Detection and analysis of substrate support and preheating ring within the processing chamber via imaging.

Abstract

Apparatus, methods, and systems are provided for identifying a substrate support and / or preheating ring in a processing chamber via imaging and image processing, and for obtaining information thereon. In one embodiment, a substrate support is provided. The substrate support broadly includes a top surface configured to accommodate a substrate in a processing chamber, and marking features disposed on the top surface of the substrate support, the marking features being detectable by an imaging device connected to the processing chamber in order to provide information about the substrate support via imaging when the substrate support is placed in the processing chamber.

Description

Technical Field

[0001] The present disclosure relates to the manufacture and processing of semiconductors. More particularly, the present disclosure relates to apparatuses, methods, and systems for fabricating devices on a semiconductor substrate. Specifically, embodiments of the present disclosure provide apparatuses, methods, and systems for identifying and analyzing a substrate support and / or a preheat ring within a processing chamber via imaging.

Background Art

[0002] Due to the trend towards smaller critical dimensions in semiconductor processing, the precision with which semiconductor device manufacturers must execute the manufacturing process has increased exponentially. Semiconductor-based integrated circuits are typically manufactured by forming a series of layers on a substrate that includes multiple integrated circuit regions, which are later separated into individual dies. To form integrated circuit components, very thin layers of material are sequentially stacked and deposited in a patterned manner.

[0003] In semiconductor device manufacturing processes such as CVD (chemical vapor deposition), epitaxy, or other heat treatments, substrates are often processed in a chamber or other processing unit. To process substrates in a chamber, they can be securely attached to a substrate support (e.g., a susceptor) within the chamber during processing to reduce substrate movement. A variety of substrate supports with diverse designs, along with corresponding preheating rings, have been developed and are used to accommodate a variety of substrates and processing chambers. For example, substrate supports are designed to include a variety of pocket sizes and surface features, each of which may require specific setup and substrate handling protocols for proper use of the support. For instance, a substrate support designed with tighter pockets may require less clearance for placing the substrate, necessitating a more precise substrate handling protocol when loading the substrate onto the support. Improper setup and / or handling procedures for the specific substrate support and / or corresponding preheating ring used may cause the substrate support to be improperly installed and / or displaced during use, which could adversely affect the quality / performance of the manufacturing process or the manufactured component.

[0004] In conventional substrate supports and preheating rings within a processing chamber, the visualization system installed inside the chamber to observe the substrate processing cannot identify the substrate support or preheating ring installed inside the processing chamber by imaging the substrate support and preheating ring. For example, in order to identify a conventional substrate support installed inside a processing chamber, the substrate support is removed from the processing chamber by the user, and the identification information on the back of the substrate support is manually inspected.

[0005] Depending on the design and use of the substrate support and preheating ring, both the substrate support and preheating ring will have a limited lifespan to ensure they can be used effectively and reliably within the processing chamber. For example, degradation will eventually affect the performance of the substrate support, such as the substrate no longer adhering firmly to the substrate support. During processing, this may cause the substrate to move and become misaligned. If the substrate becomes misaligned, it may adversely affect the uniformity of thickness and / or film properties.

[0006] Therefore, there is a need for improved apparatus, methods, and systems for identifying and imaging the substrate support and preheating ring used within the processing chamber. [Overview of the Initiative]

[0007] This disclosure provides apparatus, methods, and systems for identifying and analyzing a substrate support in a processing chamber via imaging. In some embodiments, a substrate support is provided. The substrate support includes a top surface configured to accommodate a substrate in a processing chamber, and marking features disposed on the top surface of the substrate support. The marking features are detectable by an imaging device connected to the processing chamber when the substrate support is placed in the processing chamber, and are configured to provide information about the substrate support via imaging.

[0008] In another embodiment, a substrate support is provided. The substrate support includes a top surface configured to house a substrate in a processing chamber, and a marking feature disposed on the top surface of the substrate support. The marking feature includes a height extending from the top surface of the substrate support and an outer surface containing silicon carbide (SiC). The marking feature is configured to be detectable by an imaging device connected to the processing chamber when the substrate support is placed in the processing chamber.

[0009] In yet another embodiment, a processing system is provided configured to analyze a substrate support placed in a processing chamber. The processing system includes a processing chamber having a processing space and an imaging device connected to the processing chamber. The imaging device includes a field of view and is connected to a controller having a processor and memory. The memory includes a software program configured to perform operations to image the substrate support placed in the processing space of the processing chamber and to acquire information about the substrate support when the substrate support is within the field of view of the imaging device. The substrate support includes a top surface configured to accommodate a substrate in the processing chamber and a marking feature placed on the top surface of the substrate support. The marking feature is detectable by the imaging device when the substrate support is placed in the processing chamber and is configured to provide information about the substrate support via imaging.

[0010] To enable a more detailed understanding of the features of this disclosure described above, a more specific description of this disclosure, which is briefly summarized above, can be obtained by referring to embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that since this disclosure may allow for other equally valid embodiments, the accompanying drawings only illustrate typical embodiments of this disclosure and should therefore not be considered to limit the scope of this disclosure.

[0011] However, since this disclosure may allow for other equally valid embodiments, it should be noted that the accompanying drawings only illustrate typical embodiments of this disclosure and should therefore not be considered to limit the scope of this disclosure. [Brief explanation of the drawing]

[0012] [Figure 1] This is a schematic diagram showing a cross-sectional view of a processing chamber including a substrate support assembly and a visualization device according to a particular embodiment of the present disclosure. [Figure 2A] Figure 1 shows an exemplary top view of a substrate support within the processing chamber according to a particular embodiment of the present disclosure. [Figure 2B]Figure 2A shows a cross-sectional perspective view of the substrate support shown in Figure 2A, according to a specific embodiment of the present disclosure. [Figure 3A] Figure 1 shows the field of view of a camera over a substrate support in the processing chamber, according to a specific embodiment of the present disclosure. [Figure 3B] This shows the field of view of a camera located above a substrate support and a preheating ring in a processing chamber, according to a particular embodiment of the present disclosure. [Figure 3C] This is an exemplary field of view of a camera according to a particular embodiment of the present disclosure, showing a region of interest of the substrate support and preheating ring of Figure 3B that can be imaged. [Figure 4A] A top view of a substrate support including marking features, according to a specific embodiment of this disclosure, is shown. [Figure 4B] Figure 4A shows a cross-sectional view of the substrate support along the cutting line 4B-4B. [Figure 5] A top view of a substrate support including marking features, according to a specific embodiment of this disclosure, is shown. [Figure 6A] A top view of a substrate support including marking features, according to a specific embodiment of this disclosure, is shown. [Figure 6B] A cross-sectional view of the substrate support in Figure 6A is shown along the cutting line 6B-6B. [Modes for carrying out the invention]

[0013] For ease of understanding, the same reference numerals have been used to indicate identical elements common to the figures where possible. Elements disclosed in one embodiment are intended to be usefully utilized in other embodiments, even without specific description.

[0014] The embodiments described herein generally relate to apparatus and methods for identifying substrate supports and / or preheating rings within a processing chamber and for obtaining information relating to the substrate supports, preheating rings (if present), and their use within the processing chamber. In one example, a method and apparatus for identifying a substrate support broadly includes placing a marking feature on the top surface of the substrate support and, when the substrate support is placed in the processing chamber, imaging the marking feature to identify and determine a specific model (or design) of the substrate support within the processing chamber. The same may be applied to identify a preheating ring within a processing chamber by placing a marking feature on the top surface of the preheating ring. Each marking feature placed on a substrate support or preheating ring corresponds to a specific model (or design) of each available substrate support or preheating ring. When specific marking features of a substrate support and a preheating ring are imaged, the marking features are analyzed and then used to identify the model of each substrate support or preheating ring on which the imaged marking is placed.

[0015] In other examples, methods and apparatus for monitoring and analyzing substrate supports and / or preheating rings used in a processing chamber broadly include placing marking features on the upper surface of the substrate supports and / or preheating rings, imaging the marking features when the substrate supports and / or preheating rings are present in the processing chamber, and analyzing the marking features to obtain information about the substrate supports and / or preheating rings on which the imaged marking features are located. Examples of information obtained from imaging marking features on a substrate support or preheating ring include information relating to reference measurements for direct scaling at the level of the substrate supports and preheating rings of the obtained images of the substrate supports or preheating rings in the processing chamber, reference points for detecting and determining the rotation angle by the substrate supports or preheating rings in the processing chamber, reference points for detecting and tracking the installation position of the substrate supports or preheating rings in the processing chamber, and / or an indication of a time when the substrate supports or preheating rings may be nearing the end of their lifespan.

[0016] Typically, the processing system has a centralized transfer chamber mounted on a monolithic platform. The transfer chamber is the center of activity for moving the substrates being processed within the system. One or more processing chambers are attached to the transfer chamber via slit valves, through which the substrates are passed by a substrate handler or robot. Access to the transfer chamber from the clean ambient environment is usually via one or more load-lock chambers attached to other slit valves. The load-lock chambers may communicate with an extremely clean room called a white area, or an optional substrate handling chamber, usually called a mini-environment.

[0017] Figure 1 shows a schematic cross-sectional view of a processing chamber 100 having a substrate support assembly and a visualization device according to a particular aspect of the present disclosure. The processing chamber 100 may be configured to perform an epitaxial deposition process. The processing chamber 100 may be used for processing one or more substrates, including the deposition of material onto the upper surface of a substrate 108. Among other components, the processing chamber 100 may include an array of radiant heating lamps 102 for heating the back surface 104 of a substrate support 106 (which may be, for example, a susceptor) located within the processing chamber 100. In some embodiments, the array of radiant heating lamps 102 may be located above an upper dome 128. The substrate support 106 may be a disk-shaped substrate support 106 as shown, or a ring-shaped substrate support 107 without a central opening that supports the substrate from the end face of the substrate and facilitates the substrate's exposure to the thermal radiation of the lamps 102.

[0018] The substrate support 106 is located within the processing chamber 100, between the upper dome 128 and the lower dome 114. The upper dome 128, the lower dome 114, and the base ring 136 positioned between the upper dome 128 and the lower dome 114 roughly define the internal region of the processing chamber 100. The substrate 108 (not to scale) can be brought into the processing chamber 100 via the loading port 103 and placed on the substrate support 106.

[0019] The substrate support 106 is shown in the raised processing position, but can be moved vertically by an actuator (not shown) to a loading position below the processing position. This allows the lift pins 105, which pass through the holes in the substrate support 106 and the central shaft 132, to contact the lower dome 114, thereby lifting the substrate 108 from the substrate support 106. A robot (not shown) can then enter the processing chamber 100 and engage with the substrate 108, and remove the substrate 108 from the processing chamber 100 via the loading port 103. The substrate support 106 can then be moved upward to the processing position, and the substrate 108 can be placed on the upper surface 110 of the substrate support 106 with the device side 116 facing upward.

[0020] While the substrate support 106 is located at the processing position, it divides the internal space of the processing chamber 100 into a processing gas region 156 above the substrate and a purge gas region 158 below the substrate support 106. The substrate support body 106 is rotated by a central shaft 132 during processing in order to minimize the influence of the spatial bias of heat and processing gas flow in the processing chamber 100, and thus promotes uniform processing of the substrate 108. The substrate support 106 is supported by a central shaft 132, and the central shaft 132 moves the substrate 108 up and down in the direction 134 during loading and unloading of the substrate 108 and, in some cases, during processing of the substrate 108. In order to absorb the radiant energy from the lamp 102 and transfer the radiant energy to the substrate 108, the substrate support 106 can be formed from silicon carbide or graphite coated with silicon carbide.

[0021] Generally, the central window portion of the upper dome 128 and the bottom of the lower dome 114 are formed of an optically transmissive material such as quartz. Here, "optically transparent" generally means that radiation is transmitted, but not necessarily 100% transmitted. As will be described in more detail below with respect to FIG. 1, the thickness and curvature of the upper dome 128 can be configured to provide a flatter shape for uniform flow within the processing chamber in accordance with the present invention.

[0022] One or more lamps, such as an array of radiant heating lamps 102, can be arranged in a specific pattern around the central shaft ********** more below the lower dome 114 in order to separately control the temperature in various regions of the substrate 108 as the processing gas passes through, thereby promoting the deposition of material on the upper surface 116 of the substrate 108. Although not described in detail here, the material to be deposited can include gallium arsenide, gallium nitride, or aluminum gallium nitride.

[0023] Lamp 102 can be configured to include a bulb 141 and to heat the substrate 108 to a temperature in the range of approximately 200°C to 1600°C. Each lamp 102 is connected to a switchboard (not shown), and power is supplied to each lamp 102 via the switchboard. The lamps 102 are located in a lamp head 145, which can be cooled during or after processing by a cooling fluid introduced, for example, into a channel 149 located between the lamps 102. Partly due to the proximity of the lamp head 145 to the lower dome 114, the lamp head 145 cools the lower dome 114 conductively and radiatively. The lamp head 145 can also cool the lamp walls and the walls of the reflector (not shown) around the lamp. Alternatively, the lower dome 114 can be cooled by a convective approach. Depending on the application, the lamp head 145 may or may not be in contact with the lower dome 114.

[0024] Optionally, a circular shield 167 may be positioned around the substrate support 106 and surrounded by the liner assembly 163. The shield 167 prevents or minimizes thermal / optical noise leakage from the lamp 102 to the device side 116 of the substrate 108 and provides a preheating zone for the processing gas. The shield 167 can be made from CVD SiC, SiC-coated sintered graphite, grown SiC, opaque quartz, coated quartz, or any similarly suitable material resistant to chemical decomposition by processing and purging gases.

[0025] The liner assembly 163 is dimensioned to be nested within or surrounded by the inner circumference of the base ring 136. The liner assembly 163 shields the processing space (i.e., the processing gas area 156 and the purge gas area 158) from the metal wall of the processing chamber 100. The metal wall may react with the precursor and cause contamination in the processing space. Although the liner assembly 163 is shown as a single body, the liner assembly 163 may include one or more liners of different configurations.

[0026] The optical pyrometer 118 can be used to heat the back surface of the substrate 108 from the substrate support 106. The above temperature measurement by the optical pyrometer 118 can also be performed on the device side 116 of the substrate, which has an unknown emissivity, because heating of the top surface 110 of the substrate in this manner is independent of emissivity. As a result, the optical pyrometer 118 can sense only the high-temperature radiation from the substrate 108 transmitted from the substrate support 106, where the background radiation directly reaching the optical pyrometer 118 from the lamp 102 is minimal.

[0027] Optionally, a reflector 122 may be positioned outside the upper dome 128 to reflect infrared radiation emitted from the substrate 108 back to the substrate 108. The reflector 122 may be secured to the upper dome 128 using a clamping ring 130. The reflector 122 may be made of a metal such as aluminum or stainless steel. The reflecting efficiency may be improved by coating the reflector area with a highly reflective coating such as gold. The reflector 122 may have one or more conduits 126 connected to a cooling source (not shown). The conduits 126 are connected to passages (not shown) formed on one side of the reflector 122. The passages are configured to carry a fluid flow, such as water, and may extend horizontally along one side of the reflector 122 in any desired pattern covering part or all of the surface of the reflector 122 in order to cool the reflector 122.

[0028] The process gas supplied from the process gas source 172 is introduced into the process gas region 156 through a process gas inlet 174 formed in the side wall of the base ring 136. The process gas inlet 174 is configured to direct the process gas generally radially inward. During the film formation process, the substrate support 106 can be positioned in a processing location near the process gas inlet 174, at approximately the same height as the inlet 174, thereby allowing the process gas to rise and spread across the upper surface of the substrate 108 along the flow path 173 in a laminar flow manner. The process gas is discharged from the process gas region 156 (along the flow path 175) through a gas outlet 178 located on the opposite side of the processing gas inlet 174 in the processing chamber 100. The removal of the process gas through the gas outlet 178 can be facilitated by a vacuum pump 180 connected to the gas outlet 178. Since the processing gas inlet 174 and gas outlet 178 are aligned with each other and positioned at approximately the same height, this parallel arrangement, when combined with the flatter upper dome 128 (as will be described in more detail below), is thought to enable a generally planar and uniform gas flow across the substrate 108. Furthermore, radial uniformity can be achieved through the rotation of the substrate 108 via the substrate support 106.

[0029] Figures 2A and 2B show an example of a substrate support 106 that can be used in the processing chamber of Figure 1 according to a particular embodiment of the present disclosure. The substrate support 106 includes a pocket 201 formed on the upper surface 202 of the substrate support 106. The pocket 201 is defined by an annular edge 204, which is further defined by a rim 206. The pocket 201 includes side walls 208 and a substrate housing surface 210 for holding a substrate 108. For a given substrate 108, the diameter of the substrate housing surface 210 of the pocket 201 is generally slightly larger than the diameter of the substrate 108. When in use, the substrate 108 is centered within the pocket 201 on the substrate housing surface 210, and a gap is maintained between the end face of the substrate 108 and the side walls 208 of the pocket 201.

[0030] As described above, this specification provides a method and apparatus for identifying a model of an imaged substrate support (e.g., a susceptor) placed in a processing chamber, and / or obtaining information about the substrate support and its use in the processing chamber, using marking features placed on the substrate support. Accordingly, a visualization system including an imaging device (e.g., camera 200 shown in Figure 1) located inside or outside the processing chamber (e.g., processing chamber 100) but visible through an opening in the chamber may be used to image marking features placed on the substrate support when the substrate support is placed in the chamber.

[0031] As shown in Figure 1, the processing chamber 100 may include a camera 200 for viewing the substrate 108, substrate support 106, and / or a preheating ring (not shown) coupled to the substrate support 106 within the processing chamber 100 during processing. The camera 200 may be positioned above the top of the processing chamber 100, and a collection device for the camera, such as a light pipe, may be positioned through the top of the processing chamber 100 into the processing gas region 156. Alternatively, the camera 200 may be positioned inside the processing chamber 100. For example, the camera 200 may be positioned in an opening 186 in the upper dome 128 between the upper dome 128 and the reflector 122. The camera 200 or a collection device for the camera may be positioned via an inlet for connecting a conduit 126 to the processing chamber 100, or alternatively, the camera 200 may be coupled to the chamber using a chassis. The camera 200 may be operable in a vacuum or at atmospheric pressure. Camera 200 may be located within the processing chamber 100 to image the substrate 108, edge ring, mask, and / or substrate support 106. The position of camera 200 relative to the upper dome 128 and substrate support 106, and the optical characteristics of camera 200, may be determined to ensure a field of view that includes the region of interest on the substrate support 106.

[0032] The camera 200 may be electrically connected to a controller 190 that controls the operation of the camera 200 (e.g., on / off, focusing, and imaging). The controller 190 also includes a central processing unit (CPU) 192, memory 194, and support circuitry 196. The CPU 192 may be any form of general-purpose computer processor that can be used in an industrial setting. The support circuitry 196 is conventionally connected to the CPU 192 and may include a cache, clock circuitry, input / output subsystems, and power supply, etc. When the software routines are executed by the CPU 192, they convert the CPU 192 into a purpose-specific computer (controller) 191. The software routines may also be stored and / or executed by a second controller (not shown) located away from the processing chamber 100.

[0033] Memory 194 can store information for processing and retrieval during the operation of the CPU 192. Memory 194 can store program instructions and / or data associated with various marking features used and corresponding substrate support models, as described according to one or more aspects of this disclosure. The CPU 192 can execute instructions, and one or more storage devices for memory 194 can store instructions and / or data for one or more software routines. Together, the CPU 192 and memory 194 can retrieve, store, and / or execute instructions and / or data for one or more applications or software executed by the controller 190. The controller 190 can image the substrate support 106 and / or coupled preheating ring by downloading a program stored in memory 194 via an input / output (I / O) device (not shown) and controlling the camera 200 according to that program.

[0034] It should be noted that camera 200 is merely one example of a device that can be used for imaging, and any other type of imaging device can be used as a position detection device. In embodiments, it is possible to use more than one camera to take an image of the substrate support 106. In embodiments, camera 200 may be an imaging device that includes a high-efficiency, low-voltage complementary metal oxide semiconductor (CMOS) sensor and can therefore function as a single-chip video camera. The CMOS sensor may be of the VGA type. Camera 200 may include lenses such as wide-angle lenses or plano-convex lenses having appropriate focal lengths to provide sufficient visual clarity within the desired operating range of camera 200. It will be apparent to those skilled in the art that various lenses (e.g., telephoto lenses or rotary prism lenses) can be used for various applications. Furthermore, it will be understood that other types of cameras or optical sensors, including but not limited to SVGA, XGA, MEGA pixel type cameras or other imaging devices, can be used. If desired, multiple imaging devices with different resolutions can be used in combination with lenses of various types and focal lengths. The camera or sensor may be of a static (still image) or dynamic (video) type, and may be of a charged coupled device (CCD) type. Furthermore, the camera may be used to output a video signal to any standard television format.

[0035] In one embodiment, when imaging the substrate support 106, a camera 200 may be used to image a portion of the substrate support 106 within the field of view 193 of the camera 200 (as shown in Figure 3A). For in situ imaging and analysis of the substrate support 106 in the processing chamber 100, the region of interest of the substrate support 106 on which marking features can be placed includes a portion of the substrate support 106 whose upper surface 202 is not obstructed and which is within the field of view of the camera 200 when the substrate support 106 is loaded together with the substrate 108.

[0036] In other embodiments that can be combined with other embodiments described herein, when the substrate support 106 is in a processing position, the substrate support 106 may be coupled to a preheating ring 207 positioned around the outer edge of the substrate support 106 within the processing chamber. To identify and analyze the substrate support 106 and / or the preheating ring 207 coupled thereto, a camera 200 can be used to image portions of the substrate support 106 and / or the preheating ring 207 coupled to the substrate support 106 within the field of view 193 of the camera 200 (shown in Figure 3B). For in-situ imaging and analysis of the substrate support 106 and / or the preheating ring 207 within the processing chamber, a region of interest of the substrate support and preheating ring 207 on which marking features may be placed includes the upper surface 209 of the preheating ring 207 and portions of the substrate support 106 that are not obstructed and are within the field of view of the camera 200 when the substrate support 106 is loaded together with the substrate 108.

[0037] Figure 3C is an exemplary image 300 from a camera 200 positioned to take images of the preheating ring 207, substrate support 106, and substrate 108, which are located within the processing chamber. According to certain aspects of the present disclosure, the image 300 includes identified regions of interest, within which marking features may be located. As shown in Figure 3C, the marking features may be located in a first region of interest 212 on the edge 204 of the substrate support 106, a second region of interest 214 on the rim 206 of the substrate support 106, and / or a third region of interest 216 on the preheating ring 207. When the substrate support 106 is in use within the processing chamber, the substrate 108 is loaded in the pocket 201, so any marking features located on the pocket 201 would be covered by the substrate 108 and therefore likely not visible to the camera 200. Furthermore, depending on how the marking features are formed, the marking features may affect the processing of the substrate 108 when located within the pocket 201. Thus, the identified region of interest on the substrate support 106 includes only the surface of the substrate support 106 on the edges 212 and rims 214 that are open when the substrate support 108 is in use. Furthermore, as shown in Figure 3C, when the substrate support 106 and the preheating ring 207 are positioned in the processing chamber, all marking features located within the first region of interest 212 and / or the second region of interest 214 of the substrate support 106, as well as within the third region of interest 216 on the preheating ring 207, can be imaged by the camera 200.

[0038] In some embodiments, the shape, size, and arrangement of the marking features on the substrate support 106 and / or the preheating ring 207 may cause a variety of areas to be imaged at various positions. In some embodiments, the shape of the imaged areas may vary. For example, the imaged areas may be rectangular, circular, or other shapes.

[0039] Figure 4A shows a top view of one embodiment of a substrate support 106 having an example of a marking feature 402 located within a second region of interest 214 on the rim 206 of the substrate support 106, according to a particular embodiment of this specification. While some examples of this specification describe the application of the marking feature 402 to the substrate support 106, the aspects and embodiments of this disclosure described herein with respect to the marking feature 402 and the substrate support 106 can also be similarly used to apply the marking feature 402 to a preheating ring 207 (if present in the processing chamber).

[0040] When the substrate support 106 is positioned within the processing chamber 100, the substrate support 106 can be rotated around the central shaft 132, so that when the marking feature 402 is rotated within the field of view 193 of the camera 200, a snapshot of the marking feature 402 on the substrate support 106 can be taken by the camera 200. In one embodiment, which can be combined with other embodiments of this specification, the marking feature 402 may be any type of designation that can be positioned or formed on the upper surface 202 of the substrate support 106 and can be detected by the camera 200 for analysis. In one embodiment, which can be combined with other embodiments described herein, the marking feature 402 may be a surface feature formed on the substrate support 106. In another embodiment, the marking feature 402 may be a surface feature etched onto the surface of the substrate support 106. In certain embodiments, the designation of the marking feature 402 may include any numbers, letters, symbols, shapes, or patterns, including, but not limited to, barcodes, numeric codes, alphanumeric codes, QR codes, custom shapes, patterns of shapes, patterns of symbols, sequences of letters, and special characters.

[0041] As described above, each marking feature 402 placed on the substrate support 106 and the preheating ring 207 may correspond to a specific model (or design) of several different substrate support and preheating rings. Data associated with each marking feature 402 used to identify each of the multiple corresponding substrate support models may be stored in memory 194 for retrieval and acquisition by the controller 190. After a specific marking feature 402 of the substrate support 106 is imaged, the marking feature is analyzed and used to identify the model of the corresponding substrate support or preheating ring on which the imaged marking is located.

[0042] Figure 4B shows a cross-sectional view of the substrate support 106 of Figure 4A along the cutting line 4B-4B. In certain embodiments, the marking feature 402 may extend from the upper surface 202 of the substrate support 106 and be located on a first region of interest 212 and / or a second region of interest 214. The marking feature 402 may be dimensioned and formed with sufficient thickness to be detected and imaged by the camera 200 from the upper surface around the substrate support 106. Alternatively, the marking feature 402 may be located on the substrate support 106 and formed with a surface roughness different from that of the upper surface 202 of the substrate support 106, so that the camera 200 can distinguish and detect the marking feature 402 for analysis.

[0043] The marking feature 402 may be formed from a material suitable for the processing environment, such as silicon carbide (SiC) or SiC-coated graphite. The marking feature 402 may be formed on the substrate support 106 in any suitable manner, for example, by casting onto the substrate support 106, embossing onto the substrate support 106, machining onto the substrate support 106, depositing onto the substrate support 106, or roughening or treating the upper surface 202 of the substrate support 106. For example, the feature 402 may be conformally deposited on the surface 202 of the substrate support 106 using a mask by a physical vapor deposition (PVD) process or other similar conformal deposition process. By conformally depositing the feature 402, the marking feature 402 can maintain a surface roughness similar to the surface roughness of the rest of the upper surface 202. By matching the surface roughness of the remaining portion of the top surface 202 with the surface roughness of feature 402, the marking feature 402 can be used to monitor the use of the substrate support 106 and to serve as an indicator of a time when the substrate support 106 may be nearing the end of its lifespan, as further described below.

[0044] The imaging and analysis of the marking features 402 on the substrate support 106 by the camera 200 inside the processing chamber 100 can be used to identify the specific design and model of the substrate support 106 loaded into the processing chamber 100, without the need to remove the substrate support 106 from the processing chamber 100.

[0045] Because the substrate support and preheating ring for the processing chamber can vary in design depending on the specific installation location, manufacturing recipe, and / or substrate handling protocol required, the ability to automatically identify the model and design of the substrate support and / or preheating ring loaded into the processing chamber without requiring manual intervention improves the efficiency and optimization of the setup and use of the substrate support 106 and preheating ring 207 (if present), and enables the corresponding setup and optimization of the relevant parameters of the processing chamber in which the imaged substrate support and / or preheating ring are located. By identifying and confirming the specific corresponding model and design of the substrate support 106 and preheating ring 207 installed in the processing chamber 100 to be used, the user can check and confirm the appropriate substrate handling protocol and the corresponding optimal setup for the processing chamber 100 based on the hardware of the installed substrate support 106 and preheating ring 207 being used.

[0046] For example, a corresponding manufacturing recipe for a substrate support, including various surface features and / or designs, may be subjected to various pressures and / or temperature ramping rates during processing. By identifying and verifying the specific corresponding model and design of the substrate support 106, the user can check and verify that the manufacturing recipe being adopted is appropriate and that the pressure and / or temperature ramping rate is appropriately limited. In another example, various substrate support designs may include various pocket sizes for accommodating and holding the substrate 108. By identifying and verifying the specific corresponding model and design of the substrate support 106, the user can check and verify any substrate handling corrections that may be necessary to maintain substrate handling within the pockets of the substrate support 106 being used.

[0047] In other embodiments, identifying and verifying the specific corresponding model and design of the substrate support 106 and / or preheating ring 207 (if present) installed within the processing chamber 100 can advantageously assist in tracking and verifying that the installation position of the susceptor support 106 and / or preheating ring 207 within the processing chamber 100 is correct and appropriate. The substrate support is typically mounted on multiple pins within the processing chamber 100, balanced, and can be installed at multiple different angles. Conventionally, installation of the substrate support requires the user to manually track and install the substrate support, where a predetermined portion of the substrate support is positioned relative to a predetermined portion of the processing chamber. For example, a conventional instruction for installing a substrate support may include manually positioning a logo or mark on the substrate support near a portion of the processing chamber 100, such as near the processing gas inlet 174 or gas outlet 178.

[0048] However, by placing a marking feature 402 on the upper surface 202 of the substrate support 106 in a position visible to the camera 200, and using the marking feature 402 to identify a specific model and design of the imaged substrate support 106, the known position of the marking feature 402 on the substrate support 106 (by identification of the substrate support 106) and the imaged position of the marking feature 402 relative to the installation position of the substrate support 106 in the processing chamber 100 can be advantageously used to track, verify, and correspondingly (if necessary) correct the installation position of the substrate support 106, and it can be ensured that the installation position of the substrate support 106 used is appropriate and optimal based on the imaged and identified specific substrate support 106.

[0049] In other embodiments, as described above, the substrate support 106 located within the processing chamber 100 can be moved vertically by an actuator during processing, thereby changing the imaging size of the substrate support 106 accordingly based on the changed distance between the substrate support 106 and the camera 200 (assuming that settings such as "zoom" on the camera 200 are kept constant). In certain embodiments that can be combined with other embodiments described herein, marking features 402 located on the substrate support 106 may be used to provide visible reference measurement points used when the substrate support 106 is imaged, in order to provide direct scaling at the substrate support level.

[0050] Figure 5 shows a partial top view of one embodiment of a substrate support 106 formed by placing a marking feature 502 on the rim 206 of the substrate support 106 within a second region of interest 214, according to a particular embodiment of this specification. While some examples of this specification describe the application of the marking feature 502 to the substrate support 106, the aspects and embodiments of this disclosure described herein with respect to the marking feature 502 and the substrate support 106 can also be similarly used to apply the marking feature 502 to a preheating ring 207 (if present in the processing chamber).

[0051] In one embodiment, which can be combined with other embodiments of this specification, a marking feature 502 positioned on the upper surface 202 of the substrate support 106 may include one or more shapes or symbols formed with dimensions 504 having a predetermined size, making it possible to use the marking feature 502 as a measuring scale. In order to enable the dimensions 502 of the image of the marking feature 502 to be captured by the camera 200 and used as a scale for each image, the portion of the marking feature 502 that forms the dimensions 5024 also needs to extend along an XY plane parallel to the upper surface 202 of the substrate support 106. For example, in one embodiment, the marking feature 502 may be formed as a rectangle with a width 504 of "W". When the substrate support 106, which includes the marking feature 502, is imaged by the camera 200, the imaged size of the feature 502 and the corresponding known size W of the dimension 504 can be used as a scale for calculating the correlation between the size (in pixels) of the components in the imaged image and the actual size of the components being imaged, for example, the substrate support 106 and / or the substrate 108 placed on the substrate support 106. The imaged and used marking feature 502 on the substrate support 106 to provide a measurement scale can be advantageously used during image analysis to assist in correcting image distortion in each image and to perform measurements of the imaged components.

[0052] In another embodiment, the marking feature 502 may be used to automatically detect the rotation angle of the substrate support 106 via image analysis, based on the known home zero angle position of the substrate support 106. Identification of the substrate support 106 allows for the acquisition of the relative position of the marking feature 402 on the substrate support 106 when the substrate support 106 is at the home zero angle position, which can be used as a reference point. By placing the marking feature 402 on the upper surface 202 of the substrate support 106 in a position visible to the camera 200, and comparing the imaged position of the marking feature 402 on the substrate support 106 with the known position of the marking feature 402 when the substrate support 106 is at the home zero angle position, imaging of the substrate support 106 can be advantageously used to detect and determine the rotation angle at which the substrate support 106 was imaged, and to support further imaging measurement and analysis operations.

[0053] In yet another embodiment, the marking feature 502 can also be advantageously used to track the positioning of the substrate support 106 with respect to the position of the substrate 108 on the substrate support 106 or the position of the substrate 108 loaded into the processing chamber 100. By imaging the position of the marking feature 502 relative to the loaded substrate support 106 before processing, the relative position of the substrate 108 and any corresponding changes or movements can be automatically tracked through the imaging. Such tracking of the substrate support 106 relative to the substrate 108 allows the user to more easily narrow down and identify the source of any problems that may occur during processing. For example, if a problem occurs during processing, without the ability to track the change in the relative positioning of the substrate 108 on the substrate support 106 at the time the problem occurred, it may be difficult to determine whether the processing problem was caused by the processing itself or by the substrate support 106. Furthermore, by providing a reference point for the relative positioning of the substrate 108 with respect to the substrate support 106 before processing, imaging can be used to determine the angle of the substrate support 106 that may have contributed to the processing problem.

[0054] As described above, repeated use of the substrate support 106 in the processing chamber 100 over time may cause the SiC in the substrate support 106 to deteriorate. Specifically, changes in the surface emissivity of the SiC in the substrate support 106 were observed during the lifespan of the substrate support 106. In certain processes, it was found that the SiC on the upper surface 202 of the substrate support 106 was etched during processing, which caused changes in the surface roughness and surface emissivity of the SiC on the surface of the substrate support 106. Etching of the SiC in the substrate support 106 and the deterioration of said SiC will ultimately affect the performance of the substrate support 106 and may cause the substrate support 106 to fail. Therefore, the lifespan of the substrate support 106 can be defined by the point at which the deterioration of the SiC on the outer surface of the substrate support 106 and the change in the surface emissivity of said SiC begin to affect the reliability and performance of the substrate support 106.

[0055] Figure 6A shows a partial top view of one embodiment of a substrate support 106 formed by placing an example of a marking feature 602 within a second region of interest 214 on the rim 206 of the substrate support 106, according to a particular embodiment of this specification. While some examples of this specification describe the application of the marking feature 602 to the substrate support 106, the aspects and embodiments of this disclosure described herein with respect to the marking feature 602 and the substrate support 106 can also be used to apply the marking feature 602 to a preheating ring 207 (if present in a processing chamber) to track the life of the preheating ring 207 via imaging.

[0056] To track the lifetime of the substrate support 106 using imaging, a marking feature 602 formed on the substrate support 1106 may be used to provide the user with an estimate of the remaining lifetime of the substrate support 106 on which the marking feature 602 is located. The marking feature 602 may be located on the top surface 202 of the substrate support 106 in any one of the regions of interest 212, 214 described herein. The marking feature 602 may be formed as a plurality of raised structural features, each of which extends from the top surface 202 at a different height. The marking feature 602 may be formed in any shape or size detectable by the camera 200. In the example shown in Figures 6A and 6B, the marking feature 602 is formed as three rectangular prisms extending from the top surface 212 of the substrate support 106. In an alternative embodiment, the marking feature 602 may be formed to include any number of features.

[0057] In one embodiment, which can be combined with other embodiments described herein, the marking feature 602 may include a first feature 604 having a first height 606, a second feature 608 having a second height 610 greater than the first height 606, and a third feature 612 having a third height 614 greater than the second height 610. In one embodiment, which can be combined with other embodiments described herein, the marking feature 602 may be formed as an inverted recess.

[0058] Each of the first feature 604, the second feature 608, and the third feature 612 of the marking feature 602 can be formed in the same manner as the substrate support 106, so that the original surface roughness and emissivity of the marking feature 602 are substantially the same as the original surface roughness and emissivity of the top surface 202. In certain embodiments, the marking feature 602 can be formed by depositing a graphite core on the top surface 202 by depositing SiC on the top surface 202 via a deposition process and coating the graphite core with SiC, or by etching the top surface 202 within the substrate support 106 to form a graphite core and coating the graphite core with SiC. By forming the marking feature 602 in the same manner as the substrate support 106 or in the same manner as the substrate support 106, the marking feature 602 can be etched in the same or similar manner as the substrate support 106 during processing. The etching of the SiC coating on the substrate support 106 and the changes in the surface roughness of the SiC coating can be imaged by the camera 200 and analyzed to monitor the lifespan of the substrate support 106 and to provide corresponding indicators for the period when the end of the substrate support 106's lifespan is approaching.

[0059] The lifespan of the substrate support 106 can be monitored by analyzing and tracking changes in the image of the marking features 602 obtained over time while the substrate support 106 is in use. As the marking features 602 are etched in each processing cycle of the substrate support 106, the heights of the first feature 604, the second feature 608, and the third feature 612 are gradually lost as the features 604, 608, and 612 become flatter with the top surface 202 of the substrate support 106. As the height of the marking features 602 is lost over time, the images of each feature 604, 608, and 612 of the marking features 602 obtained by the camera 200 will also change accordingly. In this case, the detection of such changes in the images of each feature 604, 608, and 612 by the camera 200 can serve as indicators of the degree of use performed on each substrate support 106 up to that point, and therefore the degree of SiC degradation. Knowing the degree of etching and degradation of the SiC can be translated into an estimate of the remaining lifespan of the imaged substrate support 106. The marking feature 602 can be formed with any number of features. The marking feature 602 can be formed with only one feature to provide a single indicator of the time nearing the end of the lifespan of the substrate support 106. Accordingly, the number of features in the marking feature 602 and the height of each feature can be adjusted and adapted accordingly to provide more or less indicators of the remaining lifespan of the substrate support 106.

[0060] In one embodiment, which can be combined with other embodiments of this specification, the height variations of the first feature 604, the second feature 608, and the third feature 612 of the marking feature 602 may be formed in correlation with the total amount of SiC etching that typically occurs at various stages throughout the lifetime of the substrate support 106. In one embodiment, the first feature 604, the second feature 608, and the third feature 612 may each be formed as indicators of the substrate support 106 at which approximately one-third of its lifetime has elapsed. The marking feature 602 may be formed such that when the substrate support 106 is new, the images of the first feature 604, the second feature 608, and the third feature 612 are initially all visible and clearly visible. While the substrate support 106 is in use, all of the features 604, 608, and 612 will be etched simultaneously along with the rest of the substrate support 106. The first height 606 of the first feature 604 can be sized such that it is sufficiently etched only after approximately one-third of the typical lifespan of the substrate support 106 has elapsed, thereby causing a corresponding change in its image detected by the camera 200. The change in the image of the first feature 604 includes the image of the first feature 604 becoming blurred and / or the first feature 604 no longer being visible to the camera 200. The larger second height 610 and third height 614 compared to the first feature 604 allow the second feature 608 and third feature 612 to undergo more etching, and therefore there is no change in the images of the second feature 608 and third feature 612.

[0061] The third feature 612 can be formed with a third height 614, which corresponds to the height of the total SiC etching that typically occurs on the upper surface 202 of the substrate support 106 before failure. The third height 614 can be formed such that, after an amount of processing and etching of the substrate support 106 corresponding to the approximate typical lifespan of the substrate support has occurred, the image of the resulting third feature 612 will also change, becoming blurred and / or no longer visible to the camera 200. When such a change in the image of the third feature 612 is captured and detected by the camera 200, an indicator can be provided to the user that the captured substrate support 106 is nearing the end of its lifespan and should therefore be replaced. Imaging and analysis to check the marking feature 602 for an indicator of the remaining lifespan of the substrate support 106 can be automatically utilized before each use of the substrate support 106 to minimize the possibility of the substrate support 106 failing during use.

[0062] In other embodiments, the third feature 612 may be formed with a third height 614 that corresponds to a slightly smaller amount than the total SiC etching typically occurring in the substrate support before failure. By forming the third height 614 to be slightly less than the typical total etching amount before failure, the third feature 612 can function as an early warning indicator that the imaged substrate support 106 is nearing the end of its life and should be replaced. Furthermore, having a slightly earlier warning indicator to replace the substrate support 106 before failure can also minimize the possibility that the substrate support 106 will actually fail during processing use (and thereby ruin the part being manufactured) before the indicator from the third feature 612 is detected and the substrate support 106 is replaced.

[0063] The second height 610 of the second feature 608 may be formed to be approximately twice the height 606 of the first feature. When changes in the image of the second feature 608 after use are correspondingly captured and detected by the camera 200, the user may be provided with an indicator that approximately two-thirds of the lifespan of the captured substrate support 106 has been used (or approximately one-third of the lifespan remains).

[0064] In summary, embodiments of the prior disclosure described herein provide apparatus and methods for identifying substrate supports and preheating rings placed in a processing chamber via imaging and for obtaining information about the imaged substrate supports and preheating rings in the processing chamber. The method and apparatus for identifying substrate supports and preheating rings broadly include placing marking features on the upper surfaces of the substrate supports and preheating rings, and when the substrate supports and preheating rings are placed in a processing chamber, imaging the marking features to identify a specific model of the substrate supports and preheating rings placed in the processing chamber. Each marking feature placed on a substrate support corresponds to a specific model (or design) of a plurality of different substrate supports. Similarly, each marking feature placed on a preheating ring corresponds to a specific model (or design) of a plurality of different preheating rings. When a specific marking feature on a substrate support is imaged, the marking feature is analyzed and then used to identify the model of the respective substrate support or preheating ring on which the imaged marking is placed. Marking features may also be placed on the substrate support and / or preheating ring to provide information regarding imaging of the substrate support, preheating ring, and / or the substrate support and preheating ring. Information that may be provided through imaging of marking features on the substrate support or preheating ring may include, but is not limited to, information regarding reference measurements for direct scaling at the level of the substrate support / preheating ring used in imaging of the substrate support or preheating ring in the processing chamber, reference points for detecting and determining the rotation angle by the substrate support in the processing chamber, reference points for detecting and tracking the installation position of the substrate support or preheating ring in the processing chamber, and / or an indication of a time when the end of life of the substrate support and / or preheating ring may be approaching.

[0065] While embodiments of this disclosure have been described above with reference to specific embodiments, numerous specific details are provided to offer a more complete understanding of the invention. However, those skilled in the art will see that various modifications and changes can be made without departing from the broad spirit and scope of the invention. Accordingly, the descriptions and drawings in the prior specification are to be considered illustrative rather than limiting.

[0066] The foregoing description applies to embodiments of the present invention, but other embodiments and further embodiments of the present invention may be devised without departing from the basic scope of the present invention, and the scope of the present invention is defined by the following claims.

Claims

1. A substrate support, A top surface configured to house the substrate within the processing chamber, A marking feature disposed on the upper surface of the substrate support, wherein when the substrate support is placed in the processing chamber, the marking feature is detectable by an imaging device connected to the processing chamber and is configured to provide information about the substrate support via imaging, A substrate support equipped with the following features.

2. The substrate support according to claim 1, wherein the marking feature disposed on the substrate support corresponds to one of the multiple models of the substrate support for the purpose of identifying multiple models of the substrate support via imaging.

3. The substrate support according to claim 1, wherein the upper surface of the substrate support includes a rim adjacent to a pocket configured to accommodate the substrate, and the marking feature is located on the rim of the substrate support.

4. The substrate support according to claim 1, wherein the marking feature includes a known dimension extending along the upper surface of the substrate support, the known dimension providing a direct scaling to the substrate support for imaging the substrate support when the marking feature is imaged.

5. The substrate support according to claim 1, wherein the marking feature is configured to provide a reference point for determining the rotation angle of the substrate support via imaging.

6. The substrate support according to claim 1, wherein the marking feature includes, but is not limited to, a symbol, shape, or pattern, a barcode, numeric code, alphanumeric code, QR code, custom shape, pattern of shape, symbol, and special character.

7. The substrate support according to claim 1, wherein the marking feature is configured to provide a reference point for tracking the installation position of the substrate support within the processing chamber via imaging.

8. A substrate support, A top surface configured to house the substrate within the processing chamber, A marking feature disposed on the upper surface of the substrate support, comprising a height extending from the upper surface of the substrate support and an outer surface containing silicon carbide (SiC), wherein when the substrate support is placed in the processing chamber, the marking feature is configured to be detectable by an imaging device connected to the processing chamber.

9. The substrate support according to claim 8, wherein the marking feature is disposed on the substrate support by depositing SiC on the upper surface of the substrate support.

10. The substrate support according to claim 8, wherein the marking feature is disposed on the substrate support by etching a graphite core on the upper surface of the substrate support and coating the outer surface of the graphite core with SiC or polishing the outer surface.

11. The substrate support according to claim 8, wherein the upper surface of the substrate support includes a rim configured to accommodate the substrate and adjacent to a pocket, and the marking feature is located on the rim of the substrate support.

12. The substrate support according to claim 8, wherein the marking feature is configured to provide an indication of the remaining lifespan of the substrate support via imaging.

13. The substrate support according to claim 8, wherein the change in the height of the marking feature provides an indication of the remaining lifespan of the substrate support when the change in the marking feature is detected by the imaging device.

14. A processing system configured to analyze a substrate support placed in a processing chamber, A processing chamber having a processing space, Connected to the processing chamber is an imaging device having a field of view, A controller connected to the imaging device, comprising a processor and a memory, wherein the memory includes a software program configured to perform operations to image the substrate support located in the processing space of the processing chamber and to acquire information about the substrate support when the substrate support is within the field of view of the imaging device, Equipped with, A processing system comprising a substrate support comprising an upper surface configured to accommodate a substrate in the processing chamber and a marking feature disposed on the upper surface of the substrate support, wherein the marking feature is detectable by the imaging device when the substrate support is placed in the processing chamber and is configured to provide information about the substrate support via imaging.

15. The system according to claim 14, wherein the marking feature disposed on the substrate support corresponds to one of the multiple models of the substrate support for the purpose of identifying multiple models of the substrate support via imaging.

16. The substrate support according to claim 14, wherein the upper surface of the substrate support includes a rim configured to accommodate the substrate and adjacent to a pocket, and the marking feature is located on the rim of the substrate support.

17. The substrate support according to claim 14, wherein the marking feature includes a known dimension extending along the upper surface of the substrate support, and the known dimension provides a direct scaling to the substrate support for imaging the substrate support when the marking feature is imaged.

18. The substrate support according to claim 14, wherein the marking feature is configured to provide a reference point for determining the rotation angle of the substrate support via imaging.

19. The substrate support according to claim 14, wherein the marking feature is configured to provide an indication of the remaining lifespan of the substrate support via imaging.

20. The substrate support according to claim 14, wherein the marking feature is configured to provide a reference point for tracking the installation position of the substrate support.

Images