Digital simulation for semiconductor manufacturing processes

JP2026517583APending Publication Date: 2026-06-02APPLIED MATERIALS INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
APPLIED MATERIALS INC
Filing Date
2024-02-16
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Semiconductor manufacturing processes are complex and resource-intensive, with manual adjustments leading to suboptimal results due to variability and time delays in identifying and correcting process drifts, and quality consistency is difficult to maintain over time.

Method used

Implement real-time automated control using model-based digital simulations that simulate wafer features based on gas, thermal, and plasma profiles, allowing for concurrent corrective actions through trained machine learning models to adjust process parameters.

Benefits of technology

Reduces the time to achieve optimal settings, minimizes energy consumption, and avoids inconsistent products by enabling real-time adjustments based on predictive data, thereby improving process efficiency and reducing resource waste.

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Abstract

This disclosure describes a method and system for operating a manufacturing process using concurrent, real-time simulation of the manufacturing process via a digital twin model. Sensor data representing the parameters of the ongoing manufacturing process is input into the digital twin model and used to predict the output of the manufacturing process. The predicted output is compared to the target output. One or more trained machine learning models are used to determine corrective actions to be implemented by the manufacturing process controller in order to minimize any deviation from the target output.
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