Double-sided adhesive sheet for transfer

The double-sided adhesive sheet addresses the challenges of miniaturized semiconductor chip handling by providing a laminated structure with optimized adhesive strengths and surface energy for efficient and damage-free collective transfer onto substrates.

JP2026109510APending Publication Date: 2026-07-01NITTO DENKO CORP
View PDF 1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
NITTO DENKO CORP
Filing Date
2025-06-25
Publication Date
2026-07-01

AI Technical Summary

Technical Problem

The miniaturization and thinning of semiconductor chips have led to damage during handling and inefficient mounting, especially with traditional collet-based picking methods, and the challenge of adhering components with fine surface irregularities to adhesive surfaces.

Method used

A double-sided adhesive sheet with specific adhesive strengths and surface free energy ratios, allowing for efficient mounting of minute electronic components onto a substrate without damage, using a laminated structure with a first adhesive layer for receiving and transferring components en masse.

Benefits of technology

The adhesive sheet enables precise and efficient mounting of semiconductor chips and other components with fine irregularities, improving manufacturing efficiency by allowing collective transfer onto a substrate, reducing damage and enhancing positional accuracy.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2026109510000001_ABST
    Figure 2026109510000001_ABST
Patent Text Reader

Abstract

This invention provides a double-sided adhesive transfer sheet suitable for efficiently mounting even minute electronic components or electronic components with fine irregularities on their surface onto a mounting substrate. [Solution] The double-sided adhesive sheet 1 for transfer has a laminated structure in which a first adhesive layer 11 providing one adhesive surface 1a, a base material 10, and a second adhesive layer 12 providing the other adhesive surface 1b are laminated in this order. The 90° adhesive force (P1) on one adhesive surface 1a, measured at a peeling angle of 90° and a peeling speed of 300 mm / min, is 0.01 to 0.15 N / 25 mm.
Need to check novelty before this filing date? Find Prior Art