Substrate transfer apparatus and method

Abstract

The present invention provides a substrate transfer apparatus and method. [Solution] The present invention relates to a substrate transfer apparatus and method, and one aspect of the present invention, the substrate transfer apparatus includes a lower stage that supports the lower surface of a substrate and moves it upward, and an upper stage that attracts the upper surface of the substrate moved upward by the lower stage and inverts it.

Description

Technical Field

[0006]

[0001] The present invention relates to a substrate transfer device and method, and more particularly, to a substrate transfer device and method for inverting a glass substrate and transferring it to a process.

Background Art

[0002] In recent years, glass substrates have attracted attention as an alternative to existing organic substrates in the field of semiconductor packaging. Glass substrates have a higher thermal conductivity than existing organic substrates, have a smooth surface, and are excellent in processability into large square panels. Therefore, they are suitable for the implementation of ultra-fine line-width semiconductor packaging, and since an intermediate substrate is not required, the thickness of the substrate can be reduced, and there is an advantage in reducing power consumption.

[0003] On the other hand, unlike organic substrates that are processed on both the upper and lower surfaces simultaneously, glass substrates must be processed individually on the upper and lower surfaces due to their material properties. Therefore, when manufacturing a glass substrate semiconductor package, prior to processing the glass substrate, a substrate inversion operation must be performed to rotate the glass substrate so that the upper or lower surface faces upward depending on whether the processing surface of the corresponding process is the upper or lower surface of the glass substrate.

[0004] In this regard, a substrate transfer technology including a flipper that inverts a substrate after gripping it has been disclosed. Such existing technologies have limitations in that the position of the substrate on the horizontal plane changes after inversion of the substrate, or only provide a substrate inversion function and it is difficult to flexibly adapt to changes in the process and inspection processes.

[0005] Specifically, existing technologies that disclose a flipper whose position on the horizontal plane of the substrate changes after inversion of the substrate must change the position of the configuration through which the substrate is transmitted depending on whether the substrate is inverted. Therefore, it may be difficult to selectively invert some of the substrates after connecting to the equipment.

[0006] Existing technologies that disclose flippers that invert substrates by rotating in place do not consider the alignment of the substrates before or after inversion, and therefore have the problem of requiring a separate device to align the substrates before they are placed in the equipment. In addition, if the position of the substrate being attracted for inversion is not appropriate, there is a possibility that the substrate may detach during inversion. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Republic of Korea Patent Application No. 10-2020-0028159 [Patent Document 2] Republic of Korea Patent Application No. 10-2021-7034672 [Patent Document 3] Republic of Korea Patent Application No. 10-2011-0015996 [Overview of the project] [Problems that the invention aims to solve]

[0008] The object of the present invention is to provide a substrate transfer apparatus and method that enables double-sided processing and inspection of substrates through substrate alignment and substrate inversion functions.

[0009] The objectives of the present invention are not limited to those mentioned above, and any other objectives not mentioned can be clearly understood from the following description. [Means for solving the problem]

[0010] A substrate transfer apparatus according to one aspect of the present invention for achieving the aforementioned objectives includes a lower stage that supports the lower surface of a substrate and moves it upward, and an upper stage that attracts and inverts the upper surface of the substrate that has been moved upward by the lower stage.

[0011] Another aspect of the present invention relates to a substrate transfer method performed by a substrate transfer apparatus including a lower stage that supports the lower surface of a substrate and moves it upward, and an upper stage that adsorbs and inverts the upper surface of the substrate that has been moved upward by the lower stage, and includes the steps of loading a substrate onto the lower stage, aligning the substrate on the lower stage to a preset target position, moving the substrate from the lower stage to the upper stage, adsorbing the substrate on the upper stage, and inverting the substrate on the upper stage. [Effects of the Invention]

[0012] According to the present invention, by ensuring that substrate alignment and substrate inversion are performed on the same vertical line, the space required for transport is reduced, thereby improving transport efficiency.

[0013] Furthermore, aligning and gripping the substrates enhances the stability of substrate gripping and inversion. Consequently, this is expected to improve the convenience of double-sided processing and inspection of substrates.

[0014] The effects of the present invention are not limited to those mentioned above, and any other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims. [Brief explanation of the drawing]

[0015] [Figure 1] This is a perspective view of a substrate transfer apparatus according to one embodiment of the present invention. [Figure 2] This is a perspective view showing the lower stage and upper stage of a substrate transfer apparatus according to one embodiment of the present invention. [Figure 3] Figure 2 is a front view showing the substrate alignment operation state of the lower stage. [Figure 4] Figure 2 is a front view showing the vertical movement of the lower stage. [Figure 5] Figure 2 is a front view showing the upper stage in the state of substrate inversion operation. [Figure 6]It is a flowchart of a substrate transfer method according to another embodiment of the present invention.

Embodiment for Carrying out the Invention

[0016] The advantages and features of the embodiments, and the methods for achieving them, will become clear by referring to the embodiments described in detail later together with the attached drawings. However, the present invention is not limited to the embodiments disclosed below and can be embodied in various different forms. However, these embodiments are provided to make the disclosure of the present invention complete and to fully inform those with ordinary knowledge in the technical field to which the present invention belongs of the scope of the invention. The present invention is only defined by the description of the claims. On the other hand, the terms used in this specification are for explaining the embodiments and are not intended to limit the present invention. In this specification, the singular form includes the plural form unless otherwise specifically stated in the text.

[0017] The present invention relates to a technique for transferring a substrate to equipment.

[0018] In particular, the present invention is characterized in that it can stably adsorb and invert a substrate and can insert the inverted and properly aligned substrate into equipment.

[0019] Such technical features can be achieved by a configuration that aligns the substrate at a target position, moves it upward, and inverts the substrate on the same vertical line as the target position.

[0020] Hereinafter, a substrate transfer device according to an embodiment of the present invention will be specifically described with reference to the attached drawings.

[0021] Referring to FIGS. 1 and 2, a substrate transfer device 1000 according to an embodiment of the present invention includes a main frame 100, a lower stage 200, an upper stage 300, and a controller 400.

[0022] The main frame 100 can form an accommodation space inside.

[0023] A lower stage 200 is installed below the housing space of the main frame 100 so as to be movable up and down, and an upper stage 300 may be installed above the housing space of the main frame 100.

[0024] The lower stage 200 can support the underside of the loaded substrate 10 and move upward.

[0025] The lower stage 200 may consist of a lifting frame 210, a substrate support 220, and a substrate alignment machine 230.

[0026] The lifting frame 210 may be installed below the main frame 100 so as to be able to move up and down.

[0027] Although not specifically shown in the drawings, the lifting frame 210 may be installed below the main frame 100 so as to be vertically movable, and may consist of an LM guide and a servo motor.

[0028] The substrate support 220 may be installed on top of the lifting frame 210 and support the lower surface of the loaded substrate 10.

[0029] Multiple substrate support members 220 can be provided on the same horizontal plane, spaced apart from each other, to form an area for supporting the substrate 10.

[0030] At this time, the substrate support 220 consists of ball casters, which prevents surface friction from occurring during the substrate alignment function, but allows the substrate 10 to flow on a horizontal surface due to rolling friction.

[0031] The circuit board alignment machine 230 may be installed on top of the lifting frame 210 and move the circuit boards loaded onto the circuit board support 220 to a preset target position for alignment.

[0032] The substrate alignment machine 230 may be installed on the outer edge of the area formed by the substrate support 220, and may move back and forth on a horizontal plane to align the substrates 10 loaded onto the substrate support 220 so that they are positioned at a preset target position.

[0033] Referring to Figure 3, the substrate alignment machine 230 may consist of a cylinder 231, a moving bar 233, and alignment rollers 235.

[0034] The cylinders 231 may be installed on the upper part of the lifting frame 210 at two points facing each other on the outermost line of a preset target position.

[0035] Here, the target position is a range that extends the ideal substrate position by a predetermined error range (e.g., 0.5 mm), and can be pre-set by the user.

[0036] The movable bar 233 may be connected to the rod of the cylinder 231 and move back and forth toward the center of the target position by the operation of the cylinder 231.

[0037] The alignment rollers 235 may be arranged in pairs, spaced apart at a certain angle on one side and the other side of the end of the moving bar 233, respectively, and in contact with the edge of the substrate 10.

[0038] The upper stage 300 can attract and invert the upper surface of the substrate 10, which has been moved upward by the lower stage 200.

[0039] The upper stage 300 may be composed of a support frame 310, a rotating frame 320, a drive means 330, and a suction pad 340.

[0040] Support frames 310 may be provided on both sides of the upper part of the main frame 100.

[0041] The rotating frame 320 may be rotatably mounted on the support frame 310.

[0042] The rotating frame 320 is rotatably mounted on both sides of the support frame 310 and can rotate in place back and forth on top of the main frame 100.

[0043] The driving means 330 may generate rotational power to rotate the rotating frame 320.

[0044] The suction pad 340 may be located at the bottom of the rotating frame 320 and use vacuum to attract the substrate 10 which has been moved upward by the lower stage 200.

[0045] Multiple suction pads 340 are provided on the same horizontal plane at intervals from each other, corresponding to the positions of the substrate support 220, enabling stable suction of the substrate 10.

[0046] The controller 400 can control the operation of the lower stage 200 and the upper stage 300.

[0047] When a circuit board is loaded onto the lower stage 200, the controller 400 controls the movement of the lower stage 200 so that it aligns the position of the circuit board and moves it upward. In response to the lower stage 200 moving the circuit board upward, the controller 400 controls the movement of the upper stage 300 so that it picks up the circuit board. In response to the upper stage 300 picking up the circuit board, the controller 400 controls the movement of the lower stage 200 so that it moves downward. In response to the lower stage 200 moving downward, the controller 400 controls the movement of the upper stage 300 so that it flips the circuit board.

[0048] A substrate transfer method according to another embodiment of the present invention can be performed by a substrate transfer apparatus 1000 according to one embodiment of the present invention.

[0049] For the sake of clarity, the same reference numerals will be used in the drawings for functionally identical elements, and redundant explanations will be avoided.

[0050] Referring to Figure 6, the substrate transfer method according to another embodiment of the present invention may include a substrate loading step (S110), a substrate alignment step (S120), a lower stage raising step (S130), a substrate adsorption step (S140), a lower stage lowering step (S150), and a substrate inversion step (S160).

[0051] The substrate loading stage (S110) may be the stage in which the substrates 10 are loaded onto the lower stage 200 via robot hands that grasp and transport each of the loaded substrates.

[0052] Referring to Figure 3, the substrate alignment step (S120) may be a step in which the substrates 10 loaded onto the lower stage 200 are aligned so that they are positioned at a predetermined target position on the horizontal plane.

[0053] Referring to Figure 4, in the lower stage raising stage (S130), the lower stage 200 moves the substrate 10 upward, in the substrate suction stage (S140), the upper stage 300 suctions the upper surface of the substrate 10 that has been moved upward by the lower stage 200, and in the lower stage lowering stage (S150), the lower stage 200 can move downward to create space for the upper stage 300 to invert the substrate.

[0054] Referring to Figure 5, in the substrate inversion step (S160), the upper stage 300 can rotate the substrate 10 180 degrees vertically while holding it in place, so that the bottom surface of the substrate 10 faces upwards.

[0055] With the above configuration, the substrate can be stably adsorbed and the substrate, which has been aligned and inverted to the target position, can be provided to the equipment.

[0056] Furthermore, since the alignment and inversion of the substrates are performed on the same vertical line, it has the advantage of being able to provide both substrate alignment and inversion functions simultaneously in a relatively small area.

[0057] Therefore, it is possible to improve the convenience of processing and inspecting both sides of glass substrates.

[0058] Those with ordinary skill in the art to which the present invention pertains will understand that the present invention can be carried out in other specific forms without altering its technical idea or essential features. Therefore, the embodiments described above should be understood in all respects as illustrative and not limiting. The scope of the present invention is defined by the claims, which are set forth below rather than by the detailed description above, and all modifications or alterations derived from the claims and the concept of equivalents thereto should be interpreted as being within the scope of the present invention. [Explanation of Symbols]

[0059] 10: Circuit board 1000: Substrate transfer device 100: Mainframe 200: Lower Stage 210: Lifting frame 220: Circuit board support 230: PCB alignment machine 231: Cylinder 233: Movement bar 235: Alignment Roller 300: Upper Stage 310: Support frame 320: Rotating Frame 330: Driving means 340: Suction pad 400: Controller

Claims

1. A lower stage that supports the underside of the substrate and moves it upward; and A substrate transfer apparatus comprising: an upper stage for adsorbing and inverting the upper surface of a substrate that has been moved upward by the lower stage;

2. A substrate transfer device according to claim 1, further comprising: a main frame having the lower stage installed at its lower end so as to be vertically movable, and the upper stage installed at its upper end.

3. The aforementioned lower stage is A lifting frame is installed at the bottom of the main frame so as to be movable vertically; A substrate support installed on the upper part of the lifting frame and supporting the lower surface of the loaded substrate; and The substrate transfer device according to claim 2, further comprising a substrate alignment machine installed on the upper part of the lifting frame, which moves and aligns the substrate loaded onto the substrate support to a preset target position.

4. The aforementioned substrate alignment machine Cylinders are installed on the upper part of the lifting frame at two points facing each other on the outermost line of the target position; A movable bar connected to the rod of the cylinder and moving back and forth toward the center of the target position by the operation of the cylinder; and The substrate transfer device according to claim 3, comprising: a pair of alignment rollers positioned at a certain angle apart on one side and the other side of the end of the moving bar, respectively, and in contact with the edge of the substrate.

5. The aforementioned upper stage Support frames provided on both sides of the upper part of the main frame; A rotating frame rotatably mounted on the aforementioned support frame; A driving means for rotating the aforementioned rotating frame; A substrate transfer apparatus according to claim 2, comprising: a suction pad provided at the lower part of the rotating frame for vacuum-suctioning a substrate moved upward by the lower stage;

6. A substrate transfer method performed by a substrate transfer apparatus including a lower stage and an upper stage, The stage where the circuit board is loaded onto the lower stage; The step of aligning the substrate in the lower stage so that it is positioned at a predetermined target position; The step of moving the substrate from the lower stage to the upper stage; The stage in which the substrate is adsorbed on the upper stage; A method for transferring a substrate, comprising the step of inverting the substrate on the upper stage.

7. Between the step of adsorbing the substrate and the step of inverting the substrate, The substrate transfer method according to claim 6, further comprising the step in which the lower stage descends to provide space for the upper stage to invert the substrate.

8. The step of inverting the aforementioned substrate is The substrate transfer method according to claim 6, wherein the upper stage holds the upper surface of the substrate in suction and rotates the substrate 180 degrees vertically so that the lower surface of the substrate faces upward.

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