3D integrated imaging device and its manufacturing method

Abstract

This application relates to the field of printing technology, and specifically to a 3D integrated imaging device and a manufacturing method thereof. The 3D integrated imaging device includes a 3D structure layer, a spacer layer, and a microlens array. The spacer layer has a predetermined thickness. The 3D structure layer is disposed on one surface of the spacer layer, and the 3D structure layer includes a plurality of micro-nano structure units. The microlens array is disposed on the surface of the spacer layer away from the 3D structure layer. The microlens array includes a plurality of microlenses, and the micro-nano structure units correspond one-to-one to the microlenses. The normal viewing pattern of the micro-nano structure units is a superposition of images captured by the microlenses with different depths of field after a target 3D image is layered. The distance between the vertices of the microlens array and the 3D structure layer can be controlled by controlling the thickness of the spacer layer, which further controls the depth of field of the image and adjusts the depth of field effect of the reproduced image.

Description

[Technical Field]

[0001] This application relates to the field of printing technology, and more particularly to 3D integrated imaging devices and methods for manufacturing the same. [Background technology]

[0002] Because there is a certain distance between the human eyes, a certain angle is formed between the left and right eyes and objects, and there are slight differences between the objects seen by the left and right eyes, resulting in parallax. When this parallax is reflected in the brain, a spatial three-dimensional sensation is created. The 3D naked-eye display effect based on a microlens array is the result of the combined optical effect between the microlens array and the micropics array and the human binocular vision. When the microlens array and the micropics array are superimposed on each other, based on the binocular parallax principle, the viewer can directly see a 3D image with the naked eye. However, currently, when performing 3D naked-eye display using a microlens array, the display effect of a reconstructed image is common. Summary of the Invention [Problem to be solved by the invention]

[0003] Based on this, it is necessary to provide a 3D integrated imaging device and a manufacturing method thereof to address the above problems. [Means for solving the problem]

[0004] According to a first aspect of an embodiment of the present application, there is provided a 3D integrated imaging device, comprising: a spacer layer having a predetermined thickness; a three-dimensional structure layer provided on one surface of the spacer layer, the three-dimensional structure layer including a plurality of micro-nano structure units; a microlens array provided on a surface of the spacer layer away from the three-dimensional structure layer, the microlens array including a plurality of microlenses; The micro-nanostructure units correspond one-to-one to the microlenses, and the normal viewing pattern of the micro-nanostructure units is a superposition of images captured by the microlenses after the target stereoscopic image is layered, with each layer having a different depth of field.

[0005] In one embodiment, the spacer layer is made of a light-transmitting material, and the material of the spacer layer is the same as the material of the microlens array layer.

[0006] In one embodiment, a reflective material layer is provided on one side of the microlens array that faces away from the spacer layer.

[0007] In one embodiment thereof, the sum of the thickness of the spacer layer and the thickness of the microlens is greater than the focal length of the microlens.

[0008] In one embodiment thereof, the predetermined thickness is between 1 micrometer and 200 micrometers.

[0009] In one embodiment, the microlens array includes plano-convex lenses arranged in an array, and the arrangement of the plano-convex lenses includes an orthogonal array or a honeycomb array.

[0010] In one embodiment, the relationship between pixel coordinates in a three-dimensional coordinate system of an image after layering the target stereoscopic image of a single microlens and pixel coordinates in the stereoscopic structure layer is as follows: JPEG2026500677000002.jpg31170Here, (X,Y) are the pixel coordinates in the three-dimensional coordinate system of the layered image, (X0,Y0) are the center coordinates of the microlens, (x,y) are the coordinates of each pixel point in the micro-nanostructure unit, (x0,y0) are the center coordinates of the micro-nanostructure unit, n is the refractive index of the microlens, g is the thickness of the spacer layer plus the height of the microlens in the microlens array, and d is the depth of field, that is, the distance from the plane on which the layered image is located to the vertex of the microlens.

[0011] According to a second aspect of an embodiment of the present application, there is provided a method for manufacturing a 3D integrated imaging device, comprising: simulating to form a three-dimensional coordinate system; transforming pixel coordinates in the three-dimensional coordinate system of the three-dimensional object into pixel coordinates on a recording plane; forming a three-dimensional structure layer on one surface of the substrate based on pixel coordinates on the recording plane; providing a spacer layer on a surface of the three-dimensional structure layer away from the substrate; and providing a microlens array on a surface of the spacer layer away from the three-dimensional structure layer.

[0012] In one embodiment thereof, the step of converting pixel coordinates in the three-dimensional coordinate system of the three-dimensional object into pixel coordinates on a recording plane comprises: layering the three-dimensional object to form a plurality of planar object images; setting different depth of field values ​​for different planar object images; and converting pixel coordinates in the three-dimensional coordinate system of each object image into pixel coordinates on a recording plane based on the depth of field of the plane on which each object image is located and parameters of the microlens array.

[0013] In one embodiment, the setting of the depth of field value further includes calculating a reference value d0 of the depth of field, where d0 is expressed by the following formula: JPEG2026500677000003.jpg14170, where d0 is the reference value of the depth of field, P1 is the period of the microlenses, f is the focal length of the microlenses, and P p is the resolution of the pixel point on the recording plane, n is the number of pixels in the microlens, After the step of transforming coordinates in the three-dimensional coordinate system of the three-dimensional target object into coordinates on a recording plane, the manufacturing method further comprises: adjusting coordinates on the recording plane according to the following mapping relationship: JPEG2026500677000004.jpg25170JPEG2026500677000005.jpg61170

[0014] In one embodiment, the step of forming a three-dimensional structure layer on one surface of the substrate based on pixel coordinates on the recording plane includes: forming a plurality of micro-nano structure units on a surface of one side of a substrate according to pixel coordinates on the recording plane; and filling the surface of the substrate on which the plurality of micro-nano structure units are formed with a coloring material.

[0015] In one embodiment thereof, after the step of forming a three-dimensional structure layer on one surface of the substrate based on pixel coordinates on the recording plane, the method further includes a step of peeling off the substrate. [Effects of the Invention]

[0016] The manufacturing method of the 3D integrated imaging device provided in this embodiment involves first simulating a three-dimensional coordinate system, then converting the pixel coordinates in the three-dimensional coordinate system of the three-dimensional target object that needs to be reproduced into pixel coordinates on the recording plane, and then forming a three-dimensional structure layer with a three-dimensional pattern having light and dark contrast on one surface of the substrate based on the pixel coordinates on the recording plane. A spacer layer and a microlens array are sequentially provided on the three-dimensional structure layer, and the three-dimensional structure layer and the microlens array work together to enable the observation of a 3D image at a corresponding observation position. The distance between the vertex of the microlens array and the three-dimensional structure layer can be controlled by controlling the thickness of the spacer layer, which further controls the depth of field of the image and has the function of adjusting the depth of field effect of the reproduced image. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a structural schematic diagram of a 3D integrated imaging device provided by an embodiment of the present application; [Figure 2] FIG. 2 is a structural schematic diagram of a 3D integrated imaging device provided by another embodiment of the present application. [Figure 3] 1 is a schematic diagram of an imaging device according to an embodiment of the present application; [Figure 4] FIG. 2 is a structural schematic diagram of a 3D integrated imaging device provided by another embodiment of the present application. [Figure 5] 1 is a flowchart of a method for manufacturing a 3D integrated imaging device according to an embodiment of the present application. [Figure 6] 1A and 1B are schematic diagrams of a single microlens recorded image and a reconstructed image. [Figure 7] FIG. 1 is a schematic diagram of object image recording using a microlens array. [Figure 8] FIG. 1 is a schematic diagram of object image recording using a microlens array. DETAILED DESCRIPTION OF THE INVENTION

[0018] To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings, in which preferred embodiments of the present application are shown. However, the present application may be embodied in many different forms and is not limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more complete and comprehensive understanding of the present disclosure.

[0019] In this application, unless otherwise clearly specified or limited, the terms "attached," "coupled," "connected," "fixed," etc. should be understood in a broad sense, and for example, unless otherwise limited, they may mean a fixed connection, a detachable connection, or an integral unit, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, an internal communication between two elements, or an interactive relationship between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application based on specific circumstances.

[0020] The terms "first" and "second" are used for descriptive purposes only and cannot be understood to indicate or imply the relative importance or number of the indicated technical features. Thus, a feature qualified by "first" or "second" can explicitly or implicitly include at least one of the feature. In the description of this application, unless otherwise clearly and specifically limited, "plurality" means at least two, e.g., two, three, etc.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one skilled in the art of this application. The terms used herein are for the purpose of describing specific examples only and are not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0022] In one embodiment, referring to FIG. 1 , a 3D integrated imaging device is provided, comprising a 3D structure layer 200, a spacer layer 300, and a microlens array 400. Here, the spacer layer 300 has a predetermined thickness, and the 3D structure layer 200 is disposed on one surface of the spacer layer 300, and the 3D structure layer 200 comprises a plurality of micro-nano structure units 210. The microlens array 400 is disposed on the surface of the spacer layer 300 away from the 3D structure layer 200, and the microlens array 400 comprises a plurality of microlenses, and the micro-nano structure units 210 correspond one-to-one to the microlenses. The normal viewing pattern of the micro-nano structure units 210 is a superposition of images captured by microlenses with different depths of field after the target 3D image is layered. That is, the microlens array 400 and the 3D structure layer 200 cooperate to provide a 3D display effect. Under the action of light, an observer can stand at the observation position and observe a 3D reconstructed image of the pattern on the three-dimensional structure layer 200 after it passes through the microlens array 400. By controlling the thickness of the spacer layer 300, the distance between the vertices of the microlens array 400 and the three-dimensional structure layer 200 can be controlled, which further controls the depth of field of the reconstructed image and adjusts the depth of field effect of the reconstructed image. The thicker the spacer layer 300, the smaller the depth of field of the reconstructed image, and the thinner the spacer layer 300, the larger the depth of field of the reconstructed image.

[0023] In practical applications, the thickness of the spacer layer 300 can be set according to actual needs. In one embodiment, the preset thickness of the spacer layer 300 can be set between 1 micrometer and 200 micrometers, and can be 1 micrometer, 20 micrometers, 50 micrometers, 200 micrometers, etc., and can be determined based on the actual depth of field display effect.

[0024] In this embodiment, the sum of the thickness of the spacer layer 300 and the thickness of the microlens is greater than the focal length of the microlens, thereby ensuring the reproduction of an image. Specifically, the thickness of the spacer layer 300 can be set according to imaging needs, and a certain condition must be met between the sum of the thickness of the spacer layer 300 and the microlens and the focal length of the microlens to achieve a desired display effect. If the sum of the thickness of the spacer layer 300 and the microlens is greater than the focal length of the microlens but less than twice the focal length, a virtual image will be generated. If the sum of the thickness of the spacer layer 300 and the microlens is greater than twice the focal length, a real image will be generated.

[0025] Here, the spacer layer 300 is made of a light-transmitting material, and for example, a transparent film layer such as a PET thin film can be used as the spacer layer 300. In this embodiment, the material of the spacer layer 300 may be the same as the material of the microlens array layer 400.

[0026] The 3D integrated imaging device provided in this embodiment may be either a transmissive type or a reflective type. Referring to FIGS. 2 to 4, the surface of the three-dimensional structure layer 200 facing away from the spacer layer 300 may include a substrate 100. Referring to FIGS. 2 and 3, in the case of a transmissive type, the substrate 100 may be made of a light-transmitting material, which may include a material such as a UV adhesive. A viewer can observe a stereoscopically reproduced image on either the substrate 100 side or the microlens array 400 side (the figure only shows the microlens array 400 side as the observation position), thereby achieving a transmissive 3D effect. Referring to FIG. 4, in the case of a reflective type, the substrate 100 may be made of an opaque material, and a reflective material layer 600 may be provided on one side of the microlens array 400 facing away from the spacer layer 300. The reflective material layer 600 may be aluminum-plated. A viewer can observe a stereoscopically reproduced image on the substrate 100 side, thereby achieving a reflective 3D effect.

[0027] In this embodiment, the three-dimensional structure layer 200 is formed on the surface of the substrate 100. Specifically, techniques such as photolithography and transfer can be used to form a three-dimensional uneven pattern (i.e., micro-nano structure unit 210) on the surface of the substrate 100, and the pits are filled with a coloring material, such as ink, to form a three-dimensional pattern with light and dark contrast.

[0028] In one embodiment, the microlens array 400 includes plano-convex lenses arranged in an array, and the plano-convex lenses are arranged in an orthogonal array or a honeycomb array. The diameter of the plano-convex lenses may be between 10 micrometers and 250 micrometers. When the plano-convex lenses are arranged in an orthogonal array, the arrangement period of the plano-convex lenses in both the X and Y directions is the same and is equal to or greater than the diameter of the plano-convex lenses. When the plano-convex lenses are arranged in a honeycomb array, the arrangement period of the plano-convex lenses in both the X and Y directions is different. When the microlens array 400 is arranged in a honeycomb array, more precise imaging is possible.

[0029] In one embodiment, the relationship between pixel coordinates in the three-dimensional coordinate system of the image after the target three-dimensional image of a single microlens is layered and pixel coordinates in the three-dimensional structure layer 200 can be expressed as follows: JPEG2026500677000006.jpg30170 where (X,Y) are pixel coordinates in the three-dimensional coordinate system of the layered image, (X0,Y0) are the center coordinates of the microlens, (x,y) are the coordinates of each pixel point in the micro-nanostructure unit 210, (x0,y0) are the center coordinates of the micro-nanostructure unit 210, n is the refractive index of the microlens, g is the thickness of the spacer layer 300 plus the height of the microlens in the microlens array 400, and d is the depth of field, i.e., the distance from the plane on which the layered image is located to the vertex of the microlens. This formula applies to the image of each layer after layering.

[0030] In another embodiment, referring to FIG. 5, a method for manufacturing a 3D integrated imaging device is provided, including the following steps.

[0031] In step S100, a three-dimensional coordinate system is formed by simulation.

[0032] First, based on the parameters of the microlens array 400, a three-dimensional coordinate system in space can be simulated through a computer, and the position information of the three-dimensional target object can then be determined.

[0033] In step S200, pixel coordinates in the three-dimensional coordinate system of the three-dimensional object are converted to pixel coordinates on the recording plane 500.

[0034] After simulating the three-dimensional coordinate system, the pixel coordinates of the three-dimensional object in the three-dimensional coordinate system can be determined, where the three-dimensional object is the object whose image needs to be reproduced in actual applications. Then, the pixel coordinates of the three-dimensional object are converted into pixel coordinates on the recording plane 500, specifically, black and white dot matrix data can be formed on the recording plane 500, with white indicating that pixel data exists at that position on the recording plane 500 and black indicating that pixel data does not exist at that position on the recording plane 500.

[0035] In step S300, the three-dimensional structure layer 200 is formed on one surface of the substrate 100 based on pixel coordinates on the recording plane 500.

[0036] After determining the pixel coordinates on the recording plane 500, they can be transferred to the surface of the substrate 100 to form the three-dimensional structure layer 200. Specifically, a three-dimensional pattern corresponding to the pixel coordinates on the recording plane 500 is formed on the surface of the substrate 100 by techniques such as photolithography or transfer, and then ink is filled in so as to have a light-dark contrast with respect to the three-dimensional pattern, thereby forming the three-dimensional structure layer 200.

[0037] In step S400, a spacer layer 300 is provided on the surface of the three-dimensional structure layer 200 that faces away from the substrate 100.

[0038] After the three-dimensional structure layer 200 is formed, a spacer layer 300 having a predetermined thickness can be formed on its surface, where the thickness of the spacer layer 300 can be determined according to the actual depth of field display needs. The thicker the spacer layer 300, the smaller the depth of field of the reproduced image will be, and the thinner the spacer layer 300, the larger the depth of field of the reproduced image will be.

[0039] In step S500, a microlens array 400 is provided on the surface of the spacer layer 300 that faces away from the three-dimensional structure layer 200.

[0040] Finally, a microlens array 400 is provided on the surface of the spacer layer 300, which can use light to reconstruct an image of a three-dimensional object within a predetermined distance from the 3D integrated imaging device. The microlens array 400 includes plano-convex lenses arranged in an array, and the plano-convex lenses can be arranged in an orthogonal or honeycomb pattern. The sum of the thickness of the microlens and the thickness of the spacer layer 300 is generally greater than one times the focal length of the microlens to meet imaging requirements.

[0041] The manufacturing method of the 3D integrated imaging device provided in this embodiment first simulates a three-dimensional coordinate system, and then converts the pixel coordinates in the three-dimensional coordinate system of the three-dimensional target object to be reproduced into pixel coordinates on the recording plane 500. Then, based on the pixel coordinates on the recording plane 500, a three-dimensional structure layer 200 with a three-dimensional pattern having a light-dark contrast is formed on the surface of the substrate 100. A spacer layer 300 and a microlens array 400 are sequentially provided on the three-dimensional structure layer 200. The three-dimensional structure layer 200 and the microlens array 400 work together to enable the observation of a 3D image at a corresponding observation position. The distance between the vertex of the microlens array 400 and the three-dimensional structure layer 200 can be controlled by controlling the thickness of the spacer layer 300, and further has the function of controlling the depth of field of the reproduced image and adjusting the depth of field effect of the reproduced image.

[0042] 6-8, in one embodiment thereof, step S200, i.e., converting pixel coordinates in the three-dimensional coordinate system of the three-dimensional object into pixel coordinates on the recording plane 500, comprises: Step S210: layering the three-dimensional object to form a plurality of planar object images; Step S220 of setting different depth of field values ​​for different planar object images; and step S230 of converting pixel coordinates in the three-dimensional coordinate system of each object image into pixel coordinates on the recording plane 500 based on the depth of field of the plane where each object image is located and parameters of the microlens array 400.

[0043] First, a three-dimensional object is layered according to a predetermined layer thickness, and a finite number of planar object images with continuously transformed depths of field are formed, and each planar object image is assigned a corresponding depth of field value. After determining object images with different depth of field planes, pixel coordinates in the three-dimensional coordinate system of each object image can be converted into pixel coordinates on the recording plane 500 based on the depth of field of the plane on which each object image is located and the parameters of the microlens array 400. Specifically, the object images corresponding to the object images with the greatest depth of field are converted into pixel data on the recording plane 500 in descending order. When data at the same recording position on the recording plane 500 collide, pixel data corresponding to the object image with the greatest depth of field can be overwritten with pixel data corresponding to the object image with the smallest depth of field.

[0044] In one embodiment, in step S230, i.e., the step of converting pixel coordinates in the three-dimensional coordinate system of each object image into pixel coordinates on the recording plane 500, the coordinates on the recording plane 500 corresponding to a single microlens are converted using the following equation: JPEG2026500677000007.jpg29170Here, (X, Y) are the pixel coordinates in the three-dimensional coordinate system of the object image, (X0, Y0) are the center coordinates of the microlens, n is the lens refractive index, g is the distance from the recording plane 500 to the apex of the microlens, d is the depth of field, that is, the distance from the plane on which the object image is located to the apex of the microlens, (x, y) are the coordinates of each pixel point on the recording plane 500, and (x0, y0) are the center coordinates of the micro-nano structure unit on the recording surface.

[0045] 6 and 7, a single microlens can record an object image located on a plane at a predetermined distance from the convex side of the lens onto a plane at a predetermined distance from the flat side of the lens. Because the range of object images that can be recorded with a single microlens is limited, a microlens array 400 formed by combining multiple microlenses can record a wide range of large three-dimensional objects.

[0046] In this embodiment, the reference value d0 of the depth of field of the reconstructed image can be expressed by the following equation. JPEG2026500677000008.jpg15170, where d0 is the reference value of the depth of field of the reconstructed image, P1 is the period of the microlenses, f is the focal length of the microlenses, and P p is the resolution of a pixel point on the recording plane 500, n is the number of pixels in the microlens, and k is a constant.

[0047] In one embodiment, after step S230, i.e., converting the coordinates in the three-dimensional coordinate system of the three-dimensional object into coordinates on the recording plane 500, the manufacturing method provided in this embodiment further includes adjusting the coordinates on the recording plane 500 according to the following mapping relationship: JPEG2026500677000009.jpg25170JPEG2026500677000010.jpg61170

[0048] That is, the k value can establish a mapping relationship between the initial pixel coordinates on the recording plane 500 of the microlens array 400 and the adjusted pixel coordinates. For different k values, the adjusted pixel coordinates will change. The mapping relationship can be obtained by a ray tracing algorithm.

[0049] Based on the above relationship matrix, the coordinates of the (s, t)-th pixel points corresponding to the (i, j)-th microlenses on the recording plane 500 are respectively mapped to the coordinates of the (s', t')-th pixel points corresponding to the (i', j')-th microlenses on the adjusted recording plane 500, and then the coordinates of each pixel on the recording plane 500 are adjusted and adjusted, and the relative position between the microlens array 400 and the reproduced image is changed at the time of final display, thereby realizing the change in the depth of field of the reproduced image from a real image to a virtual image.

[0050] In one embodiment, step S300, i.e., forming the three-dimensional structure layer 200 on one surface of the substrate 100 according to pixel coordinates on the recording plane 500, comprises: Step S310: forming a plurality of micro-nano structure units 210 on one side surface of the substrate according to pixel coordinates on the recording plane 500; and step S320 of filling the surface of the substrate 100 on which the plurality of micro-nano structure units 210 are formed with a coloring material.

[0051] Specifically, a three-dimensional pattern, i.e., a micro-nano structure unit 210, corresponding to pixel coordinates on the recording plane 500 is formed on the surface of the substrate by photolithography, transfer printing, or other techniques, and then a coloring material such as ink can be filled on the surface of the three-dimensional pattern so that the micro-nano structure unit 210 has a light-dark contrast. The subsequently formed microlens array 400 has a plurality of microlenses, and the microlenses correspond one-to-one to the micro-nano structure unit 210.

[0052] In one embodiment, after step S500, i.e., providing the microlens array 400 on the surface of the spacer layer 300 facing away from the three-dimensional structure layer 200, the manufacturing method provided by this embodiment further includes a step of forming a reflective material layer 600 on the surface of the microlens array 400 facing away from the spacer layer 300, thereby providing a reflective 3D effect.

[0053] In one embodiment, after step S300, i.e., the step of forming the three-dimensional structure layer 200 on one surface of the substrate 100 according to pixel coordinates on the recording plane 500, the manufacturing method provided in this embodiment may further include a step of peeling off the substrate 100. The step of peeling off the substrate 100 may be performed after step S300 and before step S400, or after step S400 and before step S500, or after step S500.

[0054] Although the steps in the flowcharts according to the above-described embodiments are sequentially displayed in the order indicated by the arrows, it should be understood that these steps are not necessarily executed sequentially in the order indicated by the arrows. The execution of these steps is not limited to a strict order unless explicitly stated herein, and these steps may be executed in other orders. Furthermore, at least some of the steps in the flowcharts according to the above-described embodiments may include multiple steps or multiple stages, and these steps or stages do not necessarily have to be executed at the same time but may be executed at different times. The execution order of these steps or stages does not necessarily have to be sequential, and they may be executed in order or alternately with other steps or at least some of the steps or stages in other steps.

[0055] The technical features of the above embodiments can be combined in any desired manner, and for the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope of the present specification.

[0056] The above-described examples only represent some embodiments of the present application, and although the descriptions are more specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that those skilled in the art can make further modifications and improvements without departing from the concept of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present application should be determined based on the scope of the accompanying claims. [Explanation of symbols]

[0057] 100 substrate, 200 three-dimensional structure layer, 210 micro-nano structure unit, 300 spacer layer, 400 microlens array, 500 recording plane, 600 reflective material layer

Claims

1. 1. A 3D integrated imaging device, comprising: a spacer layer having a predetermined thickness; a three-dimensional structure layer provided on one surface of the spacer layer, the three-dimensional structure layer including a plurality of micro-nano structure units; a microlens array provided on a surface of the spacer layer away from the three-dimensional structure layer, the microlens array including a plurality of microlenses; A 3D integrated imaging device characterized in that the micro-nanostructure units correspond one-to-one to the microlenses, and the normal viewing pattern of the micro-nanostructure units is a superposition of images captured by the microlenses based on different depths of field after the target stereoscopic image is layered.

2. The 3D integrated imaging device according to claim 1 , wherein the spacer layer is made of a light-transmitting material, and the material of the spacer layer is the same as the material of the microlens array layer.

3. The 3D integrated imaging device of claim 1 , wherein a reflective material layer is provided on one side of the microlens array away from the spacer layer.

4. The 3D integrated imaging device of claim 1 , wherein the sum of the thickness of the spacer layer and the thickness of the microlens is greater than the focal length of the microlens.

5. 2. The 3D integrated imaging device of claim 1, wherein the preset thickness lies between 1 micrometer and 200 micrometers.

6. The 3D integrated imaging device according to claim 1 , wherein the microlens array includes plano-convex lenses arranged in an array, and the arrangement of the plano-convex lenses includes an orthogonal arrangement or a honeycomb arrangement.

7. The relationship between pixel coordinates in the three-dimensional coordinate system of the image after the target three-dimensional image of a single microlens is layered and pixel coordinates in the three-dimensional structure layer is as follows: Here, (X, Y) are pixel coordinates in the three-dimensional coordinate system of the image after layering, (X0, Y0) are the center coordinates of the microlens, (x, y) are the coordinates of each pixel point in the micro-nanostructure unit, (x0, y0) are the center coordinates of the micro-nanostructure unit, n is the refractive index of the microlens, g is the thickness of the spacer layer plus the height of the microlens in the microlens array, and d is the depth of field, that is, the distance from the plane on which the image after layering is located to the vertex of the microlens, characterized in that

8. simulating to form a three-dimensional coordinate system; transforming pixel coordinates in the three-dimensional coordinate system of the three-dimensional object into pixel coordinates on a recording plane; forming a three-dimensional structure layer on one surface of the substrate based on pixel coordinates on the recording plane; providing a spacer layer on a surface of the three-dimensional structure layer away from the substrate; A method for manufacturing a 3D integrated imaging device described in any one of claims 1 to 7, characterized in that it includes a step of providing a microlens array on the surface of the spacer layer away from the three-dimensional structure layer.

9. The step of converting pixel coordinates in the three-dimensional coordinate system of the three-dimensional object into pixel coordinates on a recording plane includes: layering the three-dimensional object to form a plurality of planar object images; setting different depth of field values ​​for different planar object images; and converting pixel coordinates in the three-dimensional coordinate system of each object image into pixel coordinates on a recording plane based on the depth of field of the plane on which each object image is located and parameters of the microlens array.

10. When setting the depth of field value, the reference value d of the depth of field is also set. ０ d ０ is expressed by the following formula: Here, d ０ is the reference value of the depth of field, and P １ is the period of the microlenses, f is the focal length of the microlenses, and P ｐ is the resolution of the pixel point in the recording plane, n is the number of pixels in the microlens, After the step of transforming coordinates in the three-dimensional coordinate system of the three-dimensional target object into coordinates on a recording plane, the manufacturing method further comprises: adjusting coordinates on the recording plane according to the following mapping relationship:

11. The step of forming a three-dimensional structure layer on one surface of the substrate based on pixel coordinates on the recording plane includes: forming a plurality of micro-nano structure units on a surface of one side of a substrate according to pixel coordinates on the recording plane; and filling a coloring material onto the surface of the substrate on which the plurality of micro-nano structure units are formed.

12. 9. The method for manufacturing a 3D integrated imaging device according to claim 8, wherein after the step of forming a three-dimensional structure layer on the surface of one side of the substrate based on pixel coordinates on the recording plane, the method further comprises the step of peeling off the substrate.

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