Base station equipment and method for cooling base station equipment

Abstract

The present invention provides a base station device and the like that can improve heat dissipation performance by using a heat sink, which includes a base and heat dissipation fins provided diagonally to the base, in a naturally air-cooled base station device. [Solution] A base station device comprising a device body installed at a downward angle, and a heat sink attached to the device body, wherein the heat sink includes a base including a base surface and at least one heat dissipation fin, the heat dissipation fin being provided at an angle to the base surface.

Description

[Technical Field]

[0001] This disclosure relates to base station equipment and a method for cooling base station equipment. [Background technology]

[0002] Figure 13 is a perspective view of the heat sink 200 described in Patent Document 1. Figure 14 is a perspective view of the heat sink 300 described in Patent Document 2. In Figures 13 and 14, the X-axis represents the horizontal direction of the device, the Y-axis represents the vertical direction of the device, and the Z-axis represents the thickness direction of the device.

[0003] Conventionally, as shown in Figure 13, for example, a heat sink 200 comprising a base 201 and heat dissipation fins 202 is known in Patent Document 1. The heat dissipation fins 202 on both sides in the X direction are provided obliquely to the Y axis within the base surface 201a of the base 201 when viewed from the front of the heat sink 200, that is, when viewed from the direction of arrow AR3 in Figure 13. On the other hand, when viewed from the side, that is, when viewed from the direction of arrow AR4 in Figure 13, the heat dissipation fins 202 on both sides in the X direction are provided obliquely to the Y axis, within the base surface 201a extending in the Z direction, along the normal AX. 201a It is provided in a state that extends in the direction. As shown in Figure 14, a similar heat sink 300 is also described in Patent Document 2. In Figure 14, reference numeral 301 represents the base, reference numeral 301a represents the base surface of the base 301, and reference numeral 302 represents the heat dissipation fin provided on the base surface 301a. Also, reference numeral AX 301a This represents the normal to the base surface 301a.

[0004] In response to this, the inventors investigated how to improve the heat dissipation performance of a naturally air-cooled base station device by using a heat dissipation fin that, in a side view, has an acute angle of inclination with respect to the normal of the base surface extending in the Z direction, and extends upward in the direction of gravity. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] International Publication No. 2021 / 148140 [Patent Document 2] International Publication No. 2023 / 246095 [Overview of the project] [Problems that the invention aims to solve]

[0006] However, the aforementioned Patent Documents 1 and 2 do not mention at all how to improve the heat dissipation performance of naturally air-cooled base station equipment by using heat dissipation fins that, when viewed from the side, have a sharp angle of inclination with respect to the normal to the base surface and extend upward in the direction of gravity, indicating that there is room for improvement. [Means for solving the problem]

[0007] The base station equipment of the present disclosure comprises a device body including a heat sink, which is installed at a downward angle with the antenna surface facing downward and the heat sink surface facing upward, the heat sink including a base including a base surface and at least one heat dissipation fin, the heat dissipation fin being provided at an angle to the base surface.

[0008] The cooling method for the base station device of this disclosure uses a base including a base surface and a heat sink including at least one heat dissipation fin provided at an angle to the base surface. [Effects of the Invention]

[0009] This disclosure provides a base station device and a cooling method for a base station device that can improve the heat dissipation performance of a naturally air-cooled base station device by using heat dissipation fins that, in a side view, have an acute angle of inclination with respect to the normal to the base surface and extend upward in the direction of gravity. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic side view of a base station device 1 installed at a downward angle with the antenna surface F1 facing downwards in the direction of gravity and the heat sink surface F2 facing upwards in the direction of gravity. [Figure 2] (a) Example of top heat in a general heat sink, (b) Example of bottom heat in a general heat sink. [Figure 3] Perspective view of the heat sink 30. [Figure 4] Enlarged perspective view within the rectangle B1 in FIG. 3. [Figure 5] Side view of the heat sink 30 as viewed from the direction of arrow AR2 in FIG. 3. [Figure 6] (a) Side view showing the schematic of the heat sink 30 of the present disclosure, (b) Side view showing the schematic of a prior art heat sink 100 in which the heat dissipation fins 102 are provided obliquely within the base surface 101a. [Figure 7] (a) Diagram in which the movement path of the exhaust gas 40 is drawn in FIG. 6(a), (b) Diagram representing the left half of the front view of a prior art heat sink 100 showing the schematic of the heat dissipation fins 102. [Figure 8] Graph of simulation results simulating the base station device 1. [Figure 9] Graph of simulation results simulating the base station device 1. [Figure 10] (a)(b)(c) Examples in which the inclination angle θ2 of the heat dissipation fins 32 is increased as the distance from the base surface 31a increases, that is, as the Z coordinate increases. [Figure 11] Example in which a convex portion with a groove is provided on the base surface 31a, and the heat dissipation fins 32 manufactured separately from the base 31 are joined to this groove. [Figure 12] (a) Example of the heat sink 30 provided with a rotation structure 50 for rotating the heat dissipation fins 32, an example before adjusting the inclination angle θ2, (b) Example after adjusting the inclination angle θ2. [Figure 13] Perspective view of the heat sink 200 described in Patent Document 1. [Figure 14] Perspective view of the heat sink 300 described in Patent Document 2.

MODE FOR CARRYING OUT THE INVENTION

[0011] In the following, specific embodiments applying this disclosure will be described in detail with reference to the drawings. In each drawing, the same elements are denoted by the same reference numerals, and redundant explanations will be omitted where necessary for clarity. In each drawing of this disclosure, the X-axis represents the horizontal direction of the device, the Y-axis represents the vertical direction of the device, and the Z-axis represents the thickness direction of the device.

[0012] First, we will explain the matters that the inventors have considered.

[0013] With the development of the Internet of Things (IoT) and the resulting increase in data traffic from mobile phones and other devices, the amount of heat generated by base station equipment that relays long-distance communications is on the rise. However, the development of materials for the heat-generating elements has not progressed, and the upper limit of the element temperature remains almost constant. Therefore, there is a need to improve heat dissipation performance. This improvement in heat dissipation performance can be achieved, for example, by reducing the thermal resistance of the heat sink. The element temperature can be simply expressed by the following equation (1). Element temperature = ambient temperature + temperature rise of the heatsink. = Ambient temperature + Heat generation × Thermal resistance of heat sink = Ambient temperature + Heat generation amount × (Heat exchange area) -1 × Convective heat transfer coefficient -1 )... (1)

[0014] The simplest way to improve heat dissipation performance is to increase the heat exchange area by making the heat sink larger. However, since base station equipment is installed on existing facilities such as utility poles and walls, weight reduction is a customer value proposition from the perspective of ease of installation and the load-bearing capacity of the installation site, making this measure undesirable.

[0015] The next simple measure would be to increase the convective heat transfer coefficient through forced air cooling. However, since base station equipment is installed at high altitudes outdoors, this measure is also undesirable because it would increase the cost of regular maintenance, inspection, and replacement of fans, dust filters, and other components.

[0016] In light of the above, as a measure to improve the convective heat transfer coefficient, for example, a method of adjusting the angle of the heat dissipation fins within the base surface (XY plane) of the heat sink has been considered, as shown in Patent Document 1 and Patent Document 2.

[0017] However, even with these measures in place, we are reaching the limits of heat dissipation performance.

[0018] In light of the above, the present inventors will now describe the base station device 1 that can improve heat dissipation performance.

[0019] Figure 1 is a schematic side view of a base station device 1 installed at a downward angle with the antenna surface F1 facing downwards in the direction of gravity and the heat sink surface F2 facing upwards in the direction of gravity. The downward angle is defined as the normal AX between the horizontal plane H and the antenna surface F1. F1 This refers to the downward angle with respect to the horizontal plane H. In Figure 1, the sign θ1 represents the downward angle. Hereafter, it will be referred to as the downward angle θ1. In Figure 1, the downward angle θ1 = 25 degrees.

[0020] Base station device 1 measures approximately 400mm in width, 600mm in height, and 100mm to 200mm in thickness. It is assumed that base station device 1 will be used with natural air cooling. In other words, base station device 1 does not have means for forced air cooling, such as cooling fans.

[0021] Basically, base station equipment 1 is installed outdoors. In this case, if there are obstacles between base station equipment 1 and the communication partner, the radio waves will be attenuated, and the stability of communication will decrease. To avoid this, it is desirable to install base station equipment 1 at a difference in elevation from the communication partner. Here, since the communication partner is basically a user near the ground, base station equipment 1 is often installed at a higher location. The further the antenna is from the front, the weaker the radio waves become, and the less stable the communication becomes. Therefore, when installing base station equipment 1 at a high location, it is desirable to install it at a downward angle, with the antenna surface F1 of base station equipment 1 facing downwards toward the communication partner below, i.e., downwards in the direction of gravity, and the heat sink surface F2 facing upwards in the direction of gravity.

[0022] According to this disclosure, the heat dissipation fins 32 of the heat sink 30 constituting the base station device 1 are provided with their tips tilted upward in the direction of gravity. Therefore, when the base station device 1 is installed at a downward angle as shown in Figure 1, the heat sink 30 can be made to have a state closer to bottom heating, which has higher heat dissipation performance than top heating.

[0023] Figure 2(a) shows an example of top heating in a typical heatsink, and Figure 2(b) shows an example of bottom heating in a typical heatsink.

[0024] As shown in Figure 2(a), in the top heat configuration, the base 2a of the heat sink 2 with the heat source 3 is positioned above the heat dissipation fins 2b of the heat sink 2. On the other hand, as shown in Figure 2(b), in the bottom heat configuration, the base 2a of the heat sink 2 with the heat source 3 is positioned below the heat dissipation fins 2b of the heat sink 2.

[0025] In the case of top heating shown in Figure 2(a), the exhaust 40 after heat exchange is obstructed by the base 2a and heat dissipation fins 2b, making it difficult for it to detach from the heatsink 2. On the other hand, in the case of bottom heating shown in Figure 2(b), the exhaust 40 after heat exchange can detach smoothly from the heatsink 2 without being obstructed by the base 2a or heat dissipation fins 2b. Therefore, generally speaking, the heat dissipation performance of a heatsink is improved when used in a bottom heating configuration rather than a top heating configuration.

[0026] According to this disclosure, since the heat dissipation fins 32 are provided with their tips tilted upward in the direction of gravity at a predetermined angle, the heat sink 30 can be brought closer to a bottom-heat state with a smaller depression angle θ1. As a result, heat dissipation performance can be improved.

[0027] Next, we will describe an example configuration of base station device 1.

[0028] As shown in Figure 1, the base station device 1 comprises an antenna unit 10, a circuit board unit 20, and a heat sink 30. The antenna unit 10, the circuit board unit 20, and the heat sink 30 constitute the main body of the device 70. The main body of the device 70 is installed at a downward angle as shown in Figure 1.

[0029] The antenna section 10, although not shown in the diagram, includes, for example, an antenna and a radome, which is a cover for protecting the antenna. For example, multiple patch antennas may be used as the antenna.

[0030] The circuit board section 20, although not shown in the diagram, includes elements such as an FPGA (Field Programmable Gate Array) for signal processing, a BPF (Band-pass filter) for noise processing, a power supply for supplying power to antennas and other elements, a circuit board equipped with connectors for connecting to external devices, and a housing for protecting these components.

[0031] Next, we will explain the heatsink 30.

[0032] Figure 3 is a perspective view of the heat sink 30, Figure 4 is an enlarged perspective view of the rectangle B1 in Figure 3, and Figure 5 is a side view of the heat sink 30 viewed from the direction of arrow AR2 in Figure 3. As shown in Figures 3 to 5, the heat sink 30 comprises a base 31 that contacts a heat source and receives heat, and a plurality of heat dissipation fins 32. The heat source is a part that generates heat when the base station device 1 is operating, for example, an element (not shown) mounted on the substrate 20. Note that at least one heat dissipation fin 32 is sufficient.

[0033] The base 31 is the part of the heat sink 30 that contacts the heat source and receives heat. As shown in Figure 5, the base 31 is a flat plate-shaped base with thickness in the Z direction, including one main surface 31a containing a plurality of heat dissipation fins 32, and the other main surface 31b on the opposite side that contacts the heat source and receives heat. Hereinafter, the one main surface 31a containing the plurality of heat dissipation fins 32 will be referred to as the base surface 31a. The base surface 31a is in the XY plane, and the other main surface 31b is a surface parallel to the XY plane. The heat dissipation fins 32 are the part that dissipates the heat received from the base 31 to the outside air. Although not shown, the substrate portion 20 is attached to the heat sink 30 by screws or the like, with the substrate portion 20, which is the heat source, connected to the other main surface 31b of the heat sink 30. At that time, the element that is the heat source is in contact with the other main surface 31b of the heat sink 30 via a thermal interface material (TIM) or a vapor chamber or other heat diffusion material. Although not shown in the diagram, the housings constituting the base 31 and the circuit board portion 20 may be integrated with each other or may be separate components.

[0034] As shown in Figure 3, the heat dissipation fins 32 include a group of heat dissipation fins 32A positioned to the left of the center line AX1 extending in the Y direction, and a group of heat dissipation fins 32B positioned to the right of the center line AX1. The heat dissipation fins 32A and 32B are arranged symmetrically with respect to the center line AX1 and have similar configurations. Therefore, the heat dissipation fins 32A will be described as a representative example, and the description of the heat dissipation fins 32B will be omitted. Hereafter, when heat dissipation fins 32A and 32B are not distinguished, they will be referred to as heat dissipation fins 32.

[0035] The heat dissipation fin group 32A is composed of multiple flat plate-like bodies with their left end inclined upward in the direction of gravity. The heat dissipation fin group 32A is provided on the base surface 31a of the base 31 in a manner that is parallel to each other and spaced apart by a distance P1 in the Y direction.

[0036] The heat dissipation fins 32A and 32B are arranged in the X direction with a space S1 extending in the Y direction between them.

[0037] The heat dissipation fins 32A and 32B, when viewed from the front of the heat sink 30, that is, from the direction of arrow AR1 in Figure 3, form an approximately V shape that opens upward within the base surface 31a. Note that the heat dissipation fins 32A and 32B are not limited to an approximately V shape when viewed from the front of the heat sink 30; they may also form an approximately inverted V shape, where the heat dissipation fins 32A and 32B are reversed. Furthermore, the number of heat dissipation fins 32A and 32B may increase, or they may not be the same number, for example, to form an approximately N shape or an approximately W shape.

[0038] On the other hand, the heat dissipation fins 32 are positioned diagonally to the base surface 31a when viewed from the side of the heat sink 30, that is, when viewed from the direction of arrow AR2 in Figure 3. This point will be explained below in comparison to a conventional heat sink 100 in which the heat dissipation fins 102 are positioned diagonally within the base surface 101a.

[0039] Figure 6(a) is a schematic side view of the heat sink 30 of the present disclosure, and Figure 6(b) is a schematic side view of a conventional heat sink 100 in which heat dissipation fins 102 are provided diagonally within the base surface 101a. Figure 6(a) is a side view taken from the direction of arrow AR2 in Figure 3. Figure 6(b) is also a side view taken from the same direction as arrow AR2 in Figure 3 (not shown).

[0040] As shown in Figure 6(a), the heat dissipation fin 32 of this disclosure is provided at an angle to the base surface 31a in a side view. Specifically, the heat dissipation fin 32 is provided with its tip tilted upward in the direction of gravity at a predetermined angle in a side view. More specifically, the heat dissipation fin 32 is provided along the normal AX of the base surface 31a extending in the Z direction in a side view. 31aThe heat dissipation fin 102 is provided on the base surface 31a with an acute angle of inclination θ2 and extending upward in the direction of gravity. The angle of inclination θ2 is an example of a predetermined angle in this disclosure. The angle of inclination θ2 is acute, that is, an angle greater than 0 degrees and less than 90 degrees. Note that the angle of inclination θ2 may be expressed as a positive number to indicate that it is an angle on the upward side in the direction of gravity. In contrast, as shown in Figure 6(b), the conventional heat dissipation fin 102 is provided perpendicular to the base surface 101a in a side view. Specifically, the conventional heat dissipation fin 102 is provided perpendicular to the normal AX of the base surface 101a extending in the Z direction in a side view. 101a The angle of inclination relative to that, i.e., the angle corresponding to the inclination angle θ2, extends in the direction of 0 degrees.

[0041] The heat sink 30 with the above configuration may be manufactured as a single piece by, for example, casting a metal material such as aluminum or copper, or by machining an aluminum or copper-based metal material.

[0042] Furthermore, the heat dissipation fin 32 may be constructed not only by casting or cutting as described above, but also by first manufacturing a heat dissipation fin similar to the conventional technology described above, that is, a heat dissipation fin similar to the heat dissipation fin 102 provided perpendicular to the base surface 101a in a side view as shown in Figure 6(b), and then bending this heat dissipation fin.

[0043] Next, an example of the operation of the base station device 1 with the above configuration will be described.

[0044] Figure 7(a) is a diagram in which the exhaust path 40 is drawn on top of Figure 6(a). Figure 7(b) is a diagram showing the left half of a front view of a conventional heat sink 100, illustrating the outline of the heat dissipation fins 102. Note that in Figure 7(b), only the left half of the conventional heat sink 100 is shown for the sake of explanation.

[0045] When the base station device 1 is operating, the elements on the substrate 20 generate heat. The heat generated by these elements is transferred to the base 31 and then the heat dissipation fins 32 of the heat sink 30 via heat diffusing materials such as a thermal conductive material (TIM) and a vapor chamber, and is dissipated to the outside of the base station device 1 by exchanging heat with the cooler outside air. At this time, the outside air after heat exchange, i.e., exhaust air 40, decreases in density as its temperature rises, so in the case of natural air cooling, due to buoyancy, as shown in Figure 7(a), it moves upward in the direction of gravity, mainly in the direction of the height H1 of the heat dissipation fins 32, and detaches from the heat sink 30 when it reaches the tip 32a.

[0046] Next, the effects of the base station device 1 with the above configuration will be explained.

[0047] In the prior art, as shown in Figure 6(b), the heat dissipation fins 102 of the prior art are provided perpendicular to the base surface 101a in a side view. Therefore, as shown in Figure 7(b), the exhaust 40 mainly moves in the direction of the length L1 of the heat dissipation fins 102, and detaches from the heat sink 100 when it reaches the end 102a in the direction of the side of the device.

[0048] In the case of a typical base station device using roughly V-shaped heat dissipation fins, the height H1 of the heat dissipation fins is approximately 50-120 mm, and the length L1 of the heat dissipation fins is approximately 280 mm. That is, the length L1 of the heat dissipation fins > the height H1 of the heat dissipation fins, and since the heat sink 30 with the above configuration has a shorter flow path length than the conventional heat sink 100, the flow path resistance is smaller. As a result, the heat sink 30 with the above configuration has a higher airflow and a higher convective heat transfer coefficient, thus improving heat dissipation performance. Therefore, the heat sink 30, and consequently the base station device 1, can be made smaller and lighter.

[0049] Furthermore, in the conventional technology described above, the height of the heat dissipation fin 102 in the Z direction is H1, as shown in Figure 6(b). In contrast, with the base station device 1 configured above, the height of the heat dissipation fin 32 in the Z direction is H1 × cosθ2, as shown in Figure 6(a). In other words, with the base station device 1 configured above, the height of the heat dissipation fin 32 in the Z direction can be reduced compared to the conventional technology. As a result, a thinner base station device 1 in the Z direction can be realized compared to the conventional technology.

[0050] Figures 8 and 9 are graphs of simulation results for base station equipment 1. The simulation was performed in three dimensions using Simcenter Flotherm XT for a heat sink with a width of 400 mm, a length of 600 mm, and a roughly V-shaped heat dissipation fin with a height of 50 mm in the Z direction. Referring to Figure 8, it can be seen that when the depression angle θ1 = 50 degrees, the heat dissipation performance is higher when the tilt angle θ2 = 0 degrees < tilt angle θ2 < 10 degrees (disclosed) than when the tilt angle θ2 = 0 degrees (conventional), and is maximized when the tilt angle θ2 = 5 degrees. On the other hand, referring to Figure 9, comparing the tilt angle θ2 = 0 degrees (conventional) and the tilt angle θ2 = 5 degrees (disclosed), it can be seen that the performance is almost the same when the depression angle θ1 ≤ 25 degrees, and when the depression angle θ1 ≤ 25 degrees < 25 degrees, the heat dissipation performance is higher when the tilt angle θ2 = 5 degrees (disclosed). Note that the tilt angle θ2 is not limited to 5 degrees. In other words, since a tilt angle θ2 = 5 degrees is the condition for maximizing heat dissipation performance, if there is a margin in heat dissipation performance, the tilt angle θ2 may be greater than or less than 5 degrees. To put it another way, an appropriate angle may be adopted for the tilt angle θ2 depending on the balance between the required heat dissipation performance and the size of the device. Furthermore, the fact that heat dissipation performance is maximized at a tilt angle θ2 = 5 degrees is under the conditions of this simulation, and it will change depending on conditions such as the dimensions of the heat sink.

[0051] As described above, according to this embodiment, the heat dissipation fin is, in a side view, normal AX of the base surface 31a. 31a By using heat dissipation fins 32 that have an acute inclination angle θ2 and extend upward in the direction of gravity, the heat dissipation performance of the naturally air-cooled base station device 1 can be improved.

[0052] Next, a modified example will be described.

[0053] <Modified Example 1> In the above embodiment, a flat plate-shaped body is used as the heat radiation fin 32, and the inclination angle θ2 with respect to the normal line AX of the base surface 31a 31a has been described as being uniform (constant) regardless of the distance from the base surface 31a, but it is not limited to this.

[0054] For example, as shown in FIGS. 10(a), 10(b), and 10(c), the inclination angle θ2 of the heat radiation fin 32 may vary according to the distance from the base surface 31a. That is, the inclination angle θ2 of the heat radiation fin 32 may be non-uniform. FIGS. 10(a), 10(b), and 10(c) are examples in which the inclination angle θ2 of the heat radiation fin 32 increases as the distance from the base surface 31a increases, that is, as the Z coordinate increases.

[0055] According to this Modified Example 1, the exhaust flow in the height direction of the heat radiation fin 32 gradually changes upward in the gravitational direction.

[0056] If the heat radiation fin 32 is bent at its root, the sharp corner at the corner will form a stagnant flow, so bending at a location slightly away from its root will result in a smaller flow path resistance. Also, instead of bending the heat radiation fin 32 to the target angle at once, bending it in multiple stages will result in a smaller total flow path resistance. Therefore, as described above, by changing the inclination angle θ2 of the heat radiation fin 32 non-uniformly according to the Z coordinate, the air volume increases and the convective heat transfer coefficient increases, thus improving the heat radiation performance.

[0057] <Modified Example 2> In <Modified Example 1>, an example in which the inclination angle θ2 of the heat radiation fin 32 is changed non-uniformly according to the Z coordinate has been described, but the inclination angle θ2 of the heat radiation fin 32 may also be changed non-uniformly according to the X coordinate and the Y coordinate.

[0058] Generally, the closer to the center of the device, the greater the number of elements attached to the heat sink and the greater the amount of heat generated, meaning the heat density is higher and the required heat dissipation performance is also higher. Therefore, in these areas only, the inclination angle θ2 of the heat dissipation fins 32 may be changed non-uniformly according to the Z coordinate, as shown in <Modification 1>. Conversely, the closer to the corners of the device, the lower the heat density tends to be, and the required heat dissipation performance is also lower. Therefore, in these areas only, the number of times the heat dissipation fins 32 are bent may be reduced compared to areas with high heat density, or they may not be bent at all.

[0059] According to this modified example 2, a heat sink 30 with heat dissipation performance corresponding to the heat density conditions can be provided.

[0060] <Variation 3> In the above embodiment, an example was described in which the base 31 and the heat dissipation fins 32 are manufactured as a single unit, but the invention is not limited to this. For example, the heat sink 30 may be manufactured by combining the base 31 and the heat dissipation fins 32, which are manufactured separately.

[0061] Figure 11 shows an example in which a protrusion with a groove formed on the base surface 31a is provided, and the lower end of a heat dissipation fin 32, manufactured separately from the base 31, is joined to this groove. The joining method may be, for example, welding, crimping, or adhesive. The materials of the base 31 and the heat dissipation fin 32 may be the same or different.

[0062] Before joining the base 31 and the heat sink fin 32, the heat sink fin 32 is bent in advance. Note that the heat sink fin 32 may be manufactured as a flat heat sink fin and then bent, or it may be manufactured as a pre-bent heat sink fin.

[0063] According to this modified example 3, the manufacturing of the heat sink 30 becomes easier. In particular, the effect is greater when the heat dissipation fins 32 are tilted in both the front view and the side view, i.e., in both the XY plane and the YZ plane, as shown in Figure 3, or when the tilt angle of the heat dissipation fins 32 is non-uniform, as in modified examples 1 and 2.

[0064] Furthermore, parts with complex shapes and high manufacturing difficulty are generally cast, and there is a tendency to use materials with low thermal conductivity. However, according to this modified example 3, different materials can be used depending on the manufacturing difficulty of the base 31 and the heat dissipation fins 32. Therefore, by using a material with high thermal conductivity in certain parts, the heat dissipation performance can be improved.

[0065] <Modification 4> In the above embodiment, an example was described in which the inclination angle θ2 of the heat dissipation fins 32 is fixed, but the invention is not limited to this. For example, the heat sink 30 may be equipped with a rotating structure (an example of an inclination angle adjustment mechanism in this disclosure) that rotates the heat dissipation fins 32 in order to adjust the inclination angle θ2.

[0066] Figure 12(a) shows an example of a heat sink 30 equipped with a rotating structure 50 for rotating the heat sink fins 32, before the tilt angle θ2 adjustment, and Figure 12(b) shows an example after the tilt angle θ2 adjustment. The rotating structure 50 is, for example, a hinge and is provided, for example, at the base of the heat sink fins 32. In addition, a jig 60 may be provided to fix the spacing between the heat sink fins 32 in order to keep each heat sink fin 32 parallel to each other. Although not shown, the heat sink fins 32 may be rotated manually, or they may be rotated electrically using a power source such as a motor and a mechanism to transmit the rotation of the motor. The rotating structure 50 may be provided at a location other than the base of the heat sink fins 32. Furthermore, there may be multiple rotating structures 50.

[0067] According to this modified example 4, the tilt angle θ2 of the heat dissipation fins 32 can be changed after the base station device 1 is manufactured due to the action of the rotating structure 50. Therefore, by optimally adjusting the tilt angle θ2 of the heat dissipation fins 32 to match the installation conditions of the base station device 1, such as the downward angle θ1, and the installation environment of the base station device 1, such as natural wind, the heat dissipation performance can be improved.

[0068] Although the present disclosure has been described above with reference to embodiments, the present disclosure is not limited to the embodiments described above. Various modifications to the structure and details of the present disclosure are possible, as can be understood by those skilled in the art within the scope of the present disclosure. Furthermore, each embodiment and each modification can be combined with other embodiments and modifications as appropriate.

[0069] Each drawing is merely illustrative to illustrate one or more embodiments. Each drawing may be associated with one or more other embodiments rather than with only one specific embodiment. As those skilled in the art will understand, various features or steps described with reference to any one drawing can be combined with features or steps shown in one or more other drawings, for example, to create embodiments not explicitly shown or described. Not all features or steps shown in any one drawing to illustrate an exemplary embodiment are necessarily required, and some features or steps may be omitted. The order of steps shown in any of the drawings may be changed as appropriate.

[0070] Some or all of the above embodiments may also be described as follows, but are not limited to the following:

[0071] (Note 1) The device includes a heatsink and is installed at a downward angle with the antenna surface facing downwards in the direction of gravity and the heatsink surface facing upwards in the direction of gravity. The aforementioned heatsink is The base including the base surface, Includes at least one heat sink fin, The heat dissipation fins are provided at an angle to the base surface of the base station device.

[0072] (Note 2) The base station device as described in Appendix 1, wherein the heat dissipation fins are provided with their tips tilted upward at a predetermined angle in the direction of gravity.

[0073] (Note 3) The base station device as described in Appendix 1, wherein the angle between the normal to the base surface and the heat dissipation fins varies depending on the distance from the base surface.

[0074] (Note 4) The base station device according to Appendix 1, wherein the angle between the normal to the base surface and the heat dissipation fins varies depending on the heat generation density of the elements attached to the base.

[0075] (Note 5) The base station device as described in Appendix 1, wherein the heat dissipation fins form an approximately V-shape, an approximately inverted V-shape, an approximately W-shape, an approximately inverted W-shape, or an approximately N-shape when viewed from the front of the heat sink.

[0076] (Note 6) The base station device as described in Appendix 1, wherein the heat dissipation fins are joined to the base, which is made separately from the heat dissipation fins.

[0077] (Note 7) The base station device as described in Appendix 6, wherein the joining is by welding, riveting, or bonding.

[0078] (Note 8) The base station device according to Appendix 2, further comprising at least one tilt angle adjustment mechanism for adjusting the predetermined angle.

[0079] (Note 9) A method for cooling a base station device, comprising a base including a base surface and a heat sink including at least one heat dissipation fin provided at an angle to the base surface.

[0080] (Note 10) The cooling method according to Appendix 9, wherein the heat dissipation fins are provided with their tips tilted upward at a predetermined angle in the direction of gravity.

[0081] Some or all of the elements (e.g., structure and function) described in Appendices 2-8 that are subordinate to Appendice 1 may also be subordinate to Appendice 9 in the same manner as those described in Appendices 2-8. Some or all of the elements described in any appendice may be applied in various ways. [Explanation of Symbols]

[0082] 1...Base station equipment 2… Heatsink 2a... Bass 2b... Heat dissipation fins 3…Heat source 10… Antenna section 20... Circuit board section 30… Heatsink 31…Bass 31a... One of the main surfaces (base surface) 31b... The other main surface 32… Heat dissipation fins 32A, 32B... Heat dissipation fins 32a...Tip 40... Exhaust 50…Rotating structure (tilt angle adjustment mechanism) 60... Jig 70...Main unit of the device 100... Heatsink 101... Bass 101a...Base surface 102... Heat dissipation fins 102a...end part 200... Heatsink 201...bass 201a...Base surface 202... Heat dissipation fins 300... Heatsink 301...Bass 301a...Base surface AR1~AR4…Arrows AX1... Center line AX 101a ...normal to base surface 101a AX201 a... Normal to base surface 201a AX 31a ...normal to base surface 31a AX F1 ...normal to antenna surface F1 F1... Antenna side F2... Heatsink surface H…Horizontal surface H1...Height L1...Length P1...interval S1…Space θ1…Angle of depression θ2…Inclination angle (predetermined angle)

Claims

1. The device includes a heatsink and is installed at a downward angle with the antenna surface facing downwards in the direction of gravity and the heatsink surface facing upwards in the direction of gravity. The aforementioned heatsink is The base including the base surface, Including at least one heat dissipation fin, The heat dissipation fins are provided at an angle to the base surface of the base station device.

2. The base station device according to claim 1, wherein the heat dissipation fin is provided with its tip inclined upward at a predetermined angle in the direction of gravity.

3. The base station device according to claim 1, wherein the angle between the normal to the base surface and the heat dissipation fins varies depending on the distance from the base surface.

4. The base station device according to claim 1, wherein the angle between the normal to the base surface and the heat dissipation fins varies depending on the heat generation density of the elements attached to the base.

5. The base station device according to claim 1, wherein the heat dissipation fins are approximately V-shaped, approximately inverted V-shaped, approximately W-shaped, or approximately inverted W-shaped when viewed from the front of the heat sink.

6. The base station device according to claim 1, wherein the heat dissipation fins are joined to the base, which is made separately from the heat dissipation fins.

7. The base station device according to claim 6, wherein the joining is welding, riveting, or bonding.

8. The base station device according to claim 2, further comprising at least one tilt angle adjustment mechanism for adjusting the predetermined angle.

9. A method for cooling a base station device, comprising a base including a base surface and a heat sink including at least one heat dissipation fin provided at an angle to the base surface.

10. The cooling method according to claim 9, wherein the heat dissipation fins are provided with their tips tilted upward at a predetermined angle in the direction of gravity.

Images