Resin composition, method for producing the resin composition, and cured resin product

The photocurable resin composition with a silicone-containing acrylate precursor and isocyanate group addresses discoloration and low crosslink density issues, achieving high crosslink density and improved performance in resin cured products.

JP2026109132APending Publication Date: 2026-07-01NIPPON CARBIDE KOGYO KK
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
NIPPON CARBIDE KOGYO KK
Filing Date
2024-12-19
Publication Date
2026-07-01

AI Technical Summary

Technical Problem

Thermal curing of epoxy crosslinking in resin compositions leads to discoloration and lower crosslink density, resulting in inferior performance and appearance of cured resin products.

Method used

A photocurable resin composition containing a silicone-containing acrylate resin precursor, a (meth)acrylic monomer with a hydroxyl group, a (meth)acrylate with an isocyanate group, and a photoinitiator, which upon light irradiation, forms a resin cured product with suppressed discoloration and high crosslink density.

Benefits of technology

The resin composition achieves excellent appearance and high crosslink density, improving antifouling function and moldability while preventing silicone bleed-out, with a gel fraction of 95% or more.

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Abstract

A resin composition that can form a cured resin product with suppressed discoloration (i.e., low degree of yellowing), excellent appearance, and a high crosslink density (gel fraction). [Solution] A resin composition comprising a silicone-containing acrylic resin precursor containing 35 to 85% by mass of structural units (1) derived from a silicone-containing (meth)acrylate represented by formula (1) and 10 to 40% by mass of structural units (2) derived from a (meth)acrylic monomer having a hydroxyl group, a (meth)acrylate having an isocyanate group, and a photoinitiator. TIFF2026109132000028.tif60165
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