Design of nano-precision short-pass stages for operation
Nano-precision short-pass stages with sub-50 nm alignment accuracy and advanced actuation mechanisms address the precision challenges of current short-pass stages, enabling precise alignment and bonding of dies to substrates for future wafer generations.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-01
- Publication Date
- 2026-03-13
AI Technical Summary
Current short-pass stages lack the necessary precision and means to achieve nano-precision operations required for future wafer generations, particularly the 450mm generation, due to electromagnetic and power amplification limitations, which hinder the reduction of moving mass and maintain sub-nanometer motion performance.
The development of nano-precision short-pass stages with sub-50 nm alignment accuracy, utilizing multiple stage modules and actuation mechanisms in X, Y, and θ directions, including in-plane and out-of-plane bending portions, actuators, and passive bending to align and bond dies to substrates with high precision.
Enables precise alignment and bonding of multiple dies to a substrate with sub-50 nm accuracy, addressing the precision needs for future wafer generations and extending existing 300mm technology to meet future productivity and overlay requirements.
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Figure 2026508875000001_ABST
Abstract
Description
[Technical Field]
[0001] Cross-reference of related applications This application claims priority to U.S. Provisional Patent Application No. 63 / 449,357, entitled “Nano-Precise Short-Stroke Stages,” filed on 2 March 2023, which is incorporated herein by reference in its entirety.
[0002] This disclosure relates in general to short-pass wafer stage systems, and more particularly to nano-precision short-pass stages for operation. [Background technology]
[0003] Currently, sub-nanometer motion performance for short-pass stages that transport substrates is achieved through 6-degree-of-freedom (DoF) operation and measurement. Thanks to optimized actuator efficiency and rigid body motion control, the hysterically moving mass on the stage can be kept largely constant over time. However, analysis of options for improving processing power indicates that this trend can no longer be maintained due to electromagnetic and power amplification limitations. To meet future productivity and overlay requirements, the moving mass needs to be significantly reduced. This is required to extend existing 300mm technology, specifically to enable the future 450mm generation. While the future transition remains uncertain and the wafer generation targets have not been changed by the International Roadmap Committee, it seems important to evaluate the benchmarks and productivity improvement options for both generations. For the 450mm generation, the development of stages and overlay systems is one of the key issues for the 32nm node and beyond.
[0004] Unfortunately, there are currently no means to achieve the necessary precision for short-pass stages to address these problems. Specifically, there are currently no means to achieve nano-precision short-pass stages for operation.
Summary of the Invention
Means for Solving the Problems
[0005] In one embodiment of the present disclosure, a system for aligning and bonding four or more dies to a substrate, comprising four or more stage modules utilized to enable alignment of four or more dies to the substrate. The alignment is performed with an alignment accuracy of sub-50 nm, and the four or more stage modules are actuated along one or more of the X direction, the Y direction, and the θ [Figure 4B] direction.
[0006] The above generally outlines the features and technical advantages of one or more embodiments of the present invention to facilitate a better understanding of the detailed description of the present invention that follows. Additional features and advantages of the present invention that can form the subject matter of the claims of the present invention will be described hereinafter.
[0007] A better understanding of the present invention can be obtained when the following detailed description is considered in conjunction with the following drawings.
Brief Description of the Drawings
[0008] [Figure 1] A diagram of an array of short-stroke stages for fine alignment and bonding of two or more, four or more, five or more, six or more, eight or more, ten or more, twelve or more, fifteen or more, twenty or more, thirty or more, fifty or more, or one hundred or more dies to one substrate or a corresponding number of substrates according to an embodiment of the present disclosure. [Figure 2] A schematic top view of a positioning stage according to an embodiment of the present disclosure. [Figure 3] A schematic front cross-sectional view of a positioning stage according to an embodiment of the present disclosure. [Figure 4A] A diagram of an in-plane bending mechanism according to an embodiment of the present disclosure. [Figure 4B]This is a diagram showing the direction of motion enabled by a single crab leg according to embodiments of the present disclosure. [Figure 5A] This is a diagram of an in-plane bending mechanism according to an embodiment of the disclosure. [Figure 5B] This figure shows the direction of motion of a single cross-bending element, including motion across an intermediate, according to embodiments of the present disclosure. [Figure 6A] This figure shows a double parallelogram structure arranged in a continuous manner to provide motion in directions X and Y with a considerable range of motion in both directions, according to an embodiment of the present disclosure. [Figure 6B] This is a diagram showing the structure of a double parallelogram element according to an embodiment of the present disclosure. [Figure 7A] This is a diagram of a bending unit connected to a mobile body according to an embodiment of the present disclosure. [Figure 7B] This is a diagram showing the structure of the bending unit shown in Figure 7A according to an embodiment of the present disclosure. [Figure 8A] This is a diagram of a bending unit arranged continuously in orthogonal directions to enable the movement of a moving body in two directions, according to an embodiment of the present disclosure. [Figure 8B] This is a diagram showing the structure of the bending unit shown in Figure 8A according to an embodiment of the present disclosure. [Figure 9A] This is a diagram of an actuator mounted along an axis outside the plane of a moving body, according to an embodiment of the present disclosure. [Figure 9B] This is a diagram of an actuator mounted along an axis perpendicular to the desired axis of motion of a moving body, according to an embodiment of the present disclosure. [Figure 10A] This is a diagram of a double slider out-of-planar mechanism according to an embodiment of the present disclosure. [Figure 10B] This is a top view of a double slider out-of-planar mechanism according to an embodiment of the present disclosure. [Figure 10C] This is a side view of a double slider out-of-planar mechanism according to an embodiment of the present disclosure. [Figure 10D] This is another side view of a double slider out-of-planar mechanism according to an embodiment of the present disclosure. [Figure 10E]This is an additional side view of the double slider out-of-planar mechanism shown in Figure 10D, according to an embodiment of the present disclosure. [Figure 10F] This is a top view of the side view of the double slider out-of-planar mechanism shown in Figure 10D, according to an embodiment of the present disclosure. [Figure 11A] This is a diagram of an out-of-plan bending mechanism according to an embodiment of the present disclosure. [Figure 11B] This is a front view of an out-of-planar bending mechanism according to an embodiment of the present disclosure. [Figure 11C] This is a top view of the front view of the out-of-plan bending mechanism shown in Figure 11B, according to an embodiment of the present disclosure. [Figure 11D] This is a side view of the front view of the out-of-plan bending mechanism shown in Figure 11B, according to an embodiment of the present disclosure. [Figure 11E] This is a side view of an out-of-planar bending mechanism according to an embodiment of the present disclosure. [Figure 11F] This is a top view of an out-of-plan bending mechanism according to an embodiment of the present disclosure. [Figure 11G] This is a diagram showing the structure of a bending unit as a single bending section according to an embodiment of the present disclosure. [Figure 11H] This is a diagram showing the structure of a bending unit as a parallelogram structure according to an embodiment of the present disclosure. [Figure 11I] This is a diagram showing the structure of a bending unit as a double parallelogram structure according to an embodiment of the present disclosure. [Figure 12A] This is a diagram illustrating an example of an out-of-plan bending mechanism according to an embodiment of the present disclosure, in which the bending portion is divided from an input block to two separate output blocks. [Figure 12B] This figure shows an alternative embodiment of an out-of-planar bending mechanism according to the embodiments of the present disclosure, in which the bending portion is divided from an input block to a single output block. [Figure 13A] This is a diagram of an out-of-planar bending linear mechanism according to an embodiment of the present disclosure. [Figure 13B] This figure shows a bending unit used in Figure 13A as a single bending section according to an embodiment of the present disclosure. [Figure 13C]This figure shows a bending unit used in Figure 13A as a parallelogram structure according to an embodiment of the present disclosure. [Figure 13D] This figure shows a bending unit used in Figure 13A as a double parallelogram structure according to an embodiment of the present disclosure. [Figure 14] This is a diagram of a lever-type out-of-plan mechanism according to an embodiment of the present disclosure. [Figure 15A] This is a top view of a support bending unit with a fixed body according to an embodiment of the present disclosure. [Figure 15B] This is a cross-sectional front view of a support bending unit with a fixed body according to an embodiment of the present disclosure. [Figure 15C] This is a cross-sectional side view of a support bending unit with a fixed body according to an embodiment of the present disclosure. [Figure 16A] This is a schematic diagram of a mechanism that utilizes a passive bending mechanism in combination with an actuator that operates in a vertical direction, according to an embodiment of the present disclosure. [Figure 16B] This is a schematic diagram of a mechanism that utilizes a passive bending mechanism in combination with an actuator that operates in a horizontal direction, according to an embodiment of the present disclosure. [Figure 17A] This is a side view of a passive bending mechanism according to the embodiment of the disclosure. [Figure 17B] This is a front view of the passive bending mechanism shown in Figure 17A according to the embodiment of the disclosure. [Figure 18A] This is a front view of a passive bending mechanism according to the disclosed embodiment. [Figure 18B] This is a top view of the passive bending mechanism shown in Figure 18A according to an embodiment of the present disclosure. [Figure 18C] This figure shows an extended configuration of the bending unit of the passive bending mechanism shown in Figure 18A, according to an embodiment of the present disclosure. [Figure 19A] This is a side view of a passive bending mechanism utilizing a hinge bending portion according to an embodiment of the present disclosure. [Figure 19B] This is a front view of a passive bending mechanism utilizing a hinge bending portion according to an embodiment of the present disclosure. [Figure 20A]This diagram shows the thermal effects carried out through an output light-emitting diode (LED) according to an embodiment of the present disclosure. [Figure 20B] This is a diagram illustrating a thermal action performed through an actively controlled heat exchanger according to an embodiment of the present disclosure. [Figure 21A] This is a diagram of an architecture for grouping actuators according to an embodiment of the present disclosure. [Figure 21B] This diagram shows an alternative architecture for bundling actuators according to an embodiment of the present disclosure. [Figure 21C] This diagram shows a further alternative architecture for bundling actuators according to embodiments of the present disclosure. [Figure 22A] This is a diagram of the architecture of the actuator stage interface arrangement according to an embodiment of the present disclosure. [Figure 22B] This is a diagram of an architecture of an alternative actuator stage interface arrangement according to an embodiment of the present disclosure. [Figure 22C] This diagram shows an architecture of a further alternative actuator stage interface arrangement according to an embodiment of the present disclosure. [Figure 23A] This is a diagram of a mechanism for θZ operation according to an embodiment of the present disclosure. [Figure 23B] This is a diagram of a linear spring according to an embodiment of the present disclosure. [Figure 23C] This is a diagram of a torsion spring according to an embodiment of the present disclosure. [Figure 24A] This figure shows actuator stabilization without an in-planar support bending unit for actuator stabilization, according to an embodiment of the present disclosure. [Figure 24B] This figure shows actuator stabilization with an in-planar support bending unit for actuator stabilization according to an embodiment of the present disclosure. [Figure 25A] This is a diagram showing a movable body connected to the output block of an out-of-planar bending mechanism according to an embodiment of the present disclosure. [Figure 25B]This diagram shows the layout of a moving body with a bent section for actuator stabilization according to an embodiment of the present disclosure. [Figure 25C] This is a schematic diagram of the corresponding actuator stage interface according to an embodiment of the present disclosure. [Figure 25D] This is a diagram of a support bending unit as a single bending section according to an embodiment of the present disclosure. [Figure 25E] This is a diagram of a support bending unit as a parallelogram structure according to an embodiment of the present disclosure. [Figure 25F] This is a diagram of a support bending unit as a double parallelogram structure according to an embodiment of the present disclosure. [Figure 25G] This is a cross-sectional view of a support bending unit according to an embodiment of the present disclosure. [Figure 26] This is a diagram showing the bent portion and the liquid-carrying interface according to the embodiment of the disclosure. [Figure 27] This is a diagram of a nano-precision positioning stage based on a rectified planar motor according to an embodiment of the present disclosure. [Figure 28A] This is a top view of magnetic field lines extending out of the plane from a magnet array according to an embodiment of the present disclosure. [Figure 28B] This is a top view of magnetic field lines progressing from a magnet array to a plane according to an embodiment of the present disclosure. [Figure 29A] This is a top view of the arrangement of magnets in a first configuration according to an embodiment of the present disclosure, in which the north poles and south poles alternately face the coil arrangement. [Figure 29B] This is a top view of the arrangement of magnets in a second configuration according to an embodiment of the present disclosure, in which the north poles and south poles alternately face the coil arrangement. [Figure 30] This is a top view of a magnet according to an embodiment of the present disclosure, in which the north pole and south pole are arranged in such a manner that they alternately face the direction of the coil arrangement. [Figure 31A] This is a top view of the arrangement of magnets in a first configuration in a one-dimensional Halbach array according to an embodiment of the present disclosure. [Figure 31B] This is a top view of the arrangement of magnets in a second configuration in a one-dimensional Halbach array according to an embodiment of the present disclosure. [Figure 32] This is a top view of the arrangement of magnets in a two-dimensional Halbach array according to an embodiment of the present disclosure. [Figure 33A] This is a diagram of a coil arrangement according to an embodiment of the present disclosure, in which each coil in the coil arrangement is a planar spiral. [Figure 33B] This is a diagram of a magnetic field generated by a coil through which an electric current passes, according to an embodiment of the present disclosure. [Figure 34A] This is a diagram of a coil arrangement according to an embodiment of the present disclosure, in which each coil in the coil arrangement is helical. [Figure 34B] This is a cross-sectional view of the coil arrangement shown in Figure 34A according to an embodiment of the present disclosure. [Figure 34C] This is a front view of a cross-section of a coil according to an embodiment of the present disclosure. [Figure 34D] This is an inverted rear view of the cross-section of the coil according to an embodiment of the present disclosure. [Figure 34E] This diagram shows the fabrication of each layer of a helical coil according to an embodiment of the present disclosure. [Figure 35A] This is a diagram of a coil array according to an embodiment of the present disclosure, in which each coil in the coil array is a closed polygon with sharp or rounded corners. [Figure 35B] This is a front view of Figure 35A according to an embodiment of the present disclosure. [Figure 36A] This is a diagram of individual coil elements grouped together and arranged orthogonally to one another, according to embodiments of the present disclosure. [Figure 36B] This is a diagram of individual coil elements in different orientations stacked on different planes according to embodiments of the present disclosure. [Figure 37] This is a flowchart illustrating a method for fabricating a magnet array according to an embodiment of the present disclosure. [Figure 38A] This is a cross-sectional view of fabricating a magnet array using the steps described in Figure 37 according to an embodiment of the present disclosure. [Figure 38B] This is a cross-sectional view of fabricating a magnet array using the steps described in Figure 37 according to an embodiment of the present disclosure. [Figure 38C] This is a cross-sectional view of fabricating a magnet array using the steps described in Figure 37 according to an embodiment of the present disclosure. [Figure 38D] This is a cross-sectional view of fabricating a magnet array using the steps described in Figure 37 according to an embodiment of the present disclosure. [Figure 39A] This is a top view of the operation based on a non-rectified planar motor (electromagnetic) according to an embodiment of the present disclosure. [Figure 39B] This is a front view of the operation based on a non-rectified planar motor (electromagnetic) according to an embodiment of the present disclosure. [Figure 40] This is a diagram illustrating the arrangement of an exemplary coil and magnet according to an embodiment of the present disclosure. [Figure 41A] This is a top view of a copper trace forming a rectangular spiral coil structure according to an embodiment of the present disclosure. [Figure 41B] This is a front view of a copper trace forming a rectangular spiral coil structure according to an embodiment of the present disclosure. [Figure 41C] This is a bottom view of a copper trace forming a rectangular spiral coil structure according to an embodiment of the present disclosure. [Figure 41D] This is a diagram of a resulting rectangular spiral coil structure according to an embodiment of the present disclosure. [Modes for carrying out the invention]
[0009] As previously mentioned, sub-nanometer motion performance for short-pass stages that transport substrates is currently achieved through 6-degree-of-freedom (DoF) operation and measurement. Thanks to the optimization of actuator efficiency and rigid body motion control, the hysterically moving mass on the stage can be kept fairly constant over time. However, analysis of options for improving processing power indicates that this trend can no longer be maintained due to electromagnetic and power amplification limitations. To meet future productivity and overlay requirements, the moving mass needs to be significantly reduced. This is necessary to extend existing 300mm technology, specifically to enable the future 450mm generation. While the future transition remains uncertain and the wafer generation targets have not been changed by the International Roadmap Committee, it seems important to evaluate the benchmarks and productivity improvement options for both generations. For the 450mm generation, the development of stage and overlay systems is one of the key issues for the 32nm node and beyond.
[0010] Unfortunately, there are currently no means to achieve the necessary precision for short-pass stages to address these problems. Specifically, there are currently no means to achieve nano-precision short-pass stages for operation.
[0011] The principle of the present invention, as will be further discussed later, involves X, Y, and θ with sub-50 nm precision. Z For operation in and θ X , θ Y The invention provides means for designing nano-precision short-path stages for active or passive control in Z.
[0012] Referring here to the figures in detail, Figure 1 shows an array of short-pass stages for fine alignment and coupling of two or more, four or more, five or more, six or more, eight or more, ten or more, twelve or more, fifteen or more, twenty or more, thirty or more, fifty or more, or one hundred or more dies on one substrate or a corresponding number of substrates, according to embodiments of the present disclosure.
[0013] As shown in Figure 1, Figure 1 illustrates the arrangement of short-stroke stages 105 mounted on the XY positioning stage 101B, with the transport wafer 102 located on the XY positioning stage 101A. Furthermore, as shown in Figure 1, the product die / substrate 103, along with gap-filling material 104 scattered between the product die / substrate 103, is located on the transport wafer 102.
[0014] Furthermore, as shown in Figure 1, the short-stroke stage module 105 is positioned below the XY positioning stage 101B. In one embodiment, a chuck module 106 is attached to the short-stroke stage module 105 and used to hold the die 107.
[0015] It should be noted that the approximate size shown in Figure 1 is not at a constant scale, and the die and substrate alignment is not at a constant scale. In one embodiment, such alignment is performed with an alignment accuracy of sub-50 nm.
[0016] Furthermore, Figure 1 shows how one or more short-stroke stage modules 105 are used to independently align one or more dies 107 to a product die / substrate 103, the product die / substrate 103 being placed on a transport wafer 102 with gap-filling material 104 (e.g., silicon dioxide) between the individual product dies 103. In one embodiment, the stage design is presented with two elements: (1) a support interface between the stationary and moving parts of the stage, and (2) an operating strategy for the motion of the central moving part. The support interface and operating strategy are defined in the X, Y, and θ directions of the short-stroke stage.Z Direction, Z direction, θ X Direction, and θ Y This enables control of combinations of 3 or more, 4 or more, 5 or more, 6 or more, 7 or more, 8 or more, 9 or more, or 10 or more directions.
[0017] In one embodiment, one or more of the following support methods are used: (1) a bent portion, and (2) a bent portion plus a liquid film.
[0018] In one embodiment, one or more of the following operating strategies are used: (1) bending-based operation, (2) planar motor-based operation-rectification, and (3) planar motor-based operation-unrectification. It should be noted that planar motor-based operation as used herein refers to electromagnetic operation. These short-stroke stages are compact, and their exemplary shape factors in the XY plane include 20 mm × 20 mm, 10 mm × 10 mm, and 5 mm × 5 mm.
[0019] It should be noted that, unless otherwise explicitly stated, the term "grounded body" as used herein refers to a mechanically grounded (not electrically grounded) rigid body.
[0020] Referring now to Figure 2, Figure 2 shows a schematic top view of a positioning stage according to an embodiment of the present disclosure.
[0021] As shown in Figure 2, the top view of the positioning stage 200 includes a movable body 201, an actuator 202 in conjunction with a bending portion 203, and a grounded main body / fixed body 204. Furthermore, the positioning stage 200 is equipped with optional measurement hardware 205.
[0022] Referring now to Figure 3, Figure 3 shows a schematic front cross-sectional view of a positioning stage according to an embodiment of the present disclosure.
[0023] As shown in FIG. 3, a cross-sectional view of the positioning stage 200 from the front includes the chuck module 106.
[0024] Referring to FIGS. 2 and 3, X, Y, and θ Z operate in, and Z, θ X , and θ Y The design based on the bending of the stage supported in is to actively or passively align one or more substrates 103 with respect to one or more substrates / templates / wafers / product substrates with accuracy on a scale of less than nanometers. FIGS. 2 and 3 show a rough schematic of the stage 200, and the bending portion 203 is designed as a supporting interface surface for connecting the central moving body / stage 201 and the grounded body (fixed body) 204 so as to make the movement of the moving body / stage 201 flexible in a desired direction and rigid in other directions.
[0025] In one embodiment, one or more of the following elements, namely, (1) in-plane bending portions, (2) out-of-plane bending portions, (3) passive bending portions, (4) actuators, and (5) bending portions for preventing parasitic motion, are present to achieve the desired functions and performance of the positioning stage, and the in-plane bending portions, out-of-plane bending portions, passive bending portions, and bending portions for preventing parasitic motion are collectively shown as element 203 in FIGS. 2 and 3.
[0026] The in-plane bending portions are used as a supporting interface surface between the grounded body (fixed body) 204 and the moving body 201. These bending portions provide flexibility in the in-plane directions, namely, X, Y, and θ Z while supporting the moving body 201 in the other three directions, namely, θ X , θ Y , and Z. The out-of-plane bending portions are used to transmit the motion from the actuator 202 to the moving body 201, and the actuator 202 is grouped in-plane or out-of-plane according to the requirements of the overall size and form factor of the stage determined by the use of the stage. The passive bending portions are θ X , θY , and a bend used to provide flexibility to the stage in Z.
[0027] It is noted that the in-plane bend constitutes the support interface. Other bends and mechanisms are provided to ensure the proper functioning of the bend as a support interface and are applicable to all other support interfaces.
[0028] The following section discusses in-plane bending mechanisms. In-plane bending sections, as used herein, are along in-plane axes, namely X, Y, and θ. Z This refers to a bend designed to allow for precise movement of the central stage / movable unit 201.
[0029] Referring to Figure 4A, Figure 4A shows an in-plane bending mechanism 400 according to an embodiment of the present disclosure.
[0030] In one embodiment, the in-plane bending mechanism 400 corresponds to a single bending unit known as a "crab leg," consisting of two bending sections 203 arranged continuously and orthogonally to allow movement in two directions, which in this case correspond to the X and Y directions.
[0031] Furthermore, Figure 4A shows that the moving body 201 has degrees of freedom in a plane, namely X, Y, and θ. Z To provide flexibility, a mechanism for arranging the in-plane bends is shown. In one embodiment, there are one or more crab legs 401 along both in-plane axes, with an equal number of crab legs 401 along both axes.
[0032] Referring now to Figure 4B, Figure 4B shows the direction of motion enabled by a single crab leg 401 according to an embodiment of the present disclosure.
[0033] The crab legs 401 as used herein refer to a set of orthogonal bends 203, such as bends 203' and 203'' arranged in succession, which allow movement in one direction in a plane and restrict movement in orthogonal directions in the plane. A bend 203' is an orthogonal bend with respect to its axis, as its axis of length and axial motion are orthogonal to each other. Similarly, a bend 203'' is called an "axis-oriented bend".
[0034] Referring now to both Figure 4A and Figure 4B, in one embodiment there is one or more crab legs 401 along the axes in both planes, with a different number of crab legs 401 along both axes.
[0035] In one embodiment, the length, width, and height of both bends 203 (e.g., bends 203' and 203'') of a single crab leg 401 are equal, resulting in equal stiffness being imparted by a single crab leg 401 regardless of the axis along which it is positioned. If there are an equal number of such crab legs 401 along both planes, the stiffness along both axes is equal and the structure is symmetrical.
[0036] In one embodiment, the length, width, and height of both bends 203 (e.g., bends 203' and 203'') of a single crab leg 401 vary depending on the desired stiffness or range of motion along a particular direction. Exemplary dimensions for these bends 203 are shown in Table 1.
[0037] [Table 1]
[0038] Referring now to Figure 5A, Figure 5A shows an in-plane bending mechanism 500 according to an embodiment of the present disclosure.
[0039] As shown in Figure 5A, the in-plane bending mechanism 500 includes a cross bending element 501 connected to a central stage / moving body 201. Furthermore, as shown in Figure 5A, the cross bending element 501 includes a grounded body 204.
[0040] In one embodiment, each cross-bending element 501 provides motion in a specific direction, and a suitable combination of such cross-bending elements 501 arranged in a specific manner can impart motion in a desired direction. In one embodiment, there are one or more cross-bending elements 501 that provide motion to the central stage / moving body 201 as desired.
[0041] Referring now to Figure 5B, Figure 5B shows the direction of motion of a single cross-bending element 501, including motion across the intermediate 502, according to an embodiment of the present disclosure.
[0042] As shown in Figure 5B, in one embodiment, the cross bending element 501 is symmetric with respect to the axis of the bent portion 203 labeled #1, that is, the dimensions of the bent portions 203 labeled #2 and #5, the dimensions of the bent portions 203 labeled #3 and #6, and the dimensions of the bent portions 203 labeled #4 and #7 are the same.
[0043] In one embodiment, the cross-bend element 501 is not symmetrical with respect to the axis of the bend 203 designated #1, in which case one or more dimensions of pairs of bends differ, i.e., the dimensions of the bends 203 designated #2 and #5, the dimensions of the bends 203 designated #3 and #6, and the dimensions of the bends 203 designated #4 and #7. The dimensions are derived so that the direction and range of motion are available as desired, while fulfilling the constraints / requirements of stiffness.
[0044] In one embodiment, one or more of the bent portions 203 (for example, bent portions 203 labeled #3 and #6) are rigid bodies.
[0045] In one embodiment, one or more cross-bending elements 501 are connected such that the angle between the bent portion 203 of the cross-bending element 501, which is indicated as #1, and the edge of the central stage / movable body 201 at the point of contact (hereinafter referred to as the "contact angle") is between 0° and 180°, including the angles of both boundaries.
[0046] In one embodiment, the intersecting bending elements 501 present in the mechanism 500 have the same contact angle.
[0047] In one embodiment, one or more intersecting bending elements 501 present in the mechanism 500 have different contact angles to achieve desired stiffness and motion along a particular axis.
[0048] Referring now to Figure 6A, Figure 6A shows a double parallelogram structure 601 arranged in a continuous manner to provide motion in directions X and Y with a considerable range of motion in both directions, according to an embodiment of the present disclosure.
[0049] Furthermore, Figure 6A shows an exemplary in-plane mechanism 600. In one embodiment, there are one or more double parallelogram elements 601 attached to a central stage / moving body 201 along both axes. These double parallelogram elements 601 have individual double parallelograms that provide motion along orthogonal axes.
[0050] In one embodiment, there are an equal number of double parallelogram elements 601 along each axis in the plane of the central stage / moving body 201. If the dimensions of each bend 203 are the same across all elements, the mechanism 600 provides symmetrical stiffness and range of motion with respect to both planes.
[0051] Referring now to Figure 6B, Figure 6B shows the structure of the double parallelogram element 601 according to an embodiment of the present disclosure.
[0052] As shown in Figure 6B, the double parallelogram element 601 contains a double parallelogram 602 connected via an intermediate body 603. Both double parallelograms 602 together form the double parallelogram element 601.
[0053] In one embodiment, within element 601, the dimensions of the bent sections 203 labeled #1 and #2 are the same as those of the bent sections 203 labeled #3 and #4, and the dimensions of the bent sections 203 labeled #3 and #4 are the same as those of the bent sections 203 labeled #7 and #8. This provides equal stiffness and range of motion on both axes of element 601. In one embodiment, the bent sections 203 labeled #3 and #4 are connected by an intermediate body 604. In one embodiment, the bent sections 203 labeled #5 and #6 and the bent sections 203 labeled #7 and #8 are connected by an intermediate body 605.
[0054] In one embodiment, within element 601, the dimensions of the bent portions 203 labeled #1 and #2 are the same as those of the bent portions 203 labeled #3 and #4, while the dimensions of the bent portions 203 labeled #3 and #4 are different from those of the bent portions 203 labeled #7 and #8. These dimensions are derived according to the desired stiffness and range of motion for each axis of element 601.
[0055] In one embodiment, within element 601, the dimensions of the bent portions 203 labeled #1 and #2 are different from those of the bent portions 203 labeled #3 and #4, while the dimensions of the bent portions 203 labeled #3 and #4 are the same or different from those of the bent portions 203 labeled #7 and #8. These dimensions are derived according to the desired stiffness and range of motion for each axis of element 601.
[0056] In one embodiment, all double parallelogram elements 601 attached to the central stage / moving body 201 have the same dimensions, providing symmetry in terms of stiffness and range of motion along the axes in both planes.
[0057] In one embodiment, one or more double parallelogram elements 601 attached to the central stage / moving body 201 have different dimensions. These dimensions are derived according to the desired overall stiffness and range of motion of the mechanism 600 in the axes in both planes.
[0058] Referring to Figure 7A, Figure 7A shows a bending unit 701 connected to the movable body 201 according to an embodiment of the present disclosure.
[0059] As shown in Figure 7A, the bending unit 701 allows motion in two orthogonal directions. With one or more of these bending units 701 attached to the moving body 201, the bending unit 701 moves in X, Y, and θ directions. Z It can have movement in that.
[0060] Furthermore, in one embodiment, there are one or more bending units 701 attached to the central stage / moving body 201 to enable the movement of the moving body along an axis in a plane.
[0061] Referring now to Figure 7B, Figure 7B shows the structure of the bending unit 701 of Figure 7A according to an embodiment of the present disclosure.
[0062] In one embodiment, the bending unit 701 includes a bending section 203 attached to a central stage / moving body 201. In one embodiment, the bending unit 701 includes a parallelogram structure 702 or a double parallelogram structure via an intermediate body 703, as shown in Figure 7B.
[0063] In one embodiment, all bending units 701 have a parallelogram structure 702 (bent portions 203 labeled #2 and #3) between the intermediate body 703 and the grounded main body 204. The dimensions of the bent portion 203 of the parallelogram structure 702 are the same as the bent portion 203 labeled #1.
[0064] In one embodiment, all bending units 701 have a double parallelogram structure between the intermediate body 703 and the grounded main body 204. The dimensions of these bending units 701 depend on the desired stiffness and range of motion in the direction in which this structure enables the movement of the stage.
[0065] In one embodiment, at least one bending unit 701 has a parallelogram structure 702 between the intermediate body 703 and the grounded main body 204, and at least one bending unit 701 has a double parallelogram structure between the intermediate body 703 and the grounded main body 204.
[0066] In one embodiment, all bending units 701 are structurally similar, and all bending sections 203 have the same dimensions across all modules.
[0067] In one embodiment, all bending units 701 are structurally similar, but the dimensions of the bent portions 203 in those bending units 701 differ. These dimensions depend on the requirements for the overall rigidity of the moving body motion along different axes.
[0068] Referring now to Figure 8A, Figure 8A shows a bending unit 701 arranged continuously in orthogonal directions to enable the movement of the moving body 201 in two directions, according to an embodiment of the present disclosure.
[0069] As shown in Figure 8A, one or more of these bending units 701 attached to the moving body 201 are in the X direction, Y direction, and θ direction. Z Provides operation in direction.
[0070] In one embodiment, one or more bending units 701, as shown in Figure 8A, are attached to the moving body 201 to form a support interface for the moving body 201.
[0071] Referring now to Figure 8B, Figure 8B shows the structure of the bending unit 701 of Figure 8A according to an embodiment of the present disclosure.
[0072] In one embodiment, the bending unit 701 consists of two bending sections 203 that are orthogonal to each other in a continuous manner in the XY plane, providing flexibility in both directions (X direction 801 and Y direction 802). Their dimensions are independent of each other and are derived according to the requirements for stiffness and range of motion.
[0073] In one embodiment, one or more bending units 701 have different dimensions of the same bend 203 across the bending unit 701.
[0074] Referring now to Figures 9A and 9B, Figure 9A shows an actuator 901 mounted along an axis outside the plane of the mobile body 201 according to an embodiment of the present disclosure. Figure 9B shows an actuator 901 mounted along an axis perpendicular to the axis of desired motion of the mobile body 201 according to an embodiment of the present disclosure.
[0075] Figures 9A and 9B show an architecture 900 that allows actuators (e.g., actuator 901) to be grouped together away from the point of operation of the moving body (e.g., moving body 201) so that the bending portion 203 and positioning sensors for the in-planar mechanism can be efficiently grouped together.
[0076] Furthermore, the architecture 900 includes an out-of-plane bend 902, which is a bend designed to transmit motion (see element 903) from an actuator 901 that is adapted to an axis different from the axis of the desired mobile motion 904, as shown in Figures 9A and 9B. The out-of-plane bend 902 has an input block that is directly connected to the actuator 901. Furthermore, in one embodiment, the out-of-plane bend 902 has an output block that is directly connected to the central stage / mobile body 201. The input block receives motion 903 from the actuator 901 through the bending mechanism, the motion 903 is transmitted to the output block, and the output block transmits motion 904 to the central stage / mobile body 201.
[0077] Referring now to Figures 10A to 10F, Figure 10A shows a double slider out-of-plane mechanism 1000, which is bent to the same degree as a rigid double slider, according to an embodiment of the present disclosure. In one embodiment, the double slider out-of-plane mechanism 1000 receives input motion from actuators grouped along the Z direction and converts it into motion of the moving body (e.g., moving body 201) in the X or Y direction, depending on the orientation of the mechanism relative to the moving body.
[0078] Figure 10B shows a top view of the double slider out-of-planar mechanism 1000 according to an embodiment of the present disclosure.
[0079] Figure 10C shows a side view of the double slider out-of-planar mechanism 1000 according to an embodiment of the present disclosure.
[0080] Figure 10D shows another side view of the double slider out-of-planar mechanism 1000 according to an embodiment of the present disclosure.
[0081] Figure 10E is an additional side view of the double slider out-of-planar mechanism 1000 of Figure 10D, according to an embodiment of the present disclosure.
[0082] Furthermore, Figure 10F is a top view of the side view of the double slider out-of-planar mechanism 1000 of Figure 10D according to an embodiment of the present disclosure.
[0083] In Figures 10A-10F, 11A-11I, 13A-13D, 14, 16A-16B, 18C, and 19A-19B, the identifier for the bent portion 203 is indicated by the bent portion identifier 1001. In Figures 10A-10F, 11A-11I, 13A-13D, 14, 16A-16B, 18C, and 19A-19B, the identifier for the main body is indicated by the main body identifier 1002. Furthermore, in Figures 10A-10F, 11A-11I, 13A-13D, 14, 16A-16B, 18C, and 19A-19B, the rigid body is indicated by the rigid body identifier 1003.
[0084] In one embodiment, the bent portion 203 identified by #19 serves as the main link in a mechanism 1000 that transmits motion from body #2 to body #3. The motion of body #2 is in the direction of actuator 901, and the motion of body #3 is in the direction of the desired motion of the moving body 201.
[0085] In one embodiment, the input block of the mechanism 1000 is a body #1 with any combination of bends 203 identified by #1, #2, #3, and #4 to assist the movement of body #1 along a straight line and restrict the movement of body #1 in other directions. Bend #17 of the bend 203, which is a hinge bend, facilitates minimizing parasitic motion transmission from body #1 to body #2.
[0086] In one embodiment, body #2 is attached to #19 of the bend 203 and to any combination of #5, #6, #7, and #8 of the bend 203 to transmit motion to body #3, which restricts the motion of body #2 in all directions, one of which is shown in Figures 10A to 10F.
[0087] In one embodiment, body #3 is attached to #19 of the bend 203 to receive motion from body #2, and is also attached to any combination of #9, #10, #11, and #12 of the bend 203, one of which is shown in Figures 10A to 10F, which restricts the motion of body #3 in all directions.
[0088] In one embodiment, the main body #4 acts as an output block with any combination of #13, #14, #15, and #16 of the bent portion 203. #18 of the bent portion 203, which is a hinge bend, facilitates minimizing the transmission of parasitic motion from the main body #3 to the main body #4.
[0089] In one embodiment, the main body #4 is connected to the stage's moving body 201 either directly or via an intermediate link.
[0090] In one embodiment, the actuator 901 is directly connected to the main body #2, which acts as an input block.
[0091] In one embodiment, the main unit #3 is directly connected to the mobile unit 201, in which case the main unit #3 is an output block.
[0092] In one embodiment, the angle α between #19 of the bent portion 203 and the plane of the moving body (shown as the dotted axis 1004 in Figure 10A) is between 0° and 90°, including 0° and 90°.
[0093] In one embodiment, one or more sets of any combination of support bending sections 203 (bending sections (1, 2, 3, 4), (5, 6, 7, 8), (9, 10, 11, 12), and (13, 14, 15, 16)) are used to support the movement of the corresponding body, depending on the rigidity requirements. The dimensions of these bending sections 203 depend on the rigidity requirements and the range of motion requirements.
[0094] Referring to Figures 11A to 11I, Figure 11A shows an out-of-planar bending mechanism 1100 according to an embodiment of the present disclosure.
[0095] Figure 11B shows a front view of the out-of-planar bending mechanism 1100 according to an embodiment of the present disclosure.
[0096] Figure 11C shows a top view of the front view of the out-of-plan bending mechanism 1100 shown in Figure 11B, according to an embodiment of the present disclosure.
[0097] Figure 11D shows a side view of the front view of the out-of-planar bending mechanism 1100 shown in Figure 11B, according to an embodiment of the present disclosure.
[0098] Figure 11E shows a side view of the out-of-planar bending mechanism 1100 according to an embodiment of the present disclosure.
[0099] Figure 11F shows a top view of the out-of-plan bending mechanism 1100 according to an embodiment of the present disclosure.
[0100] Figure 11G shows the structure of a bending unit 701 as a single bending section according to an embodiment of the present disclosure.
[0101] Figure 11H shows the structure of the bending unit 701 as a parallelogram structure according to an embodiment of the present disclosure.
[0102] Figure 11I shows the structure of the bending unit 701 as a double parallelogram structure according to an embodiment of the present disclosure.
[0103] Furthermore, as shown in Figures 11A to 11I, sections #1 to #16 of the bent portion 203 are "support" bending units 701. The structure of such support bending units 701 has different versions, as shown in Figures 11G to 11I, which were previously discussed.
[0104] In one embodiment, the out-of-plane bending mechanism 1100 receives input motion from actuators 901 arranged along the Z direction and converts it into motion of the moving body 201 in the X or Y direction, depending on the orientation of the mechanism 1100 relative to the moving body 201.
[0105] In one embodiment, body #1 is attached to actuator 901, and therefore body #1 acts as an input block. Body #1 is attached to any combination of support bending units #1, #2, #3, and #4. The structure of these support bending units can be a single bend, a parallelogram structure, or a double parallelogram structure, as shown in Figures 11G to 11I, respectively. The structure and dimensions of these support bending units 701 are independent of each other and are designed according to the rigidity and range of motion requirements of mechanism 1100.
[0106] In one embodiment, body #2 transmits its motion to body #3, which acts as an intermediate link to transmit the motion orthogonally. Body #2 is connected to a grounded body 204 via any combination of support bending sections #5, #6, #7, and #8. Their independent structures and dimensions are derived according to the requirements for rigidity and range of motion.
[0107] In one embodiment, the bending hinge #17 acts as an interface between body #1 and body #2 in order to minimize parasitic interference in the transmission of motion from body #1 to body #2, and to minimize the transmission of shear force to the actuator due to slight rotation of body #2.
[0108] In one embodiment, body #4 receives motion from body #3 on the axis of the desired motion of the central stage / moving body 201. Body #3 is connected to any combination of support bending units #9, #10, #11, and #12. Their structures and dimensions, which are independent of each other, are derived according to the requirements for rigidity and range of motion.
[0109] In one embodiment, the bending hinge #18 receives motion from the main body #4 and transmits that motion forward to a structure attached to the bending hinge #18. This hinge acts as an interface to minimize the transmission of parasitic motion due to slight rotation of the main body #4.
[0110] In one embodiment, the main body #5 receives motion from the bending hinge #18 and transmits that motion to the bending hinge #19.
[0111] In one embodiment, the bending hinge #19 receives motion from the main body #5 and transmits that motion to the main body #6. This hinge acts as an interface to minimize the transmission of parasitic motion from the main body #5 to the main body #6 due to slight rotation of the main body #6.
[0112] In one embodiment, body #6 is directly connected to the moving body 201 and thus acts as an output block. Body #6 is connected to any combination of support bending structures #13, #14, #15, and #16. Their structures and dimensions, which are independent of each other, are derived according to the requirements for rigidity and range of motion.
[0113] It should be noted that the top view of main body #2 with bent sections #5, #6, #7, and #8 in Figure 11C is the same as the top view of main body #1. Furthermore, it should be noted that the side view of main body #3 with bent sections #9, #10, #11, and #12 in Figure 11E is the same as the top view of main body #1.
[0114] Figure 12A shows an exemplary out-of-planar bending mechanism 1200 according to an embodiment of the present disclosure, in which the bending portion 203 is divided from an input block into two separate output blocks. Figure 12B shows an alternative embodiment of the out-of-planar bending mechanism 1200 according to an embodiment of the present disclosure, in which the bending portion 203 is divided from an input block into a single output block.
[0115] Referring to Figures 12A to 12B, the out-of-plane bending mechanism 1200 receives input motion from actuators 901 arranged along the Z direction and converts it into motion of the moving body 201 in the X or Y direction, depending on the orientation of the mechanism 1200 relative to the moving body 201.
[0116] In one embodiment, the bending section 203 is separated from the input block 1201 into two separate bodies, both of which function as output blocks 1202, and the output blocks 1202 are connected to a central stage / moving body 201 as shown in Figure 12A.
[0117] In one embodiment, the angle α, as shown in Figure 12A, is in the range between 0° and 90°, including those values.
[0118] In one embodiment, the bent sections 203 extend parallel to each other from the input block 1201 to a single output block 1202, as shown in Figure 12B.
[0119] In one embodiment, the angle β, as shown in Figure 12B, is in the range between 0° and 90°, including those between them.
[0120] In one embodiment, the dimensions of the bent portion 203 and the angle between the bent portion 203 and their respective original bodies are independent and are derived according to the requirements for rigidity and range of motion.
[0121] Figure 13A shows an out-of-plane bending straight mechanism 1300 according to an embodiment of the present disclosure.
[0122] Referring to Figure 13A, in one embodiment, block #1 is connected to actuator 901 and therefore acts as input block 1201.
[0123] In one embodiment, body #2 acts as a rigid link actuated by input block 1201. Its rotation is enabled through hinges #1 and #2 when it receives motion from input block 1201.
[0124] In one embodiment, hinge #3 receives rotational motion from body #2 and transmits the motion to body #3.
[0125] In one embodiment, body #3 acts as an intermediate link, and its rotation is made possible via hinges #3, #4, and #6.
[0126] In one embodiment, body #4 acts as an intermediate link between the grounding body 204 and body #3, and is hinged at two locations, namely hinges #4 and #6, which allow body #3 to rotate. The purpose of body #4 is to restrict the motion of body #3 so that there is a desired rotational movement that can be converted into linear motion in a desired direction at hinge #6.
[0127] In one embodiment, body #5 receives motion from body #3 via hinge #6. The motion of body #5 in the linear direction is enabled by support bending sections #7 and #8 of the support bending section 203, which can be combined to form a bending unit 701, and the bending unit 701 can be structured as a single bending section, a parallelogram structure, or a double parallelogram structure, as shown in Figures 13B to 13D, respectively. Figure 13B shows the bending unit 701 used in Figure 13A as a single bending section according to an embodiment of the present disclosure. Figure 13C shows the bending unit 701 used in Figure 13A as a parallelogram structure according to an embodiment of the present disclosure. Figure 13D shows the bending unit 701 used in Figure 13A as a double parallelogram structure according to an embodiment of the present disclosure.
[0128] Referring now to Figure 14, Figure 14 shows a lever-type out-of-planar mechanism 1400 according to an embodiment of the present disclosure.
[0129] In one embodiment, the lever-type out-of-planar mechanism 1400 receives input motion from actuators 901 grouped along the X or Y direction and converts it into motion of the moving body 201 in the X or Y direction, depending on the orientation of the mechanism 1400 relative to the moving body 201.
[0130] In one embodiment, mechanism 1400 is a bending section version of a first type lever. In one embodiment, body #2 acts as a first type lever.
[0131] In one embodiment, the point of force application of the lever is attached to the body #1 through the hinge #1. In this case, the body #1 acts as an input block 1201 for the mechanism 1400.
[0132] In one embodiment, the point of action of the lever is attached to the main body #3 through the hinge #3, in which case the main body #3 acts as the output block 1202 of the mechanism 1400.
[0133] In one embodiment, body #3 is attached to support bending sections #4 and / or #5 of support bending sections 203, which can be combined to form a bending unit 701, and the bending unit 701 can be structured as a single bending section, a parallelogram structure, or a double parallelogram structure, as shown in Figures 13B to 13D, respectively. By utilizing such a structure, the rotational motion transmitted from body #2 to body #3 is minimized. Furthermore, by utilizing such a structure, body #3 can transmit linear motion to the central stage / moving body 201.
[0134] Referring now to Figures 15A to 15C, Figure 15A shows a top view of a support bending unit 701 with a fixed body according to an embodiment of the present disclosure. Figure 15B shows a cross-sectional front view of the support bending unit 701 with a fixed body according to an embodiment of the present disclosure. Figure 15C shows a cross-sectional side view of the support bending unit 701 with a fixed body according to an embodiment of the present disclosure.
[0135] In one embodiment, the arrangement of the support bending unit 701 in the plane, as shown in Figures 15A to 15C, eliminates the parasitic motion of the output block 1202 of the out-of-plane bending mechanism described earlier. Furthermore, such an arrangement provides an efficient connection between the moving body 201, the in-plane mechanism, and the out-of-plane mechanism.
[0136] In one embodiment, the support bending units 701 of the out-of-planar bending mechanisms 1100 and 1200 are attached to the fixed wall 1501 as shown in Figures 15A to 15C. In one embodiment, the fixed wall 1501 and these support bending units 701 are grounded to the movable body 201, and therefore the units 701 are positioned between the movable body 201 and the fixed wall 1501 to provide convenience for efficiently grouping the bent sections 203.
[0137] In one embodiment, the output blocks 1202 of the out-of-planar bending mechanisms 1100 and 1200 are positioned on top of a support bending unit 701 that is placed between a fixed wall 1501 and a movable body 201 of the stage.
[0138] In one embodiment, the support bending unit 701 is a single bending section, a parallelogram structure, or a double parallelogram structure. The structure and dimensions of the bending sections of these units 701 are independent of each other and are derived according to the requirements for rigidity and range of motion.
[0139] Now, let's consider the passive bending section. Referring to Figures 16A to 16B, Figure 16A shows a schematic of a mechanism 1600 that utilizes a passive bending mechanism 1601 in combination with an actuator that operates in the vertical direction (e.g., actuator 901) according to an embodiment of the present disclosure. Figure 16B shows a schematic of a mechanism 1600 that utilizes a passive bending mechanism 1601 in combination with an actuator that operates in the horizontal direction (e.g., actuator 901) according to an embodiment of the present disclosure.
[0140] Referring to Figures 16A and 16B, the passive bending mechanism 1601 positioned on the chuck module 106 is Z, θ X , and θ Y It is designed to provide flexibility to the moving body 201. Such a passive bending mechanism 1601 is not designed for active control / actuation along such a direction. Therefore, the passive bending mechanism 1601 is referred to herein as the “passive” bending mechanism 1601.
[0141] In one embodiment, the stage / moving body 201 is X, Y, and θ Z It can be operated in X, Y, and θ degrees of freedom, but not actively operated in the remaining three degrees of freedom. Therefore, active bending parts such as the passive bending mechanism 1601 are not activated when the stage / moving body 201 moves in X, Y, and θ degrees of freedom. Z Without causing interference in Z, θ X , and θ Y In order to be able to deal with external forces in the direction of Z, θ X , and θ Y It is designed to add flexibility. The passive bending mechanism 1601 is solely for supporting the stage / moving body 201 to cope with external forces, and therefore the bending portion of the passive bending mechanism 1601 is not actuated, hence the name "passive" bending portion.
[0142] Referring now to Figures 17A and 17B, Figure 17A shows a side view of the passive bending mechanism 1601 according to an embodiment of the present disclosure. Figure 17B shows a front view of the passive bending mechanism 1601 of Figure 17A according to an embodiment of the present disclosure.
[0143] As shown in Figures 17A to 17B, the passive bending mechanism 1601 is θ X and θ Y A bending hinge is used to provide flexibility.
[0144] In one embodiment, body #1 is connected to the central stage / movable body 201, and on the opposite side, it is connected to body #2 via bending hinges #1 and #2 as shown in Figure 17B. These hinges are θ X This provides flexibility to the main body #2.
[0145] In one embodiment, body #2 is connected to body #3 via two bending hinges #3 and #4, as shown in Figure 17A. These hinges are θ Y This provides flexibility to the main body #3.
[0146] In one embodiment, the main body #3 is connected to the chuck module 106. As a result, the chuck module 106 is θ X and θ Y It has flexibility in this regard, which allows it to resist external forces acting on the die without interfering with the operation of the central stage / movable body 201.
[0147] Referring now to Figure 18A, Figure 18A shows a front view of a passive bending mechanism 1601 according to an embodiment of the present disclosure.
[0148] In one embodiment, the passive bending mechanism 1601 is constructed in a manner that allows flexibility in the Z direction. In one embodiment, a set of three bending units 701 (indicated as 701A to 701C) is constructed to make the passive bending mechanism 1601 flexible in the Z direction.
[0149] In one embodiment, a set of three bending units 701 (labeled 701A to 701C in Figure 18A) assembled as shown in Figure 18A, is located at Z, θ X , and θ Y This collectively enables flexibility. Depending on the external force acting on the chuck module 106, these units will be displaced along the Z direction accordingly.
[0150] Figure 18B shows a top view of the passive bending mechanism 1601 of Figure 18A according to an embodiment of the present disclosure.
[0151] Figure 18C shows an extended form of the bending unit 701A of the passive bending mechanism 1601 shown in Figure 18A, according to an embodiment of the present disclosure. Figure 18C shows both a top view and a front view of the bending unit 701A.
[0152] Referring now to Figures 19A and 19B, Figure 19A shows a side view of a passive bending mechanism 1601 utilizing a hinge bending portion according to an embodiment of the present disclosure. Figure 19B shows a front view of a passive bending mechanism 1601 utilizing a hinge bending portion according to an embodiment of the present disclosure.
[0153] In one embodiment, the main body #1 is attached to the central stage / movable body 201, as shown in Figures 19A and 19B. On the opposite side of the main body #1, θ X and θ Y There is a two-degree-of-freedom bending hinge (hinge #1 in Figures 19A-19B) that can provide flexibility in both directions.
[0154] In one embodiment, the bending hinge #1 is attached to a body #2 which acts as an intermediate between the bending hinge #1 and the bending portions #2 and #3 of the bending portion 203, as shown in Figure 19B. The body #2 also acts as a ground for the bending portions #2 and #3 of the bending portion 203.
[0155] In one embodiment, #2 and #3 of the bent portion 203 are connected to the main body #3 and supported via #2 and #3 of the bent portion 203, and #2 and #3 of the bent portion 203 restrict the degrees of freedom of the main body #3 in all directions, but not in one direction, namely the Z direction.
[0156] As shown in Figures 9A and 9B, the actuators 901 are grouped together in a plane that is offset at a specific distance from the plane of the central stage / moving body 201, either along the Z-axis or along the X-axis or Y-axis. Grouping the actuators 901 in this manner provides sufficient space to accommodate a complex and densely grouped bending mechanism within the plane, while requiring a smaller footprint in the XY plane.
[0157] In one embodiment, one or more actuators 901 are piezoelectric actuators (PZTs). The PZTs have operating accuracy on the nm scale and can enable stage operating accuracy on the nm scale.
[0158] In one embodiment, one or more actuators 901 are voice coil motors (VCMs). The VCMs have nanometer-scale operating accuracy and can provide large operating forces. Precise current control allows the VCMs to accurately actuate the bending mechanism, and as a result, the central stage / moving body 201 can be actuated with nanometer-scale accuracy.
[0159] Referring now to Figures 20A and 20B, Figure 20A shows the thermal action carried out through an output light-emitting diode (LED) 2001 according to an embodiment of the present disclosure. Figure 20B shows the thermal action carried out through an actively controlled heat exchanger 2002 according to an embodiment of the present disclosure.
[0160] In one embodiment, one or more actuators 901 are thermal actuators. These actuators are structures made from materials with a large coefficient of thermal expansion. A heat source, such as a high-power LED 2001 or a heat exchanger 2002, can be used to inflate / contract an actuating bar 2003 as shown in Figures 20A-20B. For expansion / contraction, the actuating bar 2003 applies force to an out-of-plane bending mechanism, which in turn actsuates a central stage / moving body 201. The heat exchanger 2002 may be based on convection, radiation, or both.
[0161] Referring to Figure 20B, coil 2004 in the heat exchanger 2002 indicates that the temperature is high and the operating bar 2003 is in an expanded state, while coil 2005 indicates that the temperature is low and the operating bar 2003 is in a contracted state.
[0162] In one embodiment, one or more actuators 901 are direct-drive DC linear motors.
[0163] In one embodiment, one or more actuators 901 are screw-driven actuators having a rotary motor as the actuator.
[0164] Referring now to Figures 21A to 21C, Figure 21A is a diagram of an architecture for bundling the actuators 901 according to an embodiment of the present disclosure. Figure 21B shows an alternative architecture for bundling the actuators 901 according to an embodiment of the present disclosure. Figure 21C shows a further alternative architecture for bundling the actuators 901 according to an embodiment of the present disclosure.
[0165] As shown in Figures 21A to 21C, the architecture for integrating the actuators 901 allows for a compact installation area for the necessary in-plane bending mechanisms 400 and 500.
[0166] In one embodiment, one or more actuators 901 are grouped together along the Z-axis, as shown in Figure 21A. In one embodiment, the out-of-plane bending mechanisms 1100, 1200 convert the actuator motion along the Z-axis into stage motion along the X-axis or Y-axis.
[0167] In one embodiment, one or more actuators 901 are grouped along the X-axis or Y-axis but are offset from the plane of the moving body in a plane. In one embodiment, the out-of-plane bending mechanisms 1100, 1200 transmit the motion of the actuators 901 in the offset plane to the plane of the moving body.
[0168] In one embodiment, one or more actuators 901 are arranged such that their motion lies in the plane of the moving body 201. This arrangement offers the advantage of a smaller number of parts in the assembly and minimizes potential parasitic interference introduced by the out-of-plane bending mechanisms 1100, 1200.
[0169] Referring now to Figures 22A to 22C, Figure 22A shows an architecture of actuator stage interface arrangement according to an embodiment of the present disclosure. Figure 22B shows an alternative actuator stage interface arrangement architecture according to an embodiment of the present disclosure. Figure 22C shows a further alternative actuator stage interface arrangement architecture according to an embodiment of the present disclosure.
[0170] As shown in Figures 22A to 22C, the actuator stage interface 2201 applies force to the stage (in other words, imparts motion) in order to achieve motion in the desired direction.
[0171] In one embodiment, two actuator stage interfaces 2201 are used for operation in the X direction, and one actuator stage interface 2201 is used for operation in the Y direction, as shown in Figure 22A. Furthermore, the two actuator stage interfaces 2201 along the X direction are θ Z It is also possible to provide operation in which the magnitude and / or direction of operation are not the same for both interfaces 2201.
[0172] In one embodiment, one actuator stage interface 2201 is attached to the moving body 201 at each of its four sides, as shown in Figure 22B. Each interface 2201 is located at a specific offset from the center of the edge of the moving body 201 to which it connects. Through appropriate kinematics of the system, the desired motion is achieved across all three desired axes, namely X, Y, and θ. Z This can be achieved in [location].
[0173] In one embodiment, the actuator stage interface 2201 is connected to one edge of the moving body 201 to act along the X direction, and the same arrangement is connected to orthogonal edges for actuation along the Y direction, as shown in Figure 22C. The appropriate actuation forces and their directions through these actuator stage interfaces allow for operation along the X, Y, and θ directions. Z The desired operation can be achieved in this case.
[0174] As shown in Figures 22A to 22C, the actuator stage interface 2201 can be positioned in different directions in the plane in multiple configurations. These interfaces 2201 are mechanisms that are rigidly connected to the central stage / moving body 201.
[0175] Referring to Figure 23A, Figure 23A shows the θ according to an embodiment of the present disclosure. Z This shows the mechanism for operation.
[0176] In one embodiment, θ Z The operation in this system is achieved by adding a rotary stage in series with the XY stage. Figure 23A shows an exemplary design of one such continuous mechanism. In one embodiment, one or more stage grounding interfaces 2301 are attached to the central stage / moving body 201 at their edges. Each stage grounding interface 2301 may have dimensions of their elements independent of each other and is designed according to the requirements of the application of rigidity.
[0177] In one embodiment, the stage grounding interface 2301 comprises one or more springs 2302, such as a linear spring 2302', to provide a restoring force in the opposite direction to the force applied by the actuator stage interface 2201. An illustration of a spring 2302 corresponding to the linear spring 2302' is provided in Figure 23B according to an embodiment of the present disclosure.
[0178] One or more of these springs 2302 are helical tension springs, helical compression springs, leaf springs, or bends 203. An illustration of a spring 2302 corresponding to a torsion spring 2302'' is provided in Figure 23C according to an embodiment of the present disclosure.
[0179] Referring to Figures 23A to 23C, in one embodiment, one or more actuator stage interfaces 2201 are included to apply actuation forces, as shown in Figures 23A to 23C. These forces, when at a certain distance from the center of mass of the moving body, create a torque along the Z direction, and consequently, θ Z The stage is operated in the direction. These actuator-stage interfaces 2201 are either the output block (e.g., output block 1202) of the out-of-planar bending mechanism (e.g., out-of-planar bending mechanism 1100, 1200), or the actuator 901 itself if the actuator 901 is grouped together in the same plane as the moving body 201.
[0180] In one embodiment, the stage grounding interface 2301 consists of a torsion spring 2302'', as shown in Figure 23C, with its axis aligned in the Z direction. In this configuration, the torsion spring 2302'' provides recovery / resistance torque in the Z direction.
[0181] In one embodiment, one or more stage grounding interfaces 2301 with one or more linear springs 2302' are attached to a central stage / movable body 201 together with a stage grounding interface 2301 with torsion springs 2302''.
[0182] Referring to Figures 24A and 24B, Figure 24A shows actuator stabilization without an in-planar support bending unit for actuator stabilization according to an embodiment of the present disclosure. Figure 24B shows actuator stabilization with an in-planar support bending unit for actuator stabilization according to an embodiment of the present disclosure.
[0183] In one embodiment, an in-planar support bending unit 701 (having a similar structure to the bending unit 701) is attached to the output block 1202 of an out-planar mechanism (e.g., out-planar mechanisms 1100, 1200) (served as the actuator stage interface 2201) so that the out-planar mechanism has flexibility in a direction perpendicular to its direction of operation. This is to protect the out-planar mechanism assembly from forces acting on these mechanisms when the moving body 201 is operated in a direction perpendicular to its direction of operation. For example, when #2 and #4 of the output block 1202 operate the moving body 201 along the X direction, forces act on #1 and #3 of the output block 1202, which could damage the corresponding out-planar mechanism assembly, as shown in Figure 24B. The support bending unit 701 absorbs these forces, and the out-planar mechanism assembly corresponding to #1 and #3 of the output block 1202 remains harmless, as shown in Figure 24B.
[0184] As shown in Figure 24A, outputs #1 and #3 of output block 1202 will be deformed by force when there is no in-plane support bending unit for actuator stabilization as shown in Figure 24A.
[0185] Furthermore, as shown in Figures 24A and 24B, the mobile body 201 moves in the X direction when it is activated in the X direction.
[0186] Furthermore, Figures 24A to 24B show the force acting on the actuator stage interface 2201 in the Y direction (see element 2401) when the stage 201 is operated in the X direction.
[0187] As shown in Figures 24A and 24B, when the stage is actuated to X, the actuator-stage interface 2201 in the Y direction receives forces that, in the absence of an in-plane support bending unit (e.g., support bending unit 701) for actuator stabilization, could be transmitted to various components of the out-of-plane bending mechanism (e.g., out-of-plane mechanisms 1100, 1200) and ultimately to the actuator (e.g., actuator 901). These forces could even lead to mechanical failure of various components of the out-of-plane bending mechanism (e.g., out-of-plane bending mechanisms 1100, 1200). However, when these support bending mechanisms (e.g., support bending unit 701) are present, these bending sections 203 provide flexibility in the direction of the moving body's movement, absorbing the forces generated by the moving body's movement and preventing those forces from being transmitted to sensitive components of the out-of-plane mechanism.
[0188] Referring to Figure 25A, Figure 25A shows a movable body (e.g., movable body 201) connected to an output block 1202 of an out-of-planar bending mechanism (e.g., out-of-planar bending mechanisms 1100, 1200) according to an embodiment of the present disclosure. Furthermore, Figure 25A shows the direction of motion of the output block 1202 of the out-of-planar bending mechanism (see element 2501).
[0189] Figure 25B is a diagram showing the layout of the movable body 201 with a bent portion 203 for actuator stabilization according to an embodiment of the present disclosure.
[0190] Figure 25C shows a corresponding schematic of the actuator stage interface 2201 according to an embodiment of the present disclosure.
[0191] Furthermore, the support bending unit 701 of the mobile body 201 can correspond to one of three different structures as shown in Figures 25D to 25F. Figure 25D shows the support bending unit 701 as a single bending section according to an embodiment of the present disclosure. Figure 25E shows the support bending unit 701 as a parallelogram structure according to an embodiment of the present disclosure. Figure 25F shows the support bending unit 701 as a double parallelogram structure according to an embodiment of the present disclosure. The structure and size of the bending section of the support bending unit 701 are independent of each other and are designed according to the rigidity requirements and range of motion requirements of the mechanism. Since these bending units 701 are connected to the central stage / mobile body 201, the grounded body 204 shown in Figures 25D to 25F represents the connection to the central stage / mobile body 201.
[0192] A cross-sectional view of the support bending unit 701 is shown in Figure 25G according to an embodiment of the present disclosure.
[0193] Referring to Figure 26, Figure 26 shows the bent portion and the liquid-carrying interface according to an embodiment of the present disclosure.
[0194] Figure 26 shows a schematic design of an example of a supported bending section + stage with liquid. In one embodiment, the moving body 201 is attached to one or more previously considered in-plane bending mechanisms (e.g., in-plane bending mechanisms 400, 500). These bending sections 203 provide support to the moving body 201 along the Z direction, and along the X, Y, and θ directions. Z It is flexible in accordance with this.
[0195] In one embodiment, the stationary body 2601 is located above or below the mobile body 201 to provide a surface for storing a thin film of liquid. This liquid film has a suitable thickness to have a large capillary force in order to hold the two surfaces around it together, that is, to hold the stationary body 2601 and the mobile body 201 together. The advantage of this film is that it can hold the mobile body 201 relative to the stationary body 2601 along the Z direction, while providing extreme flexibility in the X and Y directions. Furthermore, the film is θ X , θ Y In the Z region, and in the Z region, resistance to parasitic motion of the moving body 201 is provided. This helps to reduce operational errors in the stage, and thus accuracy is greatly improved.
[0196] In one embodiment, a chuck module 106 for chucking the die 107 is attached to a movable body 201, and the opposite side of the movable body 201 is in contact with a liquid film from a liquid layer 2602 located between the movable body 201 and a fixed body 2601.
[0197] In one embodiment, there is a liquid layer 2602 between the die 107 and the wafer 102, and the liquid layer 2602 also has a large capillary force to hold the die 107 and the surface of the wafer 102 together. In one embodiment, the liquid layer 2602 supports the moving body 201 in the Z direction and θ X , θ Y , and also provides the same functionality as preventing parasitic movement of the die 107 (ultimately the mobile body 201) relative to the wafer 102 in Z.
[0198] In one embodiment, the liquid layer 2602 helps prevent the transmission of parasitic motion of the moving body 201 to the die 107, and at the same time protects the moving body 201 from external forces acting on the die 107, Z, θ X , and θ Y To provide support in this regard.
[0199] Various operating strategies are being considered below. Specifically, the following describes an operating architecture developed to function with the previously considered support interface. These operating architectures are designed considering the support interface, the rigidity of the structure, the requirements of the movement range, the nm-scale accuracy, and the spatial constraints imposed by the resistance to parasitic movement.
[0200] One type of operating strategy is to utilize the previously considered bending-based operation. For example, an exemplary architecture for incorporating actuator 901 or actuator stage interface 2201 with in-plane bending section 203 has been previously considered. Further, the exemplary orientation and arrangement of actuator stage interface 2201 have been previously considered. Finally, an additional mechanism for preventing the harmful forces of stage operation from being transmitted to the incorporated actuator 901 in the direction of movement orthogonal to the direction of operation at any given time has been previously considered.
[0201] Another type of operating strategy is the operation based on a rectified planar motor, which is considered below in relation to FIG. 27.
[0202] FIG. 27 shows a nano-accuracy positioning stage based on a rectified planar motor according to an embodiment of the present disclosure.
[0203] As shown in FIG. 27, chuck module 106 includes magnet array holding plate 2701 that holds permanent magnet array 2702. Further, FIG. 27 shows thermally stable PCB (printed circuit board) 2703 with induction element 2704. Also, FIG. 27 shows thin liquid film 2705 between glass wafers 2706 (for interaction). In one embodiment, liquid film 2705 is water. Further, FIG. 27 shows magnetic field interaction section 2707 between induction element 2704 and permanent magnet array 2702.
[0204] In one embodiment, the coil array and the magnet array 2702 create electromagnetic and magnetic fields that interact with each other to create an actuating force. Precise control of the current flowing through the coils can result in precise control of the actuating force, and consequently, precise control of the actuation along X, Y, and θ Z can be achieved.
[0205] In one embodiment, the design of a nano-precision positioning stage based on the planar motor of FIG. 27 is based on the electromagnetic actuation of the moving body 201, which provides precise positioning of the stage.
[0206] In one embodiment, several inductive elements 2704 are laid out in a planar manner, and a current of appropriate magnitude is passed through these elements to generate a magnetic field around the inductive elements 2704. In offset parallel planes, the magnetic field interacts with the electromagnetic field of the inductive elements 2704 (see element 2707), and as a result, a force is generated that can be used to actuate a plane that moves freely with respect to a mechanically grounded plane. The array of permanent magnets is laid out.
[0207] In one embodiment, the body with the inductive elements 2704 is the moving body 201, and the body with the magnet array is the fixed body 2601.
[0208] In one embodiment, the body with the magnet array 2702 is the moving body 201, and the body with the inductive elements 2704 is the fixed body 2601.
[0209] In one embodiment, one or more of the following components / sub-systems, namely, the magnet array 2702, the coil array, the control architecture, and the magnet array, are included in the design of the positioning stage based on the planar motor.
[0210] A discussion regarding the magnet array 2702 is provided below. Referring to Figures 28A and 28B, Figure 28A shows a top view of magnetic field lines extending out of the plane from the magnet array 2702 according to an embodiment of the present disclosure. Figure 28B shows a top view of magnetic field lines extending from the magnet array 2702 into the plane according to an embodiment of the present disclosure.
[0211] As shown in Figures 28A and 28B, the magnets 2801 are arranged in a unidirectional manner, with all magnets 2801 having either a north pole or a south pole facing the coil arrangement.
[0212] Furthermore, Figures 28A and 28B illustrate exemplary patterns of arrangements of permanent magnets 2801. In this arrangement, all magnets 2801 in the arrangement are oriented in a similar manner. In one embodiment, all magnets 2801 are arranged such that, when viewed from above, the magnetic field lines from these magnets emanate from a plane, as shown in Figure 28A.
[0213] In one embodiment, all magnets 2801 are arranged such that, when viewed from above, the magnetic field lines from these magnets 2801 propagate into a plane, as shown in Figure 28B.
[0214] In one embodiment, the pitch of the magnet array of magnet 2801 in the X and Y directions depends on the pole pitch requirements of the overall mechanism for operation, which include the coil array, coil pattern, control architecture, and magnet array fabrication.
[0215] Referring now to Figures 29A and 29B, Figure 29A shows a top view of the arrangement of magnets 2801 in a first configuration according to an embodiment of the present disclosure, where the north poles and south poles alternately face the coil arrangement. Figure 29B shows a top view of the arrangement of magnets 2801 in a second configuration according to an embodiment of the present disclosure, where the north poles and south poles alternately face the coil arrangement.
[0216] As shown in Figures 29A and 29B, the alternation between the north and south poles occurs in only one direction, either along the X or Y direction.
[0217] In one embodiment, the polarity of the magnets 2801 alternates in one direction, while multiple magnets 2801 remain in the other direction (of the X and Y directions). This provides alternating Z magnetic fields in the direction along which the magnetic poles alternate.
[0218] In one embodiment, the polarity of the magnets 2801 in the array is the same along the X-axis, but alternating along the Y-axis.
[0219] In one embodiment, the polarity of the magnets 2801 in the array is the same along the Y-axis, but alternates along the X-axis.
[0220] In one embodiment, the pitch of the magnets 2801 along the X and Y directions in the array depends on the precision requirements and the coil array structure.
[0221] Referring now to Figure 30, Figure 30 is a top view of a magnet 2801 according to an embodiment of the present disclosure, in which the north pole and south pole are arranged in a manner such that they alternately face the coil arrangement.
[0222] In one embodiment, such alternation occurs in two directions, namely the X direction and the Y direction.
[0223] Furthermore, Figure 30 shows that when viewed from above, the polarity of the magnets 2801 in the array is alternating in both the X and Y axes, which provides alternating Z magnetic fields along both the X and Y axes.
[0224] Referring now to Figures 31A and 31B, Figure 31A shows a top view of the arrangement of magnets 2801 in a first configuration in a one-dimensional Halbach array according to an embodiment of the present disclosure. Figure 31B shows a top view of the arrangement of magnets 2801 in a second configuration in a one-dimensional Halbach array according to an embodiment of the present disclosure.
[0225] In one embodiment, the magnet 2801 is arranged in a way that when viewed from above, the magnetic field lines appear to rotate along the axis. This arrangement is known as a Halbach array. This array strengthens the magnetic field intensity of the array of magnets 2801 on one side of the plane of the array and weakens it on the other side. The coil is positioned in a direction such that the stronger side can maximize the effective use of the magnetic field intensity of the magnet 2801 to create a larger operating force with a relatively smaller current in the coil.
[0226] In one embodiment, the Halbach array is formed along either one of the X or Y axes, while the arrays are identical or alternating along the other axis.
[0227] FIG. 32 shows a top view of the arrangement of the magnets 2801 in a two-dimensional Halbach array according to an embodiment of the present disclosure.
[0228] Referring to FIG. 32, in one embodiment, the Halbach array is formed along both the X-axis and the Y-axis. Such an arrangement further strengthens the stronger side of the array of magnets 2801 and gives the ability to generate a larger operating force.
[0229] Considerations regarding the coil arrangement in the design of a positioning stage based on a planar motor are provided below.
[0230] Referring to FIG. 33A, FIG. 33A shows a coil array 3300 in which each coil 3301 is a planar spiral according to an embodiment of the present disclosure.
[0231] Furthermore, as shown in FIG. 33A, the coil array 3300 is housed in a thermally stable PCB (printed circuit board) 3302.
[0232] Referring to FIG. 33B, FIG. 33B shows a magnetic field 3303 generated by the coil 3301 through which current passes according to an embodiment of the present disclosure.
[0233] In one embodiment, each coil 3301 is formed by depositing several spirals of copper onto a planar surface. These spirals create a magnetic field 3303 when current is passed through them, and the magnetic fields of the magnet array can interact to create an actuation force. In one embodiment, the dimensions of each spiral of the coil 3301 and the pitch of the spiral coil array 3300 are designed taking into account the load, the desired actuation accuracy, the magnet array, and the current-conducting ability of the copper traces.
[0234] Referring now to Figure 34A, Figure 34A shows a coil array 3300 according to an embodiment of the present disclosure, in which each coil 3401 of the coil array 3300 is helical.
[0235] In one embodiment, the coil 3401 is helical, as shown in Figure 34A. The outer circumference of the helix is the outer circumference of the cross-section of the coil 3401.
[0236] Referring to Figure 34B, Figure 34B shows a cross-section of the coil arrangement 3300 of Figure 34A according to an embodiment of the present disclosure.
[0237] Referring to Figures 34C to 34D, Figure 34C shows a cross-sectional front view of the coil 3401 according to an embodiment of the present disclosure. Figure 34D is an inverted cross-sectional rear view of the coil 3401 according to an embodiment of the present disclosure.
[0238] In the cross-sectional views of Figures 34C to 34D, it can be seen that the copper traces 3402 of the coil extend through the PCB (printed circuit board) 3302. Due to considerations in actual manufacturing, a perfect helix may not be possible. Therefore, the copper traces 3402 change their plane in the form of steps at specific locations indicated for their specific plane. Because the position of the plane change for the copper traces 3402 is different for each plane, there is no overlap of copper traces 3402 from two or more windings.
[0239] In one embodiment, the position of the plane change for the copper trace 3402 for each loop is somewhere along the outer circumference of the helix.
[0240] Referring to Figure 34E, Figure 34E shows the fabrication of each layer of the helical coil 3401 according to an embodiment of the present disclosure.
[0241] In one embodiment, the spiral shape is cut into multiple layers 3403, and copper 3404 is deposited in each layer to produce a layer-specific pattern, ultimately forming a spiral shape.
[0242] In one embodiment, the shape of the helical periphery is an arbitrary two-dimensional closed polygon.
[0243] Referring to Figure 35A, Figure 35A shows a coil array 3300 according to an embodiment of the present disclosure, in which each coil 3501 of the coil array 3300 is a closed polygon with sharp or rounded corners.
[0244] Referring to Figure 35B, Figure 35B shows a front view of Figure 35A according to an embodiment of the present disclosure.
[0245] Referring now to Figure 36A, Figure 36A shows individual coil elements 3601 that are grouped together and arranged orthogonally to one another, according to an embodiment of the present disclosure.
[0246] Figure 36A shows multiple versions of the coil arrangement 3602 of the coil elements 3601. In one embodiment, one or more individual coil elements 3601 are closed polygons with sharp or rounded corners.
[0247] In one embodiment, two or more individual coil elements 3601 are grouped together in the same orientation and arranged orthogonally with respect to the group around them. This helps to generate a desired magnetic field pattern for operating the moving body 201 in a desired manner.
[0248] Referring now to Figure 36B, Figure 36B shows individual coil elements 3601 in different orientations stacked in different planes according to an embodiment of the present disclosure.
[0249] In one embodiment, individual coil elements 3601 are grouped in the same orientation in one layer (e.g., 3603 in layer #3), and two or more layers (e.g., 3604 in layer #1 and 3605 in layer #2) with individual coil elements 3601 in different orientations are stacked together. As the layers move away from the magnet array surface, the thickness of the copper traces of the individual coil elements 3601 (e.g., copper trace 3402 in Figure 34D) increases because the coils need to pass through larger currents to produce an actuation force.
[0250] A study on the control architecture for the design of a positioning stage based on a planar motor is provided below.
[0251] The control architecture for a planar motor describes a method in which the current flowing through each coil (e.g., coils 3301, 3401, 3501, 3601) in a coil array (e.g., coil array 3300) is controlled. This depends on the size of the magnets, the pitch of the magnets, the layout of the coil array, the precision requirements, and the rectification algorithm.
[0252] In one embodiment, each coil (e.g., coils 3301, 3401, 3501, 3601) is modeled independently, and the current flowing through each coil (e.g., coils 3301, 3401, 3501, 3601) is circulated separately, meaning each coil has its own phase. This provides flexibility in the operation of the moving body (e.g., moving body 201) along both in-plane and out-of-plane axes.
[0253] In one embodiment, two or more coils (e.g., coils 3301, 3401, 3501, 3601) are grouped together in terms of current control, meaning that multiple coils are in the same phase. This offers the advantage of significantly reducing the number of control devices / drivers required for the overall control of the stage. This also reduces the workload on the computation and control devices.
[0254] A study on the fabrication of magnet arrays in the design of a positioning stage based on a planar motor is provided below.
[0255] In one embodiment, the magnets (e.g., magnet 2801) are large enough to be assembled manually in a desired orientation.
[0256] In one embodiment, a special jig is prepared for mounting magnets (e.g., magnet 2801) in a predetermined orientation, and is integrated with the substrate to achieve a desired magnet orientation, particularly for Halbach arrays.
[0257] Figure 37 is a flowchart of Method 3700 for fabricating an array of magnets (e.g., magnet 2801) according to an embodiment of the present disclosure. Figures 38A to 38D are cross-sectional views of fabricating an array of magnets (e.g., magnet 2801) using the steps described in Figure 37 according to an embodiment of the present disclosure.
[0258] Referring to Figures 37A to 38D in conjunction with Figure 37, in step 3701, a highly ferromagnetic material 3801 (e.g., cobalt, nickel, iron, gadolinium, neodymium, steel, magnetite, etc.) is patterned on two different substrates 3802A and 3802B, as shown in Figure 38A.
[0259] In one embodiment, the magnets are quite small and cannot be assembled directly. Therefore, the highly ferromagnetic material 3801 is patterned on two substrates, such as substrates 3802A and 3802B, as shown in Figure 38A. The patterns on both substrates 3802A and 3802B are complementary so that they form a single array when assembled together.
[0260] In step 3702, the ferromagnetic material 3801 is magnetized in the same direction by a strong magnetic field 3804, as shown in Figures 38A and 38B (magnet 3803). That is, the patterns on both substrates 3802A and 3802B are exposed to a very strong magnetic field 3804 for the magnetization of the pillars.
[0261] In step 3703, one of two substrates, such as substrate 3802B, is inverted, and the magnet 3803 is mounted on a substrate that is not inverted, such as substrate 3802A, resulting in a magnet array 3805 with alternating polarity, as shown in Figure 38C. Such a magnet array 3805 is formed by a combination of complementary patterns on substrates 3802A and 3802B, resulting in a magnet array 3805 with alternating polarity. In one embodiment, substrate 3802B is inverted, and the magnetized pillars are bonded to substrate 3802A using adhesive.
[0262] In step 3704, the inverted substrates, such as substrate 3802B, are removed as shown in Figure 38D.
[0263] The following describes the operation based on an unrectified planar motor (electromagnetic).
[0264] Referring now to Figures 39A and 39B, Figure 39A shows a top view of operation based on a non-rectified planar motor (electromagnetic) according to an embodiment of the present disclosure. Figure 39B shows a front view of operation based on a non-rectified planar motor (electromagnetic) according to an embodiment of the present disclosure.
[0265] As shown in Figures 39A and 39B, the inductive element 2704, which includes coils (e.g., coils 3301, 3401, 3501, and 3601), and the magnet 2801 interact with each other to generate an actuation force. Since the magnet 2801 does not interact with multiple coils, a rectification algorithm is not required.
[0266] Figures 39A and 39B show schematics of operation of the central stage / moving body 201 based on a planar motor (electromagnetic) where rectification is not required. In one embodiment, one or more in-planar bending mechanisms (e.g., in-planar bending mechanisms 400, 500) are any of the in-planar bending mechanisms discussed herein.
[0267] In one embodiment, there is one or more permanent magnets 2801 attached to the mobile body 201.
[0268] In one embodiment, one or more inductive elements 2704 are positioned in alignment with a permanent magnet 2801. An electric current is passed through these inductive elements 2704, and the resulting magnetic field 3901 interacts with the permanent magnet 2801, creating a moving force that acts on the moving body 201, resulting in the movement of the moving body.
[0269] In one embodiment, one or more inductive elements 2704 are coils as previously discussed (e.g., coils 3301, 3401, 3501, 3601). Such current-carrying coils can generate a magnetic field that interacts with the permanent magnet 2801 to provide a desired actuation force. In one embodiment, the axes of the coils (e.g., coils 3301, 3401, 3501, 3601) coincide with the corresponding magnetic pole axes.
[0270] Figure 40 shows the arrangement of exemplary coils (e.g., coils 3301, 3401, 3501, 3601) and magnets (e.g., 2801) according to an embodiment of the present disclosure.
[0271] In one embodiment, the coils of the induction element 2704 (e.g., coils 3301, 3401, 3501, 3601) are arranged in a more orthogonal direction compared to those in Figures 39A and 39B.
[0272] In one embodiment, the conductor 4001 is attached to the inductive element 2704 as shown in Figure 40, and interacts with the magnetic field of the coil, bending and stretching the magnetic field (see 4002) so that the resulting magnetic field can interact with the permanent magnet 2801 to obtain the desired operation. This orientation improves the efficiency of coiling.
[0273] In one embodiment, the conductor 4001 interacts with the magnetic field generated by the coils of the inductive element 2704 (e.g., coils 3301, 3401, 3501, 3601), resulting in bending and extension of the magnetic field in such a manner that the magnetic field can interact with the permanent magnet 2801 in a perpendicular direction to create an actuation force. In one embodiment, the axes of the coils (e.g., coils 3301, 3401, 3501, 3601) do not coincide with the corresponding magnetic pole axes. The following describes the fabrication of coils for a non-rectified planar motor actuation mechanism.
[0274] Referring now to Figures 41A to 41D, Figure 41A shows a top view of the copper trace 3402 forming the rectangular helical coil structure 4101 according to an embodiment of the present disclosure. Figure 41B shows a front view of the copper trace 3402 forming the rectangular helical coil structure 4101 according to an embodiment of the present disclosure. Figure 41C shows a bottom view of the copper trace 3402 forming the rectangular helical coil structure 4101 according to an embodiment of the present disclosure. Figure 41D shows the resulting rectangular helical coil structure 4101 according to an embodiment of the present disclosure.
[0275] Figures 41A to 41D provide schematics for exemplary coil structures and fabrication techniques. In one embodiment, one or both of the upper and lower layers of the coil have copper traces 3402 that change their plane to obtain multiple windings resulting in a coil such as a rectangular helical coil structure 4101. The current flowing through the resulting coil structure 4101 interacts with a permanent magnet (e.g., permanent magnet 2801) to induce a magnetic field that can produce an actuation force as desired.
[0276] In one embodiment, the rectangular spiral coil structure 4101 is fabricated using MEMS (Micro-Electro-Mechanical Systems) fabrication technology.
[0277] The following describes measurement methods for obtaining positional feedback for accurate closed-loop control architectures.
[0278] In one embodiment, one or more sensors or sensing systems are located in the X direction, Y direction, and θ direction. Z It can be involved in sensing the stage's position in a given direction.
[0279] In one embodiment, one or more sensors are capacitive sensors. In one embodiment, one or more capacitive sensors have a capacitive probe attached to a moving body (e.g., moving body 201). In one embodiment, one or more capacitive sensors have a capacitive probe attached to a stationary body (e.g., stationary body 2601).
[0280] In one embodiment, one or more sensors are laser sensors. In one embodiment, the optical sensor has a light-emitting probe that emits light of a specific wavelength along a specific direction. In one embodiment, there is a reading head that collects the light reflected from the surface onto which the light-emitting probe has projected a ray. The time lag of the reflected light provides the distance from the laser sensor to the surface onto which the light was incident. In one embodiment, the laser sensor is on a moving body (e.g., moving body 201) and projects a ray onto the surface of a stationary body (e.g., stationary body 2601). In one embodiment, the laser sensor is on a stationary body (e.g., stationary body 2601) and projects light onto the surface of a moving body (e.g., moving body 201).
[0281] In one embodiment, one or more sensing systems are systems based on interference measurement. In one embodiment, there are one or more microscopes that emit light onto a substrate carried by a stage and receive an image. In one embodiment, the substrate and template have alignment marks, which overlap to form a striped pattern that can be observed from the microscope image. These striped patterns indicate the relative alignment error between the substrate and the template, which is used as feedback for a short-pass stage, and the stage is operated to eliminate the alignment error in a closed-loop manner.
[0282] In one embodiment, the X direction, Y direction, and θ Z Operation in one or more of the directions is achieved using a piezoelectric actuator. The in-plane bending mechanism (e.g., in-plane bending mechanisms 400, 500) operates in the X, Y, and θ directions. Z To enable motion in one or more of the directions, and Z, θ X , and θ Y It is used to passively support one or more of these. The out-of-planar bend (e.g., bend 203) is used to transmit actuator motion to the moving body (e.g., moving body 201).
[0283] In one embodiment, the X direction, Y direction, and θ ZActuation in one or more of the directions is performed by an out-of-plane bending mechanism (e.g., out-of-plane bending mechanisms 1100, 1200) for transmitting the motion of an actuator (e.g., actuator 901) to a moving body (e.g., moving body 201), and in the X, Y, and θ directions. Z An in-plane bending mechanism (e.g., in-plane bending mechanisms 400, 500) for enabling motion in one or more of the following directions, obtained using a piezoelectric actuator: X direction, Y direction, and θ direction. Z Support for one or more of the directions is obtained using an in-plane bend (e.g., bend 203) and a liquid film (e.g., liquid film 2705).
[0284] In one embodiment, the X direction, Y direction, and θ Z Actuation in one or more of the directions is obtained using actuation based on an uncompressed planar motor. Planar bending mechanisms (e.g., planar bending mechanisms 400, 500) and liquid films (e.g., liquid film 2705) are operated in the Z direction, θ X Direction, and θ Y It is used to provide passive support along one or more of the directions.
[0285] In one embodiment, the X direction, Y direction, and θ Z The operation in one or more of the directions is obtained using operation based on a rectified plane motor, in the Z direction, θ X Direction, and θ Y Passive support in one or more of the directions is provided by an in-plane bending mechanism (e.g., in-plane bending mechanisms 400, 500) and / or a liquid film (e.g., liquid film 2705).
[0286] In one embodiment, the X direction, Y direction, and θ Z The operation in one or more of the directions is obtained using operation based on a rectified plane motor, in the Z direction, θ X Direction, and θ Y Passive support in one or more of the directions is provided by a flexible and controllable rectification algorithm for the levitation of the moving body along the Z direction.
[0287] As a result of the foregoing, the principle of the present invention allows for X, Y, and θ with sub-50 nm precision. Z For operation in and θ X , θ Y The invention provides means for designing nano-precision short-path stages for active or passive control in Z.
[0288] The various embodiments described herein are presented for illustrative purposes only and are not intended to be comprehensive or limitful to the embodiments disclosed. Many improvements and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the embodiments described. The terminology used herein has been selected to best describe the principles, practical applications, or technical advancements of the embodiments or technologies found in the market, or to enable other those skilled in the art to understand the embodiments disclosed herein. [Explanation of symbols]
[0289] 101A, 101B XY positioning stage 102 Transport wafer 103 Product Dies / Substrates 104 Gap-filling material 105 Short-path stage module 106 Chuck Module 107 Die 200 Positioning Stage 201 Mobile Unit 202 Actuator 203, 203', 203'' bend section 204 Grounded main body / fixture 205 Measurement Hardware 400 Planar Bending Mechanism 401 Crab Legs 500 Planar Bending Mechanism 501 Cross-bending element 502 Intermediate 600 In-plane mechanism 601 Double parallelogram elements 602 Double parallelogram 603, 604, 605 Intermediates 701, 701A, 701B, 701C Support Bending Unit 702 Parallelogram structure 703 Intermediate 801 X direction 802 Y direction 900 Architecture 901 Actuator 902 Outer-plane bend section 903 Actuator motion 904 Mobile motion 1000 Double Slider Planar Out-of-Plane Mechanism 1001 Bending part identifier 1002 Main Identifier 1003 Rigid body identifier 1004 Moving object plane 1100, 1200 Planar Out-of-Plane Bending Mechanism 1201 Input Block 1202 Output Block 1300 Plane Out-of-Plane Bending Straight Mechanism 1400 Lever-type planar mechanism 1501 Fixed body wall 1600 mechanism 1601 Passive Bending Mechanism 2001 Output Light-Emitting Diode 2002 heat exchanger 2004 Coil 2201 Actuator Stage Interface 2301 Stage Grounding Interface 2302 Spring 2302' Linear spring 2302'' Torsion spring 2401 Force acting on actuator stage interface 2201 2501 Motion of output block 1202 2601 Fixed body 2602 Liquid layer 2701 Magnet arrangement holding plate 2702 Permanent Magnet Arrangement 2703 PCB, Printed Circuit Board 2704 Induction element 2705 Liquid film 2706 Glass wafer 2707 Magnetic field interaction section 2801 Permanent Magnet 3300 coil arrangement 3301 Coil 3302 PCB, Printed Circuit Board 3303 Magnetic field 3401 Helical coil 3402 Copper Trace 3501 Coil 3601 Coil Element 3602 coil arrangement 3603, 3604, 3605 layers 3801 Highly ferromagnetic material 3802A, 3802B circuit board 3803 Magnet 3804 Magnetic field 3805 Magnet Arrangement 3901 Magnetic field 4001 Conductor 4002 Magnetic field 4101 Square spiral coil structure α Angle between the bent portion 203#19 and the moving body plane 1004
Claims
1. A system for aligning and coupling four or more dies to a substrate, Four or more stage modules used to enable the alignment of the four or more dies with respect to the substrate, wherein the alignment is performed with an alignment accuracy of sub-50 nm, and the four or more stage modules are arranged in the X direction, Y direction, and θ direction. Z A system comprising four or more stage modules that can be operated along one or more of the following directions.
2. The system according to claim 1, wherein the operation is made possible by a piezoelectric method and / or an electromagnetic method.
3. Z direction, θ X Direction and θ Y The system according to claim 1, wherein motion along one or more of the directions is passively supported.
4. The system further includes an in-plane bending mechanism, and the X direction, the Y direction, and the θ Z The system according to claim 1, wherein the operation along one or more of the directions is enabled by the in-plane bending mechanism comprising one or more intersecting bending elements.
5. The aforementioned X direction, the Y direction, and the θ direction Z The system according to claim 1, wherein the motion for the operation along one or more of the directions is transmitted from the actuator through one or more double slider out-of-plane mechanisms.
6. The aforementioned X direction, the Y direction, and the θ direction Z The system according to claim 1, wherein the motion for the operation along one or more of the directions is transmitted from the actuator through one or more lever-type out-of-planar mechanisms.
7. The Z direction, The θ X Direction, and the θ Y The system according to claim 3, further comprising a mechanism for passive support along one or more directions, the mechanism comprising a two-degree-of-freedom bending hinge continuously connected to the blade bending portion.
8. Further comprising one or more thermal actuators, wherein the operation along one or more of the X direction, the Y direction, and the θ Z direction is made possible by the one or more thermal actuators, the system according to claim 1.
9. The system further comprises an actuator, through which the X direction, the Y direction, and the θ direction are controlled. Z The system according to claim 1, wherein the operations along one or more of the directions are grouped along the X-axis and / or Y-axis.
10. The system further comprises an actuator, through which the X direction, the Y direction, and the θ direction are controlled. Z The system according to claim 1, wherein the operations along one or more of the directions are grouped along the Z-axis.
11. The actuator stage interface comprises one or more actuator stage interfaces, through which the X direction, the Y direction, and the θ direction are controlled. Z The system according to claim 1, wherein motion in one or more of the directions is protected by a mechanism for actuator stability.
12. The system according to claim 3, wherein the passive support is made possible by a liquid film, and the liquid film is located between the surface of a fixed body and the surface of a moving body.
13. The system according to claim 3, wherein the passive support is made possible by a liquid film, and the liquid film is located between the fixed die and the substrate.
14. The aforementioned X direction, the Y direction, and the θ direction Z The system according to claim 1, wherein the operation along one or more of the directions is made possible by operation based on a rectifier planar motor having a helical coil manufactured in a layer-by-layer manner.
15. The aforementioned X direction, the Y direction, and the θ direction Z The system according to claim 1, wherein the operation along one or more of the directions is made possible by operation based on an unrectified planar motor.
16. The aforementioned X direction, the Y direction, and the θ direction Z The system according to claim 1, wherein the operation along one or more of the directions is made possible by operation based on a non-rectified planar motor using a coil, the axis of the coil coincides with the corresponding magnetic pole axis.
17. The aforementioned X direction, the Y direction, and the θ direction Z The system according to claim 1, wherein the operation along one or more of the directions is made possible by operation based on a non-rectified planar motor using a coil, the axis of the coil coincides with the corresponding magnetic pole axis, and a conductor is used to bend the magnetic field to interact with the magnetic field of a permanent magnet.
18. The operation along one or more of the X, Y, and θZ directions is made possible by operation based on a non-rectified planar motor using a coil, the coil being a rectangular helix manufactured in a layer-by-layer manner, according to claim 1.
19. The system according to claim 3, wherein the passive support is made possible by a liquid film, and the liquid film is water.
20. The system according to claim 1, further comprising a support bending portion extending from a fixed body, the support bending portion being attached to an output block of an out-of-plane bending mechanism for enabling the operation in the X direction, the Y direction, and the θZ direction.