Light-emitting device

Abstract

To provide a light-emitting device that can improve reliability. [Solution] A light-emitting device comprising a substrate, an upper wiring including a first upper wiring, a second upper wiring, a third upper wiring, a fourth upper wiring and a fifth upper wiring, a lower wiring including a first lower wiring, a conductive part, a first light-emitting element, a second light-emitting element and a third light-emitting element, wherein the first upper wiring, the second upper wiring and the third upper wiring are positioned side by side in the first direction, the fourth upper wiring and the fifth upper wiring are positioned side by side in the first direction, the first upper wiring and the fourth upper wiring are positioned side by side in the second direction, and the conductive part includes a first conductive part connecting the first upper wiring and the first lower wiring, and a second conductive part connecting the fifth upper wiring and the first lower wiring.

Description

[Technical Field]

[0001] Embodiments of the present invention relate to a light-emitting device. [Background technology]

[0002] Patent Document 1 discloses a light-emitting device comprising a plurality of light-emitting elements and a support containing a plurality of conductive parts electrically connected to each of the plurality of light-emitting elements. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2023-051709 [Overview of the project] [Problems that the invention aims to solve]

[0004] Light-emitting devices are required to have further improvements in reliability. The embodiment of the present invention aims to provide a light-emitting device that can improve reliability. [Means for solving the problem]

[0005] A light-emitting device according to one embodiment of the present disclosure comprises: a substrate having an upper surface and a lower surface located opposite to the upper surface; a support including a plurality of upper wirings located on the upper surface, a plurality of lower wirings located on the lower surface, and a conductive portion located inside the substrate and connecting one of the plurality of upper wirings to one of the plurality of lower wirings; and a first light-emitting element, a second light-emitting element, and a third light-emitting element located on the support, wherein the first and second light-emitting elements are located side by side in a first direction, the first and third light-emitting elements are located side by side in a second direction perpendicular to the first direction, the upper wiring includes a first upper wiring, a second upper wiring, a third upper wiring, a fourth upper wiring, and a fifth upper wiring, the first, second and third upper wiring are located side by side in the first direction, and the fourth and fifth upper wiring are the The first upper wiring and the fourth upper wiring are positioned side by side in a first direction, the second upper wiring and the fifth upper wiring are positioned side by side in a second direction, the lower wiring includes a first lower wiring, the conductive part includes a first conductive part connecting the first upper wiring and the first lower wiring, and a second conductive part connecting the fifth upper wiring and the first lower wiring, the first light-emitting element is located on the first upper wiring and the second upper wiring and is electrically connected to the first upper wiring and the second upper wiring, the second light-emitting element is located on the second upper wiring and the third upper wiring and is electrically connected to the second upper wiring and the third upper wiring, and the third light-emitting element is located on the fourth upper wiring and the fifth upper wiring and is electrically connected to the fourth upper wiring and the fifth upper wiring. [Effects of the Invention]

[0006] According to the light-emitting device of one embodiment of the present invention, the reliability of the light-emitting device can be improved. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic top view of a light-emitting device according to the first embodiment. [Figure 2A]It is a schematic cross-sectional view of a light-emitting device taken along line IIA-IIA of FIG. 1. [Figure 2B] It is a schematic cross-sectional view of a light-emitting device taken along line IIB-IIB of FIG. 1. [Figure 3] It is a schematic top view of a support according to the first embodiment. [Figure 4] It is a schematic bottom view of a light-emitting device according to the first embodiment. [Figure 5] It is an enlarged schematic bottom view of a support according to the first embodiment. [Figure 6] It is a schematic top view of a light-emitting device according to the second embodiment. [Figure 7A] It is a schematic cross-sectional view of a light-emitting device taken along line VIIA-VIIA of FIG. 6. [Figure 7B] It is a schematic cross-sectional view of a light-emitting device taken along line VIIB-VIIB of FIG. 6. [Figure 8] It is a schematic top view of a support according to the second embodiment. [Figure 9] It is a schematic top view of a light-emitting device according to the third embodiment. [Figure 10] It is a schematic cross-sectional view of a light-emitting device taken along line X-X of FIG. 9. [Figure 11] It is a schematic top view of a support according to the third embodiment. [Figure 12] It is a schematic bottom view of a light-emitting device according to the third embodiment. [Figure 13] It is a schematic top view of a support according to the fourth embodiment. [Figure 14] It is a schematic bottom view of a light-emitting device according to the fourth embodiment.

Embodiments for Carrying Out the Invention

[0008] Hereinafter, each embodiment will be described with reference to the drawings. Since each drawing schematically shows the embodiment, the scale, interval, positional relationship, etc. of each member may be exaggerated, or illustration of a part of the member may be omitted. In this specification, the side in the arrow direction of the X-axis is defined as the +X side, and the side opposite to the arrow direction of the X-axis is defined as the -X side. The side in the arrow direction of the Y-axis is defined as the +Y side, and the side opposite to the arrow direction of the Y-axis is defined as the -Y side. Also, the arrow direction of the Z-axis is defined as upward, and the direction opposite to the arrow direction of the Z-axis is defined as downward. Looking at an object from above is called a top view, and the top view is synonymous with a plan view.

[0009] In the following description, components having substantially the same function may be denoted by a common reference numeral, and the description thereof may be omitted. Also, terms indicating a specific direction or position (for example, "up", "down" and other terms including those terms) may be used. However, those terms are only used for the sake of clarity of the relative direction or position in the drawings referred to. As long as the relative direction or position relationship by terms such as "up", "down" etc. in the drawings referred to is the same, in drawings other than the present disclosure, actual products, etc., they do not have to be arranged in the same way as the drawings referred to. In this specification, "parallel" includes not only the case where two straight lines, sides, surfaces, etc. do not intersect even when extended, but also the case where the angle formed by two straight lines, sides, surfaces, etc. intersects within a range of 10° or less. The positional relationship expressed as "up" in this specification includes both the case where they are in contact and the case where they are not in contact but are located above.

[0010] [First Embodiment] The light-emitting device 1000 according to the first embodiment will be described with reference to FIGS. 1 to 5. FIG. 1 is a view seen from the light-emitting surface side of the light-emitting device 1000. As shown in FIG. 1, two directions that are parallel to the light-emitting surface of the light-emitting device 1000 and perpendicular to each other are defined as the X direction and the Y direction. The direction perpendicular to the X direction and the Y direction is defined as the Z direction.

[0011] The light-emitting device 1000 comprises a support 10 and a light-emitting element 20. The support 10 includes a base material 11, a plurality of upper wirings 12A, a plurality of lower wirings 12B, and a plurality of conductive parts 12C. The base material 11 has an upper surface 101 and a lower surface 102 located opposite the upper surface 101. The plurality of upper wirings 12A are located on the upper surface 101 of the base material 11. The plurality of lower wirings 12B are located on the lower surface 102 of the base material 11. The plurality of conductive parts 12C are located inside the base material 11. Each of the conductive parts 12C connects one of the plurality of upper wirings 12A and one of the plurality of lower wirings 12B. The light-emitting element 20 includes a first light-emitting element 21, a second light-emitting element 22, and a third light-emitting element 23. The first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 are located on the support 10. The first light-emitting element 21 and the second light-emitting element 22 are positioned side by side in the first direction. The first light-emitting element 21 and the third light-emitting element 23 are positioned side by side in the second direction perpendicular to the first direction. The top wiring 12A includes the first top wiring 12A1, the second top wiring 12A2, the third top wiring 12A3, the fourth top wiring 12A4, and the fifth top wiring 12A5. The first top wiring 12A1, the second top wiring 12A2, and the third top wiring 12A3 are positioned side by side in the first direction. The fourth top wiring 12A4 and the fifth top wiring 12A5 are positioned side by side in the first direction. The first top wiring 12A1 and the fourth top wiring 12A4 are positioned side by side in the second direction. The second top wiring 12A2 and the fifth top wiring 12A5 are positioned side by side in the second direction. The bottom wiring 12B includes the first bottom wiring 12B1. The conductive part 12C includes the first conductive part 12C1 and the second conductive part C2. The first conductive part 12C1 connects the first top wiring 12A1 and the first bottom wiring 12B1. The second conductive part 12C2 connects the fifth top wiring 12A5 and the first bottom wiring 12B1. The first light-emitting element 21 is located on the first top wiring 12A1 and the second top wiring 12A2. The first light-emitting element 21 is electrically connected to the first top wiring 12A1 and the second top wiring 12A2. The second light-emitting element 22 is located on the second top wiring 12A2 and the third top wiring 12A3. The second light-emitting element 22 is electrically connected to the second top wiring 12A2 and the third top wiring 12A3. The third light-emitting element 23 is located on the fourth top wiring 12A4 and the fifth top wiring 12A5.The third light-emitting element 23 is electrically connected to the fourth upper wiring 12A4 and the fifth upper wiring 12A5. In Figure 1, the first direction is the X direction, and the second direction is the Y direction. In this specification, the Z direction may also be referred to as the third direction.

[0012] In this embodiment, the first lower wiring 12B1, which is one of the lower wirings 12B, is connected to the first upper wiring 12A1 via the first conductive part 12C1 and to the fifth upper wiring 12A5 via the second conductive part 12C2. This makes it easier to increase the volume of the lower wiring 12B connected to the first upper wiring 12A1 via the conductive part 12C compared to the case where the lower wiring 12B connected to the first upper wiring 12A1 via one of the multiple conductive parts 12C and the lower wiring 12B connected to the fifth upper wiring 12A5 via one of the multiple conductive parts 12C are different. By increasing the volume of the lower wiring 12B, the heat generated by the first light-emitting element 21 is more easily transferred to the lower wiring 12B. This reduces the temperature rise of the first light-emitting element 21, thus improving the reliability of the light-emitting device 1000.

[0013] The following provides a detailed explanation of each component of the light-emitting device 1000.

[0014] (Support 10) The support 10 is a member on which the light-emitting element 20 is mounted. The support 10 includes a base material 11, an upper wiring 12A, a lower wiring 12B, and a conductive part 12C. For the base material 11, an insulating material such as resin can be used. For the base material 11, for example, epoxy, glass epoxy, bismaleimide triazine (BT), polyimide, etc., can be used. For the upper wiring 12A and lower wiring 12B, conductive materials such as copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or alloys thereof can be used. The upper wiring 12A and lower wiring 12B may include a known plating layer such as gold on their surface.

[0015] The base material 11 includes an upper surface 101, a lower surface 102 located on the opposite side of the upper surface 101, and a side surface 103 connecting the upper surface 101 and the lower surface 102. The upper surface wiring 12A is located on the upper surface 101 of the base material 11. The upper surface wiring 12A of the light-emitting device 1000 includes a first upper surface wiring 12A1, a second upper surface wiring 12A2, a third upper surface wiring 12A3, a fourth upper surface wiring 12A4, a fifth upper surface wiring 12A5, a sixth upper surface wiring 12A6, and a seventh upper surface wiring 12A7. The number of upper surface wirings 12A is not particularly limited. For example, the number of upper surface wirings 12A may be eight or more.

[0016] As shown in Figure 3, the first top wiring 12A1, the second top wiring 12A2, and the third top wiring 12A3 are aligned in the first direction (X direction). The fourth top wiring, the fifth top wiring 12A5, the sixth top wiring 12A6, and the seventh top wiring 12A7 are aligned in the first direction. The first top wiring 12A1 and the fourth top wiring 12A4 are aligned in the second direction (Y direction). The second top wiring 12A2 and the fifth top wiring 12A5 are aligned in the second direction. The second top wiring 12A2 and the sixth top wiring 12A6 are aligned in the second direction. The third top wiring 12A3 and the seventh top wiring 12A7 are aligned in the second direction.

[0017] The bottom wiring 12B is located on the bottom surface 102 of the base material 11. As shown in Figure 4, the bottom wiring 12B includes the first bottom wiring 12B1, the second bottom wiring 12B2, the third bottom wiring 12B3, the fourth bottom wiring 12B4, the fifth bottom wiring 12B5, and the sixth bottom wiring 12B6. The number of bottom wirings 12B is not particularly limited. For example, there may be seven or more bottom wirings 12B. The bottom wiring 12B of the light-emitting device 1000 is arranged in the first direction in the order of the fourth bottom wiring 12B4, the first bottom wiring 12B1, the second bottom wiring 12B2, the fifth bottom wiring 12B5, the third bottom wiring 12B3, and the sixth bottom wiring 12B6.

[0018] As shown in Figures 2A and 2B, the conductive part 12C is located inside the substrate 11 and connects one of the multiple upper wirings 12A to one of the multiple lower wirings 12B. The conductive part 12C electrically connects one of the multiple upper wirings 12A to one of the multiple lower wirings 12B. The conductive part 12C of the light-emitting device 1000 includes a first conductive part 12C1, a second conductive part 12C2, a third conductive part 12C3, a fourth conductive part 12C4, a fifth conductive part 12C5, a sixth conductive part 12C6, and a seventh conductive part 12C7. The first upper wiring 12A1 and the first lower wiring 12B1 are connected by the first conductive part 12C1. The fifth upper wiring 12A5 and the first lower wiring 12B1 are connected by the second conductive part 12C2. The second upper wiring 12A2 and the second lower wiring 12B2 are connected by the third conductive part 12C3. The third upper wiring 12A3 and the third lower wiring 12B3 are connected by the fourth conductive part 12C4. The fourth upper wiring 12A4 and the fourth lower wiring 12B4 are connected by the fifth conductive part 12C5. The sixth upper wiring 12A6 and the fifth lower wiring 12B5 are connected by the sixth conductive part 12C6. The seventh upper wiring 12A7 and the sixth lower wiring 12B6 are connected by the seventh conductive part 12C7.

[0019] In the light-emitting device 1000, the first lower wiring 12B1, which is one of the multiple lower wirings 12B, is connected to the first upper wiring 12A1 via the first conductive part 12C1 and to the fifth upper wiring 12A5 via the second conductive part 12C2. This makes it easier to increase the volume of the lower wiring 12B connected to the first upper wiring 12A1 via the conductive part 12C compared to the case where the lower wiring 12B connected to the first upper wiring 12A1 via one of the multiple conductive parts 12C and the lower wiring 12B connected to the fifth upper wiring 12A5 via one of the multiple conductive parts 12C are different. In this embodiment, it is easier to increase the volume of the first lower wiring 12B1 connected to the first upper wiring 12A1 via the first conductive part 12C1. By doing so, the heat emitted by the first light-emitting element 21 is more easily transferred to the first lower wiring 12B1. This makes it easier to reduce the temperature rise of the first light-emitting element 21. As a result, the reliability of the light-emitting device 1000 is more likely to improve.

[0020] As shown in Figure 3, it is preferable that the first light-emitting element 21 and the first conductive part 12C1 overlap in a top view. This makes it easier to shorten the heat dissipation path from the first light-emitting element 21 to the first conductive part 12C1. As a result, the heat generated by the first light-emitting element 21 can easily be transferred to the first conductive part 12C1, thus reducing the temperature rise of the first light-emitting element 21. This improves the reliability of the light-emitting device 1000.

[0021] As shown in Figure 3, in a top view, it is preferable that the number of conductive parts 12C overlapping with the first light-emitting element 21 is greater than the number of conductive parts 12C overlapping with the third light-emitting element 23. This makes it easier for the heat emitted by the first light-emitting element 21 to transfer to the first lower wiring 12B1 via the multiple conductive parts 12C. This makes it easier to reduce the temperature rise of the first light-emitting element 21. In a top view, there are two conductive parts 12C overlapping with the first light-emitting element 21 and one conductive part 12C overlapping with the third light-emitting element 23. Similarly, in a top view, it is preferable that the number of conductive parts 12C overlapping with the first light-emitting element 21 is greater than the number of conductive parts 12C overlapping with the second light-emitting element 22. This makes it easier for the heat emitted by the first light-emitting element 21 to transfer to the first lower wiring 12B1 via the multiple conductive parts 12C. In a top view, there is one conductive part 12C overlapping with the second light-emitting element 22.

[0022] When the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 are lit simultaneously, the first light-emitting element 21 is positioned alongside the second light-emitting element 22 in the first direction and alongside the third light-emitting element 23 in the second direction, so the temperature in the vicinity of the first light-emitting element 21 tends to rise. Therefore, reducing the temperature rise of the first light-emitting element 21, which tends to rise in temperature, can improve the reliability of the light-emitting device 1000. For example, when the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 are connected in series, it is particularly preferable that the number of conductive parts 12C overlapping with the first light-emitting element 21 in a top view is greater than the number of conductive parts 12C overlapping with the second light-emitting element 22 and the number of conductive parts 12C overlapping with the third light-emitting element 23.

[0023] The conductive portion 12C may be constructed by filling a through-hole in the base material 11 with a conductive material, and as shown in Figures 2A and 2B, it may include a covering conductive portion 12E that covers the surface of the through-hole in the base material 11, and a filling member 12R that fills the region surrounded by the covering conductive portion 12E. The material of the covering conductive portion 12E can be the same as the material used for the upper wiring 12A and the lower wiring 12B. The filling member 12R may be conductive or insulating. For example, a resin material such as epoxy can be used for the material of the filling member 12R.

[0024] As shown in Figure 2B, the substrate 11 may include a recess 13 that opens to the bottom surface 102 and the side surface 103. The side surface 103 of the substrate 11 includes a first side surface 103A on which the recess 13 is formed, and a second side surface 103B opposite to the first side surface 103A. The surface of the substrate 11 that defines the recess 13 is covered by bottom wiring 12B. Each of the first bottom wiring 12B1, second bottom wiring 12B2, third bottom wiring 12B3, fourth bottom wiring 12B4, fifth bottom wiring 12B5, sixth bottom wiring 12B6, and seventh bottom wiring 12B7 covers the surface of the substrate 11 that defines the recess 13. Conductive bonding members such as solder for fixing the light-emitting device and the mounting substrate can be placed inside the recess 13. The inclusion of recesses 13 in the base material 11 makes it easier to increase the volume of the conductive bonding member, thereby improving the bonding strength between the light-emitting device and the mounting substrate. The number of recesses 13 may be one or multiple. Having multiple recesses makes it easier to further improve the bonding strength between the light-emitting device and the mounting substrate.

[0025] As shown in Figure 5, the first lower wiring 12B1 includes a first portion 121 that overlaps with the first conductive portion 12C1 in the second direction, and a second portion 122 that overlaps with the second conductive portion 12C2 in the second direction. In Figure 5, the extent of the first portion 121 is shown by hatching with diagonal lines rising to the right, and the extent of the second portion 122 is shown by hatching with diagonal lines rising to the left. In a view from below, the first portion 121 includes a portion extending to the +Y side and a portion extending to the -Y side from the region where the first lower wiring 12B1 and the first conductive portion 12C1 overlap. The first portion 121 does not include a portion of the first lower wiring 12B1 that does not overlap with the first conductive portion 12C1 in the second direction. The second portion 122 includes portions extending to the +Y side and portions extending to the -Y side from the region overlapping with the first lower wiring 12B1 and the second conductive portion 12C2 in a view from below. The second portion 122 does not include any portion of the first lower wiring 12B1 that does not overlap with the second conductive portion 12C2 in the second direction.

[0026] Preferably, the maximum length of the first portion 121 in the second direction is longer than the maximum length of the second portion 122 in the second direction. This makes it easier to increase the volume of the first bottom wiring 12B1 located directly beneath the first light-emitting element 21. As a result, the heat generated by the first light-emitting element 21 is more easily transferred to the first bottom wiring 12B1 via the first conductive portion 12C1.

[0027] As shown in Figure 5, it is preferable that the length L1 in the second direction of the first bottom wiring 12B1 including the end E1 of the second portion 122 closest to the second bottom wiring 12B2 in the first direction is shorter than the length L2 in the second direction of the first bottom wiring 12B1 including the end E2 of the second portion 122 furthest from the second bottom wiring 12B2 in the first direction. This makes it easier to increase the distance from the second portion 122 to the second bottom wiring 12B2 of the first bottom wiring 12B1. This makes it easier to reduce contact between the first bottom wiring 12B1 and the second bottom wiring 12B2. As a result, it is easier to reduce the risk of short-circuiting the first light-emitting element 21.

[0028] As shown in Figure 5, it is preferable that the maximum distance L3 in the second direction from the second portion 122 to the first side surface 103A is longer than the maximum distance L4 in the second direction from the second portion 122 to the second side surface 103B. This makes it easier to reduce contact between the first bottom wiring 12B1 and the second bottom wiring 12B2.

[0029] The maximum distance L3 in the second direction from the second portion 122 to the first side surface 103A is preferably longer than the maximum distance L5 in the second direction from the longest portion of the second bottom wiring 12B2 in the first direction to the first side surface 103A. This makes it easier to reduce contact between the first bottom wiring 12B1 and the second bottom wiring 12B2.

[0030] In the second direction, it is preferable that the first bottom wiring 12B1 and the second bottom wiring 12B2 do not overlap. This makes it easier to increase the distance from the first bottom wiring 12B1 to the second bottom wiring 12B2. However, in the second direction, the first bottom wiring 12B1 and the second bottom wiring 12B2 may overlap. This makes it easier to miniaturize the light-emitting device in the first direction.

[0031] (Light-emitting element 20) The light-emitting element 20 is a semiconductor element that emits light on its own when a voltage is applied, and known semiconductor elements made of nitride semiconductors or the like can be used. The light-emitting element 20 is located on the support 10. An example of the light-emitting element 20 is an LED chip. The light-emitting element 20 includes a semiconductor laminate. The semiconductor laminate includes, for example, a support member such as sapphire or gallium nitride, an n-type semiconductor layer disposed on the support member, a p-type semiconductor layer, and a light-emitting layer sandwiched between the n-type semiconductor layer and the p-type semiconductor layer. The light-emitting element 20 also includes a positive and negative pair of electrodes 20E. The light-emitting element 20 includes an n-side electrode (cathode) electrically connected to the n-type semiconductor layer and a p-side electrode (anode) electrically connected to the p-type semiconductor layer. Furthermore, the light-emitting element 20 may include an n-side metal post electrically connected to the n-side electrode and a p-side metal post electrically connected to the p-side electrode. The p-side metal post and the n-side metal post include, for example, copper (Cu) and / or nickel (Ni). One electrode 20E of the positive and negative pair includes both an n-side electrode and an n-side metal post. If the light-emitting element 20 does not include an n-side metal post, one electrode 20E is composed of the n-side electrode. The other electrode 20E of the positive and negative pair includes both a p-side electrode and a p-side metal post. If the light-emitting element 20 does not include a p-side metal post, the other electrode 20E is composed of the p-side electrode. Furthermore, the light-emitting element 20 does not need to be equipped with a support member such as sapphire or gallium nitride. This makes it easier to miniaturize the light-emitting element 20 in the third direction (Z direction).

[0032] The structure of the light-emitting layer may be a double heterostructure, a single quantum well structure (SQW) with a single active layer, or a multiple quantum well structure (MQW) with a group of active layers. The light-emitting layer is capable of emitting visible light or ultraviolet light. The light-emitting layer is capable of emitting visible light from blue to red. An example of a semiconductor laminate containing such a light-emitting layer is In x Al y Ga 1-x-yN(0≦x, 0≦y, x+y≦1) may be included. The semiconductor stack may include at least one light-emitting layer capable of the above-described emission. For example, the semiconductor stack may have a structure that includes one or more light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or it may have a structure in which a structure containing an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer in sequence is repeated multiple times. When the semiconductor stack includes multiple light-emitting layers, it may include light-emitting layers with different emission peak wavelengths, or it may include light-emitting layers with the same emission peak wavelength. Note that the emission peak wavelengths may have variations of, for example, a few nanometers. Such combinations of light-emitting layers can be selected as appropriate. For example, when the semiconductor stack includes two light-emitting layers, the light-emitting layers can be selected in combinations such as blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. Furthermore, the light-emitting layer may include multiple active layers with different emission peak wavelengths, or it may include multiple active layers with the same emission peak wavelength. Furthermore, the shape of the light-emitting element 20 when viewed from above is not particularly limited. The shape of the light-emitting element 20 when viewed from above can be, for example, a circle, a triangle, a square, a hexagon, or an octagon.

[0033] The light-emitting element 20 includes a first light-emitting element 21, a second light-emitting element 22, a third light-emitting element 23, and a fourth light-emitting element 24. The number of light-emitting elements 20 provided by the light-emitting device is not particularly limited. For example, the light-emitting device may have three light-emitting elements: the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23. Alternatively, the light-emitting device may have five or more light-emitting elements.

[0034] As shown in Figure 1, the first light-emitting element 21 and the second light-emitting element 22 are positioned side by side in the first direction. The first light-emitting element 21 and the third light-emitting element 23 are positioned side by side in the second direction. The fourth light-emitting element 24 is positioned side by side with the third light-emitting element 23 in the first direction. The fourth light-emitting element 24 is positioned side by side with the second light-emitting element 22 in the second direction.

[0035] The first light-emitting element 21 is located on the first upper wiring 12A1 and the second upper wiring 12A2. The first light-emitting element 21 is electrically connected to the first upper wiring 12A1 and the second upper wiring 12A2. The second light-emitting element 22 is located on the second upper wiring 12A2 and the third upper wiring 12A3. The second light-emitting element 22 is electrically connected to the second upper wiring 12A2 and the third upper wiring 12A3. The third light-emitting element 23 is located on the fourth upper wiring 12A4 and the fifth upper wiring 12A5. The third light-emitting element 23 is electrically connected to the fourth upper wiring 12A4 and the fifth upper wiring 12A5. The fourth light-emitting element 24 is located on the sixth upper wiring 12A6 and the seventh upper wiring 12A7. The fourth light-emitting element 24 is electrically connected to the sixth upper wiring 12A6 and the seventh upper wiring 12A7.

[0036] The electrical connection relationships of the first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, and the fourth light-emitting element 24 are not particularly limited. The light-emitting device 1000 includes a first circuit in which the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 are connected in series, and a second circuit that can be driven independently of the first circuit and is connected to the fourth light-emitting element 24. The fourth bottom wiring 12B4 is connected to the anode of the external power supply. The third bottom wiring 12B3 is connected to the cathode of the external power supply. In the first circuit of the light-emitting device 1000, current flows in the following order: fourth lower wiring 12B4, fifth conductive part 12C5, fourth upper wiring 12A4, third light-emitting element 23, fifth upper wiring 12A5, second conductive part 12C2, first lower wiring 12B1, first conductive part 12C1, first upper wiring 12A1, first light-emitting element 21, second upper wiring 12A2, second light-emitting element 22, third upper wiring 12A3, fourth conductive part 12C4, and third lower wiring 12B3. The third conductive part 12C3 is not used because the first light-emitting element 21, second light-emitting element 22, and third light-emitting element 23 are connected in series. If the light-emitting device 1000 were equipped with the third conductive part 12C3, the heat generated by the first light-emitting element 21 would be more easily transferred to the second lower wiring 12B2 via the third conductive part 12C3. This makes it easier to reduce the temperature rise of the first light-emitting element 21. The fifth bottom wiring 12B5 is connected to the anode of the external power supply. The sixth bottom wiring 12B6 is connected to the cathode of the external power supply. In the second circuit of the light-emitting device 1000, current flows in the following order: fifth bottom wiring 12B5, sixth conductive part 12C6, sixth top wiring 12A6, fourth light-emitting element 24, seventh top wiring 12A7, seventh conductive part 12C7, and sixth bottom wiring 12B6. The fourth bottom wiring 12B4 may be connected to the cathode of the external power supply, and the third bottom wiring 12B3 may be connected to the anode of the external power supply. Alternatively, the fifth bottom wiring 12B5 may be connected to the cathode of the external power supply, and the sixth bottom wiring 12B6 may be connected to the anode of the external power supply. The first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, and the fourth light-emitting element 24 may be connected in series or in parallel. Furthermore, each of the first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, and the fourth light-emitting element 24 may be driven independently.

[0037] The first light-emitting element 21 includes a first element surface 201 located on the opposite side of the surface facing the upper surface 101 of the support 10. The second light-emitting element 22 includes a second element surface 202 located on the opposite side of the surface facing the upper surface 101 of the support 10. The third light-emitting element 23 includes a third element surface 203 located on the opposite side of the surface facing the upper surface 101 of the support 10. The fourth light-emitting element 24 includes a fourth element surface located on the opposite side of the surface facing the upper surface 101 of the support 10.

[0038] The peak wavelengths of the first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, and / or the fourth light-emitting element 24 may be the same or different. It is preferable that the peak wavelength of the first light-emitting element 21 and the peak wavelength of the third light-emitting element 23 are different. Combining light-emitting elements 20 with different peak wavelengths makes it easier to improve color reproduction. Similarly, it is preferable that the peak wavelength of the second light-emitting element 22 and the peak wavelength of the third light-emitting element 23 are different. The peak wavelength is the wavelength at which the output value of the light spectrum emitted from the light-emitting element is the highest. For example, the peak wavelength of the first light-emitting element 21 is the wavelength at which the output value of the light spectrum emitted from the first light-emitting element is the highest.

[0039] In the light-emitting device 1000, the peak wavelength of the first light-emitting element 21 is in the range of 430 nm to less than 490 nm, the peak wavelength of the second light-emitting element 22 is in the range of 430 nm to less than 490 nm, and the peak wavelength of the third light-emitting element 23 is in the range of 490 nm to less than 570 nm. In this way, light with a large blue emission component is emitted from the first light-emitting element 21 and the second light-emitting element 22. This makes it easier to improve the brightness of blue light, which has lower visual sensitivity than green light. In addition, in the light-emitting device 1000, the peak wavelength of the fourth light-emitting element 24 is in the range of 490 nm to less than 570 nm. In this way, it makes it easier to improve the brightness of green light.

[0040] As shown in Figure 1, the length of the first light-emitting element 21 in the first direction is preferably 0.9 to 1.1 times the length of the third light-emitting element 23 in the first direction. This makes it easier to reduce the portion in the second direction where the first light-emitting element 21 and the third light-emitting element 23 do not overlap. If the peak wavelength of the first light-emitting element 21 and the peak wavelength of the third light-emitting element 23 are different, the portion in the second direction where the first light-emitting element 21 and the third light-emitting element 23 do not overlap becomes smaller, making it easier to improve the color mixing properties of the light-emitting device 1000.

[0041] As shown in Figure 1, the length of the second light-emitting element 22 in the first direction is preferably 0.9 to 1.1 times the length of the fourth light-emitting element 24 in the first direction. This makes it easier to reduce the portion in the second direction where the second light-emitting element 22 and the fourth light-emitting element 24 do not overlap. If the peak wavelength of the second light-emitting element 22 and the peak wavelength of the fourth light-emitting element 24 are different, reducing the portion in the second direction where the second light-emitting element 22 and the fourth light-emitting element 24 do not overlap makes it easier to improve the color mixing properties of the light-emitting device 1000.

[0042] (Jointing member 30) As shown in Figures 2A and 2B, the light-emitting device 1000 further includes a conductive bonding member 30. The bonding member 30 is a member that bonds the support 10 and the light-emitting element 20. The bonding member 30 also electrically connects the upper surface wiring 12A of the support 10 and the light-emitting element 20. As shown in Figure 2A, the bonding member 30 of the light-emitting device 1000 includes a first bonding member 31 that contacts the electrode 20E of the first light-emitting element 21 and the second upper surface wiring 12A2, and a second bonding member 32 that contacts the electrode 20E of the second light-emitting element 22 and the second upper surface wiring 12A2. The material of the bonding member 30 can be, for example, solder such as gold-tin, tin-bismuth, tin-copper, or tin-silver, or brazing materials such as low-melting-point metals.

[0043] As shown in Figure 2B, when the light-emitting element 20 is flip-chip mounted on the support 10, it is preferable that the top wiring has a protrusion 14. The protrusion 14 of the top wiring is positioned to overlap with the electrode 20E of the light-emitting element 20 in a plan view. By having the protrusion 14 on the top wiring, when connecting the top wiring 12A and the electrode 20E of the light-emitting element 20 via the joining member 30, the self-alignment effect makes it easy to align the light-emitting element 20 and the support 10.

[0044] (First translucent member 40) As shown in Figures 1, 2A, and 2B, the light-emitting device 1000 further includes a first light-transmitting member 40. The first light-transmitting member 40 is a member that is light-transmitting. The first light-transmitting member 40 covers the first element surface 201, the second element surface 202, and the third element surface 203. This allows the first light-emitting element 21, the second element-emitting element 22, and the third element-emitting element 23 to be protected from external forces by the first light-transmitting member 40. In addition, the first light-transmitting member 40 covers the fourth element surface. This allows the fourth element-emitting element 24 to be protected from external forces by the first light-transmitting member 40. In this specification, "light-transmitting" means that the transmittance with respect to the peak wavelength of the first element-emitting element is 50% or more.

[0045] The material of the first translucent member 40 can be, for example, silicone resin, epoxy resin, phenolic resin, polycarbonate resin, acrylic resin, or a modified resin thereof. The first translucent member 40 may contain a filler. Examples of fillers include titanium dioxide, zirconium oxide, aluminum oxide, and silicon oxide. The first translucent member 40 may also contain a phosphor. Examples of phosphors include yttrium-aluminum-garnet phosphors (e.g., (Y,Gd)3(Al,Ga)5O 12 Ce), lutetium-aluminum-garnet phosphors (e.g., Lu3(Al,Ga)5O 12 Ce), terbium aluminum garnet phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphors (e.g., Ca8MgSi4O 16 Cl2:Eu), silicate-based phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon-based phosphors (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu) and other oxynitride-based phosphors, LSN-based phosphors (e.g., (La,Y)3Si6N 11 :Ce), BSESN-based phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu) or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu) and other nitride-based phosphors, KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si 1-x Al x )F 6-x :Mn Here, x satisfies 0 < x < 1.) or MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn) and other fluoride-based phosphors, quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 Here, FA and MA represent formamidinium and methylammonium, respectively.), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2) and the like can be used. As the phosphor added to the first light-transmitting member 40, one type of phosphor may be used, or a plurality of types of phosphors may be used.

[0046] The phosphor may be uniformly dispersed in the first translucent member 40, or the wavelength conversion portion may be unevenly distributed near the light-emitting element rather than on the upper surface of the first translucent member 40. By unevenly distributing the phosphor near the light-emitting element, even if a phosphor that is sensitive to moisture is used, the resin or other material that forms the base of the first translucent member 40 also functions as a protective layer, thereby reducing the degradation of the phosphor. Examples of phosphors that are sensitive to moisture include KSF-based phosphors.

[0047] As shown in Figures 2A and 2B, the first light-transmitting member 40 may include at least one wavelength conversion section 41 containing a phosphor and at least one light-transmitting section 42 that does not contain a phosphor. By covering the surface of the wavelength conversion section 41 with the light-transmitting section 42, the light-transmitting section 42 also functions as a protective layer, thereby reducing the degradation of the phosphor. In this specification, "does not contain a phosphor" means that phosphors that are inevitably mixed in are not excluded, and includes phosphors with a phosphor content of 0.05% by weight or less.

[0048] The wavelength conversion unit 41 of the light-emitting device 1000 covers the first element surface 201, the second element surface 202, the third element surface 203, and the fourth element surface. This makes it easier to increase the volume of the wavelength conversion unit 41. This makes it easier for the wavelength conversion unit 41 to convert the light from the first light-emitting element 21, the light from the second light-emitting element 22, the light from the third light-emitting element 23, and / or the light from the fourth light-emitting element 24.

[0049] (Second translucent member 50) As shown in Figures 2A and 2B, the light-emitting device 1000 further includes a second light-transmitting member 50. The second light-transmitting member 50 is a light-transmitting member that covers at least a portion of the side surface 20S of the light-emitting element 20. By covering the side surface 20S of the light-emitting element 20 with the second light-transmitting member 50, the light-emitting element 20 can be protected from external forces. In addition, by covering the side surface 20S of the light-emitting element 20 with the light-transmitting second light-transmitting member 50, the light emitted from the side surface 20S of the light-emitting element 20 through the second light-transmitting member 50 can be more easily extracted to the outside of the light-emitting device 1000. The material of the second light-transmitting member 50 can be the same material as that of the first light-transmitting member 40.

[0050] It is preferable that the second light-transmitting member 50 is separated from the support 10. This makes it easier to reduce the absorption of light from the light-emitting element 20 by the support 10. It is preferable that the second light-transmitting member 50 is in contact with the side surface 20S of the light-emitting element 20. This makes it easier to improve the light extraction efficiency of the light-emitting device 1000. It is preferable that the second light-transmitting member 50 is in contact with the lower surface of the first light-transmitting member 40. This makes it easier to improve the light extraction efficiency of the light-emitting device 1000.

[0051] (Covering member 60) As shown in Figures 1, 2A, and 2B, the light-emitting device 1000 further includes a covering member 60. The covering member 60 is a member that exposes at least a portion of the upper surface of the first light-transmitting member 40 and covers at least a portion of the side surface of the first light-transmitting member 40. By covering the side surface of the first light-transmitting member 40 with the covering member 60, the first light-transmitting member 40 is more easily protected from external forces. It is preferable that the covering member 60 is light-reflective. This makes it possible to increase the contrast between the light-emitting region and the non-light-emitting region. In this specification, being light-reflective means that the reflectance with respect to the peak wavelength of the first light-emitting element is 60% or more. It is preferable that the covering member 60 is in contact with the lower surface of the light-emitting element 20. This makes it possible to reduce the absorption of light from the light-emitting element 20 by the support 10. This makes it easier to improve the light extraction efficiency of the light-emitting device 1000.

[0052] As the covering member 60, a resin material including a base resin and a light-reflecting material can be used. The base material of the covering member 60 can be the same material as that of the first light-transmitting member 40. The light-reflecting material of the covering member 60 can be the same material as that of the filler of the first light-transmitting member 40.

[0053] The covering member 60 may include a protrusion that extends above the upper surface of the first light-transmitting member 40. This makes it less likely for the upper surface of the first light-transmitting member 40 to come into contact with external components and less likely to be damaged. Furthermore, when the covering member 60 of the light-emitting device 1000 is coupled to the light guide plate with the upper surface of the first light-transmitting member 40 facing the side surface of the light guide plate, an air layer is more easily formed between the first light-transmitting member 40 and the light guide plate. This makes it easier to reduce unevenness in the brightness of the light emitted from the upper surface of the first light-transmitting member 40.

[0054] (Insulating film 70) As shown in Figure 4, the light-emitting device 1000 may include an insulating film 70 that covers a portion of the lower wiring 12B. A portion of the lower wiring 12B that covers the surface of the substrate 11 defining the recess 13 is exposed from the insulating film 70. By including the insulating film 70 in the light-emitting device 1000, it becomes easier to reduce the likelihood of the lower wiring 12B peeling off from the substrate 11.

[0055] [Second Embodiment] Next, with reference to Figures 6 to 8, the light-emitting device 1001 according to the second embodiment will be described. The light-emitting device 1001 differs from the light-emitting device 1000 according to the first embodiment mainly in the size of the first light-emitting element 21, the size of the second light-emitting element, the shape of the top wiring 12A, the shape of the joining member 30, and the shape of the first light-transmitting member 40. The differences from the light-emitting device 1000 according to the first embodiment will be described below. Note that names and reference numerals that are the same as those used in the embodiments already described indicate the same or similar components or configurations, and detailed explanations will be omitted as appropriate. The same applies to the descriptions of the embodiments shown below.

[0056] As shown in Figure 6, the first light-emitting element 21 and the second light-emitting element 22 are positioned side by side in the first direction. The first light-emitting element 21 and the third light-emitting element 23 are positioned side by side in the second direction. The fourth light-emitting element 24 is positioned side by side with the third light-emitting element 23 in the first direction. The fourth light-emitting element 24 is positioned side by side with the second light-emitting element 22 in the second direction.

[0057] In the light-emitting device 1001, the peak wavelength of the first light-emitting element 21 is in the range of 430 nm or more and less than 490 nm, the peak wavelength of the second light-emitting element 22 is in the range of 430 nm or more and less than 490 nm, the peak wavelength of the third light-emitting element 23 is in the range of 490 nm or more and less than 570 nm, and the peak wavelength of the fourth light-emitting element 24 is in the range of 490 nm or more and less than 570 nm. Note that the peak wavelengths of the first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, and / or the fourth light-emitting element 24 may be the same or different.

[0058] As shown in Figure 6, the first light-emitting element 21 may include portions on both sides of the portion where the first light-emitting element 21 and the third light-emitting element 23 overlap in the second direction, where the first light-emitting element 21 and the third light-emitting element 23 do not overlap in the second direction. In other words, the first light-emitting element 21 may include portions extending to the +X side and portions extending to the -X side from the portion where the first light-emitting element 21 and the third light-emitting element 23 overlap in the second direction. This makes it easier to extract light from the first light-emitting element 21. This makes it easier to improve the light extraction efficiency of the light-emitting device 1001. When the peak wavelength of the first light-emitting element 21 is in the range of 430 nm or more and less than 490 nm, and the peak wavelength of the third light-emitting element 23 is in the range of 490 nm or more and less than 570 nm, it becomes easier to extract light with a large blue emission component emitted from the first light-emitting element 21. This makes it easier to improve the brightness of blue light, which has lower luminosity than green light.

[0059] As shown in Figure 6, the second light-emitting element 22 may include portions on both sides of the portion where the second light-emitting element 22 and the fourth light-emitting element 24 overlap in the second direction, in which the second light-emitting element 22 and the fourth light-emitting element 24 do not overlap in the second direction. In other words, the second light-emitting element 22 may include portions extending to the +X side and portions extending to the -X side from the portion where the second light-emitting element 22 and the fourth light-emitting element 24 overlap in the second direction. This makes it easier to extract light from the second light-emitting element 22. This makes it easier to improve the light extraction efficiency of the light-emitting device 1001. When the peak wavelength of the second light-emitting element 22 is in the range of 430 nm or more and less than 490 nm, and the peak wavelength of the fourth light-emitting element 24 is in the range of 490 nm or more and less than 570 nm, it becomes easier to extract light with a large blue emission component emitted from the second light-emitting element 22. This makes it easier to improve the brightness of blue light, which has lower visual sensitivity than green light.

[0060] The top wiring 12A includes the first top wiring 12A1, the second top wiring 12A2, the third top wiring 12A3, the fourth top wiring 12A4, the fifth top wiring 12A5, the sixth top wiring 12A6, and the seventh top wiring 12A7. As shown in Figure 8, the length of the second top wiring 12A2 located between the first light-emitting element 21 and the third light-emitting element 23 in the second direction may vary in a top view. This makes it easier to confirm the misalignment of the first light-emitting element 21 and / or the third light-emitting element 23 with respect to the second top wiring 12A2 by the length of the second top wiring 12A2 located between the first light-emitting element 21 and the third light-emitting element 23 in the second direction. In other words, in a top view, the shape of the second top wiring 12A2 exposed from the first light-emitting element 21 and the third light-emitting element 23 makes it easier to confirm the misalignment of the first light-emitting element 21 and / or the third light-emitting element 23. In a top view, the second top wiring 12A2 of the light-emitting device 1001, exposed from the first light-emitting element 21 and the third light-emitting element 23, is arranged in the first direction in the order of the longer portion in the second direction, the shorter portion in the second direction, and the longer portion in the second direction.

[0061] As shown in Figure 7A, the bonding member 30 may be in continuous contact with the electrode 20E of the first light-emitting element 21, the electrode 20E of the second light-emitting element 22, and the second upper wiring 12A2. This makes it easier to increase the volume of the bonding member 30. As the volume of the bonding member 30 increases, the heat generated by the first light-emitting element 21 is more easily transferred to the bonding member 30. This reduces the temperature rise of the first light-emitting element, thus improving the reliability of the light-emitting device 1001.

[0062] As shown in Figure 6, the wavelength conversion section 41 and the light-transmitting section 42 may be positioned side by side in the second direction. In Figure 6, the location of the wavelength conversion section 41 is indicated by hatched lines. As shown in Figure 7B, the light-transmitting section 42 includes a first light-transmitting section 42A that covers the side surface of the wavelength conversion section 41, and a second light-transmitting section 42B that covers the top surface of the wavelength conversion section 41 and the top surface of the first light-transmitting section 42A. The first light-transmitting section 42A does not include any portion that overlaps with the wavelength conversion section 41 in a top view.

[0063] As shown in Figure 6, in a top view, the wavelength conversion unit 41 does not have to overlap with at least a portion of the third light-emitting element 23. In other words, in a top view, at least a portion of the third light-emitting element 23 may be exposed from the wavelength conversion unit 41. This reduces the amount of light from the third light-emitting element 23 that is blocked by the wavelength conversion unit 41. As a result, the light extraction efficiency of the light-emitting device 1001 is more easily improved. Similarly, in a top view, at least a portion of the first element surface 201 may be exposed from the wavelength conversion unit 41. In a top view, at least a portion of the second element surface 202 may be exposed from the wavelength conversion unit 41. In a top view, at least a portion of the fourth element surface may be exposed from the wavelength conversion unit 41.

[0064] As shown in Figure 6, in a top view, it is preferable that the area of ​​the overlapping portion between the wavelength conversion unit 41 and the first light-emitting element 21 is larger than the area of ​​the overlapping portion between the first light-transmitting portion 42A and the first light-emitting element 21. This makes it easier for the light from the first light-emitting element 21 to be converted by the wavelength conversion unit 41. In a top view, it is preferable that the area of ​​the overlapping portion between the wavelength conversion unit 41 and the second light-emitting element 22 is larger than the area of ​​the overlapping portion between the first light-transmitting portion 42A and the second light-emitting element 22. This makes it easier for the light from the second light-emitting element 22 to be converted by the wavelength conversion unit 41.

[0065] As shown in Figure 6, in a top view, it is preferable that the area of ​​the overlapping portion between the first light-transmitting portion 42A and the third light-emitting element 23 is larger than the area of ​​the overlapping portion between the wavelength conversion portion 41 and the third light-emitting element 23. This makes it easier to reduce the blocking of light from the third light-emitting element 23 by the wavelength conversion portion 41. Also, in a top view, it is preferable that the area of ​​the overlapping portion between the first light-transmitting portion 42A and the fourth light-emitting element 24 is larger than the area of ​​the overlapping portion between the wavelength conversion portion 41 and the fourth light-emitting element 24. This makes it easier to reduce the blocking of light from the fourth light-emitting element 24 by the wavelength conversion portion 41. If the wavelength conversion portion is divided into multiple parts, the area of ​​the overlapping portion between the wavelength conversion portion and the light-emitting element is the sum of the areas of the overlapping portions between each of the multiple wavelength conversion portions and the light-emitting elements. Similarly, if the first light-transmitting portion is divided into multiple parts, the area of ​​the portion where the first light-transmitting portion and the light-emitting element overlap is the sum of the areas of the portions where each of the multiple first light-transmitting portions and the light-emitting element overlap.

[0066] As shown in Figure 7B, the first translucent member 40 may include a groove 43 located in the second translucent portion 42B. Including the groove 43 in the first translucent member 40 increases the surface area of ​​the first translucent member 40. This makes it easier to improve the light extraction efficiency of the light-emitting device 1001. In the third direction, it is preferable that the surface of the first translucent member 40 defining the groove 43 is closer to the first light-emitting element 21 than at least a portion of the upper surface of the wavelength conversion portion 41. This allows the depth of the groove 43 to be increased. This makes it easier to increase the surface area of ​​the first translucent member 40. The method for forming the first translucent member 40 is not particularly limited. For example, the first translucent portion 42A and the second translucent portion 42B can be formed by curing an uncured resin material that is arranged to cover the side surface and the upper surface of the wavelength conversion portion 41.

[0067] [Third Embodiment] Next, with reference to Figures 9 to 12, the light-emitting device 1002 according to the third embodiment will be described. The light-emitting device 1002 differs from the light-emitting device 1000 according to the first embodiment mainly in the number of light-emitting elements 20, the number of upper wiring 12A, the number of lower wiring 12B, and the number of conductive parts 12C. The differences from the light-emitting device 1000 according to the first embodiment will be mainly described below.

[0068] As shown in Figure 9, the light-emitting element 20 of the light-emitting device 1002 includes a first light-emitting element 21, a second light-emitting element 22, a third light-emitting element 23, a fourth light-emitting element 24, a fifth light-emitting element 25, and a sixth light-emitting element 26. As shown in Figures 9 and 10, the first light-emitting element 21, the second light-emitting element 22, and the fifth light-emitting element 25 are positioned side by side in the first direction. The third light-emitting element 23, the fourth light-emitting element 24, and the sixth light-emitting element 26 are positioned side by side in the first direction. The first light-emitting element 21 and the third light-emitting element 23 are positioned side by side in the second direction. The second light-emitting element 22 and the fourth light-emitting element 24 are positioned side by side in the second direction. The fifth light-emitting element 25 and the sixth light-emitting element 26 are positioned side by side in the second direction.

[0069] In the light-emitting device 1002, the peak wavelength of the first light-emitting element 21 is in the range of 430 nm or more and less than 490 nm, the peak wavelength of the second light-emitting element 22 is in the range of 430 nm or more and less than 490 nm, the peak wavelength of the third light-emitting element 23 is in the range of 490 nm or more and less than 570 nm, the peak wavelength of the fourth light-emitting element 24 is in the range of 490 nm or more and less than 570 nm, the peak wavelength of the fifth light-emitting element 25 is in the range of 430 nm or more and less than 490 nm, and the peak wavelength of the sixth light-emitting element 26 is in the range of 430 nm or more and less than 490 nm. Note that the peak wavelengths of the light-emitting elements are not particularly limited. For example, the peak wavelength of the sixth light-emitting element 26 may be in the range of 490 nm or more and less than 570 nm.

[0070] As shown in Figure 11, the top wiring 12A of the light-emitting device 1002 includes a first top wiring 12A1, a second top wiring 12A2, a third top wiring 12A3, a fourth top wiring 12A4, a fifth top wiring 12A5, a sixth top wiring 12A6, a seventh top wiring 12A7, an eighth top wiring 12A8, a ninth top wiring 12A9, and a tenth top wiring 12A10. The first top wiring 12A1, the second top wiring 12A2, the third top wiring 12A3, and the eighth top wiring 12A8 are aligned in a first direction. The fourth top wiring 12A4, the fifth top wiring 12A5, the sixth top wiring 12A6, the seventh top wiring 12A7, the ninth top wiring 12A9, and the tenth top wiring 12A10 are aligned in a first direction. The first top wiring 12A1 and the fourth top wiring 12A4 are located side by side in the second direction. The second top wiring 12A2 and the fifth top wiring 12A5 are located side by side in the second direction. The second top wiring 12A2 and the sixth top wiring 12A6 are located side by side in the second direction. The third top wiring 12A3 and the seventh top wiring 12A7 are located side by side in the second direction. The third top wiring 12A3 and the ninth top wiring 12A9 are located side by side in the second direction. The eighth top wiring 12A8 and the tenth top wiring 12A10 are located side by side in the second direction.

[0071] As shown in Figure 12, the bottom wiring 12B includes the first bottom wiring 12B1, the second bottom wiring 12B2, the third bottom wiring 12B3, the fourth bottom wiring 12B4, the fifth bottom wiring 12B5, the sixth bottom wiring 12B6, the seventh bottom wiring 12B7, and the eighth bottom wiring 12B8. The bottom wiring 12B of the light-emitting device 1002 is arranged in the first direction in the order of fourth bottom wiring 12B4, first bottom wiring 12B1, second bottom wiring 12B2, fifth bottom wiring 12B5, third bottom wiring 12B3, sixth bottom wiring 12B6, eighth bottom wiring 12B8, and seventh bottom wiring 12B7.

[0072] The conductive part 12C of the light-emitting device 1002 includes a first conductive part 12C1, a second conductive part 12C2, a third conductive part 12C3, a fourth conductive part 12C4, a fifth conductive part 12C5, a sixth conductive part 12C6, a seventh conductive part 12C7, an eighth conductive part 12C8, a ninth conductive part 12C9, and a tenth conductive part 12C10. The first upper wiring 12A1 and the first lower wiring 12B1 are connected by the first conductive part 12C1. The fifth upper wiring 12A5 and the first lower wiring 12B1 are connected by the second conductive part 12C2. The second upper wiring 12A2 and the second lower wiring 12B2 are connected by the third conductive part 12C3. The third upper wiring 12A3 and the sixth lower wiring 12B6 are connected by the fourth conductive part 12C4. The fourth upper wiring 12A4 and the fourth lower wiring 12B4 are connected by the fifth conductive part 12C5. The sixth upper wiring 12A6 and the fifth lower wiring 12B5 are connected by the sixth conductive part 12C6. The seventh upper wiring 12A7 and the third lower wiring 12B3 are connected by the seventh conductive part 12C7. The eighth upper wiring 12A8 and the seventh lower wiring 12B7 are connected by the eighth conductive part 12C8. The ninth upper wiring 12A9 and the eighth lower wiring 12B8 are connected by the ninth conductive part 12C9. The tenth upper wiring 12A10 and the seventh lower wiring 12B7 are connected by the tenth conductive part 12C10.

[0073] The electrical connections of the first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, the fourth light-emitting element 24, the fifth light-emitting element 25, and the sixth light-emitting element 26 are not particularly limited. The light-emitting device 1002 includes a first circuit in which the first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, the fifth light-emitting element 25, and the sixth light-emitting element 26 are connected in series, and a second circuit that can be driven independently of the first circuit and is connected to the fourth light-emitting element 24. The fourth bottom wiring 12B4 is connected to the anode of the external power supply. The eighth bottom wiring 12B8 is connected to the cathode of the external power supply. In the first circuit of the light-emitting device 1002, current flows in the following order: fourth lower wiring 12B4, fifth conductive part 12C5, fourth upper wiring 12A4, third light-emitting element 23, fifth upper wiring 12A5, second conductive part 12C2, first lower wiring 12B1, first conductive part 12C1, first upper wiring 12A1, first light-emitting element 21, second upper wiring 12A2, second light-emitting element 22, third upper wiring 12A3, fifth light-emitting element 25, eighth upper wiring 12A8, eighth conductive part 12C8, seventh lower wiring 12B7, tenth conductive part 12C10, tenth upper wiring 12A10, sixth light-emitting element 26, ninth upper wiring 12A9, ninth conductive part 12C9, and eighth lower wiring 12B8. Because the first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, the fifth light-emitting element 25, and the sixth light-emitting element 26 are connected in series, the third conductive part 12C3 and the fourth conductive part 12C4 are not used. If the light-emitting device 1002 includes the third conductive part 12C3, the heat emitted by the first light-emitting element 21 will be more easily transferred to the second bottom wiring 12B2 via the third conductive part 12C3. This makes it easier to reduce the temperature rise of the first light-emitting element 21. If the light-emitting device 1002 includes the fourth conductive part 12C4, the heat emitted by the fifth light-emitting element 25 will be more easily transferred to the sixth bottom wiring 12B6 via the fourth conductive part 12C4. This makes it easier to reduce the temperature rise of the fifth light-emitting element 25. The third bottom wiring 12B3 is connected to the anode of the external power supply. The fifth bottom wiring 12B5 is connected to the cathode of the external power supply. In the second circuit of the light-emitting device 1002, current flows in the following order: third lower wiring 12B3, seventh conductive part 12C7, seventh upper wiring 12A7, fourth light-emitting element 24, sixth upper wiring 12A6, sixth conductive part 12C6, and fifth lower wiring 12B5.Furthermore, the fourth bottom wiring 12B4 may be connected to the cathode of the external power supply, and the eighth bottom wiring 12B8 may be connected to the anode of the external power supply. The third bottom wiring 12B3 may be connected to the cathode of the external power supply, and the fifth bottom wiring 12B5 may be connected to the anode of the external power supply.

[0074] [Fourth Embodiment] Next, with reference to Figures 13 and 14, the light-emitting device 1003 according to the fourth embodiment will be described. The light-emitting device 1003 differs from the light-emitting device 1002 according to the third embodiment mainly in the number of upper wirings 12A, the shape of the lower wirings 12B, and the number of conductive parts 12C. The differences from the light-emitting device 1003 according to the third embodiment will be mainly described below.

[0075] As shown in Figure 13, the top wiring 12A of the light-emitting device 1003 includes a first top wiring 12A1, a second top wiring 12A2, a third top wiring 12A3, a fourth top wiring 12A4, a fifth top wiring 12A5, a sixth top wiring 12A6, a seventh top wiring 12A7, an eighth top wiring 12A8, and a ninth top wiring 12A9. The first top wiring 12A1, the second top wiring 12A2, the third top wiring 12A3, and the eighth top wiring 12A8 are aligned in the first direction. The fourth top wiring 12A4, the fifth top wiring 12A5, the sixth top wiring 12A6, the seventh top wiring 12A7, and the ninth top wiring 12A9 are aligned in the first direction. The first top wiring 12A1 and the fourth top wiring 12A4 are aligned in the second direction. The second top wiring 12A2 and the fifth top wiring 12A5 are located side by side in the second direction. The second top wiring 12A2 and the sixth top wiring 12A6 are located side by side in the second direction. The third top wiring 12A3 and the seventh top wiring 12A7 are located side by side in the second direction. The eighth top wiring 12A8 and the ninth top wiring 12A9 are located side by side in the second direction.

[0076] As shown in Figure 14, the bottom wiring 12B includes the first bottom wiring 12B1, the second bottom wiring 12B2, the third bottom wiring 12B3, the fourth bottom wiring 12B4, the fifth bottom wiring 12B5, the sixth bottom wiring 12B6, the seventh bottom wiring 12B7, and the eighth bottom wiring 12B8. The bottom wiring 12B of the light-emitting device 1003 is arranged in the first direction in the order of fourth bottom wiring 12B4, first bottom wiring 12B1, second bottom wiring 12B2, fifth bottom wiring 12B5, third bottom wiring 12B3, sixth bottom wiring 12B6, eighth bottom wiring 12B8, and seventh bottom wiring 12B7.

[0077] The conductive part 12C of the light-emitting device 1003 includes a first conductive part 12C1, a second conductive part 12C2, a third conductive part 12C3, a fourth conductive part 12C4, a fifth conductive part 12C5, a sixth conductive part 12C6, a seventh conductive part 12C7, an eighth conductive part 12C8, and a ninth conductive part 12C9. The first upper wiring 12A1 and the first lower wiring 12B1 are connected by the first conductive part 12C1. The fifth upper wiring 12A5 and the first lower wiring 12B1 are connected by the second conductive part 12C2. The second upper wiring 12A2 and the second lower wiring 12B2 are connected by the third conductive part 12C3. The third upper wiring 12A3 and the sixth lower wiring 12B6 are connected by the fourth conductive part 12C4. The fourth upper wiring 12A4 and the fourth lower wiring 12B4 are connected by the fifth conductive part 12C5. The sixth upper wiring 12A6 and the fifth lower wiring 12B5 are connected by the sixth conductive part 12C6. The seventh upper wiring 12A7 and the third lower wiring 12B3 are connected by the seventh conductive part 12C7. The eighth upper wiring 12A8 and the eighth lower wiring 12B8 are connected by the eighth conductive part 12C8. The ninth upper wiring 12A9 and the seventh lower wiring 12B7 are connected by the ninth conductive part 12C9.

[0078] The light-emitting device 1003 includes a first circuit in which the first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, and the fifth light-emitting element 25 are connected in series, and a second circuit that can be driven independently of the first circuit and in which the fourth light-emitting element 24 and the sixth light-emitting element 26 are connected in series. The fourth bottom wiring 12B4 is connected to the anode of the external power supply. The eighth bottom wiring 12B8 is connected to the cathode of the external power supply. In the first circuit of the light-emitting device 1003, current flows in the following order: fourth lower wiring 12B4, fifth conductive part 12C5, fourth upper wiring 12A4, third light-emitting element 23, fifth upper wiring 12A5, second conductive part 12C2, first lower wiring 12B1, first conductive part 12C1, first upper wiring 12A1, first light-emitting element 21, second upper wiring 12A2, second light-emitting element 22, third upper wiring 12A3, fifth light-emitting element 25, eighth upper wiring 12A8, eighth conductive part 12C8, and eighth lower wiring 12B8. The third conductive part 12C3 and fourth conductive part 12C4 are not used because the first light-emitting element 21, second light-emitting element 22, third light-emitting element 23 and fifth light-emitting element 25 are connected in series. The light-emitting device 1003 includes a third conductive part 12C3, which makes it easier for the heat emitted by the first light-emitting element 21 to transfer to the second lower wiring 12B2 via the third conductive part 12C3. This makes it easier to reduce the temperature rise of the first light-emitting element 21. The light-emitting device 1003 includes a fourth conductive part 12C4, which makes it easier for the heat emitted by the fifth light-emitting element 25 to transfer to the sixth lower wiring 12B6 via the fourth conductive part 12C4. This makes it easier to reduce the temperature rise of the fifth light-emitting element 25. The seventh lower wiring 12B7 is connected to the anode of the external power supply. The fifth lower wiring 12B5 is connected to the cathode of the external power supply. In the second circuit of the light-emitting device 1003, current flows in the following order: 7th bottom wiring 12B7, 9th conductive part 12C9, 9th top wiring 12A9, 6th light-emitting element 26, 7th top wiring 12A7, 4th light-emitting element 24, 6th top wiring 12A6, 6th conductive part 12C6, and 5th bottom wiring 12B5. The 7th conductive part 12C7 is not used because the 4th light-emitting element 24 and the 6th light-emitting element 26 are connected in series. If the light-emitting device 1003 were equipped with the 7th conductive part 12C7, the heat generated by the 4th light-emitting element 24 would be more easily transferred to the 3rd bottom wiring 12B3 via the 7th conductive part 12C7. This would make it easier to reduce the temperature rise of the 4th light-emitting element 24.

[0079] This specification discloses light-emitting devices as described in the following sections. [Item 1] A support comprising a substrate having an upper surface and a lower surface located opposite to the upper surface, a plurality of upper surface wirings located on the upper surface, a plurality of lower surface wirings located on the lower surface, and a conductive portion located inside the substrate that connects one of the plurality of upper surface wirings to one of the plurality of lower surface wirings, The system comprises a first light-emitting element, a second light-emitting element, and a third light-emitting element located on the support, The first light-emitting element and the second light-emitting element are positioned side by side in the first direction, The first light-emitting element and the third light-emitting element are positioned side by side in a second direction perpendicular to the first direction, The aforementioned top wiring includes a first top wiring, a second top wiring, a third top wiring, a fourth top wiring, and a fifth top wiring. The first upper wiring, the second upper wiring, and the third upper wiring are positioned side by side in the first direction, The fourth upper wiring and the fifth upper wiring are positioned side by side in the first direction, The first upper wiring and the fourth upper wiring are positioned side by side in the second direction, The second upper wiring and the fifth upper wiring are positioned side by side in the second direction, The aforementioned lower wiring includes the first lower wiring, The conductive portion includes a first conductive portion connecting the first upper wiring and the first lower wiring, and a second conductive portion connecting the fifth upper wiring and the first lower wiring. The first light-emitting element is located on the first upper wiring and the second upper wiring and is electrically connected to the first upper wiring and the second upper wiring. The second light-emitting element is located on the second upper wiring and the third upper wiring and is electrically connected to the second upper wiring and the third upper wiring. The third light-emitting element is located on the fourth upper wiring and the fifth upper wiring and is electrically connected to the fourth upper wiring and the fifth upper wiring. [Item 2] The light-emitting device according to item 1, wherein the first light-emitting element and the first conductive part overlap when viewed from above. [Item 3] The light-emitting device according to item 1 or item 2, wherein, in a top view, the number of conductive parts overlapping with the first light-emitting element is greater than the number of conductive parts overlapping with the third light-emitting element. [Item 4] The light-emitting device according to any one of items 1 to 3, further comprising a conductive bonding member that is in continuous contact with the electrodes of the first light-emitting element, the electrodes of the second light-emitting element, and the second upper wiring. [Item 5] The light-emitting device according to any one of items 1 to 4, wherein the first light-emitting element includes portions on both sides of the portion in which the first light-emitting element and the third light-emitting element overlap in the second direction, and portions in which the first light-emitting element and the third light-emitting element do not overlap in the second direction. [Item 6] The light-emitting device according to any one of items 1 to 5, further comprising a fourth light-emitting element aligned with the third light-emitting element in the first direction and aligned with the second light-emitting element in the second direction. [Item 7] The peak wavelength of the first light-emitting element is in the range of 430 nm or more and less than 490 nm. The peak wavelength of the second light-emitting element is in the range of 430 nm or more and less than 490 nm. The light-emitting device according to any one of items 1 to 6, wherein the peak wavelength of the third light-emitting element is in the range of 490 nm or more and less than 570 nm. [Item 8] The light-emitting device according to any one of items 1 to 7, wherein the first light-emitting element, the second light-emitting element, and the third light-emitting element are connected in series. [Item 9] The first lower wiring includes a first portion that overlaps with the first conductive portion in the second direction, and a second portion that overlaps with the second conductive portion in the second direction. The light-emitting device according to any one of items 1 to 8, wherein the maximum length of the first portion in the second direction is longer than the maximum length of the second portion in the second direction. [Item 10] The aforementioned lower wiring includes a second lower wiring that is aligned with the first lower wiring in the first direction, The light-emitting device according to item 9, wherein the length of the first bottom wiring in the second direction, including the end of the second portion closest to the second bottom wiring in the first direction, is shorter than the length of the first bottom wiring in the second direction, including the end of the second portion furthest from the second bottom wiring in the first direction.

[0080] The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the present invention is also included in the embodiments described above in which some components or processes are added, deleted, or modified. Furthermore, the embodiments described above can be implemented in combination with each other. [Industrial applicability]

[0081] The embodiments of this disclosure are useful for various lighting sources, automotive light sources, display light sources, and the like. The embodiments of this disclosure are particularly advantageous for backlight units directed towards liquid crystal display devices. [Explanation of Symbols]

[0082] 10 Support 20 Light-emitting elements 21 First light-emitting element 22 Second light-emitting element 23 Third light-emitting element 24. Fourth light-emitting element 30 Joining members 40 First translucent member 41 Wavelength conversion section 42 Translucent part 50 Second translucent member 60 Covering member 70 insulating film 1000, 1001, 1002, 1003 Light-emitting devices

Claims

1. A support comprising a substrate having an upper surface and a lower surface located opposite to the upper surface, a plurality of upper surface wirings located on the upper surface, a plurality of lower surface wirings located on the lower surface, and a conductive portion located inside the substrate that connects one of the plurality of upper surface wirings to one of the plurality of lower surface wirings, The system comprises a first light-emitting element, a second light-emitting element, and a third light-emitting element located on the support, The first light-emitting element and the second light-emitting element are positioned side by side in the first direction, The first light-emitting element and the third light-emitting element are positioned side by side in a second direction perpendicular to the first direction, The aforementioned top wiring includes a first top wiring, a second top wiring, a third top wiring, a fourth top wiring, and a fifth top wiring. The first upper wiring, the second upper wiring, and the third upper wiring are positioned side by side in the first direction. The fourth upper wiring and the fifth upper wiring are positioned side by side in the first direction, The first upper wiring and the fourth upper wiring are positioned side by side in the second direction, The second upper wiring and the fifth upper wiring are positioned side by side in the second direction. The aforementioned lower wiring includes the first lower wiring, The conductive portion includes a first conductive portion connecting the first upper wiring and the first lower wiring, and a second conductive portion connecting the fifth upper wiring and the first lower wiring. The first light-emitting element is located on the first upper wiring and the second upper wiring and is electrically connected to the first upper wiring and the second upper wiring. The second light-emitting element is located on the second upper wiring and the third upper wiring and is electrically connected to the second upper wiring and the third upper wiring. The third light-emitting element is located on the fourth upper wiring and the fifth upper wiring and is electrically connected to the fourth upper wiring and the fifth upper wiring.

2. The light-emitting device according to claim 1, wherein the first light-emitting element and the first conductive part overlap in a top view.

3. The light-emitting device according to claim 1 or claim 2, wherein, in a top view, the number of conductive parts overlapping with the first light-emitting element is greater than the number of conductive parts overlapping with the third light-emitting element.

4. The light-emitting device according to claim 1 or claim 2, further comprising a conductive bonding member that is in continuous contact with the electrode of the first light-emitting element, the electrode of the second light-emitting element, and the second upper wiring.

5. The light-emitting device according to claim 1 or claim 2, wherein the first light-emitting element includes portions on both sides of the portion where the first light-emitting element and the third light-emitting element overlap in the second direction, wherein the first light-emitting element and the third light-emitting element do not overlap in the second direction.

6. The light-emitting device according to claim 1 or claim 2, further comprising a fourth light-emitting element that is aligned with the third light-emitting element in the first direction and aligned with the second light-emitting element in the second direction.

7. The peak wavelength of the first light-emitting element is in the range of 430 nm or more and less than 490 nm. The peak wavelength of the second light-emitting element is in the range of 430 nm or more and less than 490 nm. The light-emitting device according to claim 1 or claim 2, wherein the peak wavelength of the third light-emitting element is in the range of 490 nm or more and less than 570 nm.

8. The light-emitting device according to claim 1 or claim 2, wherein the first light-emitting element, the second light-emitting element, and the third light-emitting element are connected in series.

9. The first lower wiring includes a first portion that overlaps with the first conductive portion in the second direction, and a second portion that overlaps with the second conductive portion in the second direction. The light-emitting device according to claim 1 or claim 2, wherein the maximum length of the first portion in the second direction is longer than the maximum length of the second portion in the second direction.

10. The aforementioned lower wiring includes a second lower wiring that is aligned with the first lower wiring in the first direction. The light-emitting device according to claim 9, wherein the length of the first lower wiring in the second direction, including the end of the second portion closest to the second lower wiring in the first direction, is shorter than the length of the first lower wiring in the second direction, including the end of the second portion furthest from the second lower wiring in the first direction.

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