Tape feeder, mounting device, method for mounting connecting film, and program for mounting connecting film
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- DEXERIALS CORP
- Filing Date
- 2024-12-12
- Publication Date
- 2026-06-24
AI Technical Summary
【0011】 本発明に係るテープフィーダ、実装装置、接続フィルムの実装方法及び接続フィルムの実装プログラムは、ベースフィルムに設けられた接続フィルムの個片処理を適正に実現することができる、という効果を奏する。
Smart Images

Figure 2026103704000001_ABST
Abstract
Claims
1. The roller unit includes a roller that is in contact with the back surface of the arrangement surface of the connecting film pieces on the base film, such that the base film on which the connecting film pieces are arranged is folded back at an acute angle from a first direction of travel to a second direction of travel, and an elastic support part that elastically supports the roller in a direction that moves toward and away from the base film being fed in the first direction of travel. The roller unit is provided so as to be movable along the first direction of travel. Tape feeder.
2. The roller unit is such that, with tension applied to the base film in the second direction of travel, the roller rotates while contacting the back surface of the base film and is movable to the opposite side of the first direction of travel. The tape feeder according to claim 1.
3. The roller unit has a temperature control device that controls the temperature of a region that overlaps with a predetermined range of movement in which the roller unit moves along the first direction of travel. The tape feeder according to claim 1.
4. A tape feeder according to any one of claims 1 to 3 provided in the feeder area, A circuit board mounting section is provided in the circuit board area on which the circuit board is mounted, A transfer head is provided to be able to move back and forth between the feeder area and the circuit board area, Equipped with, The transfer head includes a pickup unit that peels and holds the individual pieces from the base film and transfers them to the circuit board, and in the feeder region, it is positioned on the opposite side of the base film from the roller and is provided to be able to move in and out of the base film, and in the circuit board region, it is provided to be able to move in and out of the circuit board to which the individual pieces are attached. Mounting device.
5. The predetermined range of movement in which the roller unit moves along the first direction of travel includes a head pickup region in which the pickup unit peels and holds the individual pieces from the base film. The mounting apparatus according to claim 4.
6. The system includes a control unit that controls the transfer head and the roller unit, The control unit is capable of positioning the transfer head in the head pickup area, moving the roller unit to the opposite side of the first direction of travel while pressing the roller towards the pickup section via the base film, thereby peeling the individual pieces from the base film and holding them in the pickup section. The mounting apparatus according to claim 5.
7. The pickup portion includes silicone rubber that constitutes the transfer and holding surface of the individual pieces. The peeling force between the transfer-holding surface and the individual piece is greater than the peeling force between the individual piece and the base film. The mounting apparatus according to claim 4.
8. The transfer assist device is provided in a region that overlaps with a predetermined movement range in which the roller unit moves along the first direction of travel, and adjusts the temperature around the transfer head to vary the peeling force between the transfer holding surface and the individual pieces. The mounting apparatus according to claim 7.
9. The pickup portion includes silicone rubber that constitutes the transfer and holding surface of the individual pieces. The peeling force between the transfer-holding surface and the individual piece is smaller than the peeling force between the individual piece and the circuit board. The mounting apparatus according to claim 4.
10. The transfer assist device is provided with a temperature adjustment around the circuit board mounting section to vary the peeling force between the transfer holding surface and the individual pieces, and between the individual pieces and the circuit board. The mounting apparatus according to claim 9.
11. The tape feeder is detachably provided in the feeder area. The mounting apparatus according to claim 4.
12. The transfer head includes a stopper member, The stopper member is provided so as to be able to contact the circuit board when the pickup portion separates from the individual piece. The mounting apparatus according to claim 4.
13. The stopper member is provided with a clearance portion to avoid mounting components that are mounted on the circuit board. The mounting apparatus according to claim 12.
14. A mounting apparatus having a tape feeder having a roller unit that is movable along the first direction of travel and includes a roller that is provided in contact with the back side of the surface on which the individual pieces of connecting film are arranged on the base film so as to fold the base film, on which a plurality of individual pieces of connecting film are arranged, at an acute angle from a first direction of travel to a second direction of travel, and an elastic support part that elastically supports the roller in a direction approaching and moving away from the base film being fed in the first direction of travel, and a transfer head that is located on the opposite side of the base film from the roller and is provided so as to be able to approach and move away from the base film and is formed to peel off and hold the individual pieces from the base film, wherein the tape feeder moves the individual pieces in the first direction of travel, thereby moving the individual pieces to a head pickup area where the pickup part peels off and holds the individual pieces from the base film, A contact step in which the pickup portion of the transfer head is brought into contact with the individual piece located in the head pickup region from the opposite side of the roller, with the base film in between; A piece holding step in which the roller unit is moved to the opposite side of the first direction of travel while pressing the roller towards the pickup part via the base film, and tension is applied to the base film in the second direction of travel, thereby peeling the individual pieces from the base film and holding them in the pickup part, A method for mounting a connecting film, comprising the following features.
15. A moving step of moving the transfer head, which holds the individual pieces, to a position corresponding to the circuit board placed on the circuit board mounting section, A piece attachment step of attaching the individual pieces held by the pickup portion of the transfer head to the circuit board, A method for mounting a connecting film according to claim 14, comprising the above.
16. The individual piece holding step includes a step of adjusting the temperature around the transfer head using a transfer assist device provided in a region that overlaps with a predetermined movement range in which the roller unit moves along the first direction of travel, and varying the peeling force between the transfer holding surface and the individual piece so that the peeling force between the transfer holding surface and the individual piece of the pickup portion, which includes silicone rubber constituting the transfer holding surface of the individual piece, is greater than the peeling force between the individual piece and the base film. A method for mounting a connecting film according to claim 14 or claim 15.
17. The individual piece mounting step includes a step of varying the peeling force between the transfer holding surface and the individual piece and the peeling force between the individual piece and the circuit board, using a transfer assist device that adjusts the temperature around the circuit board mounting section, so that the peeling force between the transfer holding surface and the individual piece of the pickup section, which includes the silicone rubber constituting the transfer holding surface of the individual piece, and the individual piece is smaller than the peeling force between the individual piece and the circuit board. A method for mounting a connecting film according to claim 15.
18. On the computer, A tape feeder having a roller unit that is movable along the first direction of travel, and which includes a roller that is in contact with the base film so as to fold the base film, on which a plurality of connecting film pieces are arranged, at an acute angle from a first direction of travel to a second direction of travel, and an elastic support part that elastically supports the roller in a direction approaching and moving away from the base film being fed in the first direction of travel, and a transfer head having a pickup part that is positioned on the opposite side of the base film from the roller and is movable towards and away from the base film, and is formed to peel off and hold the individual pieces from the base film, wherein the tape feeder moves the individual pieces in the first direction of travel, thereby moving the individual pieces to a head pickup area where the pickup part peels off and holds the individual pieces from the base film, A contact process is performed in which the pickup portion of the transfer head is brought into contact with the individual piece located in the head pickup region from the opposite side of the roller, with the base film in between. A piece holding process is performed in which the roller unit is moved to the opposite side of the first direction of travel while pressing the roller towards the pickup unit via the base film, and tension is applied to the base film in the second direction of travel, thereby peeling the individual pieces from the base film and holding them in the pickup unit. A program for implementing the connecting film that executes the following.