Measuring device and measuring method

Abstract

A measuring device is provided. The measuring device includes a virtual image generation unit that generates a virtual image based on a plurality of layers shown in a design drawing, a measurement reference area determination unit that determines a measurement reference area to be measured using the virtual image, a measurement target area detection unit that detects a measurement target area corresponding to the measurement reference area from a measurement target including a plurality of patterned layers based on the design drawing, and a measuring unit that performs measurement of the measurement target area with respect to the measurement reference area.

Description

Technical Field

[0001] The present invention relates to a measuring device and a measuring method.

Background Art

[0002] With the rapid spread of information media such as computers, electronic devices and semiconductor devices have also developed by leaps and bounds. The manufacturing technology of semiconductor devices is developing in the direction of improving the integration degree, reliability, response speed, etc. Along with this, as part of strengthening the competitiveness in the semiconductor industry, each unit process that can guarantee a high production yield has been developed, and at the same time, methods and devices for measuring process errors in each unit process have also been actively studied.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The problem to be solved by the present invention is to provide a measuring device and a measuring method that can guarantee reliability while reducing manufacturing costs and manufacturing time.

[0004] The problems of the present invention are not limited to the problems described above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

Means for Solving the Problems

[0005] A measuring device according to an embodiment for solving the above problems includes a virtual image generation unit that generates a virtual image based on a plurality of layers shown in a design drawing, a measurement reference region determination unit that determines a measurement reference region to be measured in the virtual image, a measurement target region detection unit that detects a measurement target region corresponding to the measurement reference region from a measurement target including a plurality of layers patterned based on the design drawing, and a measurement unit that measures the measurement target region with reference to the measurement reference region.

[0006] The virtual image generation unit can preprocess an image including a plurality of layers shown in the design drawing to generate a preprocessed image, capture the stacked plurality of layers based on the design drawing to obtain an actual measured image, and generate a first virtual image based on the preprocessed image and the actual measured image.

[0007] The virtual image generation unit can generate the first virtual image by adjusting the loss of the preprocessed image and the loss of the measured image, as shown in the following formula, so as to minimize the loss of the first virtual image.

[0008] <Formula> JPEG2026520096000002.jpg1668

[0009] (L: Loss of the first virtual image, α: Weight of the preprocessed image, L1: Loss of the preprocessed image, β: Weight of the actual image, L2: Loss of the actual image)

[0010] The measurement target area detection unit can detect a measurement target area corresponding to the measurement reference area of ​​the first virtual image from the measurement target on which the photoresist has been developed.

[0011] The virtual image generation unit can separate the multiple layers shown in the design drawing layer by layer to extract two-dimensional images, integrate the two-dimensional images and divide them according to the overlapping conditions between layers, and perform image mapping according to the overlapping conditions to generate a second virtual image.

[0012] The virtual image generation unit can generate the second virtual image by performing blurring processing according to the overlapping conditions between the layers after performing the image mapping.

[0013] The measurement target area detection unit can detect a measurement target area corresponding to the measurement reference area of ​​the second virtual image from the measurement target after etching using the developed photoresist and cleaning the photoresist.

[0014] The measurement target area detection unit can perform pattern matching of the measurement target with respect to the measurement reference area and detect the measurement target area that satisfies a predetermined level of agreement.

[0015] The measurement unit can perform critical dimension measurement based on the measurement reference area and can measure the line width, holes, or area of ​​the measurement target area.

[0016] The measurement target area detection unit removes noise from the measured image captured of the measurement target, and can detect the measurement target area corresponding to the measurement reference area from the noise-removed measured image.

[0017] A measurement method according to one embodiment for solving the above problem includes the steps of: generating a virtual image based on a plurality of layers shown in a design drawing; determining a measurement reference area to be measured in the virtual image; detecting a measurement target area corresponding to the measurement reference area from a measurement target including a plurality of layers patterned based on the design drawing; and measuring the measurement target area with respect to the measurement reference area.

[0018] The step of generating the virtual image may include preprocessing an image containing a plurality of layers shown in the design drawing to generate a preprocessed image, capturing a plurality of layers stacked according to the design drawing to obtain a measured image, and generating a first virtual image based on the preprocessed image and the measured image.

[0019] The step of generating the virtual image may further include a step of generating the first virtual image by adjusting the loss of the preprocessed image and the loss of the measured image, as shown in the following formula, so as to minimize the loss of the first virtual image.

[0020] <Formula> JPEG2026520096000003.jpg1668

[0021] (L: Loss of the first virtual image, α: Weight of the pre-processed image, L1: Loss of the pre-processed image, β: Weight of the measured image, L2: Loss of the measured image)

[0022] The step of detecting the measurement target area may include a step of detecting a measurement target area corresponding to the measurement reference area of the first virtual image from the measurement target on which the photoresist has been developed.

[0023] The step of generating the virtual image may include a step of separating a plurality of layers shown in the design drawing layer by layer to extract a two-dimensional image, integrating the two-dimensional images, classifying them according to the overlapping conditions between the layers, and performing image mapping according to the overlapping conditions to generate a second virtual image.

[0024] The step of generating the virtual image may further include a step of generating the second virtual image by performing a blurring process according to the overlapping conditions between the layers after performing the image mapping.

[0025] The step of detecting the measurement target area may include a step of detecting a measurement target area corresponding to the measurement reference area of the second virtual image from the measurement target that has been etched using the developed photoresist and from which the photoresist has been cleaned.

[0026] The step of detecting the measurement target area may include a step of performing pattern matching of the measurement target based on the measurement reference area and detecting the measurement target area that satisfies a preset level of matching degree.

[0027] The step of performing the measurement may include a step of performing at least one pattern measurement of overlay, refractive index, and thickness based on the measurement reference area, and measuring the line width, hole, or area of the measurement target area.

[0028] The step of detecting the measurement target area may include a step of removing noise from the measured image obtained by imaging the measurement target and detecting the measurement target area corresponding to the measurement reference area from the measured image from which the noise has been removed.

[0029] Specific details of other embodiments are included in the detailed description and the drawings.

Advantages of the Invention

[0030] According to the measuring device and the measuring method according to the embodiment, the step of generating a virtual image and determining a measurement reference area can be completed in advance before the measurement is performed, and the post-development inspection and post-cleaning inspection for each layer can be repeated while advancing the manufacturing process. Therefore, the measuring device and the measuring method can perform measurements that can ensure reliability while reducing manufacturing costs and manufacturing time.

[0031] The effects according to the embodiment are not limited to the contents exemplified above, and more diverse effects are included in this specification.

Brief Description of the Drawings

[0032] [Figure 1] It is a block diagram showing a measuring device according to an embodiment. [Figure 2] It is a flowchart showing a measuring process according to an embodiment. [Figure 3] It is a flowchart showing a measuring process according to another embodiment. [Figure 4] It is also a flowchart showing a measuring process according to another embodiment. [Figure 5] It is a flowchart showing a process of generating a first virtual image in a measuring process according to an embodiment. [Figure 6] It is a flowchart showing a process of generating a second virtual image in a measuring process according to an embodiment. [Figure 7] It is a diagram showing a measuring process of a measurement target area in a measuring process according to an embodiment. [Figure 8] It is also a flowchart showing a measuring process according to another embodiment.

Modes for Carrying Out the Invention

[0033] The advantages and features of the present invention, as well as methods for achieving them, will become clearer with reference to the embodiments described below in detail, along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and can be realized in a variety of different forms, and these embodiments are provided merely to complete the disclosure of the present invention and to fully inform those who are ordinary skill in the art to which the invention pertains, of the scope of the invention, and the present invention is defined solely by the scope of the claims.

[0034] When elements or layers are referred to as "on" other elements or layers, this includes all cases where other layers or elements are interposed immediately above or between other elements. Throughout the specification, the same reference numerals refer to the same component. The shapes, sizes, proportions, angles, numbers, etc., shown in the drawings illustrating embodiments are illustrative and the present invention is not limited to those shown.

[0035] While terms such as "first," "second," etc., are used to describe a variety of components, these components are, of course, not limited by these terms. These terms are simply used to distinguish one component from another. Therefore, the first component mentioned below may, of course, be the second component within the technical concept of the present invention.

[0036] The features of each of the various embodiments of the present invention can be combined or linked together, either partially or entirely, allowing for a wide range of technical interlocking and driving, and each embodiment can be implemented independently of or in conjunction with one another.

[0037] The following describes specific embodiments with reference to the attached drawings.

[0038] Figure 1 is a block diagram showing a measuring device according to one embodiment, and Figure 2 is a flowchart showing the measurement process according to one embodiment.

[0039] Referring to Figures 1 and 2, the measuring device 10 can measure the patterning results during a manufacturing process based on a photomask. The measuring device 10 can also predict the patterning results during a manufacturing process for electronic devices, semiconductor devices, or batteries. For example, electronic devices or semiconductor devices may be mobile phones, smartphones, tablet personal computers, mobile communication terminals, electronic organizers, e-books, portable multimedia players (PMPs), navigation systems, or ultra-mobile PCs (UMPCs). Other examples include televisions, laptops, monitors, billboards, or displays for the Internet of Things (IoT). Yet another example is wearable devices such as smartwatches, watch phones, glasses-type displays, and head-mounted displays (HMDs).

[0040] The measuring device 10 may include a virtual image generation unit 100, a measurement reference area determination unit 200, a measurement target area detection unit 300, and a measurement unit 400.

[0041] The virtual image generation unit 100 can generate a virtual image based on at least one layer shown in the design drawing (step S100). The design drawing may include layout diagrams of each of the multiple layers, and the virtual image generation unit 100 can generate virtual images in the order in which the multiple layers are sequentially stacked. Here, the multiple layers may include at least one metal layer and at least one organic layer. For example, the virtual image generation unit 100 can generate a virtual image including the first layer, a virtual image including the first and second layers, and a virtual image including the first to third layers. Therefore, the virtual image generation unit 100 does not require a physical object in which at least one layer is actually stacked, and can generate virtual images based on the design drawing.

[0042] The measurement reference area determination unit 200 can determine the measurement reference area to be measured in the virtual image (step S200). The measurement reference area determination unit 200 can receive multiple virtual images from the virtual image generation unit 100 and can determine the measurement reference area for each of the multiple virtual images. The measurement reference area determination unit 200 can determine multiple measurement reference areas for a single virtual image. For example, the measurement reference area determination unit 200 can determine the measurement reference area by receiving user input, but is not limited to this. The measurement reference area may include at least one area defined by at least one metal wire, at least one hole, or a layer.

[0043] The object to be measured may be prepared for measurement by including at least one layer patterned according to the design drawings (step S300). The object to be measured is provided during the manufacturing process of electronic or semiconductor equipment.

[0044] The measurement target area detection unit 300 can image the measurement target and detect a measurement target area corresponding to the measurement reference area from the measurement target (step S400). The measurement target area detection unit 300 can perform pattern matching of the measurement target with respect to the measurement reference area and detect a measurement target area that satisfies a preset level of agreement. The pattern matching agreement is a numerical value that quantifies the level of identity between the measurement reference area and the measurement target area. For example, the measurement target area detection unit 300 can detect a measurement target area when the pattern matching agreement is 85% or higher, but the criteria for agreement are not limited to this.

[0045] The measurement unit 400 can measure the area to be measured with respect to the measurement reference area (step S500). The measurement unit 400 can measure the line width, hole positions, and shape and size of the area to be measured. The measurement unit 400 can measure the critical dimension with respect to the measurement reference area. For example, the measurement unit 400 can measure the line width, holes, or area of ​​the area to be measured by performing pattern measurement of at least one of the overlay, refractive index, and thickness with respect to the measurement reference area. The measurement unit 400 can measure wiring misalignment by performing pattern measurement of the overlay.

[0046] If the object to be measured meets the measurement criteria, the manufacturing process of the electronic or semiconductor device can continue. The measuring device 10 can measure the object again if the manufacturing process progresses further. Therefore, the measuring device 10 can measure all patterning results in the manufacturing process and ensure the reliability of the object to be measured.

[0047] If the object being measured does not meet the measurement criteria, subsequent manufacturing processes for that object may be interrupted.

[0048] Figure 3 is a flowchart showing the measurement process according to another embodiment.

[0049] Referring to Figure 3, the virtual image generation unit 100 can generate virtual images for each of the first to nth layers shown in the design drawing (step S110). The design drawing may include layout diagrams for each of the layers from the first to the nth layer, and the virtual image generation unit 100 can generate virtual images in the order in which the layers are stacked sequentially. For example, the virtual image generation unit 100 can generate virtual images from a virtual image including the first layer to virtual images including the first to nth layers. Therefore, the virtual image generation unit 100 can generate virtual images based on the design drawing without requiring a physical object in which the first to nth layers are actually stacked.

[0050] The measurement reference area determination unit 200 can determine the measurement reference area to be measured for each of the virtual images for the first to nth layers (step S210). The measurement reference area determination unit 200 can receive multiple virtual images from the virtual image generation unit 100 and can determine the measurement reference area for each of the multiple virtual images. The measurement reference area determination unit 200 can determine multiple measurement reference areas for each virtual image. For example, the measurement reference area determination unit 200 determines the measurement reference area by receiving user input, but is not limited to this. The measurement reference area may include at least one area defined by at least one metal wire, at least one hole, or a layer.

[0051] The object to be measured may include the kth layer (where k is an integer between 1 and n) patterned according to the design drawings, and may be prepared for measurement (step S310). The object to be measured is provided during the manufacturing process of electronic or semiconductor equipment.

[0052] The measurement target area detection unit 300 can image the measurement target including the k-th layer and detect a measurement target area corresponding to the measurement reference area from the measurement target (step S410). The measurement target area detection unit 300 can perform pattern matching of the measurement target with respect to the measurement reference area and detect a measurement target area that satisfies a preset level of agreement. The degree of agreement in pattern matching may be a numerical value that quantifies the level of identity between the measurement reference area and the measurement target area. For example, the measurement target area detection unit 300 can detect a measurement target area when the degree of agreement in pattern matching is 85% or higher, but the criteria for the degree of agreement are not limited to this.

[0053] The measurement unit 400 can measure the area to be measured with respect to the measurement reference area (step S510). The measurement unit 400 can measure the line width, hole positions, and shape and size of the area to be measured. The measurement unit 400 can perform critical dimension measurements with respect to the measurement reference area. For example, the measurement unit 400 can perform pattern measurements of at least one of overlay, refractive index, and thickness with respect to the measurement reference area to measure the line width, holes, or area of ​​the area to be measured. The measurement unit 400 can measure wiring misalignment by performing pattern measurements of the overlay.

[0054] If the object to be measured, including the kth layer, meets the measurement criteria, the manufacturing process of the electronic or semiconductor device can continue. For example, if the object to be measured, including the first layer, meets the measurement criteria, the object may further add a second layer, and the measuring device 10 can measure the object to be measured, including the first and second layers. If the object to be measured, including the first and second layers, meets the measurement criteria, the object may further add a third layer, and the measuring device 10 can measure the object to be measured, including the first to third layers. In this manner, the measuring device 10 can measure the object to be measured, including the first to the nth layer. Therefore, the measuring device 10 can measure all patterning results of the manufacturing process and ensure the reliability of the object to be measured.

[0055] The measuring device 10 can pre-secure a virtual image based on the design drawings, eliminating the need to image the actual stacked object and set the measurement reference area each time the process progresses. Therefore, the measuring device 10 can complete the steps of generating a virtual image (step S110) and determining the measurement reference area (step S210) in advance before measurement is performed. As the manufacturing process progresses, only the steps of preparing the object to be measured (step S310), detecting the area to be measured (step S410), and performing the measurement (step S510) can be repeated. Thus, the measuring device 10 can perform measurements that guarantee reliability while reducing manufacturing costs and time.

[0056] Figure 4 is a flowchart showing the measurement process according to yet another embodiment.

[0057] Referring to Figure 4, the virtual image generation unit 100 can generate first and second virtual images based on at least one layer shown in the design drawing (step S120). The design drawing may include layout diagrams of multiple layers, and the virtual image generation unit 100 can generate virtual images in the order in which the multiple layers are sequentially stacked. Here, the multiple layers may include at least one metal layer and at least one organic layer. For example, the first virtual image is used for after-developing inspection (ADI). Here, after-developing inspection (ADI) can measure a measurement target on which photoresist has been developed on at least one layer. Therefore, the virtual image generation unit 100 does not require an actual physical product with developed photoresist and can generate the first virtual image based on the design drawing.

[0058] For example, the second virtual image is used for after-cleaning inspection (ACI). In this ACI, the object to be measured can be measured after etching it with developed photoresist and then cleaning the photoresist placed on the object. Therefore, the virtual image generation unit 100 does not require the actual object after etching and cleaning are complete, and can generate the second virtual image based on the design drawing.

[0059] The measurement reference area determination unit 200 can determine the measurement reference areas for the first and second virtual images (step S220). The measurement reference area determination unit 200 can receive a plurality of first virtual images and a plurality of second virtual images from the virtual image generation unit 100, and can determine the measurement reference area for each of the first virtual images and the measurement reference area for each of the second virtual images.

[0060] The object to be measured may include a photoresist developed according to the design drawings (step S321). The photoresist may be patterned on the layer that requires etching.

[0061] The measurement target area detection unit 300 can image the measurement target and detect a measurement target area corresponding to the measurement reference area of ​​the first virtual image from the measurement target (step S421). The measurement target area detection unit 300 can perform pattern matching of the measurement target with respect to the measurement reference area and detect a measurement target area that satisfies a preset level of agreement.

[0062] The measurement unit 400 can measure the area to be measured using the measurement reference area of ​​the first virtual image as a reference (step S521). The measurement unit 400 can perform post-development inspection (ADI) based on the first virtual image. Therefore, the measurement unit 400 can determine whether or not the photoresist has been properly developed on the object to be measured.

[0063] If the object to be measured meets the measurement criteria, the manufacturing process of the electronic or semiconductor device may continue. The object to be measured can be etched using developed photoresist, and the photoresist placed on the object to be measured can be cleaned and prepared for measurement (step S322). Thus, the object to be measured may include a patterned layer.

[0064] The measurement target area detection unit 300 can image the measurement target and detect a measurement target area corresponding to the measurement reference area of ​​the second virtual image from the measurement target (step S422). The measurement target area detection unit 300 can perform pattern matching of the measurement target with respect to the measurement reference area and detect a measurement target area that satisfies a preset level of agreement.

[0065] The measurement unit 400 can measure the area to be measured using the measurement reference area of ​​the second virtual image as a reference (step S522). The measurement unit 400 can perform post-cleaning inspection (ACI) based on the second virtual image. Therefore, the measurement unit 400 can determine whether or not the layer is properly patterned on the object to be measured.

[0066] The measuring device 10 can pre-secure a first virtual image for post-development inspection (ADI) and a second virtual image for post-cleaning inspection (ACI) based on the design drawings, thus eliminating the need to image the actual object to be measured and set the measurement reference area each time the process progresses. Therefore, the measuring device 10 can complete the steps of generating the first and second virtual images (step S120) and determining the measurement reference area (step S220) in advance before the measurement is performed, and can repeat post-development inspection (ADI) and post-cleaning inspection (ACI) for each layer while the manufacturing process progresses. Thus, the measuring device 10 can perform measurements that guarantee reliability while reducing manufacturing costs and time.

[0067] Figure 5 is a flowchart showing the generation process of the first virtual image in a measurement process according to one embodiment.

[0068] Referring to Figure 5, the virtual image generation unit 100 can generate a preprocessed image based on at least one layer shown in the design drawing (step S121). The design drawing may include a layout diagram containing multiple layers, which may be represented by overlapping lines. Here, the multiple layers may include at least one metal layer and at least one organic layer. The virtual image generation unit 100 can generate a preprocessed image by assigning the style of the captured image to the design drawing. Here, the style of the captured image may represent the texture of the actual captured image, which is due to the geometric structure of the object being captured. Therefore, the virtual image generation unit 100 can generate a preprocessed image similar to the actual captured image.

[0069] The virtual image generation unit 100 can acquire actual measured images by imaging multiple layers stacked according to the design drawings (step S122). For example, the virtual image generation unit 100 can acquire actual measured images in advance before performing measurements, but is not limited to this.

[0070] The virtual image generation unit 100 can generate a first virtual image based on the preprocessed image and the measured image (step S123). The virtual image generation unit 100 can generate a first virtual image that minimizes loss using a pre-trained convolutional neural network. For example, the virtual image generation unit 100 can generate a first virtual image using the following formula.

[0071] <Formula> JPEG2026520096000004.jpg1668

[0072] In the formula, L represents the loss of the first virtual image, α represents the weight of the preprocessed image, L1 represents the loss of the preprocessed image, β represents the weight of the measured image, and L2 represents the loss of the measured image.

[0073] The virtual image generation unit 100 can determine the weights (α) of the preprocessed image and (β) of the measured image that minimize the loss of the first virtual image. Therefore, the virtual image generation unit 100 can generate a first virtual image used for post-development inspection (ADI) by applying the style of the measured image to the preprocessed image generated based on the design drawing.

[0074] Figure 6 is a flowchart showing the generation process of the second virtual image in the measurement process according to one embodiment.

[0075] Referring to Figure 6, the virtual image generation unit 100 can prepare a design drawing that includes multiple layers (step S124). The design drawing can represent multiple layers, including overlapping lines. Here, the multiple layers may include at least one metal layer and at least one organic layer.

[0076] The virtual image generation unit 100 can extract a two-dimensional image for each of the multiple layers (step S125). The virtual image generation unit 100 can assign color to the separated layers. The two-dimensional image can show the pattern for each layer. Multiple layers can be represented by different colors.

[0077] The virtual image generation unit 100 can integrate two-dimensional images (step S126). The two-dimensional image at the current stage may not represent the superposition of multiple layers.

[0078] The virtual image generation unit 100 can represent layers by dividing them according to their overlapping conditions (step S127). The virtual image generation unit 100 can recognize the overlapping conditions through the lines and colors of each layer.

[0079] The virtual image generation unit 100 recognizes the superposition conditions based on the layer lines and superimposed regions, and can perform image mapping according to the superposition conditions (step S128). For example, the virtual image generation unit 100 can perform image mapping on a first region where the active layer and gate layer are stacked, a second region where the gate layer and source metal layer are stacked, a third region where the active layer, gate layer, and source metal layer are stacked, and a fourth region where the active layer and source metal layer are stacked.

[0080] The virtual image generation unit 100 can apply blurring processing depending on the layer superposition conditions (step S129). Since the layers are actually stacked and contain a geometric structure, direct imaging may be affected by the geometric structure. Therefore, the virtual image generation unit 100 can generate a second virtual image to be used for post-cleaning inspection (ACI) by applying blurring processing and applying the actual change in focusing.

[0081] Figure 7 is a diagram showing the measurement process of the area to be measured in a measurement process according to one embodiment.

[0082] Referring to Figure 7, the measurement unit 400 can measure the area to be measured with respect to the measurement reference area. The measurement unit 400 can measure the line width, hole location, and shape and size of the area at the measurement point (CD Target) of the area to be measured. The measurement unit 400 can perform critical dimension measurement (CD Inspection) with respect to the measurement reference area. Critical dimension measurement can detect the edge of a layer, and can perform measurement with respect to the edge of a layer. For example, the measurement unit 400 can perform pattern measurement of at least one of the following: overlay, refractive index, and thickness, with respect to the measurement reference area. By performing pattern measurement of the overlay, the measurement unit 400 can measure the misalignment of the wiring. Therefore, the measurement unit 400 can measure the line width, hole, or area at the measurement point (CD Target).

[0083] Figure 8 is a flowchart showing the measurement process according to yet another embodiment.

[0084] Referring to Figure 8, the virtual image generation unit 100 can generate a virtual image based on at least one layer shown in the design drawing (step S130). The design drawing may include layout diagrams for each of multiple layers, and the virtual image generation unit 100 can generate virtual images in the order in which the multiple layers are stacked sequentially. Here, the virtual image does not have to include texture or style. The virtual image generation unit 100 in Figure 8 can omit the preprocessing process (step S121) shown in Figure 5 and the blurring process (step S129) shown in Figure 6. Therefore, the virtual image generation unit 100 can generate a virtual image that does not include texture or style based on the design drawing.

[0085] The measurement reference area determination unit 200 can determine the measurement reference area to be measured in the virtual image (step S230). The measurement reference area determination unit 200 can receive multiple virtual images from the virtual image generation unit 100 and can determine the measurement reference area for each of the multiple virtual images.

[0086] The object to be measured may be prepared for measurement by including at least one layer patterned according to the design drawings (step S330). The object to be measured is provided during the manufacturing process of electronic or semiconductor equipment.

[0087] The measurement target area detection unit 300 can capture an image of the measurement target and remove noise from the measured image (step S431). For example, the measurement target area detection unit 300 can remove some of the texture of the measured image by primary noise reduction and remove the remaining texture by secondary noise reduction. By removing noise from the measured image, the measurement target area detection unit 300 can simplify the measured image.

[0088] The measurement target area detection unit 300 can detect a measurement target area corresponding to the measurement reference area from a simplified actual measurement image (step S432). The measurement target area detection unit 300 can perform pattern matching of the measurement target with respect to the measurement reference area and detect a measurement target area that satisfies a preset level of agreement.

[0089] The measurement unit 400 can measure the area to be measured with respect to the measurement reference area (step S530). The measurement unit 400 can measure the line width, hole positions, and shape and size of the area to be measured. The measurement unit 400 can perform critical dimension measurements with respect to the measurement reference area. For example, the measurement unit 400 can measure the line width, holes, or area of ​​the area to be measured by performing pattern measurements of at least one of the following: overlay, refractive index, and thickness, with respect to the measurement reference area. The measurement unit 400 can measure wiring misalignment by performing overlay pattern measurements.

[0090] The measuring device 10 can pre-secure virtual images based on design drawings, eliminating the need to image the actual stacked object and set the measurement reference area each time the process progresses. The measuring device 10 can also simplify the process of generating virtual images by simplifying the actual measured images. Therefore, the measuring device 10 can perform measurements that guarantee reliability while reducing manufacturing costs and time.

[0091] Although embodiments of the present invention have been described above with reference to the attached drawings, a person with ordinary skill in the art to which the present invention belongs will understand that the present invention can be implemented in other specific forms without changing its technical idea or essential features. Therefore, the above embodiments are illustrative in all respects and should not be interpreted as limiting.

Claims

1. A virtual image generation unit generates a virtual image based on multiple layers shown in the design drawings, A measurement reference area determination unit that determines the measurement reference area to be measured in the virtual image, A measurement target area detection unit detects a measurement target area corresponding to the measurement reference area from a measurement target including multiple patterned layers based on the aforementioned design drawings. A measuring device including a measuring unit that performs measurement of the measurement target area with respect to the measurement reference area.

2. The measuring device according to claim 1, wherein the virtual image generation unit preprocesses an image including a plurality of layers shown in the design drawing to generate a preprocessed image, captures a plurality of layers stacked according to the design drawing to obtain a measured image, and generates a first virtual image based on the preprocessed image and the measured image.

3. The measuring device according to claim 2, wherein the virtual image generation unit generates the first virtual image by adjusting the loss of the preprocessed image and the loss of the measured image as shown in the following formula, so as to minimize the loss of the first virtual image. <Formula> (L: Loss of the first virtual image, α: Weight of the preprocessed image, L1: Loss of the preprocessed image, β: Weight of the measured image, L2: Loss of the measured image)

4. The measurement device according to claim 2, wherein the measurement target area detection unit detects a measurement target area corresponding to the measurement reference area of ​​the first virtual image from the measurement target on which the photoresist has been developed.

5. The measurement device according to claim 1, wherein the virtual image generation unit separates the plurality of layers shown in the design drawing layer by layer to extract a two-dimensional image, integrates the two-dimensional images and divides them according to the superposition conditions between layers, and performs image mapping according to the superposition conditions to generate a second virtual image.

6. The measuring device according to claim 5, wherein the virtual image generation unit generates the second virtual image by performing blurring processing according to the overlapping conditions between the layers after performing the image mapping.

7. The measurement device according to claim 5, wherein the measurement target area detection unit detects a measurement target area corresponding to the measurement reference area of ​​the second virtual image from the measurement target after etching using developed photoresist and cleaning of the photoresist.

8. The measurement device according to claim 1, wherein the measurement target area detection unit performs pattern matching of the measurement target with respect to the measurement reference area and detects the measurement target area that satisfies a predetermined level of agreement.

9. The measuring device according to claim 1, wherein the measuring unit performs critical dimension measurement with respect to the measurement reference area and measures the line width, holes, or area of ​​the measurement target area.

10. The measurement device according to claim 1, wherein the measurement target area detection unit removes noise from the actual measurement image captured of the measurement target, and detects the measurement target area corresponding to the measurement reference area from the noise-removed actual measurement image.

11. The steps include generating a virtual image based on multiple layers shown in the design drawings, The steps include determining the measurement reference region to be measured in the virtual image, A step of detecting a measurement target area corresponding to the measurement reference area from a measurement target including multiple layers patterned based on the aforementioned design drawing, A measurement method comprising the step of measuring the area to be measured with respect to the aforementioned measurement reference area.

12. The measurement method according to claim 11, wherein the step of generating the virtual image includes preprocessing an image containing a plurality of layers shown in the design drawing to generate a preprocessed image, capturing a plurality of layers stacked according to the design drawing to obtain a measured image, and generating a first virtual image based on the preprocessed image and the measured image.

13. The measurement method according to claim 12, wherein the step of generating the virtual image further includes a step of generating the first virtual image by adjusting the loss of the preprocessed image and the loss of the measured image as shown in the following formula, so as to minimize the loss of the first virtual image. <Formula> (L: Loss of the first virtual image, α: Weight of the preprocessed image, L1: Loss of the preprocessed image, β: Weight of the measured image, L2: Loss of the measured image)

14. The measurement method according to claim 12, wherein the step of detecting the measurement target area includes the step of detecting a measurement target area corresponding to the measurement reference area of ​​the first virtual image from the measurement target on which the photoresist has been developed.

15. The measurement method according to claim 11, wherein the step of generating the virtual image includes the steps of separating the multiple layers shown in the design drawing layer by layer to extract a two-dimensional image, integrating the two-dimensional images and dividing them according to the superposition conditions between layers, and performing image mapping according to the superposition conditions to generate a second virtual image.

16. The measurement method according to claim 15, wherein the step of generating the virtual image further includes the step of generating the second virtual image by performing blurring processing according to the overlapping conditions between the layers after performing the image mapping.

17. The measurement method according to claim 15, wherein the step of detecting the measurement target area includes etching using developed photoresist, and detecting a measurement target area corresponding to the measurement reference area of ​​the second virtual image from the measurement target from which the photoresist has been washed.

18. The measurement method according to claim 11, wherein the step of detecting the measurement target area includes a step of performing pattern matching of the measurement target with respect to the measurement reference area and detecting the measurement target area that satisfies a predetermined level of agreement.

19. The measurement method according to claim 11, wherein the step of performing the measurement includes performing a pattern measurement of at least one of overlay, refractive index, and thickness with respect to the measurement reference area, and measuring the line width, holes, or area of ​​the measurement target area.

20. The measurement method according to claim 11, wherein the step of detecting the measurement target area includes removing noise from a measured image of the measurement target, and detecting a measurement target area corresponding to the measurement reference area from the measured image from which the noise has been removed.

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