Negative thermal expansion material and method for manufacturing a negative thermal expansion material

JP2026102749APending Publication Date: 2026-06-23NAT UNIV CORP TOKAI NAT HIGHER EDUCATION & RES SYST

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
NAT UNIV CORP TOKAI NAT HIGHER EDUCATION & RES SYST
Filing Date
2026-03-12
Publication Date
2026-06-23

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Benefits of technology

【0009】 本開示によれば、負熱膨張を示す新たな材料を提供できる。

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Abstract

This provides a new material that exhibits negative thermal expansion. [Solution] The negative thermal expansion material is Ti (3) 2-x M x O3(M contains at least one element selected from Mg, Al, Si, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Zr, Nb, Mo, Ag, In, Sn, Sb, La, Ta, W, Bi, 0
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Claims

1. General formula (3) Ti 2-x M x O 3 The oxide contains an oxide represented by (where M is at least one element selected from Mg, Al, Si, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Zr, Nb, Mo, Ag, In, Sn, Sb, La, Ta, W, Bi, and satisfies 0 < x < 2), and there exists a region exhibiting negative thermal expansion in the temperature range of 100 to 500 K. Negative thermal expansion material.

2. In the general formula (3) above, x satisfies 0 < x ≤ 1.

6. The negative thermal expansion material according to claim 1.

3. The coefficient of linear expansion is -10 ppm / K or less in the temperature range of 100 to 500 K. The negative thermal expansion material according to claim 1 or 2.

4. General formula (3) Ti 2-x M x O 3 The process includes a step of mixing and heating raw materials for a compound that contains an oxide represented by (M, which includes at least one element selected from Mg, Al, Si, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Zr, Nb, Mo, Ag, In, Sn, Sb, La, Ta, W, Bi, and satisfies 0 < x < 2), and exhibits negative thermal expansion in a temperature range of 100 to 500 K. A method for manufacturing a negative thermal expansion material.