Method for manufacturing a laminate, laminate, and intermediate laminate

Abstract

The present invention provides a method for manufacturing a laminate, a laminate, and an intermediate laminate that allow the design of the window portion to be changed even after the pattern layer has been formed, and that can suppress misalignment of the window portions formed on the front and back surfaces of the laminate. [Solution] According to one aspect of the present invention, a second intermediate laminate 100 comprising a pattern layer 14, a base layer 12, a substrate 11, a base layer 13, and a pattern layer 15 in this order is used, and a laser beam is irradiated from the pattern layer 14 side onto a portion of the second intermediate laminate 100 to remove a portion of the base layer 12 and the pattern layer 14 so as to penetrate through the thickness direction of the second intermediate laminate 100, thereby forming a window portion 16. At the same time, portions of the base layer 13 and the pattern layer 15 corresponding to the window portion 16 are removed so as to penetrate through the thickness direction of the second intermediate laminate 100, thereby forming a window portion 17, thereby obtaining a laminate 10 in which a portion of the first surface 11A of the substrate 11 is exposed through the first window portion 15, and a portion of the second surface 11A of the substrate 11 is exposed through the window portion 17.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a laminate, a laminate, and an intermediate laminate.

Background Art

[0002] In recent years, designs have been required for cards such as IC cards. For this reason, techniques for making a part of a card transparent have been developed (see, for example, Patent Document 1). As a technique for making a part of a card transparent, for example, there is a technique of forming a window portion in a part of a pattern layer formed on a transparent card substrate to expose a part of the card substrate. In this case, a pattern layer having a window portion is formed by printing the pattern layer except for the region where the window portion is to be formed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, when the window portion is formed by printing the pattern layer, the design of the window portion is determined at the time of printing the pattern layer, and it is difficult to form window portions having different designs for each card. Further, when the pattern layer is printed to form window portions on both sides of a transparent substrate, it is difficult to align the window portions on the front side and the window portions on the back side, and there is a risk that the positions of the window portions are shifted between the front and back of the card.

[0005] The present invention has been made to solve the above problems. That is, an object of the present invention is to provide a method for manufacturing a laminate, a laminate, and an intermediate laminate that can change the design of a window portion even after the formation of a pattern layer and can suppress misalignment of the positions of the window portions formed on the front and back of the laminate.

Means for Solving the Problems

[0006] [1] A step of preparing an intermediate laminate comprising: a transparent or translucent substrate; a first base layer formed on the first surface side of the substrate and removable by laser irradiation; a second base layer formed on the second surface side of the substrate opposite to the first surface and removable by laser irradiation; a first pattern layer formed on the surface side of the first base layer opposite to the substrate side; and a second pattern layer formed on the surface side of the second base layer opposite to the substrate side; and a step of applying a laser from the first pattern layer side to a portion of the intermediate laminate. A method for manufacturing a laminate, comprising the steps of: irradiating with light to remove a portion of the first base layer and the first pattern layer so as to penetrate in the thickness direction of the intermediate laminate, thereby forming a first window; and removing portions of the second base layer and the second pattern layer corresponding to the first window so as to penetrate in the thickness direction of the intermediate laminate, thereby forming a second window, thereby obtaining a laminate in which a portion of the first surface of the substrate is exposed through the first window, and a portion of the second surface of the substrate is exposed through the second window.

[0007] [2] The method for manufacturing a laminate according to [1], wherein the intermediate laminate has at least one of the following: a boundary of a planned area for forming the first window portion on the surface of the first pattern layer or a mark provided inside the boundary; and a boundary of a planned area for forming the second window portion on the surface of the second pattern layer or a mark provided inside the boundary.

[0008] [3] The method for manufacturing a laminate according to [1] or [2] above, wherein the laminate is a card or a booklet.

[0009] [4] The method for manufacturing a laminate according to [3] above, wherein the card is an IC card.

[0010] [5] A laminate comprising a transparent or translucent substrate, a first underlayment formed on a first surface of the substrate, a second underlayment formed on a second surface of the substrate opposite to the first surface, a first pattern layer formed on the surface of the first underlayment opposite to the surface of the substrate, and a second pattern layer formed on the surface of the second underlayment opposite to the surface of the substrate, wherein the laminate comprises a first window portion that penetrates the first underlayment and the first pattern layer in the thickness direction of the laminate, and a second window portion that penetrates the portion of the second underlayment and the second pattern layer corresponding to the first window portion in the thickness direction of the laminate, the first surface of the substrate having a first exposed surface exposed through the first window portion, and the second surface of the substrate having a second exposed surface exposed through the second window portion, and the absolute value of the difference between the arithmetic mean roughness of the first exposed surface and the arithmetic mean roughness of the second exposed surface is 0.05 μm or more.

[0011] [6] The method for manufacturing a laminate according to [5], wherein the arithmetic mean roughness of the first exposed surface is 0.42 μm or more and 0.48 μm or less, and the arithmetic mean roughness of the second exposed surface is 0.30 μm or more and 0.36 μm or less.

[0012] [7] The laminate according to [5], wherein the arithmetic mean roughness of the first exposed surface is greater than the arithmetic mean roughness of the surface of the first pattern layer, and the arithmetic mean roughness of the second exposed surface is greater than the arithmetic mean roughness of the surface of the second pattern layer.

[0013] [8] The laminate according to [5], wherein the arithmetic mean roughness of the first exposed surface is less than the arithmetic mean roughness of the surface of the first pattern layer, and the arithmetic mean roughness of the second exposed surface is less than the arithmetic mean roughness of the surface of the second pattern layer.

[0014] [9] The laminate according to any one of the above [5] to [8], wherein the ratio of the surface area of ​​the second pattern layer when the laminate is viewed from the second pattern layer side in the thickness direction of the laminate to the surface area of ​​the first pattern layer when the laminate is viewed from the first pattern layer side in the thickness direction of the laminate is 0.97 or more and 1.03 or less.

[0015]

[10] The laminate according to any one of [5] to [9] above, wherein the laminate is a card or a booklet.

[0016]

[11] The method for manufacturing a laminate according to

[10] above, wherein the card is an IC card.

[0017]

[12] An intermediate laminate including a transparent or translucent substrate, a first underlayer disposed on the first surface side of the substrate and removable by irradiation with laser light, a second underlayer disposed on the second surface side of the substrate opposite to the first surface and removable by irradiation with laser light, a first pattern layer formed on a surface side of the first underlayer opposite to the surface on the substrate side, and a second pattern layer formed on a surface side of the second underlayer opposite to the surface on the substrate side. [Effect of the Invention]

[0018] According to one aspect of the present invention, it is possible to provide a method for manufacturing a laminate, a laminate, and an intermediate laminate in which the design of a window portion can be changed even after the formation of a pattern layer, and the displacement of the positions of the window portions formed on the front and back of the laminate can be suppressed. [Brief Description of the Drawings]

[0019] [Figure 1] FIG. 1 is a schematic plan view of a laminate according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line A-A in FIG. 1. [Figure 3] FIG. 3 is a cross-sectional view taken along line B-B in FIG. 1. [Figure 4] FIG. 4 is a schematic plan view of a multi-sided first intermediate laminate according to an embodiment. [Figure 5] FIG. 5 is a schematic plan view of each first intermediate laminate according to an embodiment. [Figure 6] FIG. 6 is a cross-sectional view taken along line C-C in FIG. 5. [Figure 7] FIG. 7 is a cross-sectional view taken along line D-D in FIG. 5. [Figure 8]FIG. 8 is a schematic cross-sectional view showing a manufacturing process of a laminate according to an embodiment. [Figure 9] FIGS. 9A and 9B are schematic views showing a manufacturing process of a laminate according to an embodiment. [Figure 10] FIG. 10 is a schematic view showing a manufacturing process of a laminate according to an embodiment. [Figure 11] FIGS. 11A and 11B are schematic views showing a manufacturing process of a laminate according to an embodiment. [Figure 12] FIGS. 12A and 12B are schematic views showing a manufacturing process of a laminate according to an embodiment. [Figure 13] FIG. 13 is a schematic view showing a manufacturing process of a laminate according to an embodiment. MODE FOR CARRYING OUT THE INVENTION

[0020] Hereinafter, a method for manufacturing a laminate, the laminate, and an intermediate laminate according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic plan view of the laminate according to the present embodiment, FIG. 2 is a cross-sectional view taken along line A-A in FIG. 1, and FIG. 3 is a cross-sectional view taken along line B-B in FIG. 1. FIG. 4 is a schematic plan view of the multi-sided first intermediate laminate according to the present embodiment, FIG. 5 is a schematic plan view of each first intermediate laminate according to the present embodiment, FIG. 6 is a cross-sectional view taken along line C-C in FIG. 5, and FIG. 7 is a cross-sectional view taken along line D-D in FIG. 5. FIGS. 8, 9A, 9B, 10, 11A, 11B, 12A, 12B, and 13 are schematic cross-sectional views showing a manufacturing process of the laminate according to the present embodiment.

[0021] <<<LAMINATE>>> The laminate 10 shown in Figures 1 and 2 comprises a transparent or translucent base 11, a first underlayer 12 formed on the first surface 11A side of the base 11 and removable by laser irradiation (hereinafter sometimes simply referred to as "underlayer 12"), a second underlayer 13 formed on the second surface 11B side of the base 11 opposite to the first surface 11A and removable by laser irradiation (hereinafter sometimes simply referred to as "underlayer 13"), and a first pattern layer 14 formed on the side of the first underlayer 12 opposite to the surface facing the base 11 ( The laminate 10 comprises a first window portion 16 that penetrates the base layer 12 and the pattern layer 15 in the thickness direction of the laminate 10, and a second window portion 17 that penetrates the base layer 13 and the pattern layer 15 in the thickness direction of the laminate 10.

[0022] The laminate 10 is a dual-interface IC card capable of contact and contactless communication with external devices. As shown in Figure 3, the laminate 10 comprises an IC module 20 located in a recess 11C of the substrate 11, a pair of conductive plates 30, part of which are located inside the substrate 11, an antenna 40 located inside the substrate 11, and a conductive adhesive layer 50 located between the IC module 20 and the conductive plates 30, which electrically connects the IC module 20 and the conductive plates 30.

[0023] The laminate 10 is a dual-interface IC card, but the laminate is not particularly limited and can be any card or booklet. Examples of cards include a dual-interface IC card, a contact-type IC card that communicates with external devices via external connection terminals on the card surface, a contactless IC card that communicates with external devices via electromagnetic induction or the like through an antenna, or a security card. An example of a booklet is a passport.

[0024] In Figure 3, the IC module 20 and the antenna 40 are electrically connected using a conductive plate 30 and a conductive adhesive layer 50, but the method of electrically connecting the IC module 20 and the antenna 40 is not particularly limited.

[0025] The surface 10A of the laminate 10 consists of the surface 14A of the pattern layer 14, the surface of the IC module 20, and the exposed surface 11A1 of the first surface 11A of the base body 11 exposed through the window portion 16. The back surface 10B of the laminate 10 consists of the surface 15A of the pattern layer 15 and the exposed surface 11B1 of the second surface 11B of the base body 11 exposed through the window portion 17.

[0026] <<Base>> As described above, the substrate 11 is transparent or translucent. In this specification, "transparent" means that the visible light transmittance, which is the transmittance in the visible light region (wavelength 380 nm to 780 nm), is 80% or more, and "translucent" means that the visible light transmittance is 5% or more and less than 80%. "Transparent" may be either colorless transparent or colored transparent, and "translucent" may be either colorless translucent or colored translucent. Because the substrate 11 is a transparent or translucent layer, for example, when laser light is irradiated from the pattern layer 14 side, the laser light can reach the base layer 13. The visible light transmittance shall be measured using a spectrophotometer equipped with an integrating sphere.

[0027] Furthermore, for the sake of explanation, we will set up an XYZ coordinate system for the base body 11. First, the normal direction of the first face 11A of the base body 11 will be the Z axis. Then, the direction from the second face 11B, which is opposite to the first face 11A of the base body 11, toward the first face 11A will be defined as the +Z direction or upward in the thickness direction, and the opposite direction will be defined as the -Z direction or downward in the thickness direction.

[0028] Furthermore, when the base body 11 is viewed from the +Z direction, the X-axis is defined as a straight line perpendicular to both short sides of the base body 11, which has a long side and a short side as described later, and to the Z-axis. The direction from one short side closer to the recess 11C toward the other short side is defined as the +X direction or right direction, and the opposite direction is defined as the -X direction or left direction. In addition, the Y-axis is defined as an axis perpendicular to the X-axis and the Z-axis, and the direction from one long side farther from the recess 11C toward the other long side is defined as the +Y direction or upward, and the opposite direction is defined as the -Y direction or downward.

[0029] As shown in Figure 2, the substrate 11 has a structure in which an oversheet layer 111, a core layer 112, a core layer 113, an inner layer 114, a core layer 115, and an oversheet layer 116 are stacked in this order in the depth direction (-Z direction) from the first surface 11A to the second surface 11B. For example, a magnetic stripe may be embedded on the surface of the oversheet layer 111 opposite to the core layer 112. This allows it to be used as a credit card from which information on the magnetic stripe can be read.

[0030] <Oversheet layer> For the oversheet layers 111 and 116, the same material as the inner layer 114 is usually used, but a transparent material with a thickness of approximately 0.03 mm to 0.18 mm is often used. From the viewpoint of preventing curling when the laminate is integrated by heat pressing or the like, it is preferable that the thicknesses of the oversheet layers 111 and 116 are the same, but they do not necessarily have to be the same.

[0031] The materials for the oversheet layers 111 and 116 can be any material that adheres when heated. However, even if the oversheet layers themselves do not adhere when heated, they can be integrated by adding a layer of a known adhesive that generates adhesive force when heated between the oversheet layer 111 and the core layer 112, or between the oversheet layer 116 and the core layer 115.

[0032] <Core Layer> The core layers 112, 113, and 115 are not particularly limited, but examples include plastic sheets. Examples of plastic sheets include single films or composite films thereof of polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, copolymer polyester, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic acid ester, polypropylene, polyethylene, polyurethane, etc.

[0033] The thicknesses of the core layers 112, 113, and 115 can be appropriately selected considering the overall thickness of the laminate 10, but for example, they may be between 0.03 mm and 0.45 mm. In this case, the above thicknesses of the core layers 112, 113, and 115 refer to the thickness of each individual core layer 112, 113, and 115. Note that the core layers 112, 113, and 115 may be a laminated structure of two or more layers.

[0034] <Inner layer> The inner layer 114 is not particularly limited, but examples include the plastic sheets described in the sections for core layers 112, 113, and 115. The thickness of the inner layer 114 can be appropriately selected considering the overall thickness of the laminate 10, but for example, it may be around 0.03 mm to 0.45 mm.

[0035] <<1st base layer, 2nd base layer>> The base layers 12 and 13 are layers that can be removed by laser irradiation. Specifically, the first base layer 12 and the second base layer 13 are removed by heating, melting, and evaporating when irradiated with laser light. The base layers 12 and 13 may also have the function of concealing antennas 40 and the like that are located inside the substrate 11.

[0036] The materials constituting the base layers 12 and 13 are not particularly limited as long as they can be melted and evaporated by laser irradiation, but it is preferable that the base layers 12 and 13 contain a laser light absorbing material consisting of at least one of the following: metal powder, metal oxide powder, and carbon black powder, and a resin. Examples of metal powders include gold, silver, aluminum, and tin powders, and examples of metal oxide powders include titanium white and zinc oxide powders. The metal powder or metal oxide powder may be one type of metal powder or metal oxide powder, or two or more types of metal powder or metal oxide powder may be used. Among the metal powders, aluminum powder is preferred from the viewpoint of manufacturing cost.

[0037] The content of the laser light absorbing material in the base layers 12 and 13 is preferably 10% by mass or more and 20% by mass or less, respectively, relative to the mass of the base layers 12 and 13. With such a content, a portion of the base layers 12 and 13 can be removed by laser irradiation.

[0038] Examples of resins contained in the underlayers 12 and 13 include thermoplastic resins such as vinyl chloride, vinyl acetate, vinyl alcohol, acrylic resin, polyester resin, polyurethane resin and copolymers thereof, thermosetting resins such as epoxy resin, phenolic resin, and melamine resin, and ionizing radiation curable resins such as ultraviolet curable resins.

[0039] The thickness of the base layers 12 and 13 is not particularly limited, but is preferably, for example, 1 μm or more and 10 μm or less. If the thickness of the base layers 12 and 13 is 1 μm or more, not only the base layers 12 and 13 but also the pattern layers 14 and 15 can be reliably removed, and if it is 10 μm or less, the laser power required for removal can be reduced. The lower limit of the thickness of the base layers 12 and 13 is preferably 3 μm or more, and the upper limit is preferably 7 μm or less. For example, the thickness of the base layers 12 and 13 may be 3 μm or more and 7 μm or less.

[0040] The underlayers 12 and 13 can be formed by coating the first surface 11A and the second surface 11B of the substrate 11 with an ink containing a laser light absorber and a resin, as described later. This ink may also contain known additives. Known printing methods such as screen printing, gravure printing, and flexographic printing can be used as coating methods.

[0041] <<First pattern layer, second pattern layer>> The pattern layers 14 and 15 are layers for forming any pattern such as pictures, photographs, letters, numbers, figures, symbols, and designs on the front surface 10A and back surface 10B of the laminate 10.

[0042] The thickness of the pattern layers 14 and 15 is not particularly limited, but is preferably, for example, 0.1 μm or more and 10 μm or less. If the thickness of the pattern layers 14 and 15 is 0.1 μm or more, a visible color tone can be expressed, and if it is 10 μm or less, the laser power can reach the base layers 12 and 13 without being hindered. The lower limit of the thickness of the pattern layers 14 and 15 is preferably 0.5 μm or more or 1 μm or more, and the upper limit is preferably 7 μm or less or 5 μm or more. For example, the thickness of the pattern layers 14 and 15 may be 0.5 μm or more and 7 μm or less or 1 μm or more and 5 μm or less.

[0043] The pattern layers 14 and 15 contain coloring agents such as dyes and pigments, and a binder resin. The pattern layers 14 and 15 may have multiple colors or a single color. The pattern layers 14 and 15 can be formed by printing, similar to the base layers 12 and 13.

[0044] <<First Window Section, Second Window Section>> Window section 16 is provided so as to penetrate the base layer 12 and the pattern layer 15, and window section 17 is provided so as to penetrate the base layer 13 and the pattern layer 15, but window sections 16 and 17 do not penetrate the base body 11.

[0045] The window portion 17 is formed in the portion of the base layer 13 and the pattern layer 15 that corresponds to the window portion 16. That is, the window portion 16 and the window portion 17 are aligned in the thickness direction (-Z direction) of the laminate 10.

[0046] The shape and size of the window portions 16 and 17 are not particularly limited and can be freely changed by irradiation with laser light as described later. For example, if the laminate 10 is a laminate containing information such as an IC card or passport, information such as a name and / or card number or passport number may be formed in the window portions 16 and 17 by irradiation with laser light. Alternatively, if the laminate 10 is a laminate that does not contain information, a desired design may be obtained by forming window portions 16 and 17 of a desired shape.

[0047] In the laminate 10, a portion of the first surface 11A of the substrate 11 is exposed through the window portion 16, and a portion of the second surface 11B of the substrate 11 is exposed through the window portion 17. The absolute value of the difference between the arithmetic mean roughness Ra of the first exposed surface 11A1 (hereinafter sometimes simply referred to as "exposed surface 11A1") of the first surface 11A of the substrate 11 exposed through the window portion 16 and the arithmetic mean roughness Ra of the second exposed surface 11B1 (hereinafter sometimes simply referred to as "exposed surface 11B1") of the second surface 11B exposed through the window portion 17 is 0.05 μm or more. Because the absolute value of this difference is 0.05 μm or more, the surface quality can be changed between the first exposed surface 11A1 and the second exposed surface 11B1, thereby enhancing the design aesthetics. The lower limit of the absolute value of this difference is preferably 0.07 μm or more or 0.10 μm or more, and the upper limit is preferably 0.30 μm or less or 0.20 μm or less. For example, the absolute value of this difference may be 0.05 μm or more and 0.30 μm or less, 0.07 μm or more and 0.30 μm or less, or 0.10 μm or more and 0.20 μm or less. As will be described later, when forming the window portions 16 and 17, laser light is irradiated from the pattern layer 14 side, but when laser light is irradiated from the pattern layer 14 side, the exposed surface 11A1 receives stronger laser power than the exposed surface 11B1. For this reason, it is thought that a difference in the arithmetic mean roughness of the exposed surface 11A1 and the exposed surface 11B1 will occur.

[0048] The arithmetic mean roughness Ra of the first exposed surface 11A1 is preferably 0.42 μm or more and 0.48 μm or less, and the arithmetic mean roughness Ra of the second exposed surface 11B1 is preferably 0.30 μm or more and 0.36 μm or less. If the arithmetic mean Ra of the first exposed surface 11A1 is 0.42 μm or more and the arithmetic mean Ra of the exposed surface 11B1 is 0.30 μm or more, then the exposed surfaces 11A1 and 11B1 will have a slightly matte finish, which will enhance the aesthetic appeal. Furthermore, if the arithmetic mean Ra of the first exposed surface 11A1 is 0.48 μm or less and the arithmetic mean Ra of the exposed surface 11B1 is 0.36 μm or less, then the transparency of the first exposed surface 11A1 and the exposed surface 11B1 can be maintained. The lower limit of the arithmetic mean roughness Ra of the first exposed surface 11A1 is preferably 0.43 μm or more or 0.44 μm or more, and the upper limit is preferably 0.46 μm or less or 0.45 μm or less. For example, the arithmetic mean roughness Ra of the exposed surface 11A1 may be 0.43 μm or more and 0.46 μm or less or 0.44 μm or more and 0.45 μm or less. Similarly, the lower limit of the arithmetic mean roughness Ra of the exposed surface 11B1 is preferably 0.32 μm or more or 0.33 μm or more, and the upper limit is preferably 0.35 μm or less or 0.34 μm or less. For example, the arithmetic mean roughness Ra of the exposed surface 11B1 may be 0.32 μm or more and 0.35 μm or less or 0.33 μm or more and 0.34 μm or less. As will be described later, laser light is irradiated when forming the window portions 16 and 17, so exposed surfaces 11A1 and 11B1 having such arithmetic mean roughness can be obtained.

[0049] The definition of arithmetic mean roughness Ra shall conform to JIS B0601:2013. The arithmetic mean roughness Ra is based on the description of parameters in the height direction in 4.2 as stated in JIS B0601:2013. The arithmetic mean roughness Ra is a value measured by a surface roughness meter (for example, model number "SURFCOM480A", manufactured by Tokyo Seimitsu Co., Ltd.).

[0050] The arithmetic mean roughness Ra of the exposed surface 11A1 may be greater than the arithmetic mean roughness of the surface 14A of the pattern layer 14, and the arithmetic mean roughness Ra of the exposed surface 11B1 may be greater than the arithmetic mean roughness of the surface 15A of the pattern layer 15. In this case, the surface texture can be partially varied, with the pattern layers 14 and 15 having a mirror-like finish and the exposed surfaces 11A1 and 11B1 having a slightly matte finish, thereby improving the aesthetic appeal.

[0051] If the arithmetic mean roughness Ra of the exposed surface 11A1 is greater than the arithmetic mean roughness Ra of the surface 14A of the pattern layer 14, the ratio of the arithmetic mean roughness Ra of the exposed surface 11A1 to the arithmetic mean roughness Ra of the surface 14A of the pattern layer 14 (arithmetic mean roughness Ra of the exposed surface 11A1 / arithmetic mean roughness Ra of the surface 14A of the pattern layer 14) may be 6.0 or more and 8.0 or less. If this ratio is 6.0 or more, an observer of the laminate 10 can visually confirm that the exposed surface 11A1 has a different surface quality from the surface 14A of the pattern layer 14, and if it is 8.0 or less, wear near the boundary between the pattern layer 14 and the exposed surface 11A1 can be suppressed. The lower limit of this ratio is more preferably 6.4 or more and 6.8 or more, and the upper limit is more preferably 7.6 or less and 7.2 or less. For example, this ratio is preferably 6.4 or more and 7.6 or 6.8 or more and 7.2 or less.

[0052] If the arithmetic mean roughness Ra of the exposed surface 11B1 is greater than the arithmetic mean roughness of the surface 15A of the pattern layer 15, the ratio of the arithmetic mean roughness Ra of the exposed surface 11B1 to the arithmetic mean roughness Ra of the surface 15A of the pattern layer 15 (arithmetic mean roughness Ra of the exposed surface 11B1 / arithmetic mean roughness Ra of the surface 15A of the pattern layer 15) may be between 4.3 and 6.0. If this ratio is 4.3 or greater, an observer of the laminate 10 can visually recognize that the exposed surface 11B1 has a different surface quality from the surface 15A of the pattern layer 15, and if it is 6.0 or less, wear near the boundary between the pattern layer 15 and the exposed surface 11B1 can be suppressed. The lower limit of this ratio is more preferably 4.8 or greater or 5.2 or greater, and the upper limit is more preferably 5.8 or less or 5.6 or less. For example, this ratio may be between 4.8 and greater or 5.8 or between 5.2 and 5.6.

[0053] The arithmetic mean roughness Ra of the exposed surface 11A1 may be less than the arithmetic mean roughness of the surface 14A of the pattern layer 14, and the arithmetic mean roughness Ra of the exposed surface 11B1 may be less than the arithmetic mean roughness of the surface 15A of the pattern layer 15. In this case, the surface texture can be partially changed, such as the pattern layers 14 and 15 being matte and the exposed surfaces 11A1 and 11B1 being slightly matte, thereby improving the aesthetic appeal.

[0054] If the arithmetic mean roughness Ra of the exposed surface 11A1 is smaller than the arithmetic mean roughness Ra of the surface 14A of the pattern layer 14, the ratio of the arithmetic mean roughness Ra of the exposed surface 11A1 to the arithmetic mean roughness Ra of the surface 14A of the pattern layer 14 (arithmetic mean roughness Ra of the exposed surface 11A1 / arithmetic mean roughness Ra of the surface 14A of the pattern layer 14) may be 0.60 or more and 0.80 or less. If this ratio is 0.60 or more, wear near the boundary with the pattern layer 14 on the exposed surface 11A1 can be suppressed, and if it is 0.80 or less, an observer of the laminate 10 can visually confirm that the exposed surface 11A1 has a different surface quality from the surface 14A of the pattern layer 14. The lower limit of this ratio is more preferably 0.64 or more or 0.68 or more, and the upper limit is more preferably 0.76 or less or 0.72 or less. For example, this ratio may be between 0.64 and 0.76 or between 0.68 and 0.72.

[0055] If the arithmetic mean roughness Ra of the exposed surface 11B1 is smaller than the arithmetic mean roughness of the surface 15A of the pattern layer 15, the ratio of the arithmetic mean roughness Ra of the exposed surface 11B1 to the arithmetic mean roughness Ra of the surface 15A of the pattern layer 15 (arithmetic mean roughness Ra of the exposed surface 11B1 / arithmetic mean roughness Ra of the surface 15A of the pattern layer 15) may be 0.45 or more and 0.60 or less. If this ratio is 0.45 or more, wear near the boundary with the pattern layer 15 on the exposed surface 11B1 can be suppressed, and if it is 0.60 or less, an observer of the laminate 10 can visually confirm that the exposed surface 11A1 has a different surface quality from the surface 14A of the pattern layer 14. The lower limit of this ratio is more preferably 0.48 or more or 0.51 or more, and the upper limit is more preferably 0.57 or less or 0.54 or less. For example, this ratio may be between 0.48 and 0.57 or between 0.51 and 0.54.

[0056] The arithmetic mean roughness Ra of the exposed surface 11A1 may be greater than the arithmetic mean roughness Ra of the exposed surface 11B1. In this case, the exposed surface 11A1 and the exposed surface 11B1 can have different surface textures, thereby enhancing the aesthetic appeal.

[0057] It is preferable that the ratio of the area of ​​the surface 15A of the pattern layer 15 when viewing the laminate 10 from the pattern layer 15 side in the thickness direction (-Z direction) to the area of ​​the surface 14A of the pattern layer 14 when viewing the laminate 10 from the pattern layer 14 side in the thickness direction (-Z direction) (area of ​​surface 15A of pattern layer 15 / area of ​​surface 14A of pattern layer 14) is 0.97 or more and 1.03 or less. If this ratio is within the above range, the area of ​​the surface 14A of the pattern layer 14 and the area of ​​the surface 15A of the pattern layer 15 are approximately equal, so the sizes of the window portion 16 and the window portion 17 are approximately the same. It is more preferable that the lower limit of this ratio is 0.98 or more or 0.99 or more, and the upper limit is more preferable that it is 1.02 or less or 1.01 or less. For example, this ratio may be 0.98 or more and 1.02 or 0.99 or more and 1.01 or less.

[0058] <<ICモジュール> > As shown in Figure 3, the IC module 20 comprises a flat substrate 21, an external connection terminal 22 located on the front surface 21A side of the substrate 21, a terminal 23 located on the back surface 21B side of the substrate 21, an IC chip 24 located on the back surface 21B side of the substrate 21, a molded portion 25 covering the IC chip 24, and a wire 26, such as a gold wire, that electrically connects the terminal 23 and the IC chip 24. Note that the wire electrically connecting the external connection terminal 22 and the IC chip 24 is not shown.

[0059] <Circuit board, external connection terminals, and terminals> The substrate 21 can be a flexible resin film such as glass epoxy resin or polyimide resin. The external connection terminals 22 and 23 are made of patterned copper foil. Specifically, copper foil is provided on the front surface 21A and back surface 21B of the substrate 21, and the external connection terminals 22 and 23 are formed by etching the copper foil into a predetermined pattern. In addition, the substrate 21 is pre-provided with multiple through holes (not shown) for wire bonding to the external connection terminals 22.

[0060] <ICチップ> The IC chip 24 is fixed to the back surface 21B of the substrate 21 via an adhesive (not shown). Specifically, it is positioned in the center of the terminal 23 forming surface of the substrate 21. The IC chip 24 includes a CPU for controlling the operation of both contact and contactless communication, a storage device such as RAM, EEPROM, and flash memory, and various circuits such as an interface circuit and a power generation circuit for decoding input signals and generating output signals for contact and contactless communication.

[0061] <Molded part> The molded portion 25 is intended to protect the IC chip 24 and wires 26 from external forces and environmental loads. A UV-curable resin or a thermosetting resin is used as the molded portion 25.

[0062] <<Conductive Plate>> The conductive plate 30 is a conductive plate-shaped member. A portion of the conductive plate 30 is exposed within the recess 11C, specifically within the first recess 11D. That is, as shown in Figure 3, the conductive plate 30 comprises an exposed portion 31 that is exposed within the first recess 11D and a non-exposed portion 32 located within the substrate 11. The conductive plate 30 is electrically connected to the IC module 20 via a conductive adhesive layer 50.

[0063] The thickness of the conductive plate 30 is preferably 70 μm or more and 150 μm or less, and more preferably 80 μm or more and 120 μm or less.

[0064] The constituent material of the conductive plate 30 is not particularly limited as long as it is a conductive material. Suitable materials include, for example, metal materials such as copper and aluminum. Among these, copper is preferred from the viewpoint of cost and durability. Furthermore, to improve weldability, the conductive plate 30 may be formed, for example, by silver plating a copper alloy.

[0065] <<Antenna>> The antenna 40 is coiled, as shown in Figure 1, and is composed of antenna wires. The antenna 40 has a pair of ends 41. The ends 41 of the antenna 40 are electrically connected to the conductive plate 30, and thus electrically connected to the IC module 20. This constitutes a contactless communication circuit. This communication circuit may, for example, perform proximity communication using the HF frequency band of 13.56 MHz, or it may perform communication using another frequency band, such as the UHF frequency band of 920 MHz.

[0066] When a dual-interface IC card is held over an external device such as a reader / writer, the communication circuit generates an electric current due to the magnetic field formed by the reader / writer, supplying power to the IC chip. This enables the IC chip to be driven, allowing for contactless transmission and reception of information with the reader / writer, as well as reading and rewriting information in the memory.

[0067] The antenna wire constituting the antenna 40 is typically formed from a coated conductor, in which a copper wire is covered with an insulating material. Alternatively, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum can also be selected. Using coated conductors as antenna wires allows for cheaper manufacturing compared to methods such as copper foil etching.

[0068] The diameter of the antenna wire is not particularly limited as long as it ensures the characteristics of a non-contact communication circuit, but for example, it can be 0.03 mm or more and 0.30 mm or less, preferably 0.05 mm or more and 0.15 mm or less. By using the latter range, durability against heat and pressure from embedding and external forces from cutting can be improved, and good communication characteristics can be ensured.

[0069] <<Conductive adhesive layer>> The conductive adhesive layer 50 is placed between the IC module 20 and the exposed portion 31 of the conductive plate 30. By placing the conductive adhesive layer 50, the IC module 20 and the conductive plate 30 can be electrically and mechanically connected, so the IC module 20 and the antenna 40 can be electrically connected.

[0070] As the conductive adhesive layer 50, an anisotropic conductive film (ACF) or anisotropic conductive paste (ACP) can be used. Alternatively, a conductive paste or solder paste in which silver particles are dispersed as a filler in epoxy resin may also be used. In particular, if an anisotropic conductive film is used, the anisotropic conductive film can be heat-laminated over the entire back surface of the substrate 21 of the IC module 20, and after embedding the IC module 20 in the recess 11C of the pre-cut base body 11, it can be heat-pressed at a predetermined temperature and load. This makes it easy to electrically connect the IC module 20 and the conductive plate 30. Furthermore, since a mechanical connection of the IC module 20 to the base body 11 can be made simultaneously, the mounting process of the IC module 20 to the base body 11 can be simplified.

[0071] The electrical connection between the IC module 20 and the conductive plate 30, and the mechanical connection between the IC module 20 and the substrate 11, when an anisotropic conductive film is used as the conductive adhesive layer 50, can be described as follows. The conductive adhesive layer 50 has a structure in which conductive particles, in which a metal film is formed around a spherical resin or spherical metal, are dispersed in an adhesive, which is a binder containing adhesive components. The conductive particles may be resin coated with nickel or gold, or they may be solder particles. Various types of solder particles can be used, such as SnPb-based, SnAgCu-based, SnCu-based, SnZnBi-based, SnAgInBi-based, SnZnAl-based, or alloys of these with other metals. These structures are the same even when an anisotropic conductive paste is used.

[0072] <<<<Manufacturing method for laminates>>> The laminate 10 can be manufactured by the following method. First, a multi-panel first intermediate laminate 60 shown in Figure 4 is prepared. The multi-panel first intermediate laminate 60 is made by multi-paneling two or more first intermediate laminates 60A as shown in Figures 4 and 5. In this embodiment, the laminate 10 is manufactured using the multi-panel first intermediate laminate 60, but the laminate 10 may also be manufactured using the first intermediate laminate 60A alone instead of the multi-panel first intermediate laminate 60.

[0073] As shown in Figure 6, the first intermediate laminate 60A comprises a transparent or translucent base 11, a first underlayment 12 formed on the first surface 11A side of the base 11 and removable by laser irradiation, a second underlayment 13 formed on the second surface 11B side of the base 11 opposite to the first surface 11A and removable by laser irradiation, a first pattern layer 14 formed on the side of the first underlayment 12 opposite to the base 11 side, and a second pattern layer 15 formed on the side of the second underlayment 13 opposite to the base 11 side. Note that the first intermediate laminate 60 does not have window portions 16 and 17.

[0074] The first intermediate laminate 60A preferably has a mark 61 provided at the boundary or inside the boundary of the planned window area 60B for forming the window 16 on the surface 14A of the pattern layer 14, as shown in Figure 5. Having such a mark 61 makes it possible to confirm the misalignment of the window 16 when it is formed. Similarly, the first intermediate laminate 60A preferably has a mark provided at the boundary or inside the boundary of the planned window area (not shown) for forming the window 17 on the surface 15A of the pattern layer 15. Having such a mark makes it possible to confirm the misalignment of the window 17 when it is formed.

[0075] Since the laminate 10 is a dual-interface IC card, as shown in Figure 7, the first intermediate laminate 60A also includes a pair of conductive plates 30 arranged inside the base 11 and an antenna 40 arranged inside the base 11. The first intermediate laminate 60 does not have a recess 11C. In the first intermediate laminate 60A, a portion of the conductive plate 30 is exposed to the recess 11C when the recess 11C is formed, so in the first intermediate laminate 60A, it is not exposed.

[0076] When manufacturing the first intermediate laminate 60A, first, a conductive plate 30 is placed on one surface 113A of the core layer 113, as shown in Figure 8. After placing the conductive plate 30 on the surface 113A of the core layer 113, an antenna 40 having an end portion 41 is formed on the surface 113A of the core layer 113. Then, a portion of the end portion 41 of the antenna 40 is welded to the surface 30A of the conductive plate 30 opposite to the surface in contact with the core layer 113 to form a welded portion 41A. This gives rise to the antenna sheet 70. The conductive plate 30 and the portions of the antenna 40 other than the end portion 41 may be embedded in the surface 113A of the core layer 113.

[0077] Next, as shown in Figure 9A, the oversheet layer 111, core layer 112, antenna sheet 70, inner layer 114, core layer 115, and oversheet layer 116 are stacked in this order to obtain a substrate precursor 80 with multi-sided antennas. The antenna sheet 70 is positioned so that the antenna 40 faces the inner layer 114. As a result, the antenna 40 is sandwiched between the core layer 113 and the inner layer 114.

[0078] Subsequently, as shown in Figure 9B, the substrate precursor 80 with multi-sided antennas is sandwiched between heat-press plates 90 made of stainless steel or the like from above and below in the thickness direction, and the substrate precursor 80 with multi-sided antennas is heated and pressurized through the heat-press plates 90. By going through this heat-pressing process, a substrate 11 with multi-sided antennas in which each sheet is integrated can be obtained. Furthermore, if any of the layers constituting the substrate precursor 80 with multi-sided antennas have heat resistance that prevents heat fusion at a predetermined temperature, an adhesive sheet that heats together at a predetermined temperature is sandwiched between each layer, or an adhesive is applied, and then the heat-pressing process is performed on these to obtain a substrate 11 with integrated multi-sided antennas 40.

[0079] After obtaining the base body 11 with the multi-paneled antenna 40, as shown in Figure 10, a base layer 12 and a pattern layer 14 are formed in this order on the first surface 11A of the base body 11 with the multi-paneled antenna 40 by printing, and a base layer 13 and a pattern layer 15 are formed in this order on the second surface 11B of the base body 11 by printing. This gives the first multi-paneled intermediate laminate 60. Alternatively, the pattern layer 14 and the base layer 12 may be formed on the transfer substrate in this order, and the base layer 12 and pattern layer 14 may be transferred to the first surface 11A of the base body 11 to form the base layer 12 and pattern layer 14 on the first surface 11A of the base body 11. Similarly, the pattern layer 15 and the base layer 13 may be formed on the transfer substrate in this order, and the base layer 13 and pattern layer 15 may be transferred to the second surface 11B of the base body 11 to form the base layer 13 and pattern layer 15 on the second surface 11B of the base body 11.

[0080] After forming the multi-panel first intermediate laminate 60, the first intermediate laminate 60A is punched out from the multi-panel first intermediate laminate 60 to separate it into individual pieces. Then, as shown in Figure 11A, the first recess 11D is formed in the first intermediate laminate 60A. Specifically, the pattern layer 14, the base layer 12, and the substrate 11 are cut from the surface of the first intermediate laminate 60A in the depth direction (-Z direction). This cutting is continued until the conductive plate 30 is exposed.

[0081] Next, as shown in Figure 11B, a portion of the bottom surface 11D1 of the first recess 11D is further cut to form the second recess 11E. This cutting is performed so that the diameter of the hole in the second recess 11E is smaller than the diameter of the hole in the first recess 11D. As a result, a base body 11 is obtained that consists of the first recess 11D and the second recess 11E, and has a recess 11C with a step between the bottom surfaces 11D1 and 11E1.

[0082] On the other hand, as shown in Figure 12A, a conductive adhesive layer 50 is formed on the terminals 23 of the IC module 20.

[0083] Subsequently, as shown in Figure 12B, the terminal 23 and the conductive plate 30 are electrically connected via the conductive adhesive layer 50, and the IC module 20 is placed in the recess 11C such that the molded portion 25 is located in the second recess 11E. This electrically connects the IC module 20 and the antenna 40 via the conductive adhesive layer 50, and the second intermediate laminate 100 is obtained.

[0084] After preparing the second intermediate laminate 100, a laser beam is shone onto a desired area of ​​the second intermediate laminate 100 from the pattern layer 14 side, as shown in Figure 13. This causes the base layer 12 to melt and be removed by scattering, and the pattern layer 14 is also removed. Once the base layer 12 is removed, the laser beam reaches the base layer 13 through the transparent or translucent substrate 11. This causes the base layer 13 to melt and be removed by scattering, and the pattern layer 15 is also removed. As a result, a laminate 10 with window portions 16 and 17 is formed.

[0085] The laser oscillator that generates the laser light is not particularly limited as long as it can generate laser light of a wavelength absorbed by the laser light absorbing material constituting the underlying layers 12 and 13, but examples include Nd:YAG lasers (wavelength 1064nm / 532nm), Nd:YVO4 lasers (wavelength 1064nm), and carbon dioxide lasers (wavelength 10600nm).

[0086] According to this embodiment, a second intermediate laminate 100 comprises a transparent or translucent base 11, a first underlayment 12 formed on the first surface 11A side of the base 11 and removable by laser irradiation, a second underlayment 13 formed on the second surface 11B side of the base 11 and removable by laser irradiation, a first pattern layer 14 formed on the side of the first underlayment 12 opposite to the surface facing the base 11, and a second pattern layer 15 formed on the side of the second underlayment 13 opposite to the surface facing the base 11. By irradiating the second intermediate laminate 100 with laser light from the side of the first pattern layer 14, windows 16 and 17 can be formed. Therefore, even after the pattern layers 14 and 15 have been formed, the design of the windows 16 and 17 can be changed. As a result, a laminate 10 with a high degree of freedom and high design quality can be obtained. Furthermore, by irradiating the second intermediate laminate 100 with laser light from the first pattern layer 14 side, the window portions 16 and 17 can be formed continuously, thereby suppressing misalignment of the window portions 16 and 17 formed on the front and back surfaces of the laminate 10. [Examples]

[0087] To illustrate the present invention in detail, examples are given below, but the present invention is not limited to these examples.

[0088] <Example 1> Two conductive plates made of copper, each 6 mm long, 6 mm wide, and 0.1 mm thick, were bonded to a predetermined area on one side of a transparent inner core layer (Mitsubishi Chemical Corporation's "Diafix PG-MCT") made of glycol-modified PET resin (PET-G resin) with a thickness of 0.20 mm. Next, an antenna made of copper wire with a diameter of 0.11 mm was embedded in the aforementioned surface of the core layer. Then, a portion of the end of the antenna was welded to the exposed surface of the conductive plate opposite to the surface in contact with the inner core layer, forming a 2 mm long welded section. This formed an antenna sheet.

[0089] Subsequently, a transparent upper oversheet made of PET-G resin with a thickness of 0.05 mm (Diafix PG-MCT manufactured by Mitsubishi Chemical Corporation), a transparent upper core layer made of glycol-modified PET resin (PET-G resin) with a thickness of 0.20 mm (Diafix PG-MCT manufactured by Mitsubishi Chemical Corporation), the antenna sheet, a transparent inner layer made of PET-G resin with a thickness of 0.20 mm (Diafix PG-MCT manufactured by Mitsubishi Chemical Corporation), a transparent lower core layer made of glycol-modified PET resin (PET-G resin) with a thickness of 0.20 mm (Diafix PG-MCT manufactured by Mitsubishi Chemical Corporation), and a transparent lower oversheet made of PET-G resin with a thickness of 0.05 mm (Diafix PG-MCT manufactured by Mitsubishi Chemical Corporation) were laminated in this order to form an antenna-attached substrate precursor. In the antenna-attached substrate precursor, the antenna sheet was positioned so that the antenna was on the inner layer side. Then, the substrate precursor with antenna was sandwiched between hot-pressed plates, and the substrate precursor with antenna was heated to 120°C and pressurized at 2 MPa to integrate it, thereby obtaining an antenna-equipped substrate having an upper oversheet layer, an upper core layer, a middle core layer, an inner layer, a lower core layer, and a lower oversheet layer, as well as an antenna. The visible light transmittance of the substrate was measured using a spectrophotometer (ASV11D-H manufactured by AS ONE Corporation) equipped with an integrating sphere, and the visible light transmittance of the substrate was found to be 80% or higher, indicating that it was "transparent".

[0090] Then, a 2mm thick upper underlay layer was printed on the upper oversheet layer of the antenna-equipped substrate using an ink containing aluminum powder and vehicle (VAHS NO2 Silver, manufactured by Showa Ink Industries Co., Ltd.), and a 0.5mm thick upper pattern layer was formed on the upper underlay layer using an ink (UV Carton (Process Color), manufactured by DIC Graphics Co., Ltd.). Similarly, a 2mm thick lower underlay layer and a 0.5mm thick lower pattern layer were formed on the lower oversheet layer of the antenna-equipped substrate. This resulted in the creation of an intermediate laminate.

[0091] Subsequently, a laser beam under the following conditions was irradiated from the upper pattern layer side in the thickness direction of the intermediate laminate to remove the upper base layer and the upper pattern layer, forming a first rectangular window section measuring 5 mm vertically and 5 mm horizontally that penetrated the upper base layer and the upper pattern layer. Furthermore, the laser beam was allowed to reach the lower base layer through the first window section and the transparent substrate to remove the portion of the lower base layer and the lower pattern layer corresponding to the first window section, forming a second rectangular window section measuring 5 mm vertically and 5 mm horizontally that penetrated the lower base layer and the lower pattern layer. As a result, a laminate was obtained in which a portion of the upper oversheet was exposed through the first window section and a portion of the lower oversheet was exposed through the second window section. (Laser irradiation conditions) • Laser device name: IDP Corporation's laser marker "WISE-LE" • Laser light source: YAG laser • Laser wavelength: 1064nm • Power setting: 75 • Speed ​​setting: 1000

[0092] <Example 2> In Example 2, after forming the upper and lower pattern layers, an intermediate laminate was sandwiched between press plates with uneven surfaces, and the upper and lower pattern layers were given a matte finish by pressurizing them at 2 MPa in an environment of 120°C. The laminate was obtained in the same manner as in Example 1.

[0093] <Comparative Example 1> In Comparative Example 1, the first window portion was formed by printing on the upper pattern layer and the upper base layer, and the second window portion was formed by printing on the lower pattern layer and the lower base layer. Specifically, the laminate was formed by the following procedure.

[0094] First, a substrate with an antenna of the same structure was obtained using the same procedure as in Example 1. Then, a 2 mm thick upper underlay layer was printed on the upper oversheet layer of the substrate with the antenna using an ink containing aluminum powder and vehicle (VAHS NO2 Silver, manufactured by Showa Ink Industries Co., Ltd.), and a 0.5 mm thick upper pattern layer was formed on the upper underlay layer using an ink (UV Carton (Process Color), manufactured by DIC Graphics Co., Ltd.). Similarly, a 2 mm thick lower underlay layer and a 0.5 mm thick lower pattern layer were formed on the lower oversheet layer of the substrate with the antenna. This resulted in an intermediate laminate. Here, the upper pattern layer and upper underlay layer had a first rectangular window measuring 5 mm x 5 mm, and the lower pattern layer and lower underlay layer had a second rectangular window measuring 5 mm x 5 mm. This resulted in a laminate in which a part of the upper oversheet was exposed through the first window and a part of the lower oversheet was exposed through the second window.

[0095] <Checking for misalignment of window area> In the laminates according to Examples 1 and 2 and Comparative Example 1, we evaluated whether the second window portion was misaligned relative to the first window portion in the thickness direction of the laminate. The evaluation criteria were as follows. A: No misalignment of the second window section relative to the first window section was observed. B: A slight misalignment of the second window section relative to the first window section was observed. C: A clear misalignment of the second window section relative to the first window section was confirmed.

[0096] <Arithmetic mean roughness Ra measurement> The arithmetic mean roughness Ra of the surfaces was measured in the laminates according to Examples 1 and 2 and Comparative Example 1. Specifically, using a surface roughness meter (also called a surface roughness measuring instrument) (product number "SURFCOM480A", manufactured by Tokyo Seimitsu Co., Ltd.), the arithmetic mean roughness Ra was measured at two points each for the exposed surface of the upper oversheet exposed through the first window (upper exposed surface), the surface of the upper pattern layer, the exposed surface of the lower oversheet exposed through the second window (lower exposed surface), and the surface of the lower pattern layer in each laminate, and the average values ​​are shown in Table 1. In addition, the ratio of the arithmetic mean roughness Ra of the upper exposed surface to the arithmetic mean roughness Ra of the upper pattern layer surface, the ratio of the arithmetic mean roughness Ra of the lower exposed surface to the arithmetic mean roughness Ra of the lower pattern layer surface, and the absolute value of the difference between the arithmetic mean roughness Ra of the upper exposed surface and the arithmetic mean roughness Ra of the lower exposed surface are also shown in Table 1. During measurement, the system settings were set to "roughness measurement," the tilt correction to "both ends," the filter to "Gaussian," the measurement speed to 0.6 mm / sec, the cutoff value to 0.8 mm, and the reference length (sampling length) Ir to 0.8 mm.

[0097] <Area measurement> In the laminates according to Examples 1 and 2 and Comparative Example 1, the surface area of ​​the upper pattern layer was measured when the laminate was viewed from the upper pattern layer side, and the surface area of ​​the lower pattern layer was measured when the laminate was viewed from the lower pattern layer side, and the ratio of the surface area of ​​the lower pattern layer to the surface area of ​​the upper pattern layer was determined. The above areas were measured using the length-measuring function of the VK-X3000 laser microscope manufactured by Keyence Corporation.

[0098] The results are shown in Table 1 below. [Table 1]

[0099] As shown in Table 1, in the laminate according to Comparative Example 1, the first and second windows were formed by printing the upper pattern layer and the lower pattern layer, etc., resulting in a misalignment of the second window relative to the first window. In contrast, in the laminates according to Examples 1 and 2, the first and second windows were formed by irradiating the laminate in the thickness direction with laser light to remove the upper pattern layer and the lower pattern layer, etc., so there was no misalignment of the second window relative to the first window.

[0100] In the laminate according to Comparative Example 1, the first and second window portions were formed by printing the upper pattern layer and the lower pattern layer, etc., so the absolute difference between the arithmetic mean roughness of the upper exposed surface and the arithmetic mean roughness of the lower exposed surface was less than 0.05 μm. In contrast, in the laminates according to Examples 1 and 2, the first and second window portions were formed by irradiating the laminate with laser light in the thickness direction to remove the upper pattern layer and the lower pattern layer, etc., so the absolute difference between the arithmetic mean roughness of the upper exposed surface and the arithmetic mean roughness of the lower exposed surface was 0.05 μm or more.

[0101] In the laminate according to Comparative Example 1, the first and second window portions were formed by printing the upper pattern layer and the lower pattern layer, etc., resulting in a small difference in arithmetic mean roughness Ra between the upper exposed surface and the upper pattern layer, and between the lower exposed surface and the lower pattern layer. In contrast, in the laminates according to Examples 1 and 2, the first and second window portions were formed by irradiating the laminate in the thickness direction with laser light to remove the upper pattern layer and the lower pattern layer, etc., resulting in a large difference in arithmetic mean roughness Ra between the upper exposed surface and the upper pattern layer, and between the lower exposed surface and the lower pattern layer. It was confirmed that in the laminate according to Example 1, the upper and lower pattern layers could be made mirror-like, and the upper and lower exposed surfaces could be made slightly matte, and in the laminate according to Example 2, the upper and lower pattern layers could be made matte, and the upper and lower exposed surfaces could be made slightly matte.

[0102] In the laminate according to Comparative Example 1, the first and second window portions were formed by printing the upper pattern layer and the lower pattern layer, etc., so the ratio of the surface area of ​​the lower pattern layer to the surface area of ​​the upper pattern layer was outside the range of 0.97 to 1.03. In contrast, in the laminates according to Examples 1 and 2, the first and second window portions were formed by irradiating the laminate with laser light in the thickness direction to remove the upper pattern layer and the lower pattern layer, etc., so the ratio of the surface area of ​​the lower pattern layer to the surface area of ​​the upper pattern layer was within the range of 0.97 to 1.03. [Explanation of symbols]

[0103] 10…Laminate 11...Base 11A...Side 1 11A1…1st exposed surface 11B…Second side 11B1…Second exposed surface 12...First base layer 13…Second base layer 14…First pattern layer 15...Second pattern layer 16…First Window Section 17…Second Window Section

Claims

1. A transparent or translucent substrate, A first sublayer formed on the first surface side of the substrate and removable by laser irradiation, A second underlayer is formed on the second surface side of the substrate opposite to the first surface, and can be removed by laser irradiation, A first pattern layer formed on the side of the first underlayer opposite to the side facing the substrate, A step of preparing an intermediate laminate comprising: a second pattern layer formed on the side of the second base layer opposite to the side facing the substrate; A step of irradiating a portion of the intermediate laminate with laser light from the first pattern layer side to remove a portion of the first base layer and the first pattern layer so as to penetrate the thickness direction of the intermediate laminate, thereby forming a first window portion, and removing portions of the second base layer and the second pattern layer corresponding to the first window portion so as to penetrate the thickness direction of the intermediate laminate, thereby forming a second window portion, thereby obtaining a laminate in which a portion of the first surface of the base is exposed through the first window portion and a portion of the second surface of the base is exposed through the second window portion, A method for manufacturing a laminate, comprising the above.

2. The method for manufacturing a laminate according to claim 1, wherein the intermediate laminate has at least one of the following: a mark provided on the boundary of a planned area for forming the first window portion on the surface of the first pattern layer or inside the boundary; and a mark provided on the boundary of a planned area for forming the second window portion on the surface of the second pattern layer or inside the boundary.

3. The method for manufacturing a laminate according to claim 1, wherein the laminate is a card or a booklet.

4. The method for manufacturing a laminate according to claim 3, wherein the card is an IC card.

5. A laminate comprising a transparent or translucent substrate, a first underlayment formed on a first surface of the substrate, a second underlayment formed on a second surface of the substrate opposite to the first surface, a first pattern layer formed on the surface of the first underlayment opposite to the surface facing the substrate, and a second pattern layer formed on the surface of the second underlayment opposite to the surface facing the substrate, The laminate comprises a first window portion that penetrates the first base layer and the first pattern layer in the thickness direction, and a second window portion that penetrates the portion of the second base layer and the second pattern layer corresponding to the first window portion in the thickness direction of the laminate. The first surface of the substrate has a first exposed surface exposed through the first window, and the second surface of the substrate has a second exposed surface exposed through the second window, A laminate in which the absolute value of the difference between the arithmetic mean roughness of the first exposed surface and the arithmetic mean roughness of the second exposed surface is 0.05 μm or more.

6. The laminate according to claim 5, wherein the arithmetic mean roughness of the first exposed surface is 0.42 μm or more and 0.48 μm or less, and the arithmetic mean roughness of the second exposed surface is 0.30 μm or more and 0.36 μm or less.

7. The laminate according to claim 5, wherein the arithmetic mean roughness of the first exposed surface is greater than the arithmetic mean roughness of the surface of the first pattern layer, and the arithmetic mean roughness of the second exposed surface is greater than the arithmetic mean roughness of the surface of the second pattern layer.

8. The laminate according to claim 5, wherein the arithmetic mean roughness of the first exposed surface is less than the arithmetic mean roughness of the surface of the first pattern layer, and the arithmetic mean roughness of the second exposed surface is less than the arithmetic mean roughness of the surface of the second pattern layer.

9. The laminate according to claim 5, wherein the ratio of the surface area of ​​the second pattern layer when the laminate is viewed from the second pattern layer side in the thickness direction of the laminate to the surface area of ​​the first pattern layer when the laminate is viewed from the first pattern layer side in the thickness direction of the laminate is 0.97 or more and 1.03 or less.

10. The laminate according to claim 5, wherein the laminate is a card or a booklet.

11. The laminate according to claim 10, wherein the card is an IC card.

12. A transparent or translucent substrate, A first sublayer is disposed on the first surface side of the substrate and can be removed by laser irradiation, A second sublayer is located on the second surface side of the substrate opposite to the first surface, and can be removed by laser irradiation. A first pattern layer formed on the side of the first underlayer opposite to the side facing the substrate, A second pattern layer formed on the side of the second base layer opposite to the side facing the substrate, An intermediate laminate comprising the above.

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