Wire or rod extraction electrode optics

Abstract

An electrode apparatus for an ion implantation system includes a base plate having a base plate aperture and at least one fixation area. A fixation device is associated with each fixation area, and a plurality of electrode rods are selectively coupled to the base plate by the fixation device. The plurality of electrode rods have a predetermined shape and define an optical area associated with the base plate aperture. An electrical coupling is configured to electrically connect the plurality of electrode rods to an electrical potential. The plurality of electrode rods have a predetermined shape configured to define a path for charged particles passing between the plurality of electrode rods based on the electrical potential. The plurality of electrode rods can define a suppression electrode or a ground electrode downstream of an extraction aperture of the ion source.

Description

Detailed Description of the Invention

[0001] [Field of the Invention] The present invention relates generally to ion implantation systems, and more particularly to an ion source having rod-shaped extraction electrode optics to reduce the costs and maintenance issues associated with replacing extraction electrode optics.

[0002] [Background of the invention] In the manufacture of semiconductor devices and other ion-related products, ion implantation systems are used to introduce dopant elements into semiconductor wafers, display panels, or other types of workpieces. A typical ion implantation system, or ion implanter, bombards a workpiece with an ion beam using known methods or processes to create n-type or p-type doped regions or to form a passivation layer on the workpiece. When used to dope semiconductors, ion implantation systems implant selected ion species to produce the desired exogenous material. Typically, dopant atoms or molecules are ionized, separated, and possibly accelerated or decelerated, formed into a beam, and implanted into the workpiece. The dopant ions physically impact and penetrate the surface of the workpiece, then rest within the crystal lattice structure below the workpiece surface.

[0003] Ion implantation is the industry's preferred technique for adding impurities to semiconductors in the large-scale manufacturing of integrated circuits. Ion dose and ion energy are the two most important variables used to define the implantation process. Ion dose relates to the concentration of ions implanted into a given semiconductor material. Generally, high-current implanters (typically ion beam currents greater than 10 milliamperes (mA)) are used for high-volume implants, while medium-current implanters (typically capable of beam currents up to about 10 mA) are used for low-volume implants.

[0004] Ion energy is a key parameter used to control junction depth in semiconductor devices. The energy level of the ions that make up the ion beam determines the depth to which the ions are implanted. High-energy processes, such as those used to form retrograde wells in semiconductor devices, require implants of up to several million electron volts (MeV), while shallower junctions may require ultra-low energy (ULE) levels of less than 1 kiloelectron volt (1 keV).

[0005] A typical ion implanter contains four sections or subsystems: (i) an ion source that generates an ion beam; (ii) an ion beam extraction system; (iii) a beamline that includes a mass analysis magnet for mass-resolving the ion beam; and (iv) a target chamber that houses the semiconductor wafer or other substrate to be implanted by the ion beam. The trend toward smaller semiconductor devices has driven beamline configurations that deliver high beam currents at low energies. High beam currents provide the desired dose levels, while low energies enable shallow implants. For example, source / drain extensions for CMOS devices are desirable for such high-current, low-energy applications.

[0006] An ion source in an ion implanter typically generates an ion beam by ionizing a source gas containing the desired dopant element in an ion source chamber, and then extracting the ionized source gas in the form of an ion beam through an extraction system. The ionization process is performed by an electron beam, which may take the form of a thermionic emitter, such as a thermally heated filament, or a radio frequency (RF) antenna. The thermionic emitter is typically electrically biased so that the emitted electrons have sufficient energy to ionize, and the RF antenna supplies a high-energy RF signal to the ion source chamber to energize the surrounding electrons.

[0007] In this way, the high-energy electrons ionize the source gas in the ion source chamber, generating the desired ions. Examples of desired dopant ions produced from the source gas include boron (B), phosphorus (P), and arsenic (As). In ion sources that use a thermionic emitter for ionization, local emitter temperatures typically exceed 2500°C, and the ion source chamber, thermally radiated by the emitter, can reach temperatures of approximately 700°C.

[0008] 1 shows a conventional extraction electrode system 10 in which ions generated in an ion source 12 are extracted through an ion source aperture 14, generally defining an ion beam (not shown). The conventional extraction electrode system 10 includes an extraction electrode 16 that is electrically biased relative to the ion source 12 and a ground electrode 18 that is electrically grounded. Typically, the extraction electrode 16 and the ground electrode 18 have respective focusing slits 20, 22 defined in respective solid plate members 24, 26.

[0009] In ion implanter design, it is desirable for the ion beam to accurately follow a desired, predetermined beam path. For example, the precise location of the extraction electrode 16 relative to the ion source aperture 14 is important to ensure that the ion beam follows the desired, predetermined beam path. Therefore, precise alignment and positioning of the various electrodes or optics of the extraction electrode system 10 with the ion source aperture 14 is typically desired.

[0010] This disclosure recognizes that conventional extraction electrode assembly optics are considered consumable parts due to wear from ion beam sputtering. For example, the extraction electrode 16 has a front surface 28 facing the ion source opening 14 of the ion source 12, and the ground electrode 18 has a front surface 30 facing a downstream side 32 of the extraction electrode 16. Accordingly, the front surfaces 28, 30 tend to erode from exposure to ions extracted from the ion source 12, causing the focusing slits 20, 22 of the respective extraction and ground electrodes 16, 18 to widen or open over time. Such erosion due to sputtering and etching from the ion beam adversely affects the optical performance of the extraction electrode system 10.

[0011] Because conventional electrodes such as those described above are typically machined or otherwise formed from solid blocks of tungsten or graphite, the cost of manufacturing such electrodes is generally high. Often, the high cost leads to frequent attempts to reuse, clean, or modify conventional electrodes over time, resulting in detrimental variations in the performance of the optics, beam transport, and implantation systems. [Summary of the Invention]

[0012] The present invention overcomes various limitations of the prior art by providing an extraction electrode apparatus for an ion source, the extraction electrode apparatus including a plurality of rod-shaped optical elements. The rod-shaped optical elements provide a cost-effective ion implantation system by reducing system maintenance costs. Accordingly, the following presents a simplified summary of the invention in order to provide a basic understanding of some aspects of the invention. This summary is not an extensive overview of the invention, and it is not intended to identify key elements or delineate the scope of the invention. Its purpose is to present some concepts of the invention in a simplified form as a prelude to the more detailed description presented later.

[0013] The present invention is generally directed to ion implantation electrode components that can be easily replaced and / or maintained in an ion implantation system. However, the present disclosure is applicable to any system or apparatus in which one or more charged particles are extracted, accelerated, decelerated, focused, directed, and / or shaped in one or more dimensions and prevented from passing through one or more electrode components.

[0014] According to one exemplary embodiment of the present disclosure, an electrode apparatus for an ion implantation system is provided, the electrode apparatus including a base plate having a base plate opening defined therein, the base plate including at least one fixation region. For example, a fixation region is associated with each of the at least one fixation region, and a plurality of electrode rods are selectively coupled to the base plate via the fixation region. The plurality of electrode rods, such as a pair of electrode rods, have a predetermined shape for defining an optical region therebetween, the optical region being associated with the base plate opening. For example, an electrical coupling is further electrically coupled to the pair of electrode rods, configured to electrically connect to an electric potential. For example, the pair of electrode rods have a predetermined shape configured to define characteristics of charged particles passing between the pair of electrode rods based on the electric potential. The characteristics can include, for example, the path, shape, and / or energy of the charged particles.

[0015] Each of the pair of electrode rods can include, for example, an optical portion and one or more mounting portions, and the fixation device selectively engages the one or more mounting portions to position the optical portion of each of the pair of electrode rods in a predetermined position relative to the base plate. The one or more mounting portions can be associated with, for example, a first end and a second end of each of the pair of electrode rods. The one or more mounting portions can include respective elongated legs extending from the optical portion of each of the pair of electrode rods.

[0016] The base plate can include, for example, respective base holes in the at least one fastening region configured to receive the respective elongated legs. The fastening devices can include, for example, electrode fasteners respectively associated with the at least one elongated leg of each electrode rod, the electrode fasteners configured to selectively secure the at least one elongated leg to the base plate. The electrode fasteners can include, for example, screws such as set screws.

[0017] In one example, each base hole is a blind hole having a predetermined depth, which defines a predetermined position of the optical portion of each of the pair of electrode rods relative to the base plate.

[0018] In another example, the fixation device includes a mounting plate, and one or more mounting portions of each of the pair of electrode rods are selectively coupled to the one or more mounting plates, and the one or more mounting plates are selectively coupled to the base plate at at least one fastening region. The one or more mounting plates can include, for example, respective mounting holes configured to respectively receive one or more of the first and second ends of each of the pair of electrode rods, and the fixation device includes electrode fasteners respectively associated with at least one elongated leg of each electrode rod. The electrode fasteners are, for example, configured to selectively respectively secure each at least one elongated leg to the mounting plate, and the fixation device further includes at least one mounting plate fastener configured to selectively secure the mounting plate to the base plate.

[0019] The base plate can include, for example, at least one threaded base hole configured to respectively receive at least one mounting plate fastener, the at least one mounting plate fastener including a thread, such as a set screw.

[0020] In another example, the optical portions of the pair of electrode rods are curved. The pair of electrode rods may be parallel to each other, for example, when viewed along the path of the charged particles. Each of the pair of electrode rods may be made of, for example, one or more of a refractory metal and graphite. Furthermore, the base plate may be made of, for example, one or more of a refractory metal and graphite.

[0021] In yet another example, the pair of electrode rods can be configured to define a suppression electrode disposed downstream of the extraction aperture of the ion source, and the potential is a predetermined non-zero voltage. In another example, the pair of electrode rods can further define a ground electrode, and the potential is an electrical ground. The pair of electrode rods can include, for example, one of tungsten, tantalum, molybdenum, or graphite.

[0022] According to another example, an electrode assembly for an ion implantation system is provided, the electrode assembly including a base plate and a plurality of rods selectively operably coupled to the base plate, the plurality of rods being spaced apart from one another by, for example, a predetermined distance, the predetermined distance related to a width of an ion beam extracted from an ion source.

[0023] In yet another example of the present disclosure, an electrode assembly for controlling an ion beam in an ion implantation system is provided. The electrode assembly includes, for example, a base plate, one or more electrode rods, and a fixation device. The one or more electrode rods are defined by, for example, one or more predetermined shapes, the one or more predetermined shapes being related to desired characteristics of the ion beam. Furthermore, the fixation device is configured to selectively couple the one or more electrode rods to at least one fixation region of the base plate to maintain a position of the one or more electrode rods relative to the ion beam.

[0024] To the accomplishment of the foregoing and related ends, the invention comprises the structure hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative embodiments of the invention. These embodiments are indicative, however, of some of the various ways in which the principles of the invention may be employed. Other objects, advantages and novel features of the invention will become apparent from the following detailed description of the disclosure when considered in conjunction with the drawings.

[0025] [Brief description of the drawing] FIG. 1 shows an expanded perspective view of a conventional optical system for an ion implantation system.

[0026] FIG. 2 shows a schematic diagram of an ion implantation system according to various embodiments of the present disclosure.

[0027] FIG. 3 shows a front view of an electrode device according to various embodiments of the present disclosure.

[0028] FIG. 4 illustrates a side view of an electrode rod according to various embodiments of the present disclosure.

[0029] FIG. 5 shows a front view of an extraction electrode apparatus according to various embodiments of the present disclosure.

[0030] FIG. 6 illustrates a cross-sectional side view of the extraction electrode apparatus of FIG. 5 according to various embodiments of the present disclosure.

[0031] FIG. 7 illustrates a front perspective view of a suppression electrode device according to various embodiments of the present disclosure.

[0032] FIG. 8 illustrates a front perspective view of a ground electrode apparatus according to various embodiments of the present disclosure.

[0033] FIG. 9 illustrates a front view of a suppression electrode device according to various embodiments of the present disclosure.

[0034] FIG. 10 illustrates a cross-sectional side view of the suppression electrode device of FIG. 9 according to various embodiments of the present disclosure.

[0035] FIG. 11 illustrates a front view of a suppression electrode baseplate, according to various embodiments of the present disclosure.

[0036] FIG. 12 illustrates a cross-sectional side view of the suppression electrode baseplate of FIG. 11 according to various embodiments of the present disclosure.

[0037] FIG. 13 illustrates a side view of a suppression electrode rod, according to various embodiments of the present disclosure.

[0038] FIG. 14 illustrates a front view of a ground electrode apparatus according to various embodiments of the present disclosure.

[0039] FIG. 15 illustrates a cross-sectional side view of the ground electrode apparatus of FIG. 14 according to various embodiments of the present disclosure.

[0040] FIG. 16 shows a front view of another electrode device according to various embodiments of the present disclosure.

[0041] FIG. 17 illustrates a cross-sectional side view of the extraction electrode apparatus of FIG. 16 according to various embodiments of the present disclosure.

[0042] FIG. 18 shows a front view of an electrode rod assembly according to various embodiments of the present disclosure.

[0043] FIG. 19 illustrates a side view of a portion of an electrode rod, according to various embodiments of the present disclosure.

[0044] FIG. 20 shows a top front perspective view of another electrode device according to various embodiments of the present disclosure.

[0045] FIG. 21 illustrates a bottom front perspective view of the electrode device of FIG. 20 according to various embodiments of the present disclosure.

[0046] FIG. 22 shows a top front perspective view of an electrode device in association with a base plate, according to various embodiments of the present disclosure.

[0047] FIG. 23 illustrates a bottom front perspective view of the electrode device of FIG. 22 according to various embodiments of the present disclosure.

[0048] FIG. 24 illustrates a bottom perspective view of a clamping member according to various embodiments of the present disclosure.

[0049] FIG. 25 illustrates a top view of a clamping member and an electrode rod according to various embodiments of the present disclosure.

[0050] FIG. 26 illustrates a top view of a clamping member without an electrode rod, according to various embodiments of the present disclosure.

[0051] FIG. 27 illustrates a front view of the clamping member of FIG. 26 according to various embodiments of the present disclosure.

[0052] FIG. 28 illustrates a bottom view of a clamping member with an electrode rod according to various embodiments of the present disclosure.

[0053] [Detailed Description of the Invention] The present disclosure relates generally to an electrode apparatus for use in an ion implantation system, and more particularly to an extraction electrode apparatus configured to efficiently extract charged particles from an ion source while enabling lower maintenance costs by providing a replaceable rod-shaped extraction electrode.

[0054] Accordingly, the present invention will now be described with reference to the drawings, wherein like reference numerals are used to refer to like elements throughout. It should be understood that the descriptions of these aspects are merely exemplary and are not to be construed in a limiting sense. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be apparent to those skilled in the art that the present disclosure may be practiced without these specific details.

[0055] Referring now to the drawings, FIG. 2 illustrates an exemplary ion implantation system 100, which is suitable for implementing one or more aspects of the present invention, for purposes of better understanding the present disclosure. While the ion implantation system 100 is illustrated by way of example, it should be noted that the present invention may be implemented using various other types of ion implanters and systems, such as high-energy systems, low-energy systems, or other implantation systems, and all such systems are contemplated as being within the scope of the present invention.

[0056] The ion implantation system 100 of FIG. 2 includes, for example, a terminal 102, a beamline assembly 104, and an end station 106 (e.g., including a processing chamber), where the ion implantation system is typically placed under vacuum by one or more vacuum pumps 108. The ion implantation system 100 is configured, for example, to implant ions into a workpiece 110 (e.g., a semiconductor wafer, a display panel, etc.). In one example, the ion implantation system 100 is configured to implant ions into a single workpiece 110 (e.g., a "serial" ion implanter), where the workpiece typically resides on a support 112 (e.g., a pedestal or electrostatic chuck) located within the end station 106. Alternatively, the ion implantation system 100 is configured to implant ions into multiple workpieces 110 (e.g., a "batch" ion implanter), where the end station 106 includes a rotating disk (not shown) on which the multiple workpieces move relative to an ion beam 114. It should be noted that any ion implanter operable to extract ions from an ion source and implant them into one or more workpieces is contemplated as being within the scope of the present invention.

[0057] Terminal 102 is connected to a source power supply 122 (V source ) and an extraction voltage V ExtractAn extraction power supply 126 (V Ex ), and an extraction assembly 124 powered by a power supply 126. The extraction assembly 124 is operable, for example, in conjunction with the beamline assembly 104, to direct ions to a workpiece 110 on a support 112 within the end station 106 for implantation at a predetermined energy level.

[0058] In one example, the potential V source The ion source 120 includes a plasma chamber 128 (also called an arc chamber) biased to a source ions at a relatively high plasma density (e.g., 10 10 ~10 13 cm -3 ) is made. It should be noted that the present invention is generally for generating positive ions, although it is also applicable to systems in which negative ions are generated by the ion source 120. The extraction assembly 124 further includes an extraction aperture 130 (also called an arc slit) defined in the wall of the plasma chamber 128, as well as one or more extraction electrodes 132, which are connected to an extraction potential V source The bias voltage is V Extract is the potential V source and the voltage V applied to the extraction electrode Ex and thereby providing the extracted ion beam 114 to the beamline assembly 104. In one example, if an ion energy of 120 keV is desired, V source =120 kV. The drawer assembly 124 and its construction will be described in more detail below.

[0059] In accordance with the present disclosure, a first electrode of the one or more extraction electrodes 132 comprises a suppression electrode. When the suppression electrode is at a suppression potential, for example, an extraction voltage V Extract The power supply is 126V. Ex ) and source power supply 122(V source) is the potential difference between the first electrode and the extraction voltage V Extract may be defined as the potential of the source power supply 122. It will be understood that various other configurations of the one or more extraction electrodes 132 and their electrical connections are contemplated as being within the scope of the present disclosure.

[0060] When positive ions are generated, one or more extraction electrodes 132 are connected to, for example, V source The one or more extraction electrodes 132 are biased at a lower voltage (e.g., an extraction voltage of 0-100 kV) relative to the extraction electrode 120. The negative relative potential of the one or more extraction electrodes 132 with respect to the extraction aperture 130 creates an electrostatic field across the extraction aperture 130, whereby the one or more extraction electrodes 132 are operable to extract and accelerate positive ions from the ion source 120. The one or more extraction electrodes 132 thus define, for example, extraction electrode optics 134 through which the ion beam 114 passes, the extraction electrode optics being configured to extract ions from the ion source 120.

[0061] The beamline assembly 104 of the ion implantation system 100 further includes, for example, a mass analyzer 136 that receives the extracted ion beam 114 and a resolving plate 138, where the mass analyzer generally forms a dipole magnetic field to significantly pass only ions of an appropriate charge-to-mass ratio or range (e.g., a mass-analyzed ion beam having ions in a desired mass range) toward the workpiece 110 disposed in the end station 106.

[0062] The resolving plate 138 operates in conjunction with the mass analyzer 136 to, for example, remove undesired ion species from the ion beam 114, the undesired ion species having a charge-to-mass ratio different from that of the desired ion species. The resolving plate 138 includes, for example, one or more resolving apertures 140 through which the ions in the ion beam 114 pass. At the resolving plate 138, the desired ions generally experience minimal dispersion.

[0063] In one example, the strength and orientation of the magnetic field of the mass analyzer 136 and the velocity of the ions extracted from the ion source 120 are generally set by the controller 142 so that only ions having a mass equal to the mass of the desired species are passed to the end station 106. The controller 142, in one example, is operable to control various aspects of the ion implantation system 100. The controller 142 is operable to control, for example, the source power supply 122 for generating the ions and the extraction power supply 126. It will be appreciated that the controller 142 may include a processor, computer system, and / or computing device (e.g., a computer system in conjunction with inputs by a computing device) for overall control of the system 100.

[0064] According to one exemplary embodiment of the present disclosure, one or more extraction electrodes 132 have one or more electrode apertures 143 associated therewith, through which positively charged ions exit the plasma chamber 128 of the ion source 120, and the one or more electrode apertures form and / or focus the ion beam 114. It is understood that during operation of the ion implantation system 100, the extraction electrode optics 134 may be subject to wear caused by the ion beam 114, which may reduce the stability and efficiency of ion beam transport and thus contribute to so-called beam noise and variations in the width and / or height of the ion beam. The present disclosure understands that the extraction electrode optics are considered consumable parts due to such wear.

[0065] In another example, the ion implantation system 100 may further include an angular energy filter (AEF) 144 in a region downstream of the mass analyzer 136. The AEF 144 may include, for example, one or more AEF electrodes 146 or other structures configured to receive the ion beam 114 and subsequently deflect the ion beam 114 from the incident beamline axis. Over time, for example, the AEF electrodes 146 may also be subject to wear caused by the ion beam 114 in a manner similar to the extraction electrode optics 134.

[0066] Maintenance of the ion implantation system 100 may include, for example, disassembly, cleaning, and / or replacement of various components located along the beamline 148 of the ion implantation system, such as the extraction electrode optics 134 and the AEF electrodes. The present disclosure recognizes that repeatable, precise alignment of various parts after such maintenance is desirable to achieve reproducible implants. For example, the alignment of the extraction electrode 132 relative to the ion source 120 or the alignment of the AEF electrodes 146 along the beamline 148 can play a critical role in the stability and efficiency of transport of the ion beam 114. The present disclosure advantageously provides an architecture for various electrode devices within the ion implantation system 100, whereby repeatable, precise alignment (e.g., relative to the beamline 148) can be achieved during maintenance or replacement of electrode devices within the ion implantation system 100.

[0067] Figure 3 shows a generalized example of an electrode apparatus 200 that may be configured for use in the ion implantation system 100 of Figure 2 according to various aspects of the present disclosure. The electrode apparatus 200 of Figure 3 may be implemented, for example, in one or more of the extraction electrode 132, the AEF electrode 146, or other electrodes of the ion implantation system 100 of Figure 2 according to the present disclosure.

[0068] 3 includes, for example, a base plate 202 made of one or more of a refractory metal, such as tungsten (W), tantalum (Ta), molybdenum (Mo), and graphite. In this example, the base plate 202 includes a base plate aperture 204 defined therein. Note that the base plate aperture 204 may be of any size or shape and is not limited to the examples provided in this disclosure. The base plate 202 further includes, for example, at least one fixation region 206, whereby a fixation device 208 is associated with the at least one fixation region.

[0069] In one example, the first electrode rod 210 and the second electrode rod 212 are selectively coupled to the base plate 202 via a fastener 208, whereby the fastener selectively fixes the position of the first electrode rod and the second electrode rod relative to the base plate 202. While the first electrode rod 210 and the second electrode rod 212 are discussed in this example, it should be noted that various embodiments of the present disclosure are contemplated in which only the first electrode rod or the second electrode rod is selectively coupled to the base plate 202. In another alternative, additional electrode rods (not shown) may be selectively coupled to the base plate 202 in addition to the first and second electrode rods 210, 212.

[0070] In yet another alternative, although not shown, it should be understood that any number of base plates may be provided, whereby any number of electrode rods (e.g., one or more electrode rods) may be selectively coupled to any number of base plates. Accordingly, the electrode rods of the present disclosure may be configured to extract, accelerate, decelerate, bend, or focus charged particles, or otherwise control or modify their trajectories in one or more dimensions. Additionally, the electrode rods of the present disclosure may be configured to prevent charged particles from passing through or near the electrode rods.

[0071] The first and second electrode rods 210, 212 are made of, for example, one or more of a refractory metal and graphite. For example, the first and second electrode rods 210, 212 are made of one of tungsten (W), tantalum (Ta), molybdenum (Mo), or graphite, whereby the first and second electrode rods are formed, extruded, machined, bent, and / or cast into a predetermined shape. In one particular example, the first and second electrode rods 210, 212 are suitably formed from wire stock (e.g., tungsten wire), whereby the manufacturing costs of the first and second electrode rods are significantly reduced compared to manufacturing conventional optical systems formed from solid plates.

[0072] The first and second electrode rods 210, 212 are, for example, generally rigid and configured to maintain their respective predetermined shapes during normal maintenance and operation of the electrode device 200. For example, the first and second electrode rods 210, 212 have a cross-section sufficient to resist deformation and maintain their respective predetermined shapes when shipped, stored, installed, or used for operation of the electrode device 200, based on the materials selected for their construction. In one non-limiting example, the first and second electrode rods 210, 212 are circular in cross-section and have diameters that can range from about 1 mm to about 10 mm, whereby the selection of the diameter and shape of the electrode rods can be based on the particular application and / or environment in which the electrode rods will be implemented. For example, a circular cross-section of an electrode rod having a diameter of about 4 mm has been determined to be sufficiently sturdy to maintain a predetermined shape while providing sufficient manufacturability.

[0073] The first and second electrode rods 210, 212 have a predetermined shape to define an optical region 214 therebetween, for example, as described in further detail below. The optical region 214 in this example is associated with the base plate aperture 204 such that an electric potential 216 applied to the first and second electrode rods 210, 212 is configured to generally define a path, shape, or focus of an ion beam 218 (e.g., a plurality of charged particles) passing between the first and second electrode rods. The path, shape, or focus of the ion beam 218 is based, for example, on the electric potential 216 and the position and predetermined shape of the first and second electrode rods 210, 212.

[0074] The first and second electrode rods 210, 212 are generally positioned upstream of the base plate 202, for example, to prevent the optical regions 214 of the first and second electrode rods from being exposed to the ion beam 218 of the base plate, and therefore generally direct any wear to the first and second electrode rods rather than the base plate. The first and second electrode rods 210, 212 and their associated optics generally define the size and shape of the ion beam 218 for transport efficiency. In this way, if the first and second electrode rods 210, 212 wear over time due to beam strikes from the ion beam 218, the first and second electrode rods can be inexpensively replaced, while the base plate 202 can be reused repeatedly with relatively minor cleaning or maintenance due to minimal wear.

[0075] The potential 216 is, for example, the potential of the extraction power supply 126 (V Ex ), electrical ground, or other voltage source associated with the electrode apparatus 200. The electrical coupling 220 of Figure 3, for example, electrically couples the first and second electrode rods 210, 212 to the electrical potential 216. The electrical coupling 220 may include, for example, wiring or other electrical conduits electrically coupled to the first and second electrode rods 210, 212, such as connections through the fixation device 208 and the base plate 202.

[0076] Each of the first and second electrode rods 210, 212 includes, for example, an optical portion 222 and one or more mounting portions 224, and the fixture 208 selectively engages the one or more mounting portions to position the optical portion of each of the first and second electrode rods at respective predetermined positions 226, 228 relative to the base plate 202. The fixture 208 positions the first and second electrode rods 210, 212 so that, for example, when viewed along the path of the ion beam 218, at least the optical portions 222 of the first and second electrode rods are parallel to each other. The one or more mounting portions 224 of the first and second electrode rods 210, 212 are further associated, for example, with first and second ends 230, 232 of the first and second electrode rods, respectively. The fixation device 208 may include, for example, one or more fasteners 239 (e.g., one or more screws) configured to threadably engage the base plate 202 and maintain the position of the first and second electrode rods 210, 212 relative to the base plate.

[0077] 4 illustrates an electrode rod 240, which may be considered representative of one or more of the first and second electrode rods 210, 212 of FIG. 3. It should be noted that the configuration of the electrode rod 240 is provided by way of example only, and that various other shapes or configurations of electrode rods are contemplated as being within the scope of the present disclosure. Furthermore, it should be noted that while in one example the first and second electrode rods 210, 212 are equivalent, in other examples the shapes of the first and second electrode rods may differ from one another based on the desired shaping, focusing, steering, or other characteristics of the ion beam 218.

[0078] As shown in FIG. 4 , the mounting portion 224 of the electrode rod 240 includes respective elongated legs 242, 244 extending from the optical portion 222 of the electrode rod. The optical portion 222 of the electrode rod 240 in this example is curved, such that focusing or shaping of the ion beam 218 of FIG. 3 can be achieved based, at least in part, on the shape of the optical portion of the electrode rod. Furthermore, it should be noted that the length of each elongated leg 242, 244 and the radius or shape of the optical portion 222 can be adjusted to provide a desired gas conductance related to the shape and / or position of the electrode rod 240 relative to the base plate 202 of FIG. 3 or other components of the ion implantation system 100 of FIG. 2 , as will be discussed further below.

[0079] 5-6 illustrate an exemplary extraction optics 300 including a suppression electrode arrangement 302 and a ground electrode arrangement 304, from which various aspects of the present disclosure may be further understood. The suppression electrode arrangement 302 and the ground electrode arrangement 304 each include, for example, respective electrode arrangements 200 each configured to form, shape, or direct the ion beam 114 extracted from the ion source 120 of FIG. 2, whereby the suppression electrode arrangement and the ground electrode arrangement generally function as a lens and define the extraction electrode optics 134 described above.

[0080] 6 , for example, the suppression electrode device 302 is configured to repel or suppress high-energy electrons toward the extraction aperture 130 of the plasma chamber 128 of the ion source 120 to substantially prohibit the high-energy electrons from traveling along the beamline 148 of the ion beam 114. In one example, the suppression electrode rods 308, 310 are coupled to a suppression base plate 312 of the suppression electrode device 302, such that the suppression electrode rods 308, 310 are curved to optically match the extraction aperture 130. For example, the suppression electrode rods 308, 310 are provided with a curved suppression profile 314 to generally match the contour of the extraction aperture 130 of the ion source when viewed perpendicular to the beamline 148 (e.g., along the x-axis). Thus, the suppression electrode rods 308, 310 act as lenses to focus or steer the ion beam 114 in the vertical (y) direction.

[0081] For example, the front suppression surface 316 of the suppression base plate 312 of the suppression electrode apparatus 302 faces upstream toward the extraction aperture 130 of the ion source's plasma chamber 128. The curved suppression profile 314 of the suppression electrode rods 308, 310 is configured, for example, to optically match the extraction aperture 130, such that the curved suppression profile generally conforms to the extraction aperture's contour 318. Furthermore, the shape of the ion beam 114 can be controlled via the shape of the suppression electrode rods 308, 310 and the lensing effect associated with that shape.

[0082] The suppression electrode rods 308, 310 extend forward of the front suppression surface 316, as shown in FIG. 7, for example. Therefore, a lower pressure can be achieved between the suppression base plate 312 of the suppression electrode device 302 and the extraction opening 130 shown in FIG. 6 compared to conventional suppression plates. In this manner, the present disclosure reduces the likelihood of discharge due to significantly different voltages between the extraction opening 130 and the suppression base plate 312. The lower pressure results in a lower likelihood of discharge, as achieved according to Paschen's curve.

[0083] Similarly, the grounded electrode rods 320, 322, e.g., shown in Figure 8, are coupled to, e.g., the grounded base plate 324 of the grounded electrode arrangement 304, such that the grounded electrode rods are curved to optically match the suppression electrode arrangement 302. For example, when viewed perpendicular to the beamline 148 shown in Figure 5, the grounded electrode rods 320, 322 are provided with a curved ground profile 326 that generally matches the contours of the suppression electrode rods 308, 310, while extending forward of the front surface 328 of the grounded base plate 324 shown in Figure 6.

[0084] Thus, the grounded electrode rods 320, 322 of FIG. 8 further act as lenses, focusing or steering the ion beam 114 in the vertical (y) direction while again achieving a lower pressure between the suppression electrode apparatus 302 and the grounded electrode apparatus 304 of FIG. 6, thus again reducing the possibility of discharge due to significantly different voltages between the suppression electrode apparatus and the grounded electrode apparatus. Although not shown, for example, one or more electrical insulators can be provided between the suppression base plate 312 and the grounded base plate 324 of FIG. 6 to further limit the possibility of discharge therebetween. For example, the gap region 330 between the extraction opening 130 and the suppression base plate 312 and the grounded base plate 324 is expanded, thus reducing the pressure therein. Therefore, the length, shape, and configuration of the suppression electrode apparatus 302 and the grounded electrode apparatus 304 can be selected to optimize the desired optics and pressure in the gap region 330. This optimizes the mean free path of the gas in that region and limits undesired ionization of the gas, which could lead to premature system failure.

[0085] According to one embodiment of the present disclosure, an electrode device 400 is shown in FIGS. 9-10. In this example, the electrode device 400 may be configured as the suppression electrode device 302 of FIGS. 5-6. The electrode device 400 of FIGS. 9-10 includes, for example, a base plate 402 and a pair of electrode rods 404A, 404B, such that a cross-section 405 of the electrode device is shown in FIG. 10. In this example, the pair of electrode rods 404A, 404B of FIG. 9 are substantially identical. However, it should be understood that in other examples, the pair of electrode rods 404A, 404B may have different shapes from one another based on the desired optical characteristics to be achieved by the electrode device 400. Furthermore, although a pair of electrode rods 404A, 404B is described, any number of multiple electrode rods is contemplated as being within the scope of the present disclosure.

[0086] As an example, the base plate 402 includes at least one fastening region 406 for operably coupling a pair of electrode rods 404A, 404B to the base plate. As shown in FIG. 11 , for example, each of the base holes 408A-408D is associated with a respective elongated leg 410A-410D of the electrode rods 404A, 404B of FIG. 9 . The base holes 408A-408D of FIG. 11 each include, for example, a blind hole 412 having a predetermined depth 414, as shown in cross section 415 of FIG. 12 . Generally speaking, each base hole 408 is configured to receive a respective elongated leg 410 of a respective electrode rod 404, for example, as shown in FIG. 13 . In this example, the predetermined length 416 of the elongated leg 410 of each electrode rod 404 is configured to be fully inserted into the predetermined depth 414 of the respective base hole 408 in Figures 11-12, and the engagement between the elongated leg and the base hole allows for accurate and reproducible positioning of each electrode rod 404.

[0087] As shown in FIG. 12 , the fasteners 418 are configured to selectively secure each of the mounting portions 420 (e.g., the elongated legs 410 of FIG. 13 ) of the electrode rods 404 to the base plate 402. In some examples, one or more fasteners 418 are provided to selectively secure at least one elongated leg 410 of each electrode rod 404 of FIG. 13 to the base plate 402. For example, each elongated leg 410 of each electrode rod 404 may be selectively secured to the base plate via a respective fastener 418. In other examples, fewer fasteners 418 may be utilized, such as one fastener per electrode rod 404, as long as the fasteners 418 adequately and securely secure the electrode rods to the base plate 402. The fastening device 418 may include electrode fasteners 422, such as, for example, one or more set screws, that selectively and fixedly couple the electrode rod 404 to the base plate 402 via engagement with threaded holes 424 in the sidewalls 426 of the base plate. Thus, the optical portions 222 of the electrode rods 404A, 404B in FIG. 9 can be accurately and repeatably positioned, while still allowing for convenient replacement of the electrode rods for maintenance thereof.

[0088] FIG. 14 illustrates another example electrode device 500. In this case, the electrode device can be configured as the ground electrode device 304 of FIGS. 7-8. The electrode device 500 of FIG. 14 includes, for example, a base plate 502 and a pair of electrode rods 504A and 504B, resulting in a cross-section 505 of the electrode device shown in FIG. 15. The mounting portion 506 of the electrode rod 504B includes, for example, an elongated leg 508, which allows the optical portion 510 of the electrode rod to extend further from the base plate 502. Thus, in one example, a desired optical system can be achieved by positioning the optical portion 510 closer to the extraction opening 130 shown in FIG. 6. This allows the base plate 502 to be positioned farther from the extraction opening than in conventional systems. Furthermore, in addition to the cost savings associated with manufacturing the suppression electrode rod 310 and the ground electrode rod 322, the present disclosure also allows for variations in their spacing from the extraction opening 130.

[0089] It should be understood that the present disclosure contemplates various shapes of the various electrode rods disclosed herein, as well as selective coupling of the electrode rods to various base plates. For example, as shown in FIG. 15, a screw hole 520 is provided through a side wall 522 of a base plate 502 for engagement with an electrode fastener 524 (e.g., one or more screws). As shown in FIGS. 11-12, a screw hole 424 is provided in a side wall 426 of the base plate 402. Alternatively, although not shown, the screw hole can be provided on the front or rear surface of the base plate.

[0090] In yet another example, as shown in FIG. 16 , an electrode apparatus 600 is provided whereby one or more mounting members 602 are selectively coupled to a base plate 604 for selectively positioning an electrode rod 606 relative to the base plate 604. The electrode apparatus 600 is shown in cross section 608 in FIG. 17 whereby the one or more mounting members 602 selectively and fixedly position the electrode rod 606 relative to the base plate 604. The one or more mounting members 602 can include one or more through holes 610, as shown in FIG. 18 , for example, whereby one or more respective clamp screws 612, shown in FIG. 17 , selectively secure the one or more mounting members to threaded holes (not shown) in the base plate 604.

[0091] Additionally, the electrode rod 606 is selectively fixedly coupled to one or more mounting members 602 via one or more electrode fasteners 614 (e.g., one or more set screws) in a manner similar to that described above. For example, the one or more electrode fasteners 614 threadably engage threaded holes 616 in each of the one or more mounting members 602. Thus, an electrode rod assembly 618 may be provided whereby the electrode rod 606 is pre-positioned relative to the one or more mounting members 602, as shown in FIG. 18 . In this manner, the electrode rod assembly 618 allows for replacement of the electrode rod 606 by replacing the electrode rod assembly as a unit, whereby the electrode rod is pre-positioned relative to the one or more mounting members, thus allowing for quick, inexpensive, and accurate maintenance of the electrode device.

[0092] Thus, the electrode rod 606 can be secured to the one or more mounting members 602 in a predetermined orientation before being coupled to the base plate, such that the one or more mounting members allow for easy and accurate positioning of the electrode rod relative to the base plate 604 of Figures 16-17. In this manner, the electrode rod 606 and the one or more mounting members 602 can be pre-configured to quickly couple the electrode rod assembly 618 to the base plate 604 in an accurate and repeatable manner.

[0093] According to another example, as shown in FIG. 19, an elongated leg 620 of an electrode rod 606 is provided. In this example, one or more positioning flats 622, 624 are provided for precise positioning of the electrode rod, for example, relative to one or more mounting members 602 of FIG. 18. The one or more positioning flats 622, 624 position the electrode rod 606 in a predetermined position, for example, so that the electrode rod does not rotate and remains in place regardless of heating and cooling of the electrode rod and / or base plate 604. The present disclosure further understands that the positioning flats 622, 624 may be provided in combination with any of the aforementioned electrode rods relative to the base plate.

[0094] 20-21 show multiple views of another electrode device 700. In this example, first and second clamping members 702, 704 are configured to selectively secure mounting portions 706 of first and second electrode rods 708, 710, respectively. The first and second electrode rods 708, 710 may have a configuration similar to, for example, the electrode rod 240 shown in FIG.

[0095] 22-23 further illustrates a first clamping member 702 and a second clamping member 704. In this example, the first clamping member and the second clamping member may be selectively coupled or secured to a base plate 712, such as via one or more screws or fasteners (not shown) associated with one or more plate engagement regions 714. Thus, the electrode device 700 is further configured to selectively and fixedly position the first electrode rod 708 and the second electrode rod 710 relative to the base plate 712.

[0096] In this embodiment, the first clamping member 702 and the second clamping member 704 are generally identical to one another, and further, the first electrode rod 708 and the second electrode rod 710 of FIGS. 20-23 are identical to one another. In this manner, various efficiencies in the manufacture and implementation of the components may be advantageously achieved. However, although not shown, it should be noted that other configurations are contemplated, such as the first clamping member 702 and the second clamping member being mirror images of one another or otherwise different from one another. Similarly, although not shown, the first electrode rod 708 and the second electrode rod 710 may have different configurations from one another.

[0097] According to one example, first clamp member 702 is shown in more detail in FIG. 24 and is generally referred to as clamp member 715. In this example, clamp member 715 may be considered a further example of any of first and second clamp members 704 of FIGS. 20-23. As shown in FIG. 24, clamp member 715 includes, for example, a first cantilever member 716 and a second cantilever member 718 extending from a base portion 720 of the first clamp member. A central member 722 of clamp member 715 further extends from, for example, base portion 720, thereby defining a first gap 724 and a second gap 726 between central member 722 and the respective first and second cantilever members 716, 718.

[0098] The clamping member 715 further includes a first engagement portion 728 and a second engagement portion 730 associated with, for example, the first electrode rod 708 and the second electrode rod 710, respectively, of FIGS. 20-23. As shown in more detail in FIG. 25, the first engagement portion 728 is configured to selectively engage the mounting portion 706 of the first electrode rod 708, and the second engagement portion 730 is configured to selectively engage the mounting portion of the second electrode rod (not shown in FIG. 25 for clarity). The mounting portion 706 (shown for the first electrode rod 708 in FIG. 25) has, for example, a rod diameter 732 associated therewith, whereby the engagement diameters 734 associated with, for example, the first engagement portion 728 and the second engagement portion 730 are configured to contact and selectively secure the respective first and second electrode rods (not shown) to the clamping member 702. Thus, the first cantilever member 716, the second cantilever member 718, and the central member 722 generally define a fixation device 736 configured to selectively fix the first electrode rod 708 and the second electrode rod 710 to the clamp member 702 at the fixation region 737.

[0099] FIG. 26 illustrates the clamping member 702 in isolation. In this example, the engagement diameters 734 of the first and second engagement portions 728, 730 are shown in more detail. The securing device 736 further includes, for example, first and second stop members 738, 740 associated with the respective first and second cantilever members 716, 718, such that stop surfaces 742, shown in FIG. 27, are associated with the respective first and second stop members and configured to selectively contact end surfaces 744 of the respective first and second electrode rods 708, 710, as shown in FIG. 28. In this example, the first and second stop members 738, 740 of FIG. 27 are fixed relative to the central member 722. In this example, the stop surfaces 742 are generally recessed from a top surface 746 of the central member by a recess distance 748. In this manner, the stop surfaces 742 of the central member 722 are configured to cooperate with the first and second engagement portions 728, 730 of the respective first and second cantilever members 716, 718 to contact and selectively secure the respective first and second electrode rods 708, 710 of Figures 20-23 to the clamping member 702.

[0100] 28 shows another view of clamping member 702. In this example, fixation device 736 is further configured to selectively engage one or more of first cantilever member 716, second cantilever member 718, and central member 722 to selectively push or pull one or more of the first and second cantilever members toward or away from the central member along fixation axis 750. Selective pushing or pulling of first and second cantilever members 716, 718 toward or away from central member 722 selectively clamps, fixes, or otherwise fixes the position of first and second electrode rods 708, 710 to clamping member 702, for example.

[0101] In one example, the first cantilever member 716 and the second cantilever member 718 are generally resilient, and selective compression of the first cantilever member 716 and the second cantilever member 718 toward the central member 722 may be achieved by sizing the engagement diameter 734 relative to the rod diameter 732 shown in Figures 25 and 26. In an arrangement in which the engagement diameter 734 is smaller than the rod diameter 732, the fixation device 736 may include, for example, a first locking screw 752 and a second locking screw 754, whereby the first and second locking screws threadably engage the respective first cantilever member 716 and second cantilever member 718. Thus, when the first and second locking screws 752, 754 are threaded into the respective first and second cantilever members 716, 718 and abut against the central member 722, the respective first and second cantilever members are configured to resiliently deflect and extend from or retract toward the central member based on the threaded engagement therebetween.

[0102] Thus, in this example, tightening the first and second set screws 752, 754 can pull up the first and second cantilever members 716, 718 along the fixed axis 750 to allow insertion of the first and second electrode rods 708, 710, respectively, into the first and second engagement portions 728, 730 of the clamp member 702. Furthermore, due to the resilience of the first and second cantilever members 716, 718, loosening the first and second set screws 752, 754 can cause the first and second cantilever members 716, 718 to retract toward each other along the fixed axis 750, selectively retaining the first and second electrode rods 708, 710, respectively, within the clamp member 702. Thus, for example, the first gap 724 and second gap 726 shown in FIG. 26 are selectively controlled to selectively position and secure the first electrode rod 708 and second electrode rod 710 of FIG. 28 between the central member 722 and the respective first cantilever member 716 and second cantilever member 718.

[0103] It should be noted that the present disclosure contemplates that the first and second locking screws 752, 754 threadably engage the central member 722, and that the first and second cantilever members 716, 718 include through holes (not shown) configured to allow the first and second locking screws to move and rotate freely relative to the fixed axis 750. As such, the engagement diameter 734 may be provided as being greater than or approximately equal to the rod diameter 732, such that the first and second locking screws 752, 754, when tightened, urge the first and second cantilever members 716, 718 toward each other along the fixed axis 750, thereby selectively retaining the respective first and second electrode rods 708, 710 within the clamp member 702.

[0104] The present disclosure contemplates the fixation device 736 including a variety of fixation mechanisms. The present disclosure is not limited by the illustrated configuration in which the first fixation screw 752 and the second fixation screw 754 raise and lower the first cantilever member 716 and the second cantilever member 718 along the fixation axis 750. For example, the present disclosure contemplates the fixation device 736 including a variety of cams, screws, nuts, levers, or other mechanisms configured to selectively lower or raise the first cantilever member 716 and the second cantilever member 718 along the fixation axis 750.

[0105] Therefore, the present disclosure provides for replacing the electrode optics with a machined or otherwise formed rod-shaped refractory metal rod or graphite to reduce electrode costs. In this manner, electrodes that experience wear or buildup can be replaced and / or discarded after use, thereby maintaining desired ion beam transport characteristics while minimizing maintenance and operational costs. Furthermore, by maintaining desired ion beam transport characteristics, the present disclosure provides a more stable ion beam than conventional methods, thereby improving implant uniformity and mitigating particle contamination in the workpiece.

[0106] It should be noted that the present disclosure contemplates that the electrodes disclosed herein are applicable in a variety of scenarios in which the transport of charged particles is desired. For example, the present disclosure contemplates that the electrodes disclosed herein are configured to guide, shape, extract, accelerate, decelerate, and / or focus any number of charged particles in one or more dimensions, and are particularly applicable to ion beams containing a plurality of charged particles or ions. The present disclosure further contemplates that the electrodes disclosed herein, in various embodiments, are configured to prevent charged particles from passing through the electrodes. For example, various electrodes disclosed herein are contemplated to be configured to prevent backflow of charged particles between two sets of electrodes. In one example, primary and secondary electrodes of opposite polarity can be configured along a path in which the primary electrode is located downstream of the secondary electrode. This can generally prevent, for example, positive ions or electrons from flowing back from the primary electrode to the secondary electrode.

[0107] While the present invention has been shown and described with respect to certain preferred embodiments, equivalent alterations and modifications will occur to those skilled in the art upon reading and understanding this specification and the accompanying drawings. In particular, with respect to the various functions performed by the above-described components (assemblies, devices, circuits, etc.), the terms used to describe such components (including references to "means") are intended, unless otherwise indicated, to correspond to any component that performs the designated function of the described component (i.e., is functionally equivalent), even if it is not structurally equivalent to the disclosed structure that performs that function in the exemplary embodiment of the present disclosure illustrated herein. In addition, while a particular configuration of the present disclosure may be disclosed with respect to only one of multiple embodiments, such configuration can be combined with one or more other configurations of other embodiments, as may be desired and advantageous for any given or particular application. [Brief explanation of the drawings]

[0108] [Figure 1] 1 shows an enlarged perspective view of a conventional optical system for an ion implantation system. [Figure 2] 1 shows a schematic diagram of an ion implantation system according to various embodiments of the present disclosure. [Figure 3] 1 shows a front view of an electrode device according to various embodiments of the present disclosure. [Figure 4] 1 illustrates a side view of an electrode rod according to various embodiments of the present disclosure. [Figure 5] 1 shows a front view of an extraction electrode device according to various embodiments of the present disclosure. [Figure 6] 6 shows a cross-sectional side view of the extraction electrode apparatus of FIG. 5 according to various embodiments of the present disclosure. [Figure 7] 1 shows a front perspective view of a suppression electrode device according to various embodiments of the present disclosure. [Figure 8] 1 illustrates a front perspective view of a ground electrode apparatus according to various embodiments of the present disclosure. [Figure 9] 1 illustrates a front view of a suppression electrode device according to various embodiments of the present disclosure. [Figure 10] 10 shows a cross-sectional side view of the suppression electrode device of FIG. 9 according to various embodiments of the present disclosure. [Figure 11] 1 illustrates a front view of a suppression electrode base plate according to various embodiments of the present disclosure. [Figure 12] 12 illustrates a cross-sectional side view of the suppression electrode baseplate of FIG. 11 in accordance with various embodiments of the present disclosure. [Figure 13] 1 illustrates a side view of a suppression electrode rod according to various embodiments of the present disclosure. [Figure 14] 1 illustrates a front view of a ground electrode apparatus according to various embodiments of the present disclosure. [Figure 15] 15 illustrates a cross-sectional side view of the ground electrode apparatus of FIG. 14 according to various embodiments of the present disclosure. [Figure 16] 1 shows a front view of another electrode device according to various embodiments of the present disclosure. [Figure 17] 17 shows a cross-sectional side view of the extraction electrode apparatus of FIG. 16 according to various embodiments of the present disclosure. [Figure 18]1 shows a front view of an electrode rod assembly according to various embodiments of the present disclosure. [Figure 19] 1 illustrates a side view of a portion of an electrode rod, according to various embodiments of the present disclosure. [Figure 20] 1 shows a top front perspective view of another electrode device according to various embodiments of the present disclosure. [Figure 21] 21 shows a bottom front perspective view of the electrode device of FIG. 20 according to various embodiments of the present disclosure. [Figure 22] 1 shows a top front perspective view of an electrode device in association with a base plate, according to various embodiments of the present disclosure. [Figure 23] 23 shows a bottom front perspective view of the electrode device of FIG. 22 according to various embodiments of the present disclosure. [Figure 24] 1 illustrates a bottom perspective view of a clamping member according to various embodiments of the present disclosure. [Figure 25] 1A and 1B show plan views of a clamping member and an electrode rod according to various embodiments of the present disclosure. [Figure 26] 10A and 10B show plan views of clamping members without electrode rods, according to various embodiments of the present disclosure. [Figure 27] 27 illustrates a front view of the clamping member of FIG. 26 according to various embodiments of the present disclosure. [Figure 28] 10A-10C illustrate bottom views of clamping members with electrode rods according to various embodiments of the present disclosure.

Claims

1. 1. An electrode apparatus for an ion implanter, comprising: The electrode device is a base plate having a base plate opening defined therein, said base plate including at least one fastening region; a fixation device associated with each of the at least one fixation area; a plurality of electrode rods selectively coupled to the base plate via the fasteners, the plurality of electrode rods having predetermined shapes for defining optical regions therebetween, the optical regions being associated with the base plate apertures; and an electrical coupling electrically coupled to the plurality of electrode rods and configured to electrically connect to an electric potential, the plurality of electrode rods having a predetermined shape configured to define a path of an ion beam passing between the plurality of electrode rods based on the electric potential.

2. each of the plurality of electrode rods includes an optical portion and one or more attachment portions; The electrode device of claim 1 , wherein the fixation device selectively engages one or more of the mounting portions to position the optical portion of each of the plurality of electrode rods in a predetermined position relative to the base plate.

3. 3. The electrode device of claim 2, wherein one or more of the mounting portions are associated with corresponding first and second ends of each of the plurality of electrode rods.

4. The electrode device of claim 3 , wherein one or more of the mounting portions each include an elongated leg extending from the optic portion of each of the plurality of electrode rods.

5. the base plate includes base holes configured to selectively receive corresponding elongated legs of each of the plurality of electrode rods; the fixation device includes an electrode fastener respectively associated with at least one elongated leg of each electrode rod; The electrode device of claim 4 , wherein the electrode fasteners are configured to selectively secure each of the elongated legs to the base plate.

6. The electrode apparatus of claim 5 , wherein the electrode fastener comprises a set screw.

7. each corresponding base hole is a blind hole having a predetermined depth; The electrode device of claim 5 , wherein the predetermined depth defines the predetermined position of the optic portion of each of the plurality of electrode rods relative to the base plate.

8. the fixation device includes a mounting plate; one or more of the mounting portions of each of the plurality of electrode rods are selectively coupled to the mounting plate; The electrode device of claim 4 , wherein the mounting plate is selectively coupled to the base plate at at least one of the fastening regions.

9. the mounting plate includes at least one mounting hole configured to selectively receive one of the first end and the second end of each of the plurality of electrode rods; the fixation device includes an electrode fastener respectively associated with at least one elongated leg of each electrode rod; the electrode fasteners are configured to selectively secure at least one elongated leg to the mounting plate; The electrode device of claim 8 , wherein the securing device further includes at least one mounting plate fastener configured to selectively secure the mounting plate to the base plate.

10. the base plate includes at least one threaded base hole configured to respectively receive at least one of the mounting plate fasteners; The electrode apparatus of claim 9 , wherein at least one of the mounting plate fasteners comprises a screw.

11. The electrode apparatus of claim 10 , wherein the electrode fastener comprises a set screw.

12. the fixation device includes a clamping member having a central member and one or more cantilever members each spaced one or more predetermined gaps from the central member; 5. The electrode device of claim 4, wherein the clamping member is configured to selectively control one or more of the predetermined gaps to selectively position and secure each of the plurality of electrode rods between one or more of the cantilever members and the central member.

13. 13. The electrode apparatus of claim 12, wherein the clamping member further includes one or more stop members configured to selectively contact the corresponding first and second ends of each of the plurality of electrode rods, thereby controlling the position of each of the plurality of electrode rods relative to the clamping member.

14. The electrode device of claim 2 , wherein the optical portion of each of the plurality of electrode rods is curved.

15. The electrode device of claim 1 , wherein the electrode rods are parallel to one another when viewed along the path of the ion beam.

16. each of the plurality of electrode rods is made of one or more of a refractory metal or graphite; 10. The electrode device of claim 1, wherein the base plate is made of one or more of a refractory metal or graphite.

17. a plurality of said electrode rods defining a suppression electrode disposed downstream of an extraction aperture of the ion source; The electrode device of claim 1 , wherein the potential is a predetermined non-zero voltage.

18. a plurality of said electrode rods defining a ground electrode; The electrode device of claim 1 , wherein the electrical potential is a source of electrical ground.

19. 2. The electrode device of claim 1, wherein the plurality of electrode rods are made of one of tungsten (W), tantalum (Ta), molybdenum (Mo), or graphite.

20. 1. An electrode assembly for an ion implantation system, comprising: The electrode assembly comprises: A base plate and a plurality of rods selectively operably coupled to the base plate, the plurality of rods being spaced apart a predetermined distance from one another, the predetermined distance being related to a width of an ion beam extracted from the ion source.

21. 1. An electrode assembly for controlling an ion beam in an ion implantation system, comprising: The electrode assembly comprises: a base plate including at least one fastening region; one or more electrode rods having one or more predetermined shapes, the one or more predetermined shapes being related to desired characteristics of the ion beam; an anchoring device configured to selectively couple one or more of the electrode rods to at least one of the anchoring regions of the base plate, the anchoring device including a clamping member having a central member and one or more cantilever members each positioned at one or more predetermined gaps from the central member, the clamping member configured to selectively control each of the one or more predetermined gaps to selectively position and secure the one or more electrode rods between the one or more cantilever members and the central member, respectively.

22. 22. The electrode assembly of claim 21, wherein the clamping member further includes one or more stop members configured to selectively contact respective ends of the one or more electrode rods, thereby controlling the positions of the one or more electrode rods, respectively.

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