Light-emitting modules, lighting devices, and powered vehicles
The lighting device addresses assembly issues in large light-emitting modules by using guide pins and positioning pins for precise alignment, ensuring smooth assembly and maintaining optical accuracy.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-04-12
- Publication Date
- 2026-04-14
AI Technical Summary
Improper assembly of components in a light-emitting module affects the optical functionality, particularly in modules with large dimensions, leading to reduced accuracy and efficiency.
A lighting device design featuring a circuit board with guide pins on a heat sink for precise positioning, a reflector with positioning pins, and screws for secure attachment, ensuring accurate alignment and assembly even in large modules.
Ensures smooth assembly and maintains optical accuracy by allowing adjustments during assembly, thereby enhancing the performance of light-emitting modules with large dimensions.
Smart Images
Figure 2026512134000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of power vehicle lighting, and in particular, to a light emitting module, a lighting device, and a power vehicle.
Background Art
[0002] Lighting devices are widely used in various fields to provide light for illumination and / or optical indication functions; for example, in power vehicles, lighting devices such as vehicle lamps are used to ensure safe driving.
[0003] Improper assembly of components in a light emitting module can affect the optical functionality of the module.
Summary of the Invention
[0004] The objective of the present disclosure is to solve or overcome at least one of the above and other problems and drawbacks in the prior art.
[0005] The present invention provides a lighting device, which comprises a circuit board configured such that a light source is disposed thereon, a reflector located in the light output direction of the light source and configured to reflect the light emitted by the light source, and a heat sink configured to fix the circuit board and the reflector and dissipate heat from the circuit board.
[0006] In some embodiments, guide pins are provided on the heat sink, and when the circuit board is placed on the heat sink, the guide pins pass through first through holes provided on the circuit board, thereby being configured to pre-position the circuit board.
[0007] In some embodiments, there is a gap between the guide pins and the sidewalls of the first through holes of the circuit board.
[0008] In some embodiments, the gap is 0.3 mm or more.
[0009] In some embodiments, the reflector includes positioning pins which pass through second through-holes provided in the circuit board, thereby positioning the reflector relative to the heat sink.
[0010] In some embodiments, the positioning pin and the side wall of the second through-hole in the circuit board fit tightly together.
[0011] In some embodiments, the light-emitting module further includes screws that pass through a third through-hole in the reflector and a fourth through-hole in the circuit board, thereby tightly securing the reflector and the circuit board to the heat sink.
[0012] In some embodiments, the light-emitting module has at least two circuit boards, the at least two circuit boards sharing the same reflector and heat sink.
[0013] In some embodiments, at least two of the circuit boards correspond to separate lenses.
[0014] According to other aspects of the present disclosure, the present invention further provides a lighting device including a light-emitting module described in any embodiment of the present disclosure.
[0015] According to other aspects of the present disclosure, the present invention further provides a vehicle comprising a light-emitting module or lighting device as described in any embodiment of the present disclosure.
[0016] The light-emitting module according to the present invention can ensure the accuracy of the relative positioning of the components of the light-emitting module when the light-emitting module has large dimensions, thereby ensuring the optical effect of the light-emitting module. [Brief explanation of the drawing]
[0017] The following detailed description of this disclosure, along with reference to the drawings, may help to clarify other purposes and benefits of this disclosure and to achieve a comprehensive understanding of this disclosure.
[0018] These and / or other aspects, features and advantages of the present disclosure will become apparent and easier to understand from the following description of exemplary embodiments in conjunction with the drawings. [Figure 1] Figure 1 schematically shows the main diagram of a light-emitting module according to an exemplary embodiment of the present disclosure. [Figure 2] Figure 2 schematically shows an exploded view of a light-emitting module according to an exemplary embodiment of the present disclosure. [Figure 3] Figure 3 schematically shows a heat sink and circuit board of an exemplary embodiment of the light-emitting module according to the present disclosure. [Figure 4] Figure 4 schematically shows an enlarged view of a portion of Figure 3. [Figure 5] Figure 5 schematically shows a cross-sectional view of an unassembled light-emitting module according to an exemplary embodiment of the present disclosure. [Figure 6] Figure 6 schematically shows a cross-sectional view of an assembled light-emitting module according to an exemplary embodiment of the present disclosure. [Figure 7] Figure 7 schematically shows the difference in the position of the circuit board in the light-emitting module before and after the attachment of the reflector, according to an exemplary embodiment of the present disclosure. [Modes for carrying out the invention]
[0019] The following detailed description of this disclosure, along with reference to the drawings, may help to clarify other purposes and benefits of this disclosure and to achieve a comprehensive understanding of this disclosure.
[0020] Embodiments of the present disclosure are described in detail below with reference to the drawings. Identical or similar components are indicated by identical or similar reference numerals. The following description of embodiments of the present disclosure with reference to the drawings is intended to illustrate the general concepts of the present disclosure and should not be construed as limiting the present disclosure.
[0021] Furthermore, in the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, it will be apparent that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are illustrated by way of example in order to simplify the drawings.
[0022] The light-emitting module of the lighting device can have large dimensions according to requirements; for example, the heat sink or reflector of the light-emitting module can even have a length or width exceeding 100 mm. In the case of a light-emitting module with large dimensions, in order to reduce costs, a single-piece reflector is generally still used to reflect light; the tolerances of the device affect the assembly accuracy and can even prevent a successful assembly, which inevitably affects the optical function of the light-emitting module, reducing accuracy and efficiency.
[0023] As shown in FIGS. 1 and 2, the lighting device 100 according to the present disclosure includes a circuit board 101 configured such that a light source is disposed thereon, a reflector 102 positioned in the light output direction of the light source and configured to reflect the light emitted by the light source, and a heat sink 104 configured to fix the circuit board 101 and the reflector 102 and dissipate heat from the circuit board 101.
[0024] In one example, as shown in FIGS. 3 to 5, when guide pins 1041 are provided on the heat sink 104 and the circuit board 101 is attached to the heat sink 104, the guide pins 1041 are configured to pass through the first through holes 1011 provided in the circuit board 101, thereby guiding the position of the circuit board 101. The number of guide pins 1041 may be set according to actual needs and is not particularly limited in the present invention.
[0025] In a particular embodiment, the number of guide pins 1021 is two, and correspondingly, two first through holes 1011 are provided in the circuit board 101. To facilitate mounting of the circuit board 101, one of the first through holes 1011 is circular, and the other first through hole 1011 is U-shaped, or open U-shaped, or circular.
[0026] In one example, as shown in Figure 6, there is a gap between the guide pin 1041 and the side wall of the first through hole 1011 in the circuit board 101, and this gap allows the circuit board 101 to move on the heat sink 104. With this configuration, the relative position of the circuit board 101 and the heat sink 104 can be adjusted as needed during assembly.
[0027] In one example, the gap is 0.3 mm or more to ensure successful adjustment of the circuit board position. The gap referred to here means the gap between the guide pin 1041 and one side wall of the first through hole 1011 in the circuit board 101 when the guide pin is centered in the first through hole. In a preferred example, the gap is 0.5 mm or more. In actual application, the gap distance can be adjusted according to the dimensions of the circuit board 101, etc., and is only required to allow adjustment of the position of the circuit board 101 relative to the heat sink 104.
[0028] In one example, as shown in Figures 5 and 6, the reflector 102 includes positioning pins 1021 which pass through a second through-hole 1012 provided in the circuit board 101, thereby positioning the reflector 102 relative to the heat sink 104. The heat sink 104 is provided with a corresponding opening 1042 which accommodates the positioning pins 1021 of the reflector 102 and corresponds to the second through-hole 1012 of the circuit board 101. The number of positioning pins 1021 may be set according to the actual needs and is not particularly limited in the present invention.
[0029] In certain embodiments, the number of positioning pins 1021 is two, and correspondingly, two second through holes 1012 are provided in the circuit board 101. To facilitate the attachment of the reflector 102 to the circuit board 101, one of the second through holes 1012 is circular, and the other second through hole 1012 is U-shaped, open U-shaped, or circular.
[0030] In one example, the positioning pin 1021 and the second through-hole 1012 in the circuit board 101 fit tightly together, thereby ensuring that the relative position between the reflector 102 and the circuit board 101 is fixed, and thereby guaranteeing the optical accuracy of the light-emitting module 100. Furthermore, the dimensional setting of the positioning pin and its tight fit with the second through-hole make it possible to adjust the circuit board to the appropriate position by adjusting the positioning pin during assembly.
[0031] During assembly, the circuit board 101 is first positioned on the heat sink 104 by guide pins 1041 in the heat sink 104. Next, the positioning pins 1021 of the reflector 102 are passed through the second through-hole 1012 in the circuit board 101, guiding the circuit board to the correct position when the positioning pins 1021 are inserted into the through-hole in the circuit board, thereby achieving a tight fit between the reflector and the circuit board; then the positioning pins pass through the opening 1042 in the heat sink 104, thereby positioning the reflector 102 relative to the heat sink 104. According to the configuration of the present invention, if misalignment occurs during assembly, all that is needed is to adjust the position of the reflector 102, thereby driving the circuit board 102 to move on the heat sink 104 by the positioning pins 1021 in the reflector 102, thereby eliminating the effects of tolerances within a certain range and ensuring that the assembly process proceeds smoothly.
[0032] Figure 7 schematically shows the difference in the position of the circuit board in the light-emitting module before and after the mounting of the reflector according to an exemplary embodiment of the present disclosure. The solid line in Figure 7 indicates the initial position of the circuit board 101. After the mounting of the reflector 102, the position of the circuit board 101 may need to be adjusted according to subsequent assembly requirements. In this case, only the positioning pins 1021 of the reflector 102 need to be adjusted, thereby driving the circuit board 101 to the dotted line position shown as an example in Figure 7.
[0033] In one example, a thermally conductive adhesive is placed between the circuit board 101 and the heat sink 104 to conduct heat generated by the light source and other elements on the circuit board to the heat sink. The thermally conductive adhesive is also designed to facilitate the movement of the circuit board 101 relative to the heat sink 104, thereby adjusting their relative positions. In certain examples, a non-curing thermally conductive adhesive is selected for use as the thermally conductive adhesive. In other examples, a curing thermally conductive adhesive may also be selected as the thermally conductive adhesive. If a curing thermally conductive adhesive is selected, it is necessary to ensure, as far as possible, that the assembly work is completed before it hardens. The selection of the thermally conductive adhesive is not particularly limited in this invention and may be made according to the actual needs of those skilled in the art.
[0034] In one example, as shown in Figures 5 and 6, the light-emitting module 100 further includes a screw 105 that passes through a third through-hole 1022 in the reflector 102 and a fourth through-hole 1014 in the circuit board 101, thereby tightly securing the reflector 102 and the circuit board 101 to the heatsink 104. The heatsink 104 is provided with corresponding openings 1043 for accommodating the screw 105. The screw 105 is a tight-fitting screw, ensuring the overall stability of the light-emitting module 100 once assembly is complete. In a particular example, the opening 1043 in the heatsink 104 for accommodating the screw 105 is configured to be formed on a projection in the heatsink 104, which passes through a fourth opening 1014 in the circuit board 101, and this configuration can enhance the stability of the connection.
[0035] In one example, the light-emitting module 100 has at least two circuit boards 101, and these at least two circuit boards 101 share the same reflector 102 and heat sink 104. The configuration of the present invention is particularly suitable in situations where the light-emitting module 100 has large dimensions and a reflector needs to be shared. When the light-emitting module 100 includes two, three, or more circuit boards, it has a long length in the lateral direction, and the use of the solution of the present invention can effectively prevent tolerances from affecting the assembly process, ensuring that assembly can proceed smoothly and also ensuring the optical accuracy of the light-emitting module 100.
[0036] In a particular example, if the light-emitting module 100 has at least two circuit boards 101, at least one circuit board 101 is connected to the reflector 102 and heat sink 104 by the structure described in the present invention. Specifically, if the light-emitting module 100 has three circuit boards 101, the circuit boards 101 on two sides may be connected to the reflector 102 and heat sink 104 and may be positioned and fixed to them in the manner described in the present invention; any one, any two, or all three circuit boards 101 may be positioned and fixed to the reflector 102 and heat sink 104 in the manner described in the present invention.
[0037] In one example, as shown in Figures 1 and 2, the light-emitting module 100 may further include a lens 103 located on the output side of the reflector 102 and configured to project light from the reflector 102; at least two of its circuit boards 101 each correspond to a separate lens 103.
[0038] The light-emitting module 100 according to the present invention may be used in the headlights of a powered vehicle to provide a low-beam function, but of course, it can be used for any other suitable lighting or signaling function without being particularly limited in the present invention.
[0039] The light-emitting module 100 according to the present invention ensures that the assembly process proceeds smoothly even when the light-emitting module has large dimensions and multiple circuit boards share the same reflector, and also ensures the accuracy of the relative position between the reflector and the circuit board, thereby ensuring the optical accuracy of the light-emitting module.
[0040] The present invention also provides a powered vehicle having the above-described light-emitting module 100 or lighting device. The powered vehicle has the advantages of the above-described light-emitting module 100.
[0041] The term “vehicle” as used herein can mean any type of vehicle, for example, a motor vehicle, a motorcycle, or any other mobile machine capable of carrying at least one occupant or used to transport people or goods.
[0042] Here, the terms “integrated” or “unified” are understood to be relative to the terms “independent” or “separated,” that is, an integrated or unified component exists as a unit and does not include parts that are independent or separate from each other in space; for example, the various parts of an integrated or unified component may be formed (e.g., molded) at the same time, or they may be formed separately and then assembled together to form an integrated assembly.
[0043] While this disclosure has been described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to illustrate preferred embodiments of this disclosure and should not be construed as limiting this disclosure. The dimensional ratios in the drawings are schematic and should not be construed as limiting this disclosure.
[0044] While several embodiments of the general concepts of this disclosure have been shown and described, those skilled in the art will understand that modifications can be made to these embodiments without departing from the principles and spirit of the general concepts of this disclosure. The scope of this disclosure is defined by the claims and their equivalents.
Claims
1. A light-emitting module (100) is characterized by comprising: a circuit board (101) configured on which a light source (109) is arranged; a reflector (102) positioned in the direction of the light output of the light source (109) and configured to reflect the light emitted by the light source (109); and a heat sink (104) configured to fix the circuit board (101) and the reflector (102) and to dissipate heat from the circuit board (101).
2. The light-emitting module (100) according to claim 1, characterized in that a guide pin (1041) is provided on the heat sink (104), and when the circuit board (101) is placed on the heat sink (104), the guide pin (1041) passes through a first through hole (1011) provided in the circuit board (101), thereby pre-positioning the circuit board (101).
3. The light-emitting module (100) according to claim 2, characterized in that there is a gap between the guide pin (1041) and the side wall of the first through hole (1011) in the circuit board (101), and the gap allows the circuit board (101) to move on the heat sink (104).
4. The light-emitting module (100) according to claim 3, characterized in that the gap is 0.3 mm or more.
5. The reflector (102) is provided with a positioning pin (1021), and the positioning pin (1021) is configured to pass through a second through hole (1012) provided in the circuit board (101), thereby positioning the reflector (102) relative to the heat sink (104), as described in claim 2 of the light-emitting module (100).
6. The light-emitting module (100) according to claim 5, characterized in that the positioning pin (1021) and the second through hole (1012) in the circuit board (101) are tightly fitted to each other.
7. The light-emitting module (100) according to claim 5, characterized in that a thermally conductive adhesive is placed between the circuit board (101) and the heat sink (104).
8. The light-emitting module (100) further comprises a screw (105), the screw (105) passing through a third through hole (1022) in the reflector (102) and through a fourth through hole (1014) in the circuit board (101), thereby tightly fixing the reflector (102) and the circuit board (101) to the heat sink (104), as described in claim 4.
9. The light-emitting module (100) according to claim 8, wherein the light-emitting module (100) has at least two circuit boards (101), and the at least two circuit boards (101) share the same reflector (102) and heat sink (104).
10. A lighting device characterized by comprising a light-emitting module (100) according to any one of claims 1 to 9.
11. A powered vehicle characterized by comprising a light-emitting module (100) according to any one of claims 1 to 9 or a lighting device according to claim 10.