Electronic components and molds

Abstract

The present invention provides an electronic component that can be manufactured without reducing production efficiency while preventing resin leakage during resin encapsulation of the bobbin, and a mold for resin encapsulating the electronic component. [Solution] The present invention is an electronic component comprising a bobbin on which a coil is mounted, a connecting terminal 31 to which one end of the coil is connected and fixed to the bobbin, and a molded resin 41 in which a part of the bobbin, coil, and connecting terminal 31 is sealed, wherein the bobbin has an exposed portion 21a exposed from the molded resin 41, and the connecting terminal 31 has an end 31b opposite to the end 31a to which one end of the coil is connected protruding outward from the exposed portion 21a.

Description

Technical Field

[0001] The present invention relates to electronic components and molds.

Background Art

[0002] As a conventional technology, there is a product in which an electronic component in which a bobbin 21 mounted with a coil 11 is sealed with a molding resin 41 is connected to a large substrate. In addition, a technology related to such an electronic component is disclosed in Patent Document 1.

[0003] In a product in which the above electronic component is connected to a large substrate, when the coil 11 mounted on the bobbin 21 is to be sealed with the molding resin 41 while being connected to the large substrate, the large substrate takes up an area, so the number of electronic components that can be put into the mold decreases. As a result, the production efficiency decreases.

[0004] Further, in the conventional technology, when trying to make the connection terminal protrude from the molding resin, there is a problem that the molding resin leaks out from a slight gap in the mold.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In order to solve the above problems, there is a need for an electronic component that can be manufactured without reducing the production efficiency while preventing resin leakage by providing an exposed portion on the bobbin to eliminate the gap, and a mold for resin-sealing the electronic component.

[0007] Various aspects of the present invention aim to provide electronic components that can be manufactured without reducing production efficiency while preventing resin leakage during resin encapsulation of bobbins, and molds for resin encapsulating such electronic components. [Means for solving the problem]

[0008] Various aspects of the present invention will be described below.

[0009] [1] A bobbin with a coil mounted on it, One end of the coil is connected to a connecting terminal fixed to the bobbin, A molded resin in which the bobbin, the coil, and a portion of the connecting terminals are sealed, It has, The bobbin has an exposed portion that is exposed from the mold resin, The aforementioned connection terminal is an electronic component characterized in that the end opposite to the end to which one end of the coil is connected protrudes outward from the exposed portion.

[0010] According to one aspect of the present invention, the electronic component described in [1] above, the bobbin is sealed with molded resin, and an exposed portion of the bobbin is provided that is exposed from the molded resin. A connection terminal for connecting to a coil mounted on the bobbin and to a substrate protrudes from the exposed portion to the outside of the molded resin. By exposing the exposed portion in this way and eliminating gaps when the resin is sealed in the mold, it is possible to prevent the molded resin from leaking out of the mold. Therefore, it becomes possible to connect even large substrates, and an electronic component can be manufactured without reducing production efficiency.

[0011] [2] In the above [1], The bobbin has a first tapered portion located on the side opposite to the exposed portion, The first tapered portion is for the purpose of holding the exposed portion so that it is exposed from the mold when sealing with the mold resin, by the second tapered portion of the mold pin formed on the upper mold of the mold. The mold resin has a first hole formed by the mold pin, An electronic component characterized in that a portion of the first tapered portion of the bobbin is exposed from the molded resin through the first hole.

[0012] According to the electronic component described in [2] above in one aspect of the present invention, the first tapered portion is for pressing the exposed portion out of the mold by the second tapered portion of the mold pin formed on the upper mold of the mold when sealing with mold resin. This provides an exposed portion of the bobbin that is exposed from the mold resin. By exposing the exposed portion in this way and eliminating gaps when sealing with resin in the mold, it is possible to prevent the mold resin from leaking out of the mold. Therefore, it becomes possible to connect even large substrates, and an electronic component can be manufactured without reducing production efficiency.

[0013] [3] In the above [2], The mold resin has a second hole, The second hole is formed by the fixing pin, which is formed in the lower mold of the mold and positioned opposite the mold pin, when the second tapered portion of the mold pin presses the exposed portion so that it is exposed from the mold. The fixing pin then clamps the bobbin between the fixing pin and the mold pin. The electronic component is characterized in that the bobbin is exposed from the molded resin through the second hole.

[0014] [4] A mold for sealing a bobbin having a first tapered portion with resin, The aforementioned mold has an upper mold and a lower mold. The upper mold has a mold pin with a second tapered portion formed therein. The lower mold has a fixing pin formed at a position opposite to the mold pin. The second tapered portion of the mold pin is intended to press against the first tapered portion of the bobbin so that when the bobbin is sealed with the resin, the exposed portion of the bobbin is exposed from the mold and the connecting terminal protrudes from the exposed portion to the outside of the mold. The mold is characterized in that when the fixing pin presses the first tapered portion by the second tapered portion, the bobbin is sandwiched between the fixing pin and the mold pin.

[0015] According to the mold of [4] according to one aspect of the present invention, when the bobbin is sealed with resin, the bobbin is sandwiched between the fixing pin of the lower mold and the upper mold pin, and the first tapered portion of the bobbin is pressed by the second tapered portion of the upper mold pin, so that the exposed portion of the bobbin is reliably exposed from the mold, and the connection terminal protrudes from the exposed portion to the outside of the mold. Thereby, the exposed portion of the bobbin is exposed from the mold, and by eliminating the gap, it is possible to prevent the molded resin from leaking out of the mold, and it is possible to protrude the connection terminal and perform resin sealing. As a result, an electronic component can be connected to a substrate by a connection terminal, and even if the substrate is a large substrate, connection is possible, and a mold that can be manufactured without reducing production efficiency can be realized.

Effect of the Invention

[0016] <0OO0082>According to various aspects of the present invention, it is possible to provide an electronic component that can be manufactured without reducing production efficiency while preventing resin from leaking out when the bobbin is resin-sealed, and a mold for resin-sealing the electronic component.

Brief Description of the Drawings

[0017] [Figure 1] It is a perspective view showing a state in which a coil is mounted on a bobbin according to one aspect of the present invention. [Figure 2] It is a perspective view showing a part of an electronic component resin-sealed on the bobbin on which the coil shown in FIG. 1 is mounted. [Figure 3] It is a cross-sectional view for explaining a mold for resin-sealing an electronic component according to one aspect of the present invention. [Figure 4] It is a perspective view seen from the back side of the bobbin of the electronic component shown in FIG. 2. [Figure 5] It is a perspective view showing a state in which the electronic component shown in FIG. 4 is viewed from the reverse side.

Embodiment for Carrying Out the Invention

[0018] Embodiments of the present invention will be described in detail below with reference to the drawings. However, it will be readily apparent to those skilled in the art that the present invention is not limited to the following description, and that its form and details can be modified in various ways without departing from the spirit and scope of the present invention. Accordingly, the present invention shall not be construed as being limited to the descriptions of the embodiments shown below.

[0019] Figure 1 is a perspective view showing a bobbin with a coil mounted on it according to one aspect of the present invention. Figure 2 is a perspective view showing a part of an electronic component that has been resin-encapsulated on the bobbin with the coil mounted on it shown in Figure 1. Figure 3 is a cross-sectional view illustrating a mold 50 for resin-encapsulating an electronic component according to one aspect of the present invention. Note that the cross-sectional view shown in Figure 3 is drawn upside down, with the upper mold 51 of the mold 50 located at the bottom and the lower mold 53 of the mold 50 located at the top. Figure 4 is a perspective view of the bobbin of the electronic component shown in Figure 2, viewed from the back side. Figure 5 is a perspective view showing the electronic component shown in Figure 4, viewed from the opposite side.

[0020] The electronic component shown in Figure 2 has a bobbin 21 on which the coil 11 shown in Figure 1 is mounted. One end 11a of the coil 11 is connected to a connecting terminal 31 which is fixed to the bobbin 21. The other end 11b of the coil 11 is connected to a connecting terminal 32 which is also fixed to the bobbin 21. One end 11a of the coil 11 is joined to the connecting terminal 31 by heat crimping or welding, and the other end 11b of the coil 11 is joined to the connecting terminal 32 by heat crimping or welding. Parts of the bobbin 21, coil 11, and connecting terminals 31 and 32 are sealed with molded resin 41, and exposed portions 21a and 21c of the bobbin 21 are exposed from the molded resin 41 (see Figure 2). The end 31b of the connecting terminal 31 opposite to the end 31a to which the coil 11 is connected protrudes outward from the exposed portion 21a. Furthermore, the end 32b of the connecting terminal 32, opposite to the end 32a to which the other end 11b of the coil 11 is connected, protrudes outward from the exposed portion 21c (see Figure 2).

[0021] As shown in Figure 3, the bobbin 21 has a first tapered portion 21b located on the opposite side of the exposed portion 21a. The first tapered portion 21b is intended to hold the exposed portion 21a in place from the mold 50 by a second tapered portion 52a of a mold pin 52 formed on the upper mold 51 of the mold 50 when sealing with the mold resin 41. Similarly, the bobbin 21 has a third tapered portion (not shown) located on the opposite side of the exposed portion 21c. The third tapered portion is intended to hold the exposed portion 21c in place from the mold 50 by a fourth tapered portion (not shown) of a mold pin (not shown) formed on the upper mold 51 of the mold 50 when sealing with the mold resin 41. In other words, the tapered portions of the bobbin 21 are formed on the upper side of the bobbin 21 to correspond to the upper mold 51 of the mold 50.

[0022] As shown in Figure 4, the mold resin 41 has a first hole 41b formed by the mold pin 52 shown in Figure 3. A portion 41a of the first tapered portion 21b of the bobbin 21 is visible through the first hole 41b and is exposed from the mold resin 41 through the first hole 41b.

[0023] As shown in Figure 5, the mold resin 41 has a second hole 41c. The second hole 41c is formed by the fixing pin 54 shown in Figure 3. More specifically, the second hole 41c is formed by the fixing pin 54, which is positioned opposite the mold pin 52 when the second tapered portion 52a of the mold pin 52 presses the exposed portion 21a so that it is exposed from the mold 50. The fixing pin 54 is formed by sandwiching the bobbin 21 between the fixing pin 54 and the mold pin 52, which is formed in the lower mold 53 of the mold 50. The bobbin 21 can be seen through the second hole 41c and is exposed from the mold resin 41 through the second hole 41c (see Figure 5).

[0024] Similarly to the above, as shown in Figure 4, the mold resin 41 has a third hole 41d formed by a mold pin (not shown) as shown in Figure 3. A portion 41e of the third tapered portion (not shown) of the bobbin 21 is visible through the third hole 41d and is exposed from the mold resin 41 through the third hole 41d.

[0025] Similarly, as shown in Figure 5, the mold resin 41 has a fourth hole 41f. The fourth hole 41f is a hole formed by a fixing pin (not shown). More specifically, the fourth hole 41f is a hole formed by the fixing pin (not shown) when the fourth tapered portion (not shown) of the mold pin presses the exposed portion 21c to be exposed from the mold 50, and the fixing pin (not shown) formed in the lower mold 53 of the mold 50 sandwiches the bobbin 21 between the fixing pin and the mold pin. The bobbin 21 can be seen through the fourth hole 41f and is exposed from the mold resin 41 through the fourth hole 41f (see Figure 5).

[0026] Next, we will describe the mold 50 with reference to Figure 3. This is a mold 50 for sealing a bobbin 21 having a first tapered portion 21b with resin 41. This mold 50 has an upper mold 51 and a lower mold 53. The upper mold 51 has a mold pin 52 with a second tapered portion 52a, and the lower mold 53 has a fixing pin 54 at a position opposite to the mold pin 52.

[0027] The second tapered portion 52a of the mold pin 52 is intended to press against the first tapered portion 21b of the bobbin 21 so that when the bobbin 21 is sealed with resin 41, the exposed portion 21a of the bobbin 21 is exposed from the mold 50, and the connecting terminal 31 protrudes from the exposed portion 21a to the outside of the mold 50. In other words, by pressing against the first tapered portion 21b of the bobbin 21 with the second tapered portion 52a of the mold pin 52, the bobbin 21 slides outward, and the exposed portion 21a is exposed from the mold 50. The connecting terminal 31 is formed to straddle the inside and outside of the mold 50. The fixing pin 54 also clamps the bobbin 21 between the fixing pin 54 and the mold pin 52 when the second tapered portion 52a presses against the first tapered portion 21b. By sealing the bobbin 21 with resin 41 in the mold 50 in this manner, the exposed portion 21a of the bobbin 21 is exposed from the mold 50, and the connecting terminal 31 is formed to protrude from the exposed portion 21a to the outside of the mold (see Figure 2).

[0028] Similarly to the above, by sealing the bobbin 21 with resin 41 in the mold 50, the exposed portion 21ac of the bobbin 21 is exposed from the mold 50, and the connecting terminal 32 is formed to protrude from the exposed portion 21c to the outside of the mold (see Figure 2).

[0029] According to the mold 50 of this embodiment, when sealing the bobbin 21 with resin 41, as shown in Figure 3, the bobbin 21 is sandwiched between the fixing pin 54 of the lower mold 54 and the mold pin 52 of the upper mold 51, and the first tapered portion 21b of the bobbin 21 is pressed down by the second tapered portion 52a of the mold pin 52 of the upper mold 51, thereby ensuring that the exposed portion 21a of the bobbin 21 is exposed from the mold, and the connecting terminal 31 protrudes from the exposed portion 21a to the outside of the mold. This prevents the mold resin from leaking out of the mold by exposing the exposed portion 21a of the bobbin from the mold and eliminating any gaps, and allows the connecting terminal 31 to protrude and be sealed with resin. In other words, if there is even a small gap between the connecting terminals 31 and 32 and the mold 50, there is a risk of the transfer mold resin leaking out. However, by forcibly creating exposed portions 21a and 21c of the bobbin 21 around the connecting terminals 31 and 32, it is possible to reliably prevent the transfer resin from leaking. Therefore, electronic components can be connected to the circuit board via the connecting terminals 31, and even large circuit boards can be connected, resulting in a mold that can be manufactured without reducing production efficiency.

[0030] Furthermore, although the present invention is applied to two connection terminals 31 and 32 in this embodiment, it is also possible to apply the present invention to three or more connection terminals 31 and 32.

[0031] Furthermore, in the electronic component according to this embodiment, the bobbin 21 is sealed with molded resin 41, and exposed portions 21a and 21c of the bobbin 21 are provided that are exposed from the molded resin 41 as shown in Figure 2. Connection terminals 31 and 32, which are connected to the coil 11 mounted on the bobbin 21 and for connection to a substrate, protrude to the outside of the molded resin 41 from the exposed portions 21a and 21c. By exposing the exposed portion 21a in this way, when resin sealing with the mold 50, the gap is eliminated, preventing the molded resin from leaking out of the mold 50. Therefore, even if the substrate is a large substrate, it can be connected using the connection terminals 31 and 32, making it possible to realize an electronic component that can be manufactured without reducing production efficiency.

[0032] Furthermore, according to the electronic component of this embodiment, as shown in Figures 3 and 4, the first tapered portion 21b is held in place by the second tapered portion 52a of the mold pin 52 formed on the upper mold 51 of the mold when sealing with the mold resin 41, so that the exposed portion 21a is exposed from the mold. This provides an exposed portion 21a of the bobbin 21 that is exposed from the mold resin 41. In the same manner, an exposed portion 21c of the bobbin 21 that is exposed from the mold resin 41 is provided. By exposing the exposed portions 21a and 21c in this way, when sealing with resin in the mold 50, the gap is eliminated, preventing the mold resin from leaking out of the mold. Therefore, it becomes possible to connect even large substrates, and an electronic component can be manufactured without reducing production efficiency. [Explanation of Symbols]

[0033] 11 coils 11a One end of the coil 11b The other end of the coil 21 bobbins 21a, 21c Exposed part 21b First tapered section 31, 32 Connection terminals 31a, 31b Ends of connection terminals 41. Mold resin 41a Part of the first tapered section 41b First hole 41c Second hole 50 molds 51 Upper mold 52 mold pins 52a Second tapered section 53 Lower mold 54 Fixing pins

Claims

1. A bobbin with a coil installed, One end of the coil is connected to a connecting terminal fixed to the bobbin, A molded resin in which the bobbin, the coil, and a portion of the connecting terminals are sealed, It has, The bobbin has an exposed portion that is exposed from the mold resin, The aforementioned connection terminal is an electronic component characterized in that the end opposite to the end to which one end of the coil is connected protrudes outward from the exposed portion.

2. In claim 1, The bobbin has a first tapered portion located on the side opposite to the exposed portion, The first tapered portion is intended to be held in place by the second tapered portion of the mold pin formed on the upper mold of the mold when sealing with the mold resin, so that the exposed portion is exposed from the mold. The mold resin has a first hole formed by the mold pin, An electronic component characterized in that a portion of the first tapered portion of the bobbin is exposed from the molded resin through the first hole.

3. In claim 2, The mold resin has a second hole, The second hole is formed by the fixing pin, which is formed in the lower mold of the mold and positioned opposite the mold pin, when the second tapered portion of the mold pin presses the exposed portion so that it is exposed from the mold. The fixing pin then clamps the bobbin between the fixing pin and the mold pin. The electronic component is characterized in that the bobbin is exposed from the molded resin through the second hole.

4. This is a mold for sealing a bobbin having a first tapered portion with resin. The aforementioned mold has an upper mold and a lower mold. The upper mold has a mold pin with a second tapered portion formed therein. The lower mold has a fixing pin formed at a position opposite to the mold pin. The second tapered portion of the mold pin is intended to press against the first tapered portion of the bobbin so that when the bobbin is sealed with the resin, the exposed portion of the bobbin is exposed from the mold, and the connecting terminal protrudes from the exposed portion to the outside of the mold. The mold is characterized in that the fixing pin holds the bobbin between the fixing pin and the mold pin when the second tapered portion presses against the first tapered portion.

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