Terminal block manufacturing method

Abstract

The present invention provides a method for manufacturing a terminal block that suppresses corrosion of injection molds caused by flux residue resulting from soldering, and suppresses deterioration of the appearance of the resin part. [Solution] In a method for manufacturing a terminal block 1 having an assembly 2 and a resin part 3, which can be attached to a case 9 housing electronic equipment, the prepared assembly 2 is set in an injection molding die and an injection molding process is carried out. The assembly 2 has a bus bar 21, a mounting part 22, a printed circuit board 23 to which a chip capacitor 231 is soldered, and a covering material 24. The covering material 24 is a hardened covering material filled in a resin frame 4 which has at least a frame-shaped frame part 41, and covers the chip capacitor 231 and the soldered part. In the injection molding process, the assembly 2 with the frame 4 removed from the covering material 24, or the assembly 2 with the frame 4 still attached to the covering material 24, is set in the injection molding die and injection molding is carried out.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a terminal block.

Background Art

[0002] Conventionally, a terminal block is known in which a bus bar and a chip capacitor are inserted into an injection mold and resin is injection-molded. In the terminal block, the chip capacitor is usually mounted on a printed circuit board by soldering. Such a terminal block is used, for example, by being attached to a case containing an electronic device such as a DC / DC converter.

[0003] Note that the technique described in the preceding Patent Document 1 is not related to a terminal block. However, in Patent Document 1, since flux residues are generated by using flux during soldering, when a coating layer such as a barrier layer is formed on an electronic circuit board on which flux residues are generated, corrosive gas or the like infiltrates through cracks in the coating layer generated starting from the flux residues, and the electronic circuit board corrodes. Therefore, in order to prevent this, there is described a problem of providing a coating composition capable of forming a coating layer with improved corrosion resistance.

[0004] Also, in Patent Document 1, in order to solve the above problem, there is disclosed that a specific first coating composition and a second coating composition are applied to an electronic circuit board to form a first coating layer and a second coating layer. And, as methods for applying a specific first coating composition and a second coating composition to an electronic circuit board, spray coating, brush coating, roller coating, dipping, dropping, etc. are described.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

[0006] However, when manufacturing a terminal block having a printed circuit board with soldered chip capacitors, if the technology of Patent Document 1 is applied and the coating composition is applied to the soldered chip capacitors using the above-described application method, it is difficult to control the thickness of the coating composition. For example, the coating composition flows at the edges of the chip capacitors, resulting in the thickness of the formed coating material being partially thin. Therefore, with the technology of Patent Document 1, it is difficult to cover the chip capacitors and the soldered parts with a coating material of the desired thickness.

[0007] Therefore, when a printed circuit board, busbars, etc., covered with a coating material formed by coating chip capacitors and soldered parts are set in an injection mold and the resin part of a terminal block is molded, flux residue caused by flux contained in the solder or flux applied during soldering leaks out from the partially thinned coating material, causing corrosion of the injection mold. When such corrosion of the injection mold occurs, the corroded parts are transferred to the surface of the formed resin part, and the appearance of the resin part of the terminal block deteriorates.

[0008] This invention has been made in view of the above problems, and aims to provide a method for manufacturing a terminal block that can suppress corrosion of injection molds due to flux residue caused by soldering and suppress deterioration of the appearance of the resin part. [Means for solving the problem]

[0009] The method for manufacturing a terminal block according to the present invention is as follows:

[0010] The first invention is, A method for manufacturing a terminal block having an assembly and a resin part that covers a part of the assembly, and which can be attached to a case housing electronic equipment, The process includes a preparation step of preparing the assembly and an injection molding step of setting the assembly in an injection mold and performing injection molding. The aforementioned assembly is, A busbar, one end of which is inserted into a through hole formed in the wall of the case, A mounting body formed from a metal material and positioned in a direction intersecting the busbar, A printed circuit board is placed on the surface of the busbar and electrically connected to the busbar by soldering, and is also electrically connected to the mounting body, and one or more chip capacitors are soldered to it, The chip capacitor and the covering material that covers the soldered portion are provided. The aforementioned covering material is A resin frame body having at least a frame-shaped section filled with a hardened coating material, The injection molding process described above is: The first step involves setting the assembly, with the frame removed from the covering material, into an injection mold, and forming the resin part by injection molding so as to cover at least a portion of the busbar, the mounting body, and the covering material, thereby integrating the resin part with the assembly, or The second step involves setting the assembly, with the frame still attached to the covering material, into an injection mold, and forming the resin part by injection molding so as to cover at least a portion of the busbar, the mounting body, and the frame, thereby integrating the resin part with the assembly. This describes a method for manufacturing terminal blocks.

[0011] The second invention is, in the first invention, The injection molding process is the first step, The aforementioned coating material is a silicone rubber material. This describes a method for manufacturing terminal blocks.

[0012] The third invention is, in the first or second invention, The injection molding process is the first step, The bus bar has a protruding portion that protrudes from the mounting surface of the bus bar where the printed circuit board is mounted, The printed circuit board has a through-hole for the protruding portion into which the protruding portion is inserted, The bus bar is soldered to the protruding portion inserted into the through-hole for the protruding portion, The soldered portion is also covered with the coating material, This is a method for manufacturing a terminal block.

[0013] A fourth invention is any one of the first to third inventions, The injection molding step is the first step, The frame is formed of a material having mold release properties with respect to the coating material, This is a method for manufacturing a terminal block.

[0014] A fifth invention is any one of the first to fourth inventions, The injection molding step is the first step, The frame has a box shape with a bottom surface that closes one opening of the frame portion, This is a method for manufacturing a terminal block.

[0015] A sixth invention is the first invention, The injection molding step is the second step, The frame is formed of a material compatible with the resin forming the resin portion, This is a method for manufacturing a terminal block.

[0016] A seventh invention is the first invention or the sixth invention, The injection molding step is the second step, The thickness of the frame portion is 3 mm or less, This is a method for manufacturing a terminal block.

[0017] The eighth invention is based on the first invention, or any one of the sixth to seventh inventions, The injection molding process is the second process, The busbar has a projection on its surface that protrudes from the mounting surface on which the printed circuit board is placed. The printed circuit board has a through-hole for the protrusion into which the protrusion is inserted. The busbar has the protrusions that are inserted into the through-holes for the protrusions soldered to it. The soldered portion is also covered with the aforementioned covering material. This describes a method for manufacturing terminal blocks.

[0018] The ninth invention is based on the first invention, or any one of the sixth through eighth inventions, The injection molding process is the second process, The frame is formed in a box shape with a bottom portion that closes one of the openings in the frame portion. This describes a method for manufacturing terminal blocks.

[0019] The tenth invention is, in the ninth invention, The aforementioned coating material is an ultraviolet-curable material. The frame material constituting the aforementioned frame is a material that transmits ultraviolet light. This describes a method for manufacturing terminal blocks.

[0020] The eleventh invention is based on any one of the first to tenth inventions, The aforementioned preparation step is, A mounting step of soldering the chip capacitor onto the printed circuit board, The assembly process involves placing the printed circuit board on which the chip capacitor is soldered onto the surface of the busbar, electrically joining the busbar and the printed circuit board by soldering, and electrically joining the printed circuit board and the mounting body. An immersion step in which at least the chip capacitor and the soldered portion are immersed in the covering material filled in the frame, The process includes a curing step of curing the coating material to form the coating material, If the injection molding process is the first step, remove the frame from the covering material, or If the injection molding process is the second process, the frame is left attached to the covering material. This describes a method for manufacturing terminal blocks. [Effects of the Invention]

[0021] In the manufacturing method of the terminal block of the first invention, in either the first or second injection molding process, an assembly is used in which the chip capacitor and soldered parts are covered with a covering material. In this assembly, the covering material is formed by hardening the covering material filled in the frame, so that the covering material does not flow at the edges of the chip capacitor, the thinning of the covering material in certain areas is suppressed, and the desired covering thickness is ensured.

[0022] Therefore, in the terminal block manufacturing method of the first invention, regardless of whether the injection molding process is the first or second step, when the assembly is set in the injection mold and the resin part of the terminal block is molded, the coating material covering the chip capacitor and soldered parts makes it difficult for flux residue caused by soldering to leak out, suppresses corrosion of the injection mold, and suppresses deterioration of the surface condition of the resin part. In addition, the frequency of maintenance work on the injection mold can also be reduced. Therefore, the terminal block manufacturing method of the first invention provides a terminal block manufacturing method that can suppress corrosion of the injection mold due to flux residue caused by soldering and suppress deterioration of the appearance of the resin part.

[0023] Furthermore, according to the manufacturing method of the terminal block of the first invention, since the chip capacitor is covered with a covering material, it is possible to prevent vibration and stress from being directly applied to the chip capacitor, resulting in a terminal block with excellent reliability in electrical noise suppression. In addition, according to the manufacturing method of the terminal block of the first invention, since the chip capacitor is covered with a covering material, it is also possible to prevent the chip capacitor from peeling off or shifting position from the printed circuit board when the resin part is injection molded.

[0024] Furthermore, in the method for manufacturing a terminal block according to the first invention, if the injection molding process is the first step, the frame is removed from the covering material of the assembly, so when manufacturing multiple terminal blocks, it is not necessary to prepare one frame for each terminal block manufactured, and the same frame can be reused. On the other hand, in the method for manufacturing a terminal block according to the first invention, if the injection molding process is the second step, it is sufficient to prepare the assembly with the frame still attached to the covering material of the assembly, so the step of removing the frame when preparing the assembly can be omitted.

[0025] The terminal block manufacturing method of the second invention, in addition to the effects of the terminal block manufacturing method of the first invention, further enhances the heat resistance of the formed coating material because the coating material is a silicone rubber material, making it more resistant to the heat during injection molding of the resin part. Therefore, according to the terminal block manufacturing method of the second invention, damage to the coating material due to heat during injection molding is suppressed, corrosion of the injection mold due to flux residue is more easily suppressed, and deterioration of the appearance of the resin part is more easily suppressed.

[0026] The third invention's method for manufacturing a terminal block offers the advantages of the first or second inventions, plus the ability to electrically connect the busbars to the printed circuit board by inserting the busbar protrusions into the through-holes for the protrusions on the printed circuit board and soldering them. This allows for relatively easy preparation of the assembly. Furthermore, positioning the printed circuit board relative to the busbars becomes easier during assembly preparation.

[0027] The terminal block manufacturing method of the fourth invention, in addition to the effects of any one of the terminal block manufacturing methods of the first to third inventions, further has the advantage that the frame is formed of a material that has release properties with respect to the covering material. Therefore, after the covering material filled in the frame has hardened, the frame can be easily removed from the covering material, and an assembly can be prepared in which the frame has been removed from the covering material.

[0028] The fifth invention, in addition to the effects of any one of the first to fourth inventions for manufacturing a terminal block, further improves work efficiency because the frame has a box-like shape with a bottom portion that closes one of the openings in the frame. This allows the frame to be carried with the covering material filled inside during the preparation of the assembly.

[0029] The manufacturing method of the terminal block of the sixth invention, in addition to the effects of the manufacturing method of the terminal block of the first invention, further has the advantage that the frame is made of a material compatible with the resin forming the resin part. Therefore, when the resin part is injection molded, it becomes easier to join the resin part and the frame, making it possible to obtain a terminal block with excellent integration between the resin part and the frame.

[0030] The terminal block manufacturing method of the seventh invention, in addition to the effects of the terminal block manufacturing methods of the first or sixth invention, further enables miniaturization of terminal blocks manufactured using assemblies in which the frame remains attached to the covering material, because the thickness of the frame portion is 3 mm or less.

[0031] The eighth invention's method for manufacturing a terminal block offers the advantages of the first invention and any one of the sixth to seventh inventions in addition to the ability to electrically connect the busbars to the printed circuit board by inserting the busbar protrusions into the through-holes for the protrusions of the printed circuit board and soldering them. This allows for relatively easy preparation of the assembly. Furthermore, positioning the printed circuit board relative to the busbars becomes easier during assembly preparation.

[0032] The terminal block manufacturing method of the ninth invention, in addition to the effects of the terminal block manufacturing methods of the first invention and any one of the sixth to eighth inventions, further improves work efficiency because the frame has a box shape with a bottom that closes one of the openings in the frame, allowing the frame to be carried with the covering material filled inside during the preparation of the assembly.

[0033] The method for manufacturing a terminal block of the 10th invention, in addition to the effects of the method for manufacturing a terminal block of the 9th invention, further offers the advantage that the covering material is an ultraviolet-curable material, and the frame material constituting the frame is an ultraviolet-transmitting material. Therefore, when preparing the assembly, ultraviolet light can be irradiated onto the frame, and the covering material can be cured by the ultraviolet light that has passed through the frame to form the covering material. As a result, the method for manufacturing a terminal block of the 10th invention allows for the efficient formation of the covering material while the frame is still attached when preparing the assembly.

[0034] The terminal block manufacturing method of the 11th invention, in addition to the effects of any one of the terminal block manufacturing methods of the 1st to 10th inventions, further has the above-described configuration in the preparation step, so that it is possible to easily prepare assemblies in which the frame has been removed from the covering material and assemblies in which the frame is still attached to the covering material. [Brief explanation of the drawing]

[0035] [Figure 1] Figure 1 is an exploded perspective view showing a terminal block manufactured by the manufacturing method according to the embodiment, with the terminal block removed from its case. [Figure 2] Figure 2 is a perspective view of a terminal block manufactured by the terminal block manufacturing method according to the embodiment. [Figure 3] Figure 3 is a perspective view of a busbar (before assembly) used in an assembly prepared in the preparation step of the manufacturing method of a terminal block according to the embodiment. [Figure 4] Figure 4 is a perspective view of the mounting body (before assembly) used in the assembly prepared in the preparation step of the manufacturing method of the terminal block according to the embodiment. [Figure 5]Figure 5 is a perspective view of a printed circuit board (before assembly) to which chip capacitors used in the assembly prepared in the preparation step of the manufacturing method of the terminal block according to the embodiment have been soldered. [Figure 6] Figure 6 is a perspective view showing the assembled state of a printed circuit board with a chip capacitor soldered to it, a busbar, and a mounting body, which are prepared in the preparation step of the manufacturing method of the terminal block according to the embodiment. [Figure 7] Figure 7 is a perspective view showing the state in which the busbars and printed circuit board are soldered together, and the printed circuit board is soldered together, when forming the assembly prepared in the preparation step of the manufacturing method of the terminal block according to the embodiment. [Figure 8] Figure 8 is a perspective view (only a portion is shown) illustrating the assembled state of a printed circuit board with a soldered chip capacitor and a mounting body, using a different structure than that shown in Figure 6. [Figure 9] Figure 9 is a perspective view showing a frame used for forming the covering material when forming the assembly prepared in the preparation step of the manufacturing method of the terminal block according to the embodiment. [Figure 10] Figure 10 is a perspective view showing the state in which, in the preparation step of the manufacturing method of the terminal block according to the embodiment, the assembly is formed by filling the frame shown in Figure 9 with a covering material, and the chip capacitor and the soldered portion are immersed in the covering material filled in the frame. [Figure 11] Figure 11 is a perspective view of the assembly in the preparation step of the manufacturing method of the terminal block according to the embodiment, where the covering material is hardened to form a covering material, and then the frame is removed from the covering material to form the assembly. [Figure 12] Figure 12 is a perspective view of an assembly formed in the preparation step of the manufacturing method of a terminal block according to the embodiment, where the covering material is cured to form a covering material, and then the frame (however, a frame with a thinner thickness than the frame shown in Figure 9) is left attached to the covering material to form an assembly. [Modes for carrying out the invention]

[0036] A method for manufacturing a terminal block according to one embodiment will be described in detail with reference to Figures 1 to 12.

[0037] (Outline of a terminal block manufactured using the terminal block manufacturing method) The manufacturing method for a terminal block according to this embodiment (hereinafter sometimes referred to as "this manufacturing method") is a manufacturing method for producing a terminal block 1 that can be attached to a case 9 housing electronic equipment (not shown), as illustrated in Figures 1 and 2.

[0038] The terminal block 1 comprises an assembly 2 and a resin part 3 that covers a portion of the assembly 2. The assembly 2 comprises a busbar 21, a mounting body 22, a printed circuit board 23 to which one or more chip capacitors 231 are soldered, and a covering material 24 (see Figures 7, 11, 12, etc.). The detailed configuration of the assembly 2 will be described later, but in Figures 1 and 2, a portion of the busbar 21, a portion of the mounting body 22, the printed circuit board 23 with the chip capacitors 231, and the covering material 24 are covered by the resin part 3, and therefore these parts are not shown in Figures 1 and 2.

[0039] The resin part 3 can be formed from, for example, a highly thermally conductive resin. Specific examples of highly thermally conductive resins include PPS (polyphenylene sulfide) resin, PA (polyamide) resin, PBT (polybutylene terephthalate) resin, and PC (polycarbonate) resin. The terminal block 1, with the resin part 3 covering the busbar 21, allows for efficient heat dissipation from the busbar 21, through which a large current flows, to the outside air, while also ensuring insulation.

[0040] The terminal block 1 is configured to be mounted on the case 9. Here, we will explain using the example of mounting the terminal block 1 to the case 9 via mounting holes 221 located on both sides of the busbar 21 in the resin part 3. In Figure 2, the direction of arrow A indicates the mounting direction of the terminal block 1 to the case 9.

[0041] Case 9 is sometimes referred to as an electrical component case, and houses electronic equipment such as a DC / DC converter inside. Case 9 can be made of a metal material such as aluminum (aluminum includes aluminum alloys, hereafter omitted). The shape of Case 9 is not particularly limited as long as it can house the electronic equipment and allow for the attachment of Terminal Block 1.

[0042] Figure 1 illustrates a case 9 having a case bottom (not shown), a wall portion 91 erected around the outer perimeter of the case bottom, and a lid portion 92 provided opposite the case bottom and closing a case opening (not shown) formed at one end of the wall portion 91. The wall portion 91 has a through hole 911 that penetrates through it. One end of the busbar 21 of the terminal block 1 is inserted into this through hole 911. Therefore, this through hole 911 can also be called a busbar insertion hole. In this embodiment, one through hole 911 is formed in the wall portion 91, and bolt insertion holes 912 are formed on both sides of the through hole 911.

[0043] As illustrated in Figure 2, the terminal block 1 has mounting holes 221 of mounting bodies 22 embedded in the resin part 3, and a portion of the outer edge 222 of the mounting holes 221 exposed on both sides of the busbar 21 fixed to the resin part 3. In the terminal block 1, each mounting hole 221 is formed at a position corresponding to the position of each bolt insertion hole 912 of the case 9. In this embodiment, the number of mounting holes 221 in the terminal block 1 is set to two, corresponding to the number of bolt insertion holes 912 of the case 9, but the number of mounting holes 221 is not limited to this and can be changed to any number corresponding to the number of bolt insertion holes 912 of the case 9. Furthermore, the position of the mounting holes 221 in the terminal block 1 is not limited to the above position and can be changed to any position corresponding to the position of the bolt insertion holes 912 of the case 9.

[0044] When attaching the terminal block 1 to the case 9, the two mounting holes 221 on the terminal block 1 are aligned with the two bolt insertion holes 912 on the case 9, and two bolts 93 are inserted into the respective mounting holes 221 and bolt insertion holes 912 and tightened with nuts or the like. Alternatively, screw grooves may be formed on the inner surface of the bolt insertion holes 912 on the case 9, and the bolts 93 may be tightened into these bolt insertion holes 912. In this way, the terminal block 1 is fixed to the case 9 with one end of the busbar 21 of the terminal block 1 inserted into the through hole 911 of the case 9. In addition, each bolt 93 inserted into each bolt insertion hole 912 of the case 9 makes electrical contact with the outer edge 222 of each mounting hole 221. Furthermore, one end of the busbar 21 inserted into the through hole 911 of the case 9 can be electrically connected to electronic equipment inside the case 9 using bolts, nuts, screws, etc.

[0045] After the terminal block 1 is mounted to the case 9, if electrical noise inside the case 9 is transmitted to the busbar 21, that electrical noise can be discharged from the busbar 21 → chip capacitor 231 on the printed circuit board 23 → mounting hole 221 on the mounting body 22 → bolt 93 → to the ground (not shown) of the case 9.

[0046] (Method of manufacturing terminal blocks) The manufacturing method of the terminal block according to this embodiment comprises a preparation step and an injection molding step. Each step will be described below.

[0047] <Preparation process> In this manufacturing method, the preparation step is the step of preparing assembly 2. Assembly 2 may be prepared by procuring an already completed assembly 2, or it may be manufactured by assembling the individual components that make up assembly 2 within the preparation step.

[0048] Figures 3 to 12 illustrate the detailed configuration of assembly 2 and an example of the manufacturing procedure for assembly 2.

[0049] (1) Detailed configuration of the assembly Assembly 2, as illustrated in Figures 11 and 12, includes a busbar 21, a mounting body 22, a printed circuit board 23, and a covering material 24. Note that in Figure 12, the covering material 24 is not shown because it is covered by the frame 4 (described later).

[0050] The busbar 21, as illustrated in Figure 3, is typically formed from a metal material. Examples of metal materials used to form the busbar 21 include copper (including copper alloys, hereafter omitted), highly conductive metal plates such as SUS, etc. One end of the busbar 21 is inserted into a through hole 911 formed in the wall portion 91 of the case 9. Therefore, one end of the busbar 21 is formed to protrude from the resin portion 3. The other end of the busbar 21 is also formed to protrude from the resin portion 3. In Figure 3, an example is shown in which the busbar 21 is formed in a flat shape, but the shape of the busbar 21 is not particularly limited. The busbar 21 may have one or more bent portions formed by bending a metal plate that has been formed into a predetermined shape by, for example, press working.

[0051] In this embodiment, the busbar 21 may have a protrusion 211. The protrusion 211 protrudes from the mounting surface 210 on which the printed circuit board 23 is placed. The protrusion 211 may be formed, for example, by soldering a material for the protrusion, such as a pin, onto the mounting surface 210, or it may be formed by deforming the busbar 21 to make the protrusion 211 protrude from the mounting surface 210. According to the latter method, there is no need to prepare a separate material for the protrusion, and the protrusion 211 can be formed easily.

[0052] The mounting body 22, as illustrated in Figure 4 and other figures, is formed from a metal material. Examples of metal materials used to form the mounting body 22 include copper, stainless steel, and other highly conductive metal plates. The mounting body 22 is positioned in a direction that intersects with the bus bar 21. In this embodiment, as illustrated in Figures 11 and 12, the mounting body 22 is positioned in a direction perpendicular to the bus bar 21. The term "perpendicular" as used above includes not only cases where the mounting body 22 and the bus bar 21 intersect at a right angle, but also cases where the mounting body 22 and the bus bar 21 intersect at an angle ranging from -15° to +15°.

[0053] In this embodiment, the mounting body 22 has the aforementioned mounting holes 221 formed at both ends. In addition, a busbar arrangement portion 223 is formed in the longitudinal center of the mounting body 22 where the busbar 21 is arranged. In other words, in the mounting body 22, one mounting hole 221 is formed in one region and one in the other region, with the busbar arrangement portion 223 in between. Here, the busbar arrangement portion 223 is formed by cutting out a portion of the longitudinal side edge of the mounting body 22.

[0054] Furthermore, in this embodiment, the mounting body 22 can have pin portions 224 on both sides of the busbar arrangement portion 223 where the busbar 21 is arranged. Figure 4 shows an example in which each pin portion 224 is formed on both sides of the busbar arrangement portion 223 so as to protrude from the end face along the thickness direction of the mounting body 22. Such pin portions 224 can be easily formed by punching out a metal plate or the like.

[0055] Although Figure 4 shows an example where the mounting body 22 is formed in a flat shape, the shape of the mounting body 22 is not particularly limited. The mounting body 22 may have one or more bent portions formed by bending a metal plate that has been formed into a predetermined shape by, for example, press working.

[0056] The printed circuit board 23 illustrated in Figure 5 has one or more chip capacitors 231 mounted on it. The chip capacitors 231 are soldered to the printed circuit board 23. In the drawing, the soldered parts are indicated by dots. Specifically, examples of chip capacitors 231 include multilayer ceramic chip capacitors. This type of chip capacitor 231 usually has a pair of electrodes.

[0057] In Figure 5, an example is shown in which eight chip capacitors 231 are soldered to the printed circuit board 23, but the number of chip capacitors 231 is not particularly limited. Furthermore, when multiple chip capacitors 231 are soldered to the printed circuit board 23, the printed circuit board 23 may have a section in which two or more chip capacitors 231 are arranged in series, or a section in which chip capacitors 231 are arranged in parallel. In the former case, even if one chip capacitor 231 fails, a short-circuit failure will not occur, and a terminal block 1 can be obtained that has redundancy and improved safety. In the latter case, a terminal block 1 can be obtained that can remove electrical noise by increasing the total capacitance of the chip capacitors 231.

[0058] In this embodiment, the printed circuit board 23 may have through-holes 232 for protrusions into which the protrusions 211 of the busbar 21 are inserted. The printed circuit board 23 may also have through-holes 233 for each pin portion 224 of the mounting body 22 into which each pin portion 224 is inserted. Here, as illustrated in Figures 6 and 7, the protrusions 211 of the busbar 21 inserted into the through-holes 232 for protrusions of the printed circuit board 23 are soldered. Similarly, the pin portions 224 of the mounting body 22 inserted into the through-holes 233 for each pin portion of the printed circuit board 23 are soldered. As a result, the printed circuit board 23 is placed on the surface of the busbar 21 and electrically joined to the busbar 21 by soldering, and is also electrically joined to the mounting body 22.

[0059] In the above example, each pin portion 224 formed on the mounting body 22 is inserted into each through-hole 233 for each pin portion formed on the printed circuit board 23 and electrically joined by soldering. However, the mounting body 22 does not necessarily require each pin portion 224. The mounting body 22 and the printed circuit board 23 can also be electrically joined without using each pin portion 224, for example, as follows. That is, as illustrated in Figure 8, recessed side-throughs 234 are formed on both side edges of the printed circuit board 23, and each side edge portion 225 of the busbar arrangement portion 223 of the mounting body 22 is fitted into each side-through 234 to form a fitting portion 226, and the mounting body 22 and the printed circuit board 23 can be electrically joined by soldering each fitting portion 226. Alternatively, instead of forming side-throughs 234 on both side edges of the printed circuit board 23, recessed side-throughs may be formed on each side edge 225 of the busbar arrangement portion 223 of the mounting body 22 to form each fitting portion 226.

[0060] In Figure 11, the covering material 24 covers at least the chip capacitor 231 and the soldered portion. In the assembly 2 illustrated in Figure 11, as can be understood from Figure 7, the soldered portion is the portion that electrically connects each chip capacitor 231 to the printed circuit board 23, the portion that electrically connects the protrusion 211 of the busbar 21 to the through-hole 232 for the protrusion of the printed circuit board 23, and the portion that electrically connects the pin portion 224 of the mounting body 22 to the through-hole 233 for each pin portion of the printed circuit board 23. The same applies to the soldered portion in the assembly 2 illustrated in Figure 12.

[0061] The covering material 24 is formed by hardening a covering material (not shown) that has been filled into a resin frame 4, which has at least a frame portion 41 formed in the shape of a frame as illustrated in Figures 9 and 12.

[0062] The frame 4 used to form the covering material 24 only needs to have at least a frame portion 41, but from the viewpoint of improving the portability and workability of the frame 4 when the covering material is filled inside the frame 4, it is preferable to form it in a box shape with a bottom portion 411 that closes one of the openings of the frame portion 41, as illustrated in Figures 9 and 12. Although not shown, if the frame 4 is composed of a frame portion 41 without a bottom portion 411, for example, the frame 4 can be placed on a flat plate or the like, and this plate can be used as a substitute for the bottom portion 411, and the covering material can be filled inside the frame 4. When the frame 4 has a bottom portion 411, compared to when there is no bottom portion 411, it is less likely for dirt and other unwanted materials to adhere to the filled covering material, which is an advantage as it is easier to form a covering material 24 with a good surface condition. Furthermore, having a bottom portion 411 also has the advantage that the rigidity of the frame 4 is increased, making it less likely to break when the resin portion 3 is injection molded.

[0063] In this manufacturing method, when the injection molding process is the first process described later, the prepared assembly 2 is in a state where the frame 4 has been removed from the coating material 24, as illustrated in Figure 11. In other words, in the assembly 2 illustrated in Figure 11, the coating material 24 is exposed. In this case, it is preferable that the frame 4 is formed from a material that has release properties to the coating material 24 (hereinafter sometimes referred to as a release material), from the viewpoint of making it easy to remove the frame 4 after the coating material filled in the frame 4 has hardened to form the coating material 24. Suitable release materials include, for example, fluororesins. Specifically, examples of fluororesins include polytetrafluoroethylene (PTFE).

[0064] Furthermore, if the injection molding process is the first process described later, the coating material for forming the coating material 24 is preferably a material that is liquid before curing (including paste or slurry, hereafter omitted) and then hardens. Specifically, from the viewpoint of heat resistance and other factors, the coating material can preferably be a silicone rubber material, a urethane rubber material, and more preferably a silicone rubber material.

[0065] On the other hand, in this manufacturing method, if the injection molding process is the second process described later, the prepared assembly 2 is in a state where the frame 4 remains attached to the covering material 24, as illustrated in Figure 12. In other words, in the assembly 2 illustrated in Figure 12, the covering material 24 is not exposed. In this case, it is preferable that the frame 4 is formed from a material compatible with the resin forming the resin part 3 (hereinafter sometimes referred to as a compatible material) from the viewpoint of improving the bonding between the resin part 3 and the frame 4 and improving the unity between the resin part 3 and the frame 4 when the resin part 3 is injection molded. Examples of compatible materials include PPS resin, PA resin, PBT resin, and PC resin. Particularly preferably, the frame 4 is formed from the same type (including the same) of material as the resin forming the resin part 3, from the viewpoint of high compatibility, excellent bonding between the resin part 3 and the frame 4, and excellent unity between the resin part 3 and the frame 4.

[0066] Furthermore, if the injection molding process is the second process described later, the frame material constituting the frame 4 can be a material that transmits ultraviolet light (ultraviolet-transmitting material). That is, when the injection molding process is the second process, the frame material constituting the frame 4 may have both compatibility and ultraviolet transmittance, or it may have either compatibility or ultraviolet transmittance. Examples of ultraviolet-transmitting materials include silicone resin materials and acrylic resin materials. Note that the ultraviolet-transmitting material may be transparent, and if it is transparent, it becomes possible to confirm that the chip capacitor 231 and the soldered parts are immersed in the covering material inside the frame 4 when preparing the assembly 2.

[0067] When the frame material constituting the frame 4 is an ultraviolet-transmitting material, the coating material for forming the coating material 24 is preferably an ultraviolet-curable material, as this allows for efficient formation of the coating material 24 while the frame 4 remains attached, by curing the coating material with ultraviolet light that has passed through the frame 4 to form the coating material 24.

[0068] Furthermore, if the injection molding process is the second process described later, the thickness X of the frame portion 41 in the frame body 4 (see Figure 9) is preferably 3 mm or less, from the viewpoint of enabling miniaturization of the terminal block 1 manufactured using the assembly 2 in which the frame body 4 remains attached to the covering material 24. In this embodiment, if the injection molding process is the second process described later, the thickness X of the frame portion 41 can be specifically set to 2 mm. Also, from the viewpoint of workability, the thickness X of the frame portion 41 can be 0.1 mm or more. Note that the thickness X of the frame portion 41 is not limited to the above thickness and may be greater than 3 mm. Furthermore, if the injection molding process is the first process described later, the thickness X of the frame portion 41 can be specifically set to about 4 mm.

[0069] (2) Procedure for manufacturing the assembly When assembly 2 is manufactured in the preparation process, the preparation process can consist of a mounting process, an assembly process, an immersion process, and a curing process. Each process will be described in order below.

[0070] -Implementation Process- The mounting process involves soldering the chip capacitor 231 onto the printed circuit board 23, as illustrated in Figure 5.

[0071] This electrically connects the chip capacitor 231 and the printed circuit board 23. For soldering in this case, for example, solder paste (lead-free solder, etc.) can be used, and the solder can be cured in a reflow oven or the like to solder the chip capacitor 231 to the printed circuit board 23.

[0072] -Assembly Process- The assembly process, as illustrated in Figures 6 to 8, involves placing the printed circuit board 23 with the chip capacitor 231 soldered to it onto the surface of the busbar 21 (specifically, the mounting surface 210), electrically joining the busbar 21 and the printed circuit board 23 by soldering, and electrically joining the printed circuit board 23 and the mounting body 22.

[0073] In the cases illustrated in Figures 6 and 7, specifically, the printed circuit board 23, the bus bar 21, and the mounting body 22 are assembled by inserting the protruding portion 211 of the bus bar 21 into the through-hole 232 for the protruding portion of the printed circuit board 23, and inserting the respective pin portions 224 of the mounting body 22 into the through-hole 233 for each pin portion of the printed circuit board 23.

[0074] Then, the through-holes 232 for the protruding portion of the printed circuit board 23 and the protruding portion 211 of the busbar 21, the through-holes 233 for each pin portion of the printed circuit board 23 and each pin portion 224 of the mounting body 22 are soldered together. This electrically connects the busbar 21 and the printed circuit board 23, and electrically connects the printed circuit board 23 and the mounting body 22.

[0075] Furthermore, in the example shown in Figure 8, specifically, the protruding portion 211 of the busbar 21 is inserted into the through-hole 232 for the protruding portion of the printed circuit board 23, and the side edges 225 of the mounting body 22 are fitted into each side through-hole 234 of the printed circuit board 23 to assemble the printed circuit board 23, the busbar 21, and the mounting body 22.

[0076] Then, the through-holes 232 for the protruding portion of the printed circuit board 23, the protruding portion 211 of the busbar 21, the side through-holes 234 of the printed circuit board 23, and the side edges 225 of the busbar arrangement portion 223 of the mounting body 22 are soldered together. This electrically connects the busbar 21 and the printed circuit board 23, and electrically connects the printed circuit board 23 and the mounting body 22.

[0077] For soldering in each of the above cases, for example, rosin-core solder can be used. The uncovered assembly 20 (assembly 2 in the preliminary stage before forming the covering material 24) as illustrated in Figures 7 and 8 can be turned upside down from the state shown in Figures 7 and 8 (the orientation shown in Figure 10, where Figure 10 corresponds to the uncovered assembly 20 in Figure 7), and molten rosin-core solder can be sprayed onto the parts to be joined and soldered (local flow).

[0078] -Soaking process- The immersion process involves immersing at least the portion soldered to the chip capacitor 231 in the covering material filled in the frame 4, as illustrated in Figures 9 and 10.

[0079] In the assembly 2 prepared in the preparation step, the covering material 24 only needs to cover the chip capacitor 231 and the soldered parts. Therefore, in the immersion step, it is sufficient that at least the chip capacitor 231 and the soldered parts are immersed in the covering material filled in the frame 4. However, this does not prevent parts other than the chip capacitor 231 and the soldered parts from being immersed in the covering material.

[0080] Specifically, the above immersion can be performed by filling the frame 4 with liquid coating material, and then immersing the soldered portion of the uncoated assembly 20 (which is inverted from the state shown in Figures 7 and 8, as shown in Figure 10) into the coating material.

[0081] -Curing process- The curing process is a process of curing the coating material to form a coating material 24.

[0082] The curing method for the coating material can be appropriately selected depending on the type of coating material used. For example, if the coating material is heat-curable, the uncoated assembly 20, in which the chip capacitor 231 and the soldered portion are immersed in the coating material within the frame 4, can be placed in a high-temperature furnace to cure the coating material. Alternatively, for example, if the coating material is an ultraviolet-curable material and the frame material is an ultraviolet-transmitting material, the coating material can be cured by irradiating ultraviolet light from above the frame 4.

[0083] In this way, by immersing the chip capacitor 231 and the soldered portion in the covering material filled in the frame 4 and hardening the covering material, it is possible to form a covering material 24 that covers the entire chip capacitor 231 and the soldered portion with a uniform thickness without the covering material flowing before hardening.

[0084] In the preparation process, if the injection molding process is the first step after the curing process, the frame 4 is removed from the covering material 24 (the frame 4 is demolded from the covering material 24). This allows for the production of an assembly 2 as illustrated in Figure 11. On the other hand, in the preparation process, if the injection molding process is the second step after the curing process, the frame 4 remains attached to the covering material 24 (the frame 4 is left covering the covering material 24). This allows for the production of an assembly 2 as illustrated in Figure 12.

[0085] In this embodiment, when manufacturing assembly 2, the preparation step includes a mounting step, meaning that the chip capacitor 231 is soldered to the printed circuit board 23 during the preparation step. However, it is also possible to procure a printed circuit board 23 with the chip capacitor 231 pre-soldered. In this case, the mounting step in the preparation step can be omitted.

[0086] <Injection molding process> In this manufacturing method, the injection molding process is the process of setting the assembly 2 in an injection mold (not shown) and performing injection molding. If, in the preparation process, the assembly 2 is prepared in a state where the frame 4 has been removed from the covering material 24, as illustrated in Figure 11, then the injection molding process is considered the first process. On the other hand, if, in the preparation process, the assembly 2 is prepared in a state where the frame 4 is still attached to the covering material 24, as illustrated in Figure 12, then the injection molding process is considered the second process. The first and second processes will be described below.

[0087] -First step- In the first step, the injection molding process, the assembly 2, with the frame 4 removed from the covering material 24 as illustrated in Figure 11, is set in the injection molding die. Then, the resin part 3 is formed by injection molding so as to cover at least a portion of the bus bar 21, the mounting body 22, and the covering material 24, and the resin part 3 and the assembly 2 are integrated. After that, the terminal block 1 can be obtained by demolding.

[0088] In the first step, the injection molding process, the resin part 3 may be formed such that the entire covering material 24 is embedded within the resin part 3, as illustrated in Figures 1 and 2, or, although not shown, the resin part 3 may be formed such that a part of the covering material 24 is exposed. For example, the resin part 3 may be formed such that at least a part of the upper surface 241 of the covering material 24 is exposed to the outside, and the rest of the covering material 24 is embedded within the resin part 3. In the former case, the appearance can be improved by covering the covering material 24 with the resin part 3. In the latter case, the amount of material used to form the resin part 3 can be reduced, which can contribute to miniaturization of the terminal block 1 and reduction of material costs.

[0089] -Second step- In the second step, the injection molding process, the assembly 2, with the frame 4 still attached to the covering material 24 as illustrated in Figure 12, is set in the injection molding die. Then, by injection molding to cover at least a portion of the busbar 21, the mounting body 22, and the frame 4, a resin part 3 is formed, and the resin part 3 and the assembly 2 are integrated. After that, the terminal block 1 can be obtained by demolding.

[0090] In the second step, the injection molding process, the resin part 3 may be formed such that the entire frame 4 is embedded within the resin part 3, as illustrated in Figures 1 and 2. For example, the resin part 3 may be formed such that at least a portion of the outer surface 411a of the bottom 411 of the frame 4 is exposed to the outside, and the rest of the frame 4 is embedded within the resin part 3. In the former case, the appearance can be improved by covering the frame 4 with the resin part 3. In the latter case, the amount of material used to form the resin part 3 can be reduced, which can contribute to miniaturization of the terminal block 1 and reduction of material costs. In addition, in the latter case, it is easy to confirm that the frame 4 is embedded during quality inspection of the manufactured terminal block 1, which has the advantage of making it easier to guarantee the quality of the terminal block 1.

[0091] In the manufacturing method described above, regardless of whether the injection molding process is the first or second step, an assembly 2 is used in which the chip capacitor 231 and the soldered portion are covered with a covering material 24. In this assembly 2, the covering material 24 is formed by hardening the covering material filled in the frame 4, so that the covering material does not flow at the edges of the chip capacitor 231, preventing the covering material 24 from becoming thin in certain areas and ensuring the desired covering thickness.

[0092] Therefore, in this manufacturing method, regardless of whether the injection molding process is the first or second step, when the assembly 2 is set in the injection mold and the resin part 3 of the terminal block 1 is molded, the coating material 24 covering the chip capacitor 231 and the soldered parts makes it difficult for flux residue caused by soldering to flow out, thus suppressing corrosion of the injection mold and preventing deterioration of the surface condition of the resin part 3. In addition, the frequency of maintenance work on the injection mold can also be reduced. Therefore, according to this manufacturing method, it is possible to provide a method for manufacturing a terminal block 1 that can suppress corrosion of the injection mold due to flux residue caused by soldering and suppress deterioration of the appearance of the resin part 3.

[0093] Furthermore, according to this manufacturing method, the coating material 24 can prevent the chip capacitor 231 from being damaged by vibration, shock, and injection pressure when the resin part 3 is injection molded.

[0094] Furthermore, according to this manufacturing method, since the chip capacitor 231 is covered by the covering material 24, vibration and stress can be prevented from being directly applied to the chip capacitor 231, resulting in a terminal block 1 with excellent reliability in electrical noise suppression. Specifically, the stress applied to the chip capacitor 231 includes the injection pressure when the resin part 3 is injection molded, the stress when the resin part 3 shrinks after injection molding, and the stress when the bolt 93 is tightened into the mounting hole 221 of the mounting body 22. In addition, according to this manufacturing method, since the chip capacitor is covered by the covering material 24, it is also possible to prevent the chip capacitor 231 from peeling off or shifting position from the printed circuit board 23 when the resin part 3 is injection molded.

[0095] Furthermore, in this manufacturing method, if the injection molding process is the first step, the frame 4 is removed from the covering material 24 of the assembly 2. Therefore, when manufacturing multiple terminal blocks 1, it is not necessary to prepare one frame 4 for each terminal block 1 manufactured, and the same frame 4 can be reused. On the other hand, in this manufacturing method, if the injection molding process is the second step, it is sufficient to prepare the assembly 2 with the frame 4 still attached to the covering material 24 of the assembly 2. Therefore, the step of removing the frame 4 when preparing the assembly 2 can be omitted.

[0096] Furthermore, in this manufacturing method, the resin part 3 is formed by injection molding. Therefore, according to this manufacturing method, the positional relationship between the bus bar 21, the mounting body 22, and the printed circuit board 23 can be stably fixed by the resin part 3, and the resin part 3 can be easily formed into a desired shape that can be attached to the case 9 by passing a bolt 93 through the mounting hole 221.

[0097] The present invention is not limited to the embodiments described above, and various modifications are possible without departing from its spirit. Furthermore, each configuration shown in the embodiments can be combined in any way. Also, each claim described in the initial claims of the application can be combined in any way. [Explanation of Symbols]

[0098] 1 Terminal block 2 assembly 21 Bus Bar 22 Mounting body 23 Printed circuit boards 231 Chip Capacitor 24 Covering material 3 Resin part 4 Frame 41 Frame section 9 cases 91 Wall 911 Through hole

Claims

1. A method for manufacturing a terminal block having an assembly and a resin part that covers a part of the assembly, and which can be attached to a case housing electronic equipment, The process includes a preparation step of preparing the assembly and an injection molding step of setting the assembly in an injection mold and performing injection molding. The aforementioned assembly is A busbar, one end of which is inserted into a through hole formed in the wall of the case, A mounting body formed from a metal material and positioned in a direction intersecting the busbar, A printed circuit board is placed on the surface of the busbar and electrically connected to the busbar by soldering, and is also electrically connected to the mounting body, and one or more chip capacitors are soldered to it, The chip capacitor and the covering material that covers the soldered portion are provided. The aforementioned covering material is A resin frame body having at least a frame-shaped section filled with a hardened coating material, The injection molding process described above is: The first step involves setting the assembly, with the frame removed from the covering material, into an injection mold, and forming the resin part by injection molding so as to cover at least a portion of the busbar, the mounting body, and the covering material, thereby integrating the resin part with the assembly, or The second step involves setting the assembly, with the frame still attached to the covering material, into an injection mold, and forming the resin part by injection molding so as to cover at least a portion of the busbar, the mounting body, and the frame, thereby integrating the resin part with the assembly. A method for manufacturing terminal blocks.

2. The injection molding process is the first step, The aforementioned coating material is a silicone rubber material. A method for manufacturing a terminal block according to claim 1.

3. The injection molding process is the first step, The busbar has a projection on its surface that protrudes from the mounting surface on which the printed circuit board is placed. The printed circuit board has a through-hole for the protrusion into which the protrusion is inserted. The busbar has the protrusions that are inserted into the through-holes for the protrusions soldered to it. The soldered portion is also covered with the aforementioned covering material. A method for manufacturing a terminal block according to claim 1.

4. The injection molding process is the first step, The frame is formed from a material that has release properties from the covering material. A method for manufacturing a terminal block according to claim 1.

5. The injection molding process is the first step, The frame has a box-like shape with a bottom portion that closes one of the openings in the frame. A method for manufacturing a terminal block according to claim 1.

6. The injection molding process is the second step, The frame is formed from a material compatible with the resin forming the resin part. A method for manufacturing a terminal block according to claim 1.

7. The injection molding process is the second step, The thickness of the frame portion is 3 mm or less. A method for manufacturing a terminal block according to claim 1.

8. The injection molding process is the second step, The busbar has a projection on its surface that protrudes from the mounting surface on which the printed circuit board is placed. The printed circuit board has a through-hole for the protrusion into which the protrusion is inserted. The busbar has the protrusions that are inserted into the through-holes for the protrusions soldered to it. The soldered portion is also covered with the aforementioned covering material. A method for manufacturing a terminal block according to claim 1.

9. The injection molding process is the second step, The frame is formed in a box shape with a bottom portion that closes one of the openings in the frame portion. A method for manufacturing a terminal block according to claim 1.

10. The aforementioned coating material is an ultraviolet-curable material. The frame material constituting the aforementioned frame is a material that transmits ultraviolet light. The method for manufacturing a terminal block according to claim 9.

11. The aforementioned preparation process is, A mounting step of soldering the chip capacitor onto the printed circuit board, The assembly process involves placing the printed circuit board on which the chip capacitor is soldered onto the surface of the busbar, electrically joining the busbar and the printed circuit board by soldering, and electrically joining the printed circuit board and the mounting body. An immersion step in which at least the chip capacitor and the soldered portion are immersed in the covering material filled in the frame, The process includes a curing step of curing the coating material to form the coating material, If the injection molding process is the first step, remove the frame from the covering material, or If the injection molding process is the second process, the frame is left attached to the covering material. A method for manufacturing a terminal block according to claim 1.

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