Thin film deposition apparatus cluster

The substrate processing apparatus uses laminar flow and substrate rotation to address non-uniform precursor distribution, achieving uniform deposition and reducing resource consumption by ensuring consistent processing conditions across multiple substrates.

JP2026520839APending Publication Date: 2026-06-25PICOSUN OY
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
PICOSUN OY
Filing Date
2024-06-13
Publication Date
2026-06-25

AI Technical Summary

Technical Problem

Existing substrate processing apparatuses face challenges in achieving uniform deposition of precursors across multiple substrates in a batch processing environment, leading to non-uniform processing conditions and increased resource consumption.

Method used

The apparatus employs a laminar flow reaction chamber with a fluid distributor and a vertically adjustable substrate rotation system to ensure uniform precursor distribution and substrate processing, utilizing a substrate holder that accommodates multiple substrates in a stack with gaps for laminar fluid flow and rotating the substrates during processing to mitigate non-uniformity.

Benefits of technology

This approach achieves homogeneous deposition on all substrates by ensuring uniform precursor concentration and flow, reducing processing time and resource usage while enhancing processing quality.

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Abstract

The substrate processing system (1900) comprises a receiving module (1910) configured to load and unload substrates (130) into and out of the substrate processing system, a heating module (1930) configured to heat the substrates (130), and a processing module (1950) configured to sequentially process the substrates by a self-limiting surface reaction. The processing module comprises a laminar flow reaction chamber (120), a substrate lifting system (500) for moving the substrates in a direction perpendicular to the substrate surface between an unloading / unloading state and a processing state, and a transfer unit (1910) having a robot system configured to transfer the substrates between the receiving module, the heating module, and the processing module.
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