Display panel, display device, and splicing display device

Abstract

The present invention relates to a display panel, a display device, and a splicing display device. The display panel includes a substrate, a plurality of light-emitting elements, a plurality of first electrodes, a plurality of second electrodes, and a plurality of connection wirings. The substrate includes a first surface, a second surface, and a plurality of sides connecting the first surface and the second surface, at least one of the plurality of sides being a selected side. Each of the plurality of connection wirings includes a first part, a second part, and a third part that are sequentially connected, the first part being provided on at least the first surface and electrically connected to one of the plurality of first electrodes, the second part being provided on a selected side, and the third part being provided on at least the second surface and electrically connected to the second electrode of one of the plurality of second electrodes. The maximum width of the first part in the first direction and / or the maximum width of the third part in the first direction is greater than the maximum width of the second part in the first direction.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and particularly to a display panel, a display device, and a splicing display device.

Background Art

[0002] Mini LED (Mini Light-Emitting Diode) display devices and Micro LED (Micro Light-Emitting Diode) display devices have self-emitting display characteristics, and their advantages include all-solid state, long life, high brightness, low power consumption, small size, ultra-high resolution, and the like.

[0003] Since the mass transfer process of Mini LED chips in Mini LED display devices and Micro LED chips in Micro LED display devices is difficult, it is difficult to directly manufacture large-sized display devices. Therefore, usually, a plurality of small-sized Mini LED display devices or small-sized Micro LED display devices are bonded together to manufacture a large-sized display panel.

Summary of the Invention

Means for Solving the Problems

[0004] In one embodiment, a display panel is provided. The display panel includes a substrate, a plurality of light-emitting elements, a plurality of first electrodes, a plurality of second electrodes, and a plurality of connecting wires. The substrate includes a first surface, a second surface, and a plurality of sides connecting the first surface and the second surface, at least one of the plurality of sides being a selected side. The plurality of light-emitting elements are provided on the first surface. A plurality of first electrodes are provided on the first surface, the plurality of first electrodes are spaced apart along a first direction, and the plurality of first electrodes are close to the selected side by the plurality of light-emitting elements. A plurality of second electrodes are provided on the second surface, the plurality of second electrodes are spaced apart along the first direction and close to the selected side. The plurality of connecting wires are arranged in parallel and spaced apart, and each of the plurality of connecting wires includes a first part, a second part, and a third part that are connected sequentially, the first part being provided on at least the first surface and electrically connected to one of the plurality of first electrodes, the second part being provided on the selected side surface, and the third part being provided on at least the second surface and electrically connected to one of the plurality of second electrodes. The maximum width of the first part in the first direction and / or the maximum width of the third part in the first direction is greater than the maximum width of the second part in the first direction.

[0005] In some embodiments, in at least one connection wiring, the dimension in the first direction of the section line closer to the selected side of at least two section lines along the first direction of the orthogonal projection pattern on the first surface of the first part is greater than the dimension in the first direction of the section line further away from the selected side, and / or the dimension in the first direction of the section line closer to the selected side of at least two section lines along the first direction of the orthogonal projection pattern on the second surface of the third part is greater than the dimension in the first direction of the section line further away from the selected side.

[0006] In some embodiments, the second portion of the connecting wiring includes a first end and a second end, wherein the dimension of the first end in the first direction is greater than the dimension of the second end in the first direction.

[0007] In some embodiments, the first part partially overlaps with the first electrode, and the third part partially overlaps with the second electrode.

[0008] In some embodiments, the display panel further includes a plurality of signal lines provided on the first surface, which electrically connect the plurality of first electrodes to a plurality of light-emitting elements, each signal line being electrically connected to one of the first electrodes, and the dimension of the signal line in the first direction being less than or equal to the dimension of the first electrode in the first direction.

[0009] In some embodiments, the display panel further includes at least one extension line provided on the side adjacent to the selected side of at least one first electrode, the at least one extension line being electrically connected to the first electrode, and the at least one extension line being electrically connected to one connecting wire.

[0010] In some embodiments, there are multiple extension lines electrically connected to the first electrode, and the distance between any two of the extension lines is 60 μm or more.

[0011] In some embodiments, at least two of the extension lines are electrically connected to a first portion of the connecting wiring, the dimensions of the first portion in a first direction being greater than the distance between the two extension lines, or the first portion includes at least two subsections, the dimensions of any subsection in a first direction being greater than or equal to the dimensions of any extension line in a first direction, and at least two of the subsections each overlap with at least two of the extension lines.

[0012] In some embodiments, the dimension of the extension line in the first direction is 30 μm or less.

[0013] In some embodiments, the plurality of signal lines and the extension lines are composed of a first metal layer, and the plurality of first electrodes are composed of the first metal layer and a second metal layer, wherein the second metal layer is further away from the first surface than the first metal layer.

[0014] In some embodiments, of the connected signal line and extension line, the dimension of the signal line in the first direction is greater than the dimension of the extension line in the first direction.

[0015] In some embodiments, the substrate includes a first substrate having opposing first and third surfaces and a plurality of first sides connecting the first and third surfaces, and a second substrate having opposing fourth and second surfaces and a plurality of second sides connecting the fourth and second surfaces, wherein the third and fourth surfaces are close to each other, at least one of the plurality of first sides is a first selected side, at least one of the plurality of second sides is a second selected side, and the first selected side and the second selected side are located on the same plane and constitute the selected side of the substrate.

[0016] In some embodiments, the second surface includes a first region and a second region, the first region being at a first distance from the first surface and the second region being at a second distance from the first surface, the first distance being greater than the second distance.

[0017] In some embodiments, the first distance is twice the second distance.

[0018] In some embodiments, the substrate further includes an adhesive layer provided between the third surface and the fourth surface, configured to bond the third surface and the fourth surface together.

[0019] In some embodiments, the material of the adhesive layer is a thermosetting or UV (Ultra-Violet Ray) curing material, and a plurality of silica beads are uniformly distributed within the adhesive layer.

[0020] In another aspect, a display device is provided. The display device includes the display panel described in any of the above embodiments and a driving circuit board provided on a second surface of a substrate of the display panel, and the driving circuit board and a plurality of connection wirings of the display panel are electrically connected.

[0021] In yet another aspect, a splicing display device is provided. The splicing display device includes the display device described in any of the above embodiments, and selected sides of the display devices located in the same column or the same row are located on the same side.

[0022] To more clearly explain the technical solutions of the present disclosure, the drawings used in some embodiments of the present disclosure are briefly described below. The drawings in the following description are only the drawings of some embodiments of the present disclosure, and it is obvious to those skilled in the art that other drawings can be obtained from these drawings. Also, the drawings in the following description do not limit the actual size of the products, the actual flow of the methods, the actual sequence of the signals, etc. according to the embodiments of the present invention, and can be regarded as schematic drawings.

Brief Description of the Drawings

[0023] [Figure 1] It is a configuration diagram of a display panel according to some embodiments. [Figure 2A] It is a cross-sectional view of a display panel according to some embodiments. [Figure 2B] It is another cross-sectional view of a display panel according to some embodiments. [Figure 3] It is yet another cross-sectional view of a display panel according to some embodiments. [Figure 4] It is a partial actual photo of the connection wiring of a display panel according to some embodiments. [Figure 5A] It is a connection structure diagram of the connection wiring and the first electrode of a display panel according to some embodiments. [Figure 5B] It is another connection structure diagram of the connection wiring and the first electrode of a display panel according to some embodiments. [Figure 6] It is a connection structure diagram of a connection wiring and a second electrode of a display panel according to some embodiments. [Figure 7A] It is a configuration diagram of a display panel according to some embodiments. [Figure 7B] It is another configuration diagram of a display panel according to some embodiments. [Figure 7C] It is a cross-sectional view of a display panel according to some embodiments. [Figure 8A] It is a connection structure diagram of a connection wiring and an extending line of a display panel according to some embodiments. [Figure 8B] It is a connection structure diagram of a connection wiring and an extending line of a display panel according to some embodiments. [Figure 8C] It is a cross-sectional view of an extending line of a display panel according to some embodiments. [Figure 9] It is another connection structure diagram of a connection wiring and an extending line of a display panel according to some embodiments. [Figure 10A] It is a side configuration diagram of a substrate of a display panel according to some embodiments. [Figure 10B] It is yet another side structure diagram of a substrate of a display panel according to some embodiments. [Figure 11A] It is yet another side structure diagram of a substrate of a display panel according to some embodiments. [Figure 11B] It is yet another side structure diagram of a substrate of a display panel according to some embodiments. [Figure 12A] It is a structure diagram of an adhesive layer of a display panel according to some embodiments. [Figure 12B] It is a structure diagram of an adhesive layer of a display panel according to some embodiments. [Figure 13] It is a configuration diagram of a display device according to some embodiments. [Figure 14] It is yet another configuration diagram of a display device according to some embodiments. [Figure 15] It is a configuration diagram of a splicing display device according to some embodiments. [Figure 16]This is a flowchart of a method for manufacturing a display panel according to several embodiments. [Figure 17] This is yet another flowchart of a method for manufacturing a display panel according to several embodiments. [Figure 18A] This is a diagram showing the configuration of an initial first circuit board of a display panel according to several embodiments. [Figure 18B] This is yet another structural diagram of an initial first substrate of a display panel according to several embodiments. [Figure 18C] This is a diagram showing the configuration of an initial second circuit board of a display panel according to several embodiments. [Figure 18D] This is yet another structural diagram of an initial second substrate of a display panel according to several embodiments. [Figure 19A] This is a flowchart of a method for manufacturing a display panel according to several embodiments. [Figure 19B] This is a flowchart of a method for manufacturing a display panel according to several embodiments. [Figure 19C] This is a flowchart of a method for manufacturing a display panel according to several embodiments. [Figure 20] This is a flowchart of a method for manufacturing a display panel according to several embodiments. [Figure 21A] This is a process diagram of a method for manufacturing a display panel according to several embodiments. [Figure 21B] This is yet another process diagram of a method for manufacturing a display panel according to several embodiments. [Figure 21C] This is yet another process diagram of a method for manufacturing a display panel according to several embodiments. [Figure 22A] This is a process diagram of a method for manufacturing a display panel according to several embodiments. [Figure 22B] This is yet another process diagram of a method for manufacturing a display panel according to several embodiments. [Figure 23] This is a process diagram of a method for manufacturing a display panel according to several embodiments. [Modes for carrying out the invention]

[0024] The following describes, with reference to the attached drawings, some of the technical solutions of the embodiments of this disclosure clearly and completely, although it is clear that the embodiments described are only some of the embodiments of this disclosure, not all of them. All other embodiments that can be obtained by those skilled in the art based on the embodiments provided by this disclosure are within the scope of this disclosure.

[0025] Unless otherwise stated in the context, the term “comprise” and other forms, such as the third-person singular “comprises” and the present participle “comprising,” are interpreted in an open and comprehensive sense, meaning “including, but not limited to.” In the description, terms such as “one embodiment,” “some embodiments,” “exemplary embodiments,” “example,” “specific example,” or “some examples” are intended to indicate that certain features, structures, materials, or properties related to such embodiment or example are included in at least one embodiment or example of this disclosure. The general indications of the above terms do not necessarily refer to the same embodiment or example. Furthermore, any specific features, structures, materials, or properties described may be included in any one or more embodiments or examples in any appropriate manner.

[0026] Hereafter, the terms “first” and “second” are for illustrative purposes only and should not be understood as implicitly indicating or suggesting the relative importance of, or referring to, the number of technical features. Therefore, the features defining “first” and “second” may explicitly or implicitly include one or more features. In the description of the embodiments of this disclosure, “multiple” means two or more unless otherwise specified.

[0027] In describing some embodiments, the terms “coupling” and “connection” and their derived expressions may be used. The term “connection” should be understood in a broad sense; for example, a “connection” may be a fixed connection, a detachable connection, a single unit, a direct connection, or an indirect connection via an intermediate medium. The term “coupling” means, for example, that two or more components are in direct physical or electrical contact. The terms “coupling” or “communicatively coupled” may also mean that two or more components are not in direct contact with each other but are still cooperating or interacting with each other. The embodiments disclosed herein are not necessarily limited to those disclosed herein.

[0028] "At least one of A, B, and C" has the same meaning as "at least one of A, B, or C," and both include A only, B only, C only, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0029] "A and / or B" includes three combinations: A only, B only, and a combination of A and B.

[0030] The use of “applicable” or “configured to” in this specification means open and inclusive language and does not exclude devices that are applicable or configured to perform additional tasks or steps.

[0031] As used herein, “approximately,” “about,” or “approximately” includes the stated value and the mean value within a range of acceptable deviations of a particular value, the range of acceptable deviations being determined by a person skilled in the art, taking into account the measurement under consideration and the errors (i.e., limitations of the measuring system) associated with the measurement of the particular quantity.

[0032] As used herein, “parallel,” “perpendicular,” and “equal” include the situation described and similar situations, the range of such similar situations being within the range of acceptable deviations that a person skilled in the art would determine, for example, taking into account the measurement under consideration and the error associated with the measurement of a particular quantity (i.e., the limits of the measuring system). For example, “parallel” includes absolutely parallel and nearly parallel, where the range of acceptable deviation for nearly parallel may be, for example, a deviation of 5° or less; “perpendicular” includes absolutely perpendicular and nearly perpendicular, where the range of acceptable deviation for nearly perpendicular may be, for example, a deviation of 5° or less; “equal” includes absolutely equal and nearly equal, where within the range of acceptable deviations for nearly equal, for example, the difference between the two equals may be 5% or less of either.

[0033] When a layer or element is described as being on another layer or substrate, please understand that the layer or element may exist directly on the other layer or substrate, or an intermediate layer may exist between the layer or element and the other layer or substrate.

[0034] Exemplary embodiments are described herein with reference to sectional and / or plan views, which serve as ideal illustrative drawings. In the drawings, for clarity, the thickness of the layers and the area of ​​the regions are enlarged. Thus, variations in shape from the drawings are possible, for example, due to manufacturing techniques and / or tolerances. Accordingly, the exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, and include, for example, shape deviations due to manufacturing. For example, an etching region shown as a rectangle typically has curved characteristics. Thus, the regions shown in the drawings are essentially schematic, and their shapes do not represent the actual shapes of the regions in the apparatus, nor do they limit the scope of the exemplary embodiments.

[0035] To improve product reliability and reduce transportation and maintenance costs, large display devices are assembled and formed by splicing multiple smaller display devices.

[0036] To avoid the appearance of a cracked display screen due to splicing, it is necessary to reduce the frame size and seam width of individual small-size display devices. Small-size display devices include a display panel, and by connecting, for example, the wiring located on the display side of the display panel to the wiring board provided on the non-display side of the display panel via connecting lead wires located on the side of the board, the spacing between adjacent small-size display devices can be reduced when connecting multiple small-size display devices to form a larger-size display device, thereby improving the display quality of the large-size display device formed by connecting multiple small-size display devices.

[0037] Currently, Mini LED (Mini Light-Emitting Diode) and Micro LED (Micro Light-Emitting Diode) display panels commonly use transparent glass or organic glass as substrate materials, and defects in the substrate are unavoidable during the manufacturing process of the display panels.

[0038] In some embodiments, an array layer containing multiple signal lines and multiple electrodes is formed on the surface of the substrate by an array process, and light-emitting elements are provided on the side of the array layer away from the substrate, with the multiple signal lines electrically connected to the light-emitting elements. Multiple connection wires are provided on the side of the substrate, one end of which is connected to a metal electrode on the surface of the substrate, and the other end extends to the back surface of the substrate and is connected to a wiring board as an electrode on the back surface. The wiring board transmits control signals to the multiple light-emitting elements via the connection wires and the electrodes on the surface to control the image display on the display panel.

[0039] In some cases, metal electrodes and connecting leads are obtained by etching a metal layer with a laser. After the metal layer is etched, the etched surface is exposed to the outside, making it susceptible to collision and corrosion. For example, in the case of connecting wiring, a portion of the etched surface of the connecting wiring is exposed to the outside and is not completely isolated from the outside. The exposed portion is susceptible to collision and corrosion, ultimately leading to wiring failures, affecting the normal transmission of signals, and thereby affecting the normal operation of the display panel.

[0040] Based on this, several embodiments of the present disclosure provide display panels, display devices, and splicing display devices that employ a 3D printing process to fabricate side edge wiring, thereby avoiding damage and corrosion to the circuit, resolving circuit failures, eliminating the need to flip the substrate during processing, preventing scratches, dirt, and electrostatic discharge problems caused by contact of the substrate with the equipment, and thereby improving product yield and quality.

[0041] The display panel, display device, and splicing display device related to this disclosure will be described below.

[0042] Some embodiments of the present invention provide a display panel 10 including a display area AA and a peripheral area BB provided on at least one side of the display area AA, as shown in Figure 1. For example, the peripheral area BB may be provided on one side, both sides, or three sides of the display area AA, or the peripheral area BB may be provided so as to surround the display area AA.

[0043] In some embodiments, as shown in Figure 2A, the display panel 10 includes a substrate 1, a plurality of light-emitting elements 2, a plurality of first electrodes 3, a plurality of second electrodes 4, and a plurality of connection wirings 5. The substrate 1 includes a first surface 1a and a second surface 1b, and a plurality of side surfaces 1c connecting the first surface 1a and the second surface 1b, the plurality of side surfaces 1c being planar, and at least one of the plurality of side surfaces 1c of the substrate 1 being a selected side surface 1cc. The first surface 1a of the substrate is provided with a plurality of light-emitting elements 2 and a plurality of first electrodes 3, the plurality of first electrodes 3 are arranged at intervals along a first direction X, the plurality of first electrodes 3 are close to the selected side surface 1cc by the plurality of light-emitting elements 2, and the plurality of first electrodes 3 are electrically connected to the plurality of light-emitting elements 2. The second surface 1b of the substrate is provided with a plurality of second electrodes 4, the plurality of second electrodes 4 are arranged at intervals along the first direction X and are close to the selected side surface 1cc.

[0044] The multiple first electrodes 3 and the multiple light-emitting elements 2 may be indirectly in contact with the first surface 1a of the substrate 1. For example, an insulating layer may be provided between the multiple first electrodes 3 and the first surface 1a of the substrate 1, and a film layer structure such as a drive wiring layer 8 containing multiple signal lines may be provided between the multiple light-emitting elements 2 and the first surface 1a of the substrate 1. The multiple first electrodes 3 are electrically connected to the light-emitting elements 2 via the signal lines in the drive wiring layer 8, and the signal lines are configured to transmit signals to the light-emitting elements 2 to drive them to emit light.

[0045] For example, as shown in Figure 1, the display panel 10 includes at least three subpixels P of multiple colors, and the subpixels P of multiple colors include at least a first color subpixel, a second color subpixel, and a third color subpixel, where the first, second, and third colors are the three primary colors (e.g., red, green, and blue). For example, each subpixel P includes at least one light-emitting element.

[0046] For example, the light-emitting element 2 includes, but is not limited to, OLEDs (Organic Light-Emitting Diodes), Mini LEDs, Micro LEDs, etc.

[0047] Here, the first surface 1a of the substrate 1 is the front surface of the substrate 1 and corresponds to the display side of the display panel 10, and the second surface 1b of the substrate 1 is the back surface of the substrate and corresponds to the non-display side of the display panel 10.

[0048] For example, the shapes of the first surface 1a and the second surface of the substrate 1 are, for example, rectangular, and the material of the substrate 1 is a rigid material such as glass, quartz, or plastic.

[0049] For example, referring to Figures 2A and 2B, the multiple first electrodes 3 and the multiple second electrodes 4 all extend in a direction perpendicular to the selected side surface 1cc of the substrate 1, for example, in the second direction Y shown in Figure 2A. The dimension D1 of each of the multiple first electrodes 3 in the second direction Y is smaller than the dimension D2 of each of the multiple second electrodes 4 in the second direction Y, the multiple first electrodes 3 are located in the peripheral region BB of the first surface 1a, and the orthogonal projection of the multiple second electrodes 4 on the first surface 1a of the substrate 1 extends to the display region AA.

[0050] In some embodiments, multiple connection wires 5 are arranged in parallel and spaced apart and formed by a 3D printing process, referring to Figures 2A and 2B, each of the multiple connection wires 5 includes a first part 51, a second part 52, and a third part 53 which are connected sequentially, the first part 51 being provided on at least the first surface 1a, the second part 52 being provided on the selected side surface 1cc, and the third part 53 being provided on at least the second surface 1b and electrically connected to one of the multiple second electrodes 4.

[0051] Furthermore, "provided at least on the first surface 1a" means that the first part 51 is located entirely on the first surface 1a or partially on the first surface 1a. "Provided at least on the second surface 1b" means that the third part 53 is located entirely on the second surface 1b or partially on the second surface 1b.

[0052] In some examples, if the first surface 1a or the second surface 1b is in direct contact with the selected side surface 1cc, that is, if the two adjacent boundaries of the first surface 1a and the selected side surface 1cc of the substrate 1 overlap, and the two adjacent boundaries of the second surface 1b and the selected side surface 1cc of the substrate 1 overlap, then the first part 51 may be entirely provided on the first surface 1a, or the first part 51 may include a portion that extends to the selected side surface 1cc. It should be understood that each part of the first part 51 is a continuous, integrated structure. The third part 53 may be entirely provided on the second surface 1b, or the third part 53 may include a portion that extends to the selected side surface 1cc, and it should be understood that each part of the third part 53 is a continuous, integrated structure.

[0053] In some examples, a transition surface may be provided between the first surface 1a or the second surface 1b and the selected side surface 1cc, and the transition surface may be a plurality of sequentially connected surfaces as shown in Figures 2A and 2B, or it may be a plane or an arc. In this case, the entirety of the first part 51 may be provided on the first surface 1a, and the first part 51 may include a portion that extends to the transition surface between the first surface 1a and the selected side surface 1cc, and the first part 51 may include a portion that extends to the selected side surface 1cc, and it should be understood that each part of the first part 51 is a continuous, integrated structure. Then, the entirety of the third part 53 may be provided on the second surface 1b, and the third part 53 may include a portion that extends to the transition surface between the second surface 1b and the selected side surface 1cc, and the third part 53 may include a portion that extends to the selected side surface 1cc. It should be understood that each part of the third part 53 is a continuous, integrated structure. It should be understood that in some embodiments, Part 2 52 may include portions that extend to selected aspects.

[0054] As an example, referring to Figures 2A and 2B, a first transition side 1d is provided between the selected side 1cc and the first surface 1a, and a second transition side 1e is provided between the selected side 1cc and the second surface 1b. The first surface 1a and the selected side 1cc are connected by the first transition side 1d, and the second surface 1b and the selected side 1cc are connected by the second transition side 1e. The connecting wiring 5 extends from the first surface 1a to the second surface 1b via the first transition side 1d, the selected side 1cc, and the second transition side 1e. It should be understood that a portion of the first part 51 may be provided on the first surface 1a of the substrate 1, and the other portion may be provided on the first transition side 1d between the first surface 1a and the selected side 1cc, and a portion of the third part 53 may be provided on the second surface 1b of the substrate 1, and the other portion may be provided on the second transition side 1e between the second surface 1b and the selected side 1cc.

[0055] It should be understood that providing the first transition side 1d and the second transition side 1e is equivalent to chamfering or rounding the area between the selected side 1cc and the first surface 1a or the second surface 1b and the selected side 1cc, thereby reducing the possibility of scratches occurring during collisions or the placement of wiring along the side edges.

[0056] In some embodiments, referring to Figure 4, in the connecting wiring 5, the maximum width B1 of the first part 51 in the first direction X and / or the maximum width B3 of the third part 53 in the first direction X is greater than the maximum width B2 of the second part 52 in the first direction X. Here, the first direction X is the direction perpendicular to the overall extending direction of the connecting wiring 5, and as shown in Figures 2A, 2B and 3, the direction of the overall extending direction of the connecting wiring 5 is referred to as the third direction Z.

[0057] For example, as shown in Figure 4, the connecting wire 5 includes two opposing side edges in the first direction X, namely a first side edge 5a and a second side edge 5b, where the distance between the first side edge 5a and the second side edge 5b is the width of the connecting wire 5, and the maximum distance between the first side edge 5a and the second side edge 5b is the maximum width of the connecting wire 5.

[0058] Although at least a portion of the above-mentioned connecting wiring is formed by a 3D printing process, in some embodiments, the first part 51, second part 52, and third part 53 of the connecting wiring 5 are formed by three printing processes, respectively. Referring to Figure 4, in the process of manufacturing the second part 52 of the connecting wiring 5, it is necessary to reliably supply conductive paste at a predetermined starting position Q2. In the 3D printing apparatus, the residence time at the starting position Q2 is longer than at other positions on the printing path, so conductive paste accumulates, and a "big head" phenomenon may occur where the width of the second part 52 at the starting position Q2 becomes the maximum width of the second part 52. On the other hand, the lengths of the first part 51 and the third part 53 of the connecting wiring 5 are shorter than the length of the second part 52, so the length required for printing is short. During actual printing, the movement speed of the 3D printing device is slow and the residence time is long, so the deposition of conductive paste becomes more pronounced. The maximum width B1 of the first part 51 in the first direction X is greater than the maximum width B2 of the second part 52 in the first direction X, and the maximum width B3 of the third part 53 in the first direction X is greater than the width B2 of the second part 52 in the first direction X.

[0059] It should be understood that the above statements, such as "at least a portion of the connection wiring is formed by a 3D printing process," "some or all of the connection wiring is formed by a 3D printing process," and "all of the connection wiring is formed by a 3D printing process," or "some of the connection wiring is formed by a 3D printing process," can be divided into several situations.

[0060] In some embodiments, the first part 51 of the connecting wire 5 is manufactured by 3D printing, and the second and third parts 52 and 53 of the connecting wire 5 are manufactured using other processes, such as a pad printing process and a screen printing process, and the formed connecting wire 5 satisfies the condition that the maximum width B1 of the first part 51 in the first direction X is greater than the maximum width B2 of the second part 52 in the first direction X.

[0061] In some embodiments, the third portion 53 of the connecting wire 5 is manufactured by 3D printing, while the second portion 52 and first portion 51 of the connecting wire 5 are manufactured using other processes, such as a pad printing process and a screen printing process. The formed connecting wire 5 satisfies the condition that the maximum width B3 of the third portion 53 in the first direction X is greater than the maximum width B2 of the second portion 52 in the first direction X.

[0062] In some embodiments, the first and third parts 51 and 53 of the connecting wire 5 are manufactured by 3D printing, and the second part 52 of the connecting wire 5 is manufactured using other processes, such as a pad printing process and a screen printing process. The formed connecting wire 5 satisfies the condition that the maximum width B1 of the first part 51 in a first direction X is greater than the maximum width B2 of the second part 52 in a first direction X, and / or the maximum width B3 of the third part 53 in a first direction X is greater than the maximum width B2 of the second part 52 in a first direction X.

[0063] For example, the orthogonal projection region of either the first side edge 5a or the second side edge 5b onto the substrate 1 obtained based on the process described above is composed of arc-shaped line segments, and the distances between the first side edge 5a and the second side edge 5b are not the same. The maximum distance (i.e., maximum width B1) between the first side edge 5a and the second side edge 5b of the first part 51 is greater than the maximum distance (i.e., maximum width B2) between the first side edge 5a and the second side edge 5b of the second part 52, and / or the maximum distance (i.e., maximum width B3) between the first side edge 5a and the second side edge 5b of the third part 53 is greater than the maximum distance (i.e., maximum width B2) between the first side edge 5a and the second side edge 5b of the second part 52.

[0064] The connection wiring obtained by employing the above manufacturing process has a corrosion-preventive effect. This is because, in the manufacturing process, regardless of whether it is a 3D printing process, a pad printing process, or a screen printing process, a conductive paste is used as the material for the connection wiring. The selected conductive paste is, for example, silver paste, which is mainly composed of silver particles and a resin-based solvent. This silver paste has the property of forming a film quickly, and its surface can form a dense oxide thin film, which can protect its own conductivity. At the same time, in the etching process, it is possible to avoid damage to the film layer on the surface of the display panel 10 by the laser etching process, and after the connection wiring is manufactured, the etched surface of the connection wiring is exposed and susceptible to corrosion, and its surface is prone to scratches.

[0065] In some embodiments, when the connecting wiring is manufactured using other processes such as a pad printing process or a screen printing process, the maximum width B1 of the first part 51 in the first direction X can be designed to be greater than the maximum width B2 of the second part 52 in the first direction X, and the maximum width B3 of the third part 53 in the first direction X can be designed to be greater than the maximum width B2 of the second part 52 in the first direction X. In other words, the dimensional relationships between the parts of the connecting wiring described above are not limited to those obtained using a 3D printing process, and structural dimensional relationships can be designed to improve the electrical reliability of the connecting wiring.

[0066] For example, the first part 51 of the connecting wiring 5 is integrally structured with the first electrode 3 and can be formed by a single film deposition or patterning process, and similarly satisfies the condition that the maximum width B1 of the first part 51 in the first direction X is greater than the maximum width B2 of the second part 52 in the first direction X, and the maximum width B3 of the third part 53 in the first direction X is greater than the maximum width B2 of the second part 52 in the first direction X.

[0067] For example, the third part 53 of the connecting wiring 5 is integrally structured with the second electrode 4 and can be formed by a single film deposition or patterning process, and similarly satisfies the conditions that the maximum width B1 of the first part 51 in the first direction X is greater than the maximum width B2 of the second part 52 in the first direction X, and the maximum width B3 of the third part 53 in the first direction X is greater than the maximum width B2 of the second part 52 in the first direction X.

[0068] In some embodiments, referring again to Figure 4, the maximum width B1 of the first part 51 in the first direction X is greater than the maximum width B2 of the second part 52 in the first direction X.

[0069] For example, the manufacturing process for the first part 51 and the second part 52 of the connecting wiring 5 is the same as the manufacturing process described above, and the same effects as those for the connecting wiring 5 described above are obtained, so the explanation is omitted here.

[0070] In some embodiments, continuing to refer to Figure 4, the maximum width B3 in the first direction X of the third part 53 is greater than the maximum width B2 in the first direction X of the second part 52.

[0071] For example, the manufacturing process for the second part 52 and the third part 53 of the connecting wiring 5 is the same as the manufacturing process described above, and the same effects as those for the connecting wiring 5 described above are obtained, so the explanation is omitted here.

[0072] In some embodiments, as shown in Figures 5A and 5B, in at least one connecting wire 5, of at least two section lines in a first direction X of the orthogonal projection pattern onto the first surface 1a of the first part 51, the dimension d1 in the first direction X of the section line closer to the selected side 1cc is greater than the dimension d2 in the first direction X of the section line further away from the selected side 1cc.

[0073] In this context, a section line refers to a line segment between two points where a straight line extending in the first direction X intersects with the boundary of the orthogonal projection pattern onto the first surface 1a of the first part 51.

[0074] The dimensional relationships of section lines will be explained below using two of the multiple section lines in the first direction X of the orthogonal projection pattern onto the first surface 1a in Part 1 as an example.

[0075] For example, referring to Figures 5A and 5B, section lines close to the selected side 1cc are Class 1 section lines, section lines further away from the selected side 1cc are Class 2 section lines, and the dimension d1 in the first direction of a Class 1 section line is greater than the dimension d2 in the first direction of a Class 1 section line.

[0076] It should be noted that the above limits the dimensional relationship between at least two of the multiple section lines that limit the orthogonal projection pattern of Part 1 51, that is, the dimensional relationship between the section line close to the selected side surface 1cc and the section line far from the selected side surface 1cc, and does not limit the dimensions of all section lines. Therefore, referring to Figure 5A, along the direction away from the selected side surface 1cc, the dimensions of the section lines in the first direction X of the orthogonal projection pattern onto the first surface 1a of Part 1 51 gradually decrease, and the orthogonal projection pattern of Part 1 51 as a whole tends to gradually narrow. Alternatively, referring to Figure 5B, the orthogonal projection pattern of the first part 51 includes a first part and a second part, where the second part of the orthogonal projection pattern of the first part 51, away from the selected side 1cc, is narrower than the first part, closer to the selected side 1cc, and along the direction away from the selected side 1cc, the dimensions of the first part of the orthogonal projection pattern of the first part 51, closer to the selected side 1cc, in the X direction remain constant, while the second part of the orthogonal projection pattern of the first part 51, away from the selected side 1cc, gradually narrows. Here, the orthogonal projection patterns of the first part 51 onto the first surface 1a shown in Figures 5A and 5B are not unique as long as a structure that is wider at the top and narrower at the bottom is guaranteed, and Figures 5A and 5B are merely possible embodiments.

[0077] The above dimensional relationships are obtained based on the fact that the process for forming the connection wiring is a 3D printing process. Referring to Figures 2A and 2B, a first transition side surface 1d is provided between the selected side surface 1cc and the first surface 1a of the substrate 1 shown in Figures 2A and 2B. In the process of manufacturing the first part 51 of the connection wiring 5, in order to ensure sufficient thickness of conductive paste at the position of the first transition side surface 1d, it can be seen from the above that a part of the first part 51 is located on the first surface 1a of the substrate 1, and the other part is located on the first transition side surface 1d between the first surface 1a and the selected side surface 1cc. Therefore, referring to Figures 3 and 4, the starting position Q1 of the 3D printing apparatus corresponds to the end of the first part 51 to be formed that is close to the selected side surface, and is located above the first transition side surface 1d. The orthogonal projection of the starting position Q1 onto the first transition side surface 1d is the boundary of the first transition side surface 1d that is close to the selected side surface 1cc. In order to ensure that conductive paste is supplied at a predetermined starting position Q1, that the conductive paste deposited at the starting position Q1 sufficiently covers the first transition side surface 1d, and that printing is carried out along the second direction Y, the flow characteristics of the conductive paste mean that the portion of the first part 51 of the connecting wiring 5 that is away from the selected side surface 1cc is somewhat narrower than the portion that is close to the selected side surface 1cc. During printing, the overall thickness of the first part of the connecting wiring varies due to changes in speed and air pressure caused by movement. The first part 51 has a certain degree of roughness on the surface that is away from the substrate, but this roughness does not affect the resistance of the connecting wiring 5 and can ensure the normal transmission of signals from the display panel.

[0078] In some embodiments, referring to Figure 6, in at least one connection wiring, of at least two section lines in the first direction X of the orthogonal projection pattern onto the second surface 1b of the third part 53, the dimension d3 in the first direction X of the section line closer to the selected side 1cc is greater than the dimension d4 in the first direction X of the section line further away from the selected side 1cc.

[0079] For example, the third part 53 of the connecting wiring 5 is also formed using the 3D printing process described above, and thus the same effect as the first part 51 of the connecting wiring 5 is obtained. The explanation is omitted here.

[0080] In some embodiments, referring to Figures 5A, 5B, and 6, in at least one connection wiring 5, of at least two section lines in the first direction X of the orthogonal projection pattern onto the first surface 1a of the first part 51, the dimension d1 in the first direction X of the section line closer to the selected side 1cc is greater than the dimension d2 in the first direction X of the section line further away from the selected side 1cc. Of at least two section lines in the first direction X of the orthogonal projection pattern onto the second surface 1b of the third part 53, the dimension d3 in the first direction X of the section line closer to the selected side 1cc is greater than the dimension d4 in the first direction X of the section line further away from the selected side 1cc.

[0081] For example, the first part 51 and the third part 53 of the connecting wiring 5 are similarly formed using the 3D printing process described above, and thus the same effect as the first part 51 of the connecting wiring 5 is obtained. A detailed explanation is omitted here.

[0082] In some embodiments, continuing to refer to Figure 4, the second part 52 of the connecting wire 5 includes a first end 52a and a second end 52b, the first end 52a and the second end 52b being opposite ends in the extending direction (i.e., third direction Z) of the second part 52 of the connecting wire 5, where the dimension d5 of the first end 52a in the first direction X is greater than the dimension d6 of the second end 52b in the first direction.

[0083] For example, from the above, it can be seen that the connecting wiring is formed by the 3D printing process. Referring to Figure 4, in the process of forming the connecting wiring 5, it is necessary to reliably supply conductive paste at a predetermined starting position Q. Because the residence time of the 3D printing device at the starting position Q is longer than at other positions on the printing path, conductive paste accumulates, and a "large head" phenomenon may occur at the starting position Q. On the other hand, as the printing approaches the ending position R, the 3D printing device needs to shut down early, and the remaining conductive paste attached to the 3D printing device is sufficient to complete the line-type printing, so a phenomenon occurs where the line width at the ending position R is narrower than at the starting position Q. In other words, in the process of forming the second part of the connecting wiring, the starting position Q2 of the 3D printing device corresponds to the first end 52a of the second part 52 of the connecting wiring 5, and the ending position R of the 3D printing device corresponds to the second end 52b of the second part 52 of the connecting wiring 5. Therefore, the dimension d5 of the first end 52a in the first direction X is larger than the dimension d6 of the second end 52b in the first direction.

[0084] In some embodiments, referring to Figure 3, the first part 51 partially overlaps with the first electrode 3, and the third part 53 partially overlaps with the second electrode 4.

[0085] It should be understood that the first part 51 partially overlaps with the orthogonal projection of the first electrode 3 onto the first surface 1a of the substrate 1, for example, the first part 51 covers the edge of the first electrode 3 near the selected side surface 1cc, ensuring sufficient electrical connection between the first part 51 and the first electrode 3, and the third part 53 partially overlaps with the orthogonal projection of the second electrode 4 onto the second surface 1b of the substrate 1, for example, the third part 53 covers the edge of the second electrode 4 near the selected side surface 1cc, ensuring sufficient electrical connection between the third part 53 and the second electrode 4.

[0086] In some embodiments, referring to Figure 2A, the display panel 10 includes a plurality of signal lines 6 provided on a first surface 1a, the plurality of signal lines 6 electrically connecting a plurality of first electrodes 3 and a plurality of light-emitting elements 2. Referring to Figures 7A and 7B, each signal line 6 is electrically connected to one first electrode 3, and the dimension H1 of the signal line 6 in the first direction X is less than or equal to the dimension H2 of the first electrode 3 in the first direction X.

[0087] As an example, Figure 7A shows a diagram of the connection structure between the signal line 6 and the first electrode 3. As shown in Figure 7A, in order to ensure sufficient contact and electrical connection, the dimension H1 of the signal line 6 in the first direction X and the dimension H2 of the first electrode 3 in the first direction X are made equal.

[0088] As an example, Figure 7B shows another connection structure diagram between the signal line 6 and the first electrode 3. As shown in Figure 7B, the dimension H1 of the signal line 6 in the first direction X is smaller than the dimension H2 of the first electrode 3 in the first direction X. In this connection configuration, by providing this dimensional relationship, the contact area between the first electrode 3 and the first part 51 of the connecting wiring 5 can be increased when the first electrode 3 is electrically connected to the connecting wiring 5, thereby reducing contact resistance, further improving signal transmission efficiency, and enhancing the display effect of the display panel 10.

[0089] Furthermore, referring to Figures 7A and 7B, the multiple signal lines 6 on the first surface 1a have different types of transmitted signals, so their widths in the first direction X are not all the same. The width of the first electrode 3 in the first direction X is positively correlated with the width of the connected signal line 6.

[0090] For example, the width of the connecting wire 5 in the first direction X is positively correlated with the width of the connected first electrode 3 in the first direction X.

[0091] In some embodiments, referring to the film layer structure shown in Figure 7C, the substrate 1 is provided with a drive wiring layer 8 including a buffer layer 81, a first metal layer 82, an insulating layer 83, a second metal layer 84, a planarization layer 85, and a passivation layer 86.

[0092] Here, a buffer layer 81 is provided on one side of the first surface 1a. The first metal layer 82 includes a plurality of signal lines 6 and extension lines 7. An insulating layer 83 is provided on the side of the first metal layer 82 away from the substrate 1, and a second metal layer 84 is provided on the side of the insulating layer 83 away from the substrate 1, and the second metal layer 84 includes the plurality of first electrodes 3. A planarization layer 85 is provided on the side of the second metal layer 84 away from the substrate 1. A passivation layer 86 is provided on the side of the planarization layer 85 away from the substrate 1. The insulating layer 83 includes a plurality of first vias a1, and each of the plurality of first electrodes 3 is electrically connected to the signal lines 6 of the first metal layer 82 via the corresponding first via a1. It should be understood that a portion of the first electrodes 3 are located in the first metal layer 82 and another portion are located in the second metal layer 84.

[0093] In some embodiments, as shown in Figure 7C, the second metal layer 84 further includes a plurality of connection pads, which include a plurality of first pads 842 for connecting light-emitting elements 2 and a plurality of second pads 843 for connecting pixel driving chips 9.

[0094] Specifically, as shown in Figure 7C, the pins of the light-emitting element 2 and the pins of the pixel driving chip 9 are connected to corresponding connection pads with welding materials such as tin solder, tin-silver-copper alloy, or tin-copper alloy. The planarization layer 85 includes a plurality of second vias a2 that penetrate to the second metal layer 84. The passivation layer 86 includes a plurality of third vias a3 that penetrate to the planarization layer 85. Here, one third via a3 and one second via a2 correspond to each other in terms of position, forming a through via that penetrates from the passivation layer 86 to the connection pad of the second metal layer 84.

[0095] For example, as shown in Figure 7C, each light-emitting element 2 includes two connection pins, and each pixel driver chip 9 includes six connection pins. The pins of each light-emitting element 2 are connected to two first pads 842 via through-vias that penetrate the planarization layer 85 and the passivation layer 86, and the pins of each pixel driver chip 9 are connected to six second pads 843 via through-vias that penetrate the planarization layer 85 and the passivation layer 86, controlling the light-emitting elements 41 to emit light through signals transmitted from the signal line 6 and the control of the pixel driver chip 9.

[0096] In some embodiments, the first metal layer 82 or the second metal layer 84 is a metal layer comprising a plurality of laminated structures. For example, the first metal layer 82 or the second metal layer 84 includes a titanium layer, a copper layer, and a titanium layer, arranged in order from the substrate 1 side. Alternatively, the first metal layer 82 or the second metal layer 84 includes, for example, a molybdenum layer, a copper layer, and a molybdenum layer, arranged in order from the substrate 1 side. Alternatively, the first metal layer 82 or the second metal layer 84 includes, for example, a molybdenum layer, an aluminum layer, and a molybdenum layer, arranged in order from the substrate 1 side.

[0097] In some embodiments, the first metal layer 82 or the second metal layer 84 is a single-layer signal wiring layer. Furthermore, the drive wiring layer is, for example, a copper layer or an aluminum layer.

[0098] Specifically, the first metal layer 82 or the second metal layer 84 only needs to have good conductivity, and this is described here only as an example and does not limit the material used for the drive wiring layer 8.

[0099] In some embodiments, as shown in Figures 8A and 8B, the display panel 10 further includes at least one extension line 7 provided on the side of at least one first electrode 3 closer to the selected side 1cc, the at least one extension line 7 being electrically connected to the first electrode 3, and the at least one extension line 7 being electrically connected to one connecting wire 5.

[0100] For example, as shown in Figures 8A and 8B, at least one extension line 7 is provided on the side of at least one first electrode 3 closest to the selected side 1cc, for example, one first electrode corresponds to one or more extension lines 7 extending from the first electrode 3 to the boundary of the first surface 1a, and the first electrode 3 is connected to the corresponding connecting wiring 5 via the extension lines 7.

[0101] For example, at least one extension line 7 is provided on the side of each first electrode 3 closest to the selected side 1cc, and as shown in Figure 8A, two extension lines 7 are provided on the side of each first electrode 3 closest to the selected side 1cc, and each first electrode 3 is connected to the corresponding connecting wiring 5 via the corresponding extension line 7.

[0102] Furthermore, one or more extension lines 7 are provided on the side of one first electrode 3 closest to the selected side surface 1cc, and these extension lines 7 extend to the boundary between the first surface and the selected side surface. By providing the extension lines 7, the contact reliability between the first electrode 3 and the connecting wiring 5 can be improved, and the transmission resistance can be reduced to increase the efficiency of the transmitted signal and improve the yield of the display panel.

[0103] As an example, Figure 8A illustrates two extension lines 7 that are electrically connected to one first electrode 3. Both extension lines 7 are electrically connected to the first electrode 3, and both extension lines 7 are electrically connected to the connecting wiring 5. It should be understood that even if one of the two extension lines 7 is damaged, the other extension line 7 will still be able to perform its role in signal transmission, thereby making the signal transmission of the display panel 10 more stable.

[0104] In some embodiments, referring again to Figure 8A, there are multiple extension lines 7 electrically connected to the first electrode 3, and the distance s between any two extension lines 7 among the multiple extension lines 7 corresponding to one first electrode 3 is 60 μm or more.

[0105] For example, as shown in Figure 8A, the number of extension lines 7 electrically connected to the first electrode 3 may be multiple, for example, two. Furthermore, by limiting the distance between any two extension lines 7, it is possible to prevent the film layer from falling off during the subsequent chamfering process and to prevent certain damage to the extension lines 7.

[0106] Furthermore, if an extension line 7 is provided, the width of the extension line 7 in the first direction X is positively correlated with the width of the connected first electrode 3 in the first direction X, and the width of the connecting wiring 5 in the first direction X is positively correlated with the width of the connected extension line 7 in the first direction X.

[0107] In some embodiments, the width of each extension line 7 in the first direction X is different.

[0108] In some embodiments, the width of each extension line 7 in the first direction X is the same, and the width of each connecting wire 5 in the first direction X is the same. By adopting such a configuration, the structure and process of the apparatus for forming the connecting wire 5 can be simplified, and production efficiency can be improved at a low cost.

[0109] In some embodiments, referring to Figures 8A, 8B, and 9, the first electrode 3 is connected to the connecting wiring 5, and at least two extension lines 7 are provided on the side of the first electrode 3 closest to the selected side 1cc, and at least two extension lines 7 are electrically connected to the first portion 51 of the connecting wiring 5. The electrical connection between the at least two extension lines 7 and the first portion 51 of the connecting wiring 5 can be in the following forms.

[0110] In some cases, as shown in Figure 8A, the dimension d of the first part 51 in the first direction X is greater than the distance s between the two extension lines 7 that are in contact with the first part 51.

[0111] As an example, referring to Figure 8A, the dimension d of the first part 51 in the first direction X is set to be larger than the distance s between the two extension lines 7, where the first part 51 is a single pattern, and the dimension d of the first part 51 can cover the distance s between the two extension lines, so that the entire first part 51 sufficiently overlaps with the two extension lines 7, thereby achieving electrical connection and, consequently, efficient signal transmission.

[0112] Furthermore, when printing the first part of the connection wiring using 3D printing, if the printing pad is thick, it is possible to overlap the two extension lines 7 simultaneously with just one printing pass.

[0113] In another example, referring to Figure 9, the first electrode 3 is connected in correspondence with the connecting wiring 5, and at least two extension lines 7 are provided on the side of the first electrode 3 closest to the selected side 1cc, and the first part 51 of the connecting wiring 5 includes at least two subsections 511, where the dimension r1 of any subsection 511 in the first direction X is greater than or equal to the dimension r2 of any extension line 7 in the first direction X. At least two subsections 511 each overlap with at least two extension lines 7. In other words, the first part 51 is divided into at least two parts, the number of subsections 511 corresponds to the number of extension lines 7, and the corresponding connections are realized by the one-to-one correspondence between the subsections 511 and the extension lines 7.

[0114] Furthermore, when printing the first part of the connection wiring using 3D printing, if the printing pad is thin, it is necessary to print twice to connect the two extension lines 7.

[0115] For example, referring to Figure 9, the dimension r1 of any subsection 511 in the first direction X is equal to the dimension r2 of any extension line 7 in the first direction X, at least two subsections 511 overlap with at least two extension lines 7, and each of the two subsections 511 included in the first part 51 overlaps with the two extension lines 7 in correspondence, ensuring that electrical connection is achieved and, consequently, efficient signal transmission is realized.

[0116] As an example, continuing to refer to Figure 9, the dimension r1 of any subsection 511 in the first direction X is greater than the dimension r2 of any extension line 7 in the first direction X, i.e., r1 > r2. This dimensional limitation ensures that two subsections 511 formed by the 3D printing device come into contact with each other on their adjacent sides, and that at least two subsections 511 overlap with at least two extension lines 7, respectively. On the other hand, increasing the overlap area between any subsection 511 and any extension line 7 reduces contact resistance, further improves signal transmission efficiency, and enhances the display effect of the display panel 10.

[0117] In this case, the dimensional relationship between the dimension r1 of any subsection 511 in the first direction X and the dimension r2 of any extension line 7 in the first direction X is limited, ensuring sufficient contact between the subsection and the extension line, and enabling efficient transmission of electrical signals.

[0118] In some embodiments, the dimension r2 of the extension line 7 in the first direction X is 30 μm or less.

[0119] For example, the dimension r2 of the extension line 7 in the first direction X is less than 30 μm, and may be, for example, 20 μm, 25 μm, etc.

[0120] In some embodiments, referring to Figure 8C, multiple signal lines 6 and extension lines 7 are composed of a first metal layer 82, and multiple first electrodes 3 are composed of a first metal layer 82 and a second metal layer 84, with the second metal layer 84 being further away from the first surface 1a than the first metal layer 82.

[0121] As an example, referring to Figure 8C, which is a cross-section along section line DD of Figure 8A, the extension line 7 and signal line 6 are located in a first metal layer 82, which has insulating layers on both the side closer to and further away from the substrate 1, and the first electrode 3 is connected to the first metal layer 82 via a via of the insulating layer on the side further away from the substrate 1, and as is clear from the figure, a portion of the first electrode 3 is located in the first metal layer 82 and the other portion is located in the second metal layer 84, realizing the electrical connection between the extension line 7 and the signal line 6.

[0122] In some embodiments, as shown in Figure 9, the dimension H1 of the signal line 6 in the first direction X is greater than the dimension r2 of the extension line 7 in the first direction, among the connected signal line 6 and extension line 7.

[0123] For example, the signal line 6 and the extension line 7 can be electrically connected via the first electrode 3. The limitation that the dimension H1 of the signal line 6 in the first direction X is greater than the dimension r2 of the extension line 7 in the first direction is because there may be multiple extension lines 7 electrically connected to the first electrode 3, and therefore the dimension r2 of each extension line 7 in the first direction is smaller than the dimension H2 of the first electrode 3 in the first direction. In some examples, the dimensions of the signal line 6 and the first electrode 3 in the first direction X are equal, so the dimension H1 of the signal line 6 in the first direction X is greater than the dimension r2 of the extension line 7 in the first direction.

[0124] As described above, the substrate 1 of this application is a double-sided substrate, with a plurality of light-emitting elements, a plurality of first electrodes, and a plurality of signal lines formed on the substrate surface, the plurality of signal lines being electrically connected to the light-emitting elements, and a plurality of second electrodes being formed on the back surface of the substrate. A plurality of connection wires are provided on the side surface of the substrate, one end of the connection wire is connected to the first electrodes on the surface, and the other end is connected to the second electrodes on the back surface of the substrate, transmitting signals to the plurality of light-emitting elements to realize image display on the display panel.

[0125] In some embodiments, double-sided substrates generally use a double-sided array process to fabricate the wiring on both the front and back surfaces of the substrate, and the electrodes on the substrate are fabricated using processes such as electroplating, vapor deposition, or wet etching. Therefore, in the process of actually fabricating the wiring on the back surface of the substrate, it is necessary to fabricate the structure on the other surface of the substrate by processes such as fabricating the structure on one surface of the substrate and then flipping the substrate over. In this process, it is unavoidable that one surface of the substrate will come into contact with the base of the device, resulting in scratches or contamination on one surface of the substrate. Scratches or contamination can lead to short circuits, which can affect the yield and quality of the display panel. At the same time, the above manufacturing procedure is numerous and complex, resulting in high manufacturing costs and low manufacturing efficiency. Therefore, in order to simplify the overall manufacturing process flow of the display panel, the substrate of the display panel is formed by bonding two single-sided substrates together. Specifically, this is done as follows.

[0126] In some embodiments, as shown in Figures 10A and 10B, the substrate 1 includes a first substrate 11 including opposing first surfaces 1a and third surfaces 1f and a plurality of first sides 1c1 connecting the first surface 1a and the third surface 1f, and a second substrate 12 including opposing fourth surfaces 1g and second surfaces 1b and a plurality of second sides 1c2 connecting the fourth surface 1g and the second surface 1b. The third surface 1f and the fourth surface 1g are close to each other, at least one of the plurality of first sides 1c1 is a first selected side 1cc1, at least one of the plurality of second sides 1c2 is a second selected side 1cc2, and the first selected side 1cc1 is coplanar with the second selected side 1cc2 and constitutes a selected side 1cc of the substrate 1.

[0127] Substrate 1 includes a first substrate 11 and a second substrate 12 that are arranged opposite each other, the first surface 1a of the first substrate 11 is the same as the first surface 1a of substrate 1, the second surface 1b of the second substrate 12 is the same as the second surface 1b of substrate 1, and the third surface 1f of the first substrate 11 and the fourth surface 1g of the second substrate 12 are in close proximity to each other. By providing the first substrate 11 and the second substrate 12 in this manner, related elements are fabricated on the first surface 1a and the second surface 1b of the first substrate 11 and the second substrate 12, respectively. Here, related elements such as the first electrode 3, the light-emitting element 2 and the drive wiring layer 8 are fabricated on the first substrate 11, and related elements such as the second electrode 4 are fabricated on the second substrate 12. Then, by combining the first substrate 11 and the second substrate 12 into a single substrate 1, and finally forming side edge wiring on the side surface of substrate 1, the process of fabricating the film layer structure on the substrate does not require turning the substrate over, thus preventing scratches caused by contact of the substrate with equipment and preventing electrostatic discharge problems. In addition, since the related elements on the substrate are fabricated on the first substrate 11 and the second substrate 12 respectively, there is no problem of laser damage to the film layer formed on the other side of the substrate by the laser etching pattern on one side of the substrate.

[0128] Referring to Figure 10A as an example, the first substrate 11 and the second substrate 12 have the same dimensions in the second direction Y, and there may be two first selected side surfaces 1cc1 and two second selected side surfaces 1cc2, and the first selected side surface 1cc1 is located on the same plane as the second selected side surface 1cc2, that is, the first selected side surface 1cc1 and the second selected side surface 1cc2 located on the same side constitute the selected side surface 1cc of the substrate 1. Therefore, there are two selected side surfaces 1cc of the substrate 1.

[0129] For example, referring to Figure 10B, the dimension of the first substrate 11 in the second direction Y is larger than the dimension of the second substrate 12 in the second direction Y, there is one selected side surface 1cc that constitutes the substrate 1, and the first selected side surface 1cc1 located on the first substrate 11 is on the same plane as the second selected side surface 1cc2 located on the second substrate 12.

[0130] In some embodiments, referring to Figure 10B, the second surface 1b includes a first region G1 having a first distance h1 from the first surface 1a and a second region G2 having a second distance h2 from the first surface 1a, where the first distance h1 is greater than the second distance h2.

[0131] For example, the orthogonal projection area of ​​the first region G1 of the second surface 1b onto the first surface 1a is the same as the orthogonal projection area of ​​the second substrate 12 onto the first surface 1a, where the first region G1 is the location where the second substrate 12 is located, and the second region G2 is the portion of the third surface 1f of the first substrate 11 remaining exposed after removing the portion covered by the second substrate 12 from the first substrate 11, that is, the second surface 1b of substrate 1 here is a portion of the third surface 1f of the first substrate 11. In other words, the area of ​​the second substrate 12 is smaller than the area of ​​the first substrate 11. The first region G1 has a first distance h1 from the first surface 1a, where the first distance h1 is the sum of the thicknesses of the first substrate 11 and the second substrate 12, and the second region G2 has a second distance h2 from the first surface 1a, where the second distance h2 is the thickness of the first substrate 11, and therefore the first distance h1 is greater than the second distance h2.

[0132] In some embodiments, referring to Figure 10B, the first distance h1 is twice the second distance h2.

[0133] For example, to facilitate the manufacturing of the substrates, the thickness of the substrates may be made the same. In this case, the thickness of the first substrate 11 and the second substrate 12 are the same, that is, the first distance h1 is twice the second distance h2.

[0134] In some embodiments, referring to Figures 11A and 11B, the substrate 1 further includes an adhesive layer 13 provided between the third surface 1f and the fourth surface 1g, configured to bond the third surface 1f and the fourth surface 1g together.

[0135] For example, the adhesive layer 13 is provided between the third surface 1f and the fourth surface 1g, that is, the adhesive layer 13 is provided between the first substrate 11 and the second substrate 12, and brings the third surface 1f of the first substrate 11 and the fourth surface 1g of the second substrate 12 into close contact.

[0136] In some embodiments, referring to Figures 11A and 11B, the material of the adhesive layer 13 is a thermosetting or UV (Ultra-Violet Ray) curing material, and a plurality of silica beads 131 are uniformly distributed inside the adhesive layer 13.

[0137] As an example, referring to Figures 11A and 11B, in order to ensure the flatness of the bond between the third surface 1f of the first substrate 11 and the fourth surface 1g of the second substrate 12 and to improve the quality of the display panel, a plurality of silica beads 131 of uniform size are uniformly provided inside the adhesive layer 13.

[0138] In some embodiments, referring to Figures 11A and 12A, the orthogonal projection area of ​​the adhesive layer 13 onto the fourth surface 1g is equal to the area of ​​the fourth surface 1g. That is, the adhesive layer 13 extends between the first substrate 11 and the second substrate 12 and is provided corresponding to the first substrate 11 and the second substrate 12.

[0139] In some embodiments, referring to Figures 11B and 12B, the orthogonal projection of the adhesive layer 13 onto the fourth surface 1g is a frame structure, which is located at the edge of the fourth surface 1g. That is, there may be a distance between the outer contour of the adhesive layer 13 and the outer contour of the fourth surface 1g of the second substrate 12 to prevent the material of the adhesive layer 13 from overflowing from the outer contour of the fourth surface 1g of the second substrate 12 during placement. However, this does not facilitate process simplification and leads to increased costs.

[0140] As shown in Figures 13 and 14, some embodiments of the present disclosure further provide a display device 100 including a display panel 10 and a drive circuit board 20 according to any of the embodiments described above. The drive circuit board 20 is provided on the second surface 1b of the substrate 1 of the display panel 10, and the drive circuit board 20 and a plurality of connection wirings 5 ​​of the display panel 10 are electrically connected.

[0141] For example, the drive circuit board 20 is electrically connected to a plurality of connection wires 5 via a plurality of second electrodes 4, and transmits signals and voltages to the light-emitting element to achieve the display effect of the display panel 10.

[0142] For example, the display device 100 may be a Mini LED (Mini Light Emitting Diode) display device or a Micro LED (Micro Light Emitting Diode) display device.

[0143] In some examples, as shown in Figures 1, 2A, 2B, and 14, when mini light-emitting diodes or micro light-emitting diodes are used as the light-emitting element 2, the occupied volume is smaller, the particles are smaller, the light source density per unit area is higher for the same screen size, and the size of the light source unit is smaller compared to conventional LEDs. As a result, local control of the light-emitting element 2 can be performed more precisely, uniformity of display brightness can be ensured, and the display quality of the display device 100 can be ensured.

[0144] The display device 100 uses the display panel 10 according to the embodiment described above, and has the same technical effects as the display panel 10 described above, so its explanation is omitted here.

[0145] Some embodiments of the present disclosure further provide a splicing display device 1000, as shown in Figure 15, which includes a plurality of display devices 100 according to the above-described embodiments, and wherein the selected side 1cc of the display devices 100 arranged in the same column or row is provided on the same side.

[0146] For example, multiple display devices 100 of the splicing display device 1000 are arranged in an array. The splicing display device 1000 can achieve large-screen display and can be used, for example, as an advertising splicing screen or a conference splicing screen.

[0147] For example, as shown in Figure 15, the display device 100 is rectangular.

[0148] Referring to Figures 15 and 1, in the display panel 10, multiple first electrodes 3 are arranged in parallel along the first direction X, and correspondingly, multiple connection wires 5 are also arranged in parallel along the first direction X. The other direction parallel to the display surface of the display device 100 and perpendicular to the first direction X is referred to as the second direction Y. The display device 100 has multiple sides, and in the following description, among the multiple sides of the display device 100, the side that is close to the peripheral region BB of the substrate 1 will be referred to as the selected side of the display device 100.

[0149] For example, as shown in Figures 1, 2A, and 2B, the display panel 10 includes a display area AA and a peripheral area BB located on one side of the display area AA, with a plurality of connection wires 5 and a plurality of first electrodes 3 provided close to the peripheral area BB of the substrate 1.

[0150] Furthermore, as shown in Figure 15, when connecting multiple display devices 100, including the display panels 10 shown in Figures 1, 2A, and 2B, by arranging the selected sides of two adjacent display devices 100 together along the first direction X, the seam in the first direction X is substantially eliminated between two adjacent display devices 100 among the multiple display devices 1000 arranged in a row along the first direction X. A seam exists between two adjacent display devices 100 among the multiple display devices 100 arranged in a row along the second direction Y. In other words, the size of the seam between two adjacent display devices among the multiple display devices 100 arranged in a row along the first direction X is smaller than the size of the seam between two adjacent display devices 100 among the multiple display devices 100 arranged in a row along the second direction Y.

[0151] However, because the size of the peripheral region BB in the second direction Y is small, when actually viewed, the seam between the two adjacent display devices 100 is less likely to be visible within the visual range, resulting in a more complete display screen for the splicing display device 1000 and a better display effect.

[0152] The splicing display device 1000 uses the display device 100 according to the above-described embodiment and has the same technical effects as the display device 100 described above, so its explanation is omitted here.

[0153] Some embodiments of the present invention further provide a method for manufacturing a display panel 10, which includes the following steps, as shown in Figure 16.

[0154] S1 provides substrate 1.

[0155] Here, as shown in Figures 1, 2A, and 2B, the substrate 1 includes a first surface 1a, a second surface 1b, and a plurality of side surfaces 1c connecting the first surface 1a and the second surface 1b, and at least one of the plurality of side surfaces 1c of the substrate 1 is a selected side surface 1cc. The plurality of side surfaces 1c are planar.

[0156] For example, the first surface 1a includes a display area AA and a peripheral area BB located on at least one side of the display area AA and closer to the selected side surface 1cc of the substrate 1 than the display area AA.

[0157] In some examples, the material of substrate 1 is a rigid material such as glass or quartz.

[0158] For example, referring to Figure 10B, the second surface 1b includes a first region G1 having a first distance h1 greater than the second distance h2 from the first surface 1a, and a second region G2 having a second distance h2 from the first surface 1a. For example, referring to Figure 16, the first distance h1 is twice the second distance h2.

[0159] For example, referring to Figure 10A, the first region G1 and the second region G2 contained in the second surface 1b are located on the same plane. That is, the distances between the first region G1 and the second region G2 and the first surface 1a are equal, meaning that the first distance h1 is equal to the second distance h2.

[0160] The substrate 1 related to S1 is a substrate on which film layer structures corresponding to the first surface and the second surface are formed.

[0161] Referring to S2, Figures 2A, 2B, and 3, the boundary edge between the selected side surface 1cc of the substrate 1 and the first surface 1a is polished to form the first transition side surface 1d, and the boundary edge between the selected side surface 1cc of the substrate 1 and the second surface 1b is polished to form the second transition side surface 1e.

[0162] Furthermore, referring to Figures 2A, 2B, and 3, by forming the first transition side 1d and the second transition side 1e, a smooth transition connection can be ensured during the manufacturing process of the side wiring, stress can be better distributed, reducing the problems of collision and chipping due to stress concentration, and improving the reliability of the display panel.

[0163] Referring to S3, Figures 1 and 3, a plurality of connection wires 5 are formed on the first surface 1a, the selected side surface 1cc, and the second surface 1b.

[0164] Referring to Figures 1 and 3, the plurality of connecting wires 5 are arranged in parallel at intervals, and each of the plurality of connecting wires 5 includes a first part 51, a second part 52, and a third part 53 which are connected in order. The first part 51 is provided on at least the first surface 1a and is electrically connected to one of the plurality of first electrodes 3, the second part 52 is provided on the selected side surface 1cc, and the third part 53 is provided on at least the second surface 1b and is electrically connected to one of the plurality of second electrodes 4.

[0165] In some embodiments, referring to Figure 4, the maximum width B1 of the first part 51 in the first direction X and / or the maximum width B3 of the third part 53 in the first direction X is greater than the maximum width B2 of the second part 52 in the first direction X.

[0166] Furthermore, regarding the relationship between the width dimensions mentioned above during the process of manufacturing the connecting wiring, you may refer to the previously mentioned explanation, and it will not be described in detail here.

[0167] For example, of the first part 51, second part 52, and third part 53 of the connecting wiring 5, two adjacent parts overlap. Referring to Figure 3, since the first part 51 and third part 53 of the connecting wiring 5 are formed before the second part 52 of the connecting wiring 5, as can be seen from Figures 3 and 4, the parts of the second part 52 that overlap with the first part 51 and the third part 53 are separated from the substrate 1.

[0168] Note that the order in which the first part 51, second part 52, and third part 53 of the connecting wiring 5 are formed is not limited here, and Figures 3 and 4 are merely examples.

[0169] In some embodiments, as shown in Figure 17, step S1 of providing the substrate 1 further includes the following steps.

[0170] S1-1 provides an initial first substrate 11' and an initial second substrate 12'.

[0171] Referring to Figures 18A, 18B, 18C, and 18D, the initial first substrate 11' includes opposing initial first surfaces 1a' and initial third surfaces 1f', and a plurality of initial first sides 1c1' connecting the initial first surface 1a' and the initial third surface 1f', the initial second substrate 12' includes opposing initial fourth surfaces 1g' and initial second surfaces 1b', and a plurality of initial second sides 1c2' connecting the initial fourth surface 1g' and the initial second surface 1b', at least one of the plurality of initial first sides 1c1' being an initial first selected side 1cc1', and at least one of the plurality of initial second sides 1c2' being an initial second selected side 1cc2'.

[0172] For example, the initial first substrate 11' has four initial first sides 1c1', of which one initial first side 1c1' and two initial first sides 1c1' are initial first selected sides 1cc1', and the initial second substrate 12' has four initial second sides 1c2', of which one initial second side 1c2' and two initial second sides 1c2' are initial first selected sides 1cc2'.

[0173] Referring to S1-2, Figures 18A, 18B, and Figure 1, a plurality of light-emitting elements 2 and a plurality of first electrodes 3 arranged at intervals in the first direction X are formed on the initial first surface 1a' of the initial first substrate 11'. The plurality of first electrodes 3 are closer to the initial first selected side surface 1cc1' than the plurality of light-emitting elements 2.

[0174] For example, multiple light-emitting elements 2 are located within the display area AA of the initial first surface 1a', and multiple first electrodes 3 are located in the peripheral area BB of the initial first surface 1a'.

[0175] Referring to S1-3, Figures 18C, 18D, and 3, a plurality of second electrodes 4 are formed on the initial second surface 1b' of the initial second substrate 12', spaced apart in the first direction X.

[0176] For example, referring to Figures 18C, 18D, and 2A, the multiple second electrodes 4 are provided on the side adjacent to the initial second selected side surface 1cc2' of the initial second surface 1b' of the initial second substrate 12', and the dimension D2 of the multiple second electrodes 4 in the second direction Y is greater than the dimension D1 of the multiple first electrodes in the second direction Y. In other words, the orthogonal projection of the multiple second electrodes 4 onto the initial first surface 1a' can extend to the display area AA.

[0177] The above does not limit the order in which the multiple light-emitting elements 2, multiple first electrodes 3, and multiple second electrodes 4 are formed.

[0178] As shown in S1-4, Figures 18A to 18D, Figure 10A, and Figure 10B, the initial first substrate 11' and initial second substrate 12' are cut to form a plurality of first substrates 11 and a plurality of second substrates 12.

[0179] Referring here to Figures 18A to 18D, Figure 10A and Figure 10B, the first substrate 11 includes opposing first surfaces 1a and third surfaces 1f, and a plurality of first sides 1c1 connecting the first surface 1a and the third surface 1f, and the second substrate 12 includes opposing fourth surfaces 1g and second surfaces 1b, and a plurality of second sides 1c2 connecting the fourth surface 1g and the second surface 1b, with the third surface 1f and the fourth surface 1g being in close proximity to each other. At least one of the plurality of first sides 1c1 is the first selected side 1cc1, and at least one of the plurality of second sides 1c2 is the second selected side 1cc2, and the first selected side 1cc1 is located on the same plane as the second selected side 1cc2 and constitutes the selected side 1cc of the substrate 1. The first surface 1a' of the initial first substrate 11' is the first surface of the first substrate 11, the second surface 1b' of the initial second substrate 12' is the second surface 1b of the second substrate 12, the first selected side surface 1cc1' of the initial first substrate 11' is the first selected side surface 1cc1 of the first substrate 11, and the second selected side surface 1cc1' of the initial second substrate 12' is the second selected side surface 1cc2 of the second substrate 12.

[0180] As shown in S1-5, Figures 12A and 12B, an adhesive layer 13 is formed on the fourth surface 1g of the second substrate 12, and the third surface 1f and the fourth surface 1g of the first substrate 11 are bonded together to form the substrate 1.

[0181] The substrate 1 includes a first substrate 11 and a second substrate 12 that are provided opposite to each other, the first surface 1a of the first substrate 11 is the first surface 1a of the substrate 1, the second surface 1b of the second substrate 12 is the second surface 1b of the substrate 1, and the third surface 1f of the first substrate 11 and the fourth surface 1g of the second substrate 12 are in close proximity to each other. The substrate 1 includes a selected side surface 1cc composed of the first selected side surface 1cc1 and the second selected side surface 1cc2, and the first selected side surface 1cc1 is located on the same plane as the second selected side surface 1cc2.

[0182] In the process of bonding the third surface 1f and the fourth surface 1g, defects such as misalignment, overflow, or indentation of the adhesive layer 13 may exist at the edges of the first substrate 11 and the second substrate 12. This may increase the likelihood of disconnection, short circuits, and detachment during the subsequent manufacturing of connection wiring. To avoid this, after the process of bonding the third surface 1f and the fourth surface 1g is completed, the first selected side surface 1cc1 and the second selected side surface 1cc2 of the first substrate 11 and the second substrate 12 are chamfered, so that the first selected side surface 1cc1 and the second selected side surface 1cc2 are located on the same plane, ensuring alignment consistency and flatness between the first selected side surface 1cc1 and the second selected side surface 1cc2.

[0183] The order of steps S1-4 and S1-5 described above is not limited to the process of manufacturing the circuit board. For the sake of clarity, the element structure on the circuit board is omitted in the following flowchart.

[0184] In some embodiments, steps S1-4 precede steps S1-5. Figure 19A shows a flowchart for forming the substrate. Referring to Figure 19A, first, an initial first substrate 11' and an initial second substrate 12' are provided, and after cutting the initial first substrate 11' and initial second substrate 12' (the dashed lines in the figure are the cutting lines), the first substrate 11 and the second substrate 12 are obtained, an adhesive layer 13 is formed on the fourth surface 1g of the second substrate 12, and the third surface 1f and the fourth surface 1g of the first substrate 11 are bonded together to form the substrate 1.

[0185] The sizes of the first substrate 11 and the second substrate 12 shown in Figure 19A above are merely examples; for specific details, please refer to the explanation above.

[0186] In some embodiments, steps S1-5 precede steps S1-4. Figure 19B shows a flowchart for forming the substrate. Referring to Figure 19B, first, an initial first substrate 11' and an initial second substrate 12' divided into multiple second substrate regions are provided. An adhesive layer 13 is provided on the fourth surface 1g' of the initial second substrate 12' at a position close to one side edge of each second substrate region, and the third surface 1f' of the initial first substrate 11' and the fourth surface 1g' of the initial second substrate 12' are bonded together. After cutting the initial substrate to be bonded twice (dashed lines in the figure are cutting lines), substrate 1 is obtained. In the second cutting, the portion of the second substrate that does not have an adhesive layer attached is removed.

[0187] As described above, the first region and the second region of the second surface of the substrate 1 are at different distances from the first surface.

[0188] In some embodiments, steps S1-5 precede steps S1-4. Figure 19C shows a flowchart for forming a substrate. Referring to Figure 19C, first, an initial first substrate 11' and an initial second substrate 12' divided into a plurality of second substrate regions are provided. An adhesive layer 13 is provided on the fourth surface 1g' of the initial second substrate 12', and the third surface 1f' of the initial first substrate 11' is bonded to the fourth surface 1g' of the initial second substrate 12'. After cutting the initial substrates to be bonded once (the dashed lines in the figure are cutting lines), substrate 1 is obtained.

[0189] The first and second regions of the second surface of the substrate 1, formed as described above, are at the same distance from the first surface.

[0190] The following describes a manufacturing method for forming connecting wiring, using the case where the first and second regions of the second surface of the substrate are at different distances from the first surface as an example.

[0191] In some embodiments, referring to Figure 20, step S2, which involves forming a plurality of connection wires 5 on the first surface 1a, the selected side surface 1cc, and the second surface 1b, includes the following steps.

[0192] Referring to S2-1 and Figure 21B, the first part 51 of the connection wiring 5 is formed on the first surface 1a of the first substrate 11 using a 3D printing process.

[0193] Furthermore, since a portion of the first part 51 is located on the first surface 1a of the substrate 1, and the other portion is located on the first transitional side 1d between the first surface 1a and the selected side 1cc, it is necessary to reliably supply conductive paste to a predetermined starting position Q1 during the process of manufacturing the first part 51 of the connecting wiring. The starting position Q1 of the 3D printing apparatus is on the side of the selected side 1cc that is away from the first surface 1a of the substrate 1.

[0194] Referring to S2-2 and Figure 21A, the third portion 53 of the connection wiring 5 is formed on the second surface 1b of the second substrate 12 using a 3D printing process.

[0195] For example, in the process of manufacturing the third part 53 of the connecting wiring, the starting position Q3 of the 3D printing device is above the boundary between the selected side surface 1cc and the second surface 1b. For specific principles, please refer to the explanation of forming the first part 51, and it will not be described in detail here.

[0196] Referring to S2-3 and Figure 21C, a 3D printing process is used to form the second part 52 of the connecting wiring 5 that electrically connects the first part 51 and the third part 53 on the first selected side surface 1cc1 and the second selected side surface 1cc2.

[0197] For example, the starting position Q of the 3D printing device is on the side of the selected side 1cc away from the substrate 1, and close to one end of the first surface 1a of the substrate 1. The printing direction is from the first part toward the third part, and the device shuts down early as it approaches the end position to ensure overlap between both ends of the second part and the first and third parts. Alternatively, the printing direction is from the third part toward the first part, as shown by the double arrow in Figure 21C, and in this case, the printing direction is not limited.

[0198] Note that the order of steps S2-1 and S2-2 is not limited. Referring to the process diagrams shown in Figures 21A to 21C, one example is to perform step S2-2 before step S2-1. In the flowchart corresponding to step S2, Figures 21A to 21C illustrate an example where the distances from the first surface to the first and second regions of the second surface of the substrate are different.

[0199] Alternatively, step S2, which involves forming a plurality of connection wires 5 on the first surface 1a, the selected side surface 1cc, and the second surface 1b, is specifically as follows.

[0200] S21. Using a 3D printing process, the material for the connecting wiring 5 is formed on the selected side surface 1cc, and the material for the connecting wiring 5 is provided on the first surface 1a and the second surface 1b, overlapping with the first electrode 3 and the second electrode 4 to form a plurality of connecting wirings 5.

[0201] For example, the material used to form the connecting wiring 5 is, for instance, a fluid silver paste, which forms the second part 52 of the connecting wiring while simultaneously extending to the first surface 1a and the second surface 1b, thereby achieving a fluid overlap with the first electrode 3 and the second electrode 4, and further forming multiple connecting wirings 5.

[0202] The process for forming the multiple connection lines described above may be a pad printing process or a screen printing process, and is not limited to these. The connection lines obtained by employing the above manufacturing process can avoid damage and corrosion, and at the same time, laser etching can avoid causing certain damage to the film layer on the surface of the display panel 10, further simplifying the manufacturing process of the display panel and improving the yield in the manufacturing process of the display panel.

[0203] In some embodiments, referring to Figures 22A and 22B, step S2, which involves forming a plurality of connection wires 5 on the first surface 1a, the selected side surface 1cc, and the second surface 1b, includes the following steps:

[0204] S2-1, The first part 51 of the connection wiring 5 is formed on the first surface 1a of the first substrate 11 using a pad printing process.

[0205] S2-2, the third portion 53 of the connection wiring 5 is formed on the second surface 1b of the second substrate 12 using a pad printing process.

[0206] S2-3, the second part 52 of the connecting wiring 5 that electrically connects the first part 51 and the third part 53 is formed on the first selected side surface 1cc1 and the second selected side surface 1cc2 using a pad printing process.

[0207] For example, the pad used in the pad printing process is made of silica gel, and the conductive paste that can be transferred to the pad is a silver paste consisting of silver particles and a resin-based solvent.

[0208] The order of steps S2-1 and S2-2 described above is not limited. Specifically, referring to the pad printing process diagram shown in Figure 22A, conductive paste 102 is uniformly applied to the steel mesh 101 on which the wiring pattern 1011 is provided, and excess conductive paste is scraped off using a scraper 103 to smooth the sides of the steel mesh on which the wiring pattern is formed. Then, the pad 104 is pressed down and the conductive paste 102 in the wiring pattern 1011 is applied to it, and as the pad rises, the conductive paste is transferred to the pad 104. After adjusting the position to be printed on the substrate to correspond to the position of the conductive paste on the pad 104, referring to Figure 22B, the pad is pressed down to print the conductive paste to the position to be printed on the substrate, and then the side connection wiring is formed. Referring to the above description, in the process of forming the connection wiring, three transfers are required to complete the process, that is, pad printing must be performed three times.

[0209] In some cases, as can be seen with reference to Figures 22B and 4, in the process of manufacturing the connection wiring 5 using the pad printing process described above, the maximum width B1 of the first part 51 of the manufactured connection wiring 5 in the first direction X and / or the maximum width B3 of the third part 53 in the first direction X is greater than the maximum width B2 of the second part 52 in the first direction X. For example, in the process of forming the first part 51 of the connection wiring 5, the length of the first part 51 located on the first surface 1a and the first transition side surface 1d is shorter than the length of the second part 52. In order to form conductive paste on the first surface 1a and the first transition side surface 1d simultaneously, a relatively large force must be applied to the pad 104 so that the first part 51 is formed by pressing down the pad 104 only once. In this way, the more force is applied to the pad 104, the greater the deformation, so the contact area between the pad 104 and the substrate increases, and the maximum width B1 of the formed first part 51 in the first direction X becomes larger than the maximum width B2 of the second part 52 in the first direction X. The formation process of the third part 53 of the connecting wiring also refers to the formation process of the first part 51.

[0210] In some cases, as shown in Figures 22B and 4, the surface of the pad is an arcuate surface, and in the process of forming the second part 52 of the connecting wiring 5, because the length of the second part 52 is relatively long, first the starting end of the conductive paste to be applied to the pad is brought into contact with one end of the selected side surface 1cc of the substrate adjacent to the first surface 1a. After the pad printing of the starting end of the second part 52 is completed, the pad is rotated so that the other positions of the conductive paste sequentially come into contact with the selected side surface, forming the middle and end parts of the second part. When forming the starting end of the second part 52, the force acting on the pad is relatively larger compared to the middle and end parts, and the dimension d5 of the first end 52a of the connecting wiring 5 in the first direction X is larger than the dimension d6 of the second end 52b in the first direction. The second part 52 includes the first end 52a and the second end 52b, with the first end 52a being the starting end and the second end being the ending end.

[0211] In some embodiments, the process for forming the connection wiring employs a screen printing process. Referring to Figure 23, only the third portion of the connection wiring on the substrate is illustrated here. When using the screen printing process, the connection wiring is similarly completed by three screen printing steps, with the first portion on the front and the third portion on the back of the substrate being formed first, followed by the second portion on the side.

[0212] In some cases, each part of the connecting wiring formed using the screen printing process will similarly have the dimensional relationships described above. While the amount and flow rate of the conductive paste can be controlled during the screen printing process, this will not be explained here.

[0213] The above are merely specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto. Any modifications or substitutions that a person skilled in the art could conceive of within the scope of the technology disclosed herein are included within the scope of the present disclosure. Accordingly, the scope of the present disclosure is subject to the claims.

Claims

1. A substrate comprising a first surface, a second surface, and a plurality of sides connecting the first surface and the second surface, wherein at least one of the plurality of sides is a selected side, A plurality of light-emitting elements provided on the first surface, A plurality of first electrodes provided on the first surface and arranged at intervals along the first direction, wherein the plurality of first electrodes are closer to the selected side surface than the plurality of light-emitting elements, A plurality of second electrodes provided on the second surface and arranged at intervals along the first direction, wherein the second electrode is adjacent to the selected side surface, A plurality of connecting wires arranged in parallel and spaced apart, each of the plurality of connecting wires comprising a first part, a second part, and a third part connected sequentially, wherein the first part is provided on at least the first surface and is electrically connected to one of the plurality of first electrodes, the second part is provided on the selected side surface, and the third part comprises a plurality of connecting wires provided on at least the second surface and is electrically connected to one of the plurality of second electrodes, The maximum width of the first part in the first direction and / or the maximum width of the third part in the first direction is greater than the maximum width of the second part in the first direction. Display panel.

2. In at least one connection wiring, of at least two section lines in the first direction of the orthogonal projection pattern onto the first surface of the first part, the dimension in the first direction of the section line closer to the selected side is greater than the dimension in the first direction of the section line further away from the selected side, and / or Of the at least two section lines in the first direction of the orthogonal projection pattern onto the second surface of the third part, the dimension in the first direction of the section line closer to the selected side surface is greater than the dimension in the first direction of the section line further away from the selected side surface. The display panel according to claim 1.

3. The second part of the connecting wiring includes a first end and a second end, the dimension of the first end in the first direction is greater than the dimension of the second end in the first direction, and the first end and the second end are opposing ends in the extending direction of the second part of the connecting wiring. The display panel according to claim 2.

4. The first part partially overlaps with the first electrode, and the third part partially overlaps with the second electrode. The display panel according to claim 2 or 3.

5. The first surface further includes a plurality of signal lines that electrically connect the plurality of first electrodes and the plurality of light-emitting elements, each signal line being electrically connected to one of the first electrodes, and the dimension of the signal line in the first direction being less than or equal to the dimension of the first electrode in the first direction. The display panel according to any one of claims 1 to 4.

6. The present invention further includes at least one extension line provided on the side adjacent to the selected side of at least one first electrode, wherein the at least one extension line is electrically connected to the first electrode. The at least one extension line is electrically connected to one connecting wire. The display panel according to claim 5.

7. The number of extension wires electrically connected to the first electrode is multiple, and the distance between any two of the extension wires is 60 μm or more. The display panel according to claim 6.

8. At least two of the extension lines are electrically connected to the first part of the connecting wiring, The dimension of the first part in the first direction is greater than the distance between the two extension lines, or The first part includes at least two subsections, the dimension of any subsection in a first direction being greater than or equal to the dimension of any extension line in a first direction, and at least two of the subsections each overlap with at least two of the extension lines. The display panel according to claim 7.

9. The dimension of the extension line in the first direction is 30 μm or less. The display panel according to claim 8.

10. The plurality of signal lines and the extension lines are composed of a first metal layer, and the plurality of first electrodes are composed of the first metal layer and the second metal layer, the second metal layer is further away from the first surface than the first metal layer. The display panel according to any one of claims 6 to 9.

11. In the connected signal line and extension line, the dimension of the signal line in the first direction is greater than the dimension of the extension line in the first direction. The display panel according to claim 10.

12. The substrate includes a first substrate having opposing first and third surfaces and a plurality of first sides connecting the first and third surfaces, and a second substrate having opposing fourth and second surfaces and a plurality of second sides connecting the fourth and second surfaces, wherein the third and fourth surfaces are close to each other, at least one of the plurality of first sides is a first selected side, at least one of the plurality of second sides is a second selected side, and the first selected side lies on the same plane as the second selected side and constitutes a selected side of the substrate. The display panel according to any one of claims 1 to 11.

13. The second surface includes a first region having a first distance from the first surface and a second region having a second distance from the first surface, wherein the first distance is greater than the second distance. The display panel according to claim 12.

14. The first distance is twice the second distance. The display panel according to claim 13.

15. The substrate further includes an adhesive layer provided between the third surface and the fourth surface, configured to bond the third surface and the fourth surface together. The display panel according to any one of claims 12 to 14.

16. The material of the adhesive layer is a thermosetting or UV (Ultra-Violet Ray) curing material, and a plurality of silica beads are uniformly arranged inside the adhesive layer. The display panel according to claim 15.

17. A display panel according to any one of claims 1 to 16, The display panel includes a drive circuit board provided on the second surface of the substrate of the display panel and electrically connected to a plurality of connection wires of the display panel, Display device.

18. A splicing display device comprising a plurality of the display devices described in claim 17, The selected side of the display device located in the same column or row is located on the same side. Splicing display device.

Images