Sintered-ready multilayer wire / ribbon bond pads

Abstract

This solves at least some of the problems related to the prior art. [Solution] A method for manufacturing bond pads for connecting a die to a copper ribbon or copper wire on a printed circuit board, comprising: providing a sheet of copper foil having a first main surface opposite to a second main surface; providing a sinterable film of metal particles; forming a laminated sheet by laminating the sinterable film onto the first main surface; and punching out bond pads from the laminated sheet.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a bond pad for connecting a die to a copper ribbon or a copper wire, a bond pad, a sinterable silver film, a method for connecting a die to a copper wire and / or a copper ribbon, a method for manufacturing an electronic device, an electronic device, and an assembly method.

Background Art

[0002] In conventional power modules, for example, bond wires connecting a semiconductor / die to a substrate are typically formed from aluminum. As the power density requirements of power modules increase, manufacturers have begun to use copper bond wires that provide additional current-carrying capacity and better heat conduction and dissipation. The conditions for welding copper wires to a semiconductor / die tend to be more stringent than those for aluminum wires, which can cause damage to the underlying semiconductor / die. As a result, it is common to attach a thin film of copper, known as a "bond pad," to the upper surface of the die. The bond pad provides a uniform current distribution (e.g., in a short-circuit state) and better heat dissipation, and can avoid substantial damage to the underlying die when the die is welded to a copper wire.

[0003] The technology described in U.S. Patent No. 10079219B2 includes a sintered flexible contact film (bond pad) applied to the upper surface of a die or other substrate in areas of varying thicknesses. The sintered material is applied in paste form, dried in a wavy pattern, and sintered into a metal molded body. Furthermore, wires or ribbons are ultrasonically welded to the flexible contact film. Implementing such technology in the mass production of semiconductor devices presents significant challenges. For example, the application of the sintered layer is typically done by stencil, screen, or other types of printing. Printing small areas, such as the upper surface of a die, is difficult and an uncontrolled process. Misprints or paste bleed-outs occur frequently and can damage the device by short-circuiting electrical terminals or generating other defects. Furthermore, the upper surface of a die is usually patterned with the help of a dielectric barrier layer, which protrudes only 10-15 microns above the surface, further complicating the printing process. Generating reproducible paste deposits of various thicknesses on a small die of approximately 5 x 5 mm is impossible in a high-volume manufacturing (HVM) environment.

[0004] Instead of applying the sintered paste to the top surface of the die, it is possible to provide the sintered paste to the base of the bond pad. This can be achieved by printing the sintered paste onto the base, or by applying the paste to copper foil and then cutting the copper foil into individual bond pads. The former is susceptible to the problems mentioned above, while the latter may require the use of precise cutting, for example, by laser. This can complicate the manufacturing process. Furthermore, the final bond pads may not be robust enough to be handled using conventional tape-and-reel technology, and the use of dicing tape may be required instead. [Overview of the Initiative]

[0005] The present invention aims to solve at least some of the problems related to the prior art, or to provide a commercially acceptable alternative.

[0006] In a first aspect, the present invention provides a method for manufacturing a bond pad for connecting a die to a copper ribbon or copper wire, the method being: To provide a copper foil sheet having a first main surface on the opposite side of a second main surface, To provide a sinterable film of metal particles, A laminated sheet is formed by laminating a sinterable film onto the first main surface, This includes punching out bond pads from laminated sheets.

[0007] Each aspect or embodiment defined herein may be combined with any other aspect or embodiment unless otherwise expressly indicated. In particular, any feature shown to be preferred or advantageous may be combined with any other feature shown to be preferred or advantageous.

[0008] This method may result in a bond pad with a high-quality bond line between the copper foil and the sinterable film. Advantageously, the method of this invention can be simpler compared to conventional methods. In particular, this method may not require the use of precise printing and / or cutting techniques.

[0009] Compared to conventional bond pads, bond pads manufactured using this method may be more robust. As a result, they can be handled more easily without damage, thereby requiring less consideration during their use in methods for manufacturing electronic devices such as power modules or printed circuit boards.

[0010] A bond pad is used to connect a die to a copper ribbon or copper wire. This may be in a power module or a printed circuit board. In other words, a bond pad may be used to connect a die to a copper ribbon or copper wire in a power module, and / or to connect a die to a copper ribbon or copper wire in a printed circuit board. That is, the copper ribbon or copper wire may be an interconnect, i.e., a copper ribbon interconnect or a copper wire interconnect.

[0011] Bond pads may be suitable for storage in waffle packs or tapes, which are typically used in pick-and-place equipment. Therefore, bond pads may be particularly suitable for use in high-speed production lines.

[0012] This method includes providing a sheet of copper foil having a first main surface opposite a second main surface. "First main surface" and "second main surface" mean the two sides of the sheet, i.e., the two surfaces having the largest area.

[0013] This method includes providing a sinterable film of metal particles. “Sinterable” means that the film can undergo sintering upon application of heat and / or pressure to form a metallic joint between two surfaces. The sinterable film is self-supporting. In other words, the sinterable film can substantially retain its integrity when handled. This allows the film to be distinguished from a dry layer of sintering paste applied to a surface, otherwise it would be fragile when handled or moved from one surface to another. The sinterable film contains metal particles. The sinterable film may contain species other than metal particles. The metal particles may be in the form of one or more spheres, rods, and plates. The metal particles may include nanoparticles, i.e., they may have an average longest dimension of 1 to 1000 microns, as measured using TEM or laser diffraction. Examples of suitable sinterable films and methods for manufacturing them are described in U.S. Patent No. 10535628B2 and U.S. Patent No. 10710336B2, the disclosures of which are incorporated herein by reference. A suitable commercially available example of a sinterable film is MacDermid Alpha's sinter-ready film.

[0014] This method involves forming a laminated sheet by laminating a sinterable film onto a first main surface. Thus, the laminated sheet includes a sheet of sinterable film and copper foil. The sinterable film is laminated onto the first main surface. The sinterable film is not laminated onto a second main surface; in fact, the second main surface is typically left uncoated. This allows the copper foil to be welded to a copper ribbon or copper wire.

[0015] This method involves punching out bond pads from laminated sheets. Punching techniques and equipment are known in the art. A suitable commercial example of a punching press is the Lingshen punching press. Suitable punching presses are also supplied by Kaka Industry, Samhoor, and others. Punching is sometimes referred to as "stamping" in the art.

[0016] The copper foil preferably contains copper or a copper alloy and / or has a multilayer structure. This can result in a particularly effective bonding pad.

[0017] The copper foil preferably has a thickness of 10 to 200 μm, more preferably 50 to 150 μm. Thicker foils may increase the cost of the method and / or excessively increase the thickness of the bond pad, thereby excessively increasing the size of the printed circuit board or power module formed using the bond pad. Thinner foils may damage the underlying die when the copper ribbon or wire is welded to the copper foil. However, the copper foil preferably has a thickness of less than 50 μm, and may have a thickness of, for example, 10 μm to less than 50 μm.

[0018] The copper foil preferably has a hardness of 50 to 100 HV when a load of 300g is applied. A higher hardness value may make it more difficult to weld copper ribbons or copper wires to the copper foil. A lower hardness value may damage the underlying die when the copper ribbons or wires are welded to the copper foil.

[0019] The copper foil is preferably heated to 10-20 K -1 It has a coefficient of thermal expansion (CTE). This allows for the avoidance of undesirable levels of thermal stress during sintering and / or welding.

[0020] The copper foil does not have to be perforated. Alternatively, the copper foil is preferably perforated. During use, this can provide stress relief to the device including the bond pad. In this regard, the copper foil may contain a plurality of perforations and / or be porous and / or mesh-like.

[0021] The metal particles preferably include one or more of the following: silver particles, copper particles, silver-coated copper particles, copper-coated silver particles, gold particles, palladium particles, aluminum particles, silver-palladium alloy particles, and gold-palladium alloy particles, and more preferably include silver particles. The metal particles preferably have a maximum dimension of 1 to 1000 nm.

[0022] The sinterable film preferably comprises silver particles having a maximum dimension of 1 to 1000 nm and a polymer binder. The silver particles can exhibit particularly favorable sintering properties and can result in sintered joints with particularly favorable electrical and thermal conductivity. Smaller particles may be more difficult to handle. Larger particles may require undesirable high sintering temperatures and / or pressures, which can reduce the energy efficiency of the method and / or cause damage to the die or substrate. If the silver particles are in the form of spheres, the maximum dimension is the diameter of the spheres. The maximum dimension can be measured using TEM or laser diffraction. The use of a binder can ensure that the film is "self-supporting".

[0023] The sinterable film preferably contains 0.1 to 2% by weight of a polymer binder, and more preferably 0.5 to 1% by weight of a polymer binder, based on the total weight of the sinterable silver film.

[0024] The polymer binder preferably contains an amide polymer, and more preferably poly(N-vinylacetamide). Such species are particularly effective binders.

[0025] The silver particles (or metal particles) preferably have a longest dimension of 5 to 500 nm, preferably 10 to 100 nm, more preferably 30 to 60 nm. This can bring about particularly preferable sintering characteristics and handling characteristics. The longest dimension can be measured using TEM or laser diffraction.

[0026] Preferably, the silver particles (or metal particles) in the sinterable film form fine particles having a D90 of 1000 nm or less, preferably 500 nm or less, more preferably 100 nm or less, even more preferably 60 nm or less, and / or a D10 of 1 nm or more, more preferably 5 nm or more, even more preferably 10 nm or more, still even more preferably 30 nm or more. Such a particle size distribution can bring about particularly preferable sintering characteristics and handling characteristics.

[0027] The sinterable film preferably contains 90 to 99% by weight of silver particles (or metal particles), more preferably 92 to 98% by weight of silver particles (or metal particles), even more preferably 94 to 96% by weight of silver particles (or metal particles), based on the total weight of the sinterable film. Higher levels of particles can result in a sinterable film exhibiting unfavorable mechanical / handling characteristics. Lower levels of particles can allow for the presence of high levels of species other than silver (e.g., binder or its residues) in the final sintered joint, thereby potentially adversely affecting its mechanical and / or electrical and / or thermal properties.

[0028] The sinterable film preferably contains a halogenated alcohol activator having a melting point of 80 to 150 °C. Such a sinterable film can be particularly effective when bonding bond pads to a die in an electronic device manufacturing method. Surprisingly, the inventors have found that a sinterable silver film can be "thermally tacked" to the die during the method of connecting the die to a copper wire or copper ribbon. This can avoid the possibility of employing an adhesive. Residues of the adhesive can be present in the final sintered joint and reduce the integrity of the final sintered joint.

[0029] As used herein, the term “hot tacking” may encompass the process of attaching a sinterable film to a surface by applying heat and typically pressure. Such attachment occurs without substantial sintering of the metal particles in the sintered film. Thus, the sinterable film can remain in the desired position during the attachment method while retaining its ability to form a joint between the bond pad and the die surface. Although not bound by theory, hot tacking is considered to be achieved by limited metal diffusion between the sinterable film and the surface to which the film is “tacking,” such as the top surface of the die.

[0030] The presence of a halogenated alcohol activator can remove oxides from the surface to which the sinterable film is tacked, such as the upper surface of the die. This can ensure that tacking can occur at a temperature low enough to adhere the sinterable film to the surface, but low enough to avoid substantial sintering of the metal particles contained within the sinterable film. While not bound by theory, this is thought to be due to an increased level of metal diffusion that is possible as a result of the removal of surface oxides.

[0031] Furthermore, the presence of a halogenated alcohol activator may make it easier to laminate the first main surface with a sinterable film, meaning that such lamination can be carried out under milder conditions. Moreover, the use of a metal plating layer (such as a silver plating layer) on the first main surface, which would otherwise facilitate metal diffusion during lamination, may not be necessary.

[0032] The sinterable film preferably contains 0.05 to 1% by weight of a halogenated alcohol activator, and more preferably 0.1 to 0.2% by weight of a halogenated alcohol activator, based on the total weight of the sinterable film.

[0033] The halogenated alcohol activator preferably has a melting point of 85-140°C, more preferably 90-130°C, and even more preferably 100-120°C. This allows the activator to be "activated" at typical lamination and / or hot tacking temperatures. At lower temperatures, the activator is solid, which means that there is no change in the mechanical properties of the sinterable film that would affect its handling ability as a result of the activator melting.

[0034] The halogenated alcohol activator has a molecular weight of at least 150, preferably at least 200, and / or 500 or less, preferably 400 or less, more preferably 300 or less, and / or 150 to 500, preferably 200 to 300.

[0035] The halogenated alcohol preferably contains a brominated alcohol, more preferably, It contains a dibrominated alcohol. The halogenated alcohol preferably contains 3 to 5 carbon atoms. The halogenated alcohol preferably contains a monohydroxy alcohol. The halogenated alcohol may be linear or branched. The halogenated alcohol preferably contains 3,4-dibromo-2-butanol and / or 1,4-dibromobutan-2-ol. Such alcohols may be particularly effective in removing surface oxides.

[0036] The sinterable film preferably further comprises partially hydrogenated gum rosin in an amount of 0.1 to 0.3% by weight based on the total weight of the sinterable silver film, and / or finely powdered wax in an amount of 0.2 to 0.4% by weight based on the total weight of the sinterable silver film.

[0037] Laminating the first main surface with a sinterable film preferably involves bringing the sinterable film into contact with the first surface and applying heat and pressure to the copper foil and the sinterable film sheets.

[0038] The first surface preferably includes a metal plating layer, and contacting the sinterable film with the first surface preferably includes contacting the metal plating layer with a sinterable silver film. This allows lamination to be carried out at lower temperatures and / or pressures. This may be because, although not theoretically bound, metal diffusion between the metal particles and the metal plating layer may be more pronounced than between the metal particles and the copper foil.

[0039] The metal plating layer preferably contains silver, nickel-gold alloy and / or ENIG, and more preferably silver. If the sinterable film contains silver particles, the metal plating layer preferably contains silver. The diffusion of silver into the silver plating layer may be more pronounced than the diffusion into the copper foil.

[0040] The metal plating layer preferably has a thickness of 1 to 5 μm. Thinner thicknesses may not adequately promote metal diffusion. Thicker thicknesses may excessively increase the size of the device formed using the bond pad.

[0041] Applying heat and pressure to the copper foil and sinterable film sheets preferably includes applying a pressure of at least 0.5 MPa, preferably at least 0.8 MPa, more preferably 0.5 to 2 MPa, even more preferably 0.8 to 1.2 MPa, and still more preferably about 1 MPa, and / or heating the copper foil and / or sinterable film sheets to a temperature of 100 to 200°C, preferably 120 to 170°C, more preferably 140 to 160°C, and still more preferably about 150°C for preferably 1 to 60 seconds, more preferably 2 to 40 seconds, even more preferably 5 to 15 seconds, and still more preferably about 10 seconds. This can result in an appropriate level of adhesion between the copper foil sheets and the sinterable film without causing substantial sintering of the sinterable film.

[0042] Preferably, the method further includes applying an adhesive to a sinterable film on a laminated sheet, and punching is performed such that the adhesive is present on the sinterable film on the bond pad. This may allow for "cold tacking" of the bond pad to the die, i.e., tacking at temperatures below 100°C or below 90°C. This may be beneficial when the die is mounted on a substrate that may be damaged and / or oxidized at higher temperatures. The adhesive may be applied in any shape, but typically it is applied to multiple distinct areas. In other words, multiple distinct tack deposits may be applied. Following punching, each bond pad may contain, for example, 1 to 4 distinct tack deposits. The tack may be applied using a hot melt spray using commercially available equipment such as a Nordson Unity PJ30XT. The adhesive is preferably applied before punching because it is easier to apply to a continuous strip, but the adhesive may also be applied after punching.

[0043] The adhesive preferably comprises a diphenyl compound having a melting point of 50 to 90°C, and / or a triphenyl compound having a melting point of 50 to 90°C, and / or a fatty alcohol having a melting point of 30 to 60°C. In preferred embodiments, the adhesive comprises a polyvinyl ether. Such species exhibit a high level of "tackiness" at typical cold tacking temperatures but a limited level of tackiness at lower temperatures, thereby making them easier to handle. Such species may be substantially evaporated at typical sintering temperatures, meaning that such species are substantially absent from the final sintered joint.

[0044] In a further embodiment, the present invention provides a bond pad manufactured according to the method described herein.

[0045] The advantages and preferred features of the first embodiment apply equally to this embodiment.

[0046] In a further embodiment, the present invention is Silver particles having a maximum dimension of 1 to 1000 nm, Polymer binder and The present invention provides a sinterable silver film containing a halogenated alcohol activator having a melting point of 80 to 150°C.

[0047] The advantages and preferred features of the first embodiment are equally applicable to this embodiment. Sinterable films may be particularly suitable for attaching bond pads to a die.

[0048] The silver particles preferably have a maximum dimension of 5 to 500 nm, preferably 10 to 100 nm, and more preferably 30 to 60 nm.

[0049] The silver particles in the sinterable silver film preferably form fine particles having a D90 of 1000 nm or less, preferably 500 nm or less, more preferably 100 nm or less, and even more preferably 60 nm or less, and / or a D10 of 1 nm or more, preferably 5 nm or more, more preferably 10 nm or more, and even more preferably 30 nm or more.

[0050] The sinterable silver film preferably contains 90-99% by weight of silver metal particles, more preferably 92-98% by weight of silver metal particles, and even more preferably 94-96% by weight of silver metal particles, based on the total weight of the sinterable film.

[0051] The sinterable silver film preferably contains 0.1 to 2% by weight of a polymer binder, more preferably 0.5 to 1% by weight, based on the total weight of the sinterable silver film.

[0052] The polymer binder preferably contains an amide polymer, and more preferably contains poly(N-vinylacetamide).

[0053] The sinterable silver film contains, based on the total weight of the sinterable silver film, preferably 0.05 to 1% by weight of a halogenated alcohol activator, and more preferably 0.1 to 0.2% by weight of a halogenated alcohol activator.

[0054] The halogenated alcohol activator preferably has a melting point of 85 to 140°C, more preferably 90 to 130°C, and even more preferably 100 to 120°C.

[0055] The halogenated alcohol activator preferably has a molecular weight of at least 150, preferably at least 200 and / or 500 or less, preferably 400 or less, more preferably 300 or less, and / or 150 to 500, preferably 200 to 300.

[0056] The halogenated alcohol preferably includes a brominated alcohol, more preferably a dibrominated alcohol. The halogenated alcohol preferably contains 3 to 5 carbon atoms. The halogenated alcohol preferably includes a monohydroxy alcohol. The halogenated alcohol preferably includes 3,4-dibromo-2-butanol and / or 1,4-dibromobutan-2-ol.

[0057] The sinterable silver film contains partially hydrogenated gum rosin in an amount preferably 0.1 to 0.3% by weight based on the total weight of the sinterable silver film, and / or powdered wax in an amount preferably 0.2 to 0.4% by weight based on the total weight of the sinterable silver film.

[0058] In a further embodiment, the present invention provides a bond pad for connecting a die to a copper wire or copper ribbon, the bond pad is Copper foil and A sinterable silver film according to this specification laminated on a copper foil, Optionally, the system includes a metal plating layer sandwiched between a copper foil and a sinterable silver film.

[0059] The advantages and preferred features of the first embodiment apply equally to this embodiment.

[0060] The copper foil preferably contains copper or a copper alloy and / or has a multilayer structure.

[0061] The copper foil preferably has a thickness of 10 to 200 μm, more preferably 50 to 150 μm.

[0062] The copper foil preferably has a hardness of 50 to 100 Hv.

[0063] Copper foil is 10-20K -1 It preferably has a coefficient of thermal expansion (CTE).

[0064] The copper foil is preferably perforated.

[0065] The metal plating layer preferably contains silver, nickel-gold alloy, and / or ENIG (electroless nickel immersion gold).

[0066] The metal plating layer preferably has a thickness of 1 to 5 μm.

[0067] The bond pad preferably further includes an adhesive on the outer surface of a sinterable silver film.

[0068] The adhesive preferably contains a diphenyl compound having a melting point of 50 to 90°C, and / or a triphenyl compound having a melting point of 50 to 90°C, and / or a fatty alcohol having a melting point of 30 to 60°C.

[0069] The adhesive preferably contains polyvinyl ether.

[0070] In a further embodiment, the present invention provides a method for connecting a die to a copper wire and / or copper ribbon, the method being To provide a die, To provide the bond pad described herein, Bringing the sinterable film of the bond pad into contact with the die, The sinterable film is heated to connect the bond pad to the die, This includes welding copper wire and / or copper ribbon to the copper foil of a bond pad.

[0071] The advantages and preferred features of the first embodiment apply equally to this embodiment.

[0072] References to sinterable films refer to either sinterable silver films or sinterable films of metal particles, depending on which bond pad (an embodiment of the present invention) is used. Contacting the sinterable film of the bond pad with the die may be performed using a standard die pick-and-place apparatus, such as a Datacon 2200 EVO or an Infotech Die Bonder.

[0073] The welding preferably includes ultrasonic welding and / or laser welding. Such welding may be capable of forming a particularly strong connection between the die / bond pad and the copper wire and / or copper ribbon.

[0074] Welding copper wires and / or copper ribbons to the copper foil of a bond pad typically involves welding the copper wires and / or copper ribbons to a second main surface of the copper foil.

[0075] Heating a sinterable film to connect a bond pad to a die typically involves sintering the sinterable film, thereby forming a metallic bond between the bond pad and the die.

[0076] Heating is preferably carried out at a temperature of 200-300°C, more preferably 220-280°C, and even more preferably 240-260°C. Higher temperatures may cause damage to the die or the substrate on which the die is mounted. Lower temperatures may result in insufficient sintering of the sinterable film, leading to weak joints.

[0077] Heating is preferably carried out at a pressure of 2 to 20 MPa, more preferably 5 to 15 MPa, even more preferably 8 to 12 MPa, and still more preferably about 10 MPa. Higher pressures may cause damage to the die or the substrate on which the die is mounted. Lower pressures may result in insufficient sintering of the sinterable film, leading to weak joints.

[0078] Heating is preferably carried out for 10 to 180 seconds, more preferably 30 to 120 seconds, even more preferably 50 to 100 seconds, and still more preferably 60 to 90 seconds. Longer times are unnecessary and do not result in any greater level of adhesion. Shorter times may result in insufficient sintering of the sinterable film, leading to weak joints.

[0079] The die preferably contains a metallized surface, more preferably containing silver, gold, and / or palladium, and contacting the sinterable film of the bond pad with the die includes contacting the sinterable film of the bond pad with the metallized surface of the die. This may strengthen the bond.

[0080] Contacting the sinterable film of the bond pad with the die preferably involves preheating the die to a temperature of 130-180°C and contacting the preheated die with the sinterable film with a force of 50-150N, more preferably 70-130N, even more preferably 80-100N, and still more preferably about 90N, and / or for a placement time of 100-2000ms, more preferably 200-1000ms. The application of such heat and pressure promotes limited metal diffusion between the sinterable film and the die, thereby fixing the bond pad to the die (so-called "hot tacking"). Thus, the bond pad can be held in the desired position during this process.

[0081] Preferably, the die contains an adhesive on its surface, and contacting the sinterable film of the bond pad with the die involves contacting the sinterable film of the bond pad with the adhesive, which is done using a pick-and-place tool preheated to 50-90°C. The adhesive can hold the bond pad in the desired position during this method (so-called "cold tacking"). This can be achieved at a lower temperature (e.g., room temperature) than "hot tacking" and may be beneficial when the die and / or the substrate on which the die is mounted may be damaged at higher temperatures. Typically, the adhesive exhibits "tackiness" at the temperature of the pick-and-place machine. The placement time may be short, for example, as short as 50-100 milliseconds, which can enable high production speeds.

[0082] In a further embodiment, the present application provides a method for manufacturing an electronic device, which includes connecting a die to copper wires and / or copper ribbons according to the method described herein.

[0083] The advantages and preferred features of the first embodiment apply equally to this embodiment.

[0084] In a further embodiment, the present invention provides an electronic device manufactured according to the method described herein.

[0085] The advantages and preferred features of the first embodiment apply equally to this embodiment.

[0086] In a further embodiment, the present invention provides an electronic device comprising and / or manufactured using the bond pad described herein.

[0087] The advantages and preferred features of the first embodiment apply equally to this embodiment.

[0088] The electronic device preferably includes a power device or a power module.

[0089] The electronic device preferably further comprises a substrate connected to the die via a sintered silver film.

[0090] In a further embodiment, the present invention provides a method for manufacturing a bond pad as described herein, the method comprising: To provide copper foil, To provide a sinterable silver film as described herein, The process involves bringing copper foil into contact with a sinterable silver film, To provide laminated copper foil by applying heat and pressure to copper foil and a sinterable silver film, thereby laminating the sinterable silver film onto the copper foil, This includes punching out bond pads from laminated copper foil.

[0091] The advantages and preferred features of the first embodiment apply equally to this embodiment.

[0092] The sinterable silver film preferably includes a metal plating layer, and contacting the copper foil with the sinterable silver film includes contacting the metal plating layer with the sinterable silver film.

[0093] Applying heat and pressure to the copper foil and sinterable silver film preferably includes applying a pressure of at least 0.5 MPa, preferably at least 0.8 MPa, more preferably 0.5 to 2 MPa, even more preferably 0.8 to 1.2 MPa, and still more preferably about 1 MPa, and / or heating the copper foil and / or sinterable silver film to a temperature of 100 to 200°C, preferably 120 to 170°C, more preferably 140 to 160°C, and still more preferably about 150°C for preferably 1 to 60 seconds, more preferably 2 to 40 seconds, even more preferably 5 to 15 seconds, and still more preferably about 10 seconds.

[0094] In a further embodiment, the present invention is The present invention provides a substrate having a die thereon, wherein the substrate and the die are separated by a sinterable film. To provide the bond pad described herein, The bond pad is brought into contact with the die via the sinterable film of the bond pad, Sintering a sinterable film, To provide copper ribbon or copper wire, The present invention provides an assembly method that includes connecting a copper ribbon or copper wire to a die and optionally connecting it to a substrate.

[0095] The advantages and preferred features of the first embodiment apply equally to this embodiment.

[0096] Providing a bond pad preferably includes providing a bond pad on a tape-and-reel assembly, and contacting the bond pad with the die is preferably done using a pick-and-place machine. Sintering may be carried out, for example, in a sintering press. Sintering conditions may include, for example, a pressure of 1 to 15 MPa (e.g., 10 MPa), a temperature of 200 to 300°C (e.g., 250°C), and a time of 1 to 180 seconds (e.g., 60 to 90 seconds).

[0097] In a further embodiment, the present invention provides a bond pad for connecting a die to a copper wire or copper ribbon, the bond pad is Copper foil having a metal plating layer, The present invention includes a sinterable silver film laminated on a metal plating layer, as described herein.

[0098] The advantages and preferred features of the first embodiment apply equally to this embodiment.

[0099] The present invention will now be further described with respect to the following numbered clauses.

[0100] 1. A sinterable silver film, Silver particles having a maximum dimension of 1 to 1000 nm, Polymer binder and A sinterable silver film comprising a halogenated alcohol activator having a melting point of 80-150°C.

[0101] The longest dimension is measured, for example, by TEM. The particles may be in the form of spheres, plates, or rods. If the particles are in the form of spheres, the longest dimension is the diameter of the sphere.

[0102] 2. A sinterable silver film according to Clause 1, wherein the silver particles have a maximum dimension of 5 to 500 nm, preferably 10 to 100 nm, and more preferably 30 to 60 nm.

[0103] 3. A sinterable silver film according to Clause 1 or Clause 2, comprising 0.1 to 2% by weight of a polymer binder, preferably 0.5 to 1% by weight, based on the total weight of the sinterable silver film.

[0104] 4. A sinterable silver film according to any one of the clauses 1 to 3, wherein the polymer binder comprises an amide polymer, preferably poly(N-vinylacetamide).

[0105] 5. A sinterable silver film according to any one of the clauses 1 to 4, comprising 0.05 to 1% by weight of a halogenated alcohol activator, preferably 0.1 to 0.2% by weight of a halogenated alcohol activator, based on the total weight of the sinterable silver film.

[0106] 6. A sinterable silver film according to any one of clauses 1 to 5, wherein the halogenated alcohol activator has a melting point of 85 to 140°C, preferably 90 to 130°C, and more preferably 100 to 120°C.

[0107] 7. A sinterable silver film according to any one of the claims 1 to 6, wherein the halogenated alcohol activator has a molecular weight of at least 150, preferably at least 200, more preferably at least 300, even more preferably at least 400, and still more preferably at least 500.

[0108] 8. A sinterable silver film as described in any one of clauses 1 to 7, wherein the halogenated alcohol includes brominated alcohol.

[0109] 9. A sinterable silver film as described in any one of clauses 1 to 8, wherein the halogenated alcohol contains 3 to 5 carbon atoms.

[0110] 10. A sinterable silver film as described in any one of clauses 1 to 9, wherein the halogenated alcohol is linear or branched.

[0111] 11. A sinterable silver film according to any one of the clauses 1 to 10, wherein the halogenated alcohol comprises 3,4-dibromo-2-butanol and / or 1,4-dibromobutan-2-ol.

[0112] 12. Partially hydrogenated gum rosin, preferably in an amount of 0.1 to 0.3% by weight based on the total weight of the sinterable silver film, and / or The finely powdered wax is further included, preferably in an amount of 0.2 to 0.4% by weight based on the total weight of the sinterable silver film. A sinterable silver film as described in any one of clauses 1 to 11.

[0113] 13. A bonding pad for connecting a die to a copper wire or copper ribbon, Copper foil and A sinterable silver film laminated on a copper foil, as described in any one of clauses 1 to 12, A bond pad comprising, optionally, a metal plating layer sandwiched between a copper foil and a sinterable silver film.

[0114] 14. The bond pad described in Clause 13, wherein the copper foil contains copper or a copper alloy and / or has a multilayer structure.

[0115] 15. A bond pad according to Clause 13 or Clause 14, wherein the copper foil has a thickness of 10 to 200 μm, preferably 50 to 150 μm.

[0116] 16. A bond pad as described in any one of clauses 13 to 15, wherein the copper foil has a hardness of 50 to 100 Hv.

[0117] 17. A bond pad according to any one of clauses 13 to 16, wherein the copper foil has a coefficient of thermal expansion (CTE) of 10 to 20 ppm.

[0118] 18. A bond pad as described in any one of clauses 13 to 17, having perforated copper foil.

[0119] 19. A bond pad as described in any one of Clauses 13 to 18, wherein the metal plating layer includes silver, nickel-gold alloy and / or ENIG (electroless nickel immersion gold).

[0120] 20. A bond pad according to any one of clauses 13 to 19, wherein the metal plating layer has a thickness of 1 to 5 μm.

[0121] 21. A bond pad according to any one of the clauses 13 to 20, further comprising an adhesive on the outer surface of a sinterable silver film.

[0122] 22. The adhesive is Preferably a diphenyl compound having a melting point of 50 to 90°C, and / or Preferably a triphenyl compound having a melting point of 50 to 90°C, and / or The bond pad according to Clause 21, preferably comprising a fatty alcohol having a melting point of 30 to 60°C.

[0123] 23. A bond pad according to Clause 21 or Clause 22, wherein the adhesive comprises polyvinyl ether.

[0124] 24. A method for connecting a die to a copper wire and / or copper ribbon, To provide a die, To provide a bond pad as described in any one of clauses 13 to 23, The bond pad's sinterable silver film is brought into contact with the die, Heating a sinterable silver film to connect the bond pad to the die, A method comprising welding copper wire and / or copper ribbon to the copper foil of a bond pad.

[0125] 25. Welding as described in Clause 24, including ultrasonic and / or laser welding.

[0126] 26. The method according to clause 24 or clause 25, wherein heating is carried out at a temperature of 200-300°C, preferably 220-280°C, more preferably 240-260°C.

[0127] 27. The method according to any one of the clauses 24 to 26, wherein heating is carried out under a pressure of 2 to 20 MPa, preferably 5 to 15 MPa, more preferably 8 to 12 MPa, and even more preferably about 10 MPa.

[0128] 28. The method according to any one of the claims 24 to 27, wherein heating is carried out for 10 to 180 seconds, preferably 30 to 120 seconds, more preferably 50 to 100 seconds, and even more preferably 60 to 90 seconds.

[0129] 29. The method according to any one of the claims 24 to 28, wherein the die preferably comprises a metallized surface containing silver, gold and / or palladium, and contacting the sinterable silver film of the bond pad with the die comprises contacting the sinterable silver film of the bond pad with the metallized surface of the die.

[0130] 30. Bringing the sinterable silver film of the bond pad into contact with the die is Preheat the die to a temperature of 130-180°C, The method according to any one of claims 24 to 29, comprising bringing a preheated die into contact with a sinterable silver film with a force of 50 to 150 N, preferably 70 to 130 N, more preferably 80 to 100 N, and even more preferably about 90 N, and / or for a placement time of 100 to 2000 ms, preferably 200 to 1000 ms.

[0131] 31. The method according to any one of the clauses 24 to 30, wherein the sinterable silver film of the bond pad is brought into contact with the die using a pick-and-place tool preheated to 50-90°C.

[0132] 32. The method according to any one of the clauses 24 to 31, wherein the die includes an adhesive on its surface, and contacting the die with the sinterable silver film of the bond pad includes contacting the sinterable silver film of the bond pad with the adhesive.

[0133] 33. A method for manufacturing an electronic device, comprising connecting a die to copper wires and / or copper ribbons in accordance with the method described in any one of clauses 24 to 32.

[0134] 34. Electronic devices manufactured in accordance with Article 33.

[0135] 35. Electronic devices comprising and / or manufactured using a bond pad as described in any one of clauses 13 to 23.

[0136] 36. An electronic device is an electronic device as defined in Clause 34 or Clause 35, which is a power device or power module.

[0137] 37. Copper wire or copper ribbon welded to copper foil, The electronic device according to any one of clauses 34 to 36, further comprising a substrate connected to a die via a sintered silver film.

[0138] 38. A method for manufacturing a bond pad as described in any one of paragraphs 13 to 23, To provide copper foil, To provide a sinterable silver film, The process involves bringing copper foil into contact with a sinterable silver film, To provide laminated copper foil by applying heat and pressure to copper foil and a sinterable silver film, thereby laminating the sinterable silver film onto the copper foil, This includes punching out bond pads from laminated copper foil, Sinterable silver film is Silver particles having a maximum dimension of 1 to 1000 nm, Polymer binder and A sinterable silver film comprising a halogenated alcohol activator having a melting point of 80-150°C.

[0139] 39. The method of Clause 38, wherein the sinterable silver film includes a metal plating layer, and contacting the copper foil with the sinterable silver film includes contacting the metal plating layer with the sinterable silver film.

[0140] 40. Applying heat and pressure to copper foil and sinterable silver film is Applying a pressure of at least 0.5 MPa, preferably at least 0.8 MPa, more preferably 0.5 to 2 MPa, even more preferably 0.8 to 1.2 MPa, and / or, The copper foil and / or sinterable silver film are heated to a temperature of 100-200°C, preferably 120-170°C, more preferably 140-160°C, and even more preferably about 150°C. The method according to clause 38 or 39, comprising heating for preferably 1 to 60 seconds, more preferably 2 to 40 seconds, even more preferably 5 to 15 seconds, and still more preferably about 10 seconds. [Brief explanation of the drawing]

[0141] The present invention will now be further described with reference to the following drawings. [Figure 1] This is a schematic diagram of the bond pad according to the present invention. [Figure 2] This is a schematic diagram of an electronic device according to the present invention. [Figure 3] This is a schematic diagram of an electronic device according to the present invention. [Modes for carrying out the invention]

[0142] Referring to Figure 1, a bond pad (overall 1) according to the present invention is shown. The bond pad includes a copper foil 2 having a plating layer 3 on its surface. A sinterable silver film 4 is laminated on the copper foil 2 via the plating layer 3. The adhesive 5 is located on the outer surface of the sinterable silver film 4.

[0143] Referring to Figure 2, an electronic device (6 overall) according to the present invention is shown. A bond pad 1 according to the present invention is attached to a die 7 via a sinterable silver film (not shown) of the bond pad. The die 7 is attached to a substrate 9 via a sinterable silver film 8. The substrate includes a ceramic core 10 and a copper surface layer 11. Copper wires 12 are welded to the upper surfaces of the bond pad 1 and the copper surface layer 11.

[0144] The present invention will now be further described with respect to the following embodiments. [Examples]

[0145] An electronic device was fabricated using the following method. A substrate with a die on it was provided, and the substrate and die were separated by a sinterable film. A 50 μm thick bond pad was prepared on it, containing a metal-plated hard copper foil with a sinterable silver film laminated on top. The bond pad was placed on the top surface of the die via the sinterable film. The resulting blank was transferred to an oven, where the sinterable film was sintered to form a metallic bond between the bond pad and the top surface of the die, and between the die and the substrate. Next, a copper ribbon was ultrasonically welded to the top surface of the bond pad. The results are shown in Figure 3, where the bond pad is indicated by 13, the die by 14, the substrate by 15, and the copper ribbon by 16.

[0146] Identical electronic devices were prepared, except that the copper foil contained soft copper.

[0147] The connections between the bond pads and copper ribbons of both devices were subjected to shear testing using an industry-accepted shear test as described in Technical Bulletin DVS 2811. The results are as follows:

[0148] [Table 1]

[0149] In all cases, the shear strength was excellent, far exceeding the recommended values. The failure mode was between the copper ribbon and the pad, as recommended by the standard.

[0150] The details provided herein are provided by description and illustration and are not intended to limit the scope of the appended claims. Many modifications of the currently preferred embodiments shown herein will be obvious to those skilled in the art and remain within the scope of the appended claims and their equivalents.

Claims

1. A method for manufacturing a bond pad for connecting a die to a copper ribbon or copper wire, To provide a copper foil sheet having a first main surface on the opposite side of a second main surface, To provide a sinterable film of metal particles, The sinterable film is laminated onto the first main surface to form a laminated sheet, A method comprising punching out a bond pad from the laminated sheet.

2. The method according to claim 1, wherein the copper foil comprises copper or a copper alloy and / or has a multilayer structure.

3. The aforementioned copper foil is A thickness of 10 to 200 μm, preferably 50 to 150 μm, and / or Hardness Hv of 50 to 100, and / or The method according to claim 1 or 2, having a thermal expansion coefficient (CTE) of 10 to 20 ppm.

4. The method according to any one of claims 1 to 3, wherein the copper foil is perforated.

5. The sinterable film is Silver particles having a maximum dimension of 1 to 1000 nm, The method according to any one of claims 1 to 4, comprising a polymer binder.

6. The method according to claim 5, wherein the sinterable film comprises 0.1 to 2% by weight of the polymer binder, preferably 0.5 to 1% by weight of the polymer binder, based on the total weight of the sinterable silver film.

7. The method according to claim 5 or 6, wherein the polymer binder comprises an amide polymer, preferably poly(N-vinylacetamide).

8. The method according to any one of claims 5 to 7, wherein the silver particles have a maximum dimension of 5 to 500 nm, preferably 10 to 100 nm, and more preferably 30 to 60 nm.

9. The silver particles in the sinterable film are D90 of 1000 nm or less, preferably 500 nm or less, more preferably 100 nm or less, even more preferably 60 nm or less, and / or The method according to any one of claims 5 to 8, for forming fine particles having a D10 of 1 nm or more, preferably 5 nm or more, more preferably 10 nm or more, and even more preferably 30 nm or more.

10. The method according to any one of claims 1 to 9, wherein the sinterable film comprises 90 to 99% by weight of silver particles, preferably 92 to 98% by weight of silver particles, and more preferably 94 to 96% by weight of silver particles, based on the total weight of the sinterable film.

11. The method according to any one of claims 1 to 10, wherein the sinterable film comprises a halogenated alcohol activator having a melting point of 80 to 150°C.

12. The method according to claim 11, wherein the sinterable film comprises 0.05 to 1% by weight of the halogenated alcohol activator, preferably 0.1 to 0.2% by weight of the halogenated alcohol activator, based on the total weight of the sinterable film.

13. The method according to claim 11 or 12, wherein the halogenated alcohol activator has a melting point of 85 to 140°C, preferably 90 to 130°C, and more preferably 100 to 120°C.

14. The halogenated alcohol activator is At least 150, preferably at least 200, and / or 500 or less, preferably 400 or less, more preferably 300 or less, and / or The method according to any one of claims 11 to 13, having a molecular weight of 150 to 500, preferably 200 to 300.

15. The method according to any one of claims 11 to 14, wherein the halogenated alcohol includes a brominated alcohol.

16. The method according to any one of claims 11 to 15, wherein the halogenated alcohol includes a dibrominated alcohol.

17. The method according to any one of claims 11 to 16, wherein the halogenated alcohol contains 3 to 5 carbon atoms.

18. The method according to any one of claims 11 to 17, wherein the halogenated alcohol includes a monohydroxy alcohol.

19. The method according to any one of claims 11 to 18, wherein the halogenated alcohol comprises 3,4-dibromo-2-butanol and / or 1,4-dibromobutan-2-ol.

20. Partially hydrogenated gum rosin is added in an amount of preferably 0.1 to 0.3% by weight based on the total weight of the sinterable silver film, and / or The method according to any one of claims 11 to 19, further comprising finely powdered wax in an amount preferably 0.2 to 0.4% by weight based on the total weight of the sinterable silver film.

21. Laminating the first main surface with the sinterable film is Bringing the sinterable film into contact with the first surface, The method according to any one of claims 1 to 20, comprising applying heat and pressure to the copper foil and sinterable film sheets.

22. The method according to claim 21, wherein the first surface includes a metal plating layer, and contacting the sinterable film with the first surface includes contacting the metal plating layer with the sinterable silver film.

23. The method according to claim 22, wherein the metal plating layer comprises silver, a nickel-gold alloy and / or ENIG (electroless nickel-plated gold).

24. The method according to any one of claims 21 to 23, wherein the metal plating layer has a thickness of 1 to 5 μm.

25. Applying heat and pressure to the copper foil and sinterable film sheets is Applying a pressure of at least 0.5 MPa, preferably at least 0.8 MPa, more preferably 0.5 to 2 MPa, even more preferably 0.8 to 1.2 MPa, and / or, The method according to any one of claims 21 to 24, comprising heating the sheet of copper foil and / or sinterable film to a temperature of 100 to 200°C, preferably 120 to 170°C, more preferably 140 to 160°C, and even more preferably about 150°C for preferably 1 to 60 seconds, more preferably 2 to 40 seconds, even more preferably 5 to 15 seconds, and even more preferably about 10 seconds.

26. The method according to any one of claims 1 to 25, further comprising applying an adhesive to the sinterable film on the laminated sheet, wherein the punching is performed such that the adhesive is present on the sinterable film on the bond pad.

27. The aforementioned adhesive is Preferably a diphenyl compound having a melting point of 50 to 90°C, and / or Preferably a triphenyl compound having a melting point of 50 to 90°C, and / or The method according to claim 26, preferably comprising a fatty alcohol having a melting point of 30 to 60°C.

28. The method according to claim 26 or 27, wherein the adhesive comprises polyvinyl ether.

29. A bond pad manufactured according to the method described in any one of claims 1 to 28.

30. A sinterable silver film, Silver particles having a maximum dimension of 1 to 1000 nm, Polymer binder and A sinterable silver film comprising a halogenated alcohol activator having a melting point of 80 to 150°C.

31. The sinterable silver film according to claim 30, wherein the silver particles have a maximum length of 5 to 500 nm, preferably 10 to 100 nm, and more preferably 30 to 60 nm.

32. The silver particles in the aforementioned sinterable silver film are D90 of 1000 nm or less, preferably 500 nm or less, more preferably 100 nm or less, even more preferably 60 nm or less, and / or A sinterable silver film according to claim 30 or 31, which forms fine particles having a D10 of 1 nm or more, preferably 5 nm or more, more preferably 10 nm or more, and even more preferably 30 nm or more.

33. A sinterable silver film according to any one of claims 30 to 32, comprising 90 to 99% by weight of silver metal particles, preferably 92 to 98% by weight of silver metal particles, and more preferably 94 to 96% by weight of silver metal particles, based on the total weight of the sinterable film.

34. A sinterable silver film according to any one of claims 30 to 33, comprising 0.1 to 2% by weight of the polymer binder, preferably 0.5 to 1% by weight of the polymer binder, based on the total weight of the sinterable silver film.

35. The sinterable silver film according to any one of claims 30 to 34, wherein the polymer binder comprises an amide polymer, preferably poly(N-vinylacetamide).

36. A sinterable silver film according to any one of claims 30 to 35, comprising 0.05 to 1% by weight of a halogenated alcohol activator, preferably 0.1 to 0.2% by weight of a halogenated alcohol activator, based on the total weight of the sinterable silver film.

37. The sinterable silver film according to any one of claims 30 to 36, wherein the halogenated alcohol activator has a melting point of 85 to 140°C, preferably 90 to 130°C, and more preferably 100 to 120°C.

38. The halogenated alcohol activator is At least 150, preferably at least 200, and / or 500 or less, preferably 400 or less, more preferably 300 or less, and / or A sinterable silver film according to any one of claims 30 to 37, having a molecular weight of 150 to 500, preferably 200 to 300.

39. The sinterable silver film according to any one of claims 30 to 38, wherein the halogenated alcohol includes a brominated alcohol.

40. The sinterable film according to claim 39, wherein the halogenated alcohol includes a dibrominated alcohol.

41. The sinterable silver film according to any one of claims 30 to 40, wherein the halogenated alcohol contains 3 to 5 carbon atoms.

42. The sinterable silver film according to any one of claims 30 to 41, wherein the halogenated alcohol includes a monohydroxy alcohol.

43. The sinterable silver film according to any one of claims 30 to 42, wherein the halogenated alcohol comprises 3,4-dibromo-2-butanol and / or 1,4-dibromobutan-2-ol.

44. Partially hydrogenated gum rosin is added in an amount of preferably 0.1 to 0.3% by weight based on the total weight of the sinterable silver film, and / or The sinterable silver film according to any one of claims 30 to 43, further comprising finely powdered wax in an amount preferably 0.2 to 0.4% by weight based on the total weight of the sinterable silver film.

45. A bonding pad for connecting a die to a copper wire or copper ribbon, Copper foil and A sinterable silver film according to any one of claims 30 to 44, laminated on the copper foil, A bond pad optionally comprising a metal plating layer sandwiched between the copper foil and the sinterable silver film.

46. The bond pad according to claim 45, wherein the copper foil comprises copper or a copper alloy and / or has a multilayer structure.

47. The bond pad according to claim 45 or claim 46, wherein the copper foil has a thickness of 10 to 200 μm, preferably 50 to 150 μm.

48. The bond pad according to any one of claims 45 to 47, wherein the copper foil has a hardness Hv of 50 to 100.

49. The bond pad according to any one of claims 45 to 48, wherein the copper foil has a coefficient of thermal expansion (CTE) of 10 to 20 ppm.

50. The bond pad according to any one of claims 45 to 49, wherein the copper foil is perforated.

51. The bond pad according to any one of claims 45 to 50, wherein the metal plating layer comprises silver, a nickel-gold alloy and / or ENIG (electroless nickel-plated gold).

52. The bond pad according to any one of claims 45 to 51, wherein the metal plating layer has a thickness of 1 to 5 μm.

53. The bond pad according to any one of claims 45 to 52, further comprising an adhesive on the outer surface of the sinterable silver film.

54. The aforementioned adhesive is Preferably a diphenyl compound having a melting point of 50 to 90°C, and / or Preferably a triphenyl compound having a melting point of 50 to 90°C, and / or The bond pad according to claim 53, preferably comprising a fatty alcohol having a melting point of 30 to 60°C.

55. The adhesive comprising polyvinyl ether, according to claim 53 or 54, for the bond pad.

56. A method for connecting a die to a copper wire and / or copper ribbon, To provide a die, To provide a bond pad according to any one of claims 29 and 45 to 55, The sinterable film of the bond pad is brought into contact with the die, The sinterable film is heated to connect the bond pad to the die, A method comprising welding a copper wire and / or copper ribbon to the copper foil of the bond pad.

57. The method according to claim 56, wherein the welding includes ultrasonic welding and / or laser welding.

58. The method according to claim 56 or 57, wherein the heating is performed at a temperature of 200 to 300°C, preferably 220 to 280°C, and more preferably 240 to 260°C.

59. The method according to any one of claims 56 to 58, wherein the heating is carried out under a pressure of 2 to 20 MPa, preferably 5 to 15 MPa, more preferably 8 to 12 MPa, and even more preferably about 10 MPa.

60. The method according to any one of claims 56 to 59, wherein the heating is performed for 10 to 180 seconds, preferably 30 to 120 seconds, more preferably 50 to 100 seconds, and even more preferably 60 to 90 seconds.

61. The method according to any one of claims 56 to 60, wherein the die preferably comprises a metallized surface containing silver, gold and / or palladium, and contacting the sinterable film of the bond pad with the die includes contacting the sinterable film of the bond pad with the metallized surface of the die.

62. Bringing the sinterable film of the bond pad into contact with the die is, The die is preheated to a temperature of 130 to 180°C, The method according to any one of claims 56 to 61, comprising bringing the preheated die into contact with the sinterable film with a force of 50 to 150 N, preferably 70 to 130 N, more preferably 80 to 100 N, and even more preferably about 90 N, and / or for a placement time of 100 to 2000 ms, preferably 200 to 1000 ms.

63. The die has an adhesive on its surface, Bringing the sinterable film of the bond pad into contact with the die includes bringing the sinterable film of the bond pad into contact with the adhesive, The method according to any one of claims 56 to 62, wherein the sinterable film of the bond pad is brought into contact with the die using a pick-and-place tool preheated to 50 to 90°C.

64. A method for manufacturing an electronic device, comprising connecting a die to a copper wire and / or copper ribbon according to the method described in any one of claims 56 to 63.

65. An electronic device manufactured in accordance with claim 64.

66. An electronic device comprising and / or manufactured using a bond pad according to any one of claims 29 and 45 to 55.

67. The electronic device according to claim 65 or 66, wherein the electronic device includes a power device or a power module.

68. The electronic device according to any one of claims 65 to 67, further comprising a substrate connected to the die via a sintered silver film.

69. A method for manufacturing a bond pad according to any one of claims 45 to 55, To provide copper foil, To provide a sinterable silver film according to any one of claims 30 to 44, The copper foil is brought into contact with the sinterable silver film, To provide laminated copper foil by applying heat and pressure to the copper foil and the sinterable silver film, and laminating the sinterable silver film onto the copper foil, A method comprising punching out a bond pad from the laminated copper foil.

70. The method according to claim 69, wherein the sinterable silver film includes a metal plating layer, and contacting the copper foil with the sinterable silver film includes contacting the metal plating layer with the sinterable silver film.

71. Applying heat and pressure to the copper foil and the sinterable silver film is Applying a pressure of at least 0.5 MPa, preferably at least 0.8 MPa, more preferably 0.5 to 2 MPa, even more preferably 0.8 to 1.2 MPa, and / or, The method according to claim 69 or 70, comprising heating the copper foil and / or sinterable silver film to a temperature of 100 to 200°C, preferably 120 to 170°C, more preferably 140 to 160°C, and even more preferably about 150°C for preferably 1 to 60 seconds, more preferably 2 to 40 seconds, even more preferably 5 to 15 seconds, and even more preferably about 10 seconds.

72. Assembly method, The present invention provides a substrate having a die thereon, wherein the substrate and the die are separated by a sinterable film. To provide a bond pad according to any one of claims 29 and 45 to 55, The bond pad is brought into contact with the die via the sinterable film of the bond pad, Sintering the aforementioned sinterable film, To provide copper ribbon or copper wire, An assembly method comprising connecting the copper ribbon or copper wire to the die and optionally connecting it to the substrate.

73. The method according to claim 72, wherein providing the bond pad comprises providing the bond pad on a tape-and-reel assembly, and bringing the bond pad into contact with the die is done using a pick-and-place machine.

Images