High-pressure boxes and energy storage containers

Abstract

We provide high-pressure boxes and energy storage containers that can meet cooling requirements using a natural cooling method. [Solution] The high-voltage box includes a plurality of electrical components 100, a conductive member 200 having a first plate surface and a second plate surface facing each other along a first direction, the first plate surface including a first region and electrically connected to the corresponding electrical component via the first region, and a semiconductor cooling unit including a cooling end that absorbs heat, the cooling end being thermally connected to the conductive member via the second plate surface.

Description

Technical Field

[0001] The present invention relates to the field of energy storage technology, and particularly to high-pressure boxes and energy storage containers.

Background Art

[0002] The development of energy storage technology has been advancing rapidly and has become an important foundation for supporting energy conversion and sustainable development. With the progress of technology, the energy density of energy storage batteries is high, the lifespan is long, and the cost has been reduced, which means that the battery capacity becomes larger and the current flowing through electrical equipment also increases. In order to operate the energy storage system normally, higher requirements are imposed on the heat dissipation and heat resistance performance of electrical equipment in the energy storage container.

[0003] The high-pressure box is an important component of the energy storage container. A plurality of electrical components are arranged in the high-pressure box, ensuring the safe and reliable operation of the energy storage system. When the system is operating, the circuit is connected, and heat is generated when each electrical component operates, so it is necessary to dissipate heat quickly. In the related technology, natural cooling was adopted as the cooling method for the high-pressure box. With the progress of energy storage technology, as the current of the high-pressure box has increased continuously, the natural cooling method can no longer meet the cooling requirements of the high-pressure box.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Based on the above, the object of the present invention is to provide a high-pressure box and an energy storage container, and solve the problem that the cooling requirements of the high-pressure box cannot be met by the natural cooling method at least in part.

Means for Solving the Problems

[0005] To achieve the above objectives, in a first aspect of the present invention, a high-voltage box is provided, comprising: a plurality of electrical components; a plurality of conductive members, each conductive member having a first plate surface and a second plate surface arranged opposite to each other along a first direction, the first plate surface including a first region, each conductive member being electrically connected to a corresponding electrical component via the first region; and a plurality of semiconductor cooling units, each semiconductor cooling unit including a cooling end for absorbing heat, the plurality of cooling ends being thermally connected to the plurality of conductive members via the plurality of second plate surfaces, wherein, along the first direction, the orthographic projection of each cooling end onto the corresponding first plate surface overlaps with at least a portion of the first region.

[0006] Optionally, each semiconductor cooling unit further includes a heat dissipation end, which is thermally connected to a first active heat dissipation unit.

[0007] In the optional configuration, a heat dissipation member is further connected between each heat dissipation end and the corresponding first active heat dissipation unit.

[0008] In the optional configuration, each heat dissipation member includes a heat transfer body and a plurality of heat dissipation fins, the heat transfer body having a first heat transfer surface and a second heat transfer surface, the first heat transfer surface being thermally connected to the heat dissipation end, the plurality of heat dissipation fins being thermally connected to the second heat transfer surface at intervals from each other, and each of the first active heat dissipation units being connected to the side of the corresponding heat dissipation fin away from the second heat transfer surface.

[0009] In the optional configuration, if at least two of the heat dissipation ends have adjacent and coplanar surfaces, then at least two of the surfaces are thermally connected to the same first heat transfer surface.

[0010] In the optional configuration, along the first direction, the orthographic projection of each cooling end onto the corresponding first plate surface covers the first region.

[0011] In the optional configuration, at least a portion of the plurality of conductive members are stacked along the first direction, with at least two layers spaced apart, and an insulating support member is provided between two adjacent conductive members along the first direction.

[0012] In the optional configuration, the high-voltage box comprises a housing, the plurality of electrical components, the plurality of conductive members, and the plurality of semiconductor cooling units are arranged within the housing, the side walls of the housing are provided with through-holes and mounting through-holes, a second active heat dissipation unit is connected to the mounting through-hole, and at least one of the conductive members is adjacent to the side wall of the housing and extends along the side wall of the housing.

[0013] Optionally, the high-pressure box includes a first active heat dissipation unit, and at least one of the first active heat dissipation unit and the second active heat dissipation unit includes a fan.

[0014] Optionally, the high-voltage box includes a housing, the housing comprises panels to which a plurality of electrical interfaces are connected, each of the conductive members is electrically connected to the corresponding electrical interface, at least one cooling electrical interface is further connected to the panels, and the plurality of semiconductor cooling units are electrically connected to the at least one cooling electrical interface.

[0015] In the optional configuration, the multiple conductive members include solid structures formed from conductive materials.

[0016] Optionally, each of the aforementioned electrical components includes at least one of the following: a precharge resistor, a precharge relay, a fuse, a high-voltage relay, a switching power relay, a switching power supply, an isolation switch, a current sensor, and a shunt.

[0017] Based on the same inventive concept, a second aspect of the present invention further provides an energy storage container comprising an energy storage cluster, a power conditioning system, and a high-voltage box of the first aspect, wherein the high-voltage box is electrically connected to the energy storage cluster and the power conditioning system, respectively. [Effects of the Invention]

[0018] As can be seen from the above, the high-pressure box and energy storage container provided by the present invention have advantages such as a small volume, compact structure, absence of mechanical moving parts, fewer space and shape limitations, and high reliability compared to a semiconductor cooling unit. The cooling end of the semiconductor cooling unit can be thermally connected to the surface of a conductive member, and the cooling end can cover at least a portion of the first region where the conductive member and electrical components are electrically connected. The semiconductor cooling unit can directly convert electrical energy into cold energy, has low thermal inertia, can rapidly cool conductive members, can safely operate electrical components at an appropriate temperature, enhances the operating efficiency and stability of the high-pressure box, improves the operating efficiency of the entire energy storage system including the high-pressure box, and contributes to ensuring the operational safety of the system. [Brief explanation of the drawing]

[0019] To more clearly explain the technical concepts in the present invention or related technologies, the accompanying drawings that may be used in the descriptions of embodiments or related technologies are briefly introduced below. Clearly, the drawings in the following descriptions are merely embodiments of the present invention, and those skilled in the art can obtain other drawings based on these without any creative effort.

[0020] [Figure 1] This is a schematic three-dimensional view of a high-pressure box with a first structure according to an embodiment of the present invention. [Figure 2] This is a schematic exploded view of a high-pressure box with a first structure according to an embodiment of the present invention. [Figure 3] This is a partial schematic diagram of a high-pressure box according to an embodiment of the present invention. [Figure 4]It is a schematic partial side view of the high-pressure box according to an embodiment of the present invention. [Figure 5] It is a schematic structural principle diagram of the semiconductor cooling plate according to an embodiment of the present invention. [Figure 6] It is a schematic view after removing the first active heat dissipation unit and the heat dissipation member from FIG. 3. [Figure 7] It is a schematic right side view of the high-pressure box according to an embodiment of the present invention. [Figure 8] It is a schematic left side view of the high-pressure box according to an embodiment of the present invention. [Figure 9] It is a schematic front view of the panel of the high-pressure box with the first structure according to an embodiment of the present invention. [Figure 10] It is a schematic exploded perspective view of the high-pressure box with the second structure according to an embodiment of the present invention. [Figure 11] It is a schematic rear perspective view of the panel of the high-pressure box with the second structure according to an embodiment of the present invention. [Figure 12] It is a schematic connection diagram of the semiconductor cooling unit and the cooling wiring of the high-pressure box according to an embodiment of the present invention.

Embodiments for Carrying out the Invention

[0021] In order to make the object, technical solution and advantages of the present invention clearer and more obvious, specific embodiments will be combined below and the present application will be described in more detail with reference to the accompanying drawings.

[0022] Unless otherwise specified, the relative arrangements, numerical expressions and numerical ranges of the components shown in these examples do not limit the scope of the present invention.

[0023] Also, for the convenience of explanation, it should be understood that the dimensions of each part shown in the drawings are not drawn based on the actual proportional relationship.

[0024] The description of at least one embodiment described below is for illustrative purposes only and does not limit the present invention and its applications and uses. ​ Unless otherwise defined, technical or scientific terms used in the embodiments of the present invention have the general meanings understood by a person of ordinary skill in the art. Terms such as "first," "second," etc., used in the embodiments of the present invention do not indicate order, quantity, or importance, but are merely for distinguishing different components. Terms such as "include" or "contain" mean that the element or object listed before these words includes the elements or objects and their equivalents listed thereafter, and do not exclude other elements or objects. Terms such as "connect" or "link" are not limited to physical or mechanical connections, but also include direct or indirect electrical connections. Terms such as "up," "down," "left," and "right" indicate relative positional relationships, and these relative relationships may change if the absolute position of the object being described changes.

[0026] In some embodiments, the high-pressure box is cooled by a forced cooling system using a fan.

[0027] However, forced cooling using fans has high requirements regarding fan selection and installation location. If the fan placement is inappropriate, the airflow velocity on the surface of components inside the high-pressure box will be uneven, which may result in insufficient localized cooling of overcurrent areas. In more serious cases, localized blind spots may form inside the high-pressure box, preventing components within those areas from being cooled, leading to a risk of overheating and potentially causing safety accidents such as fires.

[0028] To solve the above problems, this embodiment provides a high-pressure box. Figure 1 shows a schematic three-dimensional view of the high-pressure box of the first structure according to an embodiment of the present invention, and Figure 2 shows an exploded schematic view of the high-pressure box of the first structure according to an embodiment of the present invention.

[0029] As shown in Figures 1 and 2, the high-voltage box includes a plurality of electrical components 100 and conductive members 200.

[0030] Figure 3 shows a partial three-dimensional schematic view of the high-pressure box according to an embodiment of the present invention, and Figure 4 shows a partial side schematic view of the high-pressure box according to an embodiment of the present invention.

[0031] As shown in Figures 3 and 4, the conductive member 200 has a first plate surface 210 and a second plate surface 220 that are arranged opposite to each other along a first direction (the Z direction in Figures 3 and 4). The first plate surface 210 includes a first region 211, and the conductive member 200 is electrically connected to the corresponding electrical component 100 via the first region 211. The semiconductor cooling unit 300 includes a cooling end 310 that absorbs heat, and the cooling end 310 is thermally connected to the conductive member 200 via the second plate surface 220. Along the first direction, the orthogonal projection of the cooling end 310 onto the corresponding first plate surface 210 overlaps with at least a portion of the first region 211.

[0032] For example, the conductive member 200 may include a conductive copper bar or a plurality of parallel conductors.

[0033] For example, multiple electrical components 100 may be electrically connected to each other via conductive members 200, and the electrical components 100 may also be electrically connected to an external circuit via conductive members 200.

[0034] For example, the first direction may be the height direction of the electrical component 100.

[0035] For example, the semiconductor cooling unit 300 may be powered via the conductive member 200, or it may be connected to a power supply via independent electrical wiring.

[0036] As an example, the semiconductor cooling unit 300 includes a semiconductor cooling plate. Figure 5 shows a schematic diagram of the structural principle of the semiconductor cooling plate. The semiconductor cooling plate comprises a plurality of N-type semiconductor elements 330 (including bismuth telluride) and a plurality of P-type semiconductor elements 340 (including bismuth telluride), with the plurality of N-type semiconductor elements 330 and P-type semiconductor elements 340 arranged alternately to form a series circuit with a DC power supply. Taking an example of an electrode pair in which one N-type semiconductor element 330 and one adjacent P-type semiconductor element 340 are coupled, energy transfer occurs when a DC current is passed through the series circuit. Along the direction of the current, the current flows from the N-type semiconductor element 330 through the first conductor 350 to the P-type semiconductor element 340, and the first conductor 350 absorbs heat. An insulator (e.g., a ceramic plate) thermally connected to all the first conductors 350 constitutes the cooling end 310. Similarly, current flows from the P-type semiconductor element 340 through the second conductor 360 to the N-type semiconductor element 330, the second conductor 360 releases heat, and an insulator thermally connected to all the second conductors 360 forms the heat dissipation end 320. The amount of heat absorbed at the cooling end 310 and the amount of heat dissipated at the heat dissipation end 320 are both related to the magnitude of the current and the number of couplers connecting the N-type semiconductor element 330 and the P-type semiconductor element 340. For example, a thermoelectric stack with several hundred couplers connected can be provided inside the semiconductor cooling plate to enhance the cooling (heating) effect.

[0037] Furthermore, if the semiconductor cooling unit includes a semiconductor cooling plate, the dimensions of the surface of the semiconductor cooling plate are selected according to the size of the conductive member 200 and the cooling efficiency requirements of the electrical components 100, and it is necessary that the semiconductor cooling plate be stably attached to the conductive member 200, but the dimensions of the surface of the semiconductor cooling plate itself are not limited.

[0038] For example, if the conductive member 200 is a conductive copper bar, the first plate surface 210 and the second plate surface 220 are two surfaces that are opposite each other in the thickness direction of the conductive copper bar. If the conductive member 200 is composed of multiple parallel conductors, the first plate surface 210 and the second plate surface 220 are planes formed by the fitting of the multiple conductors.

[0039] For example, a heat transfer structural adhesive can be applied to the surface of the cooling end 310 to thermally connect the surface of the cooling end 310 to the surface of the conductive member 200.

[0040] In this embodiment, power can be supplied to the corresponding electrical component 100 or signals can be transmitted via the conductive member 200. The inventors have found that when the electrical component 100 operates in a high-voltage box, heat concentrates and is generated at the electrical connection point between the electrical component 100 and the conductive member 200, i.e., at the first region 211 of the conductive member 200, causing the temperature of the first region 211 to rise. To cool the first region 211, in this embodiment, the cooling end 310 of the semiconductor cooling unit 300 is thermally connected to the corresponding position on the conductive member 200, and the orthographic projection of the cooling end 310 onto the first plate surface 210 overlaps with at least a portion of the first region 211, thereby allowing the cooling end 310 to at least partially cover the first region 211. Due to the excellent thermal conductivity of the conductive member 200, the cooling end 310 can rapidly absorb heat and prevent localized overheating.

[0041] The high-pressure box according to this embodiment has advantages such as a small volume for the semiconductor cooling unit 300, a compact structure, no mechanical moving parts, fewer space and shape constraints, and high reliability. The cooling end 310 of the semiconductor cooling unit 300 is thermally connected to the surface of the conductive member 200, and the cooling end 310 can cover at least a portion of the first region 211 where the conductive member 200 and the electrical component 100 are electrically connected. The semiconductor cooling unit 300 can directly convert electrical energy into cooling energy, has low thermal inertia, can rapidly cool the conductive member 200, and can safely operate the electrical component 100 at an appropriate temperature. This enhances the operational efficiency and stability of the high-pressure box, improves the overall operational efficiency of the energy storage system including the high-pressure box, and contributes to ensuring the operational safety of the system.

[0042] As shown in Figures 3 and 4, in some embodiments, the semiconductor cooling unit 300 further includes a heat dissipation end 320 that releases heat, and the heat dissipation end 320 is thermally connected to a first active heat dissipation unit 400.

[0043] For example, the first active heat dissipation unit 400 may include a fan or a liquid cooling unit.

[0044] For example, the cooling end 310 and the heat dissipation end 320 are arranged facing each other along the first direction.

[0045] For example, the first active heat dissipation unit 400 can be thermally connected directly or indirectly to the heat dissipation end 320.

[0046] When the semiconductor cooling unit 300 operates continuously, the temperature of the heat dissipation end 320 rises. If the heat dissipation end 320 is not cooled, the temperature of the heat dissipation end 320 may become too high, potentially causing a short circuit or disconnection of elements inside the semiconductor cooling unit 300, which could prevent the semiconductor cooling unit 300 from functioning properly.

[0047] To prevent such a situation, in this embodiment, a first active heat dissipation unit 400 is provided at the heat dissipation end 320. The first active heat dissipation unit 400 forcibly cools the heat dissipation end 320, effectively lowering the temperature of the heat dissipation end 320, and correspondingly lowering the temperature of the cooling end 310. This enables faster and more effective heat dissipation of the conductive member 200, preventing deterioration and damage to the electrical components 100 and conductive member 200 of the high-voltage box due to prolonged operation in a high-temperature environment. This improves the service life of the electrical components 100 and conductive member 200, contributing to a reduction in maintenance and replacement frequency.

[0048] As shown in Figure 4, in some embodiments, a heat dissipation member 500 is connected between the heat dissipation end 320 and the first active heat dissipation unit 400.

[0049] For example, the heat dissipation member 500 is thermally connected to the heat dissipation end 320 via a heat transfer structural adhesive.

[0050] For example, the first active heat dissipation unit 400 is connected to the heat dissipation member 500 by fitting, inserting, or fastening members.

[0051] For example, the heat dissipation member 500 covers the heat dissipation end 320 of the semiconductor cooling unit 300 and exerts a heat dissipation effect over the entire heat dissipation end 320.

[0052] The dimensions of the heat dissipation components are selected according to the actual space size inside the high-pressure box and the cooling capacity of the semiconductor cooling unit 300, and the present invention is not limited thereto.

[0053] When the temperature of the heat dissipation end 320 rises, the heat dissipation member 500 absorbs the heat from the heat dissipation end 320. Through the interaction of natural airflow and the first active heat dissipation unit 400, the heat dissipation member 500 can rapidly dissipate its own heat, quickly lowering the temperature of the heat dissipation member 500. The heat dissipation member 500 then absorbs the heat from the heat dissipation end 320. This cycle allows the heat dissipation member 500 and the first active heat dissipation unit 400 to cool the heat dissipation end 320 of the semiconductor cooling unit 300 more efficiently, ensuring the safe and stable operation of the electrical components 100 and conductive members 200 in the high-voltage box.

[0054] As shown in Figure 4, in some embodiments, the heat dissipation member 500 includes a heat transfer body 510 and a plurality of heat dissipation fins 520. The heat transfer body 510 has a first heat transfer surface 511 and a second heat transfer surface 512, the first heat transfer surface 511 being thermally connected to the heat dissipation end 320, and the plurality of heat dissipation fins 520 being thermally connected to the second heat transfer surface 512 at intervals from each other. The first active heat dissipation unit 400 is connected to the side of the heat dissipation fins 520 away from the second heat transfer surface 512.

[0055] For example, the first heat transfer surface 511 and the second heat transfer surface 512 may be arranged adjacent to each other or facing each other.

[0056] For example, the heat transfer body 510 has a plate-like structure, and one plate surface of the plate-like structure can be designated as the first heat transfer surface 511, and the corresponding other plate surface as the second heat transfer surface 512.

[0057] For example, the connection between the heat dissipation fins 520 and the heat transfer body 510 may be made by welding, bonding, fastening components, or integral molding.

[0058] By attaching multiple heat dissipation fins 520 to the heat transfer body 510, the surface area of ​​the heat transfer body 510 is increased, allowing air passing between two adjacent heat dissipation fins 520 to carry away more heat, thus contributing to improved heat dissipation performance of the heat dissipation end 320.

[0059] Furthermore, by connecting the first active heat dissipation unit 400 to the side of the heat dissipation fin 520 away from the second heat transfer surface 512, i.e., connecting the first active heat dissipation unit 400 to the free end side of the heat dissipation fin 520, the first active heat dissipation unit 400 can increase the airflow velocity between the two heat dissipation fins 520 (if the first active heat dissipation unit 400 is a fan), and can also lower the medium temperature between two adjacent heat dissipation fins 520 (if it is a liquid cooling unit), thereby contributing to further enhancing the heat dissipation effect of the heat dissipation end 320.

[0060] Figure 6 shows a schematic diagram after removing the first active heat dissipation unit 400 and the heat dissipation member 500 from Figure 3. As shown in Figures 4 and 6, in some embodiments, if at least two heat dissipation ends 320 are adjacent and located on the same plane, at least two of these surfaces are thermally connected to the same first heat transfer surface 511.

[0061] For example, the surface connected to the first heat transfer surface 511 is the surface of the heat dissipation end 320 that is away from the cooling end 310.

[0062] The structure and orientation shown in Figure 4 will be explained as an example. The electrical component 100 has an input terminal 110 and an output terminal 120, both of which are located adjacent to the top of the electrical component 100. Conductive members 200 are connected to the input terminal 110 and the output terminal 120, and semiconductor cooling units 300 are connected to each conductive member 200. Based on the positional relationship between the input terminal 110 and the output terminal 120, the surfaces of the heat dissipation ends 320 of the two semiconductor cooling units 300 are adjacent to each other and lie on the same plane. In this case, the heat dissipation ends 320 of the two semiconductor cooling units 300 can be thermally connected simultaneously by the same heat dissipation member 500, and the two heat dissipation ends 320 can be dissipated by the same heat dissipation member 500 and the same first active heat dissipation unit 400. In addition to reducing the manufacturing cost of the high-pressure box, the small gap between adjacent semiconductor cooling units 300 avoids the problem of adjacent heat dissipation members 500 and adjacent first active heat dissipation units 400 interfering with each other.

[0063] As shown in Figure 4, in some embodiments, along the first direction, the orthographic projection of the cooling end 310 onto the first plate surface 210 covers the first region 211.

[0064] By having the cooling end 310 completely cover the first region 211, on the one hand, it helps to improve the cooling efficiency and cooling effect of the semiconductor cooling unit 300 on the conductive member 200 and the electrical connection parts of the electrical component 100, and on the other hand, it can further equalize the temperature at each position in the first region 211, contributing to increased temperature consistency of the electrical connection parts of the electrical component 100.

[0065] In this embodiment of the present invention, the mounting position of the semiconductor cooling unit 300 can be designed according to the heat generation conditions and spatial arrangement inside the high-pressure box. In addition to connecting the semiconductor cooling unit 300 to the conductive member 200, it can also be directly connected to the electrical component 100 that is at risk of overheating.

[0066] In some embodiments, the cooling end 310 is thermally connected to at least a portion of the surface of the electrical component 100 of interest.

[0067] For example, the target electrical component 100 is an electrical component 100 that is prone to overload or overheating in high-temperature environments.

[0068] Generally, the housing of an electrical component 100 that requires heat dissipation has a certain thermal conductivity. By thermally connecting the cooling end 310 of the semiconductor cooling unit 300 to the surface of the target electrical component 100, precise heat dissipation can be performed for each electrical component 100 according to the different heat dissipation requirements of each component 100. This allows for accurate and efficient control of the temperature of each electrical component 100 within the high-pressure box, improving the heat dissipation efficiency and operational stability of the high-pressure box.

[0069] As shown in Figures 1, 2, and 4, in some embodiments the high-voltage box comprises a housing 600, and electrical components 100, conductive members 200, and a semiconductor cooling unit 300 are arranged inside the housing 600. Through-holes 610 and / or mounting through-holes 620 are provided in the side walls of the housing 600, and a second active heat dissipation unit 700 is connected to the mounting through-holes 620. The conductive members 200 are located near the side walls of the housing 600 and extend along the side walls of the housing 600.

[0070] For example, one, two, or more ventilation holes 610 may be provided. When multiple ventilation holes 610 are provided, the multiple ventilation holes 610 can be arranged in an aligned or unidirectional spacing on the side wall of the housing 600, thereby increasing the airflow velocity and flow rate of the air flowing inside and outside the high-pressure box through the ventilation holes 610, and improving the heat dissipation efficiency of the high-pressure box.

[0071] For example, the enclosure 600 includes a lower casing 630 and an upper cover 640. The lower casing 630 comprises a panel 631 and a back panel 632 arranged opposite each other along a second direction (the X direction in Figure 2), two side panels 633 arranged opposite each other along a third direction (the Y direction in Figure 2), and a bottom panel 634. The panel 631, the back panel 632, and the two side panels 633 form a frame structure, and the bottom panel 634 closes the bottom opening of the frame structure and is fixed to the frame structure. The upper cover 640 is attached to cover the top opening of the frame structure.

[0072] For example, Figure 7 shows a schematic right side view of the high-pressure box, and Figure 8 shows a schematic left side view of the high-pressure box. As shown in Figures 7 and 8, each side panel 633 is provided with multiple ventilation holes 610, which are spaced apart along the second direction.

[0073] For example, the ventilation opening 610 is a rectangular opening.

[0074] For example, two second active heat dissipation units 700 are provided and are spaced apart on the back panel 632 along the third direction.

[0075] For example, the first active heat dissipation unit 400 and the second active heat dissipation unit 700 may be the same or different.

[0076] The ventilation holes 610 allow air to circulate between the high-pressure box and the outside, dispersing the high-temperature air inside the high-pressure box to the outside and contributing to improving the heat dissipation efficiency of the high-pressure box. The second active heat dissipation unit 700 further improves the heat dissipation performance of the high-pressure box by increasing the airflow velocity between the high-pressure box and the outside, or by lowering the temperature of the incoming air.

[0077] Furthermore, by positioning the conductive member 200 near the side wall of the housing 600, the distance between the conductive member 200 and the ventilation holes 610 or the second active heat dissipation unit 700 can be shortened, thereby enhancing the heat dissipation effect on the conductive member 200 and the heat dissipation member 500 by the ventilation holes 610 or the second active heat dissipation unit 700, and increasing the rate at which heat is released from the conductive member 200 and the heat dissipation member 500.

[0078] As shown in Figure 2, in some embodiments, at least a portion of the conductive members 200 are stacked along a first direction, with at least two layers spaced apart, and insulating support members 900 are provided between adjacent conductive members 200 along the first direction.

[0079] For example, the insulating support member 900 may be a columnar structure or a block structure.

[0080] For example, depending on the extending length of the conductive member 200, one, two, or more insulating support members 900 can be provided along the extending direction of the conductive member 200, allowing for stacking to maintain a predetermined distance between adjacent conductive members 200, and further stacking to ensure spatial insulation between adjacent conductive members 200.

[0081] When it is necessary to provide multiple conductive members 200, the multi-path conductive members 200 can be stacked and arranged along a first direction, and each conductive member 200 can be located near a ventilation hole 610 on the side panel 633 or a second active heat dissipation unit 700, so that the ventilation hole 610 or the second active heat dissipation unit 700 can achieve good heat dissipation for all of the multi-path conductive members 200. Insulating support members 900 can be used to create spacing between the layered multi-path conductive members 200, preventing overlap and arc discharge between adjacent conductive members 200, ensuring that adjacent conductive members 200 have a good insulating effect, and thus ensuring the normal operation of the electrical components 100 in the high-voltage box.

[0082] In some embodiments, at least one of the first active heat dissipation unit 400 and the second active heat dissipation unit 700 includes a fan.

[0083] Fans offer advantages such as high heat dissipation performance, stable operation, ease of installation, and low cost. By employing fans as the first active heat dissipation unit 400 and / or the second active heat dissipation unit 700, the operational stability of the high-pressure box is improved, contributing to a reduction in the difficulty of assembly and material costs of the high-pressure box, and also facilitating mass production.

[0084] Figure 9 shows a schematic front view of panel 631 of the first structure. As shown in Figure 9, in some embodiments, a plurality of electrical interfaces 800 are attached to panel 631 of the housing 600, and conductive members 200 are electrically connected to the corresponding electrical interfaces 800.

[0085] For example, the electrical interface 800 is fitted into the panel 631, with one end of the electrical interface 800 located inside the housing 600 and electrically connected to the conductive member 200. The other end of the electrical interface 800 is located outside the housing 600 and is used to electrically connect to an external circuit.

[0086] The conductive member 200 is electrically connected to an external circuit via the electrical interface 800 of the panel 631, and the conductive member 200 can supply power or transmit signals to the electrical components 100 inside the housing 600.

[0087] Figure 10 shows an exploded schematic view of the high-pressure box of the second structure, and Figure 11 shows a rear schematic view of panel 631 of the high-pressure box of the second structure. As shown in Figures 10 and 11, in some embodiments, panel 631 is further provided with a cooling electrical interface 1000, and a semiconductor cooling unit 300 is electrically connected to the cooling electrical interface 1000.

[0088] For example, as shown in Figures 10 and 11, the cooling electrical interface 1000 is fitted into panel 631, with one end of the cooling electrical interface 1000 located inside the housing 600 and electrically connected to the semiconductor cooling unit 300 via cooling wiring 1100. The other end of the cooling electrical interface 1000 is located outside the housing 600 and is used to electrically connect to an external circuit.

[0089] As an example, Figure 12 shows a schematic diagram of the connections of a semiconductor cooling unit 300 and cooling wiring 1100. Each semiconductor cooling unit 300 extends two cooling wirings 1100, and after multiple cooling wirings 1100 extend to the vicinity of panel 631, they can be simultaneously connected to the same main cooling wiring 1200, and are electrically connected to the cooling electrical interface 1000 via the main cooling wiring 1200.

[0090] The semiconductor cooling unit 300 can be powered or its output adjusted independently via the cooling electrical interface 1000 on panel 631. This allows the semiconductor cooling unit 300 to stably cool the electrical components 100 in the high-pressure box. Furthermore, by adjusting the output of the semiconductor cooling unit 300, the temperatures of the electrical components 100 and conductive members 200 can be controlled more precisely, enabling the electrical components 100 to operate stably within a predetermined temperature range, contributing to improved operating efficiency, stability, and extended working time of the high-pressure box.

[0091] In some embodiments, the conductive member 200 includes a solid structure formed of a conductive material.

[0092] Designing the conductive member 200 as a solid structure contributes to increasing the vortex area of ​​the conductive member 200, allowing the conductive member 200 to have higher conductivity even with the same surface area. Furthermore, since conductive materials generally have good thermal conductivity, making the conductive member 200 a solid structure formed from a conductive material ensures that the conductive member 200 has good thermal conductivity, contributing to improved heat dissipation for the electrical components 100 and the conductive member 200 of the semiconductor cooling unit 300.

[0093] In some embodiments, the electrical component 100 includes at least one of a precharge resistor, a precharge relay, a fuse, a high-voltage relay, a switching power relay, a switching power supply, an isolation switch, a current sensor, and a shunt.

[0094] For example, multiple electrical components 100 can be connected to at least one circuit board 1300, and the conductive member 200 can be positioned above the circuit board 1300 and separated from the circuit board 1300 by an insulating support member 900.

[0095] Furthermore, the electrical components 100 and their connection structure within the high-voltage box can be selected and designed according to the functional requirements of the high-voltage box, and the present invention is not limited thereto.

[0096] Based on the same inventive concept, this embodiment provides an energy storage container by combining the descriptions of the high-pressure boxes in each of the embodiments described above. This energy storage container has the same technical effects as the high-pressure boxes in the embodiments described above, and therefore will not be repeated here.

[0097] The energy storage container includes an energy storage cluster (or battery cluster), a power conditioning system (PCS), and a high-voltage box as described in each of the above embodiments, wherein the high-voltage box is electrically connected to the energy storage cluster and the power conditioning system, respectively.

[0098] The high-voltage box acts as a high-voltage circuit management module connecting the energy storage cluster and the power conditioning system, and has functions such as voltage / current collection, contactor control, and protection for the energy storage cluster.

[0099] The above describes some embodiments of the present invention. Other embodiments are within the scope of the attached claims.

[0100] Each embodiment of the present invention is described in a stepwise manner, and each embodiment is described in terms of its differences from the other embodiments, and identical or similar parts between embodiments can be referenced to one another.

[0101] The description of this invention is given for illustrative and explanatory purposes only and is not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and changes will be apparent to those skilled in the art. The selection and description of embodiments are intended to better illustrate the principles and practical applications of the invention and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for specific applications.

[0102] Those skilled in the art will recognize that the discussion of any of the embodiments described above is illustrative and does not imply that the scope of the invention is limited to these examples. Under the spirit of the invention, combinations are possible between the technical features of the embodiments described above or different embodiments, the steps can be performed in any order, and many other modifications exist in different aspects of the embodiments of the invention described above, but are not provided in detail for the sake of brevity.

[0103] Although the present invention has been described by combining specific embodiments, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art.

[0104] The embodiments of the present invention are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the invention. Accordingly, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of the invention should also fall within the scope of protection of the invention. [Industrial applicability]

[0105] The high-pressure box and energy storage container of the present invention are applicable to the field of energy storage technology. [Explanation of symbols]

[0106] 100 Electrical Components 110 Input Terminal 120 Output terminal 200 Conductive material 210 1st plate surface 211 First area 220 2nd plate surface 300 Semiconductor Cooling Unit 310 Cooling end 320 heat dissipation end 330 N-type semiconductor device 340 P-type semiconductor device 350 First Conductor 360 Second conductor 400 First Active Heat Dissipation Unit 500 Heat dissipation components 510 Heat transfer unit 511 First heat transfer surface 512 Second heat transfer surface 520 heat sink fins 600 cabinets 610 Ventilation hole 620 Mounting through hole 630 Lower box body 631 Panel 632 Back Panel 633 Side Panel 634 Bottom Panel 640 Top cover 700 Second Active Heat Dissipation Unit 800 Electrical Interfaces 900 Insulation support member 1000 Cooling Electrical Interface 1100 Cooling wiring 1200 Cooling main wiring 1300 Circuit Board

Claims

1. Multiple electrical components, A plurality of conductive members, each conductive member having a first plate surface and a second plate surface arranged opposite to each other along a first direction, the first plate surface including a first region, and each conductive member being electrically connected to the corresponding electrical component via the first region, A plurality of semiconductor cooling units, each of which includes a cooling end for absorbing heat, and the plurality of cooling ends are thermally connected to the plurality of conductive members via the plurality of second plate surfaces, Includes, A high-pressure box characterized in that, along the first direction, the orthographic projection of each cooling end onto the corresponding first plate surface overlaps with at least a portion of the first region.

2. The high-pressure box according to claim 1, wherein each semiconductor cooling unit further includes a heat dissipation end for releasing heat, and the heat dissipation end is thermally connected to a first active heat dissipation unit.

3. The high-pressure box according to claim 2, further characterized in that a heat dissipation member is connected between each of the heat dissipation ends and the corresponding first active heat dissipation unit.

4. Each of the heat dissipation members includes a heat transfer body and a plurality of heat dissipation fins, the heat transfer body has a first heat transfer surface and a second heat transfer surface, the first heat transfer surface is thermally connected to the heat dissipation end, and the plurality of heat dissipation fins are thermally connected to the second heat transfer surface at intervals from each other. The high-pressure box according to claim 3, characterized in that each of the first active heat dissipation units is connected to the side of the corresponding heat dissipation fin away from the second heat transfer surface.

5. The high-pressure box according to claim 4, characterized in that, if at least two of the heat dissipation ends are adjacent and have surfaces on the same plane, at least two of the surfaces are thermally connected to the same first heat transfer surface.

6. The high-pressure box according to claim 1, characterized in that, along the first direction, the orthographic projection of each cooling end onto the corresponding first plate surface covers the first region.

7. The high-voltage box according to claim 1, characterized in that at least a portion of the plurality of conductive members are stacked along the first direction, arranged in at least two layers with an interval between them, and an insulating support member is provided between two adjacent conductive members along the first direction.

8. The high-voltage box comprises a housing, and the plurality of electrical components, the plurality of conductive members, and the plurality of semiconductor cooling units are arranged inside the housing. The high-pressure box according to claim 1, characterized in that the side wall of the housing is provided with through-holes for ventilation and mounting, a second active heat dissipation unit is connected to the mounting through-hole, and at least one of the conductive members extends along the side wall of the housing in close proximity to the side wall of the housing.

9. The high-pressure box according to claim 8, wherein the high-pressure box includes a first active heat dissipation unit, and at least one of the first active heat dissipation unit and the second active heat dissipation unit includes a fan.

10. The high-voltage box includes a housing, the housing comprises a panel, the panel is connected to a plurality of electrical interfaces, and each conductive member is electrically connected to the corresponding electrical interface. The high-voltage box according to claim 1, wherein at least one cooling electrical interface is further connected to the panel, and the plurality of semiconductor cooling units are electrically connected to the at least one cooling electrical interface.

11. The high-voltage box according to claim 1, characterized in that the plurality of conductive members include solid structures formed of a conductive material.

12. The high-voltage box according to claim 1, characterized in that each of the aforementioned electrical components includes at least one of a precharge resistor, a precharge relay, a fuse, a high-voltage relay, a switching power relay, a switching power supply, an isolation switch, a current sensor, and a shunt.

13. An energy storage container comprising an energy storage cluster, a power conditioning system, and a high-voltage box according to any one of claims 1 to 12, wherein the high-voltage box is electrically connected to the energy storage cluster and the power conditioning system, respectively.

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