Method for manufacturing a semiconductor structure and semiconductor structure
By employing a carrier substrate with an adhesive layer and rewiring layer to facilitate the reuse of silicon substrates, the method addresses the high cost issue in semiconductor packaging by reducing material waste and enhancing process efficiency.
JP2026521811APending Publication Date: 2026-07-01CR RUNAN TECHNOLOGIES (CHONGQING) CO LTD +1
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- CR RUNAN TECHNOLOGIES (CHONGQING) CO LTD
- Filing Date
- 2024-08-27
- Publication Date
- 2026-07-01
AI Technical Summary
Technical Problem
The high cost of semiconductor packaging processes is attributed to the consumption and non-reusability of silicon substrates in existing technologies.
Method used
A method involving the use of a carrier substrate with an adhesive layer to mount electrical elements, forming a mold layer, removing the carrier substrate, and creating a rewiring layer connected to protruding bumps, allowing for the reuse of the carrier substrate and reducing material waste.
Benefits of technology
This approach reduces manufacturing costs by enabling the reuse of carrier substrates and improving the efficiency of semiconductor packaging processes.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026521811000001_ABST
Abstract
The present invention provides a method for manufacturing a semiconductor structure. The method for manufacturing a semiconductor structure includes the steps of: providing an adhesive layer on one side of a carrier substrate; arranging one or more electrical elements on the side of the adhesive layer opposite to the carrier substrate, wherein at least one electrical element includes a body and a bump protruding from the body, the bump facing the carrier substrate and positioned such that at least a portion of the bump is inside the adhesive layer; forming a mold layer on the adhesive layer to seal at least the side of the electrical element; removing the carrier substrate and the adhesive layer, thereby exposing the portion of the bump that is inside the adhesive layer; and forming a redistribution layer on the side of the electrical element where the bump is provided, wherein the redistribution layer is electrically connected to the bump.
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