Support member, wafer holder, and method for manufacturing the support member

JP2026104268AActive Publication Date: 2026-06-25SUMITOMO ELECTRIC INDUSTRIES LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SUMITOMO ELECTRIC INDUSTRIES LTD
Filing Date
2024-12-13
Publication Date
2026-06-25

AI Technical Summary

Benefits of technology

【0007】 本開示の支持部材は、支持対象物を支持する突起部が損傷し難い。

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Abstract

To provide a support member in which the projection supporting the object to be supported is less likely to be damaged. [Solution] A support member comprising a resin sheet having a first surface and a second surface, and a plurality of metal bodies dispersed within the resin sheet in a plane parallel to the second surface, wherein the first surface has a plurality of protrusions at the locations where the plurality of metal bodies are arranged, and the second surface is flat.
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Claims

1. A resin sheet having a first surface and a second surface, The resin sheet comprises a plurality of metal bodies dispersed within a plane parallel to the second surface, The first surface has multiple protrusions at the locations where the multiple metal bodies are arranged. The second surface is a plane. Support member.

2. The support member according to claim 1, wherein the plurality of protrusions include a plurality of first protrusions arranged in a point-like manner in a plan view of the first surface.

3. Each of the plurality of first protrusions has a flat tip surface, The area of ​​the aforementioned tip surface is 0.02 mm 2 4.00 mm 2 The support member according to claim 2, which is as follows:

4. The support member according to claim 2, wherein the plurality of protrusions include second protrusions arranged linearly so as to surround all of the plurality of first protrusions.

5. The support member according to claim 4, wherein the width of the second projection is 0.2 mm or more and 1.0 mm or less.

6. The support member according to claim 4, wherein the second projection is provided with a slit that divides it at an intermediate point in its length.

7. The plurality of protrusions include a third protrusion arranged linearly along the slit, The support member according to claim 6, wherein the length of the third projection is longer than the width of the slit.

8. The support member according to claim 1, wherein the heights of the multiple protrusions are all the same.

9. Each of the plurality of metal bodies is a metal piece having two planes parallel to the second surface, The support member according to claim 8, wherein the thickness of the plurality of metal bodies is all the same.

10. The support member according to claim 9, wherein the height of each of the plurality of protrusions and the thickness of each of the plurality of metal bodies are the same.

11. The support member according to claim 10, wherein the thickness of each of the plurality of metal bodies is 30 μm or more and 200 μm or less.

12. The aforementioned resin sheet has a first resin layer and a second resin layer, The support member according to claim 1, wherein the plurality of metal bodies are arranged between the first resin layer and the second resin layer.

13. The support member according to claim 12, wherein the thickness of each of the first resin layer and the second resin layer is 20 μm or more and 200 μm or less.

14. The support member according to claim 1, wherein the resin sheet comprises one or more selected from the group consisting of polyimide resin, polyetheretherketone resin, polytetrafluoroethylene resin, and perfluoroalkoxyalkane resin.

15. The support member according to claim 1, wherein the metal body includes one or more selected from the group consisting of stainless steel, Kovar, nickel, nickel alloy, aluminum, and aluminum alloy.

16. A support member according to any one of claims 1 to 15, The system comprises a base plate on which the support member is placed, Wafer holder.

17. The process involves preparing the first resin film, the second resin film, and the metal film, A step of integrating the metal film onto the second resin film, A step of forming a plurality of metal bodies by etching the metal film on the second resin film into a predetermined shape, The process includes overlapping the second resin film and the first resin film so as to sandwich the plurality of metal bodies and then heat-pressing them, In the heat pressing step, the side of the second resin film opposite to the side overlapping the first resin film is brought into contact with a flat plate, and the side of the first resin film opposite to the side overlapping the second resin film is brought into contact with a cushioning material. A method for manufacturing a support member.