Induction heating system for reducing biocarryover and method for controlling the induction heating system

Abstract

An induction heating system for reducing biocarryover and a method for controlling the induction heating system are disclosed herein. [Solution] An example system includes an induction heater with a tank circuit. The example system includes a controller 226 that drives the tank circuit to selectively vibrate at the resonant frequency of the tank circuit in order to induction heat a workpiece 214 located in close proximity to the tank circuit.

Description

Technical Field

[0001] This invention claims priority to U.S. Provisional Patent Application No. 62 / 438,250, filed on December 22, 2016. U.S. Application No. 62 / 438,250 is hereby incorporated by reference in its entirety.

[0002] This disclosure generally relates to medical diagnostic instruments, and more particularly, to induction heating systems for reducing bioburden and methods of controlling induction heating systems.

Background Art

[0003] Suction and dispensing devices, such as pipette probes, are used with automated medical diagnostic instruments to suction and / or dispense fluids such as biological samples (e.g., serum, urine) and / or reagents as part of a diagnostic test procedure. Suction and dispensing devices can be reused to reduce waste and operating costs. However, reusing suction and dispensing devices increases the potential for carrying over bioburden and / or contaminants into subsequent tests.

Brief Description of the Drawings

[0004] [Figure 1] Schematic diagram of electromagnetic induction. [Figure 2] Block diagram of an example system for inductively heating a workpiece constructed in accordance with the teachings disclosed herein. [Figure 3] Block diagram of an example induction heater station of the example system of FIG. 2. [Figure 4] Schematic diagram of an example circuit that can be used with the example induction heater station of FIG. 3. [Figure 5] Diagram illustrating an example temperature profile for inductively heating a workpiece using the example system of FIG. 2. [Figure 6]This is a perspective view of an example induction heating coil that can be used with the system shown in Figure 2. [Figure 7] Figure 2 shows a perspective view of an example electromagnetic induction shield and an example heatsink for use in connection with the example system. [Figure 8] This is a top view of the first example of a cleaning cup for use in connection with the system shown in Figure 2. [Figure 9] This is a cross-sectional view of the first washing cup, taken along line 1-1 in Figure 8. [Figure 10] This is a flowchart illustrating an example method for causing a tank circuit to resonate at its natural frequency, which may be used to implement the examples disclosed herein. [Figure 11] This is a flowchart illustrating an example method for induction heating a workpiece, which may be used to implement the examples disclosed herein. [Figure 12] This is a diagram of an example processor platform for use with the examples disclosed herein. [Modes for carrying out the invention]

[0005] The diagrams are not to scale. Rather, layer thicknesses may be enlarged within the diagrams to highlight multiple layers and areas. Wherever possible, the same reference numbers are used throughout the diagrams and accompanying textual descriptions to refer to the same or similar parts.

[0006] Automated medical diagnostic instruments, such as clinical chemistry analyzers, may be used to analyze biological samples (e.g., serum, urine) by performing one or more tests on the sample, such as immunoassays. Aspiration and dispensing devices, such as pipette probes, may be used with diagnostic instruments as part of an automated pipetting system for transporting fluids within the instrument, such as samples or one or more reagents. For example, aspiration and dispensing devices may be used to deliver fluids from and / or remove fluids from the instrument's reaction vessels, move fluids between vessels, mix fluids, etc.

[0007] During use, at least a portion of the inner and / or outer surfaces of the aspiration and dispensing device is exposed to the fluid transported by the device. In some cases, residues associated with the sample and / or reagent, such as proteins or viral substances, may remain on the inner and / or outer surfaces of the aspiration and dispensing device. As a result, subsequent use of the aspiration and dispensing device may result in sample or reagent carryover, or transfer of a sample or reagent to another sample or reagent. Thus, reuse of the aspiration and dispensing device may contaminate the sample and / or reagent exposed to the device in connection with its subsequent use. The aspiration and dispensing device may be cleaned with the aim of reducing carryover and / or contaminants by sterilizing the device, for example, using heat.

[0008] Examples of systems, methods, and apparatus disclosed herein use electromagnetic induction heating to clean workpieces such as aspiration and dispensing devices. Examples disclosed herein include induction heaters that may be integrated and implemented by automated diagnostic instruments such as clinical chemistry analyzers and immunoassay analyzers. In some examples disclosed herein, the instrument into which the induction heater is integrated is used to power the induction heater and to control one or more settings of the induction heater via a graphical user interface or the like. In some examples disclosed herein, the induction heater includes an induction heating circuit that includes a conductive medium such as a coil. An electric current is supplied to the conductive medium, which induces an electromagnetic field. In the examples disclosed herein, the workpiece is placed in close proximity to the conductive medium (e.g., inserted into an opening in the coil) and heated by the magnetic field. In the examples disclosed herein, heating the aspiration and dispensing device substantially removes and / or alters one or more properties of a substance remaining on the aspiration and dispensing device so as to substantially reduce the possibility of carryover and / or contamination in subsequent use of the aspiration and dispensing device.

[0009] In some disclosed examples, a cleaning fluid is applied to a workpiece before, during, and / or after induction heating of the workpiece to wash away biological and / or chemical substances from the surface of the device. Some disclosed examples include a cleaning cup for collecting the cleaning fluid. In some disclosed examples, a conductive medium is disposed in close proximity to the cleaning cup and, in some examples, is detachably attached to a portion of the cleaning cup to facilitate the collection of the cleaning fluid during induction heating of the workpiece.

[0010] In the examples disclosed herein, the induction heating circuit includes a tank circuit, which includes a first coil to act as an electrically inductive medium for heating a workpiece. In some of the disclosed examples, a second coil is wound around the first coil to sense the oscillating magnetic field generated by the first coil and to synchronize the current supplied to the tank circuit with the current already flowing through the first coil. In the examples disclosed herein, a signal corresponding to the oscillating magnetic field generated by the first coil is dynamically detected by the second coil. This signal is used to drive the current supplied to the tank circuit so that the tank circuit is driven at its resonant frequency rather than a fixed frequency. Driving the tank circuit at its resonant frequency reduces energy loss and provides an increased amount of energy to be transferred to the suction and dispensing device heated by the first coil compared to when the tank circuit is driven at a fixed frequency. Thus, the disclosed examples improve the efficiency of induction heating of the suction and dispensing device. Driving the tank circuit to resonate at its natural frequency also compensates for manufacturing variations in components such as coils and capacitors. Driving the tank circuit to resonate at its natural frequency also accepts dynamic load variations due to changes in the tank circuit's resonant frequency resulting from the introduction of workpieces with different diameters, coating thicknesses, etc., into the magnetic field.

[0011] In some disclosed examples, the conductive medium (e.g., coil) of the induction heating circuit is coated with one or more materials to prevent corrosion from biological and chemical interactions between the workpiece, cleaning fluid, and the conductive medium. Some disclosed examples detect and / or predict failures of one or more components of the induction heater by monitoring heater performance data such as voltage, current, and frequency. Also, some disclosed examples include a heat sink to reduce the risk of overheating of the printed circuit board on which components such as coils and capacitors in tank circuits are mounted. Thus, the disclosed examples provide stable and reliable means for induction heating, as well as suction and dispensing devices.

[0012] An example system disclosed herein includes an induction heater including a tank circuit. The example system includes a controller that drives the tank circuit to selectively vibrate at the resonant frequency of the tank circuit in order to induce heating of a workpiece located in close proximity to the tank circuit.

[0013] In some examples, the controller drives the tank circuit to selectively vibrate at the resonant frequency based on the characteristics of the workpiece.

[0014] In some examples, the controller drives the tank circuit to selectively oscillate between a resonant frequency and a fixed frequency.

[0015] In some examples, the tank circuit includes a work coil and a sense coil. In such examples, the sense coil is wound around the work coil.

[0016] In some examples, the controller drives the tank circuit to vibrate at the resonant frequency based on the signal generated by the sense coil.

[0017] In some examples, the system further includes a heat sink coupled to an induction heater.

[0018] In some examples, the system further includes a shield including a thermally conductive material coupled to the induction heater.

[0019] In some examples, the tank circuit includes a work coil disposed within the wash cup. In some such examples, the workpiece is exposed to a fluid during induction heating. In some such examples, the fluid undergoes a phase change during induction heating.

[0020] In some examples, the controller accesses at least one of temperature data, current data, or voltage data from the induction heater. In such examples, the controller predicts the performance conditions of the induction heater based on the data.

[0021] In some examples, the workpiece includes a first portion and a second portion. In such examples, the controller selectively adjusts the heating settings in the tank circuit for the first portion and the second portion. In some such examples, the heating settings are adjusted for the first portion based on a first temperature profile for the first portion and for the second portion based on a second temperature profile for the second portion.

[0022] Example methods disclosed herein include providing current to an induction heater including a tank circuit by executing instructions using a processor. Example methods include driving the tank circuit to selectively oscillate at a resonant frequency of the tank circuit by executing instructions using a processor. Example methods include induction heating a workpiece disposed proximate to the tank circuit.

[0023] In some examples, driving the tank circuit to selectively oscillate at a resonant frequency is based on the characteristics of the workpiece.

[0024] An example tangible computer-readable medium disclosed herein includes, when executed, instructions causing a processor to supply current to an induction heater including at least a tank circuit. The instructions cause the processor to drive the tank circuit to vibrate selectively at the resonant frequency of the tank circuit, thereby inductively heating a workpiece disposed in close proximity to the tank circuit.

[0025] In some examples, when the instruction is executed, it causes the processor to further drive a tank circuit to vibrate selectively at a resonant frequency, based on the characteristics of the workpiece.

[0026] In some examples, when the instruction is executed, the processor further drives a tank circuit to selectively oscillate between a resonant frequency and a fixed frequency.

[0027] In some examples, the workpiece includes a first part and a second part, and when the instruction is executed, it causes the processor to selectively adjust the heating settings in the tank circuit for the first part and the second part.

[0028] In some examples, when the instruction is executed, it causes the processor to further adjust the heating settings for the first part based on a first temperature profile for the first part, and adjust the heating settings for the second part based on a second temperature profile for the second part.

[0029] Moving on to the figures, Figure 1 is a schematic diagram of electromagnetic induction. As shown in Figure 1, at least a portion of the workpiece 100 to be heated (e.g., a suction and dispensing device) is removably disposed in a conductive medium, such as a coil 102. In the example of Figure 1, the workpiece 100 includes a metal. An alternating current is supplied to the coil 102 (e.g., from a current source) and flows through the coil 102 as indicated by arrow 104 in Figure 1. The alternating current flowing through the coil 102 induces a magnetic field 106 in the area surrounding the coil 102. The magnetic field 106 induces eddy currents in the workpiece 100 as indicated by arrow 108 in Figure 1. The eddy currents generate localized heat that increases the temperature of the workpiece 100 without direct contact between the workpiece 100 and the coil 102. In an example where the workpiece 100 is a suction and dispensing device, heat affects the properties of one or more substances (e.g., residual biological substances) on the inner and / or outer surfaces of the workpiece 100, allowing these substances to be removed or altered, and the workpiece 100 to be cleaned.

[0030] Figure 2 is a block diagram of an example system 200 for reducing biocarryover by induction heating. The example system 200 includes a diagnostic instrument 202. The diagnostic instrument 202 may be, for example, a clinical chemistry analyzer, an immunoassay analyzer, etc. The example diagnostic instrument 202 includes a processor 204 to control one or more functions performed by the instrument 202, such as manipulating a test sample, performing test sample readout, positioning a reaction vessel, delivering fluid to and / or removing fluid from the reaction vessel. The example diagnostic instrument 202 includes a power supply 206. The power supply 206 may include, for example, a battery, an electrical outlet, etc. The example diagnostic instrument 202 includes a display 208. The display 208 can present one or more graphical user interfaces (GUIs) 209 to the user of the diagnostic instrument 202, for example, to receive user input via the GUI 209, to display analysis results via the GUI 209, etc. The diagnostic instrument 202 may include a timer 211 to monitor, trigger, or more generally provide timing control for one or more functions performed by the diagnostic instrument 202 with respect to analyzing a sample.

[0031] In the example system 200 in Figure 2, the diagnostic instrument 202 includes an induction heater control station 210. The example induction heater control station 210 includes an induction heater 212 for cleaning or sterilizing a workpiece 214 (e.g., workpiece 100 in Figure 1) by induction heating, as substantially disclosed in relation to Figure 1. The workpiece 214 may include aspiration and dispensing devices that can be used to perform one or more functions relating to experiments and / or analyses performed by the diagnostic instrument 202, such as transporting biological samples or delivering reagents. As a result of using the workpiece 214 with the diagnostic instrument 202, the workpiece 214 may contain biological and / or chemical residues on one or more surfaces of the workpiece 214, so that reuse of the workpiece 214 may contaminate other samples and / or reagents.

[0032] The workpiece 214 may include one or more parts having different properties 215, for example, with respect to film thickness, diameter, cross-sectional shape, material, etc. The properties 215 of the workpiece 214 may affect the magnetic properties of the workpiece 214 with respect to heating the workpiece 214 with a magnetic field. For example, as illustrated in Figure 2, the workpiece 214 may include a first part 217 having a first diameter and a second part 219 having a second diameter smaller than the first diameter. In some examples, the workpiece 214 is moved relative to an induction heater 212, for example by a robotic arm 221 of a diagnostic instrument 202, to selectively heat and clean the first part 217 and the second part 219 of the workpiece 214. The workpiece 214 may include additional parts, or fewer parts than those illustrated in Figure 2. In some examples, the workpiece 214 is a probe defined by parts 217, 219 of the workpiece, including openings extending through them.

[0033] In the example in Figure 2, the induction heater 212 is positioned close to the washing cup 216. In some examples, the induction heater 212 is coupled to the washing cup 216. For example, the induction heater 212 may be coupled inside the washing cup 216. In the example in Figure 2, at least a portion of the workpiece 214 is placed inside the washing cup 216. In some examples, the workpiece 214 is rinsed with a fluid 218 (e.g., a liquid) before, during, and / or after being heated by the induction heater 212. The washing cup 216 collects the fluid 218.

[0034] The induction heater control station 210, an example shown in Figure 2, includes a power drive unit 220. In the example in Figure 2, the power supply 206 of the diagnostic instrument 202 provides power (for example, in the form of direct current (DC)) to the power drive unit 220, as indicated by arrow 222 in Figure 2. The power received by the power drive unit 220 from the power supply 206 is used to drive the induction heater 212 by a drive signal, as indicated by arrow 224 in Figure 2. In some examples, the power drive unit 220 includes a DC-DC converter to convert the DC received from the power supply 206 from one voltage level to another.

[0035] The induction heater control station 210, an example shown in Figure 2, includes an induction heater controller 226. The induction heater controller 226 includes a processor 227 to perform one or more control functions on the induction heater 212 and / or the power drive unit 220. For example, the induction heater controller 226 generates one or more instructions to activate and / or deactivate the induction heater 212 and monitors the status and / or performance of the induction heater 212 and / or other components of the induction heater control station 210 (e.g., the power drive unit 220). The power drive unit 220 provides power to the induction heater controller 226, as indicated by arrow 228 in Figure 2.

[0036] In the example system 200 shown in Figure 2, the induction heater controller 226 is communicatively coupled to the processor 204 of the diagnostic instrument 202. The induction heater controller 226 includes a serial communication port to facilitate data transmission between the induction heater controller 226 and the processor 204 of the diagnostic instrument 202, as indicated by the arrow 230 in Figure 2. For example, one or more user commands received via the GUI 209 of the diagnostic instrument 202 may be transmitted to the induction heater controller 226 via the serial communication port 230. The induction heater controller 226 may also transmit performance data generated by, for example, monitoring the induction heater 212 to the diagnostic instrument 202 via the serial communication port 230. In another example, the timer 211 of the diagnostic instrument 202 transmits a trigger signal 232 to the induction heater controller 226 to provide timing control for one or more induction heating events, such as activation and deactivation of the induction heater 212.

[0037] In addition to receiving power from the power drive unit 220 as described above, the example induction heater controller 226 in Figure 2 is communicatively coupled to the power drive unit 220. The example induction heater controller 226 provides the power drive unit 220 with one or more commands 234, for example, regarding the activation of the induction heater 212, the temperature to which the workpiece 214 is heated, etc. The example power drive unit 220 generates a drive signal 224 to drive the induction heater 212 based on the commands 234 received from the induction heater controller 226.

[0038] The example induction heater controller 226 also receives data from the power drive unit 220, for example, regarding the performance of the induction heater 212. In the example in Figure 2, the power drive unit 220 communicates data such as the status 236 of the induction heater 212 and monitors data such as the current and / or voltage in the induction heater 212, etc. Based on the data received from the power drive unit 220, the induction heater controller 226 may communicate other signals, for example, a present / ready status signal 240 of the induction heater control station 210, a pass / fail status signal 242 regarding the performance status of one or more components of the induction heater control station 210, such as the power drive unit 220 and / or the induction heater 212, and / or data that can be used by the diagnostic instrument 202 to control the induction heater control station 210.

[0039] As disclosed below, in some examples, the induction heater controller 226 receives feedback 244 from the induction heater 212, for example, with respect to the frequency at which the circuit of the induction heater 212 is oscillating. In some examples, the induction heater controller 226 receives analog feedback signals from the power drive unit 220 and / or the induction heater 212. The induction heater controller 226 converts the analog signals into digital data (for example, via the processor 227) for analysis by the induction heater controller 226 and / or the processor 204 of the diagnostic instrument 202.

[0040] The system 200 in the example shown in Figure 2 may include a pump 246 to control the flow of a fluid 218 used to clean the workpiece 214. The operation of the pump may be controlled by a power drive unit 220 based on instructions 234 received, for example, from the processor 227 of the induction heater controller 227. In another example, the pump 246 is controlled by the processor 204 of the diagnostic instrument 202. Instructions may, for example, control the speed at which the pump 216 pumps the fluid 218.

[0041] Figure 3 is a block diagram of an example induction heater control station 210 as shown in Figure 2. The example induction heater control station 210 includes a heater board 300 (e.g., a printed circuit board), which includes one or more electrical components (e.g., circuits) coupled thereto. The example heater board 300 in Figure 3 is operably coupled to an induction heater controller 226.

[0042] In some examples, the heater board 300 includes a power drive unit 220 (for example, the power drive unit 220 is mechanically and electrically coupled to the heater board 300). In other examples, the power drive unit 220 is separate from the heater board 300 but operably coupled to it. As disclosed above, the power drive unit 220 receives power from the power supply 206 of the diagnostic instrument 202 in Figure 2. The power drive unit 220 delivers power to, for example, an induction heater controller 226, other components of the heater board 300, etc.

[0043] The heater substrate 300, as shown in Figure 3, is operably coupled to the induction heater 212. The induction heater 212, as shown in Figure 3, includes a tank circuit board 302 (e.g., a printed circuit board). In some examples, the tank circuit board 302 and the heater substrate 300 form a single substrate. In other examples, the heater substrate 300 and the tank circuit board 302 are separate substrates.

[0044] An example tank circuit board 302 in Figure 3 includes a tank circuit 304 (e.g., an inductance-capacitance or LC circuit) formed by a capacitor 306 and an inductor or work coil 308 (e.g., coil 102 in Figure 1). The work coil 308 includes a conductive material such as metal. An example power drive unit 220 supplies current 310 to the tank circuit 304 and / or generates a voltage in the tank circuit 304. In some examples, the power drive unit 220 supplies current 310 to the tank circuit 304, for example, via a shielded cable or coaxial cable. As the current 310 flows through the work coil 308 as disclosed above with respect to Figure 1, a magnetic field (e.g., magnetic field 106 in Figure 1) is generated by the work coil 308. The magnetic field can be used to heat the workpiece 214 in Figure 2 when the workpiece 214 is positioned close to the work coil 308 (e.g., at least partially positioned within the opening of the work coil 308).

[0045] The example tank circuit board 302 in Figure 3 includes a sense coil 312. In the example induction heater 212 in Figures 2 and 3, the sense coil 312 is wound around a work coil 308. The example sense coil 312 detects or senses the magnetic field generated by the work coil 308. The sense coil 312 generates one or more sensing signals 314 which are transmitted to the heater board 300. As disclosed below, the sensing signals 314 generated by the sense coil 312 are detected by a frequency control circuit 316 of the heater board 300 to drive the tank circuit 304 at a resonant frequency.

[0046] An example tank circuit board 302 includes a coil temperature sensor 318. The coil temperature sensor 318 detects the temperature of the work coil 308 and / or the sense coil 312, for example, while the work coil 308 is generating a magnetic field. The coil temperature sensor 318 transmits coil temperature data 320 to a temperature monitor 322 of an example heater board 300. In some examples, the temperature monitor 322 also collects temperature data regarding the temperature of the heater board 300 and / or one or more electrical components of the board, for example, based on one or more temperature sensors coupled to the heater board 300. The temperature monitor 322 transmits heater temperature data 323 regarding the temperatures of the work coil 308, the sense coil 312, the heater board 300, etc., to an induction heater controller 226.

[0047] The heater substrate 300, an example shown in Figure 3, also includes a current monitor 324. The current monitor 324 generates data about the current 310 supplied to the tank circuit 304, such as the amount of current and the frequency of the current. For example, the current monitor 324 can detect overcurrent or current exceeding a threshold current that should be received by the tank circuit 304. The current monitor 324 can detect changes in the current in the induction heater 212. Based on its detection, the current monitor 324 generates one or more current signals 325 and transmits these current signals 325 to the induction heater controller 226.

[0048] The heater board 300, an example shown in Figure 3, includes a voltage monitor 326. The voltage monitor 326 generates data regarding the voltage in the tank circuit 304. In some examples, the voltage monitor 326 detects overvoltage or voltage in the tank circuit 304 that exceeds a threshold limit of the tank circuit 304. The voltage monitor 326 can detect voltage based on voltage measurements obtained from the tank circuit 304 (e.g., by a voltmeter). The voltage monitor 326 can also detect changes in voltage in the induction heater 212. Based on its detection, the voltage monitor 326 generates one or more voltage signals 327 and transmits these voltage signals 327 to the induction heater controller 226.

[0049] As disclosed above, the example heater board 300 includes a frequency control circuit 316. The frequency control circuit 316 transmits one or more sense coil detection signals 328 to the example induction heater controller 226 in Figure 3, based on a sensing signal 314 generated by a sense coil 312 with respect to vibrations in the tank circuit 304. The example heater board 300 also includes a fixed-frequency clock 330. As disclosed below, the frequency control circuit 316 selectively enables the fixed-frequency clock 330 to generate one or more fixed-frequency signals or disables the fixed-frequency clock 330, based on the sensing signal 314. The fixed-frequency signals generated by the fixed-frequency clock 330 cause the current 310 in the tank circuit 304 to vibrate at a fixed frequency.

[0050] Thus, the example induction heater controller 226 receives one or more signals 323, 325, 327, and 328 from the circuitry of the example heater board 300. The induction heater controller 226 processes the data 323, 325, 327, and 328 by, for example, converting the data from analog to digital, filtering the data, or removing noise from the data. The example induction heater controller 226 in Figure 3 analyzes the data received from the heater board 300 to generate one or more instructions regarding the operation of the induction heater 212 and / or transmits the data to the diagnostic instrument 202 in Figure 2 for display to the user via the GUI 209. Any of the functions of the example induction heater controller 226 in Figure 3 disclosed herein may be performed by a processor 227 associated with the induction heater controller 226.

[0051] The induction heater controller 226, an example shown in Figure 3, includes a drive manager 332. The drive manager 332 generates an instruction 234 to be transmitted to the power drive unit 220, which causes the power drive unit 220 to generate, for example, a current 310 supplied to the tank circuit 304 and / or a voltage generated in the tank circuit 304. The instruction 234 generated by the drive manager 332 includes, for example, the amount of current 310 to be supplied to the tank circuit 304 and / or the voltage to be generated in the tank circuit 304, the duration for which the current 310 should be supplied, and so on. In some examples, the drive manager 332 generates the instruction 234 based on reference data 334 stored in the database 336 of the induction heater controller 226. The reference data 334 may include, for example, data on the current threshold and / or voltage threshold of the tank circuit 304, the inductances of the work coil 308 and / or sense coil 312, the capacitance of the capacitor 306, and so on.

[0052] An example induction heater controller 226 in Figure 3 includes a frequency manager 338. The frequency manager 338 processes the sense coil detection signal 328 generated by the frequency control circuit 316. In some examples, the frequency manager 338 generates one or more frequency commands 339 relating to the operation of the frequency control circuit 316 and / or the fixed-frequency clock 330 in order to selectively oscillate the tank circuit 304 at a resonant frequency or a fixed frequency, as disclosed below.

[0053] The example induction heater controller 226 in Figure 3 includes a performance manager 340. Current monitors 324 and / or voltage monitors 326 transmit current signals 325 and / or voltage signals 327, respectively, to the performance manager 340, indicating changes in current and / or voltage in the induction heater 212 (e.g., in the tank circuit 304). The example performance manager 340 generates one or more commands for the power drive unit, for example, based on the monitoring of current and / or voltage.

[0054] In some examples, the voltage and / or current changes detected in the induction heater 212 are based on one or more of the characteristics 215 of the workpiece 214 of Figure 2 introduced into the induction heater 212. For example, the workpiece 214 of Figure 2 includes a first portion 217 and a second portion 219 having a diameter smaller than the first diameter of the first portion 217. In some examples, the thickness of the coating on the first portion 217 is greater than the thickness of the second portion 219. As disclosed above, the first and second portions 217, 219 of the workpiece 214 may be selectively positioned in close proximity to the work coil 308 for heating of the magnetic field generated by the current 310 in the work coil 308. The presence of the first portion 217 and / or the second portion 219 relative to the work coil 308 may affect the load on the work coil 308.

[0055] In some examples, the current monitor 324 in Figure 3 detects a change in current in the tank circuit 304 when the second portion 219, which has a thinner coating, is positioned closer to the work coil 308 compared to when the first portion 217 is positioned closer to the work coil 308. For example, the current monitor 324 may detect a decrease in current 310 in the tank circuit 304 when the second portion 219 is positioned closer to the work coil 308 compared to when the first portion 217 is positioned closer to the work coil 308. The current monitor 324 generates a current signal 325 with respect to the change in current in the induction heater 212 (e.g., a decreased current). In some examples, the voltage monitor 326 detects a change in voltage in the tank circuit 304 based on a change in load on the work coil 308 due to the presence of the first portion 217 or the second portion 219 positioned closer to the work coil 308. The voltage monitor 326 generates a voltage signal 327 in relation to the voltage change detected in the induction heater 212.

[0056] The performance manager 340 of the induction heater controller 226 analyzes current signals 325 and / or voltage signals 327 in relation to a temperature profile 342 for the workpiece 214 stored in the database 336 of the induction heater controller 226, as shown in the example in Figure 3. The temperature profile 342 includes, for example, specified data (e.g., provided to the processor 227 of the induction heater controller 226 by one or more user inputs) regarding the minimum temperature for heating the workpiece 214 over its length to clean or sterilize it. The temperature profile 342 is used by the performance manager 340 to determine the power settings over time regarding the power to be supplied to the induction heater 212 in relation to one or more portions 217, 219 (e.g., loads) of the workpiece 214 being heated by the induction heater 212.

[0057] The temperature profile 342 may be based, for example, on known data regarding the properties 215 of the workpiece 214 and the response of the workpiece 214 to a magnetic field based on those properties 215. The properties 215 of the workpiece 214 result in load impedance fluctuations in the induction heater 212, based on differences in different parts 217, 219 of the workpiece 214, such as film thickness and diameter. The performance manager 340 uses the temperature profile 342 to control the power delivered to the workpiece 214 to heat the workpiece 214 at each position of the workpiece 214 relative to the induction heater 212 over time.

[0058] In some examples, the temperature profile 342 is a time-based profile relating to the temperature at which one or more parts 217, 219 of the workpiece 214 will be heated over time. In some examples, the temperature profile 342 is generated by the performance manager 340 of the induction heater controller 226 based on data (e.g., calibration or reference data) previously collected during the heating of the workpiece 214 and / or one or more other workpieces. In some examples, the temperature profile 342 is based on one or more user inputs received via the GUI 209 of the diagnostic instrument 202 relating to the voltage to be generated in the tank circuit 304 over time in relation to the position of the workpiece 214 in the induction heater 212. In some examples, the temperature profile 342 represents the optimal temperature for heating the first part 217 and / or the second part 219 of the workpiece 214 over time.

[0059] In the example shown in Figure 3, the performance manager 340 instructs the drive manager 332 to provide a command 234 to the power drive unit 220 based on the temperature profile 342. In some examples, the performance manager 340 determines the command 234 to be sent to the power drive unit 220 based on the start time of heating of the workpiece 214, which is related to the starting position of the workpiece 214 in the induction heater 212 (e.g., whether the first part 217 or the second part 219 will be heated first). In some examples, the performance manager 340 determines the position of the workpiece 214 relative to the work coil 308 based on, for example, data from the processor 204 of the diagnostic instrument 202 regarding the movement and / or position of the robot arm 221, as well as / or other positional data (e.g., position data). The performance manager 340 determines additional commands 234 to be sent to the power drive unit 220 based on the expected position of the workpiece 214 relative to the induction heater 212, as reflected in the temperature profile 342.

[0060] The performance manager 340 uses the temperature profile 342 to determine the current and / or power to be supplied to the induction heater 212, and / or the voltage to be generated in the induction heater 212, at different times during the heating of the workpiece 214 in the induction heater 212. In some examples, the performance manager 340 in Figure 3 analyzes current signals 325 and / or voltage signals 327 that show the changes in current and / or voltage in the induction heater 212 related to the temperature profile 342. Based on the analysis, the example performance manager 340 generates instructions 234 for the power drive unit 220 regarding the current, voltage, and / or power in the induction heater 212 for different heating settings associated with the temperature profile 342.

[0061] For example, based on the current signal 327, the performance manager 340 can detect a decrease in current in the tank circuit 304, which is due, for example, to the placement of a second portion 219 of the workpiece 214, having a thinner coating, closer to the work coil 308 than a first portion 217 of the workpiece 214. The performance manager 340 analyzes the temperature profile 342 to determine that a higher temperature is required to heat the second portion 219 compared to the first portion 217, due to the thinner coating of the workpiece 214 (for example, due to the thinner portion 219 of the workpiece heating up with less efficiency than the thicker portion 217 of the workpiece 214). The performance manager 340, as an example, generates an instruction 234 for the power drive unit 220 to increase the current 310 supplied to the tank circuit 304 when the second portion 219 of the workpiece 214 is placed closer to the work 308 than the first portion 217 of the workpiece 214.

[0062] In some examples, the DC-DC converter of the power drive unit 220 acts as a power source for generating voltage in the induction heater 212. In such examples, the temperature profile 342 includes voltage values. The command 234 sent to the power drive unit 220 includes voltages to be generated at specific time intervals based on the temperature profile 342. In such examples, with a given heating setting (e.g., voltage), the power changes as the load impedance in the tank circuit 304 changes as a result of the movement of the workpiece 214 between the first section 217 and the second section 219 (e.g., by the robot arm 221 in Figure 2).

[0063] In other examples, the temperature profile 342 includes power values ​​representing desired power output values ​​(e.g., watts) at different times. In such examples, the performance manager 340 calculates the power based on current data 325 from the current monitor 324 and voltage data 327 from the voltage monitor 326. The performance manager 340 adjusts the output voltage provided by the DC-DC converter to obtain the desired output power. In such examples, at a given heating setting (e.g., watts), the power is substantially constant when the load impedance changes as a result of the movement of the workpiece 214 between the first part 217 and the second part 219 (e.g., by the robot arm 221 in Figure 2).

[0064] In other examples, the power drive unit 220 includes a fixed voltage source. In such examples, the output voltage is regulated by the duty cycle of the FET gate signal of the power drive unit 220.

[0065] Thus, the performance manager 340, as an example in Figure 3, provides dynamic adjustment of the current and / or voltage in the tank circuit 304, and consequently, dynamic adjustment of the power supplied to the workpiece 214 to heat the workpiece 214. Based on monitoring of the current by the current monitor 324 and / or the voltage by the voltage monitor 326, the performance manager 340 takes into account the characteristics 215 of the workpiece 214 and load impedance variations due to the position of the workpiece 214 relative to the induction heater 212. The example performance manager 340 uses a temperature profile 342 to respond to dynamic load variations arising from different parts 217, 219 of the workpiece 214 to be heated. The current, voltage, and / or power adjustments realized via the power drive unit 220 substantially improve the performance of the induction heater 212 by taking into account the different characteristics 215 of the workpiece 214 in different parts 217, 219 in order to efficiently heat the workpiece 214.

[0066] The induction heater controller 226, an example shown in Figure 3, also includes a fault monitor 344. The fault monitor 344 analyzes temperature data 323 generated by the temperature monitor 322 for potential overheating of one or more components of the heater board 300 (e.g., the frequency control circuit 316) and / or the induction heater 212. The fault monitor 344 analyzes current signals 325 and / or voltage signals 327 for potential overcurrents and / or overvoltages that could damage the induction heater 212, based on, for example, the amount or frequency of the current 310 supplied to the tank circuit 304.

[0067] Based on an analysis of temperature, current, and / or voltage data 323, 325, and 327, the fault monitor 344 predicts whether one or more components of the induction heater control station 210 are likely to malfunction and / or fail (e.g., overheat, short circuit). The fault monitor 344 can predict the performance status of, for example, the induction heater 212 based on reference data 334 stored in the database 336 of the induction heater controller 226. For example, the fault monitor 344 can detect overcurrent based on a default current threshold for the tank circuit 304 stored in the database 336.

[0068] If the fault monitor 344 determines that one or more components of the induction heater control station 210 are not functioning properly and / or are not working, and / or if the fault monitor 344 predicts that one or more components are likely to fail, the fault monitor 344 generates one or more fault instructions 346. Fault instructions 346 may include, for example, an instruction for the problematic component to shut down, an instruction for another component to take over the problematic component, and so on. In some examples, an instruction 234 sent to the power drive unit 220 includes an instruction to address a potential failure, for example, caused by overcurrent and / or overvoltage in the tank circuit 304, by reducing and / or stopping the delivery of current to the tank circuit 304. In some examples, the fault monitor 344 stores historical data regarding the performance tracking of the heater board 300 and / or the tank circuit board 302 in a database 336. This historical data may be used by the fault monitor 344 to predict component failures.

[0069] The fault monitor 344 can also update the present / ready status signal 240 and / or pass / fail status signal 242 (as shown in Figure 2) transmitted to the processor 204 of the diagnostic instrument 202 based on an analysis of the performance data of the induction heater control station 210. For example, if the fault monitor 344 detects an error in the induction heater 212, the fault monitor 344 can update the pass / fail status signal 242 to indicate the error state of the induction heater 212. The fault monitor 344 can also generate other warnings for display via the GUI 209 of the diagnostic instrument 202, for example, regarding fault and / or historical data indicating performance changes over time that may indicate future failures.

[0070] The induction heater controller 226, an example shown in Figure 3, includes a communicator 348 for transmitting one or more of the instructions 234, 339, and 346 to the heater board 300. The communicator 348 can also transmit present / ready status signals 240 and / or pass / fail status signals 242 to the processor 204 of the diagnostic instrument 202.

[0071] Figure 4 shows an example of an induction heater control station 210, including a frequency control circuit 316, a fixed-frequency clock 330, and a tank circuit 304, as shown in Figure 3. As disclosed above with respect to Figure 3, the tank circuit 304 includes a capacitor 306 and a work coil or inductor 308. The tank circuit 304 stores energy through an oscillating current between the capacitor 306 and the work coil 308. Oscillation of the current can result in energy loss within the tank circuit 304. For example, energy may be lost due to the resistance of the work coil 308, the resonance of the capacitor 306, and the tank circuit board 302. Energy may also be lost as a result of the workpiece 214 being heated by the magnetic field generated by the work coil 308. In the example of the induction heater control station 210 shown in Figures 2 to 4, energy is supplied to the tank circuit 304 in the form of alternating current synchronized with the current already circulating within the tank circuit 304.

[0072] In the example in Figure 4, the introduction of the workpiece 214 into the tank circuit 304 changes the effective inductance of the work coil 308. Variations in the characteristics 215 of the workpiece 214, such as density and / or shape (e.g., in different sections 217, 219), can also cause changes in the effective inductance of the work coil 308. The change in the effective inductance of the work coil 308 affects the resonant frequency of the tank circuit 304, or the frequency at which the current oscillates within the tank circuit 304 with the least energy loss. In the example in Figure 4, the alternating current injected into the tank circuit has a frequency that varies based on the changing effective inductance in the work coil 308, maximizing the efficiency of the synchronization of the current introduced into the tank circuit 304 with the current already circulating within the tank circuit 304. Such frequency regulation allows the tank circuit 304 to oscillate at its resonant frequency, providing a dynamic response to load variations in the tank circuit 304 resulting from the introduction and / or operation of the workpiece 214.

[0073] As disclosed above, the tank circuit 304 includes a sense coil 312 positioned in close proximity to (e.g., wrapped around) the work coil 308. The sense coil 312 senses the magnetic field generated by the work coil 308 (e.g., the magnetic field 106 in Figure 1) and generates a sense signal 314. The sense signal 314 is used to synchronize the alternating current 310 injected into the tank circuit with the current 401 already flowing in the tank circuit 304.

[0074] For example, at the start of a heating cycle (for example, when the workpiece 214 is positioned close to the work coil 308), the variable DC power supply 400 (for example, of the power drive unit 220) is enabled by command 234 from the induction heater controller 226, for example, in Figure 3. The variable DC power supply 400 is set to a low power level by the drive manager 332 of the induction heater controller 226. The low power level setting of the variable DC power supply 400 limits the vibration of the tank circuit 304, thereby limiting energy loss, when the tank circuit 304 is vibrating at a certain frequency, whether or not it is at its resonant frequency. In other examples, the power level of the variable DC power supply is not adjustable.

[0075] In the example in Figure 4, the fixed-frequency clock 330 is enabled by a frequency manager 338, which is an example of the induction heater controller 226 in Figure 3. The frequency manager 338 sets the fixed-frequency clock 330 (for example, based on default data) to generate a fixed-frequency signal 402 close to the resonant frequency current of the tank circuit 304. The fixed-frequency signal 402 travels through a switch 404 (for example, a unipolar, double-throw, or SPDT switch) to the SYNC input pin 406 of the switched resonant frequency (RF) current drive circuit 408. The fixed-frequency signal 402 causes the current 310 supplied by the variable DC source and the current 401 already in the tank circuit 304 to oscillate at a fixed frequency.

[0076] The sense coil 312, as shown in the example in Figure 4, senses the oscillating magnetic field induced within the work coil 308 as a result of the current flowing through the work coil 308, and generates a sense signal 314. The frequency control circuit 316, as shown in the example in Figure 4, includes a signal scaler 410. The signal scaler 410 scales the sense signal 314 in relation to the SYNC input pin 406 of the switched RF current drive circuit 408 (e.g., voltage scaling). The signal scaler 410 also applies a delay to the sense signal 314 to optimize current synchronization and generate a scaled sense signal 412. In the example in Figure 4, the signal scaler 410 includes a circuit to detect the effectiveness of the sense signal 314 in scaling the signal to, for example, a predetermined voltage, signal amplitude, etc.

[0077] When the signal scaler 410 detects the validity of the sensing signal 314, the switch 404 (e.g., an SPDT switch) is switched so that the frequency control circuit drives the SYNC input pin 406 of the switched RF current drive circuit 408 using the sensing signal 314 instead of the fixed frequency signal 402. As a result, the tank circuit 304 is freed from being driven by the fixed frequency clock 330 and is instead driven at its resonant frequency with respect to the current 310 provided by the variable DC power supply 400 and the current 401 already circulating within the tank circuit 304.

[0078] In the example in Figure 4, when the tank circuit 304 is driven at its resonant frequency, the variable DC power supply 400 is adjusted to a high power level (for example, based on a command 234 from the drive manager 332). Also, when the workpiece 214 is positioned close to the work coil 308 (for example, inserted into it), the resonant frequency of the tank circuit 304 changes as the effective inductance of the work coil 308 changes due to the presence of the workpiece 214. The sense coil 312 generates a sense signal 314 that reflects the (e.g., modified) resonant frequency in the tank circuit 304. As a result, the current passing through the switched RF current drive circuit 408 is synchronized with the current 401 in the tank circuit 304. In this way, the frequency control circuit 316 dynamically responds to the introduction of the workpiece 214 into the tank circuit 304 in order to enable the tank circuit 304 to be driven at its resonant frequency when the workpiece 214 is heated by the work coil 308. The sense coil 312 and the frequency control circuit 316 form a feedback loop that responds to variations in the resonant frequency of the induction heater 212.

[0079] In the example in Figure 4, driving the tank circuit 304 at its resonant frequency substantially minimizes energy loss within the tank circuit 304. As a result, more energy is transferred to the workpiece 214 to heat it compared to the case where the tank circuit 304 oscillates at a fixed frequency that is not the tank circuit 304's resonant frequency. Thus, the self-oscillation of the tank circuit 304 at its resonant frequency increases the efficiency of the induction heater 212. Furthermore, by enabling the tank circuit 304 to oscillate at its resonant frequency rather than being driven to resonate at a fixed frequency, the example frequency control circuit 316 substantially compensates for manufacturing variations and / or aging effects of components in the induction heater control station 210, such as the work coil 308, capacitor 306, and circuit boards 300 and 302. Manufacturing variations and / or aging can alter the vibration behavior of the tank circuit 304, and therefore result in inefficiency if the tank circuit 304 were driven to oscillate only at a fixed frequency. Furthermore, the example in Figure 4 dynamically responds to load variations resulting from the introduction of the workpiece 214 into the tank circuit 304 and / or the exposure of different parts 217, 219 of the workpiece 214 having different characteristics 215 to the induction heater 212. The example in Figure 4 accepts the resulting effects on the effective impedance of the work coil 308 and the resonant frequency of the tank circuit 304 caused by the load variations by adjusting to a modified resonant frequency.

[0080] At the end of the overheating cycle, the drive manager 332 of the induction heater controller 226 adjusts the variable DC power supply 400 to a low power setting and, after a predetermined time period (e.g., delay), switches off the variable DC power supply 400. As a result, the energy in the tank circuit 304 decreases. Over time, the sense coil 312 no longer generates a sense signal 314 large enough to be recognized as valid by the signal scaler 410. In such an example, the SYNC input pin 406 of the switched RF current drive circuit 408 is switched to be driven by the fixed frequency clock 330. As a result, any residual energy in the tank circuit 304 is dissipated. After a predetermined time period (e.g., delay), the drive manager 332 sends a command 234 to disable the fixed frequency clock 330.

[0081] Figure 5 is a diagram illustrating an example of a temperature profile 500, such as the temperature profile 342 in Figure 3, for a workpiece 502 having two or more parts having different characteristics such as size and film thickness. The workpiece 502 may be, for example, the workpiece 214 in Figure 3. The workpiece 502 may include, for example, a suction and dispensing devices.

[0082] As illustrated in Figure 5, an example temperature profile 500 includes a temperature-for-time plot for a first portion 504 and a second portion 506 of an example workpiece 502. The first portion 504 of the workpiece 502 may have, for example, a first thickness, and the second portion 506 may have a second thickness different from the first thickness. The second portion 506 may have one or more other different characteristics from the first portion 504, such as a different size or cross-sectional shape.

[0083] As illustrated in Figure 5, an example temperature profile 500 includes a first temperature profile 508 for a first portion 504, which has a temperature for heating the first portion 504 of the workpiece 502 over time when the first portion 504 is positioned close to the work coil 308. The example temperature profile 500 also includes a second temperature profile 510 for a second portion 506, which has a temperature for heating the second portion 506 of the workpiece 502 over time when the second portion 506 is positioned close to the work coil 308. In some examples, the first and second temperature profiles 508, 510 represent minimum temperatures for heating the first and second portions 504, 506 of the workpiece 502, respectively, for example, to clean (e.g., sterilize) the workpiece 502. In other examples, the first and second temperature profiles 508, 510 represent optimal temperatures for heating the first and second parts 504, 506, respectively, to clean (e.g., sterilize) the workpiece 502 within a predetermined time period. Optimal temperature data can be obtained, for example, from data collected from one or more previous induction heating cycles of the workpiece 502 and / or other workpieces. In some examples, the performance manager 340 in Figure 3 uses the example temperature profile 500 to generate commands 234 relating, for example, current and / or power to be supplied to the tank circuit 304 and / or voltage to be generated in the tank circuit 304, in order to heat the first and second parts 504, 506 of the workpiece 502 over time at one or more default temperatures or heating settings.

[0084] Figure 6 is a perspective view of an example work coil 600 (e.g., work coil 308 in Figure 3) that may be used with the induction heater 212 of the induction heater control station 210, as shown in Figures 2 to 4. The example work coil 600 includes a housing 602. In the example of Figure 6, the housing 602 is a magnetic concentrator made, for example, Ferrotron. The housing 602 includes a Litz wire 604 disposed therein. The Litz wire 604 includes a number of interwoven insulated wire strands. In some examples, the Litz wire 604 is wound around a mandrel (e.g., a PEEK® mandrel).

[0085] The housing 602 in the example shown in Figure 6 also includes a magnetic wire 606 wound around the Litz wire 604. The magnetic wire 606 includes, for example, an insulated copper wire. In the example in Figure 6, the magnetic wire 606 serves as a sense coil (e.g., the sense coil 312 in Figures 3 and 4) for sensing the magnetic field generated by the work coil 600. In the example in Figure 6, the windings of the Litz wire 604 and the magnetic wire 606 are in the same direction.

[0086] One or more electrical leads 608 may be coupled to an example work coil 600. The leads may be placed in heat shrink tubing to protect them from the heat generated by the work coil 600. The example work coil 600 in Figure 6 includes a thermistor 610 or resistor used to measure the temperature of the housing 602 (e.g., a Ferrotron magnetic concentrator). The data generated by the thermistor 610 may be transmitted to a fault monitor 344 of an induction heater controller 226, for example, in Figure 3.

[0087] An example work coil 600 may be selectively designed based on, for example, spatial constraints on the induction heater control station 210 of the diagnostic instrument 202, the size of one or more workpieces to be heated by the work coil 600, and so on. In some examples, variables such as the cross-sectional shape of the wire, the metal type of the wire, the number of turns of the wire, the spacing between turns, the height of the work coil 600, the diameter of the work coil 600, the shape of the work coil 600, and the resistance of the work coil 600 are selectively selected based on one or more intended uses of the work coil 600.

[0088] As illustrated in Figure 6, an example work coil 600 includes an opening 612. During operation, a workpiece (e.g., workpiece 214 in Figure 2) is placed within the opening 612 and is heated by the magnetic field generated by the work coil 600 as an electric current flows through it. The workpiece does not touch, or substantially does not touch, the example work coil 600 during heating, but the example work coil 600 is exposed to biological and / or chemical substances on the workpiece. In examples where the workpiece is cleaned during heating, the example work coil 600 is also exposed to a cleaning fluid (e.g., fluid 218 in Figure 2). In some examples, at least some of the cleaning fluid and / or biological / chemical substances may transfer to the work coil 600. Exposure to the cleaning fluid and / or biological / chemical substances may corrode the work coil 600, which may damage it.

[0089] To prevent corrosion, the example work coil 600 includes one or more coatings 614 applied to the housing 602. The coatings 614 may include surface treatment chemicals such as Chemtetall® Oaktite® and / or ceramic coatings (e.g., ceramic coatings made by Cerakote®). Thus, the example work coil 600 in Figure 6 includes protection against corrosion to increase the operating life of the work coil 600 and improve the reliability of the work coil 600, taking into account exposure to living organisms and / or chemicals.

[0090] As disclosed above, the induction heater control station 210, an example in Figure 2, generates heat to clean workpieces such as suction and dispensing devices. In some examples, this heat may result in overheating of one or more components of the induction heater control station 210. The example induction heater control station 210 manages the heat generated by the work coil (e.g., work coils 308, 600 in Figures 3 and 6), one or more printed circuit boards (e.g., heater board 300, tank circuit board 302 in Figure 3), and / or other electrical components of the printed circuit board (e.g., capacitor 306, frequency control circuit 316 in Figure 3) by one or more thermal management techniques. The thermal management techniques used by the induction heater control station 210 substantially reduce the risk, for example, that the work coil short-circuits the electrical components of the printed circuit board and / or that waste heat damages the electrical components of the printed circuit board.

[0091] For example, Figure 7 illustrates an example tank circuit board 700 (e.g., tank circuit board 302 in Figure 3) that includes an electromagnetic interference (EMI) shield 702 and a heat sink 704. The EMI shield 702 includes a thermally conductive material (e.g., metal) that substantially surrounds the work coil 706 (e.g., work coils 308 and 600 in Figures 2 and 6). In some examples, the EMI shield 702 is covered with a coating including, for example, Teflon®. In some examples, the EMI of the induction heater 212 in Figure 2 may exceed limits or regulations imposed by organizations such as insurance company laboratories and / or government agencies such as the European Union. The example EMI shield 702 substantially reduces the EMI of the induction heater 212 to comply with one or more standards for regulatory approval (e.g., CE compliance).

[0092] The example heatsink 704 in Figure 7 substantially reduces overheating of the work coil 706 and / or tank circuit board 700 by guiding waste heat away from the work coil 706 and / or tank circuit board 700. In the example in Figure 7, thermal energy is transferred through conductors of the work coil 706, such as the Litz wire 604 in Figure 6 (and, in some examples, the magnetic wire 606 of the sense coil in Figure 6), and through one or more copper vias formed in, for example, the tank circuit board 700. The thermal energy is transferred to the heatsink 704. In some examples, thermal energy from the work coil 706 is also transferred to the heatsink via the thermally conductive material of the EMI shield 702. The example heatsink 704 transfers heat from, for example, the tank circuit board 700 to the ambient environment. In some examples, the heatsink transfers heat into the interior of a diagnostic instrument (e.g., the diagnostic instrument 202 in Figure 2) in which the induction heater control station 210 is installed.

[0093] In some examples, the induction heater controller 226 of the induction heater control station 210, as shown in the example in Figure 2, reduces the duty cycle of the induction heater 212 (e.g., via the drive manager 332 and / or performance manager 340 in Figure 2) to manage waste heat generation. For example, the induction heater 212 may be activated to generate heat at a first temperature (e.g., based on temperature profiles 342, 500 in Figures 3 and 5) at a first power setting (e.g., wattage) over a first default time period, such as 4 seconds. The induction heater 212 may also be activated to generate heat at a second temperature (e.g., wattage) at a second power setting (e.g., wattage) higher than the first temperature over a second default time period, such as 2 seconds. Both the first temperature generated over a first (e.g., longer) time period and the second temperature generated over a second (e.g., shorter) time period can be used to heat the workpiece, but the lower temperature heat generated over the first (e.g., longer) time period may take longer to dissipate. In the example in Figure 7, the induction heater controller 226 instructs the induction heater 212 to generate heat over a shorter second time period in order to dissipate the heat more quickly. In this way, the induction heater controller 226 reduces the duty cycle of the induction heater to manage waste heat more efficiently.

[0094] Thus, the thermal management techniques employed by the induction heater control station 210 substantially reduce the risk of overheating electrical components such as coils and capacitors, and thus improve the performance of the induction heater control station 210. Furthermore, the EMI shield 702, heat sink 704, and / or reduced duty cycle substantially reduce the need for other mechanical modes to control and / or remove heat from the induction heater control station 210, thereby simplifying design considerations.

[0095] Figure 8 is a top perspective view of an example tank circuit board 700 as shown in Figure 7, including a work coil 706 disposed within a cleaning cup 800 (e.g., cleaning cup 216 in Figure 2). Figure 9 is a cross-sectional view of an example cleaning cup 800 and work coil 706 taken along line 1-1 in Figure 8, including a workpiece 900 (e.g., workpiece 214 in Figure 2) disposed within the work coil 706. For illustrative purposes, an example EMI shield 702 as shown in Figure 7 is not shown in Figure 8 or Figure 9.

[0096] As disclosed above, in some examples, the work coil 706 is at least partially disposed within a washing cup 800 to facilitate the washing of the workpiece 900, for example, before, during, and / or after induction heating of the workpiece 900 by the work coil 706, in order to help remove biological and / or chemical substances from the workpiece 900. The washing cup 800 collects a washing fluid (e.g., fluid 218 in Figure 2) used to rinse the workpiece 900. An example washing cup 800 may include one or more openings or areas to house and / or removably secure the work coil 706, electrical cables coupled to the work coil 706, etc., in close proximity to or substantially within the washing cup 800.

[0097] As illustrated in Figure 9, a first portion 902 of the workpiece 900 is placed in a work coil 706 and heated by the work coil 706. A second portion 904 of the workpiece 900 is placed in a cleaning cup 800, while a third portion 906 of the workpiece 900 is not placed in the cleaning cup 800. The workpiece 900 can be selectively moved relative to the work coil 706 by, for example, a robot arm 221 in Figure 2 that can hold the third portion 906 of the workpiece 900. As disclosed above, the induction heater control station 210 selectively adjusts the heat generated by the work coil 706 based on temperature profiles (e.g., temperature profiles 342, 500) to heat the first, second, and / or third portions 902, 904, 906 of the workpiece 900 based on different characteristics of each portion, such as film thickness, cross-sectional shape, and diameter.

[0098] Before, during, and / or after heating the workpiece 900, a washing buffer flows over one or more surfaces of the workpiece 900 to wash away any biological and / or chemical residues on the workpiece 900. In some examples, the washing buffer flows over the outer and / or inner surfaces of the workpiece 900.

[0099] In some examples, a phase change (e.g., from liquid to vapor or gas) occurs in the cleaning buffer used to clean the workpiece during heating, due to the heat generated by the work coil 706. For example, in the example system 200 in Figure 2, pump 246 establishes an elevated pressure to move a fluid (e.g., a liquid such as fluid 218 in Figure 2) through a workpiece 900, which may be a probe, and this probe has an opening that extends along the length of the probe to receive the fluid. The fluid flow rate provided by pump 246 may be substantially constant or time-dependent. The increase in pressure raises the saturation temperature of the fluid moving through the workpiece 900. As a result of the heat generated by the work coil 706 during induction heating, the temperature of the material in at least a portion of the workpiece 900 (e.g., the portion surrounded by the work coil 706) increases due to exposure to the heat of the workpiece 900. The heat generated by the work coil 706 is transmitted, for example, through the walls of the workpiece 900 (e.g., the probe). Heat is transferred to the fluid flowing through the workpiece 900. As the workpiece 900 is exposed to heat over time, the temperature of the fluid may rise to a level sufficient to reach the fluid's saturation temperature. When the fluid reaches its saturation temperature, a phase change may occur in the fluid passing through the probe. For example, the fluid passing through the portion of the workpiece 900 located within the work coil 706 may undergo a phase change and become a saturated liquid-vapor mixture due to heat transfer from the work coil through the walls of the workpiece 900 to the fluid. As the fluid flows downstream or past the region of the workpiece 900 located within the work coil 706, the temperature of the fluid drops below the saturation temperature. As a result, the vapor in the liquid-vapor mixture liquefies and returns to the liquid phase. Thus, the phase change of the fluid may be temporary and based on the fluid flow relative to the work coil 706.

[0100] As the phase change begins, bubbles form in the fluid moving through the workpiece 900 (e.g., the probe). The bubbles may form in or near the portion of the workpiece 900 that is positioned within the work coil 706. The bubbles may also form temporarily within the heated portion of the workpiece 900 surrounded by the work coil. The formation, movement, and collapse of the bubbles locally alter the movement of the fluid passing through the workpiece 900. The alteration of fluid movement due to the bubbles alters the magnitude and direction of the shear stress in the fluid. Several induction heating examples disclosed herein produce the formation, movement, and collapse of multiple bubbles, resulting in multiple (e.g., transient) surges in shear stress and changes in the direction of shear stress in the fluid, which promote and / or enhance the cleaning of the workpiece 900. Thus, in some examples disclosed herein, the cleaning of the workpiece 900 involves a combination of elevated temperature and elevated liquid shear stress. In some examples, the pump 246 in Figure 2 generates a pulsatile flow rate, which results in repeated pressure drops and promotes phase change and / or bubble effects.

[0101] For example, the pump 246 in Figure 2 can dispense a fluid (e.g., liquid) at an average rate of 1.6 mL / s, which can create an average pressure difference of 30 psig across a portion of the workpiece 900 within the work coil 706. The example fluid may include a wash buffer, mostly water. Thus, the wash buffer properties can be approximated to those of pure water. Assuming a 1 atm environment, the saturation temperature of water under these conditions is 134°C. The outer surface temperature of a portion of the workpiece 900 (e.g., the first portion 217 of the workpiece 214 in Figure 2) after preheating for 0.5 seconds at 270 W with a flow rate of 1.6 mL / s can be measured as, for example, 160°C. Therefore, the inner surface temperature of the workpiece 900 (e.g., defining the opening in the probe) is 154°C. Thus, the inner surface of the workpiece 900, and therefore the layer of fluid on the inner surface, exceeds the saturation temperature of water (and therefore the cleaning buffer), which allows for a phase change of the fluid.

[0102] The cleaning cup 800, as illustrated in Figures 8 and 9, may be made of a material capable of withstanding the heat generated by the work coil 706, such as Isoplast® plastic. The shape, size, and / or other design factors of the cleaning cup 800 may differ from those illustrated in Figures 8 and 9. For example, the design of the cleaning cup 800 may be selected based on the diagnostic instrument in which the cleaning cup 800 will be used, the size of one or more workpieces to be cleaned, and so on.

[0103] An example configuration for realizing the example system 200 is illustrated in Figures 2 to 9, but one or more of the elements, processes, and / or devices illustrated in Figures 2 to 9 can be combined, divided, rearranged, omitted, deleted, and / or realized in any other way. Furthermore, an example diagnostic instrument 202, example processors 204, 227, example power supply 206, example display 208, example GUI 209, example timer 211, example induction heater control station 210, example induction heater 212, example power drive unit 220, example induction heater controller 226, example heater board 300, example tank circuit board 302, example capacitor 306, example work coil 308, example sense coil 312, example frequency control circuit 316, example coil temperature sensor 318, example temperature monitor 322, example current monitor 324, example voltage monitor The Nita 326, an example fixed-frequency clock 330, an example drive manager 332, an example database 336, an example frequency manager 338, an example performance manager 340, an example fault monitor 344, an example communications device 346, an example variable DC power supply 400, an example switched RF current drive circuit 408, an example signal scaler 410, and / or, more generally, the example system 200 shown in Figures 2 to 9, can be implemented by hardware, software, firmware, and / or any combination of hardware, software, and / or firmware.Therefore, for example, an example diagnostic instrument 202, an example processor 204, 227, an example power supply 206, an example display 208, an example GUI 209, an example timer 211, an example induction heater control station 210, an example induction heater 212, an example power drive unit 220, an example induction heater controller 226, an example heater board 300, an example tank circuit board 302, an example capacitor 306, an example work coil 308, an example sense coil 312, an example frequency control circuit 316, an example coil temperature sensor 318, an example temperature monitor 322, an example current monitor 324, an example voltage monitor 326, and an example fixed frequency clock. 330, an example drive manager 332, an example database 336, an example frequency manager 338, an example performance manager 340, an example fault monitor 344, an example communications device 346, an example variable DC power supply 400, an example switched RF current drive circuit 408, an example signal scaler 410, and / or, more generally, any of the example systems 200 in Figures 2 to 9 may be implemented by one or more analog or digital circuits, logic circuits, programmable processors, application-specific integrated circuits (ASICs), programmable logic devices (PLDs), and / or field-programmable logic devices (FPLDs).When reading any of the device and system claims of this patent to cover pure software and / or firmware implementation forms, example diagnostic instrument 202, example processors 204, 227, example power supply 206, example display 208, example GUI 209, example timer 211, example induction heater control station 210, example induction heater 212, example power drive unit 220, example induction heater controller 226, example heater board 300, example tank circuit board 302, example capacitor 306, example work coil 308, example sense coil 312, example frequency control circuit 316, example coil temperature sensor 318, example temperature monitor 322, example current monitor 324, example electric The system 200 examples in Figures 2 to 9 may also include a pressure monitor 326, an example fixed-frequency clock 330, an example drive manager 332, an example database 336, an example frequency manager 338, an example performance manager 340, an example fault monitor 344, an example communications device 348, an example variable DC power supply 400, an example switched RF current drive circuit 408, an example signal scaler 410, and / or, more generally, at least one of the system 200 examples in Figures 2 to 9 is expressly defined herein to include a tangible computer-readable storage device or storage disk, such as memory, a digital versatile disc (DVD), a compact disc (CD), or a Blu-ray disc, for storing software and / or firmware. Furthermore, the system 200 examples in Figures 2 to 9 may also include one or more elements, processes, and / or devices in addition to, or instead of, those illustrated in Figures 2 to 9, and / or may include two or more of any or all of the illustrated elements, processes, and devices.

[0104] Flowcharts representing example machine-readable instructions for realizing the example system 200 shown in Figures 2 to 9 are shown in Figures 10 and 11. In these examples, the machine-readable instructions include a program for execution by a processor, such as the processor 227 shown in the example processor platform 1200 discussed below in relation to Figure 12. The program may be embodied in software stored on a tangible computer-readable storage medium such as a CD-ROM, floppy disk, hard drive, digital versatile disk (DVD), Blu-ray disc, or memory associated with the processor 227, but the entire program and / or parts thereof may alternatively be executed by a device other than the processor 227 and / or embodied in firmware or dedicated hardware. Furthermore, while the example program is described with reference to the flowchart illustrated in Figures 10 and 11, many other ways of realizing the example system 200 may be used alternatively. For example, the order of execution of blocks may be changed, and / or some of the described blocks may be modified, deleted, or combined.

[0105] As described above, the processes illustrated in Figures 10 and 11 can be implemented using encoded instructions (e.g., computer and / or machine-readable instructions) stored in tangible computer-readable storage media such as hard disk drives, flash memory, read-only memory (ROM), compact discs (CDs), digital versatile discs (DVDs), caches, random access memory (RAM), and / or any other storage devices or storage disks, where the information is stored for any duration (e.g., for a long time, permanently, for a short moment, for temporary buffering, and / or for caching information). As used herein, the term tangible computer-readable storage media is expressly defined to include any type of computer-readable storage device and / or storage disk, and to exclude propagating signals and transmission media. As used herein, “tangible computer-readable storage media” and “tangible machine-readable storage media” are used interchangeably. Additionally or alternatively, processes illustrating Figures 10 and 11 may be implemented using encoded instructions (e.g., computer and / or machine-readable instructions) stored in non-temporary computer and / or machine-readable media such as hard disk drives, flash memory, read-only memory, compact disks, digital multipurpose disks, caches, random access memory, and / or any other storage device or storage disk, where the information is stored for any duration (e.g., long-term, permanently, for a short moment, for temporary buffering, and / or for caching information). As used herein, the term non-temporary computer-readable media is expressly defined to include any type of computer-readable storage device and / or storage disk, and to exclude propagating signals, and to exclude transmission media. As used herein, the phrase “at least” is open-ended when used as a transition term within a claim preamble, in the same manner as the term “comprising” is open-ended.

[0106] Figure 10 depicts an example flow chart representing an example method 1000 for causing an induction heater tank circuit, such as the tank circuit 304 of the induction heater 212 in Figures 2 and 3, to resonate at a resonant frequency during the thermal cycle of the induction heater. Example method 1000 can be implemented, for example, by the induction heater controller 226 (e.g., processor 227) in Figures 2 and 3, the frequency control circuit 316 in Figures 3 and 4, and so on.

[0107] An example method 1000 includes setting a variable DC power supply to a first power setting at the start of a thermal cycle (block 1002). The start of a thermal cycle may include when a workpiece, such as the workpiece 214 in Figure 2, is positioned close to the work coil for heating. In some examples, the start of a thermal cycle is determined based on one or more user inputs to the induction heater controller 226. The drive manager 332 of the example induction heater controller 226 in Figure 3 may send a command 234 to the power drive unit 220 to set the variable DC power supply 400 in Figure 4 to a low power setting, thereby substantially limiting energy loss in the tank circuit 304, regardless of whether the tank circuit 304 is resonating at its resonant frequency.

[0108] An example method 1000 includes enabling a fixed-frequency clock (block 1004). For example, a fixed-frequency clock 330 may be enabled by a frequency manager 338, as exemplified by the induction heater controller 226 in Figure 3. Enabling the fixed-frequency clock 330 generates a fixed-frequency signal 402 that proceeds to the SYNC input pin 406 of the switched RF current drive circuit 408. The example switched RF current drive circuit 408 drives the tank circuit 304 to oscillate at a fixed frequency.

[0109] An example method 1000 includes detecting a sensing signal (block 1006). For example, when current flows through the work coil 308 in Figure 3, the work coil 308 generates a magnetic field (e.g., magnetic field 106 in Figure 1). An example sense coil 312 in Figure 3 detects the magnetic field and generates a sensing signal 314. The sensing signal 314 can be detected by a signal scaler 410, an example frequency control circuit 316 in Figure 4.

[0110] If the sensing signal 314 is not detected, exemplary method 1000 continues to drive the tank circuit 304 to resonate at a fixed frequency by the current supplied to the tank circuit 304 (e.g., block 1004). If the signal scaler 410 detects the sensing signal 314, exemplary method 1000 continues to switch to driving the tank circuit to resonate at its resonant frequency by the scaled sensing signal (block 1008).

[0111] For example, the signal scaler 410 generates a scaled sensing signal 412 by scaling (e.g., voltage scaling) the sensing signal 314 to the SYNC input pin 406. The signal scaler 410 applies a delay to the sensing signal 314 to optimize the synchronization of the current supplied to the tank circuit 304 and the current 401 already flowing through the tank circuit 304. In example method 1000, the frequency manager 338 instructs the frequency control circuit 316 to switch a switch (e.g., the SPDT switch 404 in Figure 4) to drive the switched RF current drive circuit 408 using the scaled sensing signal 412 instead of the fixed frequency signal 402.

[0112] An example method 1000 includes setting a variable DC power supply to a second power setting (block 1010). For example, the drive manager 332 of the example induction heater controller 226 in Figure 3 can send command 234 to the power drive unit 220 to set the variable DC power supply 400 in Figure 4 to a high power setting (compared to the low setting set in block 1002).

[0113] Example Method 1000 continues to allow the tank circuit 304 to resonate at its resonant frequency until it is determined that the thermal cycle has ended (block 1012). In some examples, Example Method 1000 adjusts the current supplied to the tank circuit 304 based on a sensing signal 314 generated during the induction heating of the workpiece 214, in order to allow the tank circuit 304 to continue to resonate at its resonant frequency regardless of load variations in the work coil 308 caused by the workpiece 214.

[0114] In some examples, the induction heater controller 226 determines that the thermal cycle will end based on a current signal 325 received from a current monitor 324 indicating a change in the current flow in the work coil 308. In some examples, the change in the current flow in the work coil 308 may indicate that the workpiece 214 or a portion thereof has moved out of the magnetic field. In some examples, the induction heater controller 226 determines that the thermal cycle will end based on one or more user inputs.

[0115] If the thermal cycle is to be terminated, exemplary method 1000 includes setting the configurable DC power supply to a first (e.g., low) power setting (e.g., via drive manager 332) (block 1014). Delayed, exemplary method 1000 includes turning off the configurable DC power supply (block 1016).

[0116] Example method 1000 in Figure 10 includes a determination of whether a sensing signal is detected (block 1018). For example, after the variable DC power supply is turned off, the energy in the tank circuit 304 dissipates over time, and the sense coil 312 no longer generates a sensing signal 314 that is recognized by the signal scaler 410. If the sensing signal 314 is no longer detected, example method 1000 includes switching the SYNC input pin 406 of the switched RF current drive circuit 408 so that it is driven by a fixed-frequency clock 330 (e.g., via the drive manager 332) (block 1020). After a period of time, example method 1000 includes disabling the fixed-frequency clock 330 to terminate the thermal cycle of the induction heater 212 (block 1022).

[0117] Figure 11 illustrates an example flowchart representing a method 1100 for induction heating workpieces such as those shown in Figures 2 and 5, 214 and 502, using an induction heater such as the induction heater 212 shown in Figure 2. The example method 1100 can be implemented, for example, by an induction heater controller 226 (e.g., a processor 227) shown in Figures 2 and 3.

[0118] The example method 1100 in Figure 11 begins at the start of a thermal cycle, which may be determined, for example, by user input to the induction heater controller 226. User input to start the thermal cycle causes the drive manager 332 to instruct the power drive unit 220 to, for example, supply current to the tank circuit 304 of the example induction heater 212.

[0119] An example method 1100 includes identifying the temperature profile of a portion of the workpiece to be heated (block 1102). For example, the performance manager 340 of the induction heater controller 226 can identify temperature profiles 342, 500 stored in the database 336 of Figure 3. An example temperature profile 342, 500 includes one or more heating settings for the induction heater 212 for portions 217, 219, 504, 506 of the workpiece 214, 502 to be heated. In some examples, the performance manager 340 identifies the portion temperature profiles 342, 500 based on one or more user inputs that define the characteristics 215 (e.g., size, film thickness) of the portions 217, 219, 504, 506 to be heated. In other examples, the performance manager 340 identifies the temperature profile 342 based on the position of the workpiece 214, 502 relative to the induction heater 212 (e.g., based on movement by the robot arm 221 of the diagnostic instrument 202). In other examples, the performance manager 340 identifies temperature profiles 342, 500 based on changes in current and / or voltage in the induction heater 212, detected by the current monitor 324 and / or the voltage monitor 326, respectively. In some such examples, changes such as a drop in current may indicate that different parts 217, 219, 504, 506 of the workpiece 214, 502 are positioned closer to the work coil 308 for heating.

[0120] An example method 1100 includes adjusting the resonant frequency in the tank circuit of the induction heater (block 1104). Adjusting the resonant frequency of the tank circuit can be carried out substantially as disclosed above with respect to an example method 1000 in Figure 10. For example, as disclosed above, the induction heater controller 226 and the frequency control circuit 316 allow the tank circuit 304 to resonate at its resonant frequency while the work coil 308 generates a magnetic field based on a sensing signal 314 generated by the sense coil 312. The vibration of the tank circuit 304 at its resonant frequency provides efficient heat transfer to the workpieces 214, 502.

[0121] An example method 1100 includes heating a portion of a workpiece based on a temperature profile (block 1106). For example, the induction heater 212 in Figures 2 to 4 can heat portions 217, 219, 504, and 506 of a workpiece 214, 502 over a predetermined time period at one or more heating settings based on temperature profiles 342, 500. In some examples, the induction heater controller 226 generates commands 234 to achieve the heating settings of temperature profiles 342, 500 for portions 217, 219, 504, and 506 to be heated by adjusting the current and / or power supplied to the tank circuit 304 and / or the voltage generated in the tank circuit 304.

[0122] An example method 1100 includes monitoring one or more conditions in an induction heater (block 1108). For example, an example fault monitor 344 analyzes temperature data 323 received from a temperature monitor 322, current data 325 received from a current monitor 324, and / or voltage data 327 received from a voltage monitor 326 in Figure 3. Based on this analysis, the example fault monitor 344 detects whether any of the components of the induction heater 212 has failed, and / or predicts that any of the components are likely to fail. For example, the fault monitor 344 identifies conditions that may result in, for example, overheating of the work coil 308 or a short circuit in one or more components of the frequency control circuit 316. In some examples, the fault monitor 344 compares the data 323, 325, and 327 with reference data 334 stored in the database 336 in Figure 3, for example, with respect to threshold currents and / or voltages of the tank circuit 304. The fault monitor 344 tracks performance data obtained from the induction heater 212 to identify and / or predict one or more faults in the induction heater control station 210.

[0123] An example method 1100 includes generating one or more induction state updates (block 1110). For example, if the fault monitor 344 predicts that the work coil 308 is likely to overheat, the fault monitor 344 may generate one or more instructions 346 to stop the operation of the induction heater 212. In some examples, the fault monitor 344 instructs the power drive unit 220 to adjust the current supplied to the induction heater 212, taking into account the fault prediction and / or performance tracking by the fault monitor 344. In some examples, based on the prediction, the fault monitor 344 generates present / ready data 240 and / or pass / fail data 242 for display via the GUI 209 of an example diagnostic instrument 202.

[0124] Exemplary method 1100 includes determining whether another part of the workpiece will be heated (block 1112). If another part of the work coil will be heated, Exemplary method 1100 returns to identifying the temperature profiles 342, 500 of the other part to be heated (e.g., block 1102). Exemplary method 1100 adjusts the resonant frequency in the tank circuit based on changes in the resonant frequency due to load variations in the tank circuit in order to efficiently heat the part of the workpiece (e.g., blocks 1104, 1106). Load variations may result from the introduction of other parts into the tank circuit that have one or more different characteristics from the part previously heated by the induction heater. If another part of the workpiece will not be heated, Exemplary method 1100 terminates.

[0125] Figure 12 is a block diagram of an example processor platform 1200 that can execute the instructions in Figures 10 and 11 to realize the example system 200 in Figures 2 to 9. The processor platform 1200 could be, for example, a server, a personal computer, a mobile device (e.g., a mobile phone, a smartphone, a tablet such as iPad®), a personal digital assistant (PDA), an internet appliance, a medical diagnostic instrument 202, or any other type of computing device.

[0126] The illustrated example processor platform 1200 includes a processor 227. The illustrated example processor 227 is hardware. For example, the processor 227 may be implemented by one or more integrated circuits, logic circuits, microprocessors, or controls from any desired family or manufacturer.

[0127] The illustrated example processor 227 includes local memory 1213 (e.g., a cache). The illustrated example processor 227 is in communication with main memory, which includes volatile memory 1214 and non-volatile memory 1216, via bus 1218. The volatile memory 1214 can be implemented by synchronous dynamic random access memory (SDRAM), dynamic random access memory (DRAM), RAMBUS dynamic random access memory (RDRAM), and / or any other type of random access memory device. The non-volatile memory 1216 can be implemented by flash memory and / or any other desired type of memory device. Access to main memory 1214, 1216 is controlled by a memory controller.

[0128] The illustrated example processor platform 1200 also includes an interface circuit 1220. The interface circuit 1220 can be implemented by any type of interface standard, such as an Ethernet interface, a Universal Serial Bus (USB), and / or a PCI Express interface.

[0129] In the illustrated example, one or more input devices 1222 are connected to the interface circuit 1220. The input devices 1222 allow the user to input data and commands to the processor 227. The input devices may be, for example, audio sensors, microphones, cameras (still or video), keyboards, buttons, mice, touchscreens, trackpads, trackballs, IsoPoint, speech recognition systems, and / or medical diagnostic instruments 202.

[0130] One or more output devices 1224 are also connected to the interface circuit 1220 of the illustrated example. The output devices 1224 may be implemented, for example, by a display device (e.g., a light-emitting diode (LED), an organic light-emitting diode (OLED), a liquid crystal display, a cathode ray tube (CRT), a touchscreen, a haptic output device, a printer, and / or a speaker), a power drive unit 220, a frequency control circuit 316, and an induction heater 212. The interface circuit 1220 of the illustrated example therefore typically includes a graphics driver card, a graphics driver chip, or a graphics driver processor.

[0131] The illustrated example interface circuit 1220 also includes communication devices such as transmitters, receivers, transceivers, modems, and / or network interface cards to facilitate the exchange of data with external machines (e.g., any kind of computing device) over a network 1226 (e.g., Ethernet connection, digital subscriber line (DSL), telephone line, coaxial cable, mobile phone system, etc.).

[0132] The illustrated example processor platform 1200 also includes one or more mass storage devices 1228 for storing software and / or data. Examples of such mass storage devices 1228 include floppy disk drives, hard drive disks, compact disk drives, Blu-ray disk drives, RAID systems, and digital multipurpose devices.

[0133] Encoded instructions 1232 for implementing the example methods shown in Figures 10 and 11 may be stored in a mass storage device 1228, in volatile memory 1214, in non-volatile memory 1216, and / or on a removable tangible computer-readable storage medium such as a CD or DVD.

[0134] From the foregoing, it is understood that the above systems, methods, and apparatus provide control and monitoring of the performance of an induction heater in order to reduce biocarryover by one or more workpieces (e.g., probes) due to induction heating. Examples disclosed herein take into account manufacturing variations and / or aging degradation of the electrical components of the induction heater by enabling the tank circuit to resonate at its resonant frequency rather than a fixed frequency. Furthermore, examples disclosed herein dynamically respond to load variations in the induction heater, for example, due to the introduction of a workpiece into the induction heater, the positioning of the workpiece relative to the induction heater, and the characteristics of different parts of the workpiece to be heated. Some such examples adjust the current supplied to the tank circuit of the induction heater in response to changes in the resonant frequency of the tank circuit as a result of the presence of a workpiece. Some disclosed examples provide improved reliability of the induction heater through waste heat management techniques that reduce the risk of overheating and / or through predictive failure analysis. Examples disclosed herein can be implemented using diagnostic instruments (e.g., chemical analyzers) and provide a system for efficiently analyzing samples and conveniently cleaning tools used to perform analyses without requiring separate cleaning equipment.

[0135] While specific example methods, apparatuses, and articles are disclosed herein, the scope of this patent is not limited thereto. Conversely, this patent encompasses all methods, apparatuses, and articles that fairly fall within the scope of the claims herein.

Claims

1. It is a system, An induction heater including a tank circuit, A controller is used to drive the tank circuit and selectively vibrate it at its resonant frequency in order to induce heating of a workpiece placed in close proximity to the tank circuit. A system equipped with these features.

2. The system according to claim 1, wherein the controller drives the tank circuit to selectively vibrate at a resonant frequency based on the characteristics of the workpiece.

3. The system according to claim 1, wherein the controller drives the tank circuit to selectively vibrate between a resonant frequency and a fixed frequency.

4. The system according to claim 1, wherein the tank circuit includes a work coil and a sense coil, and the sense coil is wound around the work coil.

5. The system according to claim 1, wherein the controller drives the tank circuit to vibrate at a resonant frequency based on a signal generated by a sense coil.

6. The system according to claim 1, further comprising a heat sink coupled to an induction heater.

7. The system according to claim 1, further comprising a shield containing a thermally conductive material, which is coupled to an induction heater.

8. The system according to claim 1, wherein the tank circuit includes a work coil, and the work coil is disposed within a cleaning cup.

9. The system according to claim 8, wherein the workpiece is exposed to a fluid during induction heating.

10. The system according to claim 8, wherein the fluid undergoes a phase change during induction heating.

11. The controller, Access at least one of the following from the induction heater: temperature data, current data, or voltage data. The system according to claim 1, which predicts the performance conditions of an induction heater based on data.

12. The system according to claim 1, wherein the workpiece includes a first part and a second part, and the controller selectively adjusts the heating settings in the tank circuit for the first part and the second part.

13. The system according to claim 12, wherein the controller adjusts the heating settings for the first part based on a first temperature profile for the first part and adjusts the heating settings for the second part based on a second temperature profile for the second part.

14. It is a method, By executing instructions using a processor, current is supplied to the induction heater, including the tank circuit. By executing instructions using a processor, the tank circuit is driven to selectively oscillate at the tank circuit's resonant frequency, Induction heating of a workpiece placed in close proximity to the tank circuit and Methods that include...

15. The method according to claim 14, wherein the tank circuit is driven to selectively vibrate at a resonant frequency, based on the characteristics of the workpiece.

16. A tangible computer-readable medium containing instructions, wherein, when the instructions are executed, the processor will have at least By supplying current to the induction heater, including the tank circuit, The tank circuit is driven and selectively vibrated at its resonant frequency to induce heating of the workpiece placed in close proximity to the tank circuit. A tangible computer-readable medium.

17. The tangible computer-readable medium according to claim 16, wherein, when an instruction is executed, the processor further drives a tank circuit to selectively vibrate at a resonant frequency based on the characteristics of the workpiece.

18. The tangible computer-readable medium according to claim 16, wherein, when an instruction is executed, the processor further drives a tank circuit to selectively oscillate between a resonant frequency and a fixed frequency.

19. The tangible computer-readable medium according to claim 16, wherein the workpiece comprises a first part and a second part, and when an instruction is executed, it causes a processor to further selectively adjust the heating settings in a tank circuit for the first part and the second part.

20. The tangible computer-readable medium according to claim 19, wherein, when an instruction is executed, the processor further causes the processor to adjust the heating settings for the first part based on a first temperature profile for the first part, and adjust the heating settings for the second part based on a second temperature profile for the second part.

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