Laser processing equipment and laser welding equipment

Abstract

To reduce processing defects in laser processing. [Solution] The laser processing apparatus 1 is a laser processing apparatus 1 that processes a workpiece W into a predetermined processing shape P, and performs a first processing step in which processing is performed on a first region P1 of the processing shape P, and a second processing step in which processing is performed on a second region P2 of the processing shape that has a different shape from the first region P1, in succession, and the laser output in the first processing step and the laser output in the second processing step are different from each other.

Description

Technical Field

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[0001] The present disclosure relates to a laser processing apparatus and a laser welding apparatus.

Background Art

[0002] Laser processing is used for various purposes such as welding, cutting, and marking. Patent Document 1 discloses a method of welding a member containing copper.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In laser processing, various processing defects may occur. Examples of processing defects include the occurrence of spatter due to the scattering of molten metal during welding, and poor penetration and melting due to the inability to appropriately control the heat input amount of the laser. Although various proposals have been made in the past to prevent processing defects, there is still room for improvement.

[0005] An object of the present disclosure is to provide a laser processing apparatus and a laser welding apparatus capable of reducing processing defects.

Means for Solving the Problems

[0006] A laser processing apparatus according to an embodiment of the present disclosure is a laser processing apparatus that processes a workpiece into a predetermined processing shape, successively performing a first processing step of performing processing on a first region of the processing shape and a second processing step of performing processing on a second region of the processing shape that has a different shape from the first region, where the laser output in the first processing step is different from the laser output in the second processing step. [Effects of the Invention]

[0007] According to this disclosure, processing defects in laser processing can be reduced. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic diagram of a laser processing apparatus according to one embodiment of the present disclosure. [Figure 2] Figure 2 shows an example of a laser scanning unit. [Figure 3] Figure 3 shows an example of a machining path set on a workpiece. [Figure 4] Figure 4 is a table showing an example of setting processing conditions in one aspect of this disclosure. [Figure 5] Figure 5 is a perspective view showing an example of a workpiece in one aspect of this disclosure. [Figure 6] Figure 6 is a plan view of the workpiece as seen along the direction of arrow VI in Figure 5. [Figure 7] Figure 7 is a side view of the workpiece as seen along the direction of arrow VII in Figure 5. [Figure 8] Figure 8 is a table showing an example of setting processing conditions in one aspect of this disclosure. [Modes for carrying out the invention]

[0009] A laser processing apparatus according to one embodiment of this disclosure will be described below with reference to the drawings. For the sake of explanation, the dimensions of each component shown in the drawings may differ from the actual dimensions of each component.

[0010] Figure 1 is a schematic diagram of a laser processing apparatus 1 according to one embodiment of the present disclosure. As shown in Figure 1, the laser processing apparatus 1 includes a laser light source 20, a laser scanning unit 30, and a control device 40. The laser processing apparatus 1 performs laser processing by irradiating a workpiece W with laser light L. Examples of laser processing performed by the laser processing apparatus 1 include removal processing such as peeling, drilling, cutting, and marking, joining processing such as welding, and modification processing such as hardening. The laser processing performed by the laser processing apparatus 1 may be, for example, hairpin welding, in which two copper terminals are overlapped and their tips are welded.

[0011] The laser light source 20 can emit laser light L. The configuration of the laser light source 20 is appropriately selected according to the processing to be performed by the laser processing apparatus 1. The laser light L emitted by the laser light source 20 may be, for example, a solid-state laser, liquid laser, gas laser, fiber laser, or semiconductor laser. The laser light L may be ultraviolet light, visible light, or infrared light. The laser light L may be a pulsed laser or a continuous-wave laser (CW laser). The laser light source 20 may be configured to emit laser light L including multiple types of lasers. For example, if the workpiece W is a metal such as copper, a blue laser with a relatively high absorption rate by the workpiece W may be used, or a combination of a blue laser and an infrared laser may be used. The blue laser may be, for example, a semiconductor laser, and the infrared laser may be, for example, a fiber laser.

[0012] The laser scanning unit 30 can scan the laser beam L emitted from the laser light source 20 in any direction on the surface of the workpiece W. Figure 2 shows an example of the laser scanning unit 30. In this embodiment, the laser scanning unit 30 is a galvanometer optical system. The laser scanning unit 30 can scan the laser beam L emitted from the laser light source 20 in any direction. As shown in Figure 2, the laser scanning unit 30 has an X-axis galvanometer scanner 31, a Y-axis galvanometer scanner 32, and a focusing lens 33.

[0013] The X-axis galvanometer scanner 31 includes an X-axis galvanometer mirror 31a and an X-axis galvanometer motor 31b. The X-axis galvanometer mirror 31a is fixed to the output shaft of the X-axis galvanometer motor 31b. By driving the X-axis galvanometer motor 31b, the orientation of the X-axis galvanometer mirror 31a changes.

[0014] Also, the Y-axis galvanometer scanner 32 includes a Y-axis galvanometer mirror 32a and a Y-axis galvanometer motor 32b. The Y-axis galvanometer mirror 32a is fixed to the output shaft of the Y-axis galvanometer motor 32b. By driving the Y-axis galvanometer motor 32b, the orientation of the Y-axis galvanometer mirror 32a changes.

[0015] The laser beam L emitted from the laser light source 20 is reflected by the X-axis galvanometer mirror 31a and the Y-axis galvanometer mirror 32a, then condensed by the condenser lens 33, and guided to the workpiece W.

[0016] Returning to FIG. 1, the control device 40 controls the operations of the laser light source 20 and the laser scanning unit 30 according to the type of the workpiece W and the content of the intended processing. The control device 40 includes an input unit 41, a storage unit 42, a processing condition creation unit 43, and a processing instruction unit 44. The functions of each part of the control device 40 are realized by a processing circuit including one or more processors, and the processing circuit may further include a memory, an auxiliary storage device, an input device, an output device, etc.

[0017] In the input unit 41, various settings necessary for laser processing are input from an operator. The settings input to the input unit 41 include, for example, the type and shape of the workpiece W and the setting of the heat input amount during processing. In the storage unit 42, the various settings input to the input unit 41 are stored. The processing condition creation unit 43 creates processing conditions for controlling the operations of the laser light source 20 and the laser scanning unit 30 based on the settings stored in the storage unit 42. The processing conditions created by the processing condition creation unit 43 include settings related to processing parameters such as the irradiation position and scanning path of the laser beam L (irradiation locus), the laser scanning speed, the laser output, and the number of processing repetitions. The processing instruction unit 44 controls the laser light source 20 and the laser scanning unit 30 based on the processing conditions created by the processing condition creation unit 43 and executes the processing.

[0018] The laser processing apparatus 1 according to the present embodiment optionally includes an imaging unit 50 and a detection unit 51. Details of the imaging unit 50 and the detection unit 51 will be described later.

[0019] Hereinafter, a plurality of aspects included in the present disclosure will be described while referring to the laser processing apparatus 1 shown in FIG. 1. The descriptions of each aspect are independent of each other, and the configurations described for one aspect are not essential in other aspects unless otherwise specified. On the other hand, within a range where no technical contradiction occurs, part or all of the configuration of one aspect can be arbitrarily combined with other aspects, and the configurations obtained by such combinations are also included in the present disclosure.

[0020] (First Aspect) First, a first aspect of this disclosure will be described. In the first aspect, the type of laser processing performed by the laser processing apparatus 1 is not particularly limited and may be removal processing, joining processing, or modification processing. Figure 3 is a diagram showing an example of a processing shape set on a workpiece W in this aspect, and is a diagram showing the surface of the workpiece W as seen along the laser beam L in Figure 1. As shown in Figure 3, an oval processing shape P is set on the workpiece W. The processing shape P is an annular path composed of a straight path P1 at the top of the paper, a semicircular path P2 to the right of the paper, a straight path P3 at the bottom of the paper, and a semicircular path P4 to the left of the paper. The laser processing apparatus 1 processes the processing shape P by sequentially scanning the spot area (not shown) of the laser beam L along the path P1 to the path P4. For the sake of explanation, of the entire processing process, the process of processing along the straight path P1 is called the first processing process, and the process of processing along the semicircular path P2 is called the second processing process. In other words, the laser processing apparatus 1 performs a first processing step in which it processes a straight path P1 of the processing shape P, and a second processing step in which it processes a semicircular path P2 of the processing shape P that has a different shape from the straight path P1. The straight path P1 is an example of the first region in this disclosure, and the semicircular path P2 is an example of the second region in this disclosure.

[0021] In this embodiment, the laser processing apparatus 1 can change the laser output during processing. Specifically, the processing condition creation unit 43 creates processing conditions such that the laser output in the first processing step for processing a straight path P1 and the laser output in the second processing step for processing a semicircular path P2 are different from each other. For example, processing conditions may be set such that the laser output in the second processing step is smaller than the laser output in the first processing step. Furthermore, processing conditions may be set such that the scanning speed of the laser beam L in the second processing step is smaller than the scanning speed of the laser beam L in the first processing step.

[0022] When laser processing is performed along a path that includes both a straight and a curved path, as shown in Figure 3 (processing shape P), the scanning speed is faster along the straight path and slower along the curved path. When laser processing is performed along a processing shape that includes regions with different shapes in this way, if all regions are processed with the same laser output, the amount of heat input from the laser beam will be relatively higher in the regions where the scanning speed is slower, resulting in uneven processing. For example, if the laser processing being performed is welding, the amount of heat input will be high in the regions where the scanning speed is slower, leading to excessively high temperatures and potentially causing processing defects such as spatter.

[0023] According to the laser processing apparatus 1 of this embodiment, by setting different laser outputs in the first and second processing steps, which have different path shapes, it is possible to prevent uneven processing caused by changes in scanning speed due to differences in path shape. Therefore, processing defects can be reduced.

[0024] In this embodiment, it is preferable that one of the first region processed in the first processing step and the second region processed in the second processing step is a straight path and the other is a curved path, and that the laser output in the curved path is smaller than the laser output in the straight path. Since the scanning speed is slower in the curved path than in the straight path, processing defects can be reduced by reducing the laser output. In the above description, an example was shown where the first region is a straight path P1 and the second region is a curved semicircular path P2, but the order is not limited, and the first region may be curved and the second region may be straight.

[0025] In the above configuration, the curved path preferably includes a change of direction of 90° or more, and more preferably includes a change of direction of 180°. The semicircular path P2 is an example of a curved path that includes a change of direction of 180°. Since the scanning speed becomes particularly slow in a curved path that includes a change of direction of 90° or more, processing defects can be more effectively reduced by adjusting the laser output.

[0026] The laser processing apparatus 1 according to this embodiment may perform further processing steps in addition to the first and second processing steps. As shown in Figure 3, the processing shape P includes a linear path P1 and a semicircular path P2, as well as a linear path P3 and a semicircular path P4. The laser processing apparatus 1 may further perform processing steps for processing the linear path P3 and processing steps for processing the semicircular path P4. The laser output in the linear path P3 may be set the same as, for example, the laser output in the linear path P1, or it may be different. The laser output in the semicircular path P4 may be set the same as, for example, the laser output in the semicircular path P2, or it may be different.

[0027] The laser processing apparatus 1 in this embodiment may repeatedly perform a series of processing steps including a first processing step and a second processing step. For example, when processing an annular path such as the processing shape P shown in Figure 3, the laser beam L may be scanned along the processing shape P two or more times.

[0028] (Second aspect) Next, a second aspect of this disclosure will be described again with reference to Figures 1 and 3. In the second aspect, the laser processing apparatus 1 is a laser welding apparatus, and in the following description of this aspect, the laser processing apparatus 1 will be referred to as the laser welding apparatus 1. As shown in Figure 3, the laser welding apparatus 1 melts the workpiece W by repeatedly irradiating it with laser light L along a path indicated by a processing shape P set on the workpiece W, thereby welding the workpiece W to another workpiece not shown in Figure 3.

[0029] In this embodiment, the irradiation process of irradiating the workpiece W with laser light L from the laser welding apparatus 1 includes a first stage and a second stage. The first stage includes the process of irradiating the workpiece W with laser light L at least once along the processing shape P, starting from the beginning of irradiation with laser light L. The first stage corresponds to the initial stage of processing. The second stage is a stage that follows the first stage.

[0030] In this embodiment, the processing parameters in the first stage are different from the processing parameters in the second stage. In other words, the processing parameters are changed between the beginning of the processing and the subsequent processing. Specifically, the processing condition creation unit 43 creates processing conditions such that the processing parameters in the first stage, which corresponds to the beginning of the processing, and the processing parameters in the second stage, which follows the first stage, are different within a processing process in which the laser is repeatedly irradiated along the same path.

[0031] In this embodiment, the processing parameter that changes between the first and second stages may be at least one of the laser output of the laser light source 20 and the laser scanning speed of the laser scanning unit 30, or both. Figure 4 is a table showing an example of setting the processing conditions in this embodiment, showing the laser output and laser scanning speed for each lap from the first to the third pass. As shown in Figure 4, in the first pass, which is the first stage, the laser output in path P1 is set to 75%, and the scanning speed is set to 430 mm / s. On the other hand, in the second pass, which is the second stage, the laser output in path P1 is set to 90%, and the scanning speed is set to 500 mm / s. Thus, the laser output and laser scanning speed in the same path P1 are set to be different in the first and second stages.

[0032] In conventional laser welding, processing was performed at a constant scanning speed and constant laser power throughout the entire processing process. However, as shown in Figure 3, in processing where the laser is repeatedly irradiated along a predetermined path, spatter sometimes occurred, leading to processing defects. As a result of our investigation, we believe that one of the causes of spatter is that when a high-power laser is irradiated at a stage in the early stages of processing when a sufficiently large molten pool has not yet been formed, a cavity called a keyhole rapidly forms in the workpiece W.

[0033] According to the laser welding apparatus 1 of this embodiment, as shown in Figure 4, by making the processing parameters such as laser output and laser scanning speed in the first stage different from the processing parameters in the second stage, the rapid occurrence of keyholes in the early stages of processing can be prevented. As a result, the generation of spatter can be reduced.

[0034] As shown in Figure 4, it is preferable that the laser output in the first stage is weaker than the laser output in the second stage. Furthermore, it is preferable that the laser scanning speed in the first stage is slower than the laser scanning speed in the second stage. While it is desirable to irradiate the molten pool with a relatively strong laser output and a fast laser scanning speed in the second stage, where a sufficiently large molten pool has formed, it is necessary to prevent the rapid formation of keyholes in the early stages of processing. By making the laser output in the first stage weaker than in the second stage, or by making the laser scanning speed in the first stage slower than in the second stage, the formation of keyholes can be prevented and sputtering can be reduced.

[0035] In this embodiment, the irradiation process may include a third stage after the second stage. The laser output in the third stage may be weaker than that of the second stage, and the laser scanning speed in the third stage may be slower than that of the second stage. The third stage corresponds to, for example, the final stage of processing. By gradually reducing the laser scanning speed and laser output to end the processing, a good finish can be achieved. In this embodiment, the irradiation process may also include multiple stages between the second and third stages. The processing parameters may be configured to change according to the stage in which the processing is progressing.

[0036] In the example shown in Figure 4, the laser output and laser scanning speed of paths P3 and P4 in the first stage (first pass) are the same as those of paths P3 and P4 in the second stage (second pass). Thus, in this embodiment, the processing parameters do not need to be different throughout the entire first stage from those of the second stage; it is sufficient that the processing parameters differ from those of the second stage in at least a part of the first stage.

[0037] In the example shown in Figure 4, only the first pass is considered the first stage, but in this embodiment, the first stage may also include the step of irradiating the laser beam L two or more times along the set path.

[0038] In the example shown in Figure 4, as explained in the first embodiment, the laser output in the linear paths P1 and P3 is set to be different from the laser output in the semicircular paths P2 and P4. While adjusting the laser output according to the path shape is not essential in this embodiment, it is preferable to adjust the laser output according to the path shape from the viewpoint of reducing processing defects.

[0039] The laser light used in this embodiment may be a combination of a blue laser and an infrared laser. In this case, a configuration may be adopted in which the output of the infrared laser is adjusted while keeping the output of the blue laser constant. Even when using a combination of a blue laser and an infrared laser, better welding quality can be obtained by adjusting only the output of the infrared laser when adjusting the laser output.

[0040] (Third aspect) Next, a third aspect of the present disclosure will be described. In the third aspect, the laser processing apparatus 1 is a laser welding apparatus, and in the following description of this aspect, the laser processing apparatus 1 will be referred to as the laser welding apparatus 1. Figure 5 is a perspective view showing an example of a workpiece W to be welded by the laser welding apparatus 1 according to this aspect. As shown in Figure 5, the workpiece W in this aspect is two wires W1 and W2 arranged parallel to each other. For the sake of explanation, wire W1 will be referred to as the first wire W1, and wire W2 as the first wire W2. Both the first wire W1 and the second wire W2 are made of metal. The laser welding apparatus 1 welds ends W1a and W2a by irradiating each end W1a of the first wire W1 and W2a of the second wire W2 with laser light L to melt the ends W1a and W2a, respectively. In the example shown in Figure 5, both ends W1a and W2a are rectangular.

[0041] Figure 6 is a plan view of the first wire W1 and the second wire W2 as seen along the direction of arrow VI in Figure 5. As shown in Figure 6, the first wire W1 and the second wire W2 are not necessarily in contact, and there may be a gap between them. In this embodiment, G is defined as the distance between the end W1a of the first wire W1 and the end W2a of the second wire W2 when viewed along the longitudinal direction of the first wire W1 as shown in Figure 6. Specifically, distance G is defined as the length of the line segment connecting the midpoint W1b of the side of end W1a that points toward end W2a and the midpoint W2b of the side of end W2a that points toward end W1a. Note that, as in the example shown in Figure 6, the orientation of end W2a may be inclined relative to end W1a in a plan view, but according to the above definition, in such cases the shortest distance between end W1a and end W2a and distance G do not necessarily coincide. As will be explained in more detail later, distance G is a criterion for setting machining parameters, and by adopting the definition described above, distance G can be calculated as an indicator that appropriately shows the positional relationship between end W1a and end W2a.

[0042] Figure 7 is a side view of the first wire W1 and the second wire W2 as seen along the direction of arrow VII in Figure 5. As shown in Figure 7, the longitudinal position (Z-axis direction) of the end W1a of the first wire W1 and the longitudinal position of the end W2a of the second wire W2 do not necessarily coincide. In this embodiment, as shown in Figure 7, let D be the longitudinal distance between the end W1a of the first wire W1 and the end W2a of the second wire W2 as seen along the direction perpendicular to the longitudinal direction of the first wire W1.

[0043] Returning to Figure 1, the laser welding apparatus 1 of this embodiment further comprises an imaging unit 50 and a detection unit 51. The imaging unit 50 is capable of imaging the workpiece W to which the laser beam L is irradiated. In this embodiment, the imaging unit 50 is capable of imaging the end W1a of the first wire W1 and the end W2a of the second wire W2. The imaging unit 50 may be configured to be capable of imaging the workpiece W from two or more locations.

[0044] Images of the first wire W1 and the second wire W2 acquired by the imaging unit 50 are sent to the detection unit 51 for image processing. Based on the acquired images, the detection unit 51 detects the positions of the end W1a of the first wire W1 and the end W2a of the second wire W2. The positions of the ends W1a and W2a detected by the detection unit 51 include the three-dimensional (XYZ) coordinates of the central portion of each end, and the inclination of end W2a relative to end W1a in a plan view along the longitudinal direction, as shown in Figure 6. By detecting the positions of the ends W1a and W2a by the detection unit 51, the distance G between ends W1a and W2a when viewed along the longitudinal direction, and the distance D between ends W1a and W2a when viewed along a direction perpendicular to the longitudinal direction can be calculated. The information regarding the positions of ends W1a and W2a obtained by the processing by the detection unit 51 is sent to the processing condition creation unit 43 of the control device 40.

[0045] In the laser welding apparatus 1 of this embodiment, processing parameters during laser welding are set according to the position of the end W1a of the first wire W1 and the position of the end W2a of the second wire W1. Specifically, the processing condition creation unit 43 sets processing parameters and creates processing conditions based on the information regarding the positions of the ends W1a and W2a obtained by the detection unit 51.

[0046] As shown in the example in Figure 5, when welding two workpieces W1 and W2 by irradiating them with laser light L, the appropriate processing parameters differ depending on the relative positions of the workpieces W1 and W2. For example, if the distance G between ends W1a and W2a viewed along the longitudinal direction is large, it is necessary to melt more of the workpieces W1 and W2, and therefore more laser light L needs to be irradiated. Also, if the longitudinal positions of ends W1a and W2a are different and the distance D is large, it is necessary to irradiate one end with more laser light L in order to align the longitudinal positions of ends W1a and W2a.

[0047] According to this embodiment, by setting processing parameters according to the positions of end W1a and end W2a, laser welding can be performed with appropriate processing conditions tailored to the arrangement of each workpiece W1 and W2. This ensures that laser light is irradiated onto each workpiece W1 and W2 without excess or deficiency, reducing processing defects. Furthermore, since processing parameters are set appropriately according to the positions of workpieces W1 and W2, the pre-processing step of precisely aligning the positions of workpieces W1 and W2 is eliminated, improving productivity.

[0048] In this embodiment, the processing parameters set according to the positions of end W1a and end W2a may include at least one of the laser irradiation trajectory and the number of laser irradiation repeats for the first wire W1 and the second wire W2, respectively. By setting the laser irradiation trajectory according to the positions of end W1a and W2a, welding can be performed by appropriately irradiating the workpiece W1 and W2 with laser light L even if their positions are deviated from the expected arrangement. Furthermore, by setting the number of laser irradiation repeats according to the positions of end W1a and end W2a, the longitudinal positions of end W1a and end W2a can be aligned, or a sufficient amount of laser light can be irradiated to join end W1a and end W2a.

[0049] Figure 8 is a table showing an example of how to set the number of repeats according to the positions of ends W1a and W2a. As shown in Figure 8, in this example, the number of times laser light is irradiated to each end is determined based on distances D and G. In this example, "one laser irradiation" means irradiating the laser around the processed shape P shown in Figure 6. In the table, "the higher end" refers to the end of ends W1a and W2a whose longitudinal position is closer to the laser scanning unit 30, and "the lower end" refers to the other end. In the example shown in Figure 7, end W2 is the higher end and end W1 is the lower end.

[0050] According to the table in Figure 8, when distance D is in the range of 0 to 0.5 mm and distance G is 0, the number of repeats for each end is 2. When distance D is in the same range and distance G is greater than 0 and 2 mm or less, more melting is required to fill the gap between the wires, so the number of repeats for the higher end is set to 3. When distance G is greater than 2 mm, in order to further increase the amount of melting, the number of repeats for the higher end is set to 4 and the number of repeats for the lower end is set to 3.

[0051] Furthermore, if the distance D is greater than 0.5 mm, it is necessary to melt more of the higher end to match the height of the ends. Therefore, if the distance D is greater than 0.5 mm and the distance G is 0, the number of repeats for the higher end is set to 3 and the number of repeats for the lower end is set to 2. Also, if the distance D is within the same range and the distance G is greater than 0 and less than or equal to 2 mm, the number of repeats for the higher end is set to 4. If the distance G is greater than 2 mm, the number of repeats for the higher end is set to 5 and the number of repeats for the lower end is set to 3. By controlling the number of repeats as shown in Figure 8, it is possible to irradiate a sufficient amount of laser to join the ends W1a and W2a. Thus, in this embodiment, the number of repeats may be increased as the distance G increases. Also, the number of repeats for the higher end may be increased as the distance D increases.

[0052] In the above explanation, an example was shown in which distance G and distance D are used as criteria for setting machining parameters. However, in this embodiment, the information used in setting specific machining parameters is not particularly limited as long as it is based on the positions of end W1a and end W2a. Furthermore, the dimensions and repeat counts mentioned above are merely examples and do not limit this disclosure.

[0053] In this embodiment, the first wire W1 and the second wire W2 may be copper terminals included in a motor or the like. The laser light L used in this embodiment may be a combination of a blue laser and an infrared laser.

[0054] Although the present disclosure has been described above with reference to specific embodiments, the present disclosure is not limited to these specific examples.

[0055] This disclosure includes the following components: (1) A laser processing apparatus for processing a workpiece into a predetermined processing shape, A first processing step is performed to process a first region of the processed shape, and a second processing step is performed to process a second region of the processed shape that has a different shape from the first region, in succession. A laser processing apparatus in which the laser output in the first processing step and the laser output in the second processing step are different from each other. (2) One of the first region and the second region is a straight path, and the other is a curved path, The laser processing apparatus according to (1), wherein the laser output in the curved path is smaller than the laser output in the straight path. (3) A laser welding apparatus that welds a workpiece by an irradiation process in which a laser is repeatedly irradiated along a path set on the workpiece, The irradiation step includes a first step of irradiating with a laser at least once along the path, and a second step following the first step, A laser welding apparatus in which the processing parameters in the first stage are different from the processing parameters in the second stage. (4) The laser welding apparatus according to (3), wherein the processing parameter is at least one of the laser output and the laser scanning speed. (5) The laser welding apparatus according to (4), wherein the laser output in the first stage is weaker than the laser output in the second stage. (6) The laser welding apparatus according to (4) or (5), wherein the laser scanning speed in the first stage is slower than the laser scanning speed in the second stage. (7) A laser welding apparatus for welding the ends of a first metal wire and a second metal wire, which are arranged parallel to each other, A laser welding apparatus in which processing parameters during laser welding are set according to the position of the end of the first wire and the position of the end of the second wire. (8) The laser welding apparatus according to (7), wherein the processing parameters include at least one of the laser irradiation trajectory and the number of repeats of laser irradiation on the first wire and the second wire, respectively. (9) The laser welding apparatus according to (7) or (8), wherein the processing parameter is set according to the distance between the end of the first wire and the end of the second wire when viewed along the longitudinal direction of the first wire. (10) The laser welding apparatus according to any one of (7) to (9), wherein the processing parameter is set according to the longitudinal distance between the end of the first wire and the end of the second wire when viewed along a direction perpendicular to the longitudinal direction of the first wire. (11) An imaging unit capable of imaging the end of the first wire and the end of the second wire, A laser welding apparatus according to any one of (7) to (10), comprising: a detection unit that detects the position of the end of the first wire and the position of the end of the second wire based on an image acquired by the imaging unit. (12) The laser processing apparatus is a laser welding apparatus that welds a workpiece by an irradiation process in which a laser is repeatedly irradiated, The irradiation step includes a first step of irradiating with a laser at least once along the path, and a second step following the first step, The laser processing apparatus according to (1) or (2), wherein the processing parameters in the first stage are different from the processing parameters in the second stage. (13) The laser processing apparatus is a laser welding apparatus that welds the ends of a first metal wire and a second metal wire arranged parallel to each other, A laser processing apparatus according to any one of (1), (2), or (12), wherein processing parameters during laser welding are set according to the position of the end of the first wire and the position of the end of the second wire. (14) The laser welding apparatus welds the ends of a first metal wire and a second metal wire, which are arranged parallel to each other, A laser welding apparatus according to any one of (3) to (6), wherein processing parameters during laser welding are set according to the position of the end of the first wire and the position of the end of the second wire. [Explanation of Symbols]

[0056] 1. Laser processing equipment (laser welding equipment) 20 Laser light sources 30 Laser scanning unit 31 X-axis galvanometer scanner 31a X-axis galvanometer mirror 31b X-axis galvanometer motor 32 Y-axis galvanometer scanner 32a Y-axis galvanometer mirror 32b Y-axis galvanometer motor 33 Focusing lens 40 Control device 41 Input section 42 Storage section 43 Processing Condition Creation Section 44 Processing instruction section 50 Imaging Unit 51 Detection unit L Laser light W Workpiece P Machining shape P1 Straight path (first region) P2 Semicircular pathway (second region) P3 Straight path P4 Semicircular pathway W1 First wire material W2 Second wire rod W1a, W2a end W1b,W2b midpoint G,D distance

Claims

1. A laser processing apparatus for processing a workpiece into a predetermined shape, A first processing step is performed to process a first region of the aforementioned processed shape, and a second processing step is performed to process a second region of the aforementioned processed shape that has a different shape from the first region, in succession. A laser processing apparatus in which the laser output in the first processing step and the laser output in the second processing step are different from each other.

2. One of the first region and the second region is a straight path, and the other is a curved path. The laser processing apparatus according to claim 1, wherein the laser output in the curved path is smaller than the laser output in the straight path.

3. A laser welding apparatus that welds a workpiece by an irradiation process in which a laser is repeatedly irradiated along a path set on the workpiece, The irradiation step includes a first step of irradiating with a laser at least once along the path, and a second step following the first step, A laser welding apparatus in which the processing parameters in the first stage are different from the processing parameters in the second stage.

4. The laser welding apparatus according to claim 3, wherein the processing parameter is at least one of the laser output and the laser scanning speed.

5. The laser welding apparatus according to claim 4, wherein the laser output in the first stage is weaker than the laser output in the second stage.

6. The laser welding apparatus according to claim 4 or 5, wherein the laser scanning speed in the first stage is slower than the laser scanning speed in the second stage.

7. A laser welding apparatus for welding the ends of a first metal wire and a second metal wire, which are arranged parallel to each other, A laser welding apparatus in which processing parameters during laser welding are set according to the position of the end of the first wire and the position of the end of the second wire.

8. The laser welding apparatus according to claim 7, wherein the processing parameters include at least one of the laser irradiation trajectory and the number of repeats of laser irradiation on the first wire and the second wire, respectively.

9. The laser welding apparatus according to claim 7 or 8, wherein the processing parameter is set according to the distance between the end of the first wire and the end of the second wire when viewed along the longitudinal direction of the first wire.

10. The laser welding apparatus according to claim 7 or 8, wherein the processing parameter is set according to the longitudinal distance between the end of the first wire and the end of the second wire when viewed along a direction perpendicular to the longitudinal direction of the first wire.

11. An imaging unit capable of imaging the end of the first wire and the end of the second wire, The laser welding apparatus according to claim 7 or 8, further comprising: a detection unit that detects the position of the end of the first wire and the position of the end of the second wire based on an image acquired by the imaging unit.

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