Parts coupling equipment

Abstract

Providing component coupling equipment that eliminates the need to move adhesive valves toward integrated circuit components. [Solution] A component coupling apparatus comprising: a first holding device 4 having a first carrier 41 for holding an integrated circuit component W2; a second holding device 5 having a second carrier 51 for holding an optical fiber array component W1; an adhesive application device 10 having a first adhesive valve for applying a first adhesive to the optical fiber array component W1; and at least one component coupling device 2 having a holding mechanism configured to hold the optical fiber array component W1 and to move it sequentially between the second carrier 51, the adhesive application device 10, and the first carrier 41.

Description

Technical Field

[0001] The present invention relates to component coupling equipment, and particularly to component coupling equipment for coupling fiber optic array components to integrated circuit components.

Background Art

[0002] In the semiconductor manufacturing process, in order to manufacture wafers with higher performance and lower power consumption, silicon photonics (SiPh) technology has become the focus of industrial development. In silicon photonics technology, regardless of whether it is a pluggable transceiver optics (PTO) structure, an on-board optoelectronic integration (OBO) structure, a co-packaged optics (CPO) structure, or an optical I / O structure, it is necessary to couple a fiber optic array component (FAU) onto an integrated circuit element (IC). Currently, the semiconductor manufacturing process is evolving towards 2.5D or 3D packaging, and the structures of integrated circuit components and fiber optic array components are also changing with the evolution of the process. For example, a photonic integrated circuit is arranged in the integrated circuit component, and in the fiber optic array component, an optical coupling part, a receptacle part, and an optical fiber part connected between the optical coupling part and the receptacle part are arranged. The photonic integrated circuit of the integrated circuit component is coupled to the optical coupling part of the fiber optic array component, and the optical fiber part, the receptacle part, communicate optically with the outside through optical communication.

[0003] When coupling optical fiber array components with integrated circuit components, the optical fiber array components are typically held in a multi-axis movable gantry and bonded to the integrated circuit components with adhesive. First, a multi-directional movable adhesive valve (dispenser valve) is driven to a position above the integrated circuit component. Next, adhesive is applied to the coupling position of the integrated circuit component that is to be coupled to the optical fiber array component. Finally, the optical fiber array component is picked up by a multi-directional movable holding mechanism and placed on the aforementioned coupling position of the integrated circuit component to which the adhesive has been applied. However, because the adhesive valve and holding mechanism are moved sequentially and individually toward the integrated circuit component, the complexity of the structure and installation costs increase, and the adhesive application position by the adhesive valve may deviate from the precise coupling position. As a result, the drawback of the conventional technology, where adhesive is not placed between the integrated circuit component and the optical fiber array component, is awaiting improvement.

[0004] In addition, for information on conventional component coupling equipment, see, for example, Patent Document 1. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Chinese Patent Application Publication No. 116967082(A) Specification [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] In view of the above problems, the present invention aims to provide a component coupling device that improves upon at least one drawback of the prior art. [Means for solving the problem]

[0007] To achieve the above objective, the present invention is: A first holding device having a first carrier for holding integrated circuit components, A second holding device having a second carrier for holding optical fiber array components, An adhesive application apparatus having a first adhesive valve for applying a first adhesive to the optical fiber array component, The present invention provides a component coupling system in which at least one component coupling device, having a holding mechanism that sequentially moves the optical fiber array component between the second carrier, the adhesive application device, and the first carrier while holding the optical fiber array component, is disposed in a housing. [Effects of the Invention]

[0008] In the component coupling equipment of the embodiment of the present invention, the optical fiber array component is held by a holding mechanism and transported to the adhesive application device. Compared to the conventional technology, this eliminates the need to move the adhesive valve to the integrated circuit component, and allows for accurate application of the adhesive between the optical fiber array component and the integrated circuit component. As a result, the optical fiber array component is accurately coupled to the integrated circuit component, and a good yield rate can be obtained. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view showing an integrated circuit component and an optical fiber array component being coupled by one embodiment of the component coupling equipment of the present invention. [Figure 2] This is a schematic cross-sectional view showing how optical fiber array components are coupled to integrated circuit components. [Figure 3] This is a perspective view of an optical fiber array component. [Figure 4] This is a perspective view of the optical fiber array component, shown from a different angle than Figure 3. [Figure 5] This is a partially schematic cross-sectional view showing optical signals being transferred between an optical fiber array component and an integrated circuit component. [Figure 6] This is a block diagram showing the configuration of an embodiment of the component coupling equipment of the present invention. [Figure 7]It is a schematic top view showing the arrangement relationship of each component of the component coupling equipment of the same embodiment. [Figure 8] It is a perspective view showing a first drive mechanism, a holding mechanism, and two component coupling devices in the component coupling equipment of the same embodiment. [Figure 9] It is an exploded perspective view showing a third linear motion member of the first drive mechanism, a second drive mechanism, a holding mechanism, and an inspection mechanism in the component coupling equipment of the same embodiment. [Figure 10] It is a partially exploded perspective view showing a first rotating member, a second rotating member, and a third rotating member of the second drive mechanism. [Figure 11] It is a perspective view explaining that the first moving table of the first rotating member swings along a first curved path along the first pedestal around the first axis. [Figure 12] It is a perspective view explaining that the second moving table of the second rotating member swings along a second curved path along the second pedestal around the second axis. [Figure 13] It is a perspective view explaining that the third moving table of the third rotating member swings along a third curved path along the third pedestal around the third axis. [Figure 14] It is a partial side view explaining each connection surface of the second drive mechanism. [Figure 15] It is a partial perspective view explaining that the first axis, the second axis, and the third axis intersect with each other at the axis point. [Figure 16] It is an exploded perspective view explaining the holding mechanism and its curing means. [Figure 17] It is a partial side view explaining the holding mechanism and its air passage. [Figure 18] It is a partial side view explaining the holding means of the holding mechanism. [Figure 19] It is a partial side view explaining the holding means at the reverse angle. [Figure 20] It is a perspective view of the drive member of the holding mechanism. [Figure 21] It is a perspective view of the corresponding connecting member of the holding mechanism. [Figure 22]This is a partial side explanatory diagram showing the state in which the corresponding connecting member moves relative to the holding means and is connected to the optical fiber array component. [Figure 23] This is an explanatory diagram showing the state in which the first light source and the second light source of the curing means irradiate ultraviolet rays and lasers toward the optical fiber array component. [Figure 24] This is a partial side explanatory diagram showing the state in which the optical fiber array component is moved toward the inspection device by the holding mechanism in the component coupling equipment of the same embodiment. [Figure 25] This is a partial side explanatory diagram showing the state in which the optical fiber array component is moved toward the adhesive application device by the holding mechanism in the component coupling equipment of the same embodiment.

Embodiments for Carrying Out the Invention

[0010] To more clearly explain the objectives, technical means, and advantages of the embodiments of the present invention, hereinafter, in combination with the accompanying drawings of the embodiments of the present invention, the technical means in the embodiments of the present invention will be clearly and detailedly explained. It will be clear that the embodiments to be explained are some of the embodiments of the present invention and not all of the embodiments. Usually, the components of the embodiments of the present invention depicted and shown in the accompanying drawings can be arranged and designed in various different arrangements. Therefore, hereinafter, the detailed description of the embodiments of the present invention provided in the accompanying drawings does not constitute any limitation to the protection scope of the present invention and merely shows the selected embodiments of the present invention.

[0011] Before explaining the present invention in detail, it should be noted that in the following explanations, elements that perform the same role or function may be represented by the same reference numerals even if they do not have exactly the same configuration. <L

[0012] Also, in this specification, for the convenience of explanation, terms indicating the relative positional relationship of each component, such as "upper", "lower", "left", "right", etc., are used for explanation while referring to the examples in the drawings, and it should be noted that they are not absolute terms limiting the configuration of the present invention.

[0013] As shown in Figure 1, an embodiment of the component coupling equipment 11 of the present invention (see Figure 6) is used to couple an optical fiber array component W1 to an integrated circuit component W2.

[0014] Furthermore, as shown in Figures 2 to 4, the optical fiber array component W1 includes an optical coupling section W11, a receptacle section W12, and an optical fiber section W13 connected to the optical coupling section W11 and the receptacle section W12. The optical coupling section W11 is made of a material through which light can pass, and a prism W111 is provided on the first side surface W112 of the optical coupling section W11, which is away from the receptacle section W12. The receptacle section W12 is configured so that the optical fiber section W13 can pass through and be exposed on the second side surface W121 of the receptacle section W12, which is away from the optical coupling section W11. The receptacle section W12 is provided with a relatively wide first base section W122, a relatively narrow second base section W123, and two guide holes W124 that pass through the first and second base sections W122 and W123. As shown in Figure 2, the second side surface W121 is inclined outward from top to bottom. The optical fiber section W13 is composed of multiple optical fibers W131 and is flexible.

[0015] As shown in Figures 1 and 2, the integrated circuit component W2 is provided with a retaining plate W21, a cover member W22 provided on the retaining plate W21, and a photon integrated circuit W23 provided on the retaining plate W21 (in this embodiment of the present invention, multiple photon integrated circuits W23 are arranged on the retaining plate W21). The retaining plate W21 is substantially rectangular, and the photon integrated circuits W23 can be arranged around the periphery of the retaining plate W21. The cover member W22 is provided with a first cover portion W221, a second cover portion W222 which is slightly lower in height than the first cover portion W221, and a cutout space W223 located between the first cover portion W221 and the second cover portion W222, which exposes the photon integrated circuit W23. The cutout spaces W223 can be provided near each of the four sides of a rectangular retaining plate W21, depending on the design of the photon integrated circuit W23. Each photon integrated circuit W23 is provided with a lens array W231. The lens array W231 is composed of multiple lenses W2311 arranged in an array. As shown in Figures 2 and 5, each photon integrated circuit W23 has the same configuration, so the configuration of one photon integrated circuit W23 will be described in detail below.

[0016] As shown in Figures 2 and 5, when the optical fiber array component W1 is coupled to the integrated circuit component W2, the optical coupling portion W11 of the optical fiber array component W1 is brought into contact with the photon integrated circuit W23, and the receptacle portion W12 is brought into contact with the second cover portion W222 of the cover member W22. The prism W111 of the optical fiber array component W1 corresponds to the lens array W231, enabling the transfer of the optical signal W3 between the prism W111 of the optical fiber array component W1 and the lens array W231 of the photon integrated circuit W23. The optical signal W3 is supplied from the measurement unit 1 (see Figure 6) to the optical fiber array component W1, and the measurement unit 1 (see Figure 6) can measure the numerical value of the intensity of the optical signal W3 that is transferred from the optical fiber array component W1 to the integrated circuit component W2 and sent back to the optical fiber array component W1. To explain in more detail, as shown in Figure 5, for example, when the optical signal W3 is transferred from the optical fiber array component W1 to the integrated circuit component W2, it is reflected by the prism W111 and then sent diagonally forward and downward to the lens W2311 of the lens array W231. The optical coupling section W11 and the photon integrated circuit W23 can be bonded and fixed together with the first adhesive F1, and the receptacle section W12 and the second cover section W222 can be bonded and fixed together with the second adhesive F2. In this embodiment of the present invention, the shrinkage rate of the first adhesive F1 after curing is smaller than the shrinkage rate of the second adhesive F2 after curing, and the strength of the second adhesive F2 after curing is greater than the strength of the first adhesive F1 after curing. The first adhesive F1 is an ultraviolet curing adhesive, and the second adhesive F2 is a thermosetting adhesive.

[0017] In another embodiment of the present invention, the lid member W22 may be provided only with the first lid portion W221, in which case the receptacle portion W12 is in contact with the retaining plate W21.

[0018] As shown in Figures 6 and 7, the component coupling equipment 11 of this embodiment is configured to couple an optical fiber array component W1 to an integrated circuit component W2. The component coupling equipment 11 is housed in a housing T and includes a measurement unit 1, two component coupling devices 2, a control unit 3, a first holding device 4, a second holding device 5, an inspection device 6, a first rail device 7, a second rail device 8, a component transport device 9, and an adhesive application device 10. The signals from the control unit 3 are connected to the measurement unit 1, the two component coupling devices 2, the first holding device 4, the second holding device 5, the inspection device 6, the first rail device 7, the second rail device 8, the component transport device 9, and the adhesive application device 10. Each component coupling device 2 is arranged in the housing T so as to face each other. Incidentally, the number of component coupling devices 2 is not limited to two, and it is of course possible to configure the equipment to have one or three or more. Furthermore, since the two component coupling devices 2 have the same configuration, the configuration of one component coupling device 2 will be described in detail below.

[0019] As shown in Figures 7 and 8, the component coupling device 2 is provided with a first drive mechanism A provided in the housing T, a second drive mechanism B provided on the first drive mechanism A and driven by the first drive mechanism A to enable multi-axis linear movement, a holding mechanism C provided on the second drive mechanism B and driven by the second drive mechanism B to enable multi-axis rotational movement, and an inspection mechanism D. The holding mechanism C holds the optical fiber array component W1 and, by driving the first drive mechanism A and the second drive mechanism B, can move the held optical fiber array component W1 to perform multi-axis linear movement or multi-axis rotational movement. The inspection mechanism D is provided on the first drive mechanism A and can perform multi-axis linear movement by driving the first drive mechanism A, and can also perform inspection on the integrated circuit component W2 (see Figure 1).

[0020] As shown in Figure 8, in the following description of the embodiment of the present invention, a first horizontal direction d1 is defined, a second direction d2 is defined as the direction perpendicular to the first horizontal direction d1, and a third direction d3 is defined as the direction perpendicular to both the first and second vertical directions d1 and d2. In this embodiment, the first direction d1 is the front-to-back direction, the second direction d2 is the left-to-right direction, and the third direction d3 is the up-and-down direction.

[0021] As shown in Figures 8 and 9, the first drive mechanism A is provided with a first linear motion member A1 provided on the housing T, a second linear motion member A2 provided on the first linear motion member A1, and a third linear motion member A3 provided on the second linear motion member A2.

[0022] The first linear motion member A1 is provided with two first rail bases A11 that are spaced apart from each other and mounted on the housing T, and two first slides A12 that are mounted on each of the two first rail bases A11. The first rail bases A11 extend along a first direction d1, and the first slides A12 can move along the first direction d1 on the first rail bases A11.

[0023] The second linear motion member A2 is provided with a second rail base A21 that straddles the two first slides A12, and a second slide A22 provided on the second rail base A21. The second rail base A21 extends along a second direction d2, and the second slide A22 can move along the second direction d2 on the second rail base A21.

[0024] The third linear motion member A3 is provided with a third rail base A31 on the second slide A22 and a third slide A32 on the third rail base A31. The third rail base A31 extends along the third direction d3, and the third slide A32 can move along the third direction d3 on the third rail base A31.

[0025] The first drive mechanism A drives the second drive mechanism B, and the holding mechanism C moves the optical fiber array component W1 in conjunction with the second drive mechanism B, thereby enabling linear movement of the optical fiber array component W1 in three degrees of freedom in the first direction d1, the second direction d2, and the third direction d3.

[0026] In this embodiment, the first linear motion member A1 and the second linear motion member A2 are configured to drive the first slide A12 and the second slide A22 with a linear motor. However, the present invention is not limited to this configuration, and for example, the first slide A12 and the second slide A22 can also be driven using a combination of a rotary motor and a screw rod. Furthermore, in this embodiment, the third linear motion member A3 is configured to drive the third slide A32 with a combination of a rotary motor and a screw rod. However, the present invention is not limited to this configuration, and for example, the third slide A32 can also be driven using a linear motor.

[0027] As shown in Figure 9, the inspection mechanism D is provided with a first image capture unit D1 and a first distance sensor D2. The first image capture unit D1 is provided with an image capture D11, a camera head D12, and a light source D13. As shown in Figure 1, the first image capture unit D1 can acquire the orientation of the photon integrated circuit W23 and / or lens array W231 by capturing images of the photon integrated circuit W23 and / or lens array W231 from above the integrated circuit component W2. For example, a CCD camera can be used as the first image capture unit D1, and for example, an optical reflection sensor can be used as the first distance sensor D2, and the inclination angle of the upper surface of the photon integrated circuit W23 can be acquired by sensing the distance to different positions (points) on the upper surface of the photon integrated circuit W23.

[0028] As shown in Figures 9 and 10, the second drive mechanism B includes a first rotating member B1 provided on the third slide A32, a second rotating member B2 provided on the first rotating member B1, and a third rotating member B3 provided on the second rotating member B2.

[0029] As shown in Figures 10 and 11, the first rotating member B1 is configured to rotate the holding mechanism C (see Figure 9) about the first axis L1. The first rotating member B1 is provided with a first base B11 on the third slide A32 (see Figure 9), a first movable platform B12 on the first base B11, a first driver B13 capable of driving the movement of the first movable platform B12, and a first connecting means B14 on the first movable platform B12. The first base B11 has a spherical recessed surface facing the first movable platform B12, and the first movable platform B12 has a spherical projection surface facing the first base B11. The first movable platform B12 is driven by the first driver B13 to move in a curve along the first base B11, and can also swing along a curved path in the left-right direction by linking with the first connecting means B14. The first curved path R1 formed by the swinging of the first movable platform B12 along the curved path has a first axis L1 parallel to the third direction d3 as the axis of swing (in Figure 11, the radius from the first curved path R1 to the first axis L1 is represented by the first radius r1). In this embodiment of the present invention, the first base B11 and the first movable platform B12 are moved relative to each other by cross bearings.

[0030] As shown in Figures 10 and 12, the second rotating member B2 is configured to rotate the holding mechanism C (see Figure 9) about the second axis L2. The second rotating member B2 is provided with a second base B21 on the first connecting means B14 (see Figure 11), a second movable platform B22 on the second base B21, a second driver B23 capable of driving the movement of the second movable platform B22, and a second connecting means B24 on the second movable platform B22. The second base B21 is provided with a spherical recessed surface facing the second movable platform B22, and the second movable platform B22 is provided with a spherical protruding surface facing the second base B21. As a result, the second movable platform B22 is driven by the second driver B23 to move in a curve along the second base B21, and the second connecting means B24 is linked to swing along the curved path in the vertical direction. The second curved path R2 formed by the swing of the second movable platform B22 along the curved path has a second axis L2 parallel to the first direction d1 as its axis of swing (in Figure 12, the radius from the second curved path R2 to the second axis L2 is represented by the second radius r2). In this embodiment of the present invention, the second base B21 and the second movable platform B22 are moved relative to each other by cross bearings.

[0031] As shown in Figures 10 and 13, the third rotating member B3 is configured to rotate the holding mechanism C (see Figure 9) about the third axis L3. The third rotating member B3 is provided with a third base B31 on the second connecting means B24 (see Figure 12), a third movable platform B32 on the third base B31, a third driver B33 capable of driving the movement of the third movable platform B32, and a third connecting means B34 on the third movable platform B32. The third base B31 is provided with a spherical recessed surface facing the third movable platform B32, and the third movable platform B32 is provided with a spherical projection surface facing the third base B31. The third movable platform B32 moves in a curved manner along the third base B31 by the drive of the third driver B33, and can also swing along a curved path in the front-rear direction by linking the third connecting means B34. The third curved path R3 formed by the swinging of the third movable platform B32 along the curved path has a third axis L3 parallel to the second direction d2 as its axis of swing (in Figure 13, the radius from the third curved path R3 to the third axis L3 is represented by the third radius r3). ​​In this embodiment of the present invention, the third base B31 and the third movable platform B32 are moved relative to each other by cross bearings.

[0032] As shown in Figures 10 and 14, the first connecting means B14 is provided with an upright first connecting surface B141 and a horizontal second connecting surface B142. The second connecting means B24 is provided with a horizontal third connecting surface B241 and an inclined fourth connecting surface B242. The third connecting means B34 is provided with an inclined fifth connecting surface B341 and an upright sixth connecting surface B342. The first connecting surface B141 is approximately parallel to the sixth connecting surface B342, and the fourth connecting surface B242 is approximately parallel to the fifth connecting surface B341. The first connecting means B14 is provided on the first movable base B12 of the first rotating member B1 by the first connecting surface B141. The second rotating member B2 is provided below the first connecting means B14, and the second base B21 is provided on the second connecting surface B142 of the first connecting means B14. The second connecting means B24 is attached to the second movable base B22 by a third connecting surface B241. The third rotating member B3 is attached to the inclined fourth connecting surface B242 of the second connecting means B24 by a third base B31. The third connecting means B34 is attached to the third movable base B32 by an inclined fifth connecting surface B341. The holding mechanism C (see Figure 9) is attached to the sixth connecting surface B342.

[0033] As shown in Figure 15, the first axis L1, the second axis L2, and the third axis L3 are orthogonal to each other at axis point Lp.

[0034] The second drive mechanism B drives the drive and holding mechanism C to interlock the optical fiber array component W1, allowing it to rotate in three degrees of freedom: the first axis L1, the second axis L2, and the third axis L3, with the axis point Lp as the center of rotation. The default position of the axis point Lp corresponds in advance to below the optical coupling section W11 and in front of the prism W111 when the optical fiber array component W1 is held by the holding mechanism C. As shown in Figure 5, when the optical fiber array component W1 is coupled to the integrated circuit component W2, the positions below the optical coupling section W11 and in front of the prism W111 also roughly correspond to the lens array W231 on the upper surface of the photon integrated circuit W23.

[0035] As shown in Figures 16 and 17, the holding mechanism C includes a support frame C1, a holding means C2 provided on the support frame C1 and capable of holding the optical fiber array component W1, a corresponding connecting member C3 provided on the support frame C1 and connected to the measurement unit 1, a driving member C4 provided on the support frame C1 and driving the movement of the corresponding connecting member C3 along a first direction d1, and a curing means C5 provided on the support frame C1 and capable of curing the adhesive. As shown in Figure 17, an air passage C12 communicating with a nozzle C11 is formed in the support frame C1, and the nozzle C11 communicates with a negative pressure source (not shown). The holding means C2 and the corresponding connecting member C3 are both provided on the support frame C1 and can move together, and the corresponding connecting member C3 can be selectively connected to or disconnected from the optical fiber array component W1 by moving relative to the holding means C2 (i.e., it can be attached and detached). Thus, the holding mechanism C can hold the optical fiber array component W1 and also contribute to measuring the intensity of the optical signal W3 to the optical fiber array component W1 of the measurement unit 1.

[0036] As shown in Figures 17 to 19, the holding means C2 is provided with a first holding portion C21 and a second holding portion C22 that is spaced apart from the first holding portion C21 in a first direction d1. The first holding portion C21 can hold the optical coupling portion W11 of the optical fiber array component W1, and the second holding portion C22 can hold the receptacle portion W12 of the optical fiber array component W1. By the holding means C2 simultaneously holding both ends of the optical fiber array component W1, the optical fiber array component W1 can be stably held by the holding means C2, and the situation in which the optical fiber array component W1 falls from the holding mechanism C can be reduced.

[0037] The first retaining portion C21 has a first retaining surface C211 through which the first negative pressure hole C212 passes, and the optical coupling portion W11 of the optical fiber array component W1 can be attracted and held to the first retaining surface C211 by the first negative pressure hole C212. The second retaining portion C22 has a second retaining surface C221 through which the second negative pressure hole C222 passes, and the receptacle portion W12 of the optical fiber array component W1 can be attracted and held to the second retaining surface C221 by the second negative pressure hole C222. The first negative pressure hole C212 and the second negative pressure hole C222 communicate with the air passage C12.

[0038] The holding means C2 is provided with a first position limiting portion C23 and a second position limiting portion C24. The first position limiting portion C23 is located on one side of the second holding portion C22 adjacent to the first holding portion C21, and the second position limiting portion C24 is located on one side of the second holding portion C22 away from the first holding portion C21. The first position limiting portion C23 is provided with a first play area C231 through which the optical fiber portion W13 of the optical fiber array component W1 passes, and the second position limiting portion C24 is provided with a second play area C241 through which the second base portion W123 of the receptacle portion W12 of the optical fiber array component W1 passes.

[0039] When the optical fiber array component W1 is held by the holding means C2, the relatively wide first base portion W122 of the receptacle portion W12 is positioned and restricted between the first position limiting portion C23 and the second position limiting portion C24, thereby restricting the movement of the optical fiber array component W1 in the first direction d1 within the holding means C2.

[0040] As shown in Figures 17 and 20-22, the corresponding connecting member C3 is indirectly provided on the support frame C1 via a drive member C4. The drive member C4 is provided with a drive means C41, a moving means C42 driven by the drive means C41, and a mounting base C43 provided on the moving means C42. The corresponding connecting member C3 is provided on the mounting base C43 and is driven by the drive means C41 to reciprocate along a first direction d1 relative to the holding means C2, thereby selectively connecting to or not connecting to the optical fiber array component W1.

[0041] The corresponding connecting member C3 is provided with an optical passage section C31, an optical transfer section C32 connected between the optical passage section C31 and the measurement unit 1, and a guide section C33 that can be selectively inserted into the optical fiber array component W1. The optical passage section C31 and the guide section C33 are provided on the corresponding connecting surface C34 of the corresponding connecting member C3 that faces the holding means C2. The corresponding connecting surface C34 is inclined from bottom to top toward the holding means C2, and the degree of inclination of the corresponding connecting surface C34 corresponds to the second side surface W121 of the optical fiber array component W1. Specifically, the corresponding connecting surface C34 and the second side surface W121 are parallel to each other.

[0042] As shown in Figure 21, the guide section C33 is provided with two spaced-apart guide pins C331 on both sides of the light-passing section C31, and the guide pins C331 can be inserted into the guide holes W124 (see Figure 3) of the optical fiber array component W1. When the corresponding connecting member C3 connects to the optical fiber array component W1, the guide pins C331 are inserted into the guide holes W124 and the corresponding connecting surface C34 is brought into contact with the second side surface W121, so that the light-passing section C31 is exposed in relation to the optical fiber section W13 of the receptacle section W12, and the measurement unit 1 can supply the optical signal W3 (see Figure 5) to the optical fiber array component W1.

[0043] As shown in Figures 16, 18, and 23, the curing means C5 is provided with two first light sources C51 and two second light sources C52 positioned away from each of the first light sources C51 in a first direction d1. The two first light sources C51 can irradiate ultraviolet light C511 toward the first holding portion C21 of the holding means C2, and the two second light sources C52 can irradiate laser light C521 toward the first holding portion C22 of the holding means C2. The number of first light sources C51 and second light sources C52 is not limited by this embodiment in the present invention.

[0044] As shown in Figure 7, the first holding device 4 and the second holding device 5 are arranged in parallel with a gap between them in the second direction d2, and are positioned within a range from which the component coupling device 2 can move. The first holding device 4 includes a first carrier 41 for holding the integrated circuit component W2, a first turntable 42 for horizontally rotating the first carrier 41, and a first carrier rail base 43 for driving the movement of the first turntable 42 and the first carrier 41 in the first direction d1. The second holding device 5 includes a second carrier 51 for holding the optical fiber array component W1, and a second carrier rail base 52 for driving the movement of the second carrier 51 in the first direction d1. In this embodiment, the holding mechanism C moves sequentially between the second carrier 51, the adhesive application device 10, and the first carrier 41.

[0045] As shown in Figures 7 and 24, the inspection device 6 is positioned in the housing T between the first holding device 4 and the second holding device 5, and within the range of movement of the component coupling device 2. The inspection device 6 can perform inspection and measurement operations on the optical fiber array component W1. The inspection device 6 includes a second image capture unit 61, a second distance sensor 62, and an optical integrator 63. The second image capture unit 61 acquires the direction of the optical coupling section W11 and / or prism W111 by capturing images of the optical coupling section W11 and / or prism W111 from below the optical fiber array component W1 held by the holding mechanism C. By using, for example, an optical reflection sensor as the second distance sensor 62 and sensing the distance to different positions (points) on the lower surface of the optical coupling section W11, the inclination angle of the lower surface of the optical coupling section W11 can be acquired. The second image capture unit 61 and the second distance sensor 62 can adopt the same configuration as the first image capture unit D1 and the first distance sensor D2, as shown in Figure 9. The optical integrator 63 measures the intensity of the optical signal W3 output by the optical fiber array component W1 from below the optical fiber array component W1, which is held by the holding mechanism C. For example, an integrating sphere can be used as the optical integrator 63. Specifically, the optical integrator 63 measures the intensity of the optical signal W3 output by the optical fiber array component W1, but the optical signal W3, after passing through the optical fiber array component W1 and being transferred to the integrated circuit component W2 (see Figure 5), and then sent back to the optical fiber array component W1, is measured by the measurement unit 1 (see Figure 17).

[0046] As shown in Figure 7, the first rail device 7 and the second rail device 8 are arranged in parallel in the housing T with a gap between them in the second direction d2. The first rail device 7 has a first rail 71 that transports a first storage tray S1 capable of holding integrated circuit components W2 along the first direction d1. The first rail 71 can be made up of, for example, a rail and a conveyor belt. The second rail device 8 has a second rail 81 that transports a second storage tray S2 capable of holding a plurality of optical fiber array components W1 along the first direction d1. The second rail 81 can be made up of, for example, a rail and a conveyor belt. The component transport device 9 is arranged in the housing T and has a gantry 91 that straddles the first rail device 7 and the second rail device 8, a first placement mechanism 92 arranged in the gantry 91, and a second placement mechanism 93 arranged in the gantry 91. The first placement mechanism 92 and the second placement mechanism 93 are configured to move in the gantry 91 along a second direction d2. Specifically, the first placement mechanism 92 can move between the first storage tray S1 and the first carrier 41, and the second placement mechanism 93 can move between the second storage tray S2 and the second carrier 51. The first placement mechanism 92 and the second placement mechanism 93 can be configured as, for example, suction cups or suction nozzles.

[0047] As shown in Figures 7 and 25, the adhesive application device 10 is located on one side of the second holding device 5 away from the inspection device 6, and is positioned within a range from which the component coupling device 2 can move. The adhesive application device 10 includes a first adhesive valve 101 configured to apply a first adhesive F1 to the optical coupling section W11W1, and a second adhesive valve 102 configured to apply a second adhesive F2 to the receptacle section W12. The holding mechanism C is movable relative to the first adhesive valve 101 and the second adhesive valve 102. The first adhesive valve 101 has a first adhesive nozzle 1011 for discharging the first adhesive F1 upward. The second adhesive valve 102 has a second adhesive nozzle 1021 for discharging the second adhesive F2 upward. In this embodiment, the first adhesive valve 101 and the second adhesive valve 102 can be, for example, syringe pumps, but are not limited thereto. In other embodiments, the first adhesive valve 101 and the second adhesive valve 102 can be, for example, screw valves, piezoelectric valves, aerosol valves, etc.

[0048] As shown in Figures 7, 8, and 16, the first storage tray S1 in this embodiment is configured to hold only one integrated circuit component W2, but in the present invention, it is also possible to configure it to hold multiple integrated circuit components W2 simultaneously. The first storage tray S1 is placed on the first rail 71 at one end of the first rail device 7. The second storage tray S2 in this embodiment is configured to hold multiple optical fiber array components W1 simultaneously, but in the present invention, it is also possible to configure it to hold only one optical fiber array component W1. The second storage tray S2 is placed on the second rail 81 at one end of the second rail device 8. The first storage tray S1 and the second storage tray S2 are transported along the first rail 71 and the second rail 81, respectively, to a position below the gantry 91.

[0049] Next, the first carrier 41 and the second carrier 51 are moved below the gantry 91 by the drive of the first carrier rail base 43 and the second carrier rail base 52, respectively. The first placement mechanism 92 of the parts transport device 9 picks up the integrated circuit component W2 held by the first storage tray S1 and transfers it to the first carrier 41. The second placement mechanism 93 picks up the optical fiber array component W1 held by the second storage tray S2 and transfers it to the second carrier 51. After the first carrier 41 and the second carrier 51 have placed the integrated circuit component W2 and the optical fiber array component W1 on them, the first carrier 41 and the second carrier 51 are moved below the second linear motion member A2 of the first drive mechanism A by the drive of the first carrier rail base 43 and the second carrier rail base 52.

[0050] The inspection mechanism D moves laterally along the carrier 41 driven by the first drive mechanism A, thereby acquiring the orientation of each photon integrated circuit W23 and / or lens array W231, and the inclination angle of the upper surface of the photon integrated circuit W23, and then recording this information in the control unit 3. Incidentally, each measurement unit 1 and control unit 3 include, but are not limited to, controllers such as microcontrollers, single-core processors, multi-core processors, dual-core mobile processors, microprocessors, microcontrollers, digital signal processors (DSPs), field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), or radio frequency integrated circuits (RFICs).

[0051] After obtaining the orientation of the photon integrated circuit W23 and / or the lens array W231, and the inclination angle of the upper surface of the photon integrated circuit W23, the second drive mechanism B, driven by the first drive mechanism A, drives the holding mechanism C laterally to move it above the second carrier 51. Then the second drive mechanism B, driven by the first drive mechanism A, moves the holding mechanism C downward, and the holding means C2 comes into contact with the optical fiber array component W1 held by the second carrier 51. Simultaneously, by activating the provision of negative pressure by the negative pressure source, the first holding part C21 and the second holding part C22 of the holding means C2 attract and hold the optical coupling part W11 and the receptacle part W12 of the optical fiber array component W1. Then, by driving the drive member C4, the corresponding connecting member C3 is brought closer to the optical fiber array component W1 and connected to the optical fiber array component W1, so that the measurement unit 1 can supply the optical signal W3 to the optical fiber array component W1.

[0052] After the corresponding connecting member C3 is connected to the optical fiber array component W1 and the corresponding connection is made, the first drive mechanism A drives the second drive mechanism B to move the holding mechanism C upward, so that the holding means C2 that attracts and holds the optical fiber array component W1 separates from the second carrier 51, and the first drive mechanism A drives the second drive mechanism B so that the holding mechanism C holds the optical fiber array component W1 and moves laterally to the inspection device 6 to perform the inspection, and the inspection device 6 measures the intensity of the optical signal W3. The inspection device 6 acquires the direction of the optical coupling section W11 and / or the prism W111 and the inclination angle of the lower surface of the optical coupling section W11, and after measuring the intensity of the optical signal W3, it has the control unit 3 record it.

[0053] The control unit 3 compares the direction of the optical coupling section W11 and / or prism W111 with the direction of the photon integrated circuit W23 and / or lens array W231 to obtain the difference between them. Based on this difference, the control unit 3 controls the oscillation of the first rotating member B1 of the second drive mechanism B along the first curved path R1 in the left-right direction, centered on the first axis L1, as shown in Figure 11. This adjusts the orientation of the optical fiber array component W1 held by the holding mechanism C, so that the direction of the optical coupling section W11 and / or prism W111 corresponds to the direction of the photon integrated circuit W23 and / or lens array W231.

[0054] The control unit 3 also compares the inclination angle of the lower surface of the optical coupling section W11 with the inclination angle of the upper surface of the photon integrated circuit W23 and obtains the difference between them. Based on this difference, the control unit 3 controls the oscillation of the second rotating member B2 of the second drive mechanism B along the second curved path R2 in the vertical direction with respect to the second axis L2, as shown in Figure 12, and controls the oscillation of the third rotating member B3 along the third curved path R3 in the front-rear direction with respect to the third axis L3, as shown in Figure 13. By doing so, the control unit 3 adjusts the orientation of the optical fiber array component W1 held by the holding mechanism C so that the lower surface of the optical coupling section W11 is parallel to the upper surface of the photon integrated circuit W23.

[0055] Furthermore, the intensity of the optical signal W3 detected by the inspection device 6 and recorded in the control unit 3 is used for calibration. For example, an optical signal W3 with an intensity of 100 from the measurement unit 1 is provided to the optical fiber array component W1, but the intensity of the optical signal W3 from the optical fiber array component W1 detected by the optical integrator 63 is 90. This is because a loss occurred when the optical signal W3 was transmitted. The control unit 3 then readjusts the orientation (direction and tilt angle) of the optical fiber array component W1 based on the detected intensity of the optical signal W3 (90). The second drive mechanism B drives the holding mechanism C to adjust the orientation of the optical fiber array component W1, and then the first drive mechanism A drives the second drive mechanism B to move the holding mechanism C laterally toward the adhesive application device 10 to apply the adhesive. The optical fiber array component W1 held by the holding mechanism C moves in the second direction d2 corresponding to the first adhesive valve 101 and the second adhesive valve 102, and the first adhesive valve 101 and the second adhesive valve 102 apply the first adhesive F1 and the second adhesive F2 to the lower surface of the optical coupling part W11 and the lower surface of the receptacle part W12, respectively.

[0056] After applying adhesive to the optical fiber array component W1, the first drive mechanism A drives the second drive mechanism B to move the holding mechanism C laterally above the first carrier 41. Prior to this, the second drive mechanism B had already driven the holding mechanism C to align the direction of the optical coupling portion W11 and / or prism W111 with the direction of the photon integrated circuit W23 and / or lens array W231, so the lower surface of the optical coupling portion W11 was already adjusted to be parallel to the upper surface of the photon integrated circuit W23. Therefore, after moving the holding mechanism C above the first carrier 41, the first drive mechanism A drives the second drive mechanism B to move the holding mechanism C downward, thereby bonding the lower surface of the optical coupling portion W11 and the lower surface of the receptacle portion W12 to the upper surface of the photon integrated circuit W23 and the upper surface of the second lid portion W222 of the lid member W22, respectively, with the first adhesive F1 and the second adhesive F2. As a result, the optical signal W3 is transferred between the optical fiber array component W1 and the integrated circuit component W2 via the prism W111 and the lens array W231. During this process, the holding mechanism C constantly holds the optical fiber array component W1 with the holding means C2.

[0057] Immediately after bonding the optical fiber array component W1 to the integrated circuit component W2, the first adhesive F1 and the second adhesive F2 have not yet hardened, and there is a certain height between the first adhesive F1 and the second adhesive F2. Therefore, the optical fiber array component W1 is placed so as to float on top of the first adhesive F1 and the second adhesive F2, and in this state, it is held by the holding mechanism C and its orientation can be adjusted. At this time, the measurement unit 1 measures whether the intensity of the optical signal W3 falls within a predetermined range. If the numerical value of the intensity of the optical signal W3 measured by the measurement unit 1 is outside the predetermined range, the control unit 3 (see Figure 6) drives the second drive mechanism B to move the optical fiber array component W1 to the holding mechanism C, allowing it to rotate in three degrees of freedom with the axis point Lp (see Figure 15) as the center of rotation and the first axis L1, the second axis L2, and the third axis L3 as axes. With the optical fiber array component W1 attached to the integrated circuit component W2, the control unit 3 fine-tunes the orientation of the optical fiber array component W1 until the numerical value of the intensity of the optical signal W3 measured by the measurement unit 1 falls within a predetermined range. When the numerical value of the intensity of the optical signal W3 measured by the measurement unit 1 falls within the predetermined range, the operation of the second drive mechanism B is stopped. When the numerical value of the measured intensity of the optical signal W3 falls within the predetermined range, it means that the transfer efficiency of the optical signal W3 between the optical fiber array component W1 and the integrated circuit component W2 is relatively good. For example, if the numerical value of the intensity of the optical signal W3 recorded in the control unit 3 is 90, a loss of the optical signal W3 occurs when it is transferred from the optical fiber array component W1 to the integrated circuit component W2. It is preferable that this predetermined range be set to 80 to 90. If the numerical value of the intensity of the optical signal W3 measured by the measurement unit 1 is 75, the control unit 3 and the second drive mechanism B cause the holding mechanism C to continuously fine-tune the posture of the optical fiber array component W1 until the numerical value of the intensity of the optical signal W3 measured by the measurement unit 1 falls between 80 and 90.

[0058] Here, the order in which the first rotating member B1, the second rotating member B2, and the third rotating member B3 of the second drive mechanism B operate is such that the third rotating member B3 has the highest priority, followed by the second rotating member B2, and finally the first rotating member B1. After the third rotating member B3 drives the holding mechanism C to rotate the optical fiber array component W1 around the third axis L3, if the numerical value of the intensity of the optical signal W3 measured by the measurement unit 1 is already within a predetermined range, then there is no need for the first rotating member B1 and the second rotating member B2 to operate. After the second drive mechanism B drives the holding mechanism C to fine-tune the orientation of the optical fiber array component W1, if the numerical value of the intensity of the optical signal W3 measured by the measurement unit 1 is still outside the predetermined range, the control unit 3, if necessary, drives the second drive mechanism B with the first drive mechanism A to cause the holding mechanism C to perform linear movement of the optical fiber array component W1 in the three degrees of freedom: the first direction d1, the second direction d2, and the third direction d3, and then drives the second drive mechanism B to cause the holding mechanism C to move the optical fiber array By causing the component W1 to rotate in three degrees of freedom with respect to its first axis L1, second axis L2, and third axis L3, the orientation of the optical fiber array component W1 is adjusted relatively significantly until the numerical value of the intensity of the optical signal W3 measured by the measurement unit 1 falls within a predetermined range while the optical fiber array component W1 is attached to the integrated circuit component W2. Once the numerical value of the intensity of the optical signal W3 measured by the measurement unit 1 falls within the predetermined range, the operation of the first drive mechanism A and the second drive mechanism B is stopped.

[0059] As shown in Figures 2, 16, and 23, when the measured intensity of the optical signal W3 falls within a predetermined range, the curing means C5 cures the first adhesive F1 and the second adhesive F2 with ultraviolet light C511 and laser C521, respectively. Since the optical coupling part W11 is made of a transparent material, the ultraviolet light C511 passes through the optical coupling part W11 and can cure the first adhesive F1 between the optical coupling part W11 and the photon integrated circuit W23. The laser C521 generates heat, so the second adhesive F2 between the receptacle part W12 and the second lid part W222 of the lid member W22 is cured by the heat. After the first adhesive F1 and the second adhesive F2 have cured, the driving member C4 drives the corresponding connecting member C3 away from the optical fiber array component W1, thereby releasing the corresponding connection with the optical fiber array component W1.

[0060] After the corresponding connecting member C3 releases its corresponding connection with the optical fiber array component W1, the negative pressure source releases the negative pressure and the holding means C2 moves away from the optical fiber array component W1, thereby completing the process of coupling the optical fiber array component W1 to the integrated circuit component W2. The first drive mechanism A and the second drive mechanism B of the component coupling device 2 drive the holding mechanism C to repeat the above movement, thereby coupling a predetermined number of optical fiber array components W1 to the integrated circuit component W2. If multiple photon integrated circuits W23 are arranged near the four sides of the holding plate W21 of the integrated circuit element W2, the two component coupling devices 2 can first perform the above coupling operation on two opposing sides of the four sides of the integrated circuit element W2, then the first turntable 42 rotates the first carrier 41 by 90 degrees, and then the two component coupling devices 2 can again perform the coupling operation on the other two sides of the integrated circuit element W2.

[0061] After a predetermined number of optical fiber array components W1 are coupled to integrated circuit elements W2, the first carrier rail base 43 drives the first carrier 41 down to the bottom of the gantry 91, the first placement mechanism 92 removes the coupled integrated circuit elements W2 from the first carrier 41 and places them on the first storage tray S1, and then the first rail 71 discharges the first storage tray S1 from the other end of the first rail device 7. After the optical fiber array components W1 are removed from the second storage tray S2, the second rail 81 discharges the second storage tray S2 from the other end of the second rail device 8.

[0062] In the component coupling equipment 11 of the present invention, the optical fiber array component W1 is held by the holding mechanism C and transported to the adhesive application device 10, where the adhesive application device 10 applies the first adhesive F1 and the second adhesive F2 to the optical coupler portion W11 and the receptacle portion W12 of the optical fiber array component W1, respectively. Compared to the prior art, the step of moving the adhesive valve to the integrated circuit component W2 is eliminated. Furthermore, since the inspection device 6 and inspection mechanism D perform inspections on the optical fiber array component W1 and the integrated circuit component W2, respectively, the first adhesive F1 and the second adhesive F2 can be accurately applied between the optical fiber array component W1 and the integrated circuit component W2 in accordance with the integrated circuit component W2. As a result, the optical fiber array component W1 is accurately coupled to the integrated circuit component W2, and a good yield rate can be obtained. The embodiments of the present invention have been described above, but the present invention is not limited thereto, and various modifications are possible without departing from the spirit thereof. [Explanation of Symbols]

[0063] 1 Measurement Unit 2-part coupling device 3. Control Unit 4. First holding device 41 First Carrier 42. First Turntable 43. First carrier rail base 5. Second holding device 51 Second Carrier 52 Second carrier rail base 6. Inspection equipment 61 Second Image Capture Unit 62 Second distance sensor 63 Optical Integrator 7. First rail device 71 First Rail 8. Second rail device 81 The second rail 9. Parts handling device 91 Gantry 92 First Arrangement Mechanism 93 Second placement mechanism 10 Adhesive application device 101 First adhesive valve 1011 First adhesive nozzle 102 Second adhesive valve 1021 Second adhesive nozzle 11. Parts Coupling Equipment A First drive mechanism A1 First linear motion member A11 First rail base A12 First slide A2 Second linear motion member A21 Second rail base A22 Second slide A3 Third linear motion member A31 Third rail base A32 Third slide B. Second drive mechanism B1 First rotating member B11 First Pedestal B12 First mobile platform B13 First drive unit B14 First connection means B141 First connection surface B142 Second connection surface B2 Second rotating member B21 Second Pedestal B22 Second mobile platform B23 Second drive unit B24 Second connection means B241 Third connection surface B242 Fourth connection surface B3 Third rotating member B31 Third Pedestal B32 Third mobile platform B33 Third drive unit B34 Third connection means B341 Fifth connection surface B342 Sixth connection surface C Retention mechanism C1 Support Frame C11 Nozzle C12 Air passage C2 Holding means C21 First retaining part C211 First retaining surface C212 First negative pressure hole C22 Second retaining part C221 Second retaining surface C222 Second negative pressure hole C23 First position restriction section C231 First Play Area C24 Second position restriction section C241 Second Play Area C3 Compatible Connecting Components C31 Light passage part C32 Optical Transfer Unit C33 Information Department C331 Guide Pin C34 compatible connection side C4 Drive Member C41 Drive mechanism C42 Means of transportation C43 mounting base C5 Curing means C51 First light source C511 Ultraviolet C52 Second light source C521 Laser D Inspection Agency D1 First image capture member D11 Image Capture D12 Camera Head D13 light source D2 distance sensor F1 First Adhesive F2 Second Adhesive T cabinet L1 First axis L2 Second axis L3 Third axis Lp axis point R1 First curved path R2 Second curved path R3 Third curved path W1 Fiber Optic Array Component W11 Optical coupling section W111 Prism W112 First side W12 Receptacle W121 Second side W122 First base W123 Second base W124 Guide hole W13 Optical Fiber Section W131 Fiber Optic W2 Integrated Circuit Components W21 Holding plate W22 Lid component W221 First lid W222 Second lid W223 Cutout space W23 Photon Integrated Circuit W231 Lens Array W2311 Lens W3 optical signal d1 First direction d2 Second direction d3 Third direction r1 First radius r2 Second radius r3 Third radius

Claims

1. A first holding device having a first carrier for holding integrated circuit components, A second holding device having a second carrier for holding optical fiber array components, An adhesive application apparatus having a first adhesive valve for applying a first adhesive to the optical fiber array component, A component coupling apparatus comprising, arranged in a housing, at least one component coupling device having a holding mechanism for sequentially moving the optical fiber array component between the second carrier, the adhesive application device, and the first carrier while holding the optical fiber array component.

2. The first holding device and the second holding device are arranged in parallel with a gap between them. The first holding device further includes a first carrier rail base that drives the movement of the first carrier, The component coupling apparatus according to claim 1, wherein the second holding device further comprises a second carrier rail base that drives the movement of the second carrier.

3. The first holding device further comprises a first turntable that drives the rotation of the first carrier, The component coupling apparatus according to claim 2, wherein the first carrier rail base drives the movement of the first turntable and the first carrier.

4. The housing further comprises a first rail device and a second rail device arranged in parallel with a gap between them, The first rail device has a first rail configured for transporting a first storage tray that houses the integrated circuit components, The component coupling apparatus according to claim 2, wherein the second rail device has a second rail configured for transporting a second storage tray for housing the optical fiber array components.

5. The housing further comprises a parts transport device, The aforementioned parts transport device, A gantry spanning the first rail device and the second rail device, A first arrangement mechanism is positioned in the gantry so as to be able to move between the first storage tray and the first carrier along the gantry, The component coupling apparatus according to claim 4, further comprising: a second arrangement mechanism positioned on the gantry so as to be movable between the second receiving tray and the second carrier along the gantry.

6. The component coupling equipment according to claim 1, wherein two component coupling devices are arranged in the housing so as to face each other.

7. The adhesive application apparatus further includes a second adhesive valve for applying a second adhesive to the optical fiber array component. The first adhesive valve has a first adhesive nozzle that discharges the first adhesive upward, The second adhesive valve has a second adhesive nozzle that discharges the second adhesive upward, The holding mechanism moves relative to the first adhesive valve and the second adhesive valve while holding the optical fiber array component. The first adhesive valve applies the first adhesive to the lower surface of the optical coupling portion of the optical fiber array component. The component coupling apparatus according to claim 1, wherein the second adhesive valve applies the second adhesive to the lower surface of the receptacle portion of the optical fiber array component.

8. At least one of the component coupling devices further has an inspection mechanism for inspecting the integrated circuit components, The inspection mechanism includes a first image capture unit and a first distance sensor. The first image capture unit acquires the orientation of the photon integrated circuit or lens array by taking images of the photon integrated circuit or lens array from above the integrated circuit component. The component coupling apparatus according to claim 1, wherein the first distance sensor obtains the inclination angle of the upper surface of the photon integrated circuit by sensing the distance to different positions on the upper surface of the photon integrated circuit.

9. The housing further comprises an inspection device positioned within the housing for inspecting the aforementioned optical fiber array components, The inspection device includes a second image capture unit and a second distance sensor. The second image capture unit acquires the direction of the optical coupling portion or the prism by taking an image of the optical fiber array component held by the holding mechanism from below the optical coupling portion or the prism, The component coupling apparatus according to claim 1, wherein the second distance sensor obtains the inclination angle of the lower surface of the optical coupling portion by sensing the distance to different positions on the lower surface of the optical coupling portion.

10. The component coupling apparatus according to claim 9, further comprising an optical integrator that measures the intensity of an optical signal output by the optical fiber array component from below the optical fiber array component held by the holding mechanism.

11. The component coupling device according to claim 1, wherein at least one component coupling device further comprises a first drive mechanism disposed in the housing and a second drive mechanism provided on the first drive mechanism and driven by the first drive mechanism to enable multi-axis linear movement, and the holding mechanism is provided on the second drive mechanism and driven by the second drive mechanism to enable multi-axis rotational movement.

12. The first drive mechanism includes: A first linear motion member provided in the housing drives the second drive mechanism to move linearly in a first direction, A second linear motion member provided on the first linear motion member drives the second drive mechanism to move linearly in a second direction, The second linear motion member is provided with a third linear motion member that drives the second drive mechanism to move linearly in a third direction, The holding mechanism, in conjunction with the second drive mechanism, drives the movement of the optical fiber array component. The first direction, the second direction, and the third direction are mutually orthogonal. The component coupling apparatus according to claim 11, wherein the first direction and the second direction are transverse directions, and the third direction is a vertical direction.

13. The second drive mechanism is, A first rotating member provided in the first drive mechanism, which rotates the holding mechanism about a first axis, A second rotating member provided on the first rotating member rotates the holding mechanism about a second axis, The second rotating member is provided with a third rotating member that rotates the holding mechanism about a third axis, The holding mechanism, in conjunction with the second drive mechanism, drives the rotation of the optical fiber array component. The first axis is parallel to the third direction, the second axis is parallel to the first direction, and the third axis is parallel to the second direction. The first direction, the second direction, and the third direction are mutually orthogonal. The component coupling apparatus according to claim 11, wherein the first direction and the second direction are transverse directions, and the third direction is a vertical direction.

14. The first axis, the second axis, and the third axis intersect each other at the axis point. The component coupling apparatus according to claim 13, wherein the second drive mechanism drives the holding mechanism to rotate the optical fiber array component with the axis point as the center of rotation.

15. The housing further comprises a measurement unit, The component coupling equipment according to claim 1, wherein the holding mechanism comprises a holding means for holding the optical fiber array component, and a corresponding connecting member connected to the measurement unit and configured to be detachably attached to the optical fiber array component by moving relative to the holding means.

16. The holding mechanism further includes a drive member that drives the movement of the corresponding connecting member. The aforementioned drive member has a drive means and a moving means, The component coupling apparatus according to claim 15, wherein the corresponding connecting member is mounted on the moving means and is configured to reciprocate relative to the holding means by the drive means so as to be detachable from the optical fiber array component.

17. The holding mechanism has holding means for holding the optical fiber array component, The holding means has a first holding part and a second holding part that are spaced apart from each other. The first holding portion can hold the optical coupling portion of the optical fiber array component. The second holding portion can hold the receptacle portion of the optical fiber array component. The first retaining portion has a first retaining surface through which the first negative pressure hole passes, The optical coupling portion of the optical fiber array component can be attracted and held to the first holding surface by the first negative pressure hole. The second retaining portion has a second retaining surface through which the second negative pressure hole passes. The component coupling apparatus according to claim 1, wherein the receptacle portion of the optical fiber array component can be attracted and held to the second holding surface by the second negative pressure hole.

18. The holding means further includes a first position limiting portion and a second position limiting portion, The first position limiting portion is located on one side of the second holding portion adjacent to the first holding portion. The second position limiting portion is positioned on one side of the second holding portion that is away from the first holding portion. The component coupling apparatus according to claim 17, wherein the first position limiting unit and the second position limiting unit restrict the movement of the optical fiber array component.

19. The first position limiting section is provided with a first clearance area through which the optical fiber portion of the optical fiber array component passes. The component coupling apparatus according to claim 18, wherein the second position limiting portion is provided with a second play area through which the receptacle portion of the optical fiber array component passes.

20. The holding mechanism further includes a hardening means, The curing means includes a first light source and a second light source. The first light source can irradiate ultraviolet light in the direction of the first holding portion of the holding means, The component coupling apparatus according to claim 17, wherein the second light source can irradiate a laser in the direction of the second holding portion of the holding means.

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