Chip manufacturing method and splitting apparatus
The described method addresses the issue of incomplete cutting and burr formation in dicing wafers by using a clamping and pressing mechanism to stabilize the cutting process, resulting in high-quality chip production.
JP2026111496APending Publication Date: 2026-07-03DISCO CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- DISCO CORP
- Filing Date
- 2025-10-09
- Publication Date
- 2026-07-03
AI Technical Summary
Technical Problem
Existing methods for dicing wafers with metal layers result in incomplete cutting or burr formation, compromising the quality of the dicing process.
Method used
A method involving a clamping mechanism that presses the wafer from both sides along the division line, using a pair of clamping bars and pressing bars to stabilize the cutting process, followed by expansion and inversion steps to ensure complete separation without impairing the quality.
Benefits of technology
The method effectively divides ductile material layers without generating burrs, ensuring high-quality chip production.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026111496000001_ABST
Abstract
The ability to divide the ductile material layer without compromising its quality. [Solution] The chip manufacturing method comprises: a first division step 302, in which one side of a wafer unit including a wafer and a sheet fixed to the wafer is divided by a first division line, which is the division line to be divided on the wafer, is clamped along the first division line with a clamping member, while the side of the wafer unit opposite to the side clamped by the clamping member, which is sandwiched between the first division line, is pressed from the side of the substrate layer along the first division line; and a second division step 304, after performing the first division step 302, in which one side of the wafer unit is clamped along the first division line with a clamping member, while the side of the wafer unit opposite to the side clamped by the clamping member, which is sandwiched between the first division line, is pressed from the side of the ductile material layer along the first division line.
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