Deposition mask for OLED pixel deposition

Abstract

The deposition mask according to the embodiment includes a metal plate having a first surface and a second surface opposite to the first surface, and a plurality of through holes formed in the metal plate, the metal plate including a deposition region and a non-deposition region, the through holes being located on the deposition region, the through holes including a large surface hole located on the first surface, a small surface hole located on the second surface, and a connecting portion connecting the large surface hole and the small surface hole, the metal plate having a first direction and a second direction perpendicular to the first direction, the large surface hole having a 1-1 height in the first direction and a 1-2 height in the second direction, the small surface hole having a 2-1 height in the first direction and a 2-2 height in the second direction, the 2-1 height being less than 30% to 50% of the thickness of the metal plate.

Description

Technical Field

[0001] The embodiments relate to a deposition mask for OLED pixel deposition.

Background Art

[0002] Display devices are applied and used in various devices. For example, the display device can be applied to small devices such as smartphones or tablet PCs. Alternatively, the display device can be applied to large devices such as TVs, monitors, or public displays PD (Public Display). Recently, the demand for ultra-high resolution UHD (Ultra High Definition) of 500 PPI (Pixel Per Inch) or more has been increasing.

[0003] Generally used display devices can be classified into LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diode) according to the driving method.

[0004] The LCD is a display device driven using liquid crystal (Liquid Crystal).

[0005] Also, the OLED is a display device driven using an organic substance.

[0006] The organic substance contained in the light emitting layer of the OLED is deposited on a substrate by an open mask OM (Open Mask) or a deposition mask. The deposited organic substance is formed in a pattern corresponding to the pattern formed on the deposition mask. Thereby, the deposited organic substance serves as a pixel. The deposition mask is defined as a fine metal mask FMM (Fine Metal Mask).

[0007] The open mask allows for the deposition of the organic material only at specific locations during the manufacturing of an OLED display. The open mask is used in a deposition process to form a light-emitting layer on the backplane after the backplane has been completed. In other words, the open mask is used when depositing a light-emitting layer with a single color of light-emitting material.

[0008] On the other hand, the fine metal mask is used to change the color of the subpixels in the resulting light-emitting layer. Therefore, the fine metal mask contains ultrafine holes. The process using the fine metal mask involves multiple steps of deposition. Therefore, precise alignment is required. This makes it more difficult than the technique that utilizes only the open mask.

[0009] When using the open mask to deposit the light-emitting layer, only one color can be formed. Therefore, a separate color filter (C / F) is required to achieve the desired color. On the other hand, when using the fine metal mask to form the RGB light-emitting layer, a separate color filter is not required. In other words, the technique using the fine metal mask is difficult. However, compared to the method using the open mask, no light-blocking filter is required, and therefore, the light efficiency is better.

[0010] The fine metal mask is generally manufactured from an Invar alloy metal sheet containing iron (Fe) and nickel (Ni). The metal sheet includes one surface and another surface opposite to the first surface. The metal sheet includes through-holes that penetrate the first surface and the other surface. The through-holes may be formed at positions corresponding to a pixel pattern. As a result, red, green, and blue organic materials are deposited onto the substrate through the through-holes. As a result, a pixel pattern can be formed on the substrate.

[0011] On the other hand, small holes are formed on one side of the metal plate, and large holes are formed on the other side of the metal plate. The through holes are connected by a connecting portion that links the small holes and the large holes.

[0012] The organic material is sprayed in the direction of the fine metal mask. The organic material enters the large pores and is deposited onto the deposition substrate by the small pores.

[0013] The red organic material, the green organic material, and the blue organic material may be deposited using the same or different masks.

[0014] For example, the red organic material, the green organic material, and the blue organic material can each be deposited using different masks.

[0015] The deposition substrate may be defined as having regions where a red pixel pattern is formed, regions where a green pixel pattern is formed, and regions where a blue pixel pattern is formed. If multiple colors are deposited in any one of these regions, the luminescence efficiency may decrease. Therefore, the luminescence efficiency of each organic material may be improved by depositing it in the region where its respective color is deposited.

[0016] On the other hand, the blue pixel pattern has the problem of having lower luminescence efficiency compared to pixel patterns of other colors. Therefore, increasing the deposition area of ​​the blue pixel pattern can improve luminescence efficiency. However, the region in which the blue pixel pattern is formed is limited.

[0017] Therefore, there is a need for a new structure of vapor deposition mask and a method for manufacturing it that can solve the above-mentioned problems.

[0018] As a technology related to the aforementioned vapor deposition mask, the Korean Public Publication KR10-2020-0058072 (2020.05.27) has been disclosed. [Overview of the project] [Problems that the invention aims to solve]

[0019] The embodiment provides a deposition mask that increases the deposition area of ​​the blue pixel pattern.

[0020] The example provides a vapor deposition mask with improved vapor deposition efficiency and rigidity. [Means for solving the problem]

[0021] The deposition mask according to the embodiment includes a metal plate having a first surface and a second surface opposite to the first surface, and a plurality of through holes formed in the metal plate, the metal plate including a deposition region and a non-deposition region, the through holes being located on the deposition region, the through holes including a large surface hole located on the first surface, a small surface hole located on the second surface, and a connecting portion connecting the large surface hole and the small surface hole, the metal plate having a first direction and a second direction perpendicular to the first direction, the large surface hole having a 1-1 height in the first direction and a 1-2 height in the second direction, the small surface hole having a 2-1 height in the first direction and a 2-2 height in the second direction, the 2-1 height being less than 30% to 50% of the thickness of the metal plate.

[0022] Furthermore, the heights of 2-1 and 2-2 are different.

[0023] Furthermore, the height of 2-2 is smaller than the height of 2-1.

[0024] Furthermore, the height of the 2-2 is 1% to 10% of the thickness of the metal plate.

[0025] Furthermore, the small facet hole includes a first interval, the first interval is defined as the distance in a first direction from one end of the second surface forming the small facet hole to one end of the communication portion, and the first interval is 3 μm or more.

[0026] Further, the large through-hole has a first-1 width in the first direction and a first-2 width in the second direction, the small through-hole has a second-1 width in the first direction and a second-2 width in the second direction, and the first interval is 35% or more of the second-1 width.

[0027] Further, the small through-hole includes a second interval, the second interval is defined as the distance in the second direction from one end of the second surface forming the small through-hole to one end of the communication portion, and the second interval is smaller than the first interval.

[0028] Further, the large through-hole has a first-1 width in the first direction and a first-2 width in the second direction, the small through-hole has a second-1 width in the first direction and a second-2 width in the second direction, and the difference between the first-2 width and the second-2 width is larger than the difference between the first-1 width and the second-1 width.

[0029] [[ID=I12]]On the other hand, a mask for vapor deposition according to another embodiment includes a metal plate including a first surface and a second surface opposite to the first surface, and a plurality of through-holes formed in the metal plate. The metal plate includes a vapor deposition region and a non-vapor deposition region. The through-holes are disposed on the vapor deposition region. The through-holes include a large through-hole disposed on the first surface, a small through-hole disposed on the second surface, and a communication portion connecting the large through-hole and the small through-hole. A first direction and a second direction perpendicular to the first direction are defined for the metal plate. On the first surface, a plurality of first island portions, a first rib, and a second rib are disposed. The first island portions are connected by the first rib and the second rib. On the second surface, a plurality of second island portions are disposed. The large through-hole has a first-1 height in the first direction and a first-2 height in the second direction. The small through-hole has a second-1 height in the first direction and a second-2 height in the second direction. The second-1 height is larger than the second-2 height. The second-1 height is less than 30% to 50% of the thickness of the metal plate. The second-2 height is 1% to 10% of the thickness of the metal plate.

[0030] Furthermore, a third rib extending in the first direction is arranged on the second surface, and the second island portion is connected by the third rib.

[0031] Furthermore, the second rib and the third rib overlap in the thickness direction of the metal plate, and the size of the second rib is larger than the size of the third rib.

[0032] Furthermore, the small facet hole includes a first interval, the first interval is defined as the distance in a first direction from one end of the second surface forming the small facet hole to one end of the communication portion, and the first interval is 3 μm or more.

[0033] Furthermore, the large face holes have a width of 1-1 in the first direction and a width of 1-2 in the second direction, and the small face holes have a width of 2-1 in the first direction and a width of 2-2 in the second direction, and twice the first interval is greater than 50% of the width of 2-1.

[0034] Furthermore, the small facet hole includes a second interval, which is defined as the distance in the second direction from one end of the second facet forming the small facet hole to one end of the communication portion, and the second interval is greater than 0 μm and up to 2 μm.

[0035] Furthermore, the large face holes have a width of 1-1 in the first direction and a width of 1-2 in the second direction, the small face holes have a width of 2-1 in the first direction and a width of 2-2 in the second direction, and twice the third spacing is less than 50% of the width of 2-1. [Effects of the Invention]

[0036] In the example, the deposition mask has controlled spacing and height of the small pores.

[0037] This can reduce the spacing between the deposition patterns deposited by the deposition mask according to the embodiment. More specifically, the deposition pattern includes a first deposition pattern on a region corresponding to a small pore and a second deposition pattern on a region not corresponding to a small pore.

[0038] As the spacing between the small pores becomes narrower, the spacing of the deposition pattern in the first direction may decrease. Also, as the height of the small pores in the first direction is controlled, the area of ​​the second deposition pattern with shadow effect may increase. This may reduce the spacing of the deposition pattern in the first direction.

[0039] Therefore, the deposition area of ​​the blue pixel pattern placed on the deposition substrate increases. This can improve the luminescence efficiency of the blue pixel pattern.

[0040] Furthermore, the shadow effect in the second direction can be reduced. Because the height of the small pores in the second direction is controlled, the area of ​​the second deposition pattern in the second direction of the shadow effect can be reduced. Therefore, it is possible to prevent a pixel pattern of a different color from the blue pixel pattern from overlapping in the second direction 2D. Consequently, the luminescence efficiency of the pixel pattern can be improved. [Brief explanation of the drawing]

[0041] [Figure 1] This is a perspective view of a vapor deposition mask according to an example. [Figure 2] This is a cross-sectional view of an organic vapor deposition apparatus including a vapor deposition mask according to an example. [Figure 3] This figure illustrates how a deposition pattern is formed using the deposition mask according to the example. [Figure 4] This diagram illustrates the position of the pixel pattern formed on the vapor-deposited substrate. [Figure 5] This is a plan view of the deposition mask according to the example. [Figure 6] This is an enlarged view of the first surface of area A in Figure 5. [Figure 7] This is an enlarged view of the second surface of area A in Figure 5. [Figure 8] These are cross-sectional views of the A-A' region in Figures 6 and 7. [Figure 9] These are cross-sectional views of the B-B' region in Figures 6 and 7. [Figure 10]This is a diagram illustrating the deposition pattern deposited by the deposition mask according to the example. [Figure 11] This is an enlarged view of area B in Figure 10. [Figure 12] This is another enlarged view of the first surface of area A in Figure 5. [Figure 13] This is another enlarged view of the second surface of area A in Figure 5. [Figure 14] Figures 12 and 13 show cross-sectional views of the C-C' region. [Figure 15] Figures 12 and 13 show cross-sectional views of the D-D' region. [Figure 16] This figure illustrates the deposition pattern deposited by a deposition mask according to another embodiment. [Figure 17] This is an enlarged view of region C in Figure 16. [Figure 18] This is a cross-sectional view of the E-E' region in Figure 17. Modes for carrying out the invention

[0042] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings. However, the technical concept of the present invention is not limited to the embodiments described, but can be realized in a variety of different forms, and within the scope of the technical concept of the present invention, one or more components of the embodiments can be selectively combined and substituted. Furthermore, terms used in the embodiments of the present invention (including technical and scientific terms) can be interpreted as generally understood by a person of ordinary skill in the art to which the present invention belongs, unless they are clearly specifically defined and described, and commonly used terms, such as predefined terms, can be interpreted considering their meaning in the context of the relevant art.

[0043] Furthermore, the terms used in the embodiments of the present invention are for illustrative purposes only and do not limit the invention. In this specification, the singular form may also include the plural form unless otherwise specified in the phrase, and when described as "A and / or at least one of B, C," it may include one or more of all combinations that can be attached to A, B, C.

[0044] Furthermore, when describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc., can be used. Such terms are merely for distinguishing a component from other components and do not limit the essence, order, or sequence of the component.

[0045] Furthermore, when it is stated that one component is “connected,” “joined,” or “connected” to another component, this includes not only cases where the component is directly connected, joined, or connected to the other component, but also cases where it is “connected,” “joined,” or “connected” by another component between that component and the other component.

[0046] Furthermore, when it is stated that a component is formed or positioned "above or below" each component, "above or below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or positioned between the two components.

[0047] Furthermore, when expressed as "up" or "down," it can include not only an upward direction based on a single component, but also a downward direction.

[0048] The vapor deposition mask according to the example will be described below with reference to the drawings.

[0049] The deposition mask described below is a fine metal mask (FMM) capable of depositing red, green, and blue organic materials onto a deposition substrate to form an RGB pixel pattern on the substrate. The following description does not apply to open masks (OM).

[0050] Figures 1 to 3 are diagrams illustrating the process of depositing organic material onto a deposition substrate 300 using the deposition mask 100 according to the embodiment.

[0051] Figure 1 is a perspective view of a deposition mask according to an embodiment. Figure 2 is a cross-sectional view of an organic deposition apparatus including the deposition mask according to an embodiment. Figure 3 is a diagram illustrating how a deposition pattern is formed on a deposition substrate by the deposition mask.

[0052] Referring to Figures 1 to 3, the organic material deposition apparatus includes a deposition mask 100, a mask frame 200, a deposition substrate 300, an organic material deposition container 400, and a vacuum chamber 500.

[0053] The deposition mask 100 contains a metal. For example, the deposition mask contains iron (Fe) and nickel (Ni). More specifically, for example, the deposition mask contains an Invar alloy containing iron (Fe) and nickel (Ni).

[0054] The deposition mask 100 may include an effective portion and an ineffective portion. The effective portion is a region where organic material is deposited. The ineffective portion is a region where organic material is not deposited. The deposition mask 100 may include a plurality of through holes formed in the effective portion. The through holes are formed at positions corresponding to patterns formed on the deposition substrate.

[0055] The mask frame 200 includes an opening 205. The through-hole is positioned on the region corresponding to the opening 205. As a result, the organic material sprayed from the organic material deposition container 400 is deposited onto the deposition substrate 300 through the through-hole. The deposition mask 100 is fixed onto the mask frame 200. For example, the deposition mask 100 is pulled with a set tensile force. Subsequently, the deposition mask 100 is fixed onto the mask frame 200 by welding.

[0056] For example, the ineffective part of the vapor deposition mask 100 is welded to the mask frame 200. This fixes the vapor deposition mask 100 to the mask frame 200. The portion of the vapor deposition mask 100 that is located outside the mask frame 200 can be cut and removed.

[0057] The mask frame 200 contains a highly rigid metal. This reduces deformation of the mask frame when welding the vapor deposition mask 100 to the mask frame 200.

[0058] The deposition substrate 300 is a substrate used in the manufacture of a display device. For example, the deposition substrate 300 is a substrate for depositing organic material for OLED pixel patterns. Red, green, and blue organic material patterns for forming pixels are formed on the deposition substrate 300. In other words, an RGB pattern is formed on the deposition substrate 300.

[0059] The organic material deposition container 400 is a crucible. An organic material is placed inside the crucible. The organic material deposition container 400 moves within the vacuum chamber 500. For example, the organic material deposition container 400 moves within the vacuum chamber 500 in the width direction of the deposition mask 100. That is, the organic material deposition container 400 moves within the vacuum chamber 500 in a direction perpendicular to the longitudinal direction of the deposition mask 100.

[0060] The vacuum chamber 500 supplies a heat source and electric current to the organic material deposition container 400. As a result, the organic material is deposited onto the deposition substrate 300.

[0061] Referring to Figure 3, the deposition mask 100 includes a metal plate 10. The metal plate includes a first surface 1S and a second surface 2S opposite to the first surface.

[0062] Surface holes are formed on the first surface 1S and the second surface 2S, respectively. More specifically, a plurality of large surface holes V1 may be formed on the first surface 1S, and a plurality of small surface holes V2 may be formed on the second surface 2S.

[0063] The metal plate 10 may include a plurality of through holes. These through holes may be formed by large face holes V1 and small face holes V2. In particular, the large face holes V1 and the small face holes V2 are connected by a communication portion CA. As a result, the metal plate 10 may include through holes penetrating the first surface 1S and the second surface 2S.

[0064] The width of the large surface hole V1 is greater than the width of the small surface hole V2. The width of the large surface hole V1 is measured on the first surface 1S. The width of the small surface hole V2 is measured on the second surface 2S.

[0065] The width of the connecting portion CA can have a set size. Specifically, the width of the connecting portion CA may be 15 μm to 33 μm, 19 μm to 33 μm, or 20 μm to 27 μm. If the width of the connecting portion CA exceeds 33 μm, it may become difficult to achieve a resolution of 500 PPI or higher. Also, if the width of the connecting portion CA is less than 15 μm, deposition defects may occur.

[0066] The large surface pore V1 is positioned opposite the organic material deposition container 400. This allows the organic material ejected from the organic material deposition container 400 to easily enter the large surface pore V1.

[0067] The small facet holes V2 are positioned opposite the deposition substrate 300. The small facet holes V2 are positioned adjacent to the deposition substrate 300.

[0068] As a result, the organic material contained in the large surface pores V1 passes through the small surface pores V2 and is deposited onto the deposition substrate 300. This can result in the formation of one of the following pixel patterns on the deposition substrate 300: red, green, or blue. By repeating the above process, all of the red, green, and blue pixel patterns can be formed on the deposition substrate 300.

[0069] For example, the red pixel pattern, green pixel pattern, and blue pixel pattern can be deposited using different deposition masks. For instance, the blue pixel pattern can be deposited first, followed by the red and green pixel patterns.

[0070] The red pixel pattern, green pixel pattern, and blue pixel pattern can be formed in a variety of sizes and shapes.

[0071] Figure 4 is a diagram illustrating the position of the pixel pattern formed on the deposition substrate 300.

[0072] Referring to Figure 4, the deposition substrate 300 may include a first region 1A and a second region 2A. Pixel patterns of different colors may be deposited on the first region 1A and the second region 2A. For example, a blue pixel pattern may be deposited on the first region 1A.

[0073] Furthermore, the red pixel pattern and the green pixel pattern can be deposited in the second region 2A.

[0074] Therefore, the first region 1A may have a pixel pattern of the same color deposited in the first direction 1D. Similarly, the second region 2A may have a pixel pattern of the same or different colors deposited in the first direction 1D.

[0075] Furthermore, the deposition substrate 300 can have pixel patterns of different colors deposited in the second direction 2D. As a result, the blue pixel pattern deposited in the first region 1A does not interfere with the pixel patterns of different colors in the first direction 1D.

[0076] Therefore, arranging the blue pixel pattern so that it is connected in the first direction 1D can improve the deposition area of ​​the pattern. This can improve the luminous efficiency of the display device.

[0077] However, if the through-holes in the deposition mask 100 are formed in a single hole, the strength of the deposition mask may decrease. That is, the residual metal in the deposition mask decreases, which can reduce the strength of the deposition mask. Also, when the deposition mask is stretched, the warping of the deposition mask may increase.

[0078] Therefore, there is a need for a deposition mask that can solve the above-mentioned problems while improving the deposition area of ​​the pixel pattern arranged in the first region 1A.

[0079] The following describes a vapor deposition mask that can solve the above problems, referring to Figures 5 to 17.

[0080] Figure 5 is a plan view of the deposition mask 100 according to the embodiment.

[0081] Referring to Figure 5, the deposition mask 100 according to the embodiment includes a metal plate 10. The metal plate 10 includes a deposition region DA and a non-deposition region NDA.

[0082] The deposition region DA is a region for forming a deposition pattern. The deposition region DA includes a patterned region and a non-patterned region. The patterned region includes small face holes V2, large face holes V1, through holes, island portions, and ribs. The non-patterned region does not include small face holes V2, large face holes V1, through holes, island portions, and ribs.

[0083] Furthermore, the deposition region DA includes a plurality of effective parts AA1, AA2, and AA3. This allows the deposition mask 100 to form multiple deposition patterns.

[0084] The deposition region DA includes a plurality of separation regions IA1 and IA2. The separation regions IA1 and IA2 are positioned between adjacent effective regions. The separation regions IA1 and IA2 are separation regions between the plurality of effective regions. The separation regions IA1 and IA2 can distinguish between adjacent effective regions. Furthermore, one deposition mask 100 can support multiple effective regions.

[0085] The non-deposition region (NDA) is a region that does not participate in deposition. The deposition mask 100 can be fixed to the mask frame 200 by the non-deposition region (NDA). In particular, the non-deposition region (NDA) includes frame fixing regions FA1 and FA2. The non-deposition region (NDA) may also include half-etched portions HF1 and HF2 and open portions.

[0086] When the deposition mask 100 is stretched, the stress can be distributed by the half-etched portions HF1 and HF2.

[0087] Furthermore, when the deposition mask 100 is stretched, the open section allows for uniform stress distribution. This reduces deformation of the deposition mask.

[0088] The vapor deposition mask according to the first embodiment will be described below with reference to Figures 6 to 11.

[0089] Figures 6 and 7 are enlarged views of area A in Figure 5.

[0090] Referring to Figures 6 and 7, the deposition mask 100 may include through-holes. More specifically, the deposition mask 100 may include a plurality of unit through-holes UTH.

[0091] Referring to Figure 6, multiple large surface holes V1 are formed on the first surface 1S. In addition, multiple first island portions IS1 and multiple ribs are formed on the first surface 1S.

[0092] The island portion is defined as an unetched surface. The island portion is defined as the region with the greatest thickness on the first surface 1S. The first island portion IS1 may be identical to the first surface 1S.

[0093] The ribs include a first rib RB1 and a second rib RB2. The first rib RB1 extends in the first direction 1D, and the second rib RB2 extends in the second direction 2D. The ribs are defined as partially etched surfaces. The plurality of first island portions IS1 are connected by the first rib RB1 and the second rib RB2. The thickness of the first island portion IS1 is greater than the thickness of the ribs.

[0094] Referring to Figure 7, a plurality of small facet holes V2 are formed on the second surface 2S. A plurality of second island portions IS2 are formed on the second surface 2S. The plurality of second island portions IS2 are connected to each other. The second island portions IS2 may be identical to the second surface 2S.

[0095] The area of ​​the first island portion IS1 and the area of ​​the second island portion IS2 may be different. More specifically, the area of ​​the second island portion IS2 is larger than the area of ​​the first island portion IS1.

[0096] Figure 8 is a cross-sectional view taken along line A-A' in Figures 6 and 7. In other words, Figure 8 is a cross-sectional view in the first direction 1D. Figure 9 is a cross-sectional view taken along line B-B' in Figures 6 and 7. In other words, Figure 9 is a cross-sectional view in the second direction 2D.

[0097] Referring to Figure 8, the unit through-hole UTH can have a set size. The unit through-hole UTH is formed by the large face hole V1, the small face hole V2, and the connecting portion CA.

[0098] The large surface hole V1 and the small surface hole V2 may have a set size.

[0099] The large surface hole V1 may have a first-first height H1-1. More specifically, the large surface hole V1 may have the first-first height H1-1 in the first direction 1D. The first-first height H1-1 is defined as the vertical height from the first surface 1S to the communication portion CA.

[0100] The small face hole V2 may have a second-first height H2-1. More specifically, the small face hole V2 may have the second-first height H2-1 in the first direction 1D. The second-first height H2-1 is defined as the vertical height from the second surface 2S to the communication portion CA.

[0101] The 1-1 height H1-1 and the 2-1 height H2-1 may be different. The 1-1 height H1-1 may be greater than the 2-1 height H2-1. The 2-1 height H2-1 may have a set size. The 2-1 height H2-1 may be less than half the thickness T of the metal plate. More specifically, the 2-1 height H2-1 may be 30% to less than 50%, 35% to 45%, or 38% to 43% of the thickness T of the metal plate.

[0102] For example, the thickness T of the metal plate may be 15 μm to 50 μm, 20 μm to 45 μm, or 25 μm to 40 μm. The height H2-1 may be 30% to less than 50%, 35% to 45%, or 38% to 43% of the thickness T of the metal plate within the thickness range of the metal plate.

[0103] If the height H2-1 is less than 30% of the thickness T of the metal plate, the width W-1 of the first facet hole may become smaller. This may reduce the area of ​​the deposition pattern deposited by the facet hole V2. Consequently, the luminescence efficiency of the deposition pattern may decrease. Also, if the height H2-1 is 50% or more of the thickness T of the metal plate, the area of ​​metal removed from the metal plate 10 increases. This may reduce the strength of the metal plate.

[0104] The large surface hole V1 may have a first-first width W1-1. More specifically, the large surface hole V1 may have the first-first width W1-1 in the first direction 1D. The first-first width W1-1 may be defined as the distance between adjacent second ribs RB2.

[0105] The small facet hole V2 may have a second-first width W2-1. More specifically, the small facet hole V2 may have the second-first width W2-1 in the first direction 1D. The second-first width W2-1 may be defined as the distance between adjacent second faces 2S.

[0106] The widths W1-1 and W2-1 mentioned above may be different. The widths W1-1 may be larger than the widths W2-1 mentioned above.

[0107] A first interval G1 may be defined in the small face hole V2. The first interval may be defined as the distance in a first direction 1D from one end of the second surface 2S forming the small face hole to one end of the communication portion.

[0108] The first interval G1 may be 3 μm or more, 5 μm or more, or 7 μm or more. The first interval G1 may be 35% or more, 40% or more, or 45% or more of the second-1 width W2-1. Therefore, twice the first interval G1 can exceed 50% of the second-1 width W2-1.

[0109] The first interval G1 can be proportional to the second-first height H2-1. More specifically, as the second-first height H2-1 increases, the first interval G1 can increase. The deposition mask 100 according to the first embodiment forms the second-first height H2-1 within a set range. This increases the first interval G1. Furthermore, the width of the small facet holes V2 increases as the first interval G1 increases.

[0110] Therefore, the shadow effect of the organic matter emanating from the small pores V2 can be increased. The shadow effect can be defined as the degree of diffusion of the organic matter emanating from the small pores V2. The shadow effect can also be defined as the area of ​​organic matter deposited in regions other than the region of the deposition substrate corresponding to the small pores.

[0111] The deposition mask according to the first embodiment includes small holes having a first spacing. This can increase the shadow effect in the first direction. Consequently, the spacing of the deposition pattern in the first direction becomes smaller. This increases the area of ​​the deposition pattern formed on the deposition substrate 300. This can improve the luminescence efficiency of the deposition pattern.

[0112] Referring to Figure 9, the unit through-hole UTH can have a set size. The unit through-hole UTH is formed by the large face hole V1, the small face hole V2, and the connecting portion CA.

[0113] The large surface hole V1 and the small surface hole V2 may have a set size.

[0114] The large surface hole V1 may have a first-second height H1-2. More specifically, the large surface hole V1 may have the first-second height H1-2 in the second direction 2D. The first-second height H1-2 is defined as the vertical height from the first surface 1S to the communication portion CA.

[0115] The small face hole V2 may have a second-second height H2-2. More specifically, the small face hole V2 may have the second-second height H2-2 in the second direction 2D. The second-second height H2-2 is defined as the vertical height from the second surface 2S to the communication portion CA.

[0116] The above-mentioned heights H1-2 and H2-2 may be different. The above-mentioned heights H1-2 may be greater than the above-mentioned heights H2-2.

[0117] The 1-1 height H1-2 and the 1-2 height H1-2 may be different. More specifically, the 1-2 height H1-2 may be greater than the 1-1 height H1-2.

[0118] Furthermore, the 2-1 height H2-1 and the 2-2 height H2-2 may be different. More specifically, the 2-2 height H2-2 may be smaller than the 2-1 height H2-1. For example, the 2-2 height H2-2 may be 10% or less of the thickness T of the metal plate. More specifically, the 2-2 height H2-2 may be 1% to 10%, 2% to 9%, or 3% to 8% of the thickness T of the metal plate.

[0119] Therefore, the height of the small face hole V2 may differ from the height of the small face hole in the first direction 1D. More specifically, the height of the small face hole in the first direction 1D may be greater than the height of the small face hole in the second direction 2D.

[0120] The large surface hole V1 may have a first-second width W1-2. More specifically, the large surface hole V1 may have the first-second width W1-2 in the second direction 2D. The first-second width W1-2 may be defined as the distance between adjacent first ribs RB1.

[0121] The small facet hole V2 may have a second-second width W2-2. More specifically, the small facet hole V2 may have the second-second width W2-2 in the second direction 2D. The second-second width W2-2 may be defined as the distance between adjacent second faces 2S.

[0122] The above-mentioned widths 1-2 W1-2 and 2-2 W2-2 may be different. The above-mentioned widths 1-2 W1-2 may be larger than the above-mentioned widths 2-2 W2-2.

[0123] Furthermore, the difference between the 1-1 width W1-1 and the 2-1 width W2-1, and the difference between the 1-2 width W1-2 and the 2-2 width W2-2, may be different. More specifically, the difference between the 1-2 width W1-2 and the 2-2 width W2-2 may be greater than the difference between the 1-1 width W1-1 and the 2-1 width W2-1.

[0124] A second interval G2 may be defined in the small face hole V2. The second interval may be defined as the distance in the second direction 2D from one end of the second surface 2S forming the small face hole to one end of the communication portion.

[0125] The second interval G2 may differ from the first interval G1. More specifically, the second interval G2 may be smaller than the first interval G1.

[0126] The second interval G2 may be 2 μm or less. More specifically, the second interval G2 may be greater than 0 μm to 2 μm, 0.1 μm to 1.5 μm, or 0.5 μm to 1 μm. The second interval G2 may be 20% or less, 10% or less, or 5% or less of the second-second width W2-2. Therefore, twice the second interval G2 may be less than 50% of the second-second width W2-2.

[0127] The second spacing G2 can be proportional to the second-second height H2-2. More specifically, as the second-second height H2-2 decreases, the second spacing G2 can decrease. The deposition mask 100 according to the first embodiment forms the second-second height H2-2 within a set range. This reduces the second spacing G2. Also, an increase in the second spacing G2 reduces the width of the small pores V2.

[0128] Therefore, the shadow effect of organic matter emanating from the small pores V2 can be reduced. Specifically, the deposition mask according to the first embodiment includes small pores having a second spacing. This reduces the shadow effect in the second direction. Therefore, it is possible to prevent the pattern deposited in the first region 1A from overlapping with the pattern deposited in the second region 2A. This improves the deposition efficiency of the deposition mask.

[0129] Furthermore, the area of ​​the metal plate remaining in the second direction increases. Consequently, the strength of the deposition mask is improved. Therefore, warping of the deposition mask can be prevented.

[0130] Figures 10 and 11 are diagrams illustrating the deposition pattern deposited by the deposition mask according to the first embodiment.

[0131] Referring to Figures 10 and 11, the deposition substrate 300 includes a first region 1A and a second region 2A. Pixel patterns are formed on the first region 1A and the second region 2A. For example, a blue pixel pattern may be formed on the first region 1A. A red pixel pattern and a green pixel pattern may be formed on the second region 2A.

[0132] The blue pixel pattern may include a first deposition pattern DP1 and a second deposition pattern DP2. The first deposition pattern DP1 is a pattern corresponding to the small pores V2. The second deposition pattern DP2 is a pattern that does not correspond to the small pores V2. In particular, the second deposition pattern DP2 is a pattern deposited by the shadow effect.

[0133] The second deposition pattern DP2 may include a first shadow pattern S1 and a second shadow pattern S2. The first shadow pattern S1 is a shadow pattern that extends in the first direction 1D. The second shadow pattern S2 is a shadow pattern that extends in the second direction 2D.

[0134] The first shadow pattern S1 has a third-first width W3-1. The second shadow pattern S2 has a third-second width W3-2. The third-first width W3-1 may be larger than the third-second width W3-2. In particular, because the first interval G1 is larger than the second interval G2, the width of the first shadow pattern extending in the first direction may be larger.

[0135] This can reduce the spacing between the deposition patterns DP. Specifically, the first deposition pattern DP1 is spaced apart by a first spacing D1. However, the second deposition pattern DP2 can reduce the spacing between the deposition patterns DP. That is, because the width of the first shadow pattern S1 increases, the spacing between the deposition patterns DP can be reduced to a second spacing D2. Specifically, the second spacing D2 can be reduced to less than 10 μm. Therefore, the deposition area of ​​the blue pixel pattern located in the first region 1A increases. This can improve the luminescence efficiency of the blue pixel pattern.

[0136] Furthermore, the width of the second shadow pattern S2 is formed to be small. Therefore, it is possible to prevent a pixel pattern of a different color from the blue pixel pattern from overlapping in the second direction 2D. Consequently, the luminescence efficiency of the pixel pattern can be improved.

[0137] The vapor deposition mask according to the second embodiment will be described below with reference to Figures 12 to 17. Descriptions that are the same as or similar to those of the first embodiment will be omitted. Components identical to those of the first embodiment will be denoted by the same reference numerals in the drawings.

[0138] Figures 12 and 13 are other enlarged views of area A in Figure 5.

[0139] Referring to Figures 12 and 13, the deposition mask 100 may include through-holes. More specifically, the deposition mask 100 may include a plurality of unit through-holes UTH.

[0140] Referring to Figure 12, multiple large surface holes V1 are formed on the first surface 1S. In addition, multiple first island portions IS1 and multiple ribs are formed on the first surface 1S.

[0141] The ribs include a first rib RB1 and a second rib RB2. The first rib RB1 extends in the first direction 1D, and the second rib RB2 extends in the second direction 2D. The ribs are defined as partially etched surfaces. The plurality of first island portions IS1 are connected by the first rib RB1 and the second rib RB2. The thickness of the first island portion IS1 is greater than the thickness of the ribs.

[0142] Referring to Figure 13, a plurality of small facet holes V2 are formed on the second surface 2S. A plurality of second island portions IS2 and a plurality of third ribs RB3 are formed on the second surface 2S. The third ribs RB3 extend in the first direction 1D. The plurality of second island portions IS2 are connected to each other by the third ribs RB3.

[0143] The area of ​​the first island portion IS1 and the area of ​​the second island portion IS2 may be different. More specifically, the area of ​​the second island portion IS2 is larger than the area of ​​the first island portion IS1.

[0144] Figure 14 is a cross-sectional view taken along the line C-C' in Figures 12 and 13. In other words, Figure 14 is a cross-sectional view in the first direction 1D. Figure 15 is a cross-sectional view taken along the line D-D' in Figures 12 and 13. In other words, Figure 15 is a cross-sectional view in the second direction 2D.

[0145] Referring to Figure 14, the unit through-hole UTH can have a set size. The unit through-hole UTH is formed by the large face hole V1, the small face hole V2, and the connecting portion CA.

[0146] The large surface hole V1 and the small surface hole V2 may have a set size.

[0147] The large surface hole V1 may have a first-first height H1-1. More specifically, the large surface hole V1 may have the first-first height H1-1 in the first direction 1D. The first-first height H1-1 is defined as the vertical height from the first surface 1S to the communication portion CA.

[0148] The small face hole V2 may have a second-first height H2-1. More specifically, the small face hole V2 may have the second-first height H2-1 in the first direction 1D. The second-first height H2-1 is defined as the vertical height from the second surface 2S to the communication portion CA.

[0149] Furthermore, the large surface hole V1 may have a first-first width W1-1. More specifically, the large surface hole V1 may have the first-first width W1-1 in the first direction 1D. The first-first width W1-1 may be defined as the distance between adjacent second ribs RB2.

[0150] The small facet hole V2 may have a second-first width W2-1. More specifically, the small facet hole V2 may have the second-first width W2-1 in the first direction 1D. The second-first width W2-1 may be defined as the distance between adjacent second faces 2S.

[0151] The above-mentioned heights 1-1 H1-1 and 2-1 H2-1 may be the same as or similar to those in the first embodiment described above.

[0152] Furthermore, the widths W1-1 and W2-1 of the first embodiment described above may be the same as or similar to those of the first embodiment.

[0153] The first surface 1S and the second surface 2S may each include ribs. The first surface 1S may include the first rib RB1 and the second rib RB2. The second surface 2S may include the third rib RB3.

[0154] The deposition mask according to the second embodiment can control the inclination angle θ of the inner surface of the small pores V2. As a result, the third rib RB3 can be formed on the second surface 2S. The third rib RB3 can reduce the spacing between the small pores V2.

[0155] This can reduce the spacing between the deposition patterns deposited by the deposition mask according to the second embodiment. Consequently, the area of ​​the deposition patterns can increase.

[0156] The second rib RB2 and the third rib RB3 may overlap in the thickness direction of the metal plate. The sizes of the second rib RB2 and the third rib RB3 may be different. Specifically, the size of the second rib RB2 may be larger than the size of the third rib RB3. Specifically, the width of the second rib RB2 in the first direction 1D may be different from the width of the third rib RB3 in the first direction 1D. The width of the third rib RB3 in the first direction 1D may be larger than the width of the second rib RB2 in the first direction 1D.

[0157] A first interval G1 may be defined in the small face hole V2. The first interval may be defined as the distance in a first direction 1D from one end of the second surface 2S forming the small face hole to one end of the communication portion.

[0158] The first interval G1 may be 3 μm or more, 5 μm or more, or 7 μm or more. The first interval G1 may be 35% or more, 40% or more, or 45% or more of the second-1 width W2-1. Therefore, twice the first interval G1 can exceed 50% of the second-1 width W2-1.

[0159] The first interval G1 can be proportional to the second-first height H2-1. More specifically, as the second-first height H2-1 increases, the first interval G1 can increase. The deposition mask 100 according to the first embodiment forms the second-first height H2-1 within a set range. This increases the first interval G1. In addition, the width of the small facet holes V2 increases as the first interval G1 increases.

[0160] Therefore, the shadow effect of the organic matter emanating from the small pores V2 can be increased. The shadow effect can be defined as the degree of diffusion of the organic matter emanating from the small pores V2. The shadow effect can also be defined as the area of ​​organic matter deposited in regions other than the region of the deposition substrate corresponding to the small pores.

[0161] The deposition mask according to the second embodiment includes small holes having a first spacing. This can increase the shadow effect in the first direction. Therefore, the thickness of the deposition pattern can be made uniform. In particular, the thickness of the deposition pattern on the region corresponding to the outer region of the small holes may be smaller than the thickness of the deposition pattern on the region corresponding to the inner region of the small holes. The increase in the shadow effect can increase the thickness of the deposition pattern on the outer region. This can make the thickness of the deposition pattern uniform.

[0162] Furthermore, in the regions not corresponding to the small pores, a deposition pattern is formed due to the shadow effect. As a result, the thickness of the deposition pattern in the regions not corresponding to the small pores may be less than the thickness of the deposition pattern in the regions corresponding to the small pores. Therefore, the shadow effect may be increased, and the thickness of the deposition pattern in the regions not corresponding to the small pores may become thicker. For example, the shadow effects of adjacent unit through-holes may overlap, resulting in a thicker deposition pattern in the regions not corresponding to the small pores. Therefore, the thickness of the deposition pattern can be uniform overall.

[0163] Figures 16 to 18 are diagrams illustrating the deposition pattern deposited by the deposition mask according to the second embodiment.

[0164] Referring to Figures 16 to 18, the deposition substrate 300 includes a first region 1A and a second region 2A. Pixel patterns are formed on the first region 1A and the second region 2A. For example, a blue pixel pattern may be formed on the first region 1A. A red pixel pattern and a green pixel pattern may be formed on the second region 2A.

[0165] The blue pixel pattern may include a first deposition pattern DP1 and a second deposition pattern DP2. The first deposition pattern DP1 is a pattern corresponding to the small pores V2. The second deposition pattern DP2 is a pattern that does not correspond to the small pores V2. In particular, the second deposition pattern DP2 is a pattern deposited by the shadow effect.

[0166] The first deposition pattern DP1 may include the first-first deposition pattern DP1-1 and the first-second deposition pattern DP1-2. The first-first deposition pattern DP1-1 and the first-second deposition pattern DP1-2 are patterns deposited by adjacent small pores V2.

[0167] The second deposition pattern DP2 is positioned between the first-1 deposition pattern DP1-1 and the first-2 deposition pattern DP1-2. As a result, the first-1 deposition pattern DP1-1 and the first-2 deposition pattern DP1-2 are positioned almost adjacent to each other. In detail, the distance between the first-1 deposition pattern DP1-1 and the first-2 deposition pattern DP1-2 can be zero or close to zero.

[0168] This can reduce the spacing of the deposition patterns DP. Specifically, the spacing of the deposition patterns DP can be reduced because the spacing of the small pores is reduced. Furthermore, the second deposition pattern can cause the spacing of the deposition patterns DP to be 0 or close to 0. Consequently, the deposition area of ​​the blue pixel pattern located in the first region 1A increases. This can improve the luminescence efficiency of the blue pixel pattern.

[0169] Furthermore, because the spacing between the small holes is reduced, the second deposition patterns of adjacent unit through-holes can overlap each other. Therefore, the thickness of the first deposition pattern DP1 and the thickness of the second deposition pattern DP2 can become uniform. Consequently, the deposition efficiency of the deposition patterns can be improved.

[0170] Referring to Figure 18, in the case of Figure 18(a), the spacing between adjacent first deposition patterns DP1 is large. This means that the thickness of the second deposition pattern deposited due to the shadow effect may be smaller.

[0171] On the other hand, referring to Figure 18(b), the spacing between adjacent first deposition patterns DP1 is small. As a result, the second deposition patterns DP2, which are deposited by the shadow effect, may be arranged to overlap each other. This may increase the thickness of the second deposition pattern DP2. As a result, the thickness difference between the first deposition pattern DP1 and the second deposition pattern DP2 may decrease.

[0172] The features, structures, and effects described in the above-described embodiments are included in at least one embodiment of the present invention and are not necessarily limited to just one embodiment. Furthermore, the features, structures, and effects exemplified in each embodiment can be combined or modified and implemented in other embodiments by a person with ordinary skill in the art to which the embodiment belongs. Therefore, such combinations and modifications should be interpreted as being within the scope of the present invention.

[0173] Furthermore, although the above description has focused on embodiments, these are merely illustrative examples and do not limit the present invention. Anyone with ordinary skill in the art to which the present invention belongs will understand that a variety of modifications and applications not exemplified above are possible, without departing from the essential characteristics of these embodiments. For example, each component specifically shown in the embodiments can be modified and implemented. Such differences related to modifications and applications should be interpreted as falling within the scope of the present invention as defined in the attached claims.

Claims

1. A metal plate including a first surface and a second surface opposite to the first surface, The metal plate includes a plurality of through holes formed therein, The metal plate includes a vapor-deposited region and a non-vapor-deposited region. The through-hole is located on the deposition region, The through hole includes a large hole located on the first surface, a small hole located on the second surface, and a connecting portion connecting the large hole and the small hole. The metal plate has a first direction and a second direction perpendicular to the first direction defined. The large surface hole has a first-first height in the first direction and a first-second height in the second direction, The small facet hole has a second-first height in the first direction and a second-second height in the second direction, The above-mentioned height 2-1 is 30% to less than 50% of the thickness of the metal plate, wherein it is a vapor deposition mask.

2. The vapor deposition mask according to claim 1, wherein the heights of the 2-1 and 2-2 are different.

3. The vapor deposition mask according to claim 1, wherein the height of the 2-2 is smaller than the height of the 2-1.

4. The vapor deposition mask according to claim 3, wherein the height of the 2-2 is 1% to 10% of the thickness of the metal plate.

5. The aforementioned small facet hole includes a first interval, The first interval is defined as the distance in the first direction from one end of the second surface forming the small face hole to one end of the communication portion. The deposition mask according to claim 1, wherein the first interval is 3 μm or more.

6. The large surface hole has a first-1 width in the first direction and a first-2 width in the second direction, The small facet hole has a second-first width in the first direction and a second-second width in the second direction. The vapor deposition mask according to claim 4, wherein the first interval is 35% or more of the second-first width.

7. The aforementioned small facet hole includes a second interval, The second interval is defined as the distance in the second direction from one end of the second surface forming the small face hole to one end of the communication portion. The vapor deposition mask according to claim 5, wherein the second interval is smaller than the first interval.

8. The large surface hole has a first-1 width in the first direction and a first-2 width in the second direction, The small facet hole has a second-first width in the first direction and a second-second width in the second direction. The vapor deposition mask according to claim 1, wherein the difference between the first-second width and the second-second width is greater than the difference between the first-first width and the second-first width.

9. A metal plate including a first surface and a second surface opposite to the first surface, The metal plate includes a plurality of through holes formed in the metal plate, The metal plate includes a vapor-deposited region and a non-vapor-deposited region. The through-hole is located on the deposition region, The through hole includes a large hole located on the first surface, a small hole located on the second surface, and a connecting portion that connects the large hole and the small hole. The metal plate has a first direction and a second direction perpendicular to the first direction defined. Multiple first island portions, first ribs, and second ribs are arranged on the first surface. The first island portion is connected by the first rib and the second rib, Multiple second island sections are arranged on the second surface. The large surface hole has a first-first height in the first direction and a first-second height in the second direction, The small facet hole has a second-first height in the first direction and a second-second height in the second direction, The height of 2-1 is greater than the height of 2-2. The height described in 2-1 above is 30% to less than 50% of the thickness of the metal plate. The height of the 2-2 is 1% to 10% of the thickness of the metal plate, in a vapor deposition mask.

10. A third rib extending in the first direction is further arranged on the second surface. The vapor deposition mask according to claim 9, wherein the second island portion is connected by the third rib.

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