Thickness measuring instrument, thinning method, and chip manufacturing method

Abstract

The present invention provides a thickness measuring instrument, a thinning method, and a chip manufacturing method that can maintain the cleanliness of the thickness measuring instrument with a simple configuration. [Solution] The thickness measuring instrument (50) measures the thickness of the object to be measured (100). The ultrasonic unit (60) has a transmitting and receiving wavefront (61) that transmits ultrasonic waves and receives reflected ultrasonic waves. The holding part (70) holds the ultrasonic unit (60) with the transmitting and receiving wavefront (61) exposed on its lower side. The communication passage (74) is provided in the holding part (70) and connects the outer surfaces (71, 72) of the holding part (70), excluding the lower surface (73), to the lower surface (73). The medium supply unit (90) supplies a medium (93) for propagating ultrasonic waves between the transmitting and receiving wavefront (61) held in the holding part (70) and the object to be measured (100).

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