Electronic devices and methods for manufacturing electronic devices

Abstract

Ensuring quality. [Solution] The device comprises a substrate (imaging substrate 12), a shield case 24 that surrounds the substrate and forms an internal region IN together with the substrate, an insert resin (R) that fills the internal region IN, and an air reservoir structure 25 that stores air, positioned above the filling of the insert resin (R) in the internal region IN.

Description

Technical Field

[0001] The present invention relates to an electronic device and a method for manufacturing an electronic device.

Background Art

[0002] For example, Patent Document 1 discloses an imaging device module. This imaging device module includes an image sensor substrate, an image sensor mounted on the image sensor substrate, a cylindrical lens holding member fixed to the image sensor substrate and holding a lens that condenses light onto the image sensor, and a molded resin that surrounds from the side surface of the lens holding member to the image sensor substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In an electronic device, there is a configuration including a substrate and a shield case surrounding the substrate, and filling a resin in an internal region formed by the substrate and the shield case. In such an electronic device, when the filling pressure of the resin is excessively high, there is a risk that pressure is applied to the internal region, causing deformation or breakage of the substrate. Also, in such an electronic device, when the filling pressure of the resin is excessively low, voids may occur in the internal region, which may hinder the heat conduction performance for heat dissipation. Thus, in conventional electronic devices, it is not easy to stably ensure quality.

[0005] An object of the present invention is to provide an electronic device and a method for manufacturing an electronic device that can ensure quality.

Means for Solving the Problems

[0006] To achieve the above objective, an electronic device according to one aspect of the present invention comprises a substrate, a shield case surrounding the substrate and forming an internal region together with the substrate, an insert resin filled in the internal region, and an air reservoir structure for accumulating air, positioned above the filling of the insert resin in the internal region.

[0007] To achieve the above objective, a method for manufacturing an electronic device according to one aspect of the present invention comprises a substrate, a shield case surrounding the substrate and forming an internal region together with the substrate, an insert resin to be filled into the internal region, and an air reservoir structure for accumulating air positioned above the filling of the insert resin in the internal region, the method for manufacturing an electronic device comprising the steps of arranging the substrate, the shield case, and the air reservoir structure, and then filling the internal region with the insert resin. [Effects of the Invention]

[0008] This invention can ensure quality. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a front view perspective of the electronic device according to the embodiment. [Figure 2] Figure 2 is a rear-view perspective view of the electronic device according to the embodiment. [Figure 3] Figure 3 is a plan view of the electronic device according to the embodiment. [Figure 4] Figure 4 is a cross-sectional view of the electronic device according to the embodiment (cross-sectional view at position AA in Figure 3). [Figure 5] Figure 5 is a rear view perspective of the substrate unit of the electronic device according to the embodiment. [Figure 6] Figure 6 is a plan view of the circuit board unit of the electronic device according to the embodiment. [Figure 7] Figure 7 is a front view perspective of the frame portion of the electronic device according to the embodiment. [Figure 8] Figure 8 is a cross-sectional view of the electronic device according to the embodiment (cross-sectional view of the BB position in Figure 4). [Figure 9] FIG. 9 is a process diagram of a method for manufacturing an electronic device according to an embodiment. [Figure 10] FIG. 10 is a process diagram of a method for manufacturing an electronic device according to an embodiment. [Figure 11] FIG. 11 is a process diagram of a method for manufacturing an electronic device according to an embodiment. [Figure 12] FIG. 12 is a flowchart diagram of a method for manufacturing an electronic device according to an embodiment. [Figure 13] FIG. 13 is a cross-sectional view of another example of an electronic device according to an embodiment (cross-sectional view taken along the line B-B in FIG. 4). [Figure 14] FIG. 14 is a cross-sectional view of another example of an electronic device according to an embodiment (cross-sectional view taken along the line B-B in FIG. 4). [Figure 15] FIG. 15 is a cross-sectional view of another example of an electronic device according to an embodiment (cross-sectional view taken along the line B-B in FIG. 4). [Figure 16] FIG. 16 is a cross-sectional view of another example of an electronic device according to an embodiment (cross-sectional view taken along the line B-B in FIG. 4). [Figure 17] FIG. 17 is a cross-sectional view of another example of an electronic device according to an embodiment (cross-sectional view taken along the line B-B in FIG. 4). [Figure 18] FIG. 18 is a cross-sectional view of another example of an electronic device according to an embodiment (cross-sectional view taken along the line B-B in FIG. 4).

DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments for implementing the invention (hereinafter referred to as embodiments) will be described in detail with reference to the drawings. Note that the present invention is not limited by the following embodiments. Also, the components in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those within the so-called equivalent range. Furthermore, the components disclosed in the following embodiments can be combined as appropriate.

[0011] FIGS. 1 to 4 show an electronic device according to this embodiment. FIGS. 5 to 8 show a substrate unit of the electronic device according to this embodiment.

[0012] In this embodiment, the camera module 1 will be described as an example of an electronic device. And the camera module 1 of the embodiment is fixed, for example, inside and outside a vehicle that is an attachment target. The camera module 1 includes a camera unit 10 that is a substrate unit, a frame portion 20, and an exterior resin 30.

[0013] Here, in the following description, each direction is defined based on the optical axis O of the camera module 1. Specifically, the direction along (parallel to) the optical axis O is defined as the front-rear direction X, the direction in which the lens 11A faces is "front", and the opposite direction of the front is "rear". Also, the direction that is horizontally orthogonal to the front-rear direction X is defined as the width direction Y. Further, the direction that is orthogonal to the front-rear direction X and the width direction Y is defined as the vertical direction Z, the direction facing upward is "upward", and the direction facing downward is "downward". The front-rear direction X, the width direction Y, and the vertical direction Z are orthogonal in three dimensions.

[0014] As shown in FIGS. 4 to 8, the camera unit 10 includes a lens unit 11, an imaging substrate (substrate) 12, and an optical axis reference portion 13.

[0015] The lens unit 11 holds the lens 11A. As shown in FIG. 4, the lens unit 11 includes a lens 11A, a lens defining portion 11B, and a lens holding portion 11C. The lens 11A has an optical axis O that extends parallel along the front-rear direction X at the center of a disk shape. The lens defining portion 11B defines the optical axis O of the lens 11A. The lens defining portion 11B is formed in a cylindrical shape so that the optical axis O passes through the inside, and by the front surface thereof abutting against the rear surface of the lens 11A, the optical axis O of the lens 11A is defined. The lens holding portion 11C holds the lens 11A together with the lens defining portion 11B. The lens holding portion 11C is formed in a ring shape so that the optical axis O passes through the inside, and by meshing and tightening the female screw 11Ca on the inner peripheral surface thereof with the male screw 11Ba on the outer peripheral surface of the lens defining portion 11B, it functions to press the rear surface of the lens 11A against the front surface of the lens defining portion 11B.

[0016] The imaging substrate 12 is formed in the shape of a rectangular plate with thickness in the front-to-back direction X and planes facing in each direction in the up-and-down direction Z and each direction in the width direction Y. An image sensor 12A, which is an electronic component, is mounted on the front surface of the imaging substrate 12. The image sensor 12A has a center that coincides with the optical axis O of the lens portion 11. A cylindrical connection terminal 12B extending in the front-to-back direction X is fixed to the rear surface of the imaging substrate 12. In addition, although not explicitly shown in the figure, other electronic components that constitute the circuit are mounted on the front and rear surfaces of the imaging substrate 12.

[0017] The optical axis reference unit 13 is fixed to the lens unit 11 and the imaging substrate 12, and aligns the optical axis O of the lens 11A with the center of the image sensor 12A. The optical axis reference unit 13 includes a positioning unit 13A and a fixing unit 13B.

[0018] The fixing part 13B is formed in a cylindrical shape to fix the lens part 11 inside. The fixing part 13B defines the position of the lens part 11 in two dimensions, in the width direction Y and the vertical direction Z, relative to itself by engaging the female thread 13Ba on its inner circumference with the male thread 11Bb on the outer circumference of the lens defining part 11B of the lens part 11. Furthermore, the fixing part 13B defines the position of the lens part 11 in the front-to-back direction X relative to itself by adjusting the tightness of the engagement between the female thread 13Ba and the male thread 11Bb.

[0019] The fixing part 13B is fixed to the imaging substrate 12 by adhesive 13C on the side opposite to the lens 11A of the fixed lens part 11 in the front-to-back direction X. When fixing the fixing part 13B to the imaging substrate 12, the optical axis O of the lens 11A and the center of the image sensor 12A are aligned. For this reason, the optical axis reference part 13 has a positioning part 13A.

[0020] Multiple positioning sections 13A are provided on the outer circumference of the fixed section 13B (four locations in the embodiment). The positioning sections 13A are provided around the optical axis O of the lens 11A of the fixed lens section 11. The positioning sections 13A are provided at a total of four equal intervals (two locations in the embodiment) in the width direction Y and the vertical direction Z, which are perpendicular to the optical axis O (front-to-back direction X) of the lens 11A, with the optical axis O of the lens 11A as the center. Therefore, all positioning sections 13A coincide in the front-to-back direction X with respect to the optical axis O. In the vertical direction Z, the two upper positioning sections 13A that are aligned in the width direction Y are formed as recesses that open upwards. Also, in the vertical direction Z, the two lower positioning sections 13A that are aligned in the width direction Y are formed as recesses that open downwards.

[0021] The optical axis reference unit 13 is installed on a focus adjustment jig (not shown) with the lens unit 11 fixed to the fixing unit 13B, so that the projection of the focus adjustment jig fits into the positioning unit 13A. Thus, the optical axis reference unit 13 is installed on the focus adjustment jig so that the optical axis O of the lens 11A of the lens unit 11 is aligned with the focus adjustment chart (not shown) of the focus adjustment jig. The optical axis O of the lens 11A can be adjusted to match the focus adjustment chart by adjusting the tightness of the engagement between the female screw 13Ba of the fixing unit 13B and the male screw 11Bb of the lens reference unit 11B. In addition, with the optical axis reference unit 13 installed on the focus adjustment jig, the center of the image sensor 12A is aligned with the focus adjustment chart, and the image substrate 12 is fixed with adhesive 13C. In this way, the optical axis reference unit 13 is fixed to the lens unit 11 and the image substrate 12, so that the optical axis O of the lens 11A and the center of the image sensor 12A are aligned. As stated above, the front-to-back X direction adjustment of the lens 11A can be adjusted to match the focus adjustment chart by adjusting the tightness of the engagement between the female screw 13Ba of the fixing part 13B and the male screw 11Bb of the lens reference part 11B. However, adjustment may also be made by using adhesive to suspend and fix the image substrate 12 and the optical axis reference part 13 without using screws.

[0022] Therefore, the camera unit 10 is assembled with the optical axis O of the lens 11A and the center of the image sensor 12A aligned, using the positioning part 13A of the optical axis reference part 13 as a reference. Although not shown in the diagram, there are actually multiple lenses inside the lens reference part 11B, and together with the lens 11A, multiple lenses form a lens assembly, and the optical axis O determined by these multiple lenses is aligned with the center of the image sensor 12A.

[0023] Returning to the description of camera module 1, as shown in Figures 1 to 4, the frame portion 20 is positioned behind the camera unit 10. The frame portion 20 includes a base portion 21, a connector portion 22, a locking portion 23, a shield case 24, and a wall member 25A (air reservoir structure 25).

[0024] The base portion 21 is molded from a synthetic resin material and has a predetermined thickness in the front-to-back direction X, and is formed in a rectangular plate shape with planes facing in each direction in the width direction Y and each direction in the up-and-down direction Z. The base portion 21 has a positioning portion 21A.

[0025] The positioning portions 21A are provided at a total of four locations (two in the embodiment) at equal intervals in the width direction Y on a plane facing each direction in the vertical direction Z. In the upper plane in the vertical direction Z, the two upper positioning portions 21A aligned in the width direction Y are formed as recesses that open upward. In the lower plane in the vertical direction Z, the two lower positioning portions 21A aligned in the width direction Y are formed as recesses that open downward.

[0026] The connector portion 22 is integrally provided with the base portion 21 and is formed in a cylindrical shape that extends toward the rear. Inside the cylindrical shape of the connector portion 22 is a connecting fitting 22A that connects to a connection terminal 12B (contacted member) fixed to the imaging substrate 12. The connecting fitting 22A extends forward from the connector portion 22 through the base portion 21 and is electrically connected to the connection terminal 12B of the camera unit 10 at the rear of the imaging substrate 12.

[0027] The locking portion 23 is integrally provided with the base portion 21 and is positioned along the connector portion 22. The locking portion 23 is formed as a projection into which the claws of a connector (not shown) of a cable such as a recording device, which is inserted into the connector portion 22 and electrically connected to the connecting fitting 22A, engage.

[0028] The shield case 24 is formed of an elastic metal plate and includes a main plate 24A, a plurality of plate pieces 24B, and through holes 24C, as shown in Figures 4, 7, and 8.

[0029] The main plate 24A is formed in a rectangular shape with thickness in the front-to-back direction X, and two sides facing each direction in the up-and-down direction Z and two sides facing each direction in the width direction Y. The main plate 24A is formed in a rectangular shape that is slightly larger than the rectangular shape of the imaging substrate 12. The main plate 24A is positioned with its front surface facing the rear surface (one of the plate surfaces) of the imaging substrate 12. The main plate 24A is fixed by the connecting fitting 22A passing through it.

[0030] The plate pieces 24B are formed by bending each side around the main plate 24A and extending forward. Therefore, in this embodiment, the plate pieces 24B are formed at four locations around the main plate 24A. The plate piece 24B has first plate pieces 24BA that are bent and extend from each side in the width direction Y of the rectangular main plate 24A, and second plate pieces 24BB that are bent and extend from each side in the vertical direction Z of the rectangular main plate 24A. Therefore, the plate pieces 24B alternately have first plate pieces 24BA and second plate pieces 24BB around the rectangular main plate 24A. Each first plate piece 24BA is formed so that the length extending from the side of the main plate 24A is longer than the length of each second plate piece 24BB that extends from the side of the main plate 24A. In this way, the plate pieces 24B are formed with different lengths extending from the main plate 24A.

[0031] Each first plate piece 24BA has a tongue portion 24Ba that extends outward at its extended tip. The tongue portion 24Ba is formed by bending it outward, for example, at a 45-degree angle to the plate surface of the first plate piece 24BA. Each first plate piece 24BA also has a bulging portion 24Bb that expands inward along its extension. The bulging portion 24Bb extends in the direction in which the first plate piece 24BA extends, and the cross-sectional shape intersecting that direction of extension is formed by bulging inward in an arc shape. Furthermore, each first plate piece 24BA has bent portions 24Bc on both sides adjacent to the second plate piece 24BB in the circumferential direction of the main plate 24A, which are bent so as to overlap the side edges of the second plate piece 24BB from the outside.

[0032] Each second plate piece 24BB has a tongue portion 24Ba bent outward at its extended tip. The tongue portion 24Ba is formed by bending it outward, for example, at 45 degrees relative to the plate surface of the second plate piece 24BB. Each second plate piece 24BB also has a bulging portion 24Bb that expands inward along its extension. The bulging portion 24Bb extends in the direction in which the second plate piece 24BB extends, and the cross-sectional shape intersecting that direction of extension is formed by bulging inward in an arc shape. Each second plate piece 24BB also has projections 24Bd on both ends where the bent portion 24Bc of the first plate piece 24BA overlaps, projecting toward the bent portion 24Bc. The projections 24Bd are not limited to the second plate piece 24BB, but may also be provided on the first plate piece 24BA so as to project toward the second plate piece 24BB on the bent portion 24Bc that overlaps the side end of the second plate piece 24BB.

[0033] The plate piece 24B has alternating first plate pieces 24BA and second plate pieces 24BB around a rectangular main plate 24A facing the rectangular imaging substrate 12. However, for example, the first plate pieces 24BA and second plate pieces 24BB may be alternating around a hexagonal main plate 24A facing the hexagonal imaging substrate 12. That is, the plate piece 24B has alternating first plate pieces 24BA and second plate pieces 24BB around an even-sided main plate 24A.

[0034] Each plate piece 24B makes elastic contact with the peripheral edge of the imaging substrate 12. As shown in Figure 8, the imaging substrate 12 has a recess 12C formed at its peripheral edge so that a protective film made of resin or the like is peeled off, exposing the ground electrode. Each plate piece 24B has a bulge 24Bb that fits into the recess 12C and makes elastic contact with the peripheral edge of the imaging substrate 12. In addition, each plate piece 24B is formed with a sharp bend from the main plate 24A so that the tip side (tongue 24Ba side) faces inward beforehand, in order to generate an elastic force that contacts the peripheral edge of the imaging substrate 12.

[0035] The through-hole 24C penetrates the shield case 24 both internally and externally. The through-hole 24C is formed by cutting out a corner portion of the main plate 24A and the base end of each circumferentially adjacent plate piece 24B that bends from the main plate 24A. This through-hole 24C is provided to penetrate the box-shaped shield case 24, which consists of the main plate 24A and each plate piece 24B, connecting the inside and the outside.

[0036] The shield case 24 is supported by the camera unit 10 by sandwiching the imaging substrate 12 of the camera unit 10 between opposing plate pieces 24B. At this time, in the internal region IN of the shield case 24, which is partitioned by the shield case 24 and the imaging substrate 12, the connecting fitting 22A of the connector part 22 is connected to the connection terminal 12B of the imaging substrate 12.

[0037] In this type of shield case 24, the shielding effect is enhanced by having multiple plate pieces 24B that contact the peripheral edge of the imaging substrate 12, such that a portion of one plate piece 24B overlaps the outer surface of the other plate piece 24B that is adjacent in the circumferential direction. As a result, this shield case 24 can achieve further improvement in electromagnetic compatibility. In particular, in this shield case 24, each plate piece 24B that is adjacent in the circumferential direction is formed with a different length extending from the main plate 24A. Therefore, when contacting the peripheral edge of the imaging substrate 12, the longer plate piece 24BA makes contact first and spreads outward, and then the shorter plate piece 24BB makes contact with the peripheral edge of the imaging substrate 12 and spreads outward, thus avoiding interference between the overlapping portions of adjacent plate pieces 24B.

[0038] As shown in Figures 4, 7, and 8, the wall member 25A is positioned in the internal region IN of the shield case 24, which is partitioned by the shield case 24 and the imaging substrate 12. As shown in Figure 4, the wall member 25A is positioned on the upper side in the vertical direction Z within the internal region IN. The wall member 25A is molded integrally with the base portion 21 of the frame portion 20 from a synthetic resin material and is formed to extend forward through the main plate 24A of the shield case 24. Therefore, the wall member 25A is positioned in the internal region IN of the shield case 24, extending forward from the main plate 24A without any gaps for a length L. It is desirable that the wall member 25A, as shown in Figure 4, is positioned in the internal region IN from the main plate 24A of the shield case 24 to the rear surface of the imaging substrate 12.

[0039] Furthermore, as shown in Figure 7, the wall member 25A is formed so that a portion of it protrudes from the internal region IN to the external region OUT through a notch 24D provided in the upper second plate piece 24BB of the shield case 24. Therefore, as shown in Figure 8, the wall member 25A is positioned in the internal region IN of the shield case 24, extending downward from the upper second plate piece 24BB at a height T. As mentioned above, the second plate piece 24BB is formed with a sharp bend from the main plate 24A so that it faces inward, in order to contact the peripheral edge of the imaging substrate 12 by elastic force. Accordingly, the notch 24D is provided to prevent the wall member 25A from interfering with the movement of the second plate piece 24BB, and to ensure that the wall member 25A extends downward from the second plate piece 24BB without any gap at a height T. Also, if the shield case 24 is first positioned to contact the peripheral edge of the imaging substrate 12, and then the frame portion 20 is assembled to the shield case 24, the notch 24D is unnecessary.

[0040] Furthermore, as shown in Figure 8, it is preferable that at least one (multiple in the embodiment: two locations) wall members 25A are arranged side by side in the internal region IN of the shield case 24 with a spacing W in the width direction Y. Thus, in the camera module 1 of the embodiment, the wall members 25A form a box-like structure in the inner region IN with a length L (see Figure 4), height T (see Figure 8), and spacing W (see Figure 8), including the main plate 24A and the upper second plate piece 24BB of the shield case 24 and the imaging substrate 12, and opening only downwards.

[0041] Although the wall member 25A described above is molded integrally with the base 21 of the frame 20 using synthetic resin material, this is not limited to this. For example, although not shown in the figure, the wall member 25A may be made of a metal plate, like the shield case 24, and may be integrally formed with the shield case 24 by welding without any gaps.

[0042] Returning to the description of camera module 1, as shown in Figures 1 to 4, the exterior resin 30 is formed by insert molding so as to cover the outside of the lens portion 11, imaging substrate 12, and optical axis reference portion 13 of the camera unit 10. The exterior resin 30 is integrally formed from a main exterior resin 31 that covers the outside of the imaging substrate 12 and the optical axis reference portion 13, and a sub-exterior resin 32 that covers the outside of the lens portion 11.

[0043] The main exterior resin 31 is formed of an insert resin (also called a molded resin) R, which will be described later, and as shown in Figure 4, it is provided in front of the base portion 21 of the frame portion 20, in the external region OUT of the shield case 24, covering the outer circumference of the optical axis reference portion 13 and the outer circumference of the adhesive 13C, and extending into the internal region IN of the shield case 24. Furthermore, as shown in Figure 5, the main exterior resin 31 is provided so that the exterior reference portion 31A, which fits into the positioning portion 13A of the optical axis reference portion 13, is exposed to the outside.

[0044] The sub-exterior resin 32 is formed integrally with the main exterior resin 31 using an insert resin R, and as shown in Figure 4, it is provided to continuously cover the outer circumference of a part of the lens holding portion 11C of the lens portion 11, the outer circumference of a part of the lens regulating portion 11B, and the outer circumference of a part of the optical axis reference portion 13 in the front-to-back direction X.

[0045] Therefore, the exterior resin 30 continuously covers the outer periphery of the camera module 1 in the front-to-back direction X, from the lens holding portion 11C of the lens portion 11 to the frame portion 20.

[0046] Figures 9 to 12 show a method for manufacturing a camera module according to an embodiment.

[0047] The camera module 1 is molded by placing the camera unit 10 and frame portion 20, which are insert parts, into the insert mold 50 shown in Figure 9, and filling the insert mold 50 with insert resin R as shown in Figure 11. The insert mold 50 includes a lower mold 50A and an upper mold 50B.

[0048] As shown in Figure 9, the lower mold 50A has a cavity 51 and engagement holes 52. The cavity 51 is where the camera unit 10 and the frame portion 20 are positioned, and is filled with insert resin R as shown in Figure 11. The cavity 51 has a reference portion 51A that protrudes from its inner surface and fits into the positioning portion 13A of the optical axis reference portion 13 in the camera unit 10. The cavity 51 also has a reference portion 51B that fits into the positioning portion 21A of the base portion 21 of the frame portion 20 in the camera module 1. The engagement holes 52 engage with each other via guides (not shown) that are inserted together into the engagement holes 52 of the upper mold 50B.

[0049] As shown in Figure 9, the upper mold 50B has a cavity 51 and an engagement hole 52. The cavity 51 is where the camera unit 10 and the frame portion 20 are placed, and is filled with insert resin R as shown in Figure 11. The cavity 51 has a reference portion 51A that protrudes from its inner surface and fits into the positioning portion 13A of the optical axis reference portion 13 in the camera unit 10. The cavity 51 also has a reference portion 51B that fits into the positioning portion 21A of the base portion 21 of the frame portion 20 in the camera module 1. The engagement holes 52 engage with each other via guides (not shown) that are inserted together into the engagement holes 52 of the lower mold 50A.

[0050] When the camera unit 10 is placed in the insert mold 50, the frame portion 20 is assembled in advance. Therefore, the camera unit 10 and the frame portion 20 assembled to the camera unit 10 are positioned and placed in the cavities 51 of the lower mold 50A and upper mold 50B by fitting their respective positioning portions 13A and 21A to the reference portions 51A and 51B. In the camera unit 10, the optical axis O of the lens 11A and the center of the image sensor 12A are aligned by the positioning portion 13A, and the optical axis O of the lens 11A is positioned relative to the cavities 51 of the lower mold 50A and upper mold 50B by fitting this positioning portion 13A to the reference portion 51A.

[0051] Then, the lower mold 50A and the upper mold 50B engage their mutual engagement holes 52, thereby positioning the optical axis O of the lens 11A relative to their respective cavities 51, and the camera unit 10 is positioned accordingly.

[0052] As shown in Figure 12, the manufacturing method of the camera module 1 involves assembling the lens unit 11, imaging substrate 12, and optical axis reference unit 13 as a camera unit 10 based on the positioning unit 13A in step S1 (see Figure 10). By assembling the camera unit 10 based on the positioning unit 13A of the optical axis reference unit 13, the optical axis O of the lens 11A and the center of the image sensor 12A are aligned. That is, in step S1, the camera unit 10 and the frame unit 20 are assembled, and in the internal region IN of the shield case 24, which is partitioned by the shield case 24 and the imaging substrate 12, the connecting fitting 22A of the connector unit 22 is connected to the connection terminal 12B of the imaging substrate 12.

[0053] Next, as shown in Figure 12, in step S2, the camera unit 10 is positioned in the insert mold 50 by fitting the positioning portion 13A of the camera unit 10 into the reference portion 51A of the insert mold 50 (see Figure 10). As described above, the camera unit 10 is positioned relative to the insert mold 50 by fitting the positioning portion 13A into the reference portion 51A.

[0054] Next, as shown in Figure 12, in step S3, the insert resin R is filled into the insert mold 50. The filled insert resin R becomes the outer resin 30 of the camera module 1. The outer resin 30 is then fitted together with the positioning portion 13A and the reference portion 51A to form the outer reference portion 31A. Since the reference portion 51A is formed protruding from the inner surface of the cavity 51, the outer reference portion 31A formed at the point where the reference portion 51A is fitted with the positioning portion 13A appears as a recessed trace on the outside of the outer resin 30. In step S3, the insert resin R filled into the insert mold 50 covers the outer region OUT of the shield case 24 and enters the inner region IN of the shield case 24 through the through hole 24C, filling the space between the main plate 24A and the imaging substrate 12.

[0055] The insert mold 50 in this embodiment is divided into upper and lower halves. At the boundary between the lower mold 50A and the upper mold 50B, a gate (not shown) into which the insert resin R is injected is located on the right side of Figure 11, which is one side of the width direction Y, and an air gate into which voids and a portion of the insert resin R are discharged is located on the left side of Figure 11, which is the other side of the width direction Y. The insert resin R is injected into the cavity 51 through the gate under pressure from an injection machine (not shown in the figure).

[0056] Then, as shown by the arrows in Figure 11, the insert resin R, which is press-in from the gate side, abuts against the first plate piece 24BA on the right in the outer region OUT, flows around the shield case 24, and reaches the air gate. Also, in the outer region OUT, as the insert resin R flows around the shield case 24, it enters the inner region IN through the upper and lower through holes 24C on the right. In the inner region IN, the insert resin R is filled from below by gravity and rises, exiting the outer region OUT through the upper and lower through holes 24C on the left and reaching the air gate. In this way, the camera module 1 is formed by filling the outer region OUT and the inner region IN with insert resin R and molding the outer resin 30.

[0057] Furthermore, voids are generated in the inner region IN during the filling process of the insert resin R. If voids are generated irregularly in the inner region IN, the thermal conductivity of the outer resin 30 decreases, impairing heat dissipation. Conventionally, this is done by increasing the amount of insert resin R injected, but this can result in excessive pressure pushing the shield case 24 and the imaging substrate 12 outward, potentially causing deformation or breakage of the imaging substrate 12, which may bend outward.

[0058] In contrast, the camera module 1 of this embodiment has a wall member 25A (air reservoir structure 25) provided on the upper side of the inner region IN. This wall member 25A acts as a barrier for filling the insert resin R on the upper side of the inner region IN, guiding and controlling the flow of the insert resin R downwards and collecting and accumulating voids. Therefore, the camera module 1 forms an air reservoir S at the position of the wall member 25A, in this embodiment, at a specific position between two wall members 25A. This air reservoir S has a buffering function and alleviates the pressure that pushes the shield case 24 and the imaging substrate 12 outward in the inner region IN. As a result, the camera module 1 of this embodiment can avoid deformation or breakage that causes the imaging substrate 12 to bend outward. Moreover, the camera module 1 of this embodiment can densely fill the inner region IN with the insert resin R, improving heat dissipation. As a result, the camera module 1 of this embodiment can ensure quality.

[0059] In the camera module 1 of this embodiment, the air reservoir S is determined by the length L (see Figure 4), height T (see Figure 8), and spacing W (see Figure 8) of the wall members 25A in the inner region IN. Therefore, the effect of mitigating the pressure that pushes the shield case 24 and the imaging substrate 12 outward can be controlled by the length L, height T, and spacing W of these wall members 25A.

[0060] Here, Figures 13 to 18 show other examples of camera module (electronic device) 1.

[0061] In the embodiment shown in Figure 13, the camera module 1 replaces the air reservoir structure 25 with a buffer member 25B instead of a wall member 25A. The buffer member 25B is, for example, a structure that can hold air, such as a sponge or nonwoven fabric, and can deform when a predetermined pressure is exceeded. The buffer member 25B is positioned above the internal region IN, similar to the wall member 25A. In the embodiment, the buffer member 25B (air reservoir structure 25) is provided above the inner region IN, and the buffer member 25B has a buffering function, mitigating the pressure that pushes the shield case 24 and the imaging substrate 12 outward in the inner region IN. As a result, the camera module 1 of the embodiment can avoid deformation or breakage of the imaging substrate 12 that causes it to bend outward. Moreover, the camera module 1 of the embodiment can densely fill the inner region IN with insert resin R, improving heat dissipation. As a result, the camera module 1 of the embodiment can ensure quality.

[0062] In the embodiment shown in Figure 14, the camera module 1 replaces the air reservoir structure 25 with an air reservoir member 25C instead of a wall member 25A. The air reservoir member 25C is, for example, a deformable container in which air is sealed, and which can deform when a predetermined pressure is exceeded. The air reservoir member 25C is positioned above the internal region IN, similar to the wall member 25A. In the embodiment, the air reservoir member 25C (air reservoir structure 25) is provided above the inner region IN, and the air reservoir member 25C has a buffering function, mitigating the pressure that pushes the shield case 24 and the imaging substrate 12 outward in the inner region IN. As a result, the camera module 1 of the embodiment can avoid deformation or breakage of the imaging substrate 12 that causes it to bend outward. Moreover, the camera module 1 of the embodiment can densely fill the inner region IN with insert resin R, improving heat dissipation. As a result, the camera module 1 of the embodiment can ensure quality.

[0063] In the embodiment shown in Figure 15, the camera module 1 has a wall member 25A, which is an air reservoir structure 25, that is tilted downwards outward in the width direction Y (or curved, although not explicitly shown in the figure). As a result, the camera module 1 of this embodiment guides and controls the insert resin R flowing from the outside in the width direction Y downwards so as to bounce it back, and also acts to collect and accumulate voids on the opposite side (inside the wall member 25A in the width direction Y). In the camera module 1 of this embodiment shown in Figure 15, the wall member 25A is arranged in two places in the width direction Y, and each is tilted downwards outward in the width direction Y (or curved, although not explicitly shown in the figure), so the effect of collecting and accumulating a large amount of voids in the wider space between them is significant. Also, in the camera module 1 of the embodiment shown in Figure 15, if there is only one wall member 25A, it is tilted to the right (or curved, although not explicitly shown in the figure) so that the insert resin R enters the inner region IN. As a result, the camera module 1 of the embodiment can avoid deformation or breakage of the imaging substrate 12, such as bending outward. Moreover, the camera module 1 of the embodiment can densely fill the inner region IN with insert resin R, improving heat dissipation. As a result, the camera module 1 of the embodiment can ensure quality.

[0064] In the embodiment shown in Figure 16, the camera module 1 has a wall member 25A, which is an air reservoir structure 25, that is tilted downwards inward in the width direction Y (or curved, though not explicitly shown in the figure). As a result, the camera module 1 of this embodiment guides and controls the insert resin R flowing from the outside in the width direction Y downwards, and also acts to collect and accumulate voids on the opposite side (inside the wall member 25A in the width direction Y). In the camera module 1 of this embodiment shown in Figure 16, the wall member 25A is arranged in two places in the width direction Y, and each is tilted downwards inward in the width direction Y (or curved, though not explicitly shown in the figure), so the effect of holding and accumulating voids between them is significant. Also, in the camera module 1 of the embodiment shown in Figure 16, if there is only one wall member 25A, it is tilted to the left (or curved, though not explicitly shown in the figure), opposite to the right side where the insert resin R enters the inner region IN. As a result, the camera module 1 of the embodiment can avoid deformation or breakage of the imaging substrate 12, such as bending outward. Moreover, the camera module 1 of the embodiment can densely fill the inner region IN with insert resin R, improving heat dissipation. As a result, the camera module 1 of the embodiment can ensure quality.

[0065] The camera module 1 of the embodiment shown in Figures 17 and 18 has a configuration in which a wall member 25A, which is an air reservoir structure 25, is arranged as shown in Figures 11, 15, and 16 (Figure 17 uses Figure 11 as the basic configuration), and a guide wall 26 is provided. The guide wall 26 is located in the internal region IN of the shield case 24, which is partitioned by the shield case 24 and the imaging substrate 12. In the internal region IN, the guide wall 26 is located below the wall member 25A in the vertical direction Z. The guide wall 26 has the same length L as the wall member 25A. The guide wall 26 is molded integrally with the base portion 21 of the frame portion 20 from a synthetic resin material and is formed to extend forward through the main plate 24A of the shield case 24. Alternatively, the guide wall 26 is formed from a metal plate, like the shield case 24, and is formed integrally with the shield case 24 by welding without any gaps.

[0066] In the camera module 1 of the embodiment shown in Figure 17, the guide wall 26 is configured to be inclined downward and outward in the width direction Y (or curved, although not explicitly shown in the figure). As a result, the camera module 1 of the embodiment guides and controls the insert resin R flowing from the outside in the width direction Y downward so as to bounce it back, and also acts to collect voids toward the wall member 25A on the opposite side (inside the guide wall 26 in the width direction Y). In the camera module 1 of the embodiment shown in Figure 17, the guide wall 26 is arranged in two places in the width direction Y, and each is configured to be inclined downward and outward in the width direction Y (or curved, although not explicitly shown in the figure), so the effect of collecting a large amount of voids in the wider space between them is significant. Also, in the camera module 1 of the embodiment shown in Figure 17, if there is only one guide wall 26, it is configured to be inclined downward and to the right in the width direction Y (or curved, although not explicitly shown in the figure) below the right side of the two wall members 25A.

[0067] In the camera module 1 of the embodiment shown in Figure 18, the guide wall 26 is configured to be inclined downwards inward in the width direction Y (or curved, although not explicitly shown in the figure). As a result, the camera module 1 of the embodiment guides and controls the insert resin R flowing from the outside in the width direction Y downwards, and also acts to collect voids toward the wall member 25A on the opposite side (inside the guide wall 26 in the width direction Y). In the camera module 1 of the embodiment shown in Figure 18, the guide wall 26 is arranged in two locations in the width direction Y, and each is configured to be inclined downwards inward in the width direction Y (or curved, although not explicitly shown in the figure), so the effect of locally collecting voids in the narrow space between them is significant. Also, in the camera module 1 of the embodiment shown in Figure 18, if there is only one guide wall 26, it is configured to be inclined downwards to the left in the width direction Y (or curved, although not explicitly shown in the figure) below the right side of the two wall members 25A.

[0068] By the way, in the embodiment described above, the insert mold 50 includes a lower mold 50A and an upper mold 50B, which are divided to sandwich the camera module 1 in the vertical direction Z. In contrast, although not explicitly shown in the figure, an insert mold can also be used that is divided to sandwich the camera module 1 in the width direction Y. In this case, since the insert mold is divided vertically, the camera module 1 is filled with insert resin R with the width direction Y being the vertical direction. In the case of a camera module 1 manufactured in this way, the air reservoir structure 25 is positioned above the internal region IN during manufacturing, that is, it is positioned above where the width direction Y is the vertical direction.

[0069] Thus, the electronic device (camera module 1) of this embodiment is characterized by comprising a substrate (imaging substrate 12), a shield case 24 that surrounds the substrate and together with the substrate forms an internal region IN, an insert resin R (exterior resin 30) that fills the internal region IN, and an air reservoir structure 25 that stores air, positioned above the filling of the insert resin R in the internal region IN.

[0070] According to this electronic device (camera module 1), when the insert resin R is filled into the internal region IN, the air stored in the air reservoir structure 25 acts as a buffer, thereby mitigating the pressure exerted by the filling pressure of the insert resin R on the shield case 24 and the imaging substrate 12 to push them outward. As a result, this electronic device (camera module 1) can avoid deformation or breakage of the imaging substrate 12 that causes it to bend outward. Moreover, this electronic device (camera module 1) can densely fill the inner region IN with the insert resin R, improving heat dissipation. As a result, the electronic device (camera module 1) of this embodiment can ensure quality.

[0071] Furthermore, in the electronic device (camera module 1) of the embodiment, the air reservoir structure 25 consists of a wall member 25A that acts as a barrier for filling with insert resin R.

[0072] According to this electronic device (camera module 1), the wall member 25A acts as a barrier for filling the insert resin R above the inner region IN, guiding and controlling the flow of the insert resin R downwards and collecting and accumulating voids. Therefore, this electronic device (camera module 1) forms an air reservoir S at the position of the wall member 25A. This air reservoir S has a buffering function and can alleviate the pressure that pushes the shield case 24 and the imaging substrate 12 outward in the inner region IN.

[0073] Furthermore, in the electronic device (camera module 1) of this embodiment, the wall member 25A is formed from a separate component from the shield case 24.

[0074] According to this electronic device (camera module 1), since the wall member 25A is formed from a separate material from the shield case 24, the unevenness relative to the shield case 24 can be minimized, the generation of voids caused by the unevenness can be reduced, and the inner region IN can be densely filled with insert resin R.

[0075] Furthermore, in the electronic device (camera module 1) of this embodiment, the wall member 25A is integrally joined to the shield case 24.

[0076] With this electronic device (camera module 1), since the wall member 25A is integrally joined with the shield case 24, it is possible to eliminate holes or notches through which the wall member 25A penetrates the shield case 24, thereby simplifying the formation of the shield case 24 and improving productivity.

[0077] A method for manufacturing an electronic device (camera module 1) of an embodiment comprises a substrate (imaging substrate 12), a shield case 24 surrounding the substrate and forming an internal region IN together with the substrate, an insert resin R (exterior resin 30) filled into the internal region IN, and an air reservoir structure 25 for accumulating air, positioned above the filling of the insert resin R in the internal region IN, and the method for manufacturing an electronic device includes a step of arranging the substrate, the shield case 24, and the air reservoir structure 25, followed by a step of filling the internal region IN with the insert resin R.

[0078] According to the manufacturing method of this electronic device (camera module 1), when the insert resin R is filled into the internal region IN, the air stored in the air reservoir structure 25 acts as a buffer, thereby mitigating the pressure exerted by the filling pressure of the insert resin R on the shield case 24 and the imaging substrate 12 to push them outward. As a result, this manufacturing method of the electronic device (camera module 1) can avoid deformation or breakage of the imaging substrate 12, causing it to bend outward. Moreover, this manufacturing method of the electronic device (camera module 1) can densely fill the inner region IN with the insert resin R, improving heat dissipation. As a result, the manufacturing method of the electronic device (camera module 1) according to this embodiment can ensure quality.

[0079] Although the electronic device of the embodiment described above was explained using an example where it is applied to the camera module 1, it is not limited to application to the camera module 1 and can also be applied to other electronic devices. [Explanation of Symbols]

[0080] 1. Camera module (electronic device) 12 Imaging substrate (substrate) 24 Shield Cases 25 Air reservoir structure 25A wall parts R insert resin

Claims

1. circuit board and A shield case that surrounds the aforementioned substrate and forms an internal region together with the substrate, The insert resin that fills the aforementioned internal region, An air reservoir structure for accumulating air is positioned in the internal region above the filling of the insert resin, An electronic device equipped with the following features.

2. The air reservoir structure consists of a wall member that acts as a barrier for filling the insert resin. The electronic device according to claim 1.

3. The wall member is formed from a separate component from the shield case. The electronic device according to claim 2.

4. The wall member is integrally joined to the shield case. The electronic device according to claim 2.

5. circuit board and A shield case that surrounds the aforementioned substrate and forms an internal region together with the substrate, The insert resin that fills the aforementioned internal region, An air reservoir structure for accumulating air is positioned in the internal region above the filling of the insert resin, A method for manufacturing electronic equipment, comprising: The process includes, after the step of arranging the substrate, the shield case, and the air reservoir structure, filling the internal region with insert resin. A method for manufacturing electronic devices.

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