] For example, when the shutter 136a according to the comparative example described in Figure 3 was provided, the cleanliness inside the chamber 31 was approximately Class 1000. In contrast, when the shutter 36a according to this embodiment was provided, the cleanliness inside the chamber 31 could be reduced to approximately Class 10.

[0081] Furthermore, while Figures 5 and 6 illustrate the case where the movable part 36b is provided on the window 32 side in the direction from the light source unit 5 toward the window 32 provided in the chamber 31, the movable part 36b can also be provided on the opposite side from the window 32 side. When the movable part 36b is provided on the opposite side from the window 32 side, the hole 36a1 of the shutter 36a can be moved away from the window 32 so that the hole 36a1 of the shutter 36a faces the opening 31a of the chamber 31, and the hole 36a1 of the shutter 36a can be moved closer to the window 32 so that the part of the shutter 36a without a hole 36a1 faces the opening 31a of the chamber 31.

[0082] Furthermore, the shutter 36a can be moved in a direction that intersects the direction from the light source unit 5 toward the window 32 provided in the chamber 31. Although the example given illustrates the reciprocating movement of the shutter 36a in a linear direction, the shutter can also be oscillated or rotated in a circumferential direction.

[0083] However, as shown in Figure 4, the hole 36a1 of the shutter 36a has a shape that extends in one direction due to the shape of the workpiece 100. Therefore, it is preferable to move the shutter 36a in a direction intersecting the direction in which the hole 36a1 extends. In this way, the shutter 36a can be made smaller.

[0084] The material of shutter 36a is not particularly limited, as long as it has a certain degree of rigidity and resistance to ultraviolet 200. The material of shutter 36a can be, for example, a metal such as aluminum alloy or a fluororesin.

[0085] There are no particular limitations on the thickness of the shutter 36a, but it can be, for example, around 3mm to 6mm.

[0086] Furthermore, when moving the shutter 36a, there is a risk of particle generation if the shutter 36a comes into contact with at least one of the ends of the chamber 31, or the end of the transport unit 35.

[0087] Therefore, as shown in Figures 5 and 6, a gap S1 is provided between the shutter 36a and the end of the chamber 31. A gap S2 is provided between the shutter 36a and the end of the transport section 35. In this case, if the gaps S1 and S2 are made too small, the aforementioned contact is more likely to occur. On the other hand, if the gaps S1 and S2 are made too large, purge gas may easily leak from inside the chamber 31, or particles may easily penetrate inside the chamber 31. Therefore, it is preferable that the gaps S1 and S2 be about 0.5 mm to 2 mm.

[0088] Although several embodiments of the present invention have been illustrated above, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. Furthermore, the embodiments described above can be implemented in combination with each other.

[0089] The following are additional notes regarding the embodiments described above.

[0090] (Note 1) A chamber having an internal space for storing the material to be processed, with an opening at one end; A light source capable of irradiating ultraviolet light into the chamber is provided through a window in the chamber; It has a cylindrical shape, with one end facing the opening of the chamber and a conveying section; A shutter is provided so as to be movable between the end of the chamber and the end of the conveying section, with a gap in between, and is plate-shaped and has a hole that penetrates in the thickness direction; It is equipped with, An ultraviolet irradiation device wherein, when the hole of the shutter faces the opening of the chamber, the portion of the shutter surrounding the hole is located between the end of the chamber and the end of the transport section.

[0091] (Note 2) The hole in the shutter has a shape that extends in one direction. The ultraviolet irradiation device according to Appendix 1, wherein the shutter is movable in a direction intersecting the direction in which the hole extends.

[0092] (Note 3) The ultraviolet irradiation apparatus according to Appendix 1 or 2, further comprising a gas supply unit capable of supplying purge gas into the chamber.

[0093] (Note 4) The processed product comprises a semiconductor wafer and an adhesive sheet containing an ultraviolet-curable resin. The light source is an ultraviolet irradiation device according to any one of the appendices 1 to 3, capable of irradiating the adhesive sheet with ultraviolet light through the window. [Explanation of Symbols]

[0094] 1 UV irradiation device, 2 housing, 3 processing unit, 5 light source unit, 31 chamber, 31a opening, 32 window, 33 mounting unit, 34 gas supply unit, 35 transport unit, 36 opening / closing unit, 36a shutter, 36a1 hole, 36b moving unit, 51 discharge lamp, 100 processed material, 200 ultraviolet light

Claims

1. A chamber having an internal space for storing the material to be processed, with an opening at one end; A light source capable of irradiating ultraviolet light into the interior of the chamber is provided through a window in the chamber; A conveying section having a cylindrical shape, with one end facing the opening of the chamber; A shutter is provided so as to be movable between the end of the chamber and the end of the conveying section, with a gap in between, and is plate-shaped and has a hole that penetrates in the thickness direction; It is equipped with, An ultraviolet irradiation device wherein, when the hole of the shutter faces the opening of the chamber, the portion of the shutter surrounding the hole is located between the end of the chamber and the end of the transport section.

2. The hole in the shutter has a shape that extends in one direction. The ultraviolet irradiation device according to claim 1, wherein the shutter is movable in a direction intersecting the direction in which the hole extends.

3. The ultraviolet irradiation apparatus according to claim 1 or 2, further comprising a gas supply unit capable of supplying purge gas to the inside of the chamber.

4. The processed product comprises a semiconductor wafer and an adhesive sheet containing an ultraviolet-curable resin. The ultraviolet irradiation device according to claim 1 or 2, wherein the light source unit is capable of irradiating the adhesive sheet with ultraviolet light through the window.

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