Cooling system for immersion cooling of electronic components

Abstract

The present invention relates to a cooling system (1) for immersion cooling of electronic components, wherein the cooling system (1) is - A container (3) that can be filled with a two-phase heat transfer fluid, in which electronic components can be immersed in the liquid phase, and which has a gaseous space on the surface of the liquid heat transfer fluid, -A heat exchanger is provided within the gas space of container (3) and forms a liquid heat transfer fluid. -At least one condenser unit (7), the condenser unit (7) is in contact with the gas space of the container (3) by at least one fluid inlet opening (71) and at least one fluid outlet opening (72) for mass exchange of a gaseous medium to the condenser unit (7) and a liquid medium from the condenser unit (7), and comprises at least one condenser unit (7) having an outlet (79) for discharging the residual gas phase, - The condenser unit (7) is housed in a housing (74) that encloses a bundle of tubes (73) having heat exchanger tubes (731) extending parallel to each other in the axial direction behind at least one fluid inlet opening (71) in the flow direction (S), thereby forming a flow path (75) within the housing (74). - The tube bundle (73) is arranged inside the housing (74) such that the gaseous medium flows in the flow path (75) along the axial direction of the heat exchanger tube (731).

Description

Technical Field

[0001] The present invention relates to a cooling system for liquid immersion cooling of electronic components, as described in the preamble of claim 1.

Background Art

[0002] A cooling system for liquid immersion cooling is an effective cooling solution for electronic components that generate a lot of heat during operation, for example as a two-phase immersion cooling system. When the component is immersed in a two-phase heat transfer fluid having a preferably low boiling point, the heat generated from the electronic component vaporizes the surrounding liquid heat transfer fluid, thereby dissipating the heat from the electronic component. The gaseous heat transfer fluid is liquefied by a condenser and then returned to the reservoir for cooling.

[0003] From Patent Document 1, a two-phase immersion cooling system having a cooling tank is known. A condensation chamber that condenses the gaseous fluid generated during the cooling process is connected to the liquid fluid in the cooling tank. Here, the heat-generating electronic component is in the cooling medium in the cooling tank, and a vapor bypass structure is arranged above it. The vaporized fluid is sent to the condensation chamber for liquefaction using the vapor bypass structure. The condensation chamber is inside the cooling tank.

[0004] Patent Document 2 describes a two-phase immersion cooling system including an immersion tank for a gaseous heat transfer fluid and a primary condenser. The primary condenser is thermally connected to the internal volume of the immersion tank. The immersion cooling system also includes a vapor management system fluid-side connected to the headspace of the immersion tank. The vapor management system can effectively manage periods of high vapor generation by removing fluid vapor and other gases from the upper space of the liquid level tank, condensing the vapor into a liquid, and returning the liquid to the tank.

[0005] Furthermore, a cooling system for computer components is known from Patent Document 3. A heat-conducting dielectric heat transfer fluid, having a boiling point below 80°C at atmospheric pressure, exists in both liquid and gaseous phases within a pressure-controlled container. Computer components are placed within the container, at least partially immersed in the liquid phase of the heat transfer fluid. A condenser condenses the dielectric gaseous fluid, vaporized by the heat generated from the computer components, into a dielectric liquid phase. Inside the pressure-controlled container, the internal pressure is reduced to 650 hPa. By controlling the pressure within the container in which the system operates, the user can influence the vaporization temperature of the dielectric liquid. This makes it possible to improve cooling performance. Operating a computer system in a pressure-controlled container at an operating pressure different from the ambient pressure almost always requires adapting the overall structural design of the system.

[0006] Patent Document 4 provides a known cooling system having a container that can be filled with a two-phase heat transfer fluid as a refrigerant, in which electronic components can be immersed in a liquid phase. This container has a gaseous space above the surface of the liquid heat transfer fluid. Separately located on the container, along with the electronic components, is an external condenser unit configured to condense the vapor phase of the heat transfer fluid and return it to the container as a liquid refrigerant. The system includes a return line and a supply line connected to both the condenser unit and the container, forming a heat exchange loop. Furthermore, the system includes a collection container located on the supply line and configured to collect the condensed liquid heat transfer fluid before the refrigerant is supplied to the container. In addition, this heat accumulator also provides the cooling system with additional cooling capacity.

[0007] From Patent Document 5, a cooling system for immersion cooling of electronic components is known, which has a pressure tank configured to hold a heat transfer fluid in liquid form into which the electronic equipment is immersed. Furthermore, there is a steam chamber above the surface of the liquid heat transfer fluid. A condenser is located outside the pressure tank and has an inlet connected to the steam chamber by a riser tube, which is configured to receive vapor from the heat transfer fluid. Furthermore, the condenser has a condensate outlet with a tightly sealed steam outlet for residual gas and a return line for the condensate to the tank. The condensate return line is designed so that the condensed heat transfer fluid can return from the condensate outlet to the tank via the condensate return line. Inside the tank, another condenser tube may be provided for liquefying the gaseous heat transfer fluid. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] U.S. Patent Publication No. 10512192 [Patent Document 2] U.S. Patent Publication No. 10966349 [Patent Document 3] U.S. Patent Publication No. 10477726 [Patent Document 4] U.S. Patent Publication No. 2021 / 0153392 [Patent Document 5] European Patent No. 3453235 [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] This invention relates to heat exchangers and is based on the challenge of further developing a cooling system for immersion cooling of electronic components. [Means for solving the problem]

[0010] The present invention is described by the features of claim 1. Other related claims are advantageous embodiments and variations of the present invention.

[0011] This invention includes a cooling system for immersion cooling of electronic components. The cooling system comprises: - A container that can be filled with a two-phase heat transfer fluid, wherein electronic components can be immersed in the liquid phase, and the container has a gaseous space on the surface of the liquid heat transfer fluid, -A heat exchanger for forming a liquid heat transfer fluid within the gaseous space of the container, - At least one condenser unit, the condenser unit having at least one fluid inlet opening, which is in contact with the gaseous space of a container for mass exchange of a gaseous medium into the condenser unit or a liquid medium out of the condenser unit, and which has an outlet for discharging a residual gas phase.

[0012] According to the present invention, the condenser unit has a casing that encloses a bundle of tubes, which are heat exchanger tubes extending axially parallel to each other in the flow direction behind at least one fluid inlet opening, thereby forming a flow path within the casing. Furthermore, the bundle of tubes is arranged within the casing such that a gaseous medium flows through the flow path along the axial direction of the heat exchanger tubes.

[0013] The present invention is based on the idea that the condenser unit housing comprises a bundle of heat exchanger tubes extending linearly and parallel to each other, forming a kind of elongated cooling path that cools and liquefies the gaseous heat transfer fluid discharged from the container. The heat transfer fluid condensed in the heat exchanger tubes drips down to the bottom of the housing, and since the bottom of the housing is sufficiently sloped relative to the horizontal toward the fluid outlet opening, the liquid heat transfer fluid flows back into the container through the fluid outlet opening. As the amount of gaseous heat transfer fluid continuously decreases due to the condensation process, negative pressure is generated within the condenser unit housing relative to the container. As a result, gaseous heat transfer fluid constantly flows from the gaseous space of the container into the condenser unit housing through at least one fluid inlet opening. Thus, this system is automatically adjusted according to the pressure and heat transfer area. In several embodiments, the condenser unit can also be individually installed at various locations inside or outside the container, depending on the cooling requirements.

[0014] A particularly advantageous feature of the solution according to the present invention is the particularly long cooling path formed by the heat exchanger tubes, along which a gaseous fluid is forced to flow inside the elongated housing.

[0015] The container can be designed to be pressure-resistant. Advantageously, the container can be designed as a pressure vessel that can be operated under vacuum and / or pressurized conditions. By controlling the pressure inside the container in which the cooling system operates, improved cooling capacity can be achieved.

[0016] A heat exchanger in a gaseous space preferably consists of at least one tube bundle comprising a plurality of heat exchange tubes arranged parallel to each other. The tube bundle may have a number of heat exchange tubes arranged parallel to each other, each having two end tube sheets.

[0017] The heat exchanger tubes are preferably ribbed tubes manufactured from smooth tubes subjected to shaping processes. They are particularly suitable as components within highly efficient, compact and extremely stable heat exchangers with high heat transfer coefficients. The tube surfaces are optimized according to the specific heat transfer requirements demanded by the application. Due to the wide range of material options such as copper, copper alloys, steel, titanium, titanium alloys, etc., it is possible to reliably utilize materials suitable for the requirements, especially in terms of durability and formability, for various demands.

[0018] The two-phase heat transfer fluid, also called the refrigerant, is the external fluid within the container, and the electronic components are immersed in its liquid portion. The internal fluid within the heat exchanger tubes is usually a single-phase heat transfer medium such as process water, glycol, heat transfer oil, etc. However, in the present invention, a two-phase medium combined with a refrigeration cycle can also be used.

[0019] Within the container, the electrical components are arranged in a bath of the liquid heat transfer fluid in a manner suitable for cooling, and the electrical components are cooled by the vaporization of the liquid fluid. In this case, the non-condensable gas portion can be effectively removed from the system before or during the start of operation.

[0020] In an embodiment according to the present invention, computer components and a liquid immersion cooling device, as well as related power supplies, network connections, wiring connections, etc. can be arranged within the container, and during operation, this container has an internal pressure different from the ambient pressure.

[0021] In this context, it is also advantageous to bundle the wiring for electrical connections, water connections, negative pressure connections, network connections into one bundle to minimize the feed-through into the container and reduce the risk of leakage, especially when the system is in a negative or positive pressure state during operation.

[0022] In an advantageous embodiment, the container is maintained at a pressure that is at most 200 hPa lower than the ambient atmospheric pressure during operation, which contributes to lowering the boiling point of the two-phase heat transfer fluid and thereby reducing the operating temperature of the computer chip and other components. In some special embodiments, the pressure-controlled container can further have a pressure that is at most 500 hPa lower than the ambient pressure.

[0023] Embodiments of the cooling system of the present invention include a container for a dielectric cooling fluid, a heat exchanger, and a condenser unit for condensing the dielectric fluid from the gas phase to the liquid phase. The condenser unit provided outside or inside the container is designed to condense the remaining gaseous heat transfer fluid containing air and water vapor in a certain ratio into the liquid heat transfer fluid as much as possible. Ideally, the remaining heat transfer fluid is almost completely condensed from the gas phase, and essentially only air and water vapor remain as the residual gas phase. The purpose of separating the liquid heat transfer fluid is to keep the water vapor in the gas phase by giving the system an appropriate cooling capacity. This residual gas mixture is discharged from the cooling system through the outlet of the condenser unit.

[0024] Furthermore, there may be facilities inside the container for holding computer components or distributing power from the power system to the devices and components arranged inside the container. For example, it is needless to say that a number of special connections are used to operate a computer system inside a container maintained at a negative pressure. In some embodiments of the system according to the present invention, by using a series of fiber optic interfaces, connectivity inside the container can be enabled and fibers can be distributed to various holding devices of electronic components. In some embodiments of the container, monitoring sensors can be included for safe operation. These sensors can be equipped with temperature sensors, fluid level sensors, pressure sensors, position sensors, electrical sensors and / or cameras to ensure and automate the operation of the system.

[0025] These systems can, for example, include pressure sensors inside a pressure-controlled vessel to monitor the pressure and ensure that there are no significant leaks. Similarly, gas sensors can be placed outside the pressure-controlled vessel to detect the presence of dielectric vapors that may leak from the vessel.

[0026] In addition, advantageously, the cooling system may also have a control device, which is configured to control, for example, the operation of fluid circulation, which is a function of the temperature of the two-phase heat transfer fluid, and the pressure ratio within the container.

[0027] In a preferred embodiment of the present invention, the cross-sectional area of ​​the flow path may change in the direction of fluid flow. The purpose of this countermeasure is to concentrate the flow of heat transfer fluid in heat exchanger tubes that run parallel to each other in the axial direction and prevent backflow.

[0028] Advantageously, the flow path can comprise multiple chambers connected by smaller cross-sectional area connecting channels. This allows the gaseous heat transfer fluid to be guided from chamber to chamber until it liquefies. This increases the residence time in each chamber, and the flow is controlled by the pressure gradient created at the constrictions.

[0029] Furthermore, the flow path has the advantage of allowing a bundle of tubes equipped with heat exchanger tubes to pass through the chamber and connecting flow paths. This measure also aims to concentrate the flow of heat transfer fluid into the heat exchanger tubes running parallel to the axial direction, thereby preventing backflow.

[0030] In an advantageous embodiment of the present invention, a conduit structure for a gaseous fluid can be arranged. This causes the vapor to flow along the heat exchanger surface of the tube bundle toward the outlet in order to condense as much of the refrigerant as possible.

[0031] In an advantageous embodiment of the present invention, the condenser unit can be located inside or outside the container. Depending on the structural design and required space, the condenser unit may be an independent module that only needs to be connected to the gaseous space of the container in order to perform fluid mass exchange in some appropriate manner.

[0032] Advantageously, the condenser unit located within the container can be positioned above or beside the heat exchanger in the gaseous space of the container. These regions contain, in particular, a gaseous fluid phase that is concentrated in the residual gas (e.g., air components or water vapor) and can be used for further condensation.

[0033] In a preferred embodiment of the present invention, a collection container capable of discharging the residual gas phase can be installed downstream of the outlet of the condenser unit. This container prevents ambient air from entering the cooling system. The container may be an inflatable elastic balloon or a bellows capable of changing volume.

[0034] In a particularly preferred embodiment, a drying unit can be installed between the outlet and the collection container to separate water vapor from the gas phase. The pressure state of the entire cooling system often changes with load changes. If necessary, outside air can be introduced into the cooling system from the collection container, or residual gas from the drying unit, to balance the pressure. Silica gel, which absorbs water vapor, is suitable for this type of drying unit.

[0035] In a further advantageous embodiment of the present invention, a vacuum pump can be installed downstream of the outlet to discharge the residual gas phase. In this case, since the vacuum pump is always discharging the residual gas phase to the outside, the residual gas phase of water vapor and air at the outlet may also be at a lower pressure than the surroundings.

[0036] Advantageously, the heat exchanger and condenser units can be equipped with a common supply unit for the first single-phase heat transfer medium for cooling. This ensures that both units are kept at the same temperature level, suitable for the fluid separation process in the heat exchanger.

[0037] In a preferred embodiment of the present invention, the condenser unit may include a second supply unit for a second single-phase heat transfer medium for cooling. In the condenser unit, independent and different temperature levels may be set to further effectively separate individual phase components.

[0038] In a particularly preferred embodiment, the condenser unit can be designed to operate for cooling the heat exchanger when the temperature of the single-phase heat transfer medium is low. It is especially important to select pressure and temperature conditions that do not fall below the dew point of water vapor, so that water vapor can be retained in the residual gas phase and discharged. Within this pressure and temperature range, the condenser unit can be used optimally.

[0039] Examples of embodiments of the present invention will be described in detail with reference to schematic diagrams. [Brief explanation of the drawing]

[0040] [Figure 1] This is a schematic front view of a cooling system equipped with a condenser unit. [Figure 2] This is a schematic side view of a cooling system equipped with a condenser unit. [Figure 3] This is another side view of a cooling system equipped with a condenser unit. [Figure 4] This is another side view of a cooling system equipped with a condenser unit. [Modes for carrying out the invention]

[0041] In all the diagrams, corresponding parts are given the same reference numeral.

[0042] Figure 1 shows a schematic front view of a cooling system 1 for immersion cooling of an electronic component 2. The cooling system 1 comprises a container 3 filled with a two-phase heat transfer fluid. The two-phase heat transfer fluid is an external fluid within the container 3 and comprises a gaseous space 5 having a liquid heat transfer fluid portion 4 into which the electronic component 2 is immersed and a gaseous heat transfer fluid portion. A heat exchanger 6 is positioned within the gaseous space 5 of the container 3 to form the liquid heat transfer fluid 4.

[0043] In this advantageous embodiment, the heat exchanger 6 in the gas space 5 consists of a bundle of tubes, each of which has a plurality of heat exchange tubes arranged parallel to each other.

[0044] In Figure 1, the container 3 of the illustrated embodiment has a slightly narrowed region for the liquid heat transfer fluid 4, as the container wall protrudes inward and only opens within the gas space 5. The shape of the container 3 is supported by a metal profile frame 31. Thus, the container 3 is already surrounded by a stable outer frame.

[0045] The condenser unit 7 is positioned with its left side outside the container 3 and its right side inside the container 3. The condenser unit 7 is connected to the gas space 5 of the container 3 via a fluid inlet opening 71 for the exchange of gaseous fluid. Similarly, a fluid outlet opening 72 for the liquid heat transfer fluid to the container 3 is located at the edge of the inclined bottom surface of the housing 74, through which the liquid heat transfer fluid is returned to the container 3 from the condenser unit 7.

[0046] To regulate mass exchange, a valve 710 is incorporated into the fluid inlet opening 71, and a valve 720 is incorporated into the fluid outlet opening 72. A gaseous mixture consisting of heat transfer fluid, air, and water vapor is periodically or continuously extracted from the container 3 through the valve 710 at the fluid inlet opening 71. Only the liquid heat transfer fluid is returned to the container 3 through the valve 720 at the fluid outlet opening 72.

[0047] The residual gas phase remaining after the heat transfer fluid has almost completely condensed consists basically of air and water vapor, which is discharged to the outside through the outlet 79 via the valve 910. For further separation of water vapor, a drying unit 8 is placed between the outlet 79 and the collection container 9 to separate the water vapor from the gas phase.

[0048] Depending on the pressure conditions, the residual gas phase can be directly discharged into the environment. Alternatively, the residual gas phase can be removed using the vacuum pump 10. The outlet 79 is connected to the vacuum pump 10 via a supply line 101, which, via a valve control unit 1010, adjusts the flow rate of the residual gas to the outside through the discharge line 102 of the vacuum pump 10.

[0049] Alternatively, or additionally, the residual gas phase can also be guided to a collection container 9 via a supply line 91 equipped with a valve 910. This collection container 9 can be designed as a bellows with expandable volume to generate negative pressure. When the valve 910 to the collection container 9 is closed during operation, a valve 920 can be opened to discharge the residual gas through the discharge line 92 of the collection container 9.

[0050] Figure 2 schematically shows a side view of the cooling system 1 equipped with a condenser unit 7. The condenser unit 7 is mounted on the long outer side of the container 3. A fluid inlet opening 71 connects the condenser unit 7 to the gas space of the container 3 located behind it. Gaseous fluid flows in from the container 3 through this fluid inlet opening 71. A fluid outlet opening 72 is located at the end of the deepest inclined section of the bottom surface 741 of the housing 74 of the condenser unit 7. The condensed liquid fluid is returned to the container 3 through this fluid outlet opening 72. The gaseous fluid flowing in through the fluid inlet opening 71 collides with a tube bundle 73 consisting of numerous heat exchanger tubes 731 and is guided almost axially into the heat exchanger tubes 731 in the flow path 75 along the flow direction S. A conduit structure 78 is provided to intentionally divert the gaseous fluid, thereby forcing the gaseous fluid to flow along the tube bundle 73 toward the outlet 79. In the condensation process, the volume and, consequently, the pressure of the gaseous fluid continuously decreases along the tube bundle 73. The resulting pressure gradient creates a negative pressure in the condenser unit 7 relative to the container 3, causing the gaseous fluid to continuously flow in through the fluid inlet opening 71. In the region of outlet 79, non-condensable gaseous components such as air and water vapor accumulate as a result of the continuous condensation of the gaseous fluid. These non-condensable gaseous components are discharged from the cooling system 1 through outlet 79.

[0051] Figure 3 schematically shows another side view of the cooling system 1 with the condenser unit 7. Similar to that already shown in Figure 2, the condenser unit 7 is located on the upper outer side of the container 3, along with a fluid inlet opening 71 and a fluid outlet opening 72. The bottom surface 741 of the housing 74 is designed to have a constant slope toward the fluid outlet opening 72.

[0052] A recess 742 is provided on the upper side of the housing 74 in the flow direction S, thereby forming a chamber 76 that allows for the exchange of gaseous fluid through a constricted connecting passage 77. However, these constrictions still have sufficient cross-sectional area D for the tube bundle 73, which includes the heat exchanger tubes 731, to pass through. Therefore, along the flow direction S, a series of continuous chambers 76 are arranged in the flow path 75, each extending the residence time of the gaseous fluid and preventing backflow of the gaseous fluid. At the outlet 79, non-condensable gaseous components are discharged, particularly from the cooling system 1.

[0053] Figure 4 schematically shows another side view of a cooling system 1 comprising a condenser unit 7 configured with a tube bundle fin heat exchanger 73. In this embodiment, the fins function on the one hand as conduit structures 78 that guide the gaseous fluid, and also form a number of chambers 76 that guide the gaseous fluid from a fluid inlet opening 71 along the flow direction S to an outlet 79. The bottom surface 741 of the housing 74 is designed to slope toward a fluid outlet opening 72 to return the condensed liquid fluid to the container 3. In the tube bundle fin heat exchanger 73, the tubes are arranged parallel to each other along the length of the housing 74, and their ends are hydrodynamically connected in series by tube elbows. The fin-shaped conduit structures 78 have through-passages as connecting passages 77 in the flow direction S, so the gaseous fluid flows axially along the heat exchanger tubes 731. The shape of the heat exchanger tubes 731 is preferably linear, but other elongated shapes, such as elongated spiral tubes, can also be used. [Explanation of symbols]

[0054] 1. Cooling System 2 Electronic Components 3 containers 31 Metal Profile Frames 4 Heat transfer fluid 41 Surface of a liquid heat transfer fluid 5. Gas space 6 Heat exchanger 7. Condenser Unit 71 Fluid inlet opening 710 valve 72 Fluid outlet opening 720 valves 73 Tube bundles 731 Heat exchanger tube 74 cabinets 741 Bottom of the casing 742 recess 75 channels 76 rooms 77 connecting routes 78 Conduit structure 79 Exit 8 Drying Unit 9. Collection containers, bellows 91 Collection container supply line 910 Valve in the collection container supply line 92 Collection container discharge line 920 Valve in the discharge line of the collection container 10 Vacuum pump 101 Vacuum pump supply line 1010 Valve in the supply line of a vacuum pump 102 Vacuum pump discharge line D Passage cross section S flow direction

Claims

1. A cooling system (1) for immersion cooling of an electronic component (2), - A container (3) is provided, the inside of which can be filled with a two-phase heat transfer fluid (4) in which the electronic component (2) can be immersed in the liquid phase, and the container (3) has a gas space (5) above the surface (41) of the liquid heat transfer fluid (4), - A heat exchanger (6) is placed in the gas space (5) of the container (3) to form the liquid heat transfer fluid (4), - In a cooling system (1) comprising at least one condenser unit (7), the condenser unit (7) is in contact with the gas space (5) of the container (3) by at least one fluid inlet opening (71) and at least one fluid outlet opening (72) for the exchange of a gaseous medium into the condenser unit (7) and a liquid medium from the condenser unit (7), and the condenser unit (7) is provided with an outlet (79) for discharging the residual gas phase, - The condenser unit (7) is provided with a tube bundle (73) having heat exchanger tubes (731) that extend axially parallel to each other in the flow direction (S) behind the fluid inlet opening (71), and enclosed within a housing (74), thereby forming a flow path (75) within the housing (74). - The cooling system (1) is characterized in that the tube bundle (73) is arranged inside the housing (74) such that a gaseous medium flows in the flow path (75) along the axial direction of the heat exchanger tube (731).

2. The cooling system (1) according to claim 1, characterized in that the cross-sectional area (D) through which the fluid passes in the flow path (75) changes along the flow direction (S).

3. The cooling system (1) according to claim 1 or 2, characterized in that the flow path (75) has a plurality of chambers (76) connected by connecting passages (77) having a smaller passage cross-sectional area (D).

4. The cooling system (1) according to claim 3, characterized in that the tube bundle (73) equipped with the heat exchanger tube (731) is passed through the chamber (76) and the connecting passage (77) within the flow path (75).

5. A cooling system (1) according to any one of claims 1 to 4, characterized in that a conduit structure (78) for a gaseous fluid is provided.

6. The cooling system (1) according to any one of claims 1 to 5, characterized in that the condenser unit (7) is located inside or outside the container (3).

7. The cooling system (1) according to any one of claims 1 to 6, characterized in that the condenser unit (7) disposed within the container (3) is located above or next to the heat exchanger (6) in the gas space (5) of the container (3).

8. The cooling system (1) according to any one of claims 1 to 7, characterized in that a collection container (9) capable of discharging residual gas phase is arranged downstream of the outlet (79) of the condenser unit (7).

9. The cooling system (1) according to claim 8, characterized in that a drying unit (8) for separating water vapor from the gas phase is arranged between the outlet (79) and the collection container (9).

10. The cooling system (1) according to any one of claims 1 to 7, characterized in that a vacuum pump (10) is located downstream of the outlet (79) and the residual gas phase can be discharged from there.

11. The cooling system (1) according to any one of claims 1 to 10, characterized in that the heat exchanger (6) and the condenser unit (7) are provided with a common supply unit for a first single-phase heat transfer medium for cooling.

12. The cooling system (1) according to any one of claims 1 to 10, characterized in that the condenser unit (7) comprises a second supply unit for a second single-phase heat transfer medium for cooling.

13. The cooling system (1) according to any one of claims 1 to 10, characterized in that the condenser unit (7) is designed to operate to cool the heat exchanger (6) when the temperature of the single-phase heat transfer medium is low.

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