Electric drive module with motor assembly having inverter including liquid-cooled snubber

Abstract

An electric drive module having an electric motor and an inverter. The inverter includes a plurality of power semiconductor assemblies with heat sinks and a liquid-cooled snubber.

Description

Technical Field

[0001] The present disclosure relates to an electric drive module having a motor assembly including an inverter cooled by a liquid coolant.

Background Art

[0002] An electric drive module may include an electric motor, a battery that supplies current to the electric motor, and power electronics that can adjust and control the supply of current to the electric motor. The electric drive module can be used in a vehicle for propelling at least a part of the vehicle. It can be useful to increase the operating efficiency of the power electronics used with the electric drive module.

Summary of the Invention

[0003] This section provides an overview of the present disclosure and does not comprehensively disclose its full scope or all of its features.

[0004] In one embodiment, the present disclosure provides an electric drive module comprising a housing assembly, an electric motor, and an inverter. The electric motor is housed in the housing assembly and comprises a stator and a rotor rotatable around a rotation axis relative to the stator. The stator comprises a plurality of sets of field windings and a plurality of sets of phase leads. Each of the phase leads is electrically coupled to a corresponding set of the windings. The inverter comprises a retaining member, an end plate, a plurality of first and second busbars, a circuit board assembly, a plurality of power semiconductor devices, one or more first heat sinks, and one or more snubbers. The retaining member is received between the housing assembly and the respective axial ends of the sets of field windings. The end plate is fixed to and sealed with respect to the retaining member. The first and second busbars, and the circuit board assembly, are received within the retaining member on the first side of the end plate. Each of the power semiconductor devices comprises a plurality of device terminals and power terminals. One of the device terminals of each of the power semiconductor devices is electrically coupled to the second busbar. The power terminal is electrically coupled to the first busbar and to one of the device terminals is a second device terminal. The power semiconductor device is disposed within the retaining member, thereby positioning the power terminal on the second side of the end plate opposite to the first side. The device terminal of the power semiconductor device extends through the end plate and is electrically coupled to the circuit board assembly. The power terminal of each of the power semiconductor devices is attached to one or more first heatsinks, each of which has a plurality of first fins positioned in a first region adjacent to the axial end of the set of field windings. An inlet port is formed through the end plate, and the inlet port is configured to receive a liquid cooling fluid through it. The snubber has a plurality of snubber circuit elements and a plurality of second heatsinks.Each of the snubber circuit elements has a resistor and a capacitor and is electrically coupled to the first and second busbars. Each of the second heatsinks is mechanically and thermally coupled to at least one of the relevant snubber circuit elements. Each of the second heatsinks has a plurality of second fins located in a second region adjacent to the axial end of the set of field windings. The inlet port is fluidically coupled to the first region and the second region.

[0005] Further scope of application will become apparent from the description herein. The descriptions and specific examples in this summary are for illustrative purposes only and are not intended to limit the scope of this disclosure. [Brief explanation of the drawing]

[0006] The drawings described herein are for illustrative purposes only and do not illustrate all possible embodiments, nor are they intended to limit the scope of this disclosure.

[0007] [Figure 1] Figure 1 is a cross-sectional view of an exemplary electric drive module configured according to the teachings of this disclosure.

[0008] [Figure 2] Figure 2 is a cross-sectional view of a portion of the electric drive module shown in Figure 1, illustrating the motor assembly and inverter in more detail.

[0009] [Figure 3] Figure 3 is an enlarged portion of Figure 2.

[0010] [Figure 4] Figure 4 is an exploded perspective view of a portion of the electric drive module shown in Figure 1, showing the motor assembly and part of the inverter in more detail.

[0011] [Figure 5]Figure 5 is a perspective view of a part of the inverter, showing the power semiconductor with a heat sink in more detail.

[0012] [Figure 6] Figure 6 is an enlarged part of Figure 4, showing the positive bus bar, the ground bus bar, and the plurality of phase bus bars in more detail.

[0013] [Figure 7] Figure 7 is a perspective view of a part of the inverter, showing the snubber.

[0014] [Figure 8] Figure 8 is a top perspective view of the snubber.

[0015] [Figure 9] Figure 9 is a schematic diagram showing a part of the snubber electrically coupled to the positive bus bar and the ground bus bar.

[0016] [Figure 10] Figure 10 is a perspective view of a part of the snubber, showing the snubber circuit elements in more detail.

[0017] [Figure 11] Figure 11 is a bottom perspective view of the snubber.

[0018] [Figure 12] Figure 12 is a cross-sectional view of a part of the snubber with a part cut away to show the cooling chamber inside the snubber.

[0019] [Figure 13] Figure 13 is a perspective view of a part of the inverter, showing the chamber outlet inside the snubber formed by the snubber housing.

[0020] [Figure 14] Figure 14 is a cross-sectional view of a part of the inverter and the motor assembly, showing the cooling channel in fluid communication with the annular plenum 252.

[0021] [Figure 15] FIG. 15 is a cross-sectional view similar to FIG. 14, but shows an alternative configuration in which a portion of the cooling channels is employed to direct the cooling fluid outside the snubber.

[0022] [Figure 16] FIG. 16 is an inverter of an alternative configuration, in which the snubber elements are circumferentially arranged between the power semiconductors with heat sinks.

[0023] Throughout the drawings, corresponding reference numerals indicate corresponding parts.

MODE FOR CARRYING OUT THE INVENTION

[0024] Referring to FIG. 1, an exemplary electric drive module constructed in accordance with the teachings of the present disclosure is schematically indicated by reference numeral 10. The electric drive module 10 generally may include a housing assembly 12, a motor assembly 14, a transmission 16, one or more output members 20, and optionally a differential assembly 22. The motor assembly 14 may include an electric motor 30 and a motor controller 32 that includes an inverter 36. In this example, the electric drive module 10 is configured similarly to that disclosed in U.S. Patent Application Publication No. 2022 / 0393522, except as described herein.

[0025] Referring to Figure 2, the electric motor 30 includes a stator assembly 40 and a rotor assembly 42. The stator assembly 40 may have a stator body 50, multiple sets of field windings 52, and multiple phase leads 54. The stator body 50 is fixedly coupled to the housing assembly 12 and defines multiple stator body cooling channels 60 extending longitudinally through the stator body 50. In the illustrated example, each of the stator body cooling channels 60 extends linearly through the stator body 50 between its axial ends, but it will be understood that the stator body cooling channels 60 may be configured differently (for example, to extend spirally around the stator body 50, and / or to enter and / or exit the stator body 50 in a manner different from that shown). Each set of field windings 52 is wound around the stator body 50 such that each axial end of the field winding 52 extends from the corresponding axial end of the stator body 50. The cap 64 can be coupled to the set of field windings 52 and can cover or enclose the wires forming the set of field windings 52. The cap 64 is made of an electrically insulating material but also has relatively good thermal conductivity. Optionally, the cap 64 may be an encapsulating material molded onto the wires of the set of field windings 52.

[0026] The rotor assembly 42 is housed within a rotor bore formed in the stator assembly 40 and includes a rotor body 70 and a motor output shaft 72. The rotor assembly 42 is rotatable around the motor shaft 76 relative to the stator assembly 40. Each of the phase leads 54 is mechanically and electrically coupled to a corresponding one of the set of field windings 52. Optionally, the phase leads 54 may be encapsulated within a cap 64 that covers or coats the wires forming the set of field windings 52. In the presented example, the phase leads 54 are partially encapsulated within an encapsulating material forming the cap 64.

[0027] Referring to Figures 3 and 4, the inverter 36 of the motor controller 32 (Figure 1) comprises an inverter mount 80, a plurality of power semiconductors 82, a plurality of busbars (i.e., a positive busbar 90, a ground busbar 92, and a plurality of phase busbars 94a, 94b, and 94c), a plurality of insulating layers (not specifically shown), an inverter circuit board 98, and a snubber 100. The inverter 36 controls the amplitude and frequency of the power supplied to the electric motor 30. More specifically, the inverter 36 employs power semiconductors 82 (which may be, for example, MOSFETs, IGBTs, or JFETs) to control the switching of DC electricity (supplied via the positive busbar 90), thereby generating three AC electrical outputs. Here, each of the AC power outputs is supplied to a predetermined one of the phase busbars 94a, 94b, and 94c (to supply power to each of the sets of field windings 52).

[0028] The inverter mount 80 may include a base or end plate 110, a plurality of phase lead receptacles 112, a first side wall 114, and a second side wall 116. The end plate 110 may have an annular shape with a first axial side and a second axial side. The end plate 110 may define a plurality of semiconductor mounts (not specifically shown) that can be formed on the radially outer portion of the first axial side of the end plate 110. Each of the semiconductor mounts may define a plurality of semiconductor terminal openings extending through the end plate 110. The semiconductor mounts may be arranged in any desired configuration, but in the presented example, the semiconductor mounts are arranged in a ring shape around the outer circumference of the end plate 110. The semiconductor mounts may optionally include one or more partitions 118 (Figure 7), which may be used to separate and electrically insulate adjacent power semiconductors 82 from each other. Each of the phase lead receptacles 112 defines an opening formed through the end plate 110 and may have a first portion located in the center of the end plate 110 and extending axially away from the first axial side of the end plate 110, and a second portion extending axially away from the second axial side of the end plate 110. In the illustrated example, each of the phase lead receptacles 112 is a substantially tubular structure located in the center of the end plate 110. The phase lead receptacles 112 may be arranged circumferentially apart from each other. The first and second side walls 114 and 116 may be fixedly connected to the end plate 110 and may surround the outer and inner circumferences of the end plate 110, respectively. The first side wall 114 may extend a first distance from the first axial side of the end plate 110 and a second relatively short distance from the second axial side of the end plate 110. The second side wall 116 may extend a third distance from the first axial side of the end plate 110, which may be relatively longer than the first distance. The first sealing groove 120 may be formed around the first side wall 114 and may be configured to receive a first sealant 122 that seals the first side wall 114 and the housing assembly 12. The second sealing groove 124 may be formed around the second side wall 116 and may be configured to receive a second sealant 126 that seals the second side wall 116 and the cap 64.

[0029] Referring to Figure 5, each power semiconductor 82 has a plurality of first pins or terminals 130 and a power terminal 132 electrically coupled to one of the first terminals 130 (e.g., first terminal 130a in the illustrated example). The power terminal 132 is fixedly and electrically coupled to each first heatsink 140, thereby forming a power semiconductor assembly 142 with a heatsink. The first heatsink 140 may be made of a suitable thermally conductive material and may be electrically coupled to one of the associated first terminals 130. In non-limiting examples, the first heatsink 140 may be made of a metallic material such as aluminum, brass, bronze, or copper. The first heatsink 140 may define a plurality of first fins 146, which may be used to dissipate heat into a fluid flow passing through the first fins 146.

[0030] Returning to Figure 3, each of the heatsink-equipped power semiconductor assemblies 142 can be mounted on a corresponding semiconductor mount on the inverter mount 80 such that each power semiconductor 82 is received in a corresponding power semiconductor recess of the end plate 110, and the first terminals 130 on each power semiconductor 82 are received through the semiconductor terminal openings of the end plate 110. In a configuration as shown, the power semiconductors 82 are positioned radially outward from the set of field windings 52.

[0031] Referring to Figures 3 and 4, the positive busbar 90, the ground busbar 92, the phase busbars, and the insulating layer are laminated to form a busbar assembly in which an insulating layer is placed between the positive busbar 90 and the ground busbar 92, and insulating layers are also placed between the ground busbar 92 and each of the phase busbars 94a, 94b, and 94c. The insulating layer is made of an electrically insulating material and electrically insulates adjacent busbars in the axial direction from each other.

[0032] Referring to Figure 6, each of the positive busbar 90 and the ground busbar 92, as well as each of the phase busbars 94a, 94b, and 94c, includes first busbar portions 150a, 150b, 150c and second busbar portions 152a, 152b, 152c, which are fixed to each other and electrically coupled. Since each of the second busbar portions 152a, 152b, and 152c may have a structure substantially similar to the corresponding first busbar portions 150a, 150b, and 150c, this specification will describe in detail only the first busbar portions 150a, 150b, and 150c. Each of the first busbar portions 150a, 150b, and 150c may be formed from a conductive material such as copper, and each may include a body and a set of fingers 160a, 160b, and 160c.

[0033] The bodies of the positive busbar 90a and the ground busbar 92b may have an annular shape, and the bodies of the phase busbars 94a, 94b, and 94c may be formed as annular segments. These bodies are received on the second side wall 116 (Figure 3) of the inverter mount 80 (Figure 3) and within the first side wall 114 (Figure 3) of the inverter mount 80 (Figure 3), and are sized to abut against the end plate 110 (Figure 3). The outer circumference of these bodies may be positioned radially inward from the semiconductor terminal opening of the inverter mount 80 (Figure 3).

[0034] Referring to Figures 2-4, the bodies of the positive busbar 90 and the ground busbar 92b are defined by a central opening 180 (Figure 6), a plurality of terminal openings 182 (Figure 6), and a cooling standpipe opening 184 (Figure 6), each of which is formed through the body. The terminal openings 182 can be received on the phase lead wire receptacle 112, and the cooling standpipe opening 184 can be received on a cooling standpipe 190 which is integrally formed with the inverter mount 80. The cooling standpipe 190 is configured to guide coolant through the inverter mount 80 to a coolant chamber 196 located between the inverter mount 80 and the cap 64. Heat from the power semiconductor assembly 142 with heatsink and the field winding 52 set can be transferred to the coolant in the coolant chamber 196, thereby cooling the inverter 36 and the electric motor 30. Each of the phase busbars 94a, 94b, and 94c can be mechanically and electrically coupled to the corresponding phase lead wire 54.

[0035] Each set of fingers 160a, 160b, and 160c comprises multiple fingers configured to mechanically and electrically couple one of the first terminals 130 on a corresponding power semiconductor 82 to one of the positive busbar 90, the ground busbar 92, and the phase busbars 94a, 94b, and 94c. For example, the tips of the fingers in each set of fingers 160a, 160b, and 160c may be fixedly and electrically coupled to the first terminal 130 by resistance welding or resistance soldering.

[0036] Referring to Figures 3 and 6, the positive busbar 90 can be received within the first side wall 114 of the inverter mount 80 such that the positive busbar 90 abuts against the second side surface of the end plate 110, and each adjacent pair of fingers from the set of fingers 160a engages with the first of the first terminals 130 on each of the power semiconductors 82. The first electrical insulating member can be placed on the positive busbar 90. The ground busbar 92 can be received within the first side wall 114 of the inverter mount 80 such that the ground busbar 92 abuts against the side surface of the first electrical insulating member opposite to the positive busbar 90, and each adjacent pair of fingers from the set of fingers 160b engages with the second of the first terminals 130 on each of the power semiconductors 82. The second electrical insulating member can be placed on the ground busbar 92. Each of the phase busbars 94a, 94b, and 94c may be positioned within the first side wall 114 and may contact the second insulator on the side opposite to the ground busbar 92 of the second insulator, and each pair of adjacent fingers of the set of fingers 160c may engage with the third or fourth of the first terminals 130 on each of the power semiconductors 82. Each of the positive busbar 90, the ground busbar 92, and the phase busbars 94a, 94b, and 94c may be oriented with respect to the inverter mount 80 such that the phase lead receptacles 112 are received through each of the terminal openings 182 and the cooling standpipe openings 184 are received on the cooling standpipe end plates 110.

[0037] The first terminal 130 of the power semiconductor 82 is received within the inverter circuit board 98 and can be electrically coupled to other components of the inverter circuit board 98 in a desired manner. The phase leads 54 are received within the terminal receptacle end plates 110, and a sealing material (not shown) placed in a sealing groove (not shown) in each of the phase leads 54 forms a corresponding seal between the phase leads 54 and the inverter mount 80, the seal preventing fluid flow. Threaded fasteners 180 may be used to secure each of the phase busbars 94a, 94b, and 94c to the corresponding phase leads 54.

[0038] Referring to Figures 7 to 10, the snubber 100 includes a plurality of snubber circuit elements 200, a plurality of second heat sinks 202, and optionally one or more snubber mounts 204 on which snubber circuit elements 200 can be mounted. Each snubber circuit element 200 has a resistor 210 and a capacitor 212 and is electrically coupled to a positive busbar 90 and a ground busbar 92. In the presented example, a) the snubber mount 204 comprises a plurality of snubber circuit boards 216, b) each resistor 210 and capacitor 212 of the snubber circuit element 200 is mounted on one of the relevant snubber circuit boards 216, and c) the snubber circuit boards 216, resistors 210 and capacitors 212 are adjacent to each other on the second axial side of the end plate 110. Each of the resistors 210 may have a first leg 220 and a second leg 222, and each of the capacitors 212 may include a first leg 224 and a second leg 226. The first leg 220 of each resistor 210 is electrically coupled to the positive busbar 90, the second leg 222 of each resistor 210 is electrically coupled to the first leg 224 of the corresponding capacitor 212, and the second leg 226 of each capacitor 212 is electrically coupled to the ground busbar 92.

[0039] Referring specifically to Figure 10, each of the second heatsinks 202 is mechanically and thermally coupled to at least a portion of one of the relevant snubber circuit elements 200 and includes a second heatsink body 230 and a plurality of second fins 232 extending from the second heatsink body 230. In the presented example, each second heatsink body 230 of the second heatsinks 202 is attached to a capacitor 212 in one of the relevant snubber circuit elements 200. However, the second heatsinks 202 can also be attached to a resistor 210 in one of the relevant snubber circuit elements 200, or to both a resistor 210 and a capacitor 212 in one of the relevant snubber circuit elements 200.

[0040] Referring to Figures 8, 11, and 12, the snubber 100 may optionally include a snubber housing 240 coupled to one or more snubber mounts 204. In one embodiment, the snubber housing 240 may encapsulate some of the snubber circuit elements 200 to prevent contact between the cooling fluid circulating through the inverter 36 and the electrical components of the snubber 100.

[0041] Referring to Figures 11 to 14, optionally, a plurality of cooling channels 250 can be formed within the snubber 100 to guide the flow of cooling fluid into or through the second heat sink 202 in a desired manner. In the illustrated example, an annular plenum 252 is formed between the end plate 110 and one or more snubber mounts 204, each of the one or more snubber mounts 204 defining one or more inlet ports 256, and the snubber housing 240 forms a plurality of cooling chambers 258. The annular plenum 252 is positioned to be in fluid communication with a cooling standpipe 190 and is configured to receive cooling fluid from the cooling standpipe 190. Each cooling chamber 258 houses a corresponding one of the second heat sinks 202 and defines a cavity or region 260 into which the second fins 232 extend, and a chamber outlet 264 from which the cooling fluid can be discharged from the cooling chamber 258 to one or more desired regions. It will be understood that the heat conducted from the snubber circuit element 200 to the second heat sink 202 by the cooling fluid flowing through the cooling chamber 258 is permitted to be released into the cooling fluid from the second fin 232 of the second heat sink 202.

[0042] Referring to Figures 7 and 12, the chamber outlet 264 of the cooling chamber 258 directs the cooling fluid into a radially located annular space 270 between the snubber 100 and the power semiconductor assembly 142 with heatsink. The cooling fluid in this annular space may pass through the region in which the first fins 146 of the first heatsink 140 extend inward to cool the power semiconductor assembly 142 with heatsink. The cooling fluid may then flow around the axial ends of the set of field windings 52 (Figure 2) and into the stator body cooling channels 60 (Figure 2) within the stator assembly 40 (Figure 2) to cool the stator assembly 40 (Figure 2).

[0043] It will be understood that the snubber 100 may be configured in slightly different ways to guide the cooling fluid in slightly different ways. In the example in Figure 15, the snubber housing 240, in conjunction with a cap 64 covering the end plate 110 of the inverter mount 80 and the set of field windings 52, defines a number of snubber cooling passages 250a for guiding the cooling fluid from the second heat sink 202 to the first heat sink 140 coupled to the power semiconductor 82. In this example, a chamber outlet 264 discharges the cooling fluid into an annular space 280, which supplies the cooling fluid to a portion 282 of the snubber cooling passage 250a located between the cap 64 and the end plate 110. The cooling passage 250a supplies the cooling fluid into an annular space 270 (Figure 7), in which the cooling fluid may flow into the region where the first fins 146 of the first heat sink 140 extend.

[0044] Although the snubber 100 is illustrated and described as a separate component located radially inward of the heatsink-equipped power semiconductor 82, it will be understood that the snubber 100 may be incorporated into the inverter 36 (Figure 2) in a slightly different manner. For example, as shown in Figure 16, the snubber 100a may be incorporated into the inverter 36a such that the second heatsink 202 and the snubber circuit elements 200 are placed within the associated group of heatsink-equipped power semiconductor assemblies 142. In this example, each of the snubber circuit elements 200 is located between the associated pair of power semiconductors 82 on the second axial side of the end plate 110.

[0045] The above-described embodiments are provided for illustrative and explanatory purposes only. They are not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally interchangeable and usable in selected embodiments, even if not specifically illustrated or described, and are not limited to that particular embodiment. Similar elements or features may be modified in various ways. Such modifications will not be considered deviations from the disclosure, and all such modifications are intended to be within the scope of the disclosure.

Claims

1. Housing assembly and An electric motor housed in the aforementioned housing assembly, comprising a stator and a rotor rotatable around a rotation axis relative to the stator, The stator has multiple sets of field windings and multiple sets of phase leads, Each of the phase leads is electrically coupled to a corresponding set of windings. Electric motor and, An inverter comprising a holding member, an end plate, a plurality of first and second busbars, a circuit board assembly, a plurality of power semiconductor devices, one or more first heat sinks, and a snubber, The retaining member is received between the housing assembly and the respective axial ends of the field winding set. The end plate is fixed to the holding member and sealed and bonded to it. The first and second busbars, and the circuit board assembly, are received within the retaining member on the first side of the end plate. Each of the aforementioned power semiconductor devices has a plurality of device terminals and a power terminal. One of the first device terminals of each of the power semiconductor devices is electrically coupled to the second busbar. The power terminal is electrically coupled to one of the device terminals, a second device terminal, and to the first busbar. The power semiconductor device is disposed within the holding member, and the power terminals are positioned on the second side of the end plate, which is opposite to the first side. The device terminals of the power semiconductor device extend through the end plate and are electrically coupled to the circuit board assembly. Each of the power semiconductor devices has a power terminal attached to one or more of the first heatsinks. Each of the one or more first heatsinks has a plurality of first fins, The first fin of the first heat sink is located within a first region adjacent to the axial end of the set of field windings. An inlet port is formed through the end plate, The inlet port is adapted to receive a liquid cooling fluid through the inlet port, The snubber has a plurality of snubber circuit elements and a plurality of second heat sinks, Each of the snubber circuit elements has a resistor and a capacitor and is electrically coupled to the first and second busbars. Each of the second heat sinks is mechanically and thermally coupled to at least one of the relevant snubber circuit elements. Each of the second heat sinks has a plurality of second fins arranged in a second region adjacent to the axial end of the set of field windings, The inlet port is fluid-connected to the first region and the second region. Inverter and An electric drive module equipped with this feature.

2. The plurality of power semiconductor devices are arranged in a ring around the rotation axis, The electric drive module according to claim 1, wherein each of the snubber circuit elements is arranged between a related pair of power semiconductor devices.

3. The electric drive module according to claim 1, wherein the snubber circuit element and the second heat sink are arranged on the second side of the end plate.

4. Each of the snubber circuit elements has a first terminal and a second terminal. The first terminal and the second terminal extend through the end plate, The electric drive module according to claim 3, wherein the first terminal is mechanically coupled to the first busbar, and the second terminal is mechanically coupled to the second busbar.

5. The electric drive module according to claim 4, wherein each of the first terminals is a corresponding leg of the resistor.

6. The snubber further comprises one or more snubber mounts and a snubber housing. The snubber circuit element is fixedly coupled to one or more snubber mounts. The snubber housing is coupled to one or more snubber mounts and, in cooperation with the one or more snubber mounts, houses the snubber circuit elements. The electric drive module according to claim 1, wherein the snubber housing forms at least partially the second region.

7. Multiple cooling channels fluidly connect the first region and the second region. The electric drive module according to claim 6, wherein the cooling channel is at least partially formed by the snubber housing.

8. The electric drive module according to claim 7, wherein each of the cooling channels is formed by a gap space disposed between the end plate and the snubber housing.

9. The snubber circuit element is radially offset from the power semiconductor, The electric drive module according to claim 6, wherein the snubber housing defines a plurality of outlets configured to discharge fluid from the second region toward the first region.

10. The electric drive module according to claim 9, wherein the snubber circuit element is located radially inward of the power semiconductor.

11. Housing assembly and An electric motor housed in the aforementioned housing assembly, comprising a stator and a rotor rotatable around a rotation axis relative to the stator, The stator has multiple sets of field windings and multiple sets of phase leads, Each of the phase leads is electrically coupled to a corresponding set of windings. Electric motor and, Positive busbar and Ground busbar and Multiple phase busbars electrically coupled to multiple phase lead wires, An inverter comprising a plurality of power semiconductor devices coupled to at least one of the phase busbars, and one or more first heat sinks, Each of the aforementioned power semiconductor devices has a power terminal, Each power terminal of the power semiconductor device is attached to one or more first heat sinks. Inverter and A snubber having multiple snubber circuit elements and multiple second heat sinks, Each of the snubber circuit elements has a resistor and a capacitor, and is electrically coupled to the positive busbar and the ground busbar. Each of the second heat sinks is mechanically and thermally coupled to at least one of the relevant snubber circuit elements. Each of the second heatsinks has a heatsink body, a snubber, One or more cooling chambers configured to receive a fluid and to communicate the fluid with one or more first heat sinks or one or more second heat sinks, An electric drive module equipped with this feature.

12. The electric drive module according to claim 11, wherein the fluid flows through one or more second heat sinks.

13. The electric drive module according to claim 11, further comprising a snubber housing for receiving the plurality of snubber circuit elements.

14. The electric drive module according to claim 11, further comprising one or more chamber outlets within the one or more cooling chambers for guiding the fluid into an annular space located between the snubber and the plurality of power semiconductor devices.

15. The electric drive module according to claim 11, further comprising one or more cooling channels formed in the snubber for directing the flow of a cooling fluid onto or through the second heat sink.

16. The electric drive module according to claim 15, wherein the one or more cooling channels include an annular plenum formed between an end plate and a snubber mount supporting the plurality of snubber circuit elements.

17. The electric drive module according to claim 11, wherein the one or more first heat sinks include a first heat sink body and a plurality of first fins.

18. The electric drive module according to claim 11, wherein the one or more second heat sinks include a second heat sink body and a plurality of second fins.

18. The electric drive module according to claim 11, wherein one or more of the second heat sinks are attached to the capacitor of the snubber circuit element.

19. The electric drive module according to claim 11, wherein the snubber is located radially inward of the power semiconductor device.

20. The electric drive module according to claim 11, wherein the power semiconductor device is arranged adjacent to the snubber circuit element around the circumference of the inverter mount.

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