Integrated antenna device and method for manufacturing the same

Abstract

To provide an integrated antenna device with excellent heat dissipation capabilities. [Solution] The integrated antenna device 100 includes a substrate 110, an antenna 120, a radio frequency integrated circuit 130, a plurality of metal pillars 140, an encapsulation body 150, and a thermal conductive structure 160. The antenna 120 and the radio frequency integrated circuit 130 are provided on the first surface 112 and the second surface 114 of the substrate 110, respectively, with the third surface 132 of the radio frequency integrated circuit 130 facing the second surface 114. The first end of the metal pillar 140 is provided on the second surface 114 and surrounds the radio frequency integrated circuit 130. The encapsulation body 150 is provided on the second surface 114 and encapsulates the radio frequency integrated circuit 130 and a portion of the metal pillar 140. The thermal conductive structure 160 is provided above the fourth surface 134 of the radio frequency integrated circuit 130 and thermally coupled to the radio frequency integrated circuit 130. The outer surface of the heat conduction structure 160 and the second end of the metal pillar 140 are flush and exposed from the encapsulation body 150.

Description

Technical Field

[0001] The present invention relates to an integrated antenna device and a manufacturing method thereof, and particularly to an integrated antenna device having an excellent heat dissipation effect and a manufacturing method thereof.

Background Art

[0002] In the current architecture of antenna modules, the farther the distance between the radio frequency integrated circuit and the antenna, the more serious the signal loss due to the intermediate electromagnetic path. Also, the longer the signal line between the radio frequency integrated circuit and the antenna, the more serious the near-end crosstalk (NEXT) and far-end crosstalk (FEXT). One solution to solve this problem is to integrate the radio frequency integrated circuit and the antenna. However, since the radio frequency integrated circuit and the antenna generate high-temperature heat during operation, how to enhance the heat dissipation effect is the research direction in this field.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The present invention provides an integrated antenna device having an excellent heat dissipation effect. Means for Solving the Problems

[0004] The integrated antenna device of the present invention includes a substrate, at least one antenna, a radio frequency integrated circuit, a plurality of metal pillars, an enclosure, and a thermal conduction structure. The substrate includes opposing first and second surfaces. At least one antenna is provided on the first surface. The radio frequency integrated circuit (RFIC) is provided on the second surface. The radio frequency integrated circuit includes opposing third and fourth surfaces. The third surface faces the second surface. The plurality of metal pillars each include a plurality of opposing first ends and a plurality of second ends. The plurality of first ends are provided on the second surface, and the plurality of metal pillars surround the radio frequency integrated circuit. The enclosure is provided on the second surface and encloses at least a portion of the radio frequency integrated circuit and at least a portion of each of the plurality of metal pillars. The thermal conduction structure is provided above the fourth surface and is thermally coupled to the radio frequency integrated circuit. The outer surface of the thermal conduction structure is exposed from the enclosure, and its outer surface is flush with the plurality of second ends of the plurality of metal pillars and is exposed from the enclosure.

[0005] In one embodiment of the present invention, the above-described encapsulation exposes other parts of the radio frequency integrated circuit and other parts of each of the multiple metal pillars.

[0006] In one embodiment of the present invention, the above-described encapsulation body encapsulates the entire radio frequency integrated circuit and also encapsulates the parts of the multiple metal pillars other than the multiple second ends.

[0007] In one embodiment of the present invention, the integrated antenna device described above further includes a thermal interlayer located between the thermal conduction structure and the radio frequency integrated circuit, and connecting to the thermal conduction structure and the radio frequency integrated circuit, respectively.

[0008] In one embodiment of the present invention, the thermal interlayer described above includes a conductive material.

[0009] In one embodiment of the present invention, the thickness of the thermal interlayer described above is less than 20 micrometers.

[0010] In one embodiment of the present invention, the thermal conductivity of the material of the heat-conducting structure described above is 200 W / mK or higher.

[0011] In one embodiment of the present invention, the heat conduction structure described above is a heat conduction plate.

[0012] In one embodiment of the present invention, the heat conduction structure described above includes a plurality of heat conduction pillars that are separated from each other, and the plurality of heat conduction pillars are enclosed in another encapsulation body.

[0013] The present invention provides a method for manufacturing an integrated antenna device, comprising a circuit board assembly comprising a substrate, at least one antenna, and at least one radio frequency integrated circuit, wherein the substrate comprises opposing first and second surfaces, at least one antenna is provided on the first surface, the radio frequency integrated circuit is provided on the second surface, each radio frequency integrated circuit comprises opposing third and fourth surfaces, the third surface facing the second surface, and at least one pair of metal pillars are positioned on the second surface of the substrate, each pair of metal pillars comprising a plurality of metal pillars, the plurality of metal pillars corresponding to the radio The present invention relates to a multi-band radio frequency integrated circuit, comprising: a plurality of metal pillars surrounding the frequency integrated circuit, each including a plurality of opposing first ends and a plurality of second ends, the plurality of first ends being provided on a second surface; encapsulating at least a portion of each radio frequency integrated circuit and at least a portion of each of the plurality of metal pillars by providing an encapsulation adhesive on the second surface of the substrate and curing it to form an encapsulation body; and providing at least one thermal conduction structure on at least one radio frequency integrated circuit, wherein each thermal conduction structure is provided above the fourth surface of the corresponding radio frequency integrated circuit, and each thermal conduction structure is thermally coupled to the corresponding radio frequency integrated circuit.

[0014] In one embodiment of the present invention, the at least one antenna described above includes a plurality of antennas, the at least one radio frequency integrated circuit includes a plurality of radio frequency integrated circuits, the at least one set of metal pillars includes a plurality of sets of metal pillars, and the at least one thermal conduction structure includes a plurality of thermal conduction structures. The substrate is divided into a plurality of arrayed sub-regions, and the plurality of sub-regions are separated by a plurality of pre-cut lines. The plurality of antennas, the plurality of radio frequency integrated circuits, the plurality of sets of metal pillars, and the plurality of thermal conduction structures are each arranged in a plurality of sub-regions, and the manufacturing method described above is to obtain a plurality of integrated antenna devices by cutting the encapsulation body and the circuit board assembly along a plurality of pre-cut lines, further comprising the outer surface of each thermal conduction structure of the plurality of integrated antenna devices being exposed from the corresponding encapsulation body, and the outer surface being flush with a plurality of second ends of the corresponding plurality of metal pillars.

[0015] In one embodiment of the present invention, the step of positioning each set of metal pillars described above on the second surface of a substrate further includes positioning the multiple metal pillars by covering the multiple second ends of the multiple metal pillars of each set of metal pillars with a hot melt adhesive.

[0016] In one embodiment of the present invention, after the step of curing the above-described encapsulating adhesive to form an encapsulated body, the invention further includes heating to remove the hot-melt adhesive, thereby exposing a plurality of second ends.

[0017] In one embodiment of the present invention, prior to the step of providing each of the above-described thermal conduction structures on the fourth surface of the corresponding radio frequency integrated circuit, at least one thermal interlayer is provided on at least one radio frequency integrated circuit, wherein each thermal interlayer is provided on the fourth surface of the corresponding radio frequency integrated circuit, and in the step of providing each thermal conduction structure on the fourth surface of the corresponding radio frequency integrated circuit, each thermal conduction structure is provided on the corresponding thermal interlayer to thermally couple with the corresponding radio frequency integrated circuit.

[0018] In one embodiment of the present invention, after the step of providing each of the above-described heat conduction structures on the fourth surface of the corresponding radio frequency integrated circuit, the outer surface of each heat conduction structure is exposed from the encapsulation body, and the outer surface is made flush with the multiple second ends of the corresponding multiple metal pillars.

[0019] In one embodiment of the present invention, the above-described heat conduction structure is provided on the fourth surface of the corresponding radio frequency integrated circuit, and the step of thermally coupling the heat conduction structure with the radio frequency integrated circuit is performed before the step of positioning each set of metal pillars on the second surface of the substrate.

[0020] In one embodiment of the present invention, prior to the step of providing each of the above-described thermal conduction structures on the fourth surface of the corresponding radio frequency integrated circuit, at least one thermal interlayer is provided on at least one radio frequency integrated circuit, wherein each thermal interlayer is provided on the fourth surface of the corresponding radio frequency integrated circuit, and in the step of providing each thermal conduction structure on the fourth surface of the corresponding radio frequency integrated circuit, each thermal conduction structure is provided on the corresponding thermal interlayer to thermally couple with the corresponding radio frequency integrated circuit.

[0021] In one embodiment of the present invention, in the step of curing the above-described encapsulating adhesive to form an encapsulated body, the encapsulating adhesive encloses each set of metal pillars, the corresponding radio frequency integrated circuit, and the thermal conductive structure, wherein the height to which each set of metal pillars protrudes from the second surface is greater than the height of the thermal conductive structure relative to the second surface.

[0022] In one embodiment of the present invention, after the step of curing the above-described encapsulating adhesive to form an encapsulated body, the encapsulated body is further polished until the outer surface of each heat conduction structure is exposed from the encapsulated body and the outer surface is flush with the multiple second ends of the corresponding multiple metal pillars.

[0023] The present invention provides a method for manufacturing an integrated antenna device, comprising a circuit board assembly comprising a substrate and at least one antenna, wherein the substrate comprises opposing first and second surfaces, and at least one antenna is provided on the first surface, and at least one radio frequency integrated circuit module is positioned on the second surface of the substrate, wherein each radio frequency integrated circuit module comprises a radio frequency integrated circuit and a thermal conductive structure, wherein the radio frequency integrated circuit comprises opposing third and fourth surfaces, the third surface facing the second surface, and the thermal conductive structure is provided above the fourth surface and radio frequency integrated The method includes thermally coupling with an integrated circuit, positioning at least one set of metal pillars on a second surface of a substrate, each set of metal pillars comprising a plurality of metal pillars, the plurality of metal pillars surrounding a corresponding radio frequency integrated circuit module, each of the plurality of metal pillars comprising a plurality of opposing first ends and a plurality of second ends, the plurality of first ends being provided on the second surface, encapsulating each radio frequency integrated circuit module and the plurality of metal pillars by providing an encapsulation adhesive on the second surface of the substrate and curing it to form an encapsulation body, and exposing the thermal conductive structure and the plurality of second ends of the plurality of metal pillars from the encapsulation body.

[0024] In one embodiment of the present invention, prior to the step of positioning the above-described at least one radio frequency integrated circuit module on the second surface of a substrate, a first jig having a first adhesive layer is provided, and a first guide structure is provided above the first jig, wherein the first guide structure includes a plurality of first through holes, a plurality of heat conduction pillars are inserted into the plurality of first through holes of the first guide structure, and the plurality of third ends of the plurality of heat conduction pillars are brought into contact with the first adhesive layer and fixed to the first jig, a plurality of encapsulation adhesives is provided on the first jig and cured to form another encapsulation body thereby encapsulating the plurality of heat conduction pillars, a plurality of third ends of the plurality of heat conduction pillars encapsulated in the other encapsulation body and a plurality of fourth ends opposite to the plurality of third ends are exposed, and the plurality of third ends or plurality of fourth ends exposed from the other encapsulation body are provided above the fourth surface of the radio frequency integrated circuit and thermally coupled to the radio frequency integrated circuit.

[0025] In one embodiment of the present invention, before the step of positioning at least one set of the above-described metal pillars on the second surface of the substrate, a mask fixed to the second adhesive layer is provided, and a second guide structure is provided above the mask, wherein the mask includes a plurality of second through holes, the second guide structure includes a plurality of third through holes, the plurality of third through holes are positioned with respect to the plurality of second through holes, a plurality of metal pillars are inserted into the plurality of third through holes of the second guide structure and the plurality of second through holes of the mask, and a plurality of first ends of the plurality of metal pillars are fixed to the second adhesive layer; the plurality of metal pillars are moved near a second jig having a third adhesive layer, and a plurality of second ends of the plurality of metal pillars are brought into contact with the third adhesive layer, thereby fixing the plurality of metal pillars to the second jig; and further separating the second adhesive layer from the plurality of metal pillars to expose the plurality of first ends of the plurality of metal pillars fixed to the second jig.

[0026] In one embodiment of the present invention, after the step of separating the above-described second adhesive layer from the plurality of metal pillars, a heat conduction structure of the radio frequency integrated circuit module is fixed to the second jig, and the heat conduction structure is positioned between the radio frequency integrated circuit and the second jig, wherein the radio frequency integrated circuit module is surrounded by the plurality of metal pillars, and a third surface of the radio frequency integrated circuit is flush with the plurality of first ends of the plurality of metal pillars.

[0027] In one embodiment of the present invention, after the step of providing the plurality of third ends or the plurality of fourth ends of the plurality of heat conduction structures above the fourth surface of the radio frequency integrated circuit, and before positioning the radio frequency integrated circuit module on the second surface of the substrate, the heat conduction structure of each radio frequency integrated circuit module is fixed to a third jig having a fourth adhesive layer, and the heat conduction structure is positioned between the radio frequency integrated circuit and the third jig.

[0028] In one embodiment of the present invention, the step of positioning at least one of the above-described radio frequency integrated circuit modules on the second surface of the substrate and the step of positioning at least one set of metal pillars on the second surface of the substrate are executed simultaneously.

[0029] In one embodiment of the present invention, the step of exposing the plurality of first ends of the plurality of metal pillars and the above-described heat conduction structure from the encapsulation body further includes polishing the encapsulation body until each heat conduction structure and the plurality of second ends of the corresponding plurality of metal pillars are exposed from the encapsulation body, and the exposed surfaces of each heat conduction structure and the plurality of second ends of the corresponding plurality of metal pillars are flush.

Advantages of the Invention

[0030] Based on the above, the antenna of the integrated antenna device of the present invention is provided on the first surface of the substrate, and the radio frequency integrated circuit is provided on the second surface of the substrate. Such a design can integrate the antenna and the radio frequency integrated circuit. Further, the plurality of first ends of the plurality of metal pillars are provided on the second surface of the substrate, and the plurality of metal pillars surround the radio frequency integrated circuit. The encapsulation body is provided on the second surface of the substrate, and by encapsulating at least a part of the radio frequency integrated circuit and at least a part of each of the plurality of metal pillars, the plurality of metal pillars are fixed. The heat conduction structure is provided above the fourth surface and is thermally coupled to the radio frequency integrated circuit. The outer surface of the heat conduction structure is flush with the plurality of second ends of the plurality of metal pillars, and the outer surface of the heat conduction structure is flush with the plurality of second ends of the plurality of metal pillars and is exposed from the encapsulation body. Therefore, the heat generated by the substrate and the radio frequency integrated circuit is transmitted to the outside by the plurality of metal pillars and the heat conduction structure, and an excellent heat dissipation effect can be achieved.

Brief Description of the Drawings

[0031] [Figure 1A] It is a perspective view of an integrated antenna device according to one embodiment of the present invention. [Figure 1B] It is a perspective view from a different viewpoint of FIG. 1A. [Figure 1C] It is a cross-sectional view of FIG. 1A. [Figure 2] This is a cross-sectional view of an integrated antenna device according to another embodiment of the present invention. [Figure 3] This is a flowchart of a method for manufacturing an integrated antenna device according to one embodiment of the present invention. [Figure 4A] This figure shows the manufacturing process of the integrated antenna device shown in Figure 1C. [Figure 4B] This figure shows the manufacturing process of the integrated antenna device shown in Figure 1C. [Figure 4C] This figure shows the manufacturing process of the integrated antenna device shown in Figure 1C. [Figure 4D] This figure shows the manufacturing process of the integrated antenna device shown in Figure 1C. [Figure 4E] This figure shows the manufacturing process of the integrated antenna device shown in Figure 1C. [Figure 4F] This figure shows the manufacturing process of the integrated antenna device shown in Figure 1C. [Figure 4G] This figure shows the manufacturing process of the integrated antenna device shown in Figure 1C. [Figure 5] This is a flowchart of a method for manufacturing an integrated antenna device according to another embodiment of the present invention. [Figure 6A] This diagram shows the manufacturing process of the integrated antenna device shown in Figure 2. [Figure 6B] This diagram shows the manufacturing process of the integrated antenna device shown in Figure 2. [Figure 6C] This diagram shows the manufacturing process of the integrated antenna device shown in Figure 2. [Figure 6D] This diagram shows the manufacturing process of the integrated antenna device shown in Figure 2. [Figure 6E] This diagram shows the manufacturing process of the integrated antenna device shown in Figure 2. [Figure 6F] This diagram shows the manufacturing process of the integrated antenna device shown in Figure 2. [Figure 6G] This diagram shows the manufacturing process of the integrated antenna device shown in Figure 2. [Figure 7] This is a cross-sectional view of an integrated antenna device according to another embodiment of the present invention. [Figure 8A] This figure shows the manufacturing process of the radio frequency integrated circuit module for the integrated antenna device shown in Figure 7. [Figure 8B] This figure shows the manufacturing process of the radio frequency integrated circuit module for the integrated antenna device shown in Figure 7. [Figure 8C] This figure shows the manufacturing process of the radio frequency integrated circuit module for the integrated antenna device shown in Figure 7. [Figure 8D] This figure shows the manufacturing process of the radio frequency integrated circuit module for the integrated antenna device shown in Figure 7. [Figure 8E] This figure shows the manufacturing process of the radio frequency integrated circuit module for the integrated antenna device shown in Figure 7. [Figure 8F] This figure shows the manufacturing process of the radio frequency integrated circuit module for the integrated antenna device shown in Figure 7. [Figure 8G] This figure shows the manufacturing process of the radio frequency integrated circuit module for the integrated antenna device shown in Figure 7. [Figure 8H] This figure shows the manufacturing process of the radio frequency integrated circuit module for the integrated antenna device shown in Figure 7. [Figure 8I] This figure shows the manufacturing process of the radio frequency integrated circuit module for the integrated antenna device shown in Figure 7. [Figure 9A] This figure shows the positioning process of the metal pillar of the integrated antenna device shown in Figure 7. [Figure 9B] This figure shows the positioning process of the metal pillar of the integrated antenna device shown in Figure 7. [Figure 9C] This figure shows the positioning process of the metal pillar of the integrated antenna device shown in Figure 7. [Figure 9D] This figure shows the positioning process of the metal pillar of the integrated antenna device shown in Figure 7. [Figure 9E] This figure shows the positioning process of the metal pillar of the integrated antenna device shown in Figure 7. [Figure 10A] This figure shows the manufacturing process of the integrated antenna device. [Figure 10B] This figure shows the manufacturing process of the integrated antenna device. [Figure 10C] This figure shows the manufacturing process of the integrated antenna device. [Figure 10D]This figure shows the manufacturing process of the integrated antenna device. [Figure 10E] This figure shows the manufacturing process of the integrated antenna device. [Figure 10F] This figure shows the manufacturing process of the integrated antenna device. [Figure 11] This figure shows another embodiment of Figure 10A. [Figure 12] This is a flowchart of a method for manufacturing an integrated antenna device according to another embodiment of the present invention. [Modes for carrying out the invention]

[0032] Figures 1A and 1B are perspective views of an integrated antenna device according to one embodiment of the present invention from different viewpoints. Figure 1C is a cross-sectional view of Figure 1A. It should be noted that Figure 1C is a schematic diagram of Figure 1A, and the proportional relationships between the components are slightly different; it is for illustrative purposes only.

[0033] Referring to Figures 1A to 1C, the integrated antenna device 100 of this embodiment includes a substrate 110, at least one antenna 110, at least one radio frequency integrated circuit 130, a plurality of metal pillars 140, an encasing 150, and a heat conduction structure 160.

[0034] The substrate 110 includes opposing first surface 112 and second surface 114. At least one antenna is provided on the first surface 112. In this embodiment, the number of antennas 120 is given as four, but is not limited to this. The radio frequency integrated circuit (RFIC) 130 is provided on the second surface 114. Therefore, the antennas 120 and the radio frequency integrated circuit 130 are integrated on the same substrate 110, which effectively reduces the possibility of signal loss and crosstalk.

[0035] Each of the multiple metal pillars 140 includes a plurality of opposing first ends 142 and a plurality of second ends 144. The plurality of first ends 142 are provided on the second surface 114, and the plurality of metal pillars 140 surround the radio frequency integrated circuit 130. In this embodiment, the radio frequency integrated circuit 130 and the metal pillars 140 are each connected to the second surface 114 of the substrate 110 by solder balls 119, but the method of connecting the radio frequency integrated circuit 130 and the metal pillars 140 to the second surface 114 of the substrate 110 is not limited to this. Also, the material of the metal pillars 140 is, for example, copper, but the material of the metal pillars 140 is not limited to this.

[0036] It should be noted that in this embodiment, the substrate 110 includes a radio frequency circuit (not shown), and the second surface 114 of the substrate 110 has a plurality of electrical contacts 115 electrically connected to the radio frequency circuit. Some of the plurality of electrical contacts 115 can connect the radio frequency integrated circuit 130 to the antenna 120 via the radio frequency circuit in the substrate 110. Other parts of the plurality of electrical contacts 115 can electrically connect some of the metal pillars 140 to the radio frequency integrated circuit 130. Another part of the electrical contacts 115 can connect some of the metal pillars 140 to the antenna 120.

[0037] Furthermore, as shown in Figure 1B, in this embodiment, the radio frequency integrated circuit 130 includes a beamforming IC (BFIC) 131 and a power amplifier (PA) 135, but the configuration of the radio frequency integrated circuit 130 is not limited thereto. As shown in Figure 1C, the beamforming IC 131 of the radio frequency integrated circuit 130 includes opposing third surfaces 132 and fourth surfaces 134. The third surface 132 faces the second surface 114.

[0038] The encapsulation body 150 is provided on the second surface 114 of the substrate 110 and includes at least a portion of the radio frequency integrated circuit 130 and at least a portion of each of the plurality of metal pillars 140, thereby securely fixing the radio frequency integrated circuit 130 and the metal pillars 140.

[0039] In this embodiment, the encapsulation body 150 exposes other parts of the radio frequency integrated circuit 130 and other parts of each of the multiple metal pillars 140. In this way, the heat dissipation effect can be enhanced by partially exposing the radio frequency integrated circuit 130 and the metal pillars 140. Of course, the area enclosed by the encapsulation body 150 is not limited to this.

[0040] The thermal conduction structure 160 is provided above the fourth surface 134 and is thermally coupled to the radio frequency integrated circuit 130. In this embodiment, the thermal conduction structure 160 is a thermal conduction plate, but the type of thermal conduction structure 160 is not limited thereto. In this embodiment, the integrated antenna device 100 further includes a thermal intermediate layer 170 located between the thermal conduction structure 160 and the radio frequency integrated circuit 130, which thermally couples the thermal conduction structure 160 with the radio frequency integrated circuit 130 by connecting the thermal conduction structure 160 and the radio frequency integrated circuit 130, respectively. Specifically, the thermal intermediate layer 170 is used to tightly and securely connect the beamforming IC 131 of the radio frequency integrated circuit 130 and the thermal conduction structure 160. In this way, the heat generated by the beamforming IC 131 can be suitably transferred to the thermal conduction structure 160 by the thermal intermediate layer 170.

[0041] The thermal conductivity of the material of the thermal conduction structure 160 is 200 W / mK or higher. The thermal conduction structure 160 may be a conductor or a nonconductor. If grounding is required, the thermal conduction structure 160 may be a conductor. The thermal conduction structure 160 may also be a metal, including, for example, aluminum, gold, silver, or copper, but the type of thermal conduction structure 160 is not limited to these. In one embodiment, the thermal conduction structure 160 may be a highly thermally conductive compound such as graphene, silicon carbide, or aluminum nitride, but the type of thermal conduction structure 160 is not limited to these. In addition, an insulating material is usually used as the material for the thermal interlayer 170, but in some embodiments, if the radio frequency integrated circuit 130 is required to achieve grounding requirements by the fourth surface 134, the thermal interlayer 170 may include a conductive material. The thickness of the thermal interlayer 170 is less than 20 micrometers, for example, 10 micrometers.

[0042] As shown in Figure 1C, the outer surface of the heat conduction structure 160 is flush with the multiple second ends 144 of the multiple metal pillars 140, and the outer surface of the heat conduction structure 160 and the multiple second ends 144 of the multiple metal pillars 140 are exposed from the encapsulation body 150. For this reason, the integrated antenna device 100 may be selectively provided on a heat dissipation surface (not shown). The heat generated by the antenna 120, substrate 110, and radio frequency integrated circuit 130 is transferred to the outside by the multiple metal pillars 140 and the heat conduction structure 160, achieving an excellent heat dissipation effect.

[0043] In this embodiment, the entire heat conduction structure 160 is exposed from the encapsulation body 150, increasing the contact area with air and improving heat dissipation. Of course, in one embodiment, the heat conduction structure 160 may be partially enclosed in the encapsulation body 150, and is not limited to Figure 1C.

[0044] Figure 2 is a cross-sectional view of an integrated antenna device according to another embodiment of the present invention. Referring to Figure 2, the main difference between the integrated antenna device 100a in Figure 2 and the integrated antenna device 100 in Figure 1C is that in this embodiment, the encapsulation body 150 encapsulates the entire radio frequency integrated circuit 130 and the thermal interlayer 170, and also encapsulates parts of the thermal conduction structure 160 other than the outer surface and parts of the multiple metal pillars 140 other than the multiple second ends 144. As a result, the encapsulation body 150 exposes only the outer surface of the thermal conduction structure 160 and the multiple second ends 144 of the multiple metal pillars 140.

[0045] Furthermore, multiple solder balls 119 are provided on the outer surface of the heat conduction structure 160 and on multiple second ends 144 of the multiple metal pillars 140. Naturally, in one embodiment, other forms of solder, such as solder sheets or solder paste, may be provided on the outer surface of the heat conduction structure 160, and are not limited to those shown in the figure.

[0046] Such a design allows for more stable fixing of the components of the integrated antenna device 100a, and the heat generated by the radio frequency integrated circuit 130, antenna 120, and substrate 110 is also transferred to the outside by the outer surface of the heat conduction structure 160 and the multiple second ends 144 of the multiple metal pillars 140, resulting in a good heat dissipation effect.

[0047] The manufacturing method for the integrated antenna device 100 shown in Figure 1C is described below.

[0048] Figure 3 is a flowchart of a method for manufacturing an integrated antenna device 100 according to one embodiment of the present invention. Figures 4A to 4G illustrate the manufacturing process of the integrated antenna device shown in Figure 1C. It should be noted that Figures 4A to 4G merely illustrate the example of manufacturing two sets of integrated antenna devices 100, but the flowchart in Figure 3 can be used to manufacture a larger number of integrated antenna devices 100 or a single integrated antenna device 100, and is not limited to the figures.

[0049] First, referring to Figures 3 and 4A, the manufacturing method 200 of the integrated antenna device of this embodiment includes the following steps. First, a circuit board assembly is provided as shown in step 210 of Figure 3. The circuit board assembly includes a substrate 110, at least one antenna 120, and at least one radio frequency integrated circuit 130. The substrate 110 includes opposing first surfaces 112 and second surfaces 114. At least one antenna 120 is provided on the first surface 112. The radio frequency integrated circuit 130 is provided on the second surface 114. Each radio frequency integrated circuit 130 includes opposing third surfaces 132 and fourth surfaces 134. The third surface 132 faces the second surface 114.

[0050] In this embodiment, the substrate 110 is divided into a plurality of arrayed sub-regions 116, and the plurality of sub-regions 116 are separated by a plurality of pre-cut lines 118. The substrate 110 in Figure 4A is shown as an example with two sub-regions 116. At least one radio frequency integrated circuit 130 includes a plurality of radio frequency integrated circuits 130, and Figure 4A shows two as an example, but is not limited to these. At least one antenna 120 includes a plurality of antennas 120. The plurality of antennas 120 and the two radio frequency integrated circuits 130 are each arranged in two sub-regions 116.

[0051] Next, as shown in step 220 of Figure 3 and in Figure 4B, at least one set of metal pillars 140 are positioned on the second surface 114 of the substrate 110. Each set of metal pillars includes a plurality of metal pillars 140. The plurality of metal pillars 140 surround the corresponding radio frequency integrated circuit 130. Each of the plurality of metal pillars 140 includes a plurality of opposing first ends 142 and second ends 144. The plurality of first ends 142 are provided on the second surface 114.

[0052] In this embodiment, at least one set of metal pillars 140 includes sets of multiple metal pillars 140, such as two sets arranged in two sub-regions 116, and each of the two sets of metal pillars 140 surrounds two radio frequency integrated circuits 130.

[0053] It should be noted that the multiple metal pillars 140 are arranged in an array, and in order to ensure that the multiple metal pillars 140 are well positioned on the electrical contacts on the second surface 114 of the substrate 110, the step of positioning each set of metal pillars 140 on the second surface 114 of the substrate 110 further includes positioning the multiple metal pillars 140 by coating the multiple second ends 144 of each set of metal pillars 140 with a hot melt adhesive 180. In one embodiment, the melting point of the hot melt adhesive 180 is less than 85 degrees Celsius.

[0054] In other words, before the multiple metal pillars 140 are placed on the second surface 114 of the substrate 110, the multiple metal pillars 140 may be already arranged, and the multiple second ends 144 may be fixed in relative positions by a hot-melt adhesive 180. Subsequently, the multiple metal pillars 140 fixed in relative positions by the hot-melt adhesive 180 are positioned on the second surface 114 of the substrate 110.

[0055] Then, as shown in step 230 of Figure 3 and in Figure 4C, the encapsulation adhesive is applied to the second surface 114 of the substrate 110 and heated in an oven at 120°C for 20 minutes, with a relative humidity of 60% or less. Alternatively, it is heated in an oven at 130°C for 30 minutes, with a relative humidity of 60% or less. Alternatively, it is heated at 80°C for 60 minutes, with a relative humidity of 60% or less. By curing the encapsulation adhesive to form an encapsulation body 150, at least a portion of each radio frequency integrated circuit 130 and at least a portion of each of the multiple metal pillars 140 can be encapsulated.

[0056] In this embodiment, the encapsulation body 150 encloses a portion of each radio frequency integrated circuit 130 and a portion of each of the multiple metal pillars 140, while leaving the other portions of each radio frequency integrated circuit 130 and the other portions of each of the multiple metal pillars 140 exposed. The encapsulation body 150 does not contain a hot melt adhesive 180.

[0057] Next, as shown in Figure 4D, after the step of curing the encapsulating adhesive to form an encapsulated body 150, the process further includes heating to remove the hot-melt adhesive 180, thereby exposing the multiple second ends 144 of the multiple metal pillars 140.

[0058] Then, as shown in Figure 4E, at least one thermal interlayer 170 is provided on at least one radio frequency integrated circuit 130. Each thermal interlayer 170 is provided on the fourth surface 134 of the corresponding radio frequency integrated circuit 130. In this embodiment, there are two thermal interlayers 170, corresponding to the number of radio frequency integrated circuits 130.

[0059] As shown in step 240 of Figure 3 and in Figure 4F, at least one thermal conduction structure 160 is provided on at least one radio frequency integrated circuit 130. Each thermal conduction structure 160 is provided above the fourth surface 134 of the corresponding radio frequency integrated circuit 130, and each thermal conduction structure 160 is thermally coupled to the corresponding radio frequency integrated circuit 130. Specifically, in this embodiment, at least one thermal conduction structure 160 includes a plurality of thermal conduction structures 160, for example, two. Each thermal conduction structure 160 is provided on the corresponding thermal interlayer 170, thereby being thermally coupled to the corresponding radio frequency integrated circuit 130.

[0060] Finally, as shown in Figure 4G, multiple integrated antenna devices 100 are obtained by cutting the encapsulation body 150 and the circuit board assembly along the pre-cut line 118. The outer surface of each heat conduction structure 160 of the multiple integrated antenna devices 100 is exposed from the corresponding encapsulation body 150. In this embodiment, the thickness of the heat conduction structure 160 may be selected such that the outer surface of each heat conduction structure 160 is flush with the multiple second ends 144 of the corresponding multiple metal pillars 140.

[0061] The integrated antenna device 100 can be manufactured using the method described above. The heat generated by this integrated antenna device 100 is transferred to the outside by the multiple metal pillars 140 and the heat conduction structure 160, thereby achieving excellent heat dissipation.

[0062] The manufacturing method for the integrated antenna device 100a shown in Figure 2 is described below.

[0063] Figure 5 is a flowchart of a method for manufacturing an integrated antenna device according to another embodiment of the present invention. Figures 6A to 6G show the manufacturing process of the integrated antenna device of Figure 2. Similarly, although Figures 6A to 6G merely illustrate the example of manufacturing two sets of integrated antenna devices 100a, the flowchart in Figure 5 can be used to manufacture a larger number of integrated antenna devices 100a or a single integrated antenna device 100a, and is not limited to the figure.

[0064] The manufacturing method 200a for an integrated antenna device includes the following steps. First, referring to Figures 5 and 6A, first, a circuit board assembly is provided as in step 210 of Figure 5. The circuit board assembly includes a substrate 110, at least one antenna 120, and at least one radio frequency integrated circuit 130. The substrate 110 includes opposing first surfaces 112 and second surfaces 114. At least one antenna 120 is provided on the first surface 112. The radio frequency integrated circuit 130 is provided on the second surface 114. Each radio frequency integrated circuit 130 includes opposing third surfaces 132 and fourth surfaces 134. The third surface 132 faces the second surface 114.

[0065] In this embodiment, the substrate 110 is divided into a plurality of arrayed sub-regions 116, and the plurality of sub-regions 116 are separated by a plurality of pre-cut lines 118. The substrate 110 in Figure 6A is illustrated with two sub-regions 116 as an example, but is not limited thereto. The at least one radio frequency integrated circuit 130 includes a plurality of radio frequency integrated circuits 130, and Figure 6A is illustrated with two as an example, but is not limited thereto. The at least one antenna 120 includes a plurality of antennas 120. The plurality of antennas 120 and the two radio frequency integrated circuits 130 are arranged in two sub-regions 116, respectively.

[0066] Next, as shown in Figure 6B, at least one thermal interlayer 170 is provided on at least one radio frequency integrated circuit 130. Each thermal interlayer 170 is provided on the fourth surface 134 of the corresponding radio frequency integrated circuit 130. In this embodiment, there are two thermal interlayers 170, corresponding to the number of radio frequency integrated circuits 130.

[0067] Then, as shown in step 240 of Figure 5 and in Figure 6C, at least one thermal conduction structure 160 is provided on at least one radio frequency integrated circuit 130. Each thermal conduction structure 160 is provided above the fourth surface 134 of the corresponding radio frequency integrated circuit 130, and each thermal conduction structure 160 is thermally coupled to the corresponding radio frequency integrated circuit 130. Specifically, in this embodiment, at least one thermal conduction structure 160 includes a plurality of thermal conduction structures 160, for example, two. Each thermal conduction structure 160 is provided on the corresponding thermal intermediate layer 170, thereby being thermally coupled to the corresponding radio frequency integrated circuit 130.

[0068] Next, as shown in step 220 of Figure 5 and in Figure 6D, at least one set of metal pillars 140 are positioned on the second surface 114 of the substrate 110. Each set of metal pillars includes a plurality of metal pillars 140. The plurality of metal pillars 140 surround the corresponding radio frequency integrated circuit 130. Each of the plurality of metal pillars 140 includes a plurality of opposing first ends 142 and second ends 144. The plurality of first ends 142 are provided on the second surface 114.

[0069] In this embodiment, at least one set of metal pillars 140 includes sets of multiple metal pillars 140, such as two sets arranged in two sub-regions 116, and each set of metal pillars 140 surrounds two radio frequency integrated circuits 130, two thermal interlayers 170, and two thermal conductive structures 160.

[0070] As shown in Figure 6D, after this step is completed, the height to which each set of metal pillars 140 protrudes from the second surface 114 is greater than the height of the heat conduction structure 160 relative to the second surface 114. In other words, the multiple second ends 144 of the multiple metal pillars 140 are higher than the outer surface of the heat conduction structure 160.

[0071] Then, as shown in step 230 of Figure 5 and in Figure 6E, an encapsulation adhesive is applied to the second surface 114 of the substrate 110 and cured to form an encapsulation body 150, thereby encapsulating at least a portion of each radio frequency integrated circuit 130 and at least a portion of each of the multiple metal pillars 140.

[0072] In this embodiment, after this step is completed, the encapsulation body 150 encapsulates each radio frequency integrated circuit 130, each thermal interlayer 170, each thermal conduction structure 160, and each of the multiple metal pillars 140, while exposing only the multiple second ends 144 of the multiple metal pillars 140. In other embodiments, the encapsulation body 150 may cover the multiple second ends 144 of the multiple metal pillars 140.

[0073] Next, as shown in Figure 6F, the encapsulation body 150 is polished until the outer surface of each heat conduction structure 160 is exposed from the encapsulation body 150 and the outer surface of the heat conduction structure 160 is flush with the multiple second ends 144 of the corresponding multiple metal pillars 140. Then, multiple solder balls 119 are provided on the outer surface of the heat conduction structure 160 and the multiple second ends 144 of the multiple metal pillars 140. Of course, in one embodiment, other forms of solder, such as solder sheets or solder paste, may be provided on the outer surface of the heat conduction structure 160, and are not limited to those shown in the figure.

[0074] Finally, as shown in Figure 6G, multiple integrated antenna devices 100a are obtained by cutting the encapsulation body 150 and the circuit board assembly along multiple pre-cut lines 118. The outer surface of each heat conduction structure 160 of the multiple integrated antenna devices 100a is exposed from the corresponding encapsulation body 150, and the outer surface is flush with the multiple second ends 144 of the corresponding multiple metal pillars 140.

[0075] The integrated antenna device 100a can be manufactured using the method described above. The heat generated by this integrated antenna device 100a is transferred to the outside by the multiple metal pillars 140 and the heat conduction structure 160, achieving an excellent heat dissipation effect.

[0076] Figure 7 is a cross-sectional view of an integrated antenna device according to another embodiment of the present invention. Referring to Figure 7, the main difference between the integrated antenna device 100b in Figure 7 and the integrated antenna device 100a in Figure 2 lies in the configuration of the heat conduction structures 160, 160b. In this embodiment, the heat conduction structure 160b includes a plurality of heat conduction pillars 162 that are separated from each other. The plurality of heat conduction pillars 162 are sealed and fixed in a encapsulation body 152.

[0077] Similarly, the heat generated by the integrated antenna device 100b in Figure 7 is transferred to the outside by the multiple metal pillars 140 and the multiple heat conduction pillars 162 of the heat conduction structure 160b, thereby achieving an excellent heat dissipation effect.

[0078] Next, we will introduce the manufacturing process of the integrated antenna device 100b shown in Figure 7. First, we will introduce the manufacturing process of the radio frequency integrated circuit 189 of the integrated antenna device 100b shown in Figure 7.

[0079] Figures 8A to 8I show the manufacturing process of the radio frequency integrated circuit module of the integrated antenna device shown in Figure 7. First, referring to Figure 8A, a first jig 185 having a first adhesive layer 184 is provided, and a first guide structure 186 is provided above the first jig 185. The first guide structure 186 has a plurality of first through holes 187.

[0080] Next, referring to Figure 8B, the multiple heat conduction pillars 162 are inserted into the multiple first through holes 187 of the first guide structure 186, and the multiple ends of the multiple heat conduction pillars 162 are brought into contact with the first adhesive layer 184 and fixed to the first jig 185. Then, as shown in Figure 8C, the first guide structure 186 is removed.

[0081] Next, referring to Figure 8D, the first jig 185 is placed inside the mold 188 together with the first adhesive layer 184 and the multiple heat conductive pillars 162. As shown in Figure 8E, the encapsulating adhesive is injected into the mold 188 and cured to form an encapsulation body 152, thereby encapsulating the multiple heat conductive pillars 162. Then, as shown in Figure 8F, the first jig 185, the first adhesive layer 184, and the multiple heat conductive pillars 162, which are encapsulated in the encapsulation body 152, are removed from the mold 188. In other words, in the stages shown in Figures 8D to 8F, the encapsulating adhesive is provided on the first jig 185 and cured to form an encapsulation body 152, thereby encapsulating the multiple heat conductive pillars 162.

[0082] Next, referring to Figure 8G, both ends of each of the multiple heat-conducting pillars 162 enclosed in the encapsulation body 152 are exposed. In this embodiment, this step is performed by polishing or the like to remove the first jig 185, the first adhesive layer 184, and a portion of the encapsulation body 152.

[0083] Then, referring to Figure 8H, a radio frequency integrated circuit 130 is provided. In this embodiment, a thermal intermediate layer 170 is provided on the fourth surface 134 of the radio frequency integrated circuit 130.

[0084] Referring to Figure 8I, one end of each of the multiple heat conductive pillars 162 exposed from the encapsulation body 152 is positioned above the fourth surface 134 of the radio frequency integrated circuit 130 and thermally coupled to the radio frequency integrated circuit 130. In this embodiment, the multiple ends of the multiple heat conductive pillars 162 exposed from the encapsulation body 152 are connected to the thermal interlayer 170, thereby thermally coupling to the radio frequency integrated circuit 130. In one embodiment, the encapsulation body 152 may be made of a material whose coefficient of thermal expansion is close to that of the radio frequency integrated circuit 130 in order to disperse thermal stress and make the thermal interlayer 170 less prone to cracking.

[0085] The positioning process for the metal pillar 140 of the integrated antenna device 100b in Figure 7 is described below. Figures 9A to 9E show the positioning process for the metal pillar of the integrated antenna device in Figure 7. First, referring to Figure 9A, a mask 191 is provided fixed on the second adhesive layer 190, and a second guide structure 193 is provided above the mask 191. The mask 191 includes a plurality of second through holes 192. The second guide structure 193 includes a plurality of third through holes 194. The plurality of third through holes 194 are positioned in the plurality of second through holes 192.

[0086] Next, referring to Figure 9B, the multiple metal pillars 140 are inserted into the multiple third through holes 194 of the second guide structure 193 and the second through hole 192 of the mask 191, and the multiple first ends 142 of the multiple metal pillars 140 are fixed to the second adhesive layer 190. Then, referring to Figure 9C, the second guide structure 193 is removed.

[0087] Next, referring to Figure 9D, the structure in Figure 9C is reversed, and the multiple metal pillars 140 are moved to the vicinity of the second jig 195 having the third adhesive layer 196, and the multiple second ends 144 of the multiple metal pillars 140 are brought into contact with the third adhesive layer 196, thereby fixing the multiple metal pillars 140 to the second jig 195.

[0088] Referring to Figure 9E, the second adhesive layer 190 is separated from the multiple metal pillars 140, exposing the multiple first ends 142 of the multiple metal pillars 140 fixed to the second jig 195. The second adhesive layer 190 and the mask 191 are then removed.

[0089] Next, we will introduce the manufacturing process of the integrated antenna device 100b shown in Figure 7.

[0090] Figures 10A to 10F show the manufacturing process of the integrated antenna device shown in Figure 7. Figure 11 shows another embodiment of Figure 10A. Figure 12 is a flowchart of the manufacturing method of the integrated antenna device according to another embodiment of the present invention.

[0091] First, referring simultaneously to Figures 10A, 10B, and 12, the manufacturing method 300 of the integrated antenna device of this embodiment includes the following steps. First, in step 310, a circuit board assembly is provided. The circuit board assembly includes a substrate 110 and at least one antenna 120. The substrate 110 includes opposing first surfaces 112 and second surfaces 114. At least one antenna 120 is provided on the first surface 112. In this embodiment, the number of antennas 120 is given as an example of two, but the number of antennas 120 is not limited to this.

[0092] Next, in step 320, at least one radio frequency integrated circuit module 189 is positioned on the second surface 114 of the substrate 110. Each radio frequency integrated circuit module 189 includes a radio frequency integrated circuit 130 and a thermal conduction structure 160b. The radio frequency integrated circuit 130 includes opposing third surface 132 and fourth surface 134. The third surface 132 faces the second surface 114. The thermal conduction structure 160b is provided above the fourth surface 134 and is thermally coupled to the radio frequency integrated circuit 130. In this embodiment, the number of radio frequency integrated circuit modules 189 is given as an example of two, but the number of radio frequency integrated circuit modules 189 is not limited to this.

[0093] In step 330, at least one set of metal pillars 140 is positioned on the second surface 114 of the substrate 110. In this embodiment, the number of metal pillars 140 is in multiple sets, surrounding the outside of the radio frequency integrated circuit module 189. Each set of metal pillars 140 includes multiple metal pillars 140. The multiple metal pillars 140 surround the corresponding radio frequency integrated circuit module 189. Each set of metal pillars 140 includes a plurality of opposing first ends 142 and a plurality of second ends 144. The plurality of first ends 142 are provided on the second surface 114, facing the second surface 114.

[0094] It should be noted that, in this embodiment, before performing steps 320 and 330, the thermal conduction structure 160b of the radio frequency integrated circuit module 189 is first fixed to the third adhesive layer 196 on the second jig 195, positioning the thermal conduction structure 160b between the radio frequency integrated circuit 130 and the second jig 195. As shown in Figure 10A, the radio frequency integrated circuit module 189 is surrounded by a plurality of metal pillars 140, and the third surface 132 of the radio frequency integrated circuit 130 is flush with the plurality of first ends 142 of the plurality of metal pillars 140. Subsequently, a plurality of solder balls 119 may be provided on the third surface 132 of the radio frequency integrated circuit 130 and the first ends 142 of the plurality of metal pillars 140.

[0095] Next, the steps of positioning at least one radio frequency integrated circuit module 189 on the second surface 114 of the substrate 110 (step 320) and positioning at least one set of metal pillars 140 on the second surface 114 of the substrate 110 (step 330) may be performed simultaneously, thereby reducing the number of steps. Multiple solder balls 119 on the third surface 132 of the radio frequency integrated circuit 130 and multiple solder balls 119 on the multiple first ends 142 of the multiple metal pillars 140 are connected to multiple electrical contacts 115 on the second surface 114 of the substrate 110.

[0096] It should be noted that in another embodiment, the thermal conduction structure 160b of the radio frequency integrated circuit module 189 is not fixed to the second jig 195, but may be independently positioned on the structure of the second jig 195. Referring to Figure 11, the main difference between Figure 11 and Figure 10A is that the thermal conduction structure 160b of each radio frequency integrated circuit module 189 is fixed to a third jig 197 having a fourth adhesive layer 198, the thermal conduction structure 160b is positioned between the radio frequency integrated circuit 130 and the third jig 197, and the third jig 197 is separated from the second jig 195, providing greater flexibility in positioning.

[0097] In the embodiment shown in Figure 11, since the third jig 197 is separated from the second jig 195, step 320 may be performed before step 330, step 320 may be performed after step 330, or step 320 and step 330 may be performed simultaneously.

[0098] Next, returning to Figures 10C and 12, step 340 is performed, and the encapsulation adhesive is applied to the second surface 114 of the substrate 110 and cured to form an encapsulation body 150, thereby encapsulating each radio frequency integrated circuit module 189 and the multiple metal pillars 140. In this embodiment, the encapsulation body 150 is formed in the space between the second surface 114 of the substrate 110 and the third adhesive layer 196, and encapsulates each radio frequency integrated circuit module 189 and the multiple metal pillars 140.

[0099] Then, referring to Figures 10D and 12, in step 350, the heat conduction structure 160b and the multiple second ends 144 of the multiple metal pillars 140 are exposed from the encapsulation body 150. In step 350, the multiple heat conduction pillars 162 of the heat conduction structure 160b and the multiple second ends 144 of the corresponding multiple metal pillars 140 are exposed from the encapsulation body 150, and the second jig 195 and the third adhesive layer 196 may be removed by polishing the encapsulation body 150 until the exposed surface of the multiple heat conduction pillars 162 of each heat conduction structure 160b and the multiple second ends 144 of the corresponding multiple metal pillars 140 are flush, thereby exposing the multiple heat conduction pillars 162 of the heat conduction structure 160b and the multiple second ends 144 of the multiple metal pillars 140, but the removal method is not limited to this. Next, multiple solder balls 119 are provided on multiple ends of multiple heat conduction pillars 162 of the heat conduction structure 160b and on multiple second ends 144 of multiple metal pillars 140.

[0100] Finally, referring to Figures 10E and 10F, multiple integrated antenna devices 100b are obtained by cutting the encapsulation body 150 and the circuit board assembly along multiple pre-cut lines 118. The integrated antenna devices 100b can be manufactured by the method described above. The heat generated by these integrated antenna devices 100b is transferred to the outside by multiple metal pillars 140 and a heat conduction structure 160b, achieving an excellent heat dissipation effect.

[0101] In summary, the antenna of the integrated antenna device of the present invention is provided on the first surface of the substrate, and the radio frequency integrated circuit is provided on the second surface of the substrate. Such a design allows for the integration of the antenna and the radio frequency integrated circuit. Furthermore, the multiple first ends of the multiple metal pillars are provided on the second surface of the substrate, and the multiple metal pillars surround the radio frequency integrated circuit. The multiple metal pillars are fixed by being provided on the second surface of the substrate and enclosing at least a portion of the radio frequency integrated circuit and at least a portion of each of the multiple metal pillars. The thermal conduction structure is provided above the fourth surface and is thermally coupled to the radio frequency integrated circuit. The outer surface of the thermal conduction structure is flush with the multiple second ends of the multiple metal pillars, and the outer surface of the thermal conduction structure is exposed from the enclosure, flush with the multiple second ends of the multiple metal pillars. As a result, the heat generated by the substrate and the radio frequency integrated circuit is transferred to the outside by the multiple metal pillars and the thermal conduction structure, achieving an excellent heat dissipation effect. [Industrial applicability]

[0102] This invention relates to an integrated antenna device having excellent heat dissipation effects and a method for manufacturing the same. [Explanation of Symbols]

[0103] 100, 100a, 100b: Integrated antenna equipment 110: Circuit board 112: 1st surface 114:Second surface 115: Electrical contacts 116: Sub-region 118: Pre-cut line 119: Solder ball 120: Antenna 130: Radio frequency integrated circuit 131: Beamforming IC 132:Third surface 134: 4th surface 135: Power amplifier 140: Metal pillar 142: 1st end 144: 2nd end 150, 152: Inclusions 160, 160b: Thermal Conduction Structure 162: Heat Conduction Pillar 170: Thermal Intermediate Layer 180: Hot melt adhesive 184: 1st adhesive layer 185: First jig 186: First guide structure 187: First through hole 188: Mold 189: Radio frequency integrated circuit module 190:Second adhesive layer 191: Mask 192: Second through hole 193: Second guide structure 194: Third through hole 195: Second jig 196:Third adhesive layer 197: Third jig 198: 4th adhesive layer 200, 200a, 300: Method for manufacturing an integrated antenna device 210-240, 310-350: Steps

Claims

1. A substrate including opposing first and second surfaces, The first surface is provided with at least one antenna, A radio frequency integrated circuit (RFIC) is provided on the second surface and includes opposing third and fourth surfaces, the third surface facing the second surface, A plurality of metal pillars, each including a plurality of opposing first and second ends, the first ends of which are provided on the second surface and surrounding the radio frequency integrated circuit, A encapsulating body provided on the second surface, which encapsulates at least a portion of the radio frequency integrated circuit and at least a portion of each of the plurality of metal pillars, A thermal conductive structure is provided above the fourth surface and is thermally coupled to the radio frequency integrated circuit. Includes, The outer surface of the heat conduction structure is flush with the plurality of second ends of the plurality of metal pillars, and the outer surface and the plurality of second ends are exposed from the encapsulating body. Integrated antenna system.

2. The encapsulated body exposes the other parts of the radio frequency integrated circuit and the other parts of each of the plurality of metal pillars. The integrated antenna device according to claim 1.

3. The encapsulation body encloses the entire radio frequency integrated circuit and also encloses the portions of the plurality of metal pillars other than the plurality of second ends. The integrated antenna device according to claim 1.

4. A thermal interlayer located between the thermal conduction structure and the radio frequency integrated circuit, connecting the thermal conduction structure and the radio frequency integrated circuit, respectively. This also includes, The integrated antenna device according to claim 1.

5. The thermal intermediate layer includes a conductive material. The integrated antenna device according to claim 4.

6. The thickness of the aforementioned thermal interlayer is less than 20 micrometers. The integrated antenna device according to claim 4.

7. The thermal conductivity of the material of the aforementioned heat-conducting structure is 200 W / m-K or higher. The integrated antenna device according to claim 1.

8. The aforementioned heat conduction structure is a heat conduction plate. The integrated antenna device according to claim 1.

9. The heat conduction structure includes a plurality of heat conduction pillars separated from each other, and the plurality of heat conduction pillars are enclosed in another enclosure. The integrated antenna device according to claim 1.

10. To provide a circuit board assembly, the circuit board assembly comprising a substrate, at least one antenna, and at least one radio frequency integrated circuit, wherein the substrate comprises opposing first and second surfaces, the at least one antenna is provided on the first surface, the radio frequency integrated circuit is provided on the second surface, and each radio frequency integrated circuit comprises opposing third and fourth surfaces, the third surface facing the second surface. Positioning at least one set of metal pillars on the second surface of the substrate, wherein each set of metal pillars comprises a plurality of metal pillars, the plurality of metal pillars surrounding the corresponding radio frequency integrated circuit, the plurality of metal pillars each comprising a plurality of opposing first ends and a plurality of second ends, the plurality of first ends being provided on the second surface, The encapsulation adhesive is applied to the second surface of the substrate and cured to form an encapsulated body, thereby encapsulating at least a portion of each of the radio frequency integrated circuits and at least a portion of each of the plurality of metal pillars. The present invention provides at least one thermal conduction structure on the at least one radio frequency integrated circuit, wherein each thermal conduction structure is located above the fourth surface of the corresponding radio frequency integrated circuit, and each thermal conduction structure is thermally coupled to the corresponding radio frequency integrated circuit. including, A method for manufacturing an integrated antenna device.

11. The at least one antenna includes a plurality of antennas, the at least one radio frequency integrated circuit includes a plurality of radio frequency integrated circuits, the at least one set of metal pillars includes a plurality of sets of metal pillars, the at least one heat conduction structure includes a plurality of heat conduction structures, the substrate is divided into a plurality of arrayed sub-regions, the plurality of sub-regions are separated by a plurality of pre-cut lines, the plurality of antennas, the plurality of radio frequency integrated circuits, the plurality of sets of metal pillars, and the plurality of heat conduction structures are each arranged separately in the plurality of sub-regions, and The aforementioned manufacturing method is Multiple integrated antenna devices are obtained by cutting the encapsulated body and the circuit board assembly along the multiple pre-cut lines, wherein the outer surface of the heat conduction structure of each of the multiple integrated antenna devices is exposed from the corresponding encapsulated body, and the outer surface is flush with the multiple second ends of the corresponding multiple metal pillars. This also includes, A method for manufacturing an integrated antenna device according to claim 10.

12. In the step of positioning each set of metal pillars on the second surface of the substrate, The method further includes positioning the plurality of metal pillars by covering the plurality of second ends of the plurality of metal pillars in each set of metal pillars with a hot-melt adhesive. This also includes, A method for manufacturing an integrated antenna device according to claim 10.

13. After the step of curing the encapsulating adhesive to form the encapsulated body, By heating and removing the hot-melt adhesive, the plurality of second ends are exposed. Includes A method for manufacturing an integrated antenna device according to claim 12.

14. Before the step of providing each of the heat conduction structures on the fourth surface of the corresponding radio frequency integrated circuit, Providing at least one thermal interlayer on the at least one radio frequency integrated circuit, wherein each of the thermal interlayers is provided on the corresponding fourth surface of the radio frequency integrated circuit. It further includes, and In the step of providing each of the heat conduction structures on the fourth surface of the corresponding radio frequency integrated circuit, each of the heat conduction structures is provided on the corresponding thermal intermediate layer to thermally couple with the corresponding radio frequency integrated circuit. A method for manufacturing an integrated antenna device according to claim 13.

15. After the step of providing each of the heat conduction structures on the fourth surface of the corresponding radio frequency integrated circuit, the outer surface of each of the heat conduction structures is exposed from the encapsulation body, and the outer surface is made flush with the plurality of second ends of the corresponding plurality of metal pillars. A method for manufacturing an integrated antenna device according to claim 14.

16. The step of providing each of the heat conduction structures on the fourth surface of the corresponding radio frequency integrated circuit and thermally coupling the heat conduction structures with the radio frequency integrated circuit is performed before the step of positioning each set of metal pillars on the second surface of the substrate. A method for manufacturing an integrated antenna device according to claim 10.

17. Before the step of providing each of the heat conduction structures on the fourth surface of the corresponding radio frequency integrated circuit, Providing at least one thermal interlayer on the at least one radio frequency integrated circuit, wherein each of the thermal interlayers is provided on the corresponding fourth surface of the radio frequency integrated circuit. It further includes, and In the step of providing each of the heat conduction structures on the fourth surface of the corresponding radio frequency integrated circuit, each of the heat conduction structures is provided on the corresponding thermal intermediate layer to thermally couple with the corresponding radio frequency integrated circuit. A method for manufacturing an integrated antenna device according to claim 16.

18. In the step of curing the encapsulating adhesive to form the encapsulated body, the encapsulating adhesive encloses each set of metal pillars, the corresponding radio frequency integrated circuit, and the heat conduction structure, and the height to which each set of metal pillars protrudes from the second surface is greater than the height of the heat conduction structure relative to the second surface. A method for manufacturing an integrated antenna device according to claim 17.

19. After the step of curing the encapsulating adhesive to form the encapsulated body, The encapsulation body is polished until the outer surface of each of the heat conduction structures is exposed from the encapsulation body and the outer surface is flush with the plurality of second ends of the corresponding plurality of metal pillars. This also includes, A method for manufacturing an integrated antenna device according to claim 18.

20. To provide a circuit board assembly, wherein the circuit board assembly includes a substrate and at least one antenna, the substrate includes opposing first and second surfaces, and the at least one antenna is provided on the first surface. Positioning at least one radio frequency integrated circuit module on the second surface of the substrate, wherein each radio frequency integrated circuit module includes a radio frequency integrated circuit and a thermal conduction structure, the radio frequency integrated circuit includes opposing third and fourth surfaces, the third surface facing the second surface, and the thermal conduction structure is provided above the fourth surface and is thermally coupled to the radio frequency integrated circuit. Positioning at least one set of metal pillars on the second surface of the substrate, wherein each set of metal pillars comprises a plurality of metal pillars, the plurality of metal pillars surrounding the corresponding radio frequency integrated circuit module, the plurality of metal pillars each comprising a plurality of opposing first ends and a plurality of second ends, the plurality of first ends being provided on the second surface, The encapsulation adhesive is applied to the second surface of the substrate and cured to form an encapsulated body, thereby encapsulating each of the radio frequency integrated circuit modules and the plurality of metal pillars. The heat conduction structure and the plurality of second ends of the plurality of metal pillars are exposed from the encapsulation body. including, A method for manufacturing an integrated antenna device.

21. Before the step of positioning the at least one radio frequency integrated circuit module on the second surface of the substrate, A first jig having a first adhesive layer is provided, and a first guide structure is provided above the first jig, wherein the first guide structure includes a plurality of first through holes. Multiple heat-conducting pillars are inserted into the multiple first through-holes of the first guide structure, and the multiple third ends of the multiple heat-conducting pillars are brought into contact with the first adhesive layer and fixed to the first jig. Another sealing adhesive is applied to the first jig and cured to form another sealing body, thereby sealing the plurality of heat conductive pillars. To expose the plurality of third ends of the plurality of heat conductive pillars enclosed in the other enclosed body, and the plurality of fourth ends opposite to the plurality of third ends, The plurality of third ends or the plurality of fourth ends exposed from the other encapsulation body are provided above the fourth surface of the radio frequency integrated circuit and are thermally coupled to the radio frequency integrated circuit. This also includes, A method for manufacturing an integrated antenna device according to claim 20.

22. Before the step of positioning the set of at least one metal pillars on the second surface of the substrate, A mask is provided that is fixed to a second adhesive layer, and a second guide structure is provided above the mask, wherein the mask includes a plurality of second through holes, the second guide structure includes a plurality of third through holes, and the plurality of third through holes are positioned within the plurality of second through holes. The plurality of metal pillars are inserted into the plurality of third through holes of the second guide structure and the plurality of second through holes of the mask, and the plurality of first ends of the plurality of metal pillars are fixed to the second adhesive layer. The plurality of metal pillars are moved to the vicinity of the second jig having the third adhesive layer, and the plurality of second ends of the plurality of metal pillars are brought into contact with the third adhesive layer, thereby fixing the plurality of metal pillars to the second jig. The second adhesive layer is separated from the plurality of metal pillars, exposing the plurality of first ends of the plurality of metal pillars fixed to the second jig. This also includes, A method for manufacturing an integrated antenna device according to claim 20.

23. After the step of separating the second adhesive layer from the plurality of metal pillars, The heat conduction structure of the radio frequency integrated circuit module is fixed to the second jig, and the heat conduction structure is positioned between the radio frequency integrated circuit and the second jig, wherein the radio frequency integrated circuit module is surrounded by the plurality of metal pillars, and the third surface of the radio frequency integrated circuit is flush with the plurality of first ends of the plurality of metal pillars. This also includes, A method for manufacturing an integrated antenna device according to claim 22.

24. After the step of providing the plurality of third ends or the plurality of fourth ends of the plurality of heat conduction pillars above the fourth surface of the radio frequency integrated circuit, and before positioning the radio frequency integrated circuit module on the second surface of the substrate, The heat conduction structure of each radio frequency integrated circuit module is fixed to a third jig having a fourth adhesive layer, and the heat conduction structure is positioned between the radio frequency integrated circuit and the third jig. This also includes, A method for manufacturing an integrated antenna device according to claim 21.

25. The steps of positioning the at least one radio frequency integrated circuit module on the second surface of the substrate and positioning the at least one set of metal pillars on the second surface of the substrate are performed simultaneously. A method for manufacturing an integrated antenna device according to claim 20.

26. The step of exposing the heat conduction structure and the plurality of first ends of the plurality of metal pillars from the encapsulation body is, The encapsulation body is polished until each of the heat conduction structures and the corresponding multiple second ends of the multiple metal pillars are exposed from the encapsulation body, and the exposed surface of each of the heat conduction structures and the corresponding multiple second ends of the multiple metal pillars are flush with the surface. This also includes, A method for manufacturing an integrated antenna device according to claim 20.

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