Methods for manufacturing transfer films, laminates, touch sensors, and printed circuit boards.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- FUJIFILM CORP
- Filing Date
- 2026-03-13
- Publication Date
- 2026-06-23
AI Technical Summary
【0010】 本発明によれば、線幅の狭い導電性細線の形成に用いた際に、導電性細線の形成不良の発生を抑制できる、転写フィルムを提供できる。 また、本発明によれば、上記転写フィルムを用いた積層体の製造方法、上記転写フィルムを用いたプリント配線基板の製造方法、及び、タッチセンサーを提供できる。
Smart Images
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Abstract
Claims
1. It comprises a temporary support and a photosensitive composition layer disposed on the temporary support, The number of foreign particles with a diameter of 1 μm or more in the photosensitive composition layer is 10 particles / mm ２ The following: The photosensitive composition layer comprises an alkali-soluble acrylic resin, The content of the alkali-soluble acrylic resin is 30.00 to 90.00% by mass relative to the total mass of the photosensitive composition layer. The photosensitive composition layer contains a residual solvent, The residual solvent content is 2 to 15 mg / m². ２ This is a transfer film.
2. The transfer film according to claim 1, wherein the thickness of the photosensitive composition layer is 20 μm or less.
3. The number of foreign objects with a diameter of 1 μm or more in the temporary support is 10 per mm. ２ The transfer film according to claim 1 or 2, which is as follows:
4. The transfer film according to any one of claims 1 to 3, wherein the thickness of the temporary support is 30 μm or less.
5. The photosensitive composition layer comprises a polymerizable compound, The transfer film according to any one of claims 1 to 4, wherein the content of the polymerizable compound is 10.00 to 70.00% by mass with respect to the total mass of the photosensitive composition layer.
6. The photosensitive composition layer comprises a polymerizable compound, The transfer film according to any one of claims 1 to 5, wherein the content of the polymerizable compound is 10.00 to 50.00% by mass with respect to the total mass of the photosensitive composition layer.
7. The photosensitive composition layer contains a polymerization initiator, The transfer film according to any one of claims 1 to 6, wherein the content of the polymerization initiator is 0.10 to 10.00% by mass with respect to the total mass of the photosensitive composition layer.
8. The transfer film according to any one of claims 1 to 7, wherein the ratio of the mass of the component with a molecular weight of 100,000 or more contained in the photosensitive composition layer to the mass of the component with a molecular weight of 10,000 or less contained in the photosensitive composition layer is 0.10 or less.
9. The transfer film according to any one of claims 1 to 8, wherein the alkali-soluble acrylic resin comprises a structural unit having a carboxyl group and a structural unit having an aromatic ring.
10. The photosensitive composition layer contains a polymerization inhibitor, The transfer film according to any one of claims 1 to 9, wherein the content of the polymerization inhibitor is 0.10 to 5.00% by mass with respect to the total mass of the photosensitive composition layer.
11. The transfer film according to any one of claims 1 to 10, wherein the refractive index of the photosensitive composition layer is 1.54 or less.
12. A lamination step of bonding the photosensitive composition layer on the temporary support of the transfer film according to any one of claims 1 to 11 to a substrate having a conductive layer by bringing the photosensitive composition layer into contact with the substrate, the conductive layer, the photosensitive composition layer, and the temporary support in this order to obtain a substrate with a photosensitive composition layer, An exposure step of pattern exposure of the photosensitive composition layer, A developing step involves developing the exposed photosensitive composition layer to form a pattern, An etching step to obtain conductive nanowires by etching the conductive layer in the region where the aforementioned pattern is not placed, The process includes a removal step to remove the aforementioned pattern, A method for manufacturing a laminate, further comprising a peeling step of peeling the temporary support from the substrate with the photosensitive composition layer, between the bonding step and the exposure step, or between the exposure step and the development step.
13. The method for manufacturing a laminate according to claim 12, wherein the wire width of the conductive fine wire is 8 μm or less.
14. A touch sensor comprising a laminate manufactured by the manufacturing method described in claim 12 or 13.
15. A seed layer formation step in which a seed layer is formed on a substrate, A lamination step of bonding the photosensitive composition layer on the temporary support of the transfer film according to any one of claims 1 to 11 to a substrate having a seed layer by bringing the photosensitive composition layer into contact with the substrate, the seed layer, the photosensitive composition layer, and the temporary support in this order to obtain a substrate with a photosensitive composition layer, An exposure step of pattern exposure of the photosensitive composition layer, A developing step involves developing the exposed photosensitive composition layer to form a pattern, A metal plating layer formation step involves forming a metal plating layer on the seed layer in an area where the aforementioned pattern is not arranged by a plating process, A protective layer formation step of forming a protective layer on the metal plating layer, A pattern removal step to remove the aforementioned pattern, The process includes a seed layer removal step of removing the exposed seed layer to obtain a conductive nanowire, A method for manufacturing a printed wiring board, further comprising a peeling step of peeling the temporary support from the substrate with the photosensitive composition layer, between the lamination step and the exposure step, or between the exposure step and the development step.