Silver-containing films and contact materials

JP2026103837APending Publication Date: 2026-06-24KOBE STEEL LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
KOBE STEEL LTD
Filing Date
2025-11-26
Publication Date
2026-06-24

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  • Figure 2026103837000001_ABST
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Abstract

To provide a silver-containing film that has sufficient wear resistance, is relatively inexpensive to manufacture, and has readily available raw materials. [Solution] A silver-containing film comprising a silver layer and particles in contact with the silver layer, wherein the particles are made of a non-conductive hydrocarbon polymer having a melting point of 130°C or lower, and the hydrocarbon polymer does not contain side chains in its unit molecular structure except at the ends, and does not contain elements other than carbon and hydrogen in its unit molecular structure.
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Claims

1. Silver layer and The particles in contact with the silver layer include, The aforementioned particles consist of a non-conductive hydrocarbon polymer with a melting point of 130°C or lower. The hydrocarbon polymer is a silver-containing film in which, except for the terminals, it does not contain side chains in its unit molecular structure, and the unit molecular structure does not contain any elements other than carbon and hydrogen.

2. The silver-containing film according to claim 1, wherein the hydrocarbon polymer is a polyethylene polymer.

3. The silver-containing film according to claim 1, wherein the silver layer has a silver content of 50% by mass or more and 100% by mass or less.

4. The silver-containing film according to claim 1, wherein the particle size D50 at which 50% of the cumulative volume from the finest particle side of the cumulative particle size distribution of the aforementioned particles is 100 μm or less.

5. A silver-containing film according to claim 1, satisfying formula (1). 0≦A p / (A p +A Ag )×100≦12.0 ・・・(1) In equation (1), A p A is the area of ​​the portion of the particles embedded in the silver layer in a cross-section in the thickness direction of the silver-containing film, Ag This is the area of ​​the silver layer in the cross-section in the thickness direction of the silver-containing film.

6. A conductive substrate and A contact material comprising a silver-containing film according to any one of claims 1 to 5, which covers at least a portion of the surface of the conductive substrate.