PCB splitting device and cutting tool

Abstract

To provide a substrate splitting device for separating substrates from a collection of substrates, which can accurately cut the connection points between adjacent slits with simple operation, and a cutting tool that can be attached to the substrate splitting device. [Solution] A substrate splitting device for splitting a substrate from an assembled substrate, comprising: an upper member including a cutting blade for cutting a connecting portion existing between adjacent slits of an assembled substrate; a lower member including a fitting groove for fitting the cutting blade; and a moving mechanism capable of relative movement between the upper member and the lower member, wherein the lower member further includes a pair of guide pins for insertion into each of the adjacent slits, and the fitting groove is positioned between the pair of guide pins, and a cutting tool that can be attached to the substrate splitting device.

Description

Technical Field

[0001] The present invention relates to a substrate dividing device and a cutting tool.

Background Art

[0002] There is known a substrate dividing device for cutting a connecting portion existing between adjacent slits of a set substrate having perforations in which a plurality of slits are continuous. In Patent Document 1, a plurality of lower blades fixedly supported on the lower blade mounting table side and a plurality of upper blades fixed on the liftable upper blade mounting table side cut a plurality of connecting portions of a set substrate fixed on all sides with substrate positioning pins by the lifting operation of the upper blade mounting table, and a manual substrate dividing device for dividing a substrate from the set substrate is disclosed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The perforation lines provided on the set substrate are set according to the shape of the substrate to be divided. Therefore, if the shape of the substrate to be divided changes, the position of the connecting portion existing between adjacent slits also changes. Thus, in the manual substrate dividing device disclosed in Patent Document 1, it is necessary to change the arrangement of the upper blade and the lower blade fixed to the mounting table side according to the position of the connecting portion. As a result, the manual substrate dividing device disclosed in Patent Document 1 requires a setup operation of changing the arrangement of the upper blade and the lower blade according to the position of the connecting portion before cutting the connecting portion, and the operation becomes complicated.

[0005] In view of such problems, an object of the present invention is to provide a substrate dividing device for dividing a substrate from a set substrate, which can accurately cut a connecting portion existing between adjacent slits with a simple operation, and a cutting tool detachable from the substrate dividing device. [Means for solving the problem]

[0006] The present invention relates to a substrate splitting device for splitting a substrate from a substrate assembly, comprising: an upper member including a cutting blade for cutting a connecting portion located between adjacent first and second slits of a substrate assembly having a perforation pattern of multiple slits in a series; a lower member including a fitting groove into which the cutting blade fits; and a moving mechanism capable of relatively moving the upper member and the lower member between a first state in which the cutting blade is separated from the fitting groove and a second state in which the cutting blade is fitted into the fitting groove, wherein the lower member further includes a first guide pin for insertion into the first slit and a second guide pin for insertion into the second slit, and the fitting groove is located between the first guide pin and the second guide pin.

[0007] Furthermore, the present invention provides a cutting tool that can be attached to and detached from a substrate splitting device, comprising: an upper member including a cutting blade for cutting a connecting portion located between adjacent first and second slits of a substrate having a perforation pattern of multiple slits; and a lower member including a fitting groove for fitting the cutting blade, wherein the lower member further includes a first guide pin for insertion into the first slit and a second guide pin for insertion into the second slit, and the fitting groove is positioned between the first and second guide pins. [Effects of the Invention]

[0008] According to the present invention, a substrate splitting device is provided for separating substrates from a collection of substrates, which can accurately cut the connecting portions existing between adjacent slits with simple operation. Furthermore, according to the present invention, a cutting tool that can be attached to and detached from the above substrate splitting device is provided. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic perspective view of a substrate splitting apparatus according to an embodiment of the present invention. [Figure 2]Figure 2 is an explanatory diagram illustrating the relationship between a cutting tool according to an embodiment of the present invention and a substrate assembly set on the lower member. [Figure 3] Figure 3 is a schematic plan view of the assembled substrate. [Figure 4] Figure 4 is a schematic cross-sectional view showing the first and second states of a cutting tool in which a collection of substrates is set on the lower member. [Figure 5] Figure 5 is an explanatory diagram illustrating the cutting method of the connection part of a single-hole perforation. [Figure 6] Figure 6 is an explanatory diagram illustrating the cutting method of the connection part of a perforated section without holes. [Figure 7] Figure 7 is a schematic diagram of the lower member. [Figure 8] Figure 8 is a schematic diagram of the lower component to which the assembled circuit board is set. [Figure 9] Figure 9 is an explanatory diagram illustrating the cross-section of Modified Example 1. [Figure 10] Figure 10 is a schematic side view of the lower member of the modified example 2. [Figure 11] Figure 11 is a schematic side view of the lower member of the modified example 3. [Figure 12] Figure 12 is a schematic side view of the lower member of the modified example 4. [Modes for carrying out the invention]

[0010] The present invention will now be described in detail based on preferred embodiments, with appropriate reference to the accompanying drawings. However, the present invention is not limited to these examples, and is intended to include all modifications within the meaning and scope of the claims, as indicated by the claims.

[0011] (1) One embodiment of the present invention is a substrate splitting device for splitting a substrate from a substrate assembly, comprising: an upper member including a cutting blade for cutting a connecting portion located between adjacent first slits and second slits of a substrate assembly having perforations in which a plurality of slits are continuous; a lower member including a fitting groove into which the cutting blade fits; and a moving mechanism capable of relatively moving the upper member and the lower member between a first state in which the cutting blade is separated from the fitting groove and a second state in which the cutting blade is fitted into the fitting groove, wherein the lower member further includes a first guide pin for insertion into the first slit and a second guide pin for insertion into the second slit, and the fitting groove is arranged between the first guide pin and the second guide pin.

[0012] According to the substrate splitting apparatus described in (1) above, with the first guide pin inserted into the first slit and the second guide pin inserted into the second slit, the connecting portion between the first slit and the second slit is cut by the cutting blade. In other words, according to the substrate splitting apparatus, the connecting portion of the assembled substrate can be cut in the cutting area of ​​the cutting blade while being positioned by the first guide pin and the second guide pin. Therefore, according to the substrate splitting apparatus, the connecting portion is cut accurately.

[0013] Also, the substrate dividing device described in (1) above cuts each connection part existing between slits. That is, after the cutting of one connection part is completed, the first guide pin and the second guide pin are respectively inserted into the first slit and the second slit on both sides of the next connection part, so that the next connection part is positioned with respect to the cutting blade and the fitting groove. After the positioning, the upper member and the lower member are relatively moved until the cutting blade is inserted into the fitting groove, whereby the next connection part is cut. Therefore, even if the layout of the collective substrate is changed, the substrate dividing device does not need to change the device configuration according to the position of the connection part existing on the perforation line provided on the new collective substrate like the manual substrate dividing device disclosed in Patent Document 1. Thus, according to the substrate dividing device, the connection part can be cut with a simple operation.

[0014] (2) In the substrate dividing device described in (1) above, the lower member has the fitting groove, the first guide pin, and the second guide pin disposed thereon, and includes a first surface facing the upper member and a second surface lower than the first surface.

[0015] (3) In the substrate dividing device described in (2) above, a stepped portion is provided between the first surface and the second surface.

[0016] (4) In the substrate dividing device described in (2) or (3) above, the second surface includes a tapered surface that slopes downward toward the outside of the lower member.

[0017] According to the substrate dividing device described in any one of (2) to (4) above, the collective substrate can be set on the lower member so that electronic components such as integrated circuits and capacitors installed on the mounting substrate do not contact the second surface. Thereby, when cutting the connection part, it is possible to suppress damage to the electronic component caused by the electronic component contacting the second surface.

[0018] (5) In the substrate splitting apparatus described in any of (1) to (4) above, the shape of the first guide pin and the second guide pin are each oval columnar.

[0019] (6) In the substrate splitting apparatus described in (5) above, the shape of the first guide pin and the second guide pin are both cylindrical.

[0020] According to the substrate splitting device described in (5) or (6) above, there are no edges on the circumferential surfaces of the columnar first guide pin and the second guide pin. Therefore, the assembled substrate can be smoothly moved and rotated while either the first guide pin or the second guide pin is inserted into the first slit or the second slit. This makes it possible to smoothly set the assembled substrate onto the lower member.

[0021] (7) Another embodiment of the present invention is a cutting tool that can be attached to and detached from a substrate splitting device, comprising: an upper member including a cutting blade for cutting a connecting portion located between adjacent first slits and second slits of a substrate assembly having a perforation pattern of a plurality of slits; and a lower member including a fitting groove for fitting the cutting blade, wherein the lower member further includes a first guide pin for insertion into the first slit and a second guide pin for insertion into the second slit, and the fitting groove is located between the first guide pin and the second guide pin.

[0022] According to the substrate splitting device equipped with the cutting tool described in (7) above, the connection portion can be accurately cut with simple operation. Furthermore, depending on the width between the first slit and the second slit, the cutting tool attached to the substrate splitting device can be changed to a cutting tool having a width between guide pin pairs that fits the gap between the slits.

[0023] [Substrate splitting device] Figure 1 is a schematic perspective view of a substrate splitting device 10 according to an embodiment of the present invention. In Figure 1, the double arrows indicate the vertical direction of the substrate splitting device 10. The substrate splitting device 10 comprises a base 11 and a moving mechanism 12 fixed to the base 11. The substrate splitting device 10 shown in Figure 1 is equipped with a cutting tool 20 consisting of an upper member 21 and a lower member 22. The lower member 22 is detachably attached to the base 11. Figure 1 shows the lower member 22 attached to the base 11.

[0024] The moving mechanism 12 includes a shaft 121, a mounting member 122, a holding member 123, a spring 124, and a lever 125. The mounting member 122 is provided on the lower end of the shaft 121. The upper member 21 is detachably attached to the mounting member 122. Figure 1 shows the upper member 21 attached to the mounting member 122. The shaft 121, spring 124, and lever 125 are held by the holding member 123. In the holding member 123, the shaft 121 is biased upward by the spring 124. The lever 125 is configured so that the upper end of the shaft 121 can be pressed downward by manually pulling down the handle 125a. Figure 1 shows the first state of the moving mechanism 12, in which the shaft 121 is biased upward by the spring 124, and the cutting blade 211 of the upper member 21 (described later) is separated from the fitting groove 221 of the lower member 22. The moving mechanism 12 in the first state shown in Figure 1 transitions to a second state in which the cutting blade 211 (described later) is fitted into the fitting groove 221 when the handle 125a is manually pulled down.

[0025] [Cutting tools / collective board] Figure 2 is an explanatory diagram illustrating the relationship between the cutting tool 20 according to an embodiment of the present invention and the aggregate substrate 30 set on the lower member 22. Figure 3 is a schematic plan view of the aggregate substrate 30. Figure 4 is a schematic cross-sectional view showing the first and second states of the cutting tool 20 with the aggregate substrate 30 set on the lower member 22. Figure 4(a) is a schematic cross-sectional view showing the first state, where the cutting blade 211 is separated from the fitting groove 221. Figure 4(b) is a schematic cross-sectional view showing the second state, where the cutting blade 211 is fitted into the fitting groove 221.

[0026] As shown in Figure 2, the upper member 21 has an upper base 210 that is mounted on the mounting member 122, and a cutting blade 211 for cutting the connection portion 35 of the assembly substrate 30. The lower member 22 has a lower base 220 that is mounted on the base 11, a fitting groove 221 into which the cutting blade 211 fits, and a pair of guide pins 222 that are inserted into the slit 33 of the assembly substrate 30. The lower base 220 has a first surface FSU facing the upper member 21, where the fitting groove 221 and the pair of guide pins 222 are located, and a second surface SSU that is lower than the first surface FSU. The stepped portion STD is a vertical surface provided between the first surface FSU and the second surface SSU. The tapered surface TPS is a tapered surface that slopes downward from below the stepped portion STD toward the outside of the lower member 22. The second surface SSU on the lower base 220 is the tapered surface TPS.

[0027] The guide pin pair 222 consists of a first guide pin 222a and a second guide pin 222b. When the assembly substrate 30 is set on the lower member 22, the guide pin pair 222 is inserted into adjacent slits 33 of the assembly substrate 30. Figure 2 shows, by dashed lines, that the first guide pin 222a is inserted into the first slit 33a of the assembly substrate 30, and the second guide pin 222b is inserted into the second slit 33b adjacent to the first slit. Both the first guide pin 222a and the second guide pin 222b shown in Figure 2 are cylindrical. There are no edges on the circumferential surface of the cylindrical guide pin pair 222. Therefore, with one guide pin of the guide pin pair 222 inserted into a slit 33, the assembly substrate 30 can be moved and rotated smoothly. This makes it easy to insert the other guide pin into the adjacent slit 33. As a result, the cutting tool 20 allows for smooth setting of the assembly substrate 30 onto the lower member 22. Figure 2 shows the perforations of the assembly substrate 30, with two connecting parts 35 between the first slit 33a and the second slit 33b, and one hole 34 between the two connecting parts 35.

[0028] As shown in Figure 3, the assembly substrate 30 has two types of perforations, each consisting of multiple consecutive slits 33. One of the two types of perforations is a perforation (hereinafter referred to as the "single-hole perforation") in which two connecting portions 35 are provided between adjacent slits 33 and one hole 34 is provided between the two connecting portions 35. The other type of perforation is a perforation (hereinafter referred to as the "holeless perforation") in which one connecting portion 35 is provided between adjacent slits 33. The assembly substrate 30 also has one mounted substrate 31 on which electronic components 40 such as integrated circuits and capacitors are mounted, and two discard substrates 32 on which electronic components 40 are not mounted. In the assembly substrate 30, the mounted substrate 31 and the discard substrates 32 are separated by perforations and connected by connecting portions 35.

[0029] The dimensions of each component of the perforation can be the same as those applied to perforations on a typical assembled circuit board. In the assembled circuit board 30, the slit width SWI is set to 1 mm or more and 2 mm or less, the slit length SLE is set to 30 mm or more and 50 mm or less, the connection part width CWI is set to 1 mm or more and 2 mm or less, and the hole diameter HDI is set to 1 mm or more and 2 mm or less. Between adjacent slits 33 of a single-hole perforation, there are two connection parts 35 and one hole 34. Therefore, the width SGP1 between slits of a single-hole perforation on the assembled circuit board 30 is 3 mm or more and 6 mm or less. Between adjacent slits 33 of a non-perforated perforation, there is one connection part 35. Therefore, the width SGP2 between slits of a non-perforated perforation on the assembled circuit board 30 is 1 mm or more and 2 mm or less, the same as the connection part width CWI.

[0030] As shown in Figures 2 and 4, the fitting groove 221 is positioned between the first guide pin 222a and the second guide pin 222b. Here, in the lower member 22, the first guide pin 222a, the fitting groove 221, and the second guide pin 222b are aligned in a straight line. Also, in the assembly substrate 30, the first slit 33a, the two connecting parts 35, the hole 34, and the second slit 33b are aligned in a straight line. Therefore, as shown in Figure 4(a), when the assembly substrate 30 is set on the lower member 22 by inserting the first guide pin 222a into the first slit 33a of the assembly substrate 30 and inserting the second guide pin 222b into the second slit 33b, the two connecting parts 35 located between the first slit 33a and the second slit 33b are positioned between the cutting blade 211 and the fitting groove 221. When the handle 125a of the substrate splitting device 10 is manually pulled down, the cutting blade 211 descends toward the fitting groove 221, reaching the second state shown in Figure 4(b). As the cutting blade 211 descends, it cuts the two connecting portions 35 located between the guide pin pair 222 and fits into the fitting groove 221. While the cutting blade 211 descends, the two connecting portions 35 to be cut are positioned between the cutting blade 211 and the fitting groove 221 by the first guide pin 222a and the second guide pin 222b. Therefore, the substrate splitting device 10 equipped with the cutting tool 20 can accurately cut the connecting portions 35 located between adjacent slits 33.

[0031] [Method of cutting the connection part] Figure 5 is an explanatory diagram illustrating the cutting method of the connection portion 35 with a single perforation. Figure 6 is an explanatory diagram illustrating the cutting method of the connection portion 35 with a non-perforated perforation. Figures 5 and 6 show the cutting area CA1 that can be cut by the cutting blade 211 of the upper member 21, with the first guide pin 222a and the second guide pin 222b of the lower member 22 inserted into the first slit and the second slit 33b, respectively, which are adjacent slits 33 of the assembled substrate 30.

[0032] (Cutting method of the connection part of a single-hole perforated stitch) As described above, the fitting groove 221 is positioned between the first guide pin 222a and the second guide pin 222b. The cutting blade 211 cuts the connecting portion 35 located between the cutting blade 211 and the fitting groove 221 as it descends to be fitted into the fitting groove 221. Therefore, as shown in Figure 5, when cutting the connecting portion 35 of a single-hole perforation, the assembly substrate 30 is set on the lower member 22 so that the two connecting portions 35 are located in the cutting region CA1. With the assembly substrate 30 set on the lower member 22, the first guide pin 222a and the second guide pin 222b are inserted into the first slit and the second slit 33b, respectively. Therefore, the guide pin pair 222 is provided on the lower member 22 such that the width GPG1 between the first guide pin 222a and the second guide pin 222b is wider than the width SGP1. More specifically, the lower member 22 of the cutting tool 20 is provided with a first guide pin 222a and a second guide pin 222b such that the width GPG1 is 1 mm or more wider than the width SGP1. This ensures that when the assembled substrate 30 is set on the lower member 22, there is play between the guide pin pair 222 and adjacent slits 33. Therefore, it is easy to insert the guide pin pair 222 into adjacent slits 33.

[0033] Each pair of guide pins 222 is inserted into an adjacent slit 33. Therefore, the width of the first guide pin 222a and the width of the second guide pin 222b are both configured to be narrower than the slit width SWI. Both the first guide pin 222a and the second guide pin 222b are cylindrical with the same diameter and have the same guide pin width GPW. The difference between the guide pin width GPW and the slit width SWI is preferably 0.2 mm or more and 1 mm or less. If the difference between the guide pin width GPW and the slit width SWI is 0.2 mm or more, when the assembly substrate 30 is set on the lower member 22, there is play between the pair of guide pins 222 and the adjacent slit 33. This makes it easy to insert the pair of guide pins 222 into the adjacent slit 33. If the difference between the guide pin width GPW and the slit width SWI is 1 mm or less, the rotational movement of the assembly substrate 30 set on the lower member 22 is restricted. This improves the positioning accuracy of the connection portion 35 to be cut, enabling more precise cutting of the connection portion 35.

[0034] In Figure 5, CAL1 indicates the length of the cutting region CA1. The connection portion 35 located between the guide pin pair 222 is cut in the cutting region CA1. Therefore, the cutting tool 20 is set so that the length CAL1 is shorter than the width GPG1 between the guide pin pair 222 and longer than the width SGP1 between the single-hole perforation slits. In Figure 5, CAW indicates the width of the cutting region CA1. The width CAW is set to be narrower than the slit width SWI. The difference between the width CAW and the slit width SWI is preferably 0.2 mm or more. This creates a gap between the mounted substrate 31 to be divided and the cutting region CA1. Therefore, damage to the mounted substrate 31 during cutting of the connection portion 35 by the substrate dividing device 10 equipped with the cutting tool 20 is suppressed.

[0035] (Cutting method of the connection part of the perforated section without holes) Figure 6 shows the same single-hole perforation as in Figure 5, but with a holeless perforation. Therefore, the explanation of the cutting method for the single-hole perforation, as explained based on Figure 5, will be omitted.

[0036] Unlike single-hole perforations, holeless perforations have only one connection point 35 between adjacent slits 33. Therefore, the width SGP2 between slits in holeless perforations is narrower than the width SGP1 between slits in single-hole perforations. Thus, as shown in Figure 6, when cutting the connection point 35 of holeless perforations, the assembly substrate 30 can be set on the lower member 22 so that one connection point 35 is located in the cutting region CA1. In other words, the cutting tool 20 can be applied to cutting the connection point 35 of both single-hole and holeless perforations. Since the width GPG1 is wider than the width SGP1, naturally, the width GPG1 is wider than the width SGP2. Therefore, even in holeless perforations, play is ensured between adjacent slits 33, making it easy to insert the guide pin pair 222 into adjacent slits 33.

[0037] [Lower part] Figure 7 is a schematic diagram of the lower member 22. Figure 7(a) is a schematic plan view of the lower member 22. Figure 7(b) is a schematic side view of the lower member 22. The double arrows shown in Figure 7 indicate the vertical direction in the schematic side view of the lower member 22 shown in Figure 7(b). Figure 8 is a schematic diagram of the lower member 22 with the assembly board 30 set on it. Figure 8(a) is a schematic plan view of the lower member 22 with the assembly board 30 set on it. Figure 8(b) is a schematic side view of the lower member 22 with the assembly board 30 set on it. The double arrows shown in Figure 8 indicate the vertical direction in the schematic side view of the lower member 22 with the assembly board 30 set on it shown in Figure 8(b).

[0038] As described above, the lower base 220 has a first surface FSU and a second surface SSU that is lower than the first surface FSU. The second surface SSU is formed by a stepped portion STD provided between the first surface FSU and the second surface SSU, and a tapered surface TPS that slopes downward from below the stepped portion STD toward the outside of the lower member 22. As shown in Figure 8(b), in the assembled substrate 30 set on the lower member 22, the electronic components 40 mounted on the mounting substrate 31 do not come into contact with the lower base 220 due to the second surface SSU. Therefore, when the connection portion 35 is cut by the substrate splitting device 10, the external force applied to the electronic components 40 due to contact with the lower base 220 is reduced. As a result, the substrate splitting device 10 suppresses the occurrence of damage to the electronic components 40 due to the cutting of the connection portion 35.

[0039] [Differentiation] As shown in Figure 2, the first guide pin 222a and the second guide pin 222b are both cylindrical, but the shape of the guide pin pair of the present invention is not limited to this. Each guide pin pair of the present invention may be a projection that can be inserted into the slit of the assembly substrate. From the viewpoint of facilitating the setting onto the lower member of the assembly substrate, the guide pin pair is preferably oval-shaped, such as a cylindrical, elliptical, or rounded rectangular shape. An oval shape refers to a column with an oval cross-section. An oval shape is a shape that has the characteristics of being a differentiable (smooth) curve, a closed, non-intersecting curve on a plane, and having at least one symmetrical part, and includes circular, elliptical, rounded rectangular, and egg shapes. There are no edges on the circumferential surface of an oval shape. Therefore, if the guide pin pair is oval-shaped, it can be set onto the lower member of the assembly substrate smoothly.

[0040] Figures 5 and 6 illustrate the cutting method of the connection portion 35 in a composite substrate 30 having single-hole perforations and perforations without holes, using the cutting tool 20. However, the substrate splitting apparatus and cutting tool of the present invention are not limited to application to cutting connection portions of single-hole perforations and perforations without holes. The substrate splitting apparatus and cutting tool of the present invention can be applied to cutting connection portions of various perforations by changing the width between guide pin pairs and the cutting area according to the width between adjacent slits in a composite substrate having perforations with multiple consecutive slits.

[0041] As shown in Figures 7 and 8, the second surface SSU of the lower base 220 of the lower member 22 is formed by a stepped portion STD and a tapered surface TPS. In addition, the lower base 220 has one second surface SSU on one side of the first surface FSU. However, in the substrate splitting apparatus and cutting tool of the present invention, the second surface SSU of the lower member only needs to be a surface that is lower than the first surface FSU so that when the assembled substrate is set on the lower member, the electronic components do not come into contact with the lower base, and is not limited to the above-described form of the second surface SSU on the lower base 220.

[0042] (Variation 1) Figure 9 is an explanatory diagram illustrating the cutting method of Modified Example 1. The assembled substrate 300 shown in Modified Example 1 has perforations (hereinafter referred to as "two-hole perforations") between adjacent slits 33, with three connecting portions 35 and two holes 34 provided. The cutting tool for cutting the three connecting portions 35 in the two-hole perforations comprises an upper member including a cutting blade capable of cutting the cutting area CA2, and a lower member including a fitting groove for fitting the cutting blade, a first guide pin 2220a for insertion into the first slit 33a, and a second guide pin 2220b for insertion into the second slit 33b. Note that the same details as those described for the cutting method of the one-hole perforation based on Figure 5 will be omitted from this explanation.

[0043] As shown in Figures 5 and 9, the width SGP3 between the slits of a two-hole perforation is wider than the width SGP1 between the slits of a single-hole perforation by the amount of one connecting portion 35 and one hole 34. More specifically, the width SGP3 is between 5 mm and 10 mm. Therefore, the width GPG2 between the guide pin pair 2220 is set wider than the width SGP3. By setting the width GPG2 to be 1 mm or more wider than the width SGP3, it is possible to easily insert the guide pin pair 2220 into adjacent slits 33. In addition, the length CAL2 of the cutting area CA2 is set to be shorter than the width GPG2 between the guide pin pair 2220 and longer than the width SGP3 between the slits of a two-hole perforation.

[0044] The guide pin pair 2220 consists of a first guide pin 2220a which is a rounded rectangular column and a second guide pin 2220b which is an elliptical column. Although the shapes of the first guide pin 2220a and the second guide pin 2220b are different, they are both oval columnar. Therefore, they can be smoothly set onto the lower member of the assembly substrate 300.

[0045] (Modification 2) Figure 10 is a schematic side view of the lower member 23 of the modified example 2. In the lower base 230 of the lower member 23, the second surface SSU is a horizontal plane HOS that extends horizontally from the lower side of the stepped portion STD. In the lower member 23, due to the presence of the second surface SSU, when the assembly board 30 is set on the lower member 23, the electronic components 40 mounted on the mounting board 31 of the assembly board 30 do not come into contact with the lower base 230. Therefore, in the lower member 23, as in the lower member 22, the occurrence of damage to the electronic components 40 due to the cutting of the connection portion 35 is suppressed. Note that the same contents as those explained for the lower member 22 based on Figures 7 and 8 will be omitted from the explanation.

[0046] (Variation 3) Figure 11 is a schematic side view of the lower member 24 of the modified example 3. The second surface SSU on the lower base 240 of the lower member 24 is formed as a tapered surface TPS that slopes downward toward the outside of the lower member 24 from the connection position between the first surface FSU and the second surface SSU. In the lower member 24 as well, due to the presence of the second surface SSU, when the assembly substrate 30 is set on the lower member 24, the electronic components 40 mounted on the mounting substrate 31 of the assembly substrate 30 do not come into contact with the lower base 240. Therefore, in the lower member 24 as well as the lower member 22, the occurrence of damage to the electronic components 40 due to the cutting of the connection portion 35 is suppressed.

[0047] (Modification 4) Figure 12 is a schematic side view of the lower member 25 of the modified example 4. The lower base 250 of the lower member 25 has a second surface SSU formed by a stepped portion STD and a tapered surface TPS, which is provided on both sides of the first surface FSU. Therefore, like the lower member 22, the lower member 25 also suppresses the occurrence of damage to the electronic components 40 due to the cutting of the connection portion 35. Furthermore, even if the assembled circuit board set on the lower member 25 is, for example, an assembled circuit board composed of mounting boards 31 on which all electronic components 40 are mounted, the lower member 25 can prevent contact between the lower base 250 and not only the mounting board 31 to be separated, but also the electronic components 40 mounted on adjacent mounting boards 31. Thus, the lower member 25 further suppresses the occurrence of damage to the electronic components 40 due to the cutting of the connection portion 35.

[0048] [Note 1] In the substrate splitting apparatus 10 according to the embodiment of the present invention described above, the state transition of the moving mechanism 12 between the first and second states is performed by manual operation of the handle 125a of the lever 125. However, the substrate splitting apparatus of the present invention is not limited to this. For example, a substrate splitting apparatus can be provided that performs the state transition of the moving mechanism between the first and second states electrically.

[0049] [Note 2] In the substrate splitting apparatus 10 according to the embodiment of the present invention described above, the cutting blade 211 of the upper member 21 is lowered toward the fitting groove 221 of the lower member 22. However, the substrate splitting apparatus of the present invention is not limited to this, as it may be equipped with a moving mechanism that can move the upper member and the lower member relative to each other between a first state and a second state. For example, the substrate splitting apparatus can also be configured to raise the fitting groove 221 of the lower member 22 toward the cutting blade 211 of the upper member 21. [Explanation of Symbols]

[0050] 10. Substrate splitting device 11 Pedestal 12 Moving mechanism section 121 Shaft 122 Mounting component 123 Retaining member 124 Springs 125 Lever 125a Handle 20 cutting tools 21 Upper member 210 Upper base 211 Cutting blade 22, 23, 24, 25 Lower part 220, 230, 240, 250 lower base 221 Fitting groove 222, 2220 Guide pin pair 222a, 2220a First guide pin 222b, 2220b Second guide pin 30, 300 Assembly Board 31 Implemented circuit board 32 Disposable circuit boards 33 slits 33a First Slit 33b Second Slit 34 holes 35 Connection part 40 Electronic Components SWI slit width SLE Slit Length CWI connection width HDI hole diameter SGP1 Single-hole perforation width between slits SGP2 Holeless perforation width between slits Width between slits in SGP3 2-hole perforation stitching CA1, CA2 cutting area GPG1, GPG2 Guide pin pair width CAL1, CAL2 Length of the cutting area GPW Guide pin width CAW cutting area width FSU front page SSU Page 2 TPS tapered surface STD multi-layered section HOS horizontal plane

Claims

1. An upper member including a cutting blade for cutting the connecting portion between adjacent first and second slits of a composite substrate having perforations in which multiple slits are arranged in a series, A lower member including a fitting groove for fitting the cutting blade, A moving mechanism that allows the upper member and the lower member to move relative to each other between a first state in which the cutting blade is separated from the fitting groove and a second state in which the cutting blade is fitted into the fitting groove, Equipped with, The lower member further includes a first guide pin for insertion into the first slit and a second guide pin for insertion into the second slit. The fitting groove is positioned between the first guide pin and the second guide pin. A substrate splitting device for separating substrates from the aforementioned aggregate substrate.

2. The aforementioned lower member is, The fitting groove, the first guide pin, and the second guide pin are arranged on the first surface facing the upper member, A second surface that is lower than the first surface, A substrate splitting apparatus according to claim 1, including the following:

3. A step is provided between the first surface and the second surface. The substrate splitting apparatus according to claim 2.

4. The second surface includes a tapered surface that slopes downward toward the outside of the lower member. The substrate splitting apparatus according to claim 2.

5. The substrate splitting apparatus according to any one of claims 1 to 4, wherein the shape of the first guide pin and the second guide pin are each oval columnar.

6. The substrate splitting apparatus according to claim 5, wherein the first guide pin and the second guide pin are each cylindrical in shape.

7. An upper member including a cutting blade for cutting the connecting portion between adjacent first and second slits of a composite substrate having perforations in which multiple slits are arranged in a series, A lower member including a fitting groove for fitting the cutting blade, Equipped with, The lower member further includes a first guide pin for insertion into the first slit and a second guide pin for insertion into the second slit. The fitting groove is positioned between the first guide pin and the second guide pin. A cutting tool that can be attached to and detached from a circuit board splitting device.

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