Air-cooled and liquid-cooled integrated architecture cold plate type heat dissipation system, mainboard and server

Abstract

This application discloses a cold plate type heat dissipation system, mainboard, and server with an air-cooling and liquid-cooling integrated architecture in the field of server technology, which solves the problem of small total heat exchange area and wasteful coolant. The system includes a heat exchange cavity, a water supply pipe, and a water drain pipe, the bottom of the heat exchange cavity is used to contact a heat-generating element, and further includes a heat dissipation assembly and a heat conduction assembly, the heat dissipation assembly includes at least one heat dissipation fin, the bottoms of the heat dissipation fin are both connected to the bottom of the heat exchange cavity, the water supply pipe and the water drain pipe are respectively located at both ends of the heat dissipation fin in the longitudinal direction, the bottom of the heat conduction assembly is connected to the bottom of the heat exchange cavity, and the top of the heat conduction assembly is connected to the top of the heat dissipation fin, so that a portion of the heat absorbed by the heat exchange cavity is transferred to the top of the heat dissipation fin. This application increases the total heat exchange area between the coolant and the heat-generating element, minimizes the waste of coolant in the top layer of coolant, optimizes the temperature uniformity of heat dissipation, and improves the heat dissipation efficiency of cold plate liquid cooling technology.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims priority to a Chinese patent application filed with the State Intellectual Property Office of the People's Republic of China on November 15, 2023, bearing application number 202311517910.2 and entitled "Cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture, mainboard and server," the entire contents of which are incorporated herein by reference.

[0002] [Technical field] The present application relates to the field of server technology, and in particular to a cold plate type heat dissipation system with an air-cooling and liquid-cooling integrated architecture, a mainboard, and a server. [Background technology]

[0003] Servers are an important component of electronic devices and are mainly used to provide computing services. Depending on the type of service they provide, servers can be divided into file servers, database servers, application program servers, web page servers, etc. The main components of a server include a chassis, mainboard, CPU (Central Processing Unit), GPU (Graphics Processing Unit), hard disk, memory, power supply, heat sink, etc., and are similar to the architecture of a general-purpose computer.

[0004] In recent years, as server performance has become increasingly higher and the amount of heat generated has increased, the traditional air-cooled heat dissipation method for servers has become unable to meet the heat dissipation requirements of servers, and due to its high energy consumption and noise, it has gradually been phased out and replaced by liquid-cooled heat dissipation technology. Within the industry, liquid-cooled heat dissipation technology can be mainly divided into direct liquid-cooled heat dissipation technology and indirect liquid-cooled heat dissipation technology.

[0005] Among these, direct liquid cooling technology is mainly immersion liquid cooling technology, which immerses the entire server in an insulating coolant, allowing the coolant to circulate and dissipate heat generated by the server's operation. However, immersion liquid cooling technology places high requirements on the environment, results in low space utilization in the engine room, requires huge costs for installation, operation, maintenance, and reconfiguration, and the risk of corrosion to the server caused by the coolant is currently unclear. Due to the above drawbacks, direct liquid cooling technology has not become the mainstream liquid cooling technology, and is generally only used in ultra-high-density data centers.

[0006] Currently, indirect liquid cooling is a widely used liquid cooling technology. It primarily uses cold plate liquid cooling, which uses a working fluid (e.g., coolant, low-temperature gas, etc.) as a heat transfer medium. The working fluid flows through the cold plate, which then absorbs heat from the server's heat-generating components (e.g., CPUs). The heat is then transferred to the working fluid, which then carries it farther and cools it. During this process, the working fluid is separated from the heat-generating components and does not come into direct contact with them. Instead, the cold plate acts as a heat transfer element between them. Furthermore, by combining this with a heat-absorbing material, such as thermally conductive silicone grease, applied to the cold plate, the heat from the heat-generating components can be quickly transferred to the working fluid.

[0007] In related technologies, the liquid cooling plate in cold plate liquid cooling technology generally uses a metal plate such as a copper plate, and the inside of the metal plate is hollowed out to form a heat exchange cavity that can accommodate a certain amount of coolant. Furthermore, water supply pipes and drainage pipes are inserted into both ends of the metal plate, and finally, a CDU (Cooling Dispensing Unit) is assembled, which allows the coolant to circulate within the heat exchange cavity of the metal plate. However, on the one hand, heat-generating elements such as central processing units (CPUs) and graphics processor units (GPSs) are generally small in size and have a small exposed area, but because of their very high heat-generating power, the contact area between the liquid-cooled plate and the heat-generating elements is very limited, resulting in a small total heat exchange area between the coolant and the heat-generating elements. On the other hand, due to the laminar flow characteristics and the influence of its own weight, after the coolant enters the heat exchange cavity of the metal plate from the water supply pipe, the coolant in the bottom layer can fully absorb the heat from the heat-generating elements, but the coolant in the top layer generally has difficulty fully absorbing the heat from the heat-generating elements. In addition, due to the pump-driven action of the coolant distribution unit, the coolant in the top layer often flows out of the heat exchange cavity without fully absorbing the heat, resulting in low heat dissipation uniformity and some of the coolant being wasted. Summary of the Invention [Means for solving the problem]

[0008] The present application provides a cold plate type heat dissipation system with an air-cooled and liquid-cooled integrated architecture, which includes a heat exchange cavity, a water supply pipe and a water drain pipe communicating with the heat exchange cavity, the interior of the heat exchange cavity being used to contain a coolant, and the bottom surface of the heat exchange cavity being used to contact a heat generating element, and further includes a heat dissipation assembly and a heat conduction assembly mounted within the heat exchange cavity; The heat dissipation assembly includes at least one heat dissipation fin, the bottom of which is connected to the bottom surface of the heat exchange cavity and extends along the height direction of the heat exchange cavity, and the water outlet of the water supply pipe and the water inlet of the water drain pipe are respectively located at both ends of the heat dissipation fin in the length direction; The bottom of the heat conduction assembly is connected to the bottom surface of the heat exchange cavity, and the top of the heat conduction assembly is connected to the top of the heat dissipation fins, thereby providing a cold plate type heat dissipation system with an air-cooling and liquid-cooling integrated architecture, in which a portion of the heat absorbed by the heat exchange cavity is transferred to the top of the heat dissipation fins.

[0009] In some embodiments, the water inlet of the water supply line and the water inlet of the water drain line both communicate with the top of the heat exchange cavity and are located at opposite ends of the heat exchange cavity in the longitudinal direction. In some embodiments, the water supply line outlet is connected to the top of the heat exchange cavity, the water drain line inlet is connected to the bottom of the side wall of the heat exchange cavity, and the water supply line outlet and the water drain line inlet are each located at both ends of the heat exchange cavity in the longitudinal direction.

[0010] In some embodiments, the top wall of the heat exchange cavity is a heat spreader plate, the tops of the heat dissipation fins extend to be connected to the heat spreader plate, and the heat spreader plate performs natural heat exchange of part of the heat of the heat dissipation fins with the outside air. In some embodiments, in a cold plate type heat dissipation system with an integrated air-cooling and liquid-cooling architecture applied to a server including a heat dissipation fan, the height of the heat exchange cavity is equal to the height of the air path formed by the heat dissipation fan inside the server.

[0011] In some embodiments, the heat dissipation assembly includes two heat dissipation fins at the beginning and end, and the side walls on both sides of the width of the heat exchange cavity are both heat conduction medium walls, the two heat dissipation fins are respectively in close contact with the inner walls on both sides of the width of the heat exchange cavity, and the outer walls on both sides of the width of the heat exchange cavity are both provided with air-cooled heat dissipation plates. In some embodiments, the bottom of the heat dissipating fins is welded onto the bottom surface of the heat exchange cavity, and the thickness of each heat dissipating fin is 0.2 mm to 0.3 mm.

[0012] In some embodiments, both sides of the heat dissipating fins are provided with protrusions and / or grooves to increase the surface area. In some embodiments, the heat dissipation assembly includes a plurality of heat dissipation fins, and the heat conduction assembly includes a bottom heat pipe coated on the bottom surface of the heat exchange cavity, a vertical heat pipe standing on the surface of the bottom heat pipe, and a top heat pipe provided at the tip of the vertical heat pipe, wherein the vertical heat pipe extends vertically to a predetermined height position of the heat dissipation fins, and the top heat pipe passes through the plurality of heat dissipation fins in sequence.

[0013] In some embodiments, the top heat pipes penetrate vertically through the heat dissipation fins, and the top heat pipes penetrate the top and / or center of the heat dissipation fins. In some embodiments, the heat dissipation assembly includes a plurality of heat dissipation fins, and the bottom heat pipe extends along the arrangement direction of the plurality of heat dissipation fins and is uniformly distributed along the length direction of the plurality of heat dissipation fins.

[0014] In some embodiments, the heat dissipation assembly includes a plurality of heat dissipation fins, each of which has a through hole for passing the top heat pipe therethrough, and an extension sleeve is connected between the hole walls of the through holes of two adjacent heat dissipation fins, and the extension sleeve is used to fit onto the top heat pipe. In some embodiments, the gap between the outer wall of the top heat pipe and the inner wall of the extension sleeve is filled with a weld-formed thermally conductive flux.

[0015] In some embodiments, the heat dissipation assembly includes a plurality of heat dissipation fins, and the cold plate type heat dissipation system with an air-cooled and liquid-cooled integrated architecture further includes a water distribution pipe communicating with the water outlet of the water supply pipeline, the water distribution pipe extending along the arrangement direction of the plurality of heat dissipation fins, and the water distribution pipe having a plurality of uniformly distributed water outlets.

[0016] In some embodiments, the heat dissipation assembly includes a plurality of heat dissipation fins, and the cold plate type heat dissipation system with an air-cooled and liquid-cooled integrated architecture further includes a water collection pipe communicating with the water inlet of the drainage pipe, the water collection pipe extending along the arrangement direction of the plurality of heat dissipation fins, and the water collection pipe having a plurality of uniformly distributed water inlets.

[0017] In some embodiments, a plurality of heat exchange cavities are provided, each of which is used to contact a different heat-generating element, and which are connected in series via a water supply line and a water drain line. In some embodiments, the heat exchange cavity further includes a heat conduction plate disposed on the bottom surface thereof, the bottom surface of the heat conduction plate being a smooth plane, and being used to press the top surface of the heat-generating element to absorb heat therefrom. In some embodiments, the heat transfer plate and the heat exchange cavity are removably coupled so that a heat transfer plate that matches the size of the heat generating element is exchanged for the heat exchange cavity.

[0018] In some embodiments, the top surface of the heat transfer plate has a groove for fixing the heat transfer plate; A guide chute extending vertically is opened on the bottom surface of the heat exchange cavity, a guide slider is provided inside the guide chute, an engaging member is provided on the bottom of the guide slider, and an insertion / removal operation block is provided on the side wall of the guide slider, the engaging member is used to form an engaging connection with the engaging groove, and the insertion / removal operation block is used to apply a vertical force to the guide slider so as to insert the engaging member into the engaging groove or pull the engaging member out of the engaging groove.

[0019] In some embodiments, the tip of the guide slider and the tip of the guide chute are connected by magnetic attraction, and / or the engaging member and the engaging groove are connected by magnetic attraction. The present application further provides a main board including a boat body, a heat-generating element provided on the surface of the boat body, and a heat dissipation system for dissipating heat from the heat-generating element, wherein the heat dissipation system is any of the above-mentioned cold plate-type heat dissipation systems of the air-cooled / liquid-cooled integrated architecture.

[0020] The present application further provides a server including a housing, a mainboard mounted in the housing, and heat dissipation fans provided at both ends of the housing, wherein the mainboard is the above-mentioned mainboard. [Effects of the Invention]

[0021] The present invention relates to a cold plate-type heat dissipation system with an integrated air-cooling and liquid-cooling architecture, and primarily includes a heat exchange cavity, a water supply line, a drainage line, a heat dissipation assembly, and a heat conduction assembly. The heat exchange cavity is the main structure of the heat dissipation system, having a sealed cavity with a specific shape inside, capable of containing a certain amount of coolant. It is primarily used to mount and accommodate other components of the heat dissipation system and to provide an environment for heat exchange between the coolant and heat-generating components. The bottom of the heat exchange cavity is used to contact the heat-generating components (mainly server assemblies that generate a relatively large amount of heat, such as central processing units and graphics processor units), and is typically pressed against the exposed top surface of the heat-generating components to absorb heat generated during operation. The heat exchange cavity is connected to the water supply line and the drain line, and the water supply line is mainly used to introduce new coolant into the heat exchange cavity, and the drain line is mainly used to discharge the coolant that has absorbed heat in the heat exchange cavity, thereby realizing a continuous circulation of the coolant within the heat exchange cavity. The heat dissipation assembly is one of the core components, and is installed in the heat exchange cavity as a whole. It mainly includes a plurality of heat dissipation fins. The bottom of each heat dissipation fin is connected to the bottom surface of the heat exchange cavity, and each heat dissipation fin extends along the height direction (or vertical direction) within the heat exchange cavity, mainly used to gradually disperse the heat absorbed by the heat exchange cavity from the heat-generating element to the sides of the entire heat dissipation fins from bottom to top. Therefore, when the coolant flows through the heat exchange cavity, it can contact both sides of each heat dissipation fin, that is, the coolant in the bottom layer contacts the bottom side of the heat dissipation fin, and the coolant in the top layer contacts the top side of the heat dissipation fin, thereby absorbing the heat dispersed from the sides of the heat dissipation fins and realizing liquid-cooled heat dissipation. In addition, the water outlet of the water supply pipe and the water inlet of the water drain pipe are located at both ends of the length of each heat dissipation fin, so that when the coolant flows through the heat exchange cavity, it flows in from one end of the gap between two adjacent heat dissipation fins, flows completely around the sides of each heat dissipation fin, and then flows out from the other end of the gap.The heat conduction assembly is another core component, and is installed in the heat exchange cavity as a whole. The bottom of the heat conduction assembly is connected to the bottom of the heat exchange cavity, and the top of the heat conduction assembly is connected to the top of each heat dissipation fin. It is mainly used to absorb some heat from the heat-generating element through the bottom of the heat exchange cavity and then directly transfer it to the top of each heat dissipation fin along the extension direction of the heat conduction assembly. Therefore, the top of each heat dissipation fin receives the heat and gradually distributes it to the sides of the entire heat dissipation fin from bottom to top, so there is no need to wait for the heat to be gradually transferred from the bottom of each heat dissipation fin to top. [Brief explanation of the drawings]

[0022] In order to more clearly explain the technical solutions in the embodiments of the present application or the related art, the drawings necessary to be used in the description of the embodiments or the related art will be briefly described below. Obviously, the drawings in the following description are only embodiments of the present application, and those skilled in the art can obtain other drawings based on the provided drawings without any creative efforts. [Figure 1] 1 is a schematic diagram of the overall structure of a cold plate type heat dissipation system with an air-cooling and liquid-cooling integrated architecture according to an embodiment of the present application. [Figure 2] 1 is a schematic diagram of a structure of a heat exchange cavity according to an embodiment of the present application; [Figure 3] 2 is a schematic diagram of the internal structure of a heat exchange cavity according to an embodiment of the present application; FIG. [Figure 4] FIG. 4 is a side view of the heat exchange cavity of FIG. 3 according to an embodiment of the present application. [Figure 5] 2 is a schematic diagram of the connection structure between the heat dissipation fins and the top heat pipe according to an embodiment of the present application; [Figure 6] 1 is a schematic diagram of a structure of a heat conduction assembly according to an embodiment of the present application; [Figure 7] 1 is a schematic diagram of the structure of a heat conduction plate according to an embodiment of the present application; [Figure 8] 1 is a schematic diagram of the local structure of a heat exchange cavity according to an embodiment of the present application; [Figure 9]1 is a schematic diagram of a main board structure according to an embodiment of the present application; [Figure 10] FIG. 2 is a schematic diagram of a server structure according to an embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. Based on the embodiments of the present application, all other embodiments that can be devised by those skilled in the art without any creative efforts belong to the scope of protection of the present application.

[0024] FIG. 1 is a schematic diagram of the overall structure of a cold plate type heat dissipation system with an air-cooling and liquid-cooling integrated architecture according to an embodiment of the present invention. In the embodiment of the present application, the cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture mainly includes a heat exchange cavity 1, a water supply pipe 2, a water drain pipe 3, a heat dissipation assembly 4 and a heat conduction assembly 5.

[0025] As shown in FIG. 2, FIG. 2 is a schematic diagram of the structure of a heat exchange cavity 1 according to an embodiment of the present application. The heat exchange cavity 1 is the main structure of the heat dissipation system, and has a specially shaped sealed cavity inside that can accommodate a certain amount of coolant. It is mainly used to mount and accommodate other components of the heat dissipation system, and to provide an environment for heat exchange between the coolant and the heat-generating components. The bottom of the heat exchange cavity 1 is used to abut the heat-generating components (mainly server assemblies that generate a relatively large amount of heat, such as central processing units and graphics processor units), and is generally pressed against the exposed top surface of the heat-generating components to absorb the heat generated during operation of the heat-generating components.

[0026] The water supply line 2 and the drain line 3 are both connected to the heat exchange cavity 1, of which the water supply line 2 is mainly used to introduce new coolant into the heat exchange cavity 1, and the drain line 3 is mainly used to discharge the coolant that has absorbed heat in the heat exchange cavity 1, thereby realizing continuous circulating flow of the coolant within the heat exchange cavity.

[0027] The heat dissipation assembly 4 is one of the core components, and is installed in the heat exchange cavity 1 as a whole, and mainly includes at least one heat dissipation fin 41. Note that the present application does not limit the number of the heat dissipation fins 41, and the number of the heat dissipation fins 41 can be determined according to the actual heat dissipation demand. The bottom of the heat dissipation fins 41 is connected to the bottom surface of the heat exchange cavity 1, and the heat dissipation fins 41 extend along the height (or vertical) of the heat exchange cavity 1 within the heat exchange cavity 1. They are mainly used to gradually disperse the heat absorbed by the heat exchange cavity 1 from bottom to top to the entire sides of the heat dissipation fins 41. Therefore, when the coolant flows through the heat exchange cavity 1, it can contact both sides of the heat dissipation fins 41. That is, the coolant in the lowest layer contacts the bottom side of the heat dissipation fins 41, and the coolant in the highest layer contacts the top side of the heat dissipation fins 41, thereby absorbing the heat dispersed from the sides of the heat dissipation fins 41 and realizing liquid-cooled heat dissipation. In addition, the water outlet of the water supply pipe 2 and the water inlet of the water drain pipe 3 are located at both ends of the length of the heat dissipation fin 41, so that when the coolant flows through the heat exchange cavity 1, the coolant flows in from one end of the gaps between the heat dissipation fins 41, flows completely around the sides of the heat dissipation fins 41, and then flows out from the other end of the heat dissipation fins 41. If the heat dissipation assembly 4 includes multiple heat dissipation fins 41, the coolant can also flow in from one end of the gaps between the heat dissipation fins 41, flows completely around the sides of each heat dissipation fin 41, and then flows out from the other end of the gaps.

[0028] The heat conduction assembly 5 is another core component, and is installed in the heat exchange cavity 1 as a whole. The bottom of the heat conduction assembly 5 is connected to the bottom of the heat exchange cavity 1, and the top of the heat conduction assembly 5 is connected to the top of the heat dissipation fin 41. It is mainly used to absorb some heat from the heat-generating element through the bottom of the heat exchange cavity 1 and then transfer it directly to the top position of the heat dissipation fin 41 along the extension direction of the heat conduction assembly 5. Therefore, the top of the heat dissipation fin 41 receives the heat and gradually distributes it to the sides of the entire heat dissipation fin 41 from bottom to top, so there is no need to wait for the heat to be gradually transferred from the bottom of the heat dissipation fin 41 to top.

[0029] In this way, the cold plate type heat dissipation system with the air-cooling and liquid-cooling integrated architecture according to this embodiment disperses the heat absorbed from the heat-generating element by the heat exchange cavity 1 over the entire side surface through the heat dissipation fins 41 in the heat dissipation assembly 4. Therefore, when the coolant flows through the heat exchange cavity 1, it can not only directly absorb the heat from the heat-generating element through the bottom surface of the heat exchange cavity 1, but also indirectly absorb the heat from the heat-generating element through the side surfaces of the heat dissipation fins 41. Furthermore, the side area of ​​the heat dissipation fins 41 is significantly larger than the bottom area of ​​the heat exchange cavity 1. Furthermore, a relatively large number of heat dissipation fins 41 can be installed, and all sides of each heat dissipation fin 41 can be in contact with the coolant, which significantly increases the total heat exchange area between the coolant and the heat-generating element.

[0030] Furthermore, when the coolant flows through the heat exchange cavity 1, due to the laminar flow characteristics, the coolant in the bottom layer contacts the bottom of the heat dissipation fins 41, and the coolant in the top layer contacts the top of the heat dissipation fins 41. In addition, the heat at the bottom of the heat dissipation fins 41 is more concentrated, and the density of the heat dispersed at the top is relatively low. However, with the action of the heat conduction assembly 5, some of the heat from the heat-generating element can be directly transferred to the top of the heat dissipation fins 41, thereby increasing the heat received and dispersed by the top of the heat dissipation fins 41 and equalizing the heat density at the bottom and top of the heat dissipation fins 41. Furthermore, the coolant in the top layer can also fully absorb heat from the side tops of the heat dissipation fins 41, avoiding waste of coolant.

[0031] As described above, the cold plate heat dissipation system with air-cooling and liquid-cooling integrated architecture of this embodiment integrates the features of both air-cooling and liquid-cooling heat dissipation technologies into cold plate liquid cooling technology to form an integrated architecture, which increases the total heat exchange area between the coolant and the heat-generating elements, minimizes coolant waste in the top layer of coolant, optimizes the temperature uniformity of heat dissipation, and improves the heat dissipation efficiency of cold plate liquid cooling technology.

[0032] As shown in FIGS. 3 and 4, FIG. 3 is a schematic diagram of the internal structure of the heat exchange cavity 1 according to the embodiment of the present invention, and FIG. 4 is a side view of the heat exchange cavity in FIG. 3 according to the embodiment of the present invention. In some embodiments of the heat dissipation assembly 4, the entire heat dissipation assembly 4 is mounted at a midpoint in the length of the heat exchange cavity 1, and the heat dissipation fins 41 all extend along the length of the heat exchange cavity 1, thereby dividing the internal space of the heat exchange cavity 1 into three regions: a midpoint region where the heat dissipation assembly 4 is mounted, and end regions at both ends in the length direction, and the two end regions are the coolant supply and drain regions.

[0033] In some embodiments of the water supply pipe 2 and the water drain pipe 3, the water outlet of the water supply pipe 2 and the water inlet of the water drain pipe 3 are both connected to the top of the heat exchange cavity 1, and the water outlet of the water supply pipe 2 and the water inlet of the water drain pipe 3 are respectively located at both ends of the heat exchange cavity 1 in the longitudinal direction, i.e., at the water supply area and the water drain area, respectively. In this way, the coolant flows out from the water outlet of the water supply pipe 2, drops into the water supply area, passes through the gaps between each heat dissipation fin 41, flows into the water drain area, and finally passes through the water drain pipe 3 to be discharged. This distribution structure of the water supply pipe 2 and the water drain pipe 3 reuses the conventional general cold plate structure, which eliminates the need to change the pipe structure on the main board. In addition, the water supply pipe 2 and the water drain pipe 3 are located on the same height plane, making them easy to install and remove.

[0034] In another embodiment of the water supply pipe 2 and the water drain pipe 3, the water supply pipe 2 and the water drain pipe 3 are not located on the same height plane, and only the water outlet of the water supply pipe 2 communicates with the top of the heat exchange cavity 1, and the water supply port of the water drain pipe 3 communicates with the bottom of the side wall of the heat exchange cavity 1, thereby forming a height distribution structure of the water supply and water outlet. Naturally, the water outlet of the water supply pipe 2 and the water supply port of the water drain pipe 3 are still located at both ends of the length of the heat exchange cavity 1, respectively. In this way, the coolant in the top layer absorbs slightly less heat than the coolant in the bottom layer. Therefore, if the water inlet of the drainage pipe 3 is connected to the top of the heat exchange cavity 1, the coolant in the top layer is more likely to flow out directly after absorbing heat from the top of the heat dissipation fins 41. In this embodiment, the coolant in the top layer cannot flow out directly from the top after absorbing heat from the top of the heat dissipation fins 41, but must flow downward to the bottom of the heat exchange cavity 1 before it can flow out. This strengthens the fluidity of the coolant in the top layer, allowing it to absorb heat as fully as possible, maximizing the use of the coolant in the heat exchange cavity 1, and further reducing coolant waste.

[0035] Considering that each fin 41 is uniformly arranged along the width of the heat exchange cavity 1, in this embodiment, a water diversion pipe 8 is additionally provided to ensure that the coolant enters the water supply area and flows into the gaps between any two adjacent fins 41 as uniformly and synchronously as possible. In some embodiments, the water diversion pipe 8 is provided in the water supply area of ​​the heat exchange cavity 1, communicates with the water outlet of the water supply pipe 2, and is distributed along the width of the heat exchange cavity 1, i.e., along the arrangement direction of each fin 41. Furthermore, multiple water outlets are provided along the length of the water diversion pipe 8. Generally, the water outlets are uniformly distributed along the length of the water diversion pipe 8. In this manner, after the coolant passes through the water supply pipe 2 and enters the water diversion pipe 8, it simultaneously drops from each outlet to each location within the water supply area of ​​the heat exchange cavity 1, ensuring that the coolant enters the gaps between each fin 41 uniformly and synchronously.

[0036] Similarly, in this embodiment, water collection pipes 9 are further installed so that the coolant can be discharged into the drainage pipe 3 as uniformly and synchronously as possible after absorbing heat. In some embodiments, the water collection pipes 9 are located in the drainage area of ​​the heat exchange cavity 1, communicate with the water inlets of the drainage pipe 3, and are distributed along the width of the heat exchange cavity 1, i.e., along the arrangement direction of each heat dissipation fin 41. Furthermore, multiple water inlets are provided along the length of the water collection pipe 9. Generally, the water inlets are uniformly distributed along the length of the water collection pipe 9. In this way, after the coolant absorbs heat and flows into the drainage area, it simultaneously enters the drainage pipe 3 through the water inlets at various positions within the drainage area and is discharged from the drainage pipe 3, ensuring that the coolant enters the gaps between each heat dissipation fin 41 uniformly and synchronously, and preventing heat from accumulating in the drainage area in a short period of time.

[0037] In some embodiments of the heat exchange cavity 1, the heat conduction assembly 5 takes into consideration the fact that part of the heat from the heat-generating elements is directly transferred to the top of the heat dissipation fins 41 for easy absorption by the coolant in the top layer. To enhance the heat dissipation efficiency of the top of the heat dissipation fins 41, the top wall of the heat exchange cavity 1 in these embodiments is a heat spreader plate 6, and the top of each heat dissipation fin 41 extends to connect to the heat spreader plate 6. In this way, the heat from the top of the heat dissipation fins 41 is not only absorbed by the coolant in the top layer, but also transferred to the heat spreader plate 6, which can uniformly distribute the heat over its surface. This allows the heat spreader plate 6 to exchange heat naturally with the external air or convectively with the cool air currents inside the server chassis, further improving the heat exchange efficiency to a certain extent.

[0038] Furthermore, the height of a typical conventional cold plate is low and significantly different from the height of the air-cooled radiator (e.g., fan) installed in the server, resulting in ineffective coolant waste in the airflow path above the cold plate. In contrast, in this embodiment, the height of the heat exchange cavity 1 is increased, typically three to four times the height of a conventional cold plate, to match the height of the airflow path formed by the heat dissipation fan in the server. In this way, the height of the heat exchange cavity 1 matches the height of a specific airflow path within the server chassis, and the cool airflow in the corresponding airflow path is blocked when passing through the heat exchange cavity 1 and cannot continue. As a result, the cool air flows to both sides of the heat exchange cavity 1 and eventually enters another airflow path to replenish the coolant, preventing the cool airflow in that airflow path from being wasted. In addition, while conventional cold plate liquid cooling technologies require filling the cold plate with foam to block the airflow above the cold plate or adjusting the airflow guide structure of the air-cooled heat dissipation fan to redirect the airflow above the cold plate, this embodiment increases the height of the heat exchange cavity 1 to match the height of the airflow path created by the cooling fan, thereby not only increasing the height of the heat dissipation fins 41 but also increasing the area of ​​the heat dissipation fins 41 and the total heat exchange area. This rationalizes the use of the space above the cold plate, eliminating the need for foam filling, saving material costs, and eliminating the need to adjust the airflow guide structure, allowing the associated airflow guides to be directly reused within the server. Furthermore, while the pressure and flow rate of the coolant remain unchanged, increasing the height of the heat exchange cavity 1 increases its volume, reducing the pressure within the heat exchange cavity 1 and further reducing the risk of leakage.

[0039] Similarly, in this embodiment, not only can the heat dissipation efficiency be improved by the top wall of the heat exchange cavity 1, but also by the side walls on both sides of the heat exchange cavity 1. In some embodiments, both side walls in the width direction of the heat exchange cavity 1 are heat-conducting medium walls, for example, walls made of a metal material such as copper, and the two heat dissipation fins 41 at the end of the heat dissipation assembly 4 (i.e., the heat dissipation fins 41 located on both sides of the heat exchange cavity 1 in the width direction) are respectively in close contact with the inner walls on both sides of the width direction of the heat exchange cavity 1, and the outer wall surfaces of both side walls are provided with air-cooled heat dissipation plates 7. In this way, the two heat dissipation fins 41 at the end of the heat dissipation assembly 4 simultaneously transfer heat to both side walls of the heat exchange cavity 1, and then to the air-cooled heat dissipation plates 7, which then come into contact with the external cool air flow for air-cooled heat dissipation, thereby further improving the heat dissipation efficiency of the heat-generating elements in combination with the air-cooled heat dissipation. Naturally, the air-cooled heat sink 7 may be provided on the front end surface or top end surface of the heat exchange cavity 1, but if the height of the heat exchange cavity 1 reaches a limit position, the air-cooled heat sink 7 may not be provided on the top surface.

[0040] In some embodiments of the heat dissipating fins 41, conventional heat dissipating fins require manufacturing, processing, and assembly using tooth cutting or sawing. Due to process limitations, the thickness of a typical heat dissipating fin needs to be maintained within the range of 1 mm to 2 mm to achieve a relatively good heat conduction effect. However, due to the small width of the heat exchange cavity 1, a thickness of 1 mm to 2 mm is too large for the heat exchange cavity 1, making it impossible to arrange multiple heat dissipating fins within the heat exchange cavity 1, thereby limiting the total heat exchange area. In contrast, in this embodiment, the bottom of each heat dissipating fin 41 is fixed to the bottom of the heat exchange cavity 1 by a welding process, and the thickness of each heat dissipating fin 41 is 0.2 mm to 0.3 mm, for example, 0.2 mm, 0.25 mm, or 0.3 mm. In this way, due to the welding connection between each heat dissipating fin 41 and the bottom surface of the heat exchange cavity 1, the manufacturing thickness of the heat dissipating fins 41 can be made thinner without being limited to tooth cutting or sawtooth cutting, which allows the pitch between two adjacent heat dissipating fins 41 to be reduced and more heat dissipating fins 41 to be arranged in the heat exchange cavity 1, thereby increasing the total heat exchange area. In addition, due to the action of the heat conduction assembly 5, part of the heat from the heating element is transferred directly to the top of the heat dissipating fin 41, rather than having to be gradually dispersed from the bottom to the top of the heat dissipating fin 41, so that the heat conduction efficiency is hardly affected.

[0041] In another embodiment of the heat dissipating fins 41, to further increase the total heat exchange area, each heat dissipating fin 41 is provided with a protrusion or a groove structure on both sides, or with both a protrusion and a groove structure. Generally, the protrusions and grooves are arc-shaped, thereby forming minute convex and concave portions on the sides of the heat dissipating fin 41. In this way, the protrusions and grooves can effectively increase the surface area of ​​the sides of the heat dissipating fin 41, thereby increasing the contact area with the coolant as it flows along the sides of the heat dissipating fin 41 and further improving the heat dissipation efficiency to a certain extent. Furthermore, the arc-shaped protrusions and grooves can guide the coolant, preventing it from being obstructed, resulting in a decrease in flow rate and heat accumulation.

[0042] As shown in FIG. 6, FIG. 6 is a schematic diagram of the structure of a heat conduction assembly 5 according to an embodiment of the present application. In some embodiments of the heat conduction assembly 5, the heat conduction assembly 5 mainly includes a bottom heat pipe 51, a vertical heat pipe 52, and a top heat pipe 53. The present application does not limit the number of bottom heat pipes 51 and top heat pipes 53, and the number of bottom heat pipes 51 and top heat pipes 53 can be set according to the heat conduction needs. Here, the bottom heat pipes 51 are installed at the bottom of the heat exchange cavity 1 and cover the bottom surface of the heat exchange cavity 1. Generally, multiple bottom heat pipes 51 are installed at the same time and are mainly used to absorb heat from heat-generating elements. The vertical heat pipes 52 are installed on the surface of each bottom heat pipe 51 and extend vertically (in the height direction of the heat exchange cavity 1) to a predetermined height position of the heat dissipation fins 41, such as the top position or center position of the heat dissipation fins 41, and are mainly used to realize vertical heat transfer. The top heat pipes 53 are provided at the ends of the upright heat pipes 52, pass through each heat dissipation fin 41 in turn, and are connected to each heat dissipation fin 41, and are mainly used to transfer heat from the upright heat pipes 52 to each heat dissipation fin 41. In this way, part of the heat from the heat-generating element is transferred to the bottom heat pipes 51 through the bottom surface of the heat exchange cavity 1, then transferred to higher places through the upright heat pipes 52, and finally transferred to each heat dissipation fin 41 through the top heat pipes 53.

[0043] Furthermore, for ease of manufacturing, the top heat pipes 53 penetrate each heat dissipation fin 41 in a direction perpendicular to the heat dissipation fins 41. Furthermore, the same vertical heat pipe 52 may be provided with multiple top heat pipes 53, for example, two top heat pipes 53, with one top heat pipe 53 connected to the top of the vertical heat pipe 52 and the other top heat pipe 53 connected to the center of the vertical heat pipe 52. In this way, heat can be transferred to different height positions of each heat dissipation fin 41 simultaneously via the multiple top heat pipes 53 at different heights, thereby further improving the uniformity of heat dissipation.

[0044] Furthermore, considering that the top surface of the heating element is usually a uniform heat surface, in order to improve the uniformity of the heat absorption of the heating element by each bottom heat pipe 51, in this embodiment, each bottom heat pipe 51 extends along the arrangement direction of each heat dissipation fin 41 and is uniformly distributed along the length of the heat dissipation fin 41. Generally, three to five bottom heat pipes 51 can be evenly arranged on the bottom surface of the heat exchange cavity 1. In this way, the covering area of ​​each bottom heat pipe 51 on the bottom surface of the heat exchange cavity is approximately the same as the top surface area of ​​the heating element, so that heat can be absorbed simultaneously from all positions on the top surface of the heating element, further improving the uniformity of heat dissipation.

[0045] As shown in FIG. 5, FIG. 5 is a schematic diagram of the connection structure between the heat dissipation fins 41 and the top heat pipe 53 according to an embodiment of the present invention. In some embodiments of the heat dissipating fins 41 and the top heat pipe 53, a through-hole is provided on each fin 41 to facilitate the top heat pipe 53 passing through each fin 41 in sequence. Furthermore, because the top heat pipe 53 and the fins 41 maintain a perpendicular relationship, the contact area between the top heat pipe 53 and the fin 41 is actually only the area of ​​the inner wall of one periphery of the through-hole, which is small. In contrast, in this embodiment, an extension sleeve 42 is connected between the through-hole walls of two adjacent fins 41, which means that the through-holes of the two adjacent fins 41 are connected together via the extension sleeve 42. After the top heat pipe 53 passes through the through-hole, the extension sleeve 42 is fitted onto the top heat pipe 53. In this way, after connecting the through holes of two adjacent heat dissipation fins 41 via the extension sleeve 42, the through holes are equivalent to being pulled into a tubular shape along the axial direction, and when they come into contact with the top heat pipe 53 through this tubular "through hole", the heat exchange area between the top heat pipe 53 and the two adjacent heat dissipation fins 41 can be greatly increased, and further, the efficiency of the top heat pipe 53 in transferring heat to the heat dissipation fins 41 can be improved.

[0046] Furthermore, considering that a fin penetration process is formed by drilling a through-hole in each heat dissipation fin 41 and then inserting and fixing the top heat pipe 53 into the through-hole, manufacturing and installation errors can easily result in micro-gaps between the outer edge of the top heat pipe 53 and the inner edge of the through-hole in each heat dissipation fin 41, or between the outer wall of the top heat pipe 53 and the inner wall of the extension sleeve 42. This prevents the top heat pipe 53 from connecting to the heat dissipation fins 41 without gaps, further reducing the thermal conductivity between them. In contrast, in this embodiment, the gap between the outer wall of the top heat pipe 53 and the inner wall of the extension sleeve 42 is filled with a thermally conductive flux, such as solder, which is welded. In this way, after inserting the top heat pipe 53 into the through-hole of each heat dissipation fin 41, the gap between the outer wall of the top heat pipe 53 and the inner wall of the extension sleeve 42 can be filled with thermally conductive flux. Furthermore, by performing a welding process such as reflow soldering on the top heat pipe 53 and the heat dissipation fins 41, the gap between the outer edge of the top heat pipe 53 and the inner edge of the through-hole of each heat dissipation fin 41 can be eliminated, thereby improving the thermal conduction efficiency between the top heat pipe 53 and the heat dissipation fins 41.

[0047] Furthermore, because a server mainboard may include a dual central processing unit (CPU) or multiple graphics processor units, the mainboard may simultaneously include multiple heat-generating elements that generate large amounts of heat. Therefore, multiple cold plates must be installed on the mainboard to dissipate the heat. In contrast, in this embodiment, the mainboard is simultaneously provided with multiple heat exchange cavities 1, and the number of heat exchange cavities 1 is equal to the number of heat-generating elements on the mainboard that require cold plate heat dissipation, so as to provide a one-to-one correspondence. In some embodiments, each heat exchange cavity 1 is used to contact a different heat-generating element to absorb the heat from each heat-generating element, and each heat exchange cavity 1 is connected in series via a water supply pipe 2 and a drainage pipe 3. In this way, the coolant output from the coolant distribution unit can enter the first heat exchange cavity 1 to absorb heat, then enter the second heat exchange cavity 1 to continue absorbing heat, and continue in this way, cooling again and continuing the circulating flow, and then returning to the coolant distribution unit after saturation, thereby ensuring full utilization of the coolant and further reducing the waste of coolant.

[0048] Naturally, for some heat generating elements with large heat output, such as some graphics processor units, the water supply line 2 and the water drain line 3 can be connected to the corresponding heat exchange cavity 1 independently, so that the coolant distribution unit independently provides cold plate heat dissipation for the heat generating element.

[0049] In another embodiment of the present application, in order to improve the heat absorption efficiency of the heat exchange cavity 1 with respect to the heat-generating element, the cold plate-type heat dissipation system with an integrated air-cooling and liquid-cooling architecture includes the heat exchange cavity 1, the water supply line 2, the water discharge line 3, the heat dissipation assembly 4, and the heat conduction assembly 5, and further includes a heat conduction plate 10. In some embodiments, the heat conduction plate 10 is disposed on the bottom surface of the heat exchange cavity 1, and the bottom surface of the heat conduction plate 10 is a smooth plane. It is mainly used to press the top surface of the heat-generating element instead of the heat exchange cavity 1 to absorb heat from the heat-generating element. Typically, the materials of the heat conduction plate 10, the heat exchange cavity 1, the heat dissipation assembly 4, the heat conduction assembly 5, etc. are all made of a material with high thermal conductivity, such as copper, to improve heat conduction efficiency.

[0050] As shown in FIG. 7, FIG. 7 is a schematic diagram of the structure of a heat conduction plate 10 according to an embodiment of the present invention. Furthermore, considering that different types of heat-generating elements have different sizes and areas, for example, different types of central processing unit units have different vertical and horizontal sizes, and that the sizes of central processing unit units and graphics processor units also generally differ, in order to ensure that the thermal conduction plate 10 can stably cover the top surfaces of heat-generating elements of different sizes and areas, in this embodiment, the thermal conduction plate 10 is detachably connected to the heat exchange cavity 1 so that the thermal conduction plate 10 that matches the size and area of ​​the current heat-generating element in the heat exchange cavity 1 can be replaced, thereby realizing the versatility of the thermal conduction plate 10. In some embodiments, the thermal conduction plates 10 of different models have engagement grooves 101 formed on their top surfaces, and the positions of the engagement grooves 101 on the thermal conduction plates 10 of each model are all fixed, so that the thermal conduction plate 10 can always be connected to the heat exchange cavity 1 via the engagement grooves 101, regardless of which model number is selected. Generally, a plurality of, for example, 4 to 8, engaging grooves 101 can be formed on the heat conducting plate 10 at the same time, and they are located on both sides, both ends, and corners of the heat conducting plate 10, respectively.

[0051] As shown in FIG. 8, FIG. 8 is a schematic diagram of the local structure of a heat exchange cavity according to an embodiment of the present application. To facilitate the removal and replacement of the heat exchange cavity 1 and the heat conduction plate 10, the heat exchange cavity 1 is provided with a guide chute 11, a guide slider 12, a fastening member 13, and an insertion / removal block 14 in this embodiment. The guide chute 11 is located on the bottom of the heat exchange cavity 1 and extends vertically, i.e., along the height of the heat exchange cavity 1. The guide slider 12 is mounted within the guide chute 11 and slides along it, allowing for vertical lifting and lowering. The fastening member 13 is located at the bottom of the guide slider 12 and is mainly used to engage with and connect to the fastening groove 101 on the heat conduction plate 10, and may be, for example, a fastening post or a fastening block. However, it is difficult to stably lock the fastening member 13 in the fastening groove 101 by the gravity of the guide slider 12 and the fastening member 13 themselves, so an insertion / removal operation block 14 is further provided on the side wall of the guide slider 12. The insertion / removal operation block 14 is mainly operated by an operator who applies force to push down and pull up the insertion / removal operation block 14, thereby applying a corresponding vertical force to the guide slider 12, which, when pushed down, inserts the fastening member 13 into the fastening groove 101 to form a stable fastening, or pulls out the fastening member 13 from the fastening groove 101 to achieve separation and removal.

[0052] Furthermore, to improve the stability of the engagement between the engaging member 13 and the engaging groove 101, in this embodiment, the engaging member 13 and the engaging groove 101 are made of magnetic materials so that they are attracted to each other by magnetic force when engaged with each other, thereby enhancing the stability of the connection and preventing loosening. Similarly, the tip of the guide slider 12 and the tip of the guide chute 11 may also be magnetic so that the tip of the guide slider 12 is attracted and fixed to the tip of the guide chute 11 by magnetic attraction, preventing the guide slider 12 from accidentally dropping.

[0053] As shown in FIG. 9, this embodiment further provides a main board, which mainly includes a boat body, a heat-generating element provided on the surface of the boat body, and a heat dissipation system for dissipating heat from the heat-generating element, wherein the heat dissipation system adopts all the technical solutions of the embodiment of the cold plate type heat dissipation system with the air-cooling and liquid-cooling integrated architecture described above. Therefore, the main board according to this embodiment also has all the technical effects of the technical solutions of the above embodiment, and redundant explanations will be omitted here.

[0054] As shown in FIG. 10, this embodiment further provides a server, which mainly includes a housing, a main board installed in the housing, and heat dissipation fans installed on both ends of the housing, wherein the main board adopts all the technical solutions of the above main board embodiment, so the server according to this embodiment also has all the technical effects of the technical solutions of the above embodiment, and redundant explanations will be omitted here.

[0055] The above description of the disclosed embodiments will enable those skilled in the art to make and use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein. [Explanation of symbols]

[0056] Heat exchange cavity-1, water supply pipe-2, drain pipe-3, heat dissipation assembly-4, heat conduction assembly-5, heat equalizing plate-6, air-cooled heat dissipation plate-7, water distribution pipe-8, water collection pipe-9, heat conduction plate-10, guide chute-11, guide slider-12, engagement member-13, insertion / removal operation block-14, heat dissipation fin-41, extension sleeve-42, bottom heat pipe-51, upright heat pipe-52, top heat pipe-53, Attachment groove-101.

Claims

1. A cold plate type heat dissipation system with an air-cooled and liquid-cooled integrated architecture, comprising a heat exchange cavity (1), a water supply pipe (2) and a water drain pipe (3) communicating with the heat exchange cavity (1), the interior of the heat exchange cavity (1) being used to contain a cooling liquid, and the bottom surface of the heat exchange cavity (1) being used to contact a heat generating element, The heat exchanger further includes a heat dissipation assembly (4) and a heat conduction assembly (5) mounted within the heat exchange cavity (1); The heat dissipation assembly (4) includes at least one heat dissipation fin (41), the bottom of which is connected to the bottom surface of the heat exchange cavity (1) and extends along the height direction of the heat exchange cavity (1), and the water outlet of the water supply pipe (2) and the water inlet of the water drain pipe (3) are located at both ends of the heat dissipation fin (41) in the length direction, respectively; The cold plate type heat dissipation system with an air-cooling and liquid-cooling integrated architecture is characterized in that the bottom of the heat conduction assembly (5) is connected to the bottom surface of the heat exchange cavity (1), and the top of the heat conduction assembly (5) is connected to the top of the heat dissipation fins (41), so as to transfer a portion of the heat absorbed by the heat exchange cavity (1) to the top of the heat dissipation fins (41).

2. 2. The cold plate type heat dissipation system with an air-cooled and liquid-cooled integrated architecture as claimed in claim 1, wherein the water outlet of the water supply pipe (2) and the water inlet of the water drain pipe (3) are both connected to the top of the heat exchange cavity (1) and are respectively located at both ends in the longitudinal direction of the heat exchange cavity (1).

3. 2. The cold plate type heat dissipation system with an air-cooled and liquid-cooled integrated architecture as claimed in claim 1, wherein the water outlet of the water supply pipe (2) is connected to the top of the heat exchange cavity (1), the water inlet of the water drain pipe (3) is connected to the bottom of the side wall of the heat exchange cavity (1), and the water outlet of the water supply pipe (2) and the water inlet of the water drain pipe (3) are respectively located at both ends in the longitudinal direction of the heat exchange cavity (1).

4. The top wall of the heat exchange cavity (1) is a heat equalizer plate (6), The top of the heat dissipation fin (41) extends to be connected to the heat equalizing plate (6), and 2. The cold plate type heat dissipation system with air-cooled and liquid-cooled integrated architecture according to claim 1, wherein the heat equalizer (6) performs natural heat exchange of a part of the heat of the heat dissipation fins (41) with the external air.

5. 5. The cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture as claimed in claim 4, which is applied to a server including a heat dissipation fan, wherein the height of the heat exchange cavity (1) is equal to the height of the air channel formed by the heat dissipation fan in the server.

6. 6. The cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture as claimed in claim 5, characterized in that the heat dissipation assembly (4) includes two heat dissipation fins (41) at the beginning and end, the side walls on both sides of the width direction of the heat exchange cavity (1) are both heat conduction medium walls, the two heat dissipation fins (41) are respectively in close contact with the inner walls on both sides of the width direction of the heat exchange cavity (1), and the outer walls on both sides of the width direction of the heat exchange cavity (1) are both provided with air-cooled heat sinks (7).

7. The cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture as claimed in claim 1, characterized in that the bottom of the heat dissipation fin (41) is welded to the bottom surface of the heat exchange cavity (1), and the thickness of the heat dissipation fin (41) is 0.2 mm to 0.3 mm.

8. The cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture as claimed in claim 7, characterized in that the heat dissipation fins (41) have protrusions and / or grooves on both sides to increase their surface area.

9. The heat dissipation assembly (4) includes a plurality of heat dissipation fins (41), and the heat conduction assembly (5) includes a bottom heat pipe (51) coated on the bottom surface of the heat exchange cavity (1), a standing column heat pipe (52) standing on the surface of the bottom heat pipe (51), and a top heat pipe (53) provided at the tip of the standing column heat pipe (52); The upright heat pipe (52) extends vertically to a predetermined height position of the heat dissipation fin (41), and 2. The cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture as claimed in claim 1, wherein the top heat pipe (53) passes through the plurality of heat dissipation fins (41) in sequence.

10. 10. The cold plate type heat dissipation system with an air-cooling and liquid-cooling integrated architecture as described in claim 9, wherein the top heat pipe (53) penetrates the heat dissipation fin (41) vertically and penetrates the top and / or center of the heat dissipation fin (41).

11. 11. The cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture as described in claim 10, wherein the heat dissipation assembly (4) includes a plurality of heat dissipation fins (41), and the bottom heat pipes (5) extend along the arrangement direction of the plurality of heat dissipation fins (41) and are uniformly distributed along the length direction of the plurality of heat dissipation fins (41).

12. 10. The cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture as claimed in claim 9, wherein the heat dissipation assembly (4) comprises a plurality of heat dissipation fins (41), each of which has a through hole for passing the top heat pipe (53), and an extension sleeve (42) is connected between the hole walls of the through holes of two adjacent heat dissipation fins (41), and the extension sleeve (42) is used to fit onto the top heat pipe (53).

13. 13. The cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture as claimed in claim 12, wherein the gap between the outer wall of the top heat pipe (53) and the inner wall of the extension sleeve (42) is filled with a welded thermal conductive flux.

14. 2. The cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture according to claim 1, wherein the heat dissipation assembly (4) comprises a plurality of heat dissipation fins (41), and the cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture further comprises a water distribution pipe (8) communicating with the water outlet of the water supply pipe (2), the water distribution pipe (8) extending along the arrangement direction of the plurality of heat dissipation fins (41), and the water distribution pipe (8) has a plurality of uniformly distributed water outlets.

15. 15. The cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture according to claim 14, wherein the heat dissipation assembly (4) comprises a plurality of heat dissipation fins (41), and the cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture further comprises a water collection pipe (9) communicating with the water supply port of the drainage pipe (3), the water collection pipe (9) extending along the arrangement direction of the plurality of heat dissipation fins (41), and the water collection pipe (9) has a plurality of uniformly distributed water supply ports.

16. 2. The cold plate type heat dissipation system with air-cooled and liquid-cooled integrated architecture as claimed in claim 1, characterized in that a plurality of heat exchange cavities (1) are provided, each heat exchange cavity (1) is used to contact a different heat-generating element, and is connected in series via the water supply pipe (2) and the drain pipe (3).

17. The cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture according to any one of claims 1 to 16, further comprising a heat conduction plate (10) provided on the bottom surface of the heat exchange cavity (1), the bottom surface of the heat conduction plate (10) being a smooth plane, and used to press the top surface of the heat-generating element to absorb its heat.

18. 18. The cold plate type heat dissipation system with an air-cooling and liquid-cooling integrated architecture as described in claim 17, wherein the heat conduction plate (10) and the heat exchange cavity (1) are detachably connected so that a heat conduction plate (10) that matches the size of the heat-generating element is replaced for the heat exchange cavity (1).

19. The uppermost surface of the heat conducting plate (10) has a groove (101) at a fixed position. A guide chute (11) extending vertically is provided on the bottom surface of the heat exchange cavity (1), A guide slider (12) is provided in the guide chute (11), An engaging member (13) is provided at the bottom of the guide slider (12), An insertion / removal operation block (14) is provided on the side wall of the guide slider (12), The fastening member (13) is used to fasten and connect to the fastening groove (101), and 19. The cold plate type heat dissipation system with an air-cooled and liquid-cooled integrated architecture as described in claim 18, characterized in that the insertion / removal operation block (14) is used to apply a vertical force to the guide slider (12) so as to insert the engaging member (13) into the engaging groove (101) or to pull the engaging member (13) out of the engaging groove (101).

20. The tip of the guide slider (12) and the tip of the guide chute (11) are connected by magnetic attraction, and / or 20. The cold plate type heat dissipation system with air-cooling and liquid-cooling integrated architecture as claimed in claim 19, wherein the fastening member (13) and the fastening groove (101) are coupled by magnetic attraction.

21. A main board comprising a boat body, a heat-generating element provided on the surface of the boat body, and a heat dissipation system for dissipating heat from the heat-generating element, wherein the heat dissipation system is a cold plate type heat dissipation system with an air-cooling and liquid-cooling integrated architecture as described in any one of claims 1 to 20.

22. 22. A server comprising a housing, a main board mounted in the housing, and heat dissipation fans provided on both ends of the housing, wherein the main board is the main board described in claim 21.

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