Equipment and systems for dynamic test management burn-in.

Abstract

The objective is to provide equipment and systems for dynamic test management burn-in. [Solution] In some embodiments, the dynamic test management burn-in device comprises a plurality of test sockets, a plurality of power converters, and a plurality of controllers. The plurality of power converters are suitable for receiving a first power supply from a power supply device and supplying a second power supply to each of the plurality of test sockets. The plurality of controllers each comprises a plurality of power detection units suitable for detecting the second power supply and control the output or on / off state of the plurality of power converters based on the detection results of the plurality of power detection units. The voltage of the first power supply is greater than the voltage of the second power supply, and the current of the first power supply is less than the current of the second power supply.

Description

Technical Field

[0001] The present invention relates to an apparatus and a system for dynamic test management burn-in, and particularly to a burn-in apparatus and a burn-in system capable of automatically adjusting a test power supply and a burn-in temperature during a chip burn-in test process.

Background Art

[0002] With the rapid development of artificial intelligence technology and other high-performance computing cluster processing technologies, the computing power and power consumption of chips have also increased rapidly, bringing great challenges and opportunities to the semiconductor semiconductor packaging and testing industry.

[0003] Furthermore, for the burn-in test, conventional hardware systems can no longer support the requirements of high-power devices under test (DUTs). On the other hand, in the circuit design of conventional test boards, it is difficult to support or supply a high wattage power supply. Taking the current chip test with a maximum thermal design power (TDP) of 700 W as an example, the test board needs to supply a current exceeding 58 amperes to each device under test for a long time. In addition, when the test system needs to supply a large current to support high-power devices under test, especially when the test board needs to test multiple high-power devices under test simultaneously, it means that thick wires or lines need to be arranged in the system, so the test system has become large-sized and the wiring has become complicated.

[0004] On the other hand, the test current requirements for high-power chips are not constant throughout the burn-in test process. For example, the initial current required to start the test is greater than the test current under stable test conditions, and when an overload condition occurs, the system must immediately reduce the test current. However, conventional burn-in systems cannot adaptively and dynamically adjust the state of the test power supply. In addition, because high-power chips become hot when operating, the demand for thermal control has presented unprecedented challenges for the test industry. [Overview of the project] [Problems that the invention aims to solve]

[0005] The present invention has been made in view of the above circumstances, and provides a dynamic test management burn-in apparatus and system that can completely solve the above problems. [Means for solving the problem]

[0006] To achieve the above objective, the present invention provides a dynamic test management burn-in device comprising a plurality of test sockets, a plurality of power converters, and a plurality of controllers. Each of the plurality of test sockets is used to mount a device under test. The plurality of power converters are electrically coupled to the plurality of test sockets and are suitable for receiving a first power supply from a power supply device and supplying a second power supply to each of the plurality of test sockets. The plurality of controllers are electrically coupled to the plurality of power converters and each comprises a plurality of power detection units suitable for detecting the second power supply. The plurality of controllers supply the second power supply to the plurality of test sockets by controlling the output or on / off state of the plurality of power converters based on the detection results of the plurality of power detection units, wherein the voltage of the first power supply is greater than the voltage of the second power supply and the current of the first power supply is less than the current of the second power supply.

[0007] To achieve the above objectives, the present invention provides a dynamic test management burn-in system comprising a power supply device, a plurality of test sockets, a plurality of power converters, and a plurality of controllers. The power supply device is suitable for supplying a first power supply. The plurality of test sockets are each used to mount a device under test. The plurality of power converters are electrically coupled to the power supply device and the plurality of test sockets, and the plurality of power converters are suitable for receiving the first power supply, supplying a second power supply to each of the plurality of test sockets, reducing the voltage of the first power supply, and increasing the current of the first power supply to generate the second power supply. The plurality of controllers are electrically coupled to the plurality of power converters and comprise a plurality of power detection units suitable for detecting the second power supply. The plurality of controllers supply the second power supply to the plurality of test sockets by controlling the output or on / off state of the plurality of power converters based on the detection results of the plurality of power detection units. [Effects of the Invention]

[0008] In short, the dynamic test management burn-in apparatus and system according to some embodiments are equipped with a power supply monitoring mechanism and a power supply protection mechanism, and in other embodiments, a burn-in temperature control mechanism may also be provided. Therefore, by adaptively adjusting the burn-in power supply and burn-in temperature, the stability of the burn-in test progress can be ensured, thereby improving the reliability and lifespan of the entire burn-in test system. [Brief explanation of the drawing]

[0009] [Figure 1A] This is a system configuration diagram of a dynamic test management burn-in system according to the first embodiment of the present invention. [Figure 1B] This is a system configuration diagram of a dynamic test management burn-in system according to a second embodiment of the present invention. [Figure 1C] This is a system configuration diagram of a dynamic test management burn-in system according to a third embodiment of the present invention. [Figure 2]This is a system configuration diagram of a dynamic test management burn-in system according to a fourth embodiment of the present invention. [Figure 3] This is a system configuration diagram of a dynamic test management burn-in system according to a fifth embodiment of the present invention. [Figure 4] This is a system configuration diagram of a dynamic test management burn-in system according to a sixth embodiment of the present invention. [Figure 5] This is a system configuration diagram of a dynamic test management burn-in system according to the seventh embodiment of the present invention. [Figure 6] This is a system configuration diagram of a dynamic test management burn-in system according to the eighth embodiment of the present invention. [Modes for carrying out the invention]

[0010] Various embodiments are provided below for detailed explanation, but these embodiments are used only as examples to illustrate the present invention and do not limit the scope of the invention. In addition, some components have been omitted from the drawings of the embodiments in order to clearly illustrate the technical features of the present invention. Furthermore, the same or similar reference numerals in all drawings indicate the same or similar components, and the drawings of the present invention are for illustrative purposes only, are not necessarily drawn to a fixed scale, and not all details are necessarily shown in the drawings.

[0011] (First embodiment) First, referring to Figure 1A, this is a system configuration diagram of a dynamic test management burn-in system 11 according to a first embodiment of the present invention. In the embodiment shown in Figure 1A, the dynamic test management burn-in device 1 mainly comprises a circuit board 10, a plurality of test sockets 2, a plurality of power converters 3, and a plurality of controllers 4, the plurality of test sockets 2, the plurality of power converters 3, and the plurality of controllers 4 are provided on the circuit board 10. In some embodiments, the circuit board 10 is a burn-in board.

[0012] Multiple test sockets 2 are connected in parallel to each other and are used to mount a Device Under Test (DUT) 9. Multiple power converters 3 are electrically coupled to the multiple test sockets 2 and are suitable for receiving a first power supply P1 from a power supply device 8 and supplying a second power supply P2 to each of the multiple test sockets 2. Multiple controllers 4 are electrically coupled to the multiple power converters 3 and each comprises multiple power detection units 421 suitable for detecting the second power supply P2. Based on the detection results of the multiple power detection units 421, the multiple controllers 4 control the output or on / off state of the multiple power converters 3 to supply the second power supply P2 to the multiple test sockets 2, where the voltage of the first power supply P1 is greater than the voltage of the second power supply P2, and the current of the first power supply P1 is less than the current of the second power supply P2.

[0013] Furthermore, the test socket 2 is a special connector used to connect the device under test 9 to the test system during the test phase, enabling comprehensive testing without permanently mounting the device under test 9 to the test circuit board. In some embodiments, the power converter 3 is a DC converter used to adjust the voltage and current of the DC power supply, such as a boost converter (to increase the voltage) and a buck converter (to decrease the voltage). In some embodiments, the power converter 3 is also called a Point of Load (POL) DC power module and is usually located near the test socket 2, thereby shortening the transmission path of the second power supply P2. Furthermore, the transmission of high currents generally results in greater losses as the transmission path lengthens, and in this embodiment, since the power converter 3 is located around the test socket 2, the transmission path of the second power supply P2 on the circuit board 10 is shorter than the transmission path of the first power supply P1, thus significantly reducing losses.

[0014] In the embodiment shown in Figure 1A, the power converter 3 converts a first power supply P1, which includes high voltage and low current, into a second power supply P2, which includes low voltage and high current. In some specific embodiments, the voltage of the first power supply P1 may be 12V and the current 2A, and the voltage of the second power supply P2 may be 1V and the current 20A. For other high-power devices under test 9, the current demand of the test power supply (second power supply P2) may reach 50A or more, so the voltage of the first power supply P1 may be 48V or more.

[0015] Furthermore, in some embodiments, the number of power converters 3 may be greater than or equal to the number of test sockets 2. In embodiments where the number of power converters 3 is greater than the number of test sockets 2, redundant power converters 3 can be provided as backups, so that if, for example, one set of power converters 3 fails, they can be immediately replaced to supply the power necessary for the test. In other embodiments, the multiple power converters 3 can be connected in parallel to each other, so that a higher current can be supplied by the current summing method, which is more suitable as a test current for high-power devices under test 9.

[0016] In the embodiment shown in Figure 1A, the plurality of controllers 4 comprises a main controller 41 and a plurality of sub-controllers 42, the main controller 41 being electrically connected to the plurality of sub-controllers 42, and the plurality of sub-controllers 42 being electrically connected to the plurality of power converters 3 and the plurality of test sockets 2. In some specific embodiments, each test socket 2 corresponds to one sub-controller 42, and the sub-controller 42 is suitable for controlling the output or on / off state of at least one power converter 3. In addition, each sub-controller 42 may include a power detection unit 421 incorporated inside the sub-controller 42, as shown in Figure 1A. In other embodiments, the power detection unit 421 may be an independent component electrically connected between the power converters 3, the sub-controllers 42 and the test sockets 2, as shown in Figure 1B.

[0017] Furthermore, as shown in FIG. 1A, in an embodiment where a power detection unit 421 is incorporated into the sub-controller 42, the power detection unit 421 can be used to detect the power input to the power converter 3, the output power of the power converter 3, and the power input to the test socket 2. In other words, in these embodiments, the power detection unit 421 can be used to detect the first power supply P1 and the second power supply P2, which includes detecting the voltage and current input to the power converter 3, the output voltage and current of the power converter 3, and the voltage and current supplied to the test socket 2.

[0018] (Second Embodiment) Referring to FIG. 1B, FIG. 1B is a system configuration diagram of a dynamic test management burn-in system according to a second embodiment of the present invention. In an embodiment where the power detection unit 421 is an independent component, the power detection unit 421 can be connected so as to span between the input end and the output end of the power converter 3. In some specific embodiments, the power detection unit 421 can also be electrically connected to the test socket 2. Thus, the independently provided power detection unit 421 can similarly be used to detect the first power supply P1 and the second power supply P2, which includes detecting the voltage and current input to the power converter 3, the output voltage and current of the power converter 3, and the voltage and current supplied to the test socket 2.

[0019] Furthermore, in embodiments where the power detection unit 421 is electrically connected to the test socket 2, the power detection unit 421 can also detect the power actually supplied to the device under test 9 through the test socket 2 and transmit a feedback power signal Pu to the subcontroller 42. The subcontroller 42 can control each power converter 3 to adjust the output second power supply P2 according to the power supply actually detected. In other words, in some embodiments, the power actually input to the device under test 9 can be detected through the power detection unit 421 to improve the overall system stability. If the power supply is overloaded or insufficient, the subcontroller 42 can dynamically adjust the output of the power converter 3, i.e., the second power supply P2.

[0020] In one embodiment, the main controller 41 may be a control computer equipped with a general-purpose processor and connected to a set of standard input / output systems. Alternatively, the main controller 41 may be implemented with specific logic circuits. In other embodiments, the main controller 41 may be a combination of specific logic circuits, general-purpose hardware, software, and firmware, which is generally suitable for controlling a test system. In some embodiments, the main controller 41 may also be connected to a remote computer system, which can receive test programs from the system and transmit test results to the system for analysis. The sub-controller 42 may be, but is not limited to, a System on a Chip (SOC), a Field Programmable Gate Array (FPGA) chip, or a High Performance Computing (HPC) chip.

[0021] The operation modes of several embodiments will be described below. When the system is operating normally, the first power supply P1 of the power supply device 8 is converted by the power converter 3, and then the voltage of the first power supply P1 is reduced and the current of the first power supply P1 is increased to generate the second power supply P2, which is supplied to the test socket 2. The second power supply P2 includes the rated voltage and rated current required for the operation of the device under test 9.

[0022] However, when an abnormal situation occurs in the system, for example, when a failure occurs in the power supply device 8, when the device under test 9 performs a high-power operation or a low-power operation different from normal operation, when the load current is too large immediately after the start of the test, or when the current of the second power supply P2 becomes overloaded or insufficient due to other emergency situations, the sub-controller 42 dynamically controls the plurality of power converters 3 based on the detection result of the power detection unit 421 (for example, when the load current becomes overloaded or insufficient), and adjusts the output (for example, increasing or decreasing the current output), so as to ensure the stability of the output second power supply P2.

[0023] In other embodiments, for example, when the output of the power converter 3 is fixed and an abnormal situation occurs in the system (for example, when the load current becomes overloaded or insufficient), the sub-controller 42 turns on or off the plurality of power converters 3 based on the detection result of the power detection unit 421 (for example, when the load current is insufficient, the idle power converter 3 can be started, or when the load current is overloaded, the redundant power converter 3 can be turned off), so as to ensure the stability of the second power supply P2 supplied to the device under test 9.

[0024] Furthermore, in this embodiment, the main controller 41 includes a storage unit 411 for storing power converter setting data 412. The power converter setting data 412 includes a power converter 3 corresponding to each test socket 2, and there may be one or more power converters 3. For example, each power converter 3 may be assigned a number, and the power converter setting data 412 will contain the number of the power converter 3 corresponding to each test socket 2. In other embodiments, the storage unit 411 may be provided in the sub-controller 42, that is, each sub-controller 42 may be provided with a storage unit 411, or the storage unit 411 may be provided in the main controller 41 or the sub-controller 42. In other words, the control information (power converter setting data 412) of the power converter 3 may be stored in at least one of the main controller 41 and the sub-controller 42.

[0025] If the aforementioned abnormal situation occurs in the system, the main controller 41 can automatically update the power converter setting data 412 based on the detection results of the multiple power detection units 421. For example, if the test current of a test socket 2 is insufficient, the main controller 41 can control other idle power converters 3 to supply power to the test socket 2. Specifically, in the power converter setting data 412, the number of the idle power converter 3 is entered into the number of the power converter 3 corresponding to the test socket 2. Similarly, if the test current of a test socket 2 becomes overloaded, the main controller 41 can control one of the multiple power converters 3 that supply power to the test socket 2 to turn off, that is, the number of the redundant power converter 3 is removed from the number of the power converter 3 corresponding to the test socket 2.

[0026] In other words, in this embodiment, the main controller 41 groups the power converters 3 corresponding to each test socket 2 and can increase or decrease the number of power converters 3 in each group according to the actual test power demand. Of course, if a power converter 3 fails, the main controller 41 can update the power converter setting data 412 in real time and assign one or more idle power converters 3 to the test socket 2.

[0027] Specifically, in some embodiments, the dynamic test management burn-in device 1 can achieve automatic dynamic power management, that is, it can automatically control the output of each power converter 3 according to the actual conditions of the test current, or adjust the number of power converters 3 corresponding to each test socket 2. In this way, the stability of the power supply input to the device under test 9 can be ensured. Furthermore, if an abnormal situation continues to occur after the dynamic power management mechanism has been activated, the main controller 41 will automatically intervene to terminate the burn-in test and stop the power supply from the power supply device 8 in real time, thereby preventing damage to the device under test 9 or the test system.

[0028] Furthermore, in the embodiment shown in Figure 1A, each power converter 3 may further include a power feedback unit 30 incorporated into the power converter 3. The power feedback unit 30 may be used to detect the power input to the power converter 3 (first power P1) and the output power of the power converter 3 (second power P2). In other words, in these embodiments, the power feedback unit 30 may be used by the subcontroller 42 to determine whether the power state of the power converter 3 is normal by detecting the voltage and current input to the power converter 3 and the voltage and current output by the power converter 3.

[0029] (Third embodiment) On the other hand, referring to Figure 1C, Figure 1C is a system configuration diagram of a dynamic test management burn-in system 11 according to a third embodiment of the present invention. In another embodiment, the power feedback unit 30 is an independent component and is connected so as to straddle the input terminal and output terminal of the power converter 3. Thus, the independently provided power feedback unit 30 can also be used to detect the voltage and current input to the power converter 3 and the voltage and current output by the power converter 3.

[0030] (Fourth embodiment) Referring to Figure 2, this is a system configuration diagram of a dynamic test management burn-in system 11 according to the fourth embodiment of the present invention. Below, the dynamic control method of burn-in temperature in the fourth embodiment will be described. In fact, the dynamic control method of burn-in temperature in the fourth embodiment can be used in conjunction with the dynamic power management method of the first embodiment, that is, it should be noted that major components such as the main controller 41 and the sub-controller 42 are shared. Although only one set of temperature control modules 5 is shown in Figure 2, in most embodiments, each test socket 2 corresponds to one set of temperature control modules 5.

[0031] In the embodiment shown in Figure 2, the sub-controller 42 includes a temperature sensing unit 422 suitable for detecting the temperature of the device under test 9 in the test socket 2, and the main controller 41 or sub-controller 42 can adjust the temperature of the device under test 9 by controlling the temperature control module 5 through the sub-controller 42 based on the detection result. The temperature sensing unit 422 may include a thermocouple, a resistance thermometer (RTD), or other contact or non-contact temperature measuring means.

[0032] In some embodiments, the temperature control module 5 is provided on the circuit board 10, and each temperature control module 5 comprises a switch 51, a heater 52, and a cooler 53, and the heater 52 and cooler 53 are mounted in close proximity to or in contact with the device under test 9 (for example, located inside the test socket 2 or on a test head (not shown)).

[0033] The heater 52 may consist of an electric heating element, a resistive heat source, or other equivalent components capable of controlling the temperature rise, and may also consist of a high-temperature fluid pipeline or chamber. The cooler 53 may be a Peltier element (thermo-electric modules) or a vapor compression cooling system (VCRS). In other embodiments, the cooler 53 may include a fan or a pipeline or chamber through which a low-temperature fluid flows.

[0034] The switch 51 is electrically connected to the sub-controller 42, and the heater 52 and cooler 53 are electrically connected to the switch 51. The main controller 41 or the sub-controller 42 controls the switch 51 based on the results of the temperature sensing unit 422 to adjust the temperature by turning the heater 52 and cooler 53 on or off. When the heater 52 is turned on, the temperature of the device under test 9 can be raised, and when the cooler 53 is turned on, the temperature can be lowered, thereby achieving automatic maintenance of the burn-in temperature of the device under test 9. In other embodiments, the switch 51 may be equipped with a power adjustment circuit suitable for controlling the output of the heater 52 and cooler 53 to achieve more precise temperature control.

[0035] In the embodiment shown in Figure 2, the main controller 41 includes a storage unit 411 that stores burn-in set temperature data 413, which includes the burn-in set temperature of each device under test 9. The main controller 41 compares the detection result of the temperature sensing unit 422 with the burn-in set temperature data 413 and controls the temperature control module 5 via the sub-controller 42 to adjust the burn-in temperature of the device under test 9. In other embodiments, the storage unit 411 may be provided in the sub-controller 42, that is, each sub-controller 42 may be provided with the storage unit 411, or the storage unit 411 may be provided in the main controller 41 or the sub-controller 42. In other words, the temperature control conditions (burn-in set temperature data 413) of each device under test 9 can be stored in at least one of the main controller 41 and the sub-controller 42.

[0036] In other words, in this embodiment, independent temperature control can be performed for each device under test 9 in each test socket 2. For example, independent temperature control can be performed for the same or different burn-in temperatures of different devices under test 9, or for the same or different burn-in temperatures of the same device under test 9. For example, if some devices under test 9 perform high-power overclocking operations, extremely high temperatures will occur, but in this case, the temperature of multiple devices under test 9 can be reduced. On the other hand, if an abnormal temperature condition continues to occur after the aforementioned dynamic burn-in temperature control mechanism has been activated, the main controller 41 will stop the burn-in test and immediately stop the power supply from the power supply device 8 to prevent damage to the device under test 9 or the test system.

[0037] (Fifth embodiment) Referring to Figure 3, this is a system configuration diagram of a dynamic test management burn-in system 11 according to the fifth embodiment of the present invention. The main difference between the fifth embodiment and the first embodiment described above is that the first power supply P1 of the fifth embodiment undergoes multi-stage conversion, making it particularly suitable for input power supplies with special specifications such as ultra-high voltage (first power supply P1) or test power supplies with special specifications such as ultra-high current (second power supply P2).

[0038] Furthermore, in the embodiment shown in Figure 3, the multiple power converters 3 comprise a main power converter 31 and a multiple sub-power converters 32. The main power converter 31 is electrically connected to the multiple sub-power converters 32 and the power supply device 8, and the multiple sub-power converters 32 are electrically coupled to the multiple test sockets 2. The main power converter 31 is suitable for receiving a first power supply P1 from the power supply device 8, performing a first-stage power conversion, generating an intermediate power supply Pi, and supplying it to each of the multiple sub-power converters 32. Furthermore, the multiple sub-power converters 32 generate a second power supply P2 after performing a second-stage power conversion on the intermediate power supply Pi, and the multiple sub-power converters 32 supply the second power supply P2 to each of the multiple test sockets 2.

[0039] Specifically, in some embodiments, the power supply device 8 supplies a high-voltage first power supply P1 to the main power converter 31, and the input power is transmitted in a high-voltage, low-current manner, so the power interface 12 of the dynamic test management burn-in device 1 can be made simpler and more compact. More specifically, a larger cross-sectional area of ​​the conductor reduces resistance and heat generation, and allows more current to flow, so high-current transmission conductors require a larger cross-sectional area. Therefore, in some embodiments, the cross-sectional area of ​​the power interface 12 for transmitting the first power supply P1 (high voltage and low current) may be smaller than the cross-sectional area of ​​the conductor for transmitting the second power supply P2 (low voltage and high current). This reduces the number and volume of power interfaces 12 (e.g., conductors or connectors), allows for sufficient power to be received without designing a large number of power interfaces 12, reduces manufacturing costs, and minimizes power loss.

[0040] Furthermore, in these embodiments, a two-stage voltage and current conversion is used. After the first power supply P1 is transmitted to the dynamic test management burn-in device 1, the main power converter 31 performs a first-stage voltage drop and current increase to generate an intermediate power supply Pi. Next, the main power converter 31 transmits the intermediate power supply Pi to each of the sub-power converters 32, and performs a second-stage voltage drop and current increase, causing each of the sub-power converters 32 to output a second power supply P2.

[0041] In these embodiments, the current of the first power supply P1 is smaller than the current of the intermediate power supply Pi, and the current of the intermediate power supply Pi is smaller than the current of the second power supply P2. Therefore, the cross-sectional area of ​​the conductors in the power interface 12 of the first power supply P1 may be smaller than the cross-sectional area of ​​the transmission conductors of the intermediate power supply Pi, and the cross-sectional area of ​​the transmission conductors of the intermediate power supply Pi may be smaller than the cross-sectional area of ​​the transmission conductors of the second power supply P2. Thus, the two-stage voltage and current conversion makes the power interface 12 for electrically connecting to external devices (such as a power supply device 8) on the circuit board 10 simpler and more compact, reducing the volume or space it occupies, which is more helpful for the assembly and maintenance of the circuit board 10.

[0042] Although the second power supply P2, which has the largest current, requires thicker transmission wires, the sub-power converter 32 is located close to the test socket 2, so the transmission path of the second power supply P2 is the shortest, thereby reducing losses due to the wires during high-current transmission. However, in some embodiments, the transmission path of the second power supply P2 may be smaller than the sum of the transmission paths of the first power supply P1 and the intermediate power supply Pi. In another embodiment, the power supply transmission paths can be arranged according to the magnitude of the current; for example, the transmission path of the second power supply P2 is larger than the transmission path of the intermediate power supply Pi, and the transmission path of the intermediate power supply Pi is larger than the transmission path of the first power supply P1.

[0043] (Sixth embodiment) Referring to Figure 4, this is a system configuration diagram of a dynamic test management burn-in system 11 according to the sixth embodiment of the present invention. The main difference between the sixth embodiment and the fifth embodiment described above is that the dynamic test management burn-in device 1 of the sixth embodiment further comprises a relay board 6. The multiple test sockets 2, the multiple sub-power converters 32 and the multiple controllers 4 are provided on the circuit board 10, and the main power converter 31 is provided on the relay board 6.

[0044] Therefore, by providing the relay board 6, not only is the flexibility of all power line arrangements improved, but because the main power converter 31 is located outside the circuit board 10, it also contributes to reducing the heat source on the circuit board 10 and improving thermal control. Furthermore, power interfaces 12 such as plug-and-play connectors can be placed on the circuit board 10 and the relay board 6 to facilitate subsequent assembly and maintenance work.

[0045] (Seventh Embodiment) Referring to Figure 5, this is a system configuration diagram of a dynamic test management burn-in system 11 according to the seventh embodiment of the present invention. In the seventh embodiment, the plurality of power converters 3 comprises a plurality of first power converters 33 and at least one second power converter 34, and the plurality of power converters 3 are electrically coupled to a plurality of test sockets 2, respectively. The first power converters 33 are suitable for receiving a first power supply P1 from a power supply device 8 and supplying a second power supply P2 to each test socket 2. The second power converters 34 receive an auxiliary power supply Ps from a power supply device 8 and supply pin power Pn to the test sockets 2.

[0046] Furthermore, in some embodiments, the device under test 9 may require power inputs of different specifications; for example, while the main pins may require a high-current input for burn-in testing, other sub-pins may only require a low-current power supply. In the seventh embodiment, the first power converter 33 can supply a high-current second power supply P2 for burn-in testing to several of the main pins, and the second power converter 34 can supply a low-current auxiliary power supply Ps to several of the sub-pins. That is, the sub-pin power supply can be performed independently and does not affect the high-current burn-in testing supplied to the device under test 9 by the first power converter 33.

[0047] (Eighth embodiment) Referring to Figure 6, this is a system configuration diagram of a dynamic test management burn-in system 11 according to the eighth embodiment of the present invention. The main difference between the eighth embodiment and the seventh embodiment is that in the eighth embodiment, the secondary pin power supply Pn is supplied by a separate auxiliary power supply device 7. Specifically, in the eighth embodiment, each test socket 2 is provided with a main power input unit 21 and a secondary power input unit 22, the main power input unit 21 being electrically coupled to a plurality of power converters 3 and suitable for receiving the second power supply P2, and the secondary power input unit 22 being electrically coupled to the auxiliary power supply device 7 and suitable for receiving the pin power supply Pn.

[0048] Overall, according to several embodiments, the input power supply of the dynamic test management burn-in device 1 uses a high-voltage, low-current power supply configuration, significantly reducing the volume and number of input power supply interfaces 12. For example, reducing the number and volume of required power lines can reduce manufacturing costs and power loss. In addition, multiple sets of parallel power converters 3 can be used to stably supply power for testing and meet the burn-in current required for the high-power device under test 9. At the same time, the dynamic test management burn-in device 1 is equipped with a power supply monitoring, protection mechanism, and burn-in temperature control mechanism to ensure stable control of the burn-in power supply and temperature.

[0049] Furthermore, in some embodiments, the power output from the point-of-load DC power module (POL) can be monitored by providing the aforementioned dynamic power management technology. If an abnormality occurs in the output power, the system can automatically compensate and adjust, quickly returning to the preset rated voltage and rated current. In further embodiments, the actual test power supplied from the test socket 2 to the device under test 9 is also monitored and similarly automatically compensated and adjusted to achieve more accurate power management.

[0050] Furthermore, in some embodiments, the aforementioned dynamic burn-in temperature control techniques can be integrated to provide a stable burn-in temperature to the device under test 9 throughout the burn-in test process. In further embodiments, independent temperature control can be provided for the actual operating conditions of each device under test 9, ensuring that each device under test 9 can be tested in an accurate and stable temperature environment.

[0051] While preferred embodiments of the present invention have been disclosed above, these are by no means limiting to the present invention. Anyone familiar with the art may make various modifications and embellishments within the spirit and scope of the present invention, and therefore the scope of protection of the present invention shall be based on the claims attached herein. [Explanation of symbols]

[0052] 10 Circuit boards 1. Dynamic Test Management Burn-in Equipment 11. Dynamic Test Management Burn-in System 12 Power Interfaces 2 test sockets 21 Main power input section 22. Sub-power input section 30 Power Feedback Unit 3 Power converters 31 Main power converter 32. Sub-power converter 33. First Power Converter 34. Second Power Converter 4. Controller 41 Main Controller 42 Subcontroller 411 Storage Units 412 Power converter configuration data 413 Burn-in setting temperature data 421 Power Detection Unit 422 Temperature detection unit 5. Temperature control module 51 Switch 52 Heater 53 Cooler 6. Intermediate board 7 Auxiliary power supply 8 Power supply device 9. Device under test P1 1st power supply P2 2nd power supply Pi intermediate power supply Ps auxiliary power supply Pn pin power supply Pu Feedback Power Signal

Claims

1. Each of the test sockets has multiple test sockets for mounting the device under test, Multiple power converters, each electrically coupled to a plurality of test sockets, receiving a first power supply from a power supply device and supplying a second power supply to each of the plurality of test sockets, Multiple controllers electrically coupled to multiple power converters, A dynamic test management burn-in apparatus comprising: a plurality of power detection units adapted to detect at least one of the first power supply and the second power supply, A dynamic test management burn-in device comprising a plurality of controllers that control the output or on / off state of a plurality of power converters based on the detection results of a plurality of power detection units to supply the second power supply to a plurality of test sockets, wherein the voltage of the first power supply is greater than the voltage of the second power supply, and the current of the first power supply is less than the current of the second power supply.

2. The dynamic test management burn-in apparatus according to claim 1, wherein the number of power converters is greater than the number of test sockets, and the power converters are connected in parallel with each other.

3. The plurality of controllers comprises a main controller and a plurality of sub-controllers, The dynamic test management burn-in apparatus according to claim 1, wherein the main controller is electrically connected to a plurality of sub-controllers, the plurality of sub-controllers are electrically connected to a plurality of power converters and a plurality of test sockets, and a plurality of power detection units are incorporated into each of the plurality of sub-controllers.

4. The dynamic test management burn-in apparatus according to claim 3, wherein at least one of the main controller and the plurality of sub-controllers includes a storage unit for storing power converter setting data, the power converter setting data includes at least one of the plurality of power converters corresponding to each of the test sockets, and the main controller updates the power converter setting data based on the detection results of the plurality of power detection units.

5. The system further comprises a plurality of temperature control modules, each electrically connected to a plurality of the aforementioned sub-controllers, The multiple subcontrollers include multiple temperature sensing units suitable for detecting the temperature of the device under test in the multiple test sockets, The dynamic test management burn-in apparatus according to claim 3, wherein the main controller controls a plurality of temperature control modules via a plurality of sub-controllers in accordance with the detection results of a plurality of temperature sensing units to adjust the temperature of the device under test.

6. The main controller and at least one of the plurality of sub-controllers include a storage unit for storing burn-in set temperature data. The dynamic test management burn-in apparatus according to claim 5, wherein the burn-in setting temperature data includes the burn-in setting temperature of the device under test in each of the test sockets, the main controller compares the detection results of a plurality of temperature sensing units with the burn-in setting temperature data, and controls a plurality of temperature control modules via a plurality of sub-controllers to adjust the temperature of the device under test.

7. Each of the temperature control modules comprises a switch, a heater, and a cooler. The dynamic test management burn-in apparatus according to claim 6, wherein the switch is electrically connected to a plurality of subcontrollers, the heater and the cooler are electrically connected to the switch, and the plurality of subcontrollers control the switch to turn the heater and the cooler on and off, thereby adjusting the temperature of the device under test to maintain it at the burn-in set temperature.

8. The plurality of controllers comprises a main controller and a plurality of sub-controllers, The dynamic test management burn-in apparatus according to claim 1, wherein the main controller is electrically connected to a plurality of sub-controllers, the plurality of sub-controllers are electrically connected to a plurality of power converters and a plurality of test sockets, and the plurality of power detection units are electrically connected to the input terminals and output terminals of the power converters and the test sockets, respectively, and are suitable for detecting the voltage and current input to the plurality of power converters, the voltage and current output from the power converters and the power supplied by the plurality of test sockets to the device under test, and for transmitting feedback power signals to the plurality of sub-controllers, respectively.

9. The multiple power converters comprise at least one main power converter and multiple sub-power converters. The dynamic test management burn-in apparatus according to claim 1, wherein at least one main power converter is electrically connected to a plurality of sub-power converters, the plurality of sub-power converters are electrically connected to a plurality of test sockets, at least one main power converter is suitable for receiving the first power from the power supply device and supplying intermediate power to each of the plurality of sub-power converters, and the plurality of sub-power converters supply the second power to each of the test sockets.

10. It further comprises a circuit board and an intermediate board, The dynamic test management burn-in apparatus according to claim 9, wherein the plurality of test sockets, the plurality of sub-power converters, and the plurality of controllers are provided on the circuit board, and at least one of the main power converters is provided on the relay board.

11. Each of the multiple power converters comprises a plurality of first power converters and at least one second power converter, each electrically coupled to a plurality of test sockets. The dynamic test management burn-in apparatus according to claim 1, wherein a plurality of the first power converters are suitable for receiving the first power from the power supply device and supplying the second power to each of the test sockets, and at least one of the second power converters is suitable for receiving auxiliary power from the power supply device and supplying pin power to each of the test sockets.

12. Each of the test sockets comprises a main power input section and a sub-power input section. The dynamic test management burn-in apparatus according to claim 1, wherein the main power input section is electrically coupled to a plurality of power converters and is suitable for receiving the second power supply, and the sub-power input section is electrically coupled to an auxiliary power supply device and is suitable for receiving pin power.

13. The dynamic test management burn-in apparatus according to claim 1, wherein each of the power converters is equipped with a power feedback unit suitable for detecting the voltage and current input to the power converter and the voltage and current output from the power converter.

14. A power supply device suitable for supplying a first power source, Each of the test sockets has multiple test sockets for mounting the device under test, Multiple power converters, electrically coupled to the power supply device and the multiple test sockets, which receive the first power supply, supply the second power supply to each of the multiple test sockets, reduce the voltage of the first power supply, and increase the current of the first power supply to generate the second power supply, Multiple controllers electrically coupled to multiple power converters, A dynamic test management burn-in system comprising: a plurality of power detection units adapted to detect at least one of the first power supply and the second power supply, A dynamic test management burn-in system comprising multiple controllers that control the output or on / off state of multiple power converters based on the detection results of multiple power detection units to supply the second power to multiple test sockets.

15. The dynamic test management burn-in system according to claim 14, wherein the number of power converters is greater than the number of test sockets, and the power converters are connected in parallel with one another.

16. The plurality of controllers comprises a main controller and a plurality of sub-controllers, The dynamic test management burn-in system according to claim 14, wherein the main controller is electrically connected to a plurality of sub-controllers, the plurality of sub-controllers are electrically connected to a plurality of power converters and a plurality of test sockets, and a plurality of power detection units are incorporated into each of the plurality of sub-controllers.

17. The main controller and at least one of the plurality of sub-controllers include a storage unit for storing power converter setting data. The dynamic test management burn-in system according to claim 16, wherein the power converter setting data includes at least one of a plurality of power converters corresponding to each of the test sockets, and the main controller updates the power converter setting data based on the detection results of a plurality of power detection units.

18. The system further comprises a plurality of temperature control modules, each electrically connected to a plurality of the aforementioned sub-controllers, The multiple subcontrollers include multiple temperature sensing units suitable for detecting the temperature of the device under test in the multiple test sockets, The dynamic test management burn-in system according to claim 16, wherein the main controller controls a plurality of temperature control modules via a plurality of sub-controllers in accordance with the detection results of a plurality of temperature sensing units to adjust the temperature of the device under test.

19. The main controller and at least one of the plurality of sub-controllers include a storage unit for storing burn-in set temperature data. The dynamic test management burn-in system according to claim 18, wherein the burn-in setting temperature data includes the burn-in setting temperature of the device under test in each of the test sockets, the main controller compares the detection results of a plurality of temperature sensing units with the burn-in setting temperature data, and controls a plurality of temperature control modules via a plurality of sub-controllers to adjust the temperature of the device under test.

20. Each of the temperature control modules comprises a switch, a heater, and a cooler. The dynamic test management burn-in system according to claim 19, wherein the switch is electrically connected to a plurality of subcontrollers, the heater and the cooler are electrically connected to the switch, and the plurality of subcontrollers control the switch to turn the heater and the cooler on and off, thereby adjusting the temperature of the device under test to maintain it at the burn-in set temperature.

21. The multiple power converters comprise at least one main power converter and multiple sub-power converters. The dynamic test management burn-in system according to claim 14, wherein at least one main power converter is electrically connected to a plurality of sub-power converters, the plurality of sub-power converters are electrically connected to a plurality of test sockets, at least one main power converter is suitable for receiving the first power from the power supply device and supplying intermediate power to each of the plurality of sub-power converters, and the plurality of sub-power converters supply the second power to each of the test sockets.

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